Light emitting display device

Abstract

This disclosure relates to a light-emitting display device. The light-emitting display device includes: a substrate comprising a display area in which sub-pixels are disposed and a non-display area outside the display area; a planarization layer located on the display area and the non-display area on the substrate; a light-emitting diode (LED) located in a sub-pixel on the planarization layer; and an encapsulation layer located on the LED and in both the display area and the non-display area, comprising a first inorganic encapsulation layer and a second inorganic encapsulation layer, and an organic encapsulation layer interposed between the first and second inorganic encapsulation layers, wherein the planarization layer includes a recessed opening surrounding the display area and having a wave-like shape in a plan view, and wherein, in the non-display area, the encapsulation layer extends outward beyond the recessed opening.

Description

Technical Field

[0001] This disclosure generally relates to the field of displays, and more specifically, for example, but not limited to, to a light-emitting display device. Background Technology

[0002] Recently, flat panel display devices with excellent characteristics such as thinness, light weight and low power consumption have been widely developed and applied in various fields.

[0003] In flat panel display devices, light-emitting display devices equipped with light-emitting elements such as light-emitting diodes emit light when charge is injected into the light-emitting layer formed between the anode and cathode, and electrons and holes pair up and then extinguish.

[0004] The light-emitting display device has an encapsulation layer that covers and protects the light-emitting diodes, and the encapsulation layer includes an organic encapsulation layer for covering foreign matter.

[0005] Considering the various process margins of light-emitting display devices, the organic encapsulation layer needs a fairly wide margin outside the display area.

[0006] Therefore, the non-display area of ​​the light-emitting display device has become wider, making it difficult to achieve a narrow bezel.

[0007] The descriptions provided in the background section should not be assumed to be prior art simply because they are mentioned in or associated with that section. The background section may include information describing one or more aspects of the subject matter art, and the descriptions in that section do not limit this disclosure. Summary of the Invention

[0008] The advantage of this disclosure is that it provides a light-emitting display device that can reduce the width occupied by the organic encapsulation layer in the non-display area to achieve a narrow bezel.

[0009] Additional features and advantages of this disclosure will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practice of this disclosure. These and other advantages of this disclosure will be realized and obtained by means of the structures specifically pointed out in the written description, its claims, and the accompanying drawings.

[0010] To achieve these and other advantages and in accordance with the purposes of this disclosure, as embodied and broadly described herein, a light-emitting display device includes: a substrate comprising a display area in which sub-pixels are disposed and a non-display area outside the display area; a planarization layer located on the substrate in the display area and non-display area; a light-emitting diode located on the planarization layer in the sub-pixels; and an encapsulation layer located on the light-emitting diode and in the display area and non-display area, and including a first inorganic encapsulation layer and a second inorganic encapsulation layer, and an organic encapsulation layer interposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer, wherein the planarization layer includes a recessed opening surrounding the display area and having a wave-like shape in a plan view, and wherein, in the non-display area, the encapsulation layer extends outward beyond the recessed opening.

[0011] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory, and are intended to provide a further explanation of the claimed disclosure.

[0012] Other systems, methods, features, and advantages will be apparent or become apparent to those skilled in the art upon reading the following drawings and detailed description. It is intended that all such additional systems, methods, features, and advantages are included in this specification, fall within the scope of this disclosure, and are protected by the appended claims. Nothing in this section should be construed as limiting these claims. Further aspects and advantages will be discussed below in conjunction with embodiments of this disclosure. Attached Figure Description

[0013] The accompanying drawings, which are included to provide a further understanding of this disclosure and are incorporated in and constitute a part of this specification, illustrate embodiments of the disclosure and, together with the specification, serve to explain the various principles of the disclosure. In the drawings:

[0014] Figure 1 This is a plan view schematically showing the configuration of a light-emitting display device according to an embodiment of the present disclosure;

[0015] Figure 2 This is a circuit diagram schematically illustrating an example of the structure of a sub-pixel according to an embodiment of the present disclosure;

[0016] Figure 3 It is along Figure 1 A cross-sectional view taken from line III-III';

[0017] Figures 4 to 8 These are diagrams schematically illustrating various examples of the shape of the waveform pattern of the waveform structure forming the recessed opening according to embodiments of the present disclosure; and

[0018] Figures 9 to 11This is a diagram schematically illustrating various examples of waveform structures at the sides and corners constituting the recessed openings according to embodiments of the present disclosure.

[0019] Throughout the accompanying drawings and detailed embodiments, unless otherwise stated, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustrative purposes, the relative sizes and depictions of these elements may be exaggerated. Detailed Implementation

[0020] The advantages and features of this disclosure, as well as methods of implementing them, will become apparent from the following detailed description of the embodiments taken in conjunction with the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed below, but can be implemented in various different forms, and these embodiments complete the disclosure. This disclosure is provided to fully inform those skilled in the art of this disclosure, and this disclosure may be defined by the scope of the claims.

[0021] The shapes, dimensions, scales, angles, quantities, etc., disclosed in the accompanying drawings for explaining the embodiments of this disclosure are illustrative, and this disclosure is not limited to the contents shown. Throughout the specification, the same reference numerals refer to the same components.

[0022] Furthermore, in describing this disclosure, if it is determined that a detailed description of the relevant known art unnecessarily obscures the subject matter of this disclosure, its detailed description may be omitted. When words such as "comprising," "including," "having," and "consisting of" are used in this disclosure, other parts may be added unless only "only" is used. When components are expressed in the singular, the plural is included unless explicitly stated otherwise.

[0023] When interpreting a component, it is interpreted as including the margin range, even without a separate explicit description.

[0024] When describing positional relationships, for example, when the positional relationship between two parts is described as "above", "above", "below", "beside", "under", etc., one or more other parts may be located between the two parts unless "exactly" or "directly" is used.

[0025] When describing temporal relationships, such as when the chronological order is described as "after", "following", "before", etc., discontinuous situations may be included unless "directly" or "immediately" is used.

[0026] When describing the components of this disclosure, terms such as first and second may be used. These terms are used only to distinguish the components from other components, and the nature, order, sequence, or number of the components are not limited by these terms.

[0027] The corresponding features of the various embodiments of this disclosure may be partially or wholly connected or combined with each other, and may be technically interlocked and driven in various ways, and the corresponding embodiments may be implemented independently of each other or may be implemented together in a related relationship.

[0028] In the following description, embodiments of the present disclosure are described in detail with reference to the accompanying drawings. Furthermore, in the following embodiments, the same and similar reference numerals are assigned to the same and similar components, and their detailed descriptions may be omitted.

[0029] Throughout the accompanying drawings and detailed description, unless otherwise described, the same reference numerals should be understood to refer to the same elements, features, and structures. For clarity, illustrative purposes, and convenience, the relative sizes and depictions of these elements may be exaggerated. The described progression of processing steps and / or operations is illustrative; however, the order of steps and / or operations is not limited to the order set forth herein and can be varied as is known in the art, except where the steps and / or operations must occur in a specific order. The same reference numerals always denote the same elements. The names of the various elements used in the following description are chosen solely for convenience of writing the specification and may therefore differ from the names used in actual products.

[0030] Any implementation described herein as an "example" is not necessarily to be construed as preferred or advantageous over other implementations.

[0031] Unless otherwise defined, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which the exemplary embodiments pertain. It should also be understood that terms such as those defined in common dictionaries shall be interpreted as having a meaning consistent, for example, with their meaning in the context of the relevant field, and shall not be interpreted in an idealized or overly formal sense unless expressly defined herein. For example, the terms “part” or “unit” may be applied to, for example, a single circuit or structure, an integrated circuit, a computational block of a circuit arrangement, or any structure configured to perform the described functions, as would be understood by one of ordinary skill in the art.

[0032] Figure 1 This is a plan view schematically showing the configuration of a light-emitting display device according to an embodiment of the present disclosure. Figure 2 This is a circuit diagram schematically illustrating an example of the structure of a sub-pixel according to an embodiment of the present disclosure.

[0033] Before a detailed description, the light-emitting display device 10 according to embodiments of the present disclosure may include any type of display device, which includes a light-emitting diode OD and an encapsulation layer formed thereon. Figure 3(ECL).

[0034] In this embodiment, for ease of explanation, an organic light-emitting display device can be used as a light-emitting display device 10.

[0035] The light-emitting display device 10 can be a top-emitting or bottom-emitting display device.

[0036] Reference Figure 1 and Figure 2 The light-emitting display device 10 (or its light-emitting display panel) of this embodiment may include a display area AA for displaying images and a non-display area NA arranged around the display area AA.

[0037] In the display area AA, multiple sub-pixels SP arranged along multiple row lines (or horizontal lines) and multiple column lines (or vertical lines) can be formed on the substrate 101.

[0038] Furthermore, multiple gate lines (or scan lines) GL extending along the row direction (or horizontal direction or a first direction) and multiple data lines DL extending along the column direction (or vertical direction or a second direction) can be formed on the substrate 101. Each sub-pixel SP can be connected to the corresponding gate line GL and data line DL.

[0039] Furthermore, power lines for transmitting a high-potential driving voltage (or high-potential power supply voltage) VDD and a low-potential driving voltage (or low-potential power supply voltage) VSS can be formed on the substrate 101. The high-potential driving voltage VDD and the low-potential driving voltage VSS can be applied to the sub-pixel SP.

[0040] The plurality of sub-pixels SP formed on the substrate 101 may include sub-pixels SP of different colors constituting a pixel (which is a unit for displaying a color image). For example, the sub-pixels SP constituting a pixel may include sub-pixels SP displaying a first color, a second color, and a third color respectively, such as a red sub-pixel SP, a green sub-pixel SP, and a blue sub-pixel SP displaying red, green, and blue respectively. As another example, the sub-pixels SP constituting a pixel may also include a white sub-pixel SP displaying white.

[0041] Red subpixels SP, green subpixels SP, and blue subpixels SP can be arranged in various configurations. For example, subpixels SP can be arranged in a stripe pattern, where subpixels SP of the same color are arranged in the column direction and subpixels SP of different colors are arranged alternately in the row direction, but this is not a limitation.

[0042] Each sub-pixel SP may include a light-emitting diode OD as a light-emitting element. Furthermore, the sub-pixel SP may include a pixel driving circuit for driving the light-emitting diode OD. The pixel driving circuit may include multiple transistors and at least one capacitor, the multiple transistors including a driving transistor Td. In this configuration, during light emission, the driving transistor Td can be turned on to generate a light-emitting current, and this light-emitting current can be supplied to the light-emitting diode OD, thereby performing the light-emitting operation.

[0043] You can refer to Figure 2 An example describing the structure of a subpixel SP. Figure 2 For ease of explanation, the pixel driving circuit for driving sub-pixels SP is shown in a 3T1C structure configured with three transistors T1, T2, and Td, and a capacitor Cst. Furthermore, Figure 2 The structure shown is an example, and the pixel driving circuit can be configured with different structures.

[0044] In the following description, the transistor terms “source electrode” and “drain electrode” are used to distinguish the two electrodes connected to the semiconductor layer, and in some cases may be referred to as opposite terms.

[0045] The sub-pixel SP may include a first transistor T1 and a second transistor T2 as switching transistors, a driving transistor Td, a storage capacitor Cst, and a light-emitting diode OD. The first transistor T1 may be a data supply transistor, and the second transistor T2 may be a driving characteristic sensing transistor.

[0046] The first transistor T1 can be connected to the corresponding gate line GL and data line DL. In this respect, the source electrode (or drain electrode) of the first transistor T1 can be connected to the data line DL, and the gate electrode of the first transistor T1 can be connected to the gate line GL.

[0047] The driving transistor Td may have a gate electrode connected to the source electrode of the first transistor T1, a source electrode (or drain electrode) to which a high-potential driving voltage VDD is applied, and a drain electrode (or source electrode) connected to the first electrode (or anode electrode) of the light-emitting diode OD.

[0048] The second transistor T2 can be connected to the corresponding gate line GL and reference line RL. In this respect, the source electrode (or drain electrode) of the second transistor T2 can be connected to the reference line RL, the gate electrode of the second transistor T2 can be connected to the gate line GL, and the drain electrode (or source electrode) of the second transistor T2 can be connected to the node between the driving transistor Td and the light-emitting diode OD. In other words, the drain electrode of the second transistor T2 can be connected to the drain electrode of the driving transistor Td and the first electrode of the light-emitting diode OD.

[0049] Thus, in this embodiment, taking the case where the second transistor T2 and the first transistor T1 within the sub-pixel SP are connected to the same gating line GL and receive the same gating signal as an example. As another example, the second transistor T2 can be configured to be connected to a different gating line GL than the one connected to the first transistor T1.

[0050] The cathode (or second electrode) of the light-emitting diode OD can receive a low-potential drive voltage VSS. The low-potential drive voltage VSS can be a voltage with a potential lower than that of the high-potential drive voltage VDD, and can include the ground voltage.

[0051] The storage capacitor Cst can be connected between the gate electrode and the drain electrode of the driving transistor Td.

[0052] In the above configuration, during operation in the display mode for displaying images, when a gating signal is applied via the gating line GL, the first transistor T1 can be turned on, and a data signal (or data voltage) can be input to the sub-pixel SP, so that the data signal can be applied to the gate electrode of the driving transistor Td. At this time, the second transistor T2 can be turned on, so that a reference voltage can be applied to the source electrode of the driving transistor Td. Therefore, the data signal and the reference voltage can be applied to both electrodes of the storage capacitor Cst, and as a result, the data signal can be stored in the storage capacitor Cst.

[0053] Then, when the gate signal is not applied to the gate line GL and is turned off, the first transistor T1 and the second transistor T2 can be turned off, the driving transistor Td can be turned on, and the emission current (or driving current) corresponding to the applied data signal can flow to the light-emitting diode OD through the driving transistor Td. Therefore, during the light-emitting period, light corresponding to the emission current can be generated and output by the light-emitting diode OD.

[0054] Furthermore, during operation in compensation mode for compensating the driving transistor Td, a sensing data signal can be applied to the sub-pixel SP, and a sensing voltage can be provided to the reference line RL via the second transistor T2. Based on the sensing voltage, the data signal used for image display can be compensated, and the compensated data signal can be applied to the sub-pixel SP to compensate the driving transistor Td.

[0055] Furthermore, in the light-emitting display device 10 of this embodiment, a recessed opening (or opening, groove or hole) OPP surrounding (or enclosing) the display area AA can be formed along the periphery of the display area AA.

[0056] For example, the recessed opening OPP can be formed along the boundary of the display area AA in the non-display area NA, and can be configured to be recessed downward toward the substrate 101. As described later, the recessed opening OPP can be formed on, for example, a planarization layer ( Figure 3 In 110), the planarization layer is an insulating layer formed between the substrate 101 and the light-emitting diode OD.

[0057] The planarization layer may form one or more recessed openings (OPPs). In this embodiment, for ease of explanation, we will take the case where a single recessed opening (OPP) is formed along the periphery of the display area AA as an example. As another example, when multiple recessed openings (OPPs) are formed, the multiple recessed openings (OPPs) may be arranged sequentially in the outward direction while being spaced apart from each other by a certain distance, and the recessed openings (OPPs) at relatively outer positions may be formed to surround the recessed openings (OPPs) located inside the recessed openings (OPPs) at relatively outer positions.

[0058] In this way, when the recessed opening OPP is formed, the surface of the substrate 101 can have an uneven cross-sectional shape due to the recessed opening OPP, thereby increasing the surface area of ​​the substrate 101. In this regard, the area where the recessed opening OPP is formed can be recessed downward to become a recessed portion, and the inner and outer regions of the recessed opening OPP can protrude upward relative to the recessed opening OPP to become protruding portions, so that the surface of the substrate 101 can have an uneven shape.

[0059] In this case, the outward spreading properties of the encapsulation layer covering and protecting the LED OD can be effectively controlled, especially the organic encapsulation layer constituting the encapsulation layer. Figure 3 The outward spreading property of OE in the middle.

[0060] In this regard, for example, an inkjet printing method can be used to form the organic encapsulation layer. In the inkjet printing method, for example, an organic solution for forming the organic encapsulation layer can be dropped onto the substrate 101, and the dropped organic solution can flow and spread laterally, thereby forming an organic encapsulation layer on the substrate 101.

[0061] Considering the various process margins of the light-emitting display device 10, including the process margin based on the spreadability of the organic encapsulation layer, the organic encapsulation layer can be formed as part of the non-display area NA covering the outside of the display area AA.

[0062] Therefore, the width occupied by the organic encapsulation layer in the non-display area NA can be reduced by controlling the spreadability of the organic solution.

[0063] In this respect, in this embodiment, for the substrate 101 in which the light-emitting diode OD is formed, the recessed opening OPP can be formed along the boundary of the display area AA, so that the substrate 101 can be configured with a non-uniform structure (or a recessed structure).

[0064] The non-uniform structure can significantly increase the surface area of ​​the substrate 101, thereby limiting (or reducing) the outward spread of the organic solution.

[0065] Therefore, the width of the organic encapsulation layer formed in the non-display area NA can be reduced, thereby reducing the process margin for the organic encapsulation layer.

[0066] Therefore, the width occupied by the organic encapsulation layer in the non-display area NA can be reduced, thereby achieving a narrow bezel.

[0067] Furthermore, in this embodiment, in order to increase or maximize the effect of the narrow bezel, when viewed in a plan view, the recessed opening OPP formed around the display area AA can be formed with a curved shape rather than a linear shape.

[0068] In this regard, refer to Figure 1 The recessed opening OPP can have a curved shape, wherein an outwardly curved portion OCP protruding in the outward direction and an inwardly curved portion ICP recessed in the inward direction are alternately arranged along the periphery of the display area AA.

[0069] In other words, the recessed opening OPP can be formed into a waveform shape having a combination of an inwardly curved portion ICP and an outwardly curved portion OCP.

[0070] In this way, by forming a recessed opening OPP with a wavy structure in a plane, the length of the recessed opening OPP with a wavy structure can be significantly increased compared to a recessed opening with a straight structure. In other words, by forming a recessed opening OPP with a wavy structure, the area occupied by the recessed opening OPP (or the recessed opening region) can be increased or maximized.

[0071] Therefore, the surface area of ​​the substrate 101 with recessed openings in the OPP can be increased or maximized to allow for more effective control over the spreadability of the organic encapsulation layer.

[0072] Therefore, the width occupied by the organic encapsulation layer in the non-display area NA can be further reduced to increase or maximize the effect of narrow bezels.

[0073] The structure of the light-emitting display device 10 equipped with a wave-shaped recessed opening OPP can be described in more detail below, which can effectively achieve a narrow bezel by controlling the spread of the organic encapsulation layer.

[0074] Figure 3 It is along Figure 1 The cross-sectional view taken by line III-III' schematically shows the outermost portion of display area AA (e.g., the outermost portion on the right) and the non-display area NA outside display area AA. Furthermore, in Figure 3 For ease of explanation, the transistors in the sub-pixels SP formed on the substrate 101 are omitted.

[0075] Reference Figure 3 as well as Figure 1 and Figure 2 A transistor (or thin-film transistor) can be formed in each sub-pixel SP on the substrate 101 of the light-emitting display device 10 (e.g., Figure 2 (T1, T2, and Td in the text).

[0076] The substrate 101 can be, for example, an insulating substrate, such as a glass substrate or a plastic substrate. As another example, the substrate 101 can be a silicon substrate (or silicon wafer) formed from crystalline silicon (e.g., single-crystal silicon) used as a semiconductor, and in this case, there is the advantage of being able to efficiently realize small-sized display devices requiring high resolution. In this embodiment, for ease of explanation, an insulating substrate is used as an example.

[0077] Furthermore, a transistor may include a semiconductor layer, a gate insulating layer, a gate electrode, a source electrode, and a drain electrode. A bottom-gate thin-film transistor with its gate electrode located below the semiconductor layer, or a top-gate thin-film transistor with its gate electrode located on the semiconductor layer, can be used as a transistor.

[0078] Furthermore, when a semiconductor substrate is used as substrate 101, an active region that serves as a semiconductor layer can be formed in the semiconductor substrate.

[0079] A planarization layer 110 can be formed on a substrate 101 on which transistors can be formed. The planarization layer 110 can make the surface of the substrate 101 substantially flat.

[0080] The planarization layer 110 can be formed as a single layer or a multilayer structure. The planarization layer 110 may include an organic layer made of an organic insulating material such as acrylic resin or benzocyclobutene. As another example, the planarization layer 110 may include at least one inorganic layer stacked together with the organic layer, and the inorganic layer may be formed of an inorganic insulating material such as silicon oxide or silicon nitride.

[0081] exist Figure 3 In the diagram, for ease of explanation, the planarization layer 110 is shown as a single layer.

[0082] The planarization layer 110 may be formed, for example, in a display area AA and a non-display area NA outside the display area AA. In other words, the planarization layer 110 may extend outward from the display area AA and be formed in a portion of the non-display area NA.

[0083] The planarization layer 110 formed in the non-display area NA can cover the driving elements formed in the non-display area NA, such as the gate driving circuit in the GIP structure, but is not limited thereto.

[0084] As previously mentioned, the planarization layer 110 may have a recessed opening OPP formed along the periphery of the display area AA.

[0085] A recessed opening OPP can be formed in the planarization layer 110 in a shape (e.g., annular shape) such that the recessed opening OPP is located in the non-display area NA adjacent to the display area AA, surrounding the display area AA, and the recessed opening OPP can be configured to be recessed downward toward the substrate 101.

[0086] Here, the recessed opening OPP can be formed to have a width of, for example, about 5 μm or more, but is not limited thereto.

[0087] The substrate 101 below the planarization layer 110 can be exposed upward through the recessed opening OPP, but is not limited thereto. For example, the recessed opening OPP can be formed in the shape of a groove so that the recessed base of the planarization layer 110 remains below the recessed opening OPP.

[0088] As a result, when the recessed opening OPP is formed, the surface of the substrate 101 on which the planarization layer 110 is formed may have an uneven shape due to the recessed opening OPP.

[0089] Furthermore, when viewed in a plane, the recessed opening OPP may have a curved shape rather than a linear shape.

[0090] For example, the recessed opening OPP can have a curved shape, wherein an outwardly curved portion OCP protruding in the outward direction and an inwardly curved portion ICP recessed in the inward direction are arranged alternately along the periphery of the display area AA.

[0091] In other words, the recessed opening OPP can be configured with a combination of an inwardly curved portion ICP and an outwardly curved portion OCP, so that the recessed opening OPP can be formed into a waveform shape around the display area AA when viewed as a whole.

[0092] Here, the radius of curvature of the curved portions ICP and OCP of the recessed opening OPP can be, for example, about 10 μm or larger, but is not limited thereto.

[0093] On the substrate 101 on which the planarization layer 110 is formed, for example, a first electrode 140 of a light-emitting diode OD can be formed through a sub-pixel SP in the display area AA. For each sub-pixel SP, the first electrode 140 can be formed in a patterned manner.

[0094] When the light-emitting display device 10 is a top-emitting display device, the first electrode 140 may include a reflective layer formed of, for example, a metal with high reflectivity. The reflective layer may be formed of, for example, Ag, Al, Mo, Ti, or an APC (Al-Pd-Cu) alloy, but is not limited thereto.

[0095] When the light-emitting display device 10 is a bottom-emitting display device, the first electrode 140 may include a transparent layer formed of a transparent conductive material, for example, having transparent properties. The transparent layer may be formed of, for example, ITO, IZO, or ITZO, but is not limited thereto.

[0096] On the substrate 101 on which the first electrode 140 is formed, a dam (or partition wall or fence) BNK can be formed, positioned along the edge of each sub-pixel SP and surrounding the sub-pixel SP. The dam BNK can be formed of inorganic insulating material and / or organic insulating material.

[0097] The embankment BNK may have an opening that exposes the first electrode 140 of each sub-pixel SP, and may be configured to cover the edge of the first electrode 140. The opening of the embankment BNK can define the light-emitting area (or light-emitting diode OD) within the sub-pixel SP that actually generates light.

[0098] The light-emitting layer 145 can be formed on the substrate 101 having the first electrode 140 and the embankment BNK. The light-emitting layer 145 can be formed, for example, corresponding to the sub-pixel SP arranged in the display area AA.

[0099] The light-emitting layer 145 can be, for example, an organic light-emitting layer formed using organic materials. Alternatively, the light-emitting layer 145 can be formed as a multilayer structure including layers of light-emitting materials that actually perform light emission.

[0100] The light-emitting layer 145 can be formed as a single stacked structure or a multi-stacked structure. In addition, when the light-emitting layer 145 is formed as a multi-stacked structure, a charge generation layer can be provided between adjacent stacks.

[0101] The second electrode 150 can be formed on the substrate 101 having the light-emitting layer 145. The second electrode 150 can be formed, for example, in a substantially continuous form in the display area AA.

[0102] When the light-emitting display device 10 is a top-emitting display device, the second electrode 150 may include a transparent layer formed of a transparent conductive material, for example, having transparent properties. The transparent layer may be formed of, for example, ITO, IZO, or ITZO, but is not limited thereto.

[0103] As another example, the second electrode 150 can be formed of a metal exhibiting translucent properties, such as Mg, Ag, or an alloy of Mg and Ag (Mg:Ag). In this case, a microcavity structure can be formed by the translucent second electrode 150 and a reflector below the translucent second electrode 150. Considering the resonant distance of the microcavity, the reflector can be included in or located below the first electrode 140.

[0104] Furthermore, when the light-emitting display device 10 is a bottom-emitting display device, the second electrode 150 may include a reflective layer formed of, for example, a metal with high reflectivity. The reflective layer may be formed of, for example, Ag, Al, Mo, Ti, or an APC (Al-Pd-Cu) alloy, but is not limited thereto.

[0105] As described above, the first electrode 140, the light-emitting layer 145, and the second electrode 150 laminated in the display area AA can constitute the light-emitting diode OD of the sub-pixel SP.

[0106] Furthermore, the light-emitting layer 145 and the second electrode 150 formed in the display area AA can extend into the non-display area NA.

[0107] In this regard, for example, the light-emitting layer 145 and the second electrode 150 may be formed to extend beyond the boundary of the display area AA and cover the recessed opening OPP in the non-display area NA. In this case, the light-emitting layer 145 and the second electrode 150 may have a shape that extends outward along the upper surface of the portion of the planarization layer 110 located inside the recessed opening OPP, the inner surface of the recessed opening OPP (or the inner surface of the planarization layer 110 defining the recessed opening OPP), and the upper surface of the portion of the planarization layer 110 located outside the recessed opening OPP.

[0108] In this case, the light-emitting layer 145 and the second electrode 150 can be formed along the recessed opening OPP, thereby maintaining the non-uniform structure caused by the recessed opening OPP.

[0109] Furthermore, in the recessed opening OPP, an insulating pattern 141 can be formed below the light-emitting layer 145 along the uneven shape of the recessed opening OPP. For example, the insulating pattern 141 can be formed in the non-display area NA to cover the recessed opening OPP and the upper surface of the planarization layer 100 on the inner and outer sides of the recessed opening OPP.

[0110] The insulating pattern 141 can be formed of, for example, an inorganic insulating material, and can reduce or prevent (or block) the entry of moisture or oxygen through the recessed opening OPP. The insulating pattern 141 can be formed of, for example, silicon oxide, silicon nitride, metal oxide, and metal, but is not limited thereto.

[0111] For example, an insulating pattern 141 may be formed during the process of forming the first electrode 140. In this case, the insulating pattern 141 may be made of the metal forming the first electrode 140 or a metal oxide formed by oxidizing the metal of the first electrode 140.

[0112] In addition, a first dam DAM1, which is an upwardly protruding dam, can be formed on the planarization layer 110 outside the recessed opening OPP.

[0113] The first dam DAM1 can be formed, for example, positioned along the periphery of the recessed opening OPP and surrounding the recessed opening OPP. In this case, similar to the recessed opening OPP, the first dam DAM1 can be formed to have a wavy shape in a plane, but is not limited thereto.

[0114] For example, the same materials used in the same process as the dam section BNK can be used to form the first dam DAM1, but it is not limited to this.

[0115] In this way, when the first dam DAM1 is formed around the recessed opening OPP, the height difference of the non-uniform structure of the substrate 101 may increase due to the recessed opening OPP and the first dam DAM1. In this case, a non-uniform structure with a greater height can be formed, thereby increasing the limiting effect on the spreadability of the organic encapsulation layer OE.

[0116] Furthermore, the dam BNK of the outermost sub-pixel SP located inside the recessed opening OPP can have a shape that protrudes upward relative to the recessed opening OPP to function as a dam.

[0117] Furthermore, another first dam DAM1 can be formed within the recessed opening OPP. In other words, another first dam DAM1 can be formed in the non-display area NA between the dam portion BNK of the outermost sub-pixel SP and the recessed opening OPP. In this case, by arranging the first dam DMA1 on each side of the inner and outer sides of the recessed opening OPP, the non-uniform structure can be extended, thereby further limiting the spreadability of the organic encapsulation layer OE.

[0118] Furthermore, outside of the planarization layer 110, at least one second dam DAM2 can be formed in the non-display area NA on the substrate 101. In this embodiment, for ease of explanation, the case of arranging two second dams DAM2 is taken as an example. At the same time, when multiple second dams DAM2 are formed, adjacent second dams DAM2 can be spaced apart from each other by a certain distance.

[0119] The second dam DAM2 can be arranged at a certain distance from the end of the planarization layer 110, and can be formed around the recessed opening OPP (and the first dam DAM1).

[0120] For example, such as Figure 1 As shown, corresponding to the external shape of the substrate 101, such as a rectangular shape, the second dam DAM2 may have a rectangular frame shape in the plan view.

[0121] The second dam DAM2, together with the first dam DAM1 disposed within it, can be configured to restrict the spread of the organic encapsulation layer OE. More specifically, when the organic encapsulation layer OE flows beyond the first dam DAM1 and reaches its outer edge, the flow of the organic encapsulation layer OE can ultimately be blocked by the second dam DAM2. Therefore, even if the organic encapsulation layer OE unintentionally spreads beyond the first dam DAM1, the spread will be restricted by the second dam DAM2.

[0122] For example, when the planarization layer 110 is formed, a second dam DAM2 can be formed. In this case, the second dam DAM2 can be formed essentially by the laminated layer that forms the planarization layer 110, but is not limited thereto.

[0123] As another example, the second dam DAM2 may also include a laminated layer forming the embankment BNK or the first dam DAM1. In other words, the second dam DAM2 may be configured such that the laminated layer forming the embankment BNK or the first dam DAM1 is disposed on the laminated membrane forming the planarization layer 110.

[0124] On the substrate 101 configured as described above, an encapsulation layer ECL can be formed along the display area AA and the non-display area NA. The encapsulation layer ECL may include, for example, at least one inorganic encapsulation layer IE1 and / or IE2 and at least one organic encapsulation layer OE, but is not limited thereto.

[0125] In this embodiment, the encapsulation layer ECL includes an organic encapsulation layer OE and a first inorganic encapsulation layer IE1 and a second inorganic encapsulation layer IE2 formed below and on the organic encapsulation layer OE, respectively.

[0126] The first inorganic encapsulation layer IE1 and the second inorganic encapsulation layer IE2 can reduce, minimize, or prevent external moisture or oxygen from penetrating into the light-emitting diode OD within the display area AA.

[0127] The first inorganic encapsulation layer IE1 and the second inorganic encapsulation layer IE2 can be formed from, for example, inorganic insulating materials capable of low-temperature deposition, such as silicon nitride, silicon oxide, silicon oxynitride, or aluminum oxide, but are not limited thereto.

[0128] Furthermore, in the presence of foreign matter, the organic encapsulation layer OE, situated between the first inorganic encapsulation layer IE1 and the second inorganic encapsulation layer IE2, can prevent the first inorganic encapsulation layer IE1 and the second inorganic encapsulation layer IE2 from being abnormally formed by foreign matter. Therefore, the organic encapsulation layer OE can be used as an encapsulation layer to cover foreign matter and provide planarization.

[0129] The organic encapsulation layer (OE) can be formed from, for example, non-photosensitive organic insulating materials (such as acrylic resin, epoxy resin, phenolic resin, polyamide resin, polyimide resin, polyethylene, or silicon carbide (SiOC)) or photosensitive organic insulating materials (such as photoacrylic acid), but is not limited thereto.

[0130] The first inorganic encapsulation layer IE1 may, for example, cover the second electrode 150 in the display area AA and extend into the non-display area NA to cover the recessed opening OPP, the first dam DAM1, and the second dam DAM2. In this case, the first inorganic encapsulation layer IE1 may be formed along the upper surface of the planarization layer 110 outside the recessed opening OPP (and the first dam DAM1).

[0131] In this way, the first inorganic encapsulation layer IE1 can extend beyond the second dam DAM2 (or the area between the second dam DAM2 and one end of the substrate 101), while covering the display area AA.

[0132] An organic solution can be coated onto the first inorganic encapsulation layer IE1 to form an organic encapsulation layer OE. As previously described, the organic solution can be dropped onto the substrate 101 on which the first inorganic encapsulation layer IE1 is formed (e.g., dropped onto the display area AA), and the dropped organic solution can spread beyond the display area AA, thereby forming the organic encapsulation layer OE over the display area AA and a portion of the non-display area NA outside the display area AA.

[0133] Here, due to the recessed opening OPP, the substrate 101 having the first inorganic encapsulation layer IE1 can have a non-uniform structure formed in the non-display area NA where the recessed opening OPP is located.

[0134] Therefore, the spreadability of the organic solution forming the organic encapsulation layer OE can be limited by the non-uniform structure formed along the recessed opening OPP surrounding the display area AA.

[0135] Due to the non-uniform structure, the area (or width) where the organic solution spreads in the non-display area NA can be reduced, thereby reducing the area (or width) in the non-display area NA where the organic encapsulation layer OE is formed.

[0136] Furthermore, in this embodiment, the recessed opening OPP can be formed in a wavy shape in the planar view to further limit the spreadability of the organic solution. Therefore, the area (or width) occupied by the organic encapsulation layer OE in the non-display area NA can be further reduced.

[0137] In this way, by forming a wavy-shaped recessed opening OPP in the non-display area NA and achieving a non-uniform structure in the substrate 101, the restriction (or reduction) on the flow of the organic solution can be maximized, thereby significantly reducing or minimizing the area (or width) occupied by the organic encapsulation layer OE in the non-display area NA.

[0138] Therefore, the process margin of the organic encapsulation layer (OE) can be reduced, thereby reducing the width of the non-display area (NA). As a result, a narrow bezel can be effectively achieved for the light-emitting display device 10.

[0139] Furthermore, in this embodiment, an example is given where the organic encapsulation layer OE fills the recessed opening OPP and its spreading is confined to a first dam DAM1 outside the recessed opening OPP, and thus the end of the organic encapsulation layer OE is positioned corresponding to (or near) the first dam DAM1. Additionally, in some cases, the organic solution may overflow the first dam DAM1 and flow outside the first dam DAM1, and in such cases, a second dam DAM2 exists outside the first dam DAM1 so that the spreading of the organic encapsulation layer OE can be substantially confined to the area forming the second dam (DAM2).

[0140] On substrate 101, where the formation area of ​​organic encapsulation layer OE is controlled, a second inorganic encapsulation layer IE2 can be formed.

[0141] The second inorganic encapsulation layer IE2 can be formed to substantially completely surround the organic encapsulation layer OE together with the first inorganic encapsulation layer IE1.

[0142] For example, similar to the first inorganic encapsulation layer IE1, the second inorganic encapsulation layer IE2 can extend to the outside of the second dam DAM2 (or the area between the second dam DAM2 and the end of the substrate 101) while covering the display area AA.

[0143] In this case, the second inorganic encapsulation layer IE2 can extend to the non-display area NA while covering the surface (i.e., the upper surface) of the organic encapsulation layer OE, and can extend beyond the organic encapsulation layer OE while covering the surface of the first inorganic encapsulation layer IE1.

[0144] As described above, on the substrate 101 having a light-emitting diode OD, the second inorganic encapsulation layer IE2 can be formed substantially corresponding to the first inorganic encapsulation layer IE1, and the organic encapsulation layer OE can be interposed between the first inorganic encapsulation layer IE1 and the second inorganic encapsulation layer IE2. The first inorganic encapsulation layer IE1 and the second inorganic encapsulation layer IE2 can be formed to extend further outward than the organic encapsulation layer OE.

[0145] In this regard, in the non-display area (NA), the ends of the first inorganic encapsulation layer IE1 and the second inorganic encapsulation layer IE2 can be positioned further outward than the ends of the organic encapsulation layer OE. In other words, the ends of the first inorganic encapsulation layer IE1 and the second inorganic encapsulation layer IE2 can be positioned closer to the ends of the substrate 101 than the ends of the organic encapsulation layer OE. The first inorganic encapsulation layer IE1 and the second inorganic encapsulation layer IE2, as well as the organic encapsulation layer OE, configured as described above, can form an encapsulation layer ECL.

[0146] By forming the encapsulation layer ECL as described above, the first inorganic encapsulation layer IE1 and the second inorganic encapsulation layer IE2 formed over a relatively wide area can reduce or prevent external moisture or oxygen from penetrating into the interior of the light-emitting display device 10, while the organic encapsulation layer OE formed over a relatively small area can cover foreign matter, thereby effectively encapsulating the light-emitting diode OD.

[0147] Specifically, by forming a wave-shaped recessed opening OPP in the non-display area NA along the boundary of the display area AA, an uneven structure can be formed on the substrate 101, thus limiting the spreadability of the organic solution forming the organic encapsulation layer OE. Therefore, the area (or width) in the non-display area NA on which the organic encapsulation layer OE is spread and coated can be further reduced.

[0148] Therefore, by using the concave opening OPP with a wave-shaped shape to achieve a non-uniform structure, the spreadability of the organic solution can be effectively limited (or reduced), thereby significantly reducing or minimizing the area (or width) occupied by the organic encapsulation layer OE in the non-display area NA.

[0149] Therefore, the process margin of the organic encapsulation layer OE can be reduced, thereby reducing the width of the non-display area NA and effectively achieving a narrow bezel for the light-emitting display device 10.

[0150] Furthermore, in this embodiment, the waveform structure of the recessed opening OPP can have various shapes, which can be described in more detail below.

[0151] Figures 4 to 8 These are diagrams schematically illustrating various examples of the shape of the waveform pattern of the waveform structure forming the recessed opening according to embodiments of the present disclosure. Figures 4 to 8For ease of explanation, a portion of the recessed opening OPP is shown in the image.

[0152] First, refer to Figure 4 The waveform pattern, which is the unit pattern of the waveform structure constituting the recessed opening OPP, can have a regular shape.

[0153] For example, the waveform pattern constituting the waveform structure of the recessed opening OPP may include an outwardly curved portion OCP and an inwardly curved portion ICP. The outwardly curved portion OCP is a curved portion that protrudes toward the end of the substrate 101, and the inwardly curved portion ICP is a curved portion that is recessed toward the interior of the substrate 101.

[0154] The outwardly curved portion OCP and the inwardly curved portion ICP can be formed to have substantially the same (or corresponding) curved shapes. For example, both the outwardly curved portion OCP and the inwardly curved portion ICP can have circular (or spherical) shapes, and the curvature (or radius of curvature) of the circular shape of the outwardly curved portion OCP and the inwardly curved portion ICP can be substantially the same.

[0155] In this way, the outwardly curved portion OCP and the inwardly curved portion ICP can be formed into the same circular shape, so that the waveform pattern with the outwardly curved portion OCP and the inwardly curved portion ICP can be formed into a regular pattern.

[0156] The waveform pattern can be repeated multiple times in at least a portion of the recessed opening OPP.

[0157] Next, refer to Figure 5 The waveform pattern constituting the concave opening OPP can have a regular shape. Furthermore, Figure 5 The waveform pattern can have a different Figure 4 The curved portions OCP and ICP formed by the shape of the waveform pattern. For example, the curved portions OCP and ICP of the waveform pattern can have an elliptical shape.

[0158] In this respect, the outwardly curved portion OCP and the inwardly curved portion ICP can have essentially the same elliptical shape, and the curvature (or radius of curvature) of the elliptical shape of the outwardly curved portion OCP and the inwardly curved portion ICP can be essentially the same.

[0159] In this way, the outwardly curved portion OCP and the inwardly curved portion ICP can be formed into the same elliptical shape, so that the waveform pattern with the outwardly curved portion OCP and the inwardly curved portion ICP can be formed into a regular pattern.

[0160] The waveform pattern can be repeated multiple times in at least a portion of the recessed opening OPP.

[0161] Next, refer to Figure 6 The waveform pattern of the waveform structure that constitutes the concave opening OPP can have an irregular shape.

[0162] For example, the outwardly curved portion OCP and the inwardly curved portion ICP can have significantly different curvatures. The outwardly curved portion OCP can have a circular shape with a first curvature, and the inwardly curved portion ICP can have a circular shape with a second curvature different from the first curvature.

[0163] For example, such as Figure 6 As shown, the outwardly curved portion OCP can have a relatively large first curvature (or a relatively small first curvature radius), and the inwardly curved portion ICP can have a relatively small second curvature (or a relatively large second curvature radius) compared to the outwardly curved portion OCP.

[0164] Alternatively, the outwardly curved portion OCP can have a relatively small curvature, and the inwardly curved portion ICP can have a relatively large curvature compared to the outwardly curved portion OCP.

[0165] In this way, the outwardly curved portion OCP and the inwardly curved portion ICP can be formed with different curved shapes, so that the waveform pattern with the outwardly curved portion OCP and the inwardly curved portion ICP can be formed into an irregular pattern.

[0166] The waveform pattern can be repeated multiple times in at least a portion of the recessed opening OPP.

[0167] Next, refer to Figure 7 The waveform pattern of the waveform structure that constitutes the concave opening OPP can have an irregular shape.

[0168] For example, the outward-curving portion OCP and the inward-curving portion ICP can have significantly different curvature shapes. The outward-curving portion OCP can have an elliptical shape, while the inward-curving portion ICP can have a circular shape.

[0169] For example, such as Figure 7 As shown, the outwardly curved portion OCP can have an elliptical shape with relatively small curvature, while the inwardly curved portion ICP can have a circular shape with relatively large curvature.

[0170] In another example, the outwardly curved portion OCP can have a circular shape, and the inwardly curved portion ICP can have an elliptical shape.

[0171] Therefore, the outwardly curved portion OCP and the inwardly curved portion ICP can be formed with different curved shapes, so that the waveform pattern with the outwardly curved portion OCP and the inwardly curved portion ICP can be formed as an irregular pattern.

[0172] The waveform pattern can be repeated multiple times in at least a portion of the recessed opening OPP.

[0173] Next, refer to Figure 8 In the waveform pattern of the waveform structure constituting the recessed opening OPP, at least one of the outwardly curved portion OCP and the inwardly curved portion ICP can be formed as a combination with different curved shapes.

[0174] For example, the outwardly curved portion OCP can be configured to include an elliptical portion (or a first portion) OS and a circular portion (or a second portion) CS. Similarly, the inwardly curved portion ICP can be configured to include an elliptical portion (or a first portion) OS and a circular portion (or a second portion) CS.

[0175] As another example, one of the outwardly curved portion OCP and the inwardly curved portion ICP can be formed as a combination of different curved shapes, and the other of the outwardly curved portion OCP and the inwardly curved portion ICP can be formed as having a curved shape different from the combination of curved shapes (e.g., circular or elliptical).

[0176] In this way, at least one of the outwardly curved portion OCP and the inwardly curved portion ICP can be formed as a combination with different curved shapes.

[0177] The waveform pattern can be repeated multiple times in at least a portion of the recessed opening OPP.

[0178] In this embodiment, the waveform structure of the recessed opening OPP can be formed in various ways depending on the location, which can be described in more detail below.

[0179] Figures 9 to 11 This is a diagram schematically illustrating various examples of waveform structures at the sides and corners constituting the recessed openings according to embodiments of the present disclosure.

[0180] Reference Figures 9 to 11 The recessed opening OPP can be configured with side OPPs and corner OPPc. The side OPPs correspond to one side of the substrate 101 and extend along one side of the substrate 101. The corner OPPc corresponds to the corner of the substrate 101 between adjacent sides of the substrate 101 and extends along the corner of the substrate 101.

[0181] In this case, the waveform structure of the side OPPs of the recessed opening OPP and the waveform structure of the corner OPPc of the recessed opening OPP can be basically the same or different.

[0182] For example, the waveform structure of side OPPs and the waveform structure of corner OPPs can have the same or different shapes and / or curvatures.

[0183] In this regard, refer to Figure 9 The waveform structure of the side OPPs (or the curved portions OCP and ICP of the side OPPs) of the recessed opening OPP can be configured, for example, as a circular shape. Furthermore, the waveform structure of the corner OPPc of the recessed opening OPP can be configured as a circular shape, similar to the waveform structure of the side OPPs. Here, the curvature of the waveform structure of the corner OPPc can be the same as the curvature of the waveform structure of the side OPPs.

[0184] In this way, the side OPPs and corner OPPc of the recessed opening OPP can be configured such that their waveform structures have substantially the same curved shape.

[0185] In addition, refer to Figure 10 The waveform structure of the side OPPs (or the curved portions OCP and ICP of the side OPPs) of the recessed opening OPP can be configured, for example, as a circular shape. Furthermore, the waveform structure of the corner OPPc of the recessed opening OPP can be configured as a circular shape, similar to the waveform structure of the side OPPs. Here, the curvature of the waveform structure of the corner OPPc can differ from the curvature of the waveform structure of the side OPPs. For example, the curvature of the waveform structure of the corner OPPc can be relatively large, while the curvature of the waveform structure of the side OPPs can be relatively small.

[0186] Therefore, the side OPPs and corner OPPc of the recessed opening OPP can be configured such that their waveform structures have significantly different bending shapes.

[0187] In addition, refer to Figure 11 The waveform structure of the side OPPs (or the curved portions OCP and ICP of the side OPPs) of the recessed opening OPP can be configured, for example, as a circular shape. Furthermore, the waveform structure of the corner OPPc of the recessed opening OPP can be configured differently from the waveform structure of the side OPPs, for example, as an elliptical shape.

[0188] In this way, the side OPPs and corner OPPc of the recessed opening OPP can be configured such that their waveform structures have significantly different bending shapes.

[0189] As described above, according to embodiments of this disclosure, the wave-shaped recessed opening can be formed in a planarization layer in a portion of the non-display area along the boundary of the display area. Therefore, an uneven structure can be formed in the substrate, which limits the spreadability of the organic solution forming the organic encapsulation layer. Thus, the area (or width) in the non-display area on which the organic encapsulation layer is spread and coated can be further reduced.

[0190] In this way, by utilizing the concave openings in a wave shape to achieve a non-uniform structure, the spreadability of the organic solution can be effectively limited (or reduced), thereby significantly reducing or minimizing the area (or width) occupied by the organic encapsulation layer in the non-display area.

[0191] Therefore, the process margin of the organic encapsulation layer can be reduced, thereby reducing the width of the non-display area and effectively achieving a narrow bezel for the light-emitting display device.

[0192] It will be apparent to those skilled in the art that various modifications and variations can be made to this disclosure without departing from the technical spirit or scope thereof. Therefore, this disclosure is intended to cover such modifications and variations as long as they fall within the scope of the appended claims and their equivalents.

[0193] Cross-references to related applications

[0194] This application claims the priority of Korean Patent Application No. 10-2024-0195123, filed in Korea on December 24, 2024, the entire contents of which are expressly incorporated herein by reference for all purposes, as if fully set forth herein.

Claims

1. A light-emitting display device, the light-emitting display device comprising: A substrate, the substrate including a display area and a non-display area outside the display area, wherein sub-pixels are arranged in the display area; A planarization layer, the planarization layer being located on the substrate in the display area and the non-display area; A light-emitting diode, wherein the light-emitting diode is located in a sub-pixel on the planarization layer; as well as An encapsulation layer is located on the light-emitting diode and in the display area and the non-display area, and includes a first inorganic encapsulation layer and a second inorganic encapsulation layer, and an organic encapsulation layer interposed between the first inorganic encapsulation layer and the second inorganic encapsulation layer. The planarization layer includes recessed openings that surround the display area and have a wave-like shape in a planar view. In the non-display area, the encapsulation layer extends outward beyond the recessed opening.

2. The light-emitting display device according to claim 1, wherein, One or more recessed openings are arranged around the display area.

3. The light-emitting display device according to claim 1, wherein the light-emitting display device further comprises a first dam surrounding the recessed opening on the planarization layer.

4. The light-emitting display device according to claim 3, wherein, Another first dam is located inside the recessed opening on the planarization layer.

5. The light-emitting display device according to claim 3, wherein The light-emitting diode includes a first electrode, a light-emitting layer on the first electrode, and a second electrode on the light-emitting layer. The embankment covers the edge of the first electrode, and The first dam comprises the same material as the embankment.

6. The light-emitting display device according to claim 3, wherein the light-emitting display device further comprises a second dam located in the non-display area outside the planarization layer.

7. The light-emitting display device according to claim 6, wherein, The second dam has a frame shape that corresponds to the external shape of the substrate.

8. The light-emitting display device according to claim 1, wherein The width of the recessed opening is 5 μm or greater.

9. The light-emitting display device according to claim 1, wherein The radius of curvature of the curved portion of the waveform forming the recessed opening is 10 μm or greater.

10. The light-emitting display device according to claim 1, wherein The waveform pattern forming the recessed opening includes an outwardly curved portion and an inwardly curved portion.

11. The light-emitting display device according to claim 10, wherein, The outwardly curved portion and the inwardly curved portion have the same curvature.

12. The light-emitting display device according to claim 10, wherein The outwardly curved portion and the inwardly curved portion have different curvatures.

13. The light-emitting display device according to claim 10, wherein At least one of the outwardly curved portion and the inwardly curved portion includes a combination of different curved shapes.

14. The light-emitting display device according to claim 1, wherein, The recessed opening includes a side portion positioned corresponding to the side of the substrate and a corner portion positioned corresponding to the corner of the substrate.

15. The light-emitting display device according to claim 14, wherein, The waveform shape of the corner portion and the waveform shape of the side portion may be the same or different in shape and / or curvature.

16. The light-emitting display device according to claim 1, wherein The ends of the first inorganic encapsulation layer and the second inorganic encapsulation layer are outside the ends of the organic encapsulation layer.

17. The light-emitting display device according to claim 1, wherein An insulating pattern is provided along the recessed opening.

18. The light-emitting display device according to claim 1, wherein, At least one of the recessed openings extends in the non-display area to completely surround the display area.

19. The light-emitting display device according to claim 1, further comprising: A dike section, wherein the dike section is disposed on the planarization layer; as well as A dam, wherein the dam is disposed on the planarization layer in the non-display area, Wherein, at least one of the recessed openings is disposed on the substrate between the dike and the dam.

20. A light-emitting display device, the light-emitting display device comprising: A substrate, the substrate including a display area and a non-display area outside the display area, wherein sub-pixels are arranged in the display area; A planarization layer, the planarization layer being located on the substrate in the display area and the non-display area; A light-emitting diode, wherein the light-emitting diode is located in the sub-pixel on the planarization layer; as well as An encapsulation layer is located on the light-emitting diode and extends into the display area and the non-display area. The planarization layer includes recessed openings that are entirely located within the non-display area surrounding the display area. These recessed openings have a wave-like shape in a planar view. In the non-display area, the encapsulation layer covers the recessed opening and extends outward beyond the recessed opening.

Images