Liquid-cooled small form-factor pluggable optical module

Abstract

A pluggable optical module includes: a body; a cold plate coupled to the body; and a pair of quick-disconnectors for a cooling fluid supply line and a quick-disconnector for a cooling fluid return line, coupled to the cold plate and extending from the cold plate and the body. Optionally, the cold plate is integrated into the body. Alternatively, one or more fixing mechanisms are used to attach the cold plate adjacently to an outer surface of the body, and a thermal interface material is disposed between the cold plate and the outer surface of the body. The body and the cold plate are adapted to be inserted into a host card, circuit package, or module as an integrated unit, wherein the pair of quick-disconnectors for a cooling fluid supply line and a quick-disconnector for a cooling fluid return line are adapted to fluidly engage with a corresponding pair of quick-disconnectors for a cooling fluid supply manifold or flow channel cavity and a fluid return manifold or flow channel cavity disposed in the host card, circuit package, or module.

Description

Cross-references to related applications

[0001] This disclosure claims priority to co-pending U.S. Patent Application No. 18 / 432,141, filed February 5, 2024, entitled “Liquid-cooled small form factor pluggable optical module,” which claims priority to U.S. Provisional Patent Application No. 63 / 544,516, filed October 17, 2023, entitled “Liquid-cooled small form factor pluggable optical module,” the contents of which are incorporated herein by reference in their entirety. Technical Field

[0002] This disclosure generally relates to the fields of telecommunications and optical networking. More specifically, this disclosure relates to liquid-cooled small pluggable optical modules (POMs). Background Technology

[0003] Conventionally, air-cooled riding heat sinks are used to cool the POM (Power Oxide Module). When the POM is inserted into an associated card, circuit pack, or module, it docks with the heat sink in a dry / sliding manner, introducing significant dry / sliding thermal performance losses. Replacing the air-cooled riding heat sink with an externally placed liquid-cooled riding plate may not solve this dry-sliding thermal performance loss problem, but instead introduces the additional problem of bulky quick-disconnectors.

[0004] Existing solutions have significant drawbacks. Lower performance is caused by thermal losses at the dry / slip interface, compounded by the limitations of air cooling for high-power pluggable optics. The bulky external quick-disconnectors hinder compact designs and prevent minimizing plug-in pitch, thus limiting panel port density for cards, circuit packs, or modules. Typically, there is insufficient space on the printed circuit board (PCB) of a card, circuit pack, or module for two separate manifolds, resulting in limited usable height.

[0005] This "Background Art" is provided only as an illustrative context and should not be construed as limiting in any way. It will be apparent to those skilled in the art that the principles and concepts of this disclosure can be implemented equivalently in other contexts without limitation. Summary of the Invention

[0006] This disclosure provides a liquid-cooled compact POM using an embedded quick-disconnector arranged to minimize the pitch between plugs and cooperating with a dual-flow (i.e., dual-channel cavity) manifold assembly mounted on the PCB of a card, circuit package, or module. By integrating liquid cooling into the POM, the dry / slip interface is eliminated, as are the dry / slip thermal performance losses associated with riding heat sinks. Furthermore, the use of liquid cooling significantly improves cooling performance. A new POM can be provided, and existing POMs can be upgraded to integrate liquid cooling and eliminate this dry / slip interface. The array of female quick-disconnectors associated with the dual-flow manifold assembly complements the minimized pitch between plugs in the POM. The two manifolds or channel cavities combined into a single manifold assembly reduce the size and cost of fluid distribution. This idea can be used in compact spaces to allow more space for other devices. Therefore, this disclosure allows for thermal management of high-power POMs (e.g., QSFP-DDs) that would otherwise be extremely challenging to cool. This disclosure allows for increased port density of high-power plugs at the panel and enables future liquid cooling in space-constrained applications. This disclosure also allows for effective liquid cooling of components located at the nose of the POM, which typically protrudes from the associated panel and, in conventional cooling solutions, does not come into thermal contact with the riding heat sink or cold plate.

[0007] This disclosure provides an integration method for integrating liquid cooling into a small POM while maintaining a minimized inter-plug pitch, and an integration method for integrating blind-fit liquid quick-disconnectors into the POM. This integration can be accomplished in two ways: by replacing the top of the plug housing with a cold plate equipped with a liquid quick-disconnector, thereby manufacturing a liquid-cooled plug (during the plug manufacturing process), and by upgrading an existing plug by attaching a cold plate featuring a liquid quick-disconnector to the top of the plug housing using a thermal interface material. Therefore, this disclosure enables the conversion of existing POMs into liquid-cooled POMs. An array of female quick-disconnectors at the dual-flow manifold assembly combines multiple embedded female quick-disconnectors (thus minimizing the required spacing). The dual-flow (i.e., dual-channel cavity) manifold assembly is provided in combination with the array of female quick-disconnectors. This allows parallel flow to the panel-mounted liquid-cooled POM. The tapered dispensing channels also facilitate flow control along the length of the manifold assembly.

[0008] In one embodiment, this disclosure provides a pluggable optical module comprising: a body; a cold plate coupled to the body; and a pair of quick-disconnectors for a cooling fluid supply line and a quick-disconnector for a cooling fluid return line coupled to the cold plate and extending from the cold plate and the body. The cold plate extends to the nose of the body and is disposed adjacent to a component disposed in the nose of the body. Optionally, the cold plate is integrated into the body. Alternatively, one or more fixing mechanisms are used to connect the cold plate adjacent to the outer surface of the body, and a thermal interface material is disposed between the outer surfaces of the cold plate and the body. The body and the cold plate are adapted to be inserted into a host card, circuit package, or module as an integrated unit, wherein the pair of quick-disconnectors for a cooling fluid supply line and a quick-disconnector for a cooling fluid return line are adapted to fluidly engage with a corresponding pair of quick-disconnectors for a cooling fluid supply manifold or flow channel cavity and a fluid return manifold or flow channel cavity disposed in the host card, circuit package, or module. Optionally, the pair of quick-disconnectors for the cooling fluid supply line and the cooling fluid return line are male quick-disconnectors. Optionally, the corresponding pair of quick-disconnectors for the cooling fluid supply line and the cooling fluid return line are female quick-disconnectors. Optionally, the pair of quick-disconnectors for the cooling fluid supply line and the cooling fluid return line are diagonally positioned on the insertion end of the pluggable optical module, wherein each of the pair of quick-disconnectors for the cooling fluid supply line and the cooling fluid return line is offset vertically relative to the lateral axis of the cold plate and / or the body. This vertical offset minimizes the pitch between the plugs on the host card, circuit package, or panel of the module when the pluggable optical module is inserted into the host card, circuit package, or panel of the module. Alternatively, the pair of quick-disconnectors for the cooling fluid supply line and the cooling fluid return line are horizontally positioned on the insertion end of the pluggable optical module, wherein each of the pair of quick-disconnectors for the cooling fluid supply line and the cooling fluid return line is adjacent to each other side-by-side along the transverse axis of the cold plate and / or the body. Alternatively, each of the pair of quick-disconnectors for the cooling fluid supply line and the cooling fluid return line is a separate component connected to the cold plate and the body using one or more fixing mechanisms. Alternatively, the pair of quick-disconnectors for the cooling fluid supply line and the cooling fluid return line are connected together as a single component, which is connected to the cold plate and the body using one or more fixing mechanisms.

[0009] In another embodiment, this disclosure provides a negative quick-disconnector array assembly comprising: a structure defining a plurality of embedded negative quick-disconnector housings; and a plurality of negative quick-disconnector inner valves disposed within the plurality of embedded negative quick-disconnector housings; wherein the plurality of embedded negative quick-disconnector housings and the plurality of negative quick-disconnector inner valves form a plurality of negative quick-disconnectors adapted to receive corresponding plurality of positive quick-disconnectors, the plurality of positive quick-disconnectors being associated with one or more pluggable optical modules. Each embedded negative quick-disconnector housing is sized to accommodate misalignment of the quick-disconnectors and is designed to receive a sealing O-ring of the associated inner valve abutting against a rear wall of the embedded negative quick-disconnector housing to prevent leakage. Optionally, the negative quick-disconnector array assembly further includes a wall coupled to the structure to secure the plurality of negative quick-disconnector inner valves within the plurality of embedded negative quick-disconnector housings. Optionally, the structure is fluidly connected to a cooling fluid supply line and a cooling fluid return line via one or more flow channel cavities or manifolds. Alternatively, the structure is a manifold including flow channel cavities connected to a cooling fluid supply line and a cooling fluid return line. Optionally, the female quick-closing devices of the fluid supply-return pair are diagonally disposed on the surface of the structure, wherein each of the female quick-closing devices in the pair is vertically offset relative to the transverse axis of the structure. Alternatively, the female quick-closing devices of the fluid supply-return pair are horizontally disposed on the surface of the structure, wherein each of the female quick-closing devices in the pair is adjacent to each other side-by-side along the transverse axis of the structure. Optionally, the structure defines one or more recesses or cutouts from front to back in the top and / or bottom surfaces of the structure, thereby providing one or more airflow channels through and around the structure.

[0010] In another embodiment, this disclosure provides a method for providing a pluggable optical module, the method comprising: providing a pluggable optical module body; attaching a cold plate to a vicinity of an outer surface of the pluggable optical module body using one or more fixing mechanisms; and providing a thermal interface material between the cold plate and the outer surface of the pluggable optical module body; wherein the pluggable optical module body and the cold plate are adapted to be inserted into a host card, circuit package, or module as an integrated unit.

[0011] It will be apparent to those skilled in the art that aspects and features of each of the described embodiments may be incorporated, omitted, and / or combined as desired in a given application without limitation. Attached Figure Description

[0012] The present disclosure is illustrated and described with reference to the accompanying drawings, wherein the same reference numerals are used to appropriately denote the same component parts / method steps, and wherein:

[0013] Figure 1 The elimination of the dry / slip interface associated with POM is shown;

[0014] Figure 2 A liquid-cooled POM with diagonally arranged liquid connectors is shown;

[0015] Figure 3 This demonstrates how a typical POM can be upgraded to a liquid-cooled plug by attaching a cold plate to diagonally positioned liquid connectors.

[0016] Figure 4 The liquid-cooled POM is shown in both single-cage and multi-cage variants, using the entire body (i.e., housing and inner valve) of each negative quick disconnector, which undesirably occupies a large amount of space in space-constrained applications.

[0017] Figure 5 The manifold assembly and liquid-cooled plug are shown, wherein the liquid connectors are placed diagonally to achieve a minimized inter-plug pitch via an embedded female quick disconnector (i.e., internal valve only).

[0018] Figure 6 A liquid-cooled connector is shown, wherein if the pitch between the connectors is large, the liquid connectors are placed side by side (i.e., horizontally).

[0019] Figure 7 A typical negative fast disconnector is shown;

[0020] Figure 8 A female quick-release array is shown—this female quick-release array embeds a valve within a liquid connector into a single component, which can be integrated with or separated from the flow channel cavity of a dual-flow manifold assembly; and

[0021] Figure 9 The outline of the manifold assembly (i.e., the recess) is shown, which is configured to minimize air blockage caused by the dual-flow manifold assembly.

[0022] It will be apparent to those skilled in the art that aspects and features of each embodiment in the illustrated embodiments can be incorporated, omitted, and / or combined as desired in a given application without limitation. Detailed Implementation

[0023] This disclosure provides a cooling solution to address the challenging thermal requirements associated with current and future small POMs (e.g., QSFP-DD). This cooling solution integrates liquid cooling directly into the body of the POM while ideally maintaining maximized port density in panel processing.

[0024] As mentioned above, liquid-cooled riding cold plates can be used instead of air-cooled riding heat sinks in a similar manner, but this still suffers from dry heat performance losses / sliding heat performance losses. In some configurations using integrated cold plate assemblies, this design can incorporate conventional, large-volume quick-disconnectors. These quick-disconnectors are typically only suitable for larger POM forming factors, resulting in a negative impact on port density. In this design, two separate manifolds are used for the supply and return lines at the point where the liquid connections are mated. The quick-disconnectors are typically mounted on the manifolds (e.g., screwed to the outside) rather than embedded in the manifolds. The female quick-disconnector is typically a separate, two-piece component (in typical configurations, it includes an inner valve and a housing).

[0025] refer to Figure 1 The conventional method for cooling POM 10 is to use a riding heat sink / cold plate 12 on top of POM 10. The interface 14 between POM 10 and the riding heat sink / cold plate 12 is a sliding contact / dry contact interface, which introduces a significant loss of temperature performance, thus degrading the cooling performance. The higher the plug power, the greater the loss of temperature performance, making thermal management of upcoming high-power POMs extremely challenging.

[0026] To address this issue, the POM 20 of this disclosure employs a liquid-cooled feature 22, which is integrated into or fixedly coupled to the body 24 of the POM 20, thereby eliminating any sliding contact / dry contact interfaces. The liquid-cooled feature 22 includes a coolant supply line and a coolant return line 26, which, when the POM 20 is inserted into a card, circuit pack, or module, are coupled via a blind-fit quick-disconnector to an associated manifold assembly located on the PCB of the associated card, circuit pack, or module.

[0027] refer to Figure 2The liquid-cooled miniature POM 20 of this disclosure includes a POM body 24 comprising two conventional POM components and an integrated or attached liquid-cooling feature 22 at the top (or bottom) of the POM body 24. Conventional POM components are well known to those skilled in the art, and for the sake of brevity, they are not described in more detail. At the insertion end of the POM body 24, the POM 20 includes a drip-free, blind-mate liquid supply quick-disconnect and a liquid return quick-disconnect 28. In typical applications, due to size limitations (associated with the male and female quick-disconnects) and space limitations (associated with the POM, card, circuit package, or module), the POM 20 typically includes a male quick-disconnect, while the female quick-disconnect is typically included in the associated manifold; however, in a given application, this arrangement may be reversed depending on permissible and desired conditions. When the POM 20 is inserted into the host PCB, both electrical and fluid connections are made using a blind-mating method. As shown, to minimize the pitch between the plugs in the POM 20, the supply quick-disconnect and return quick-disconnect 28 on the POM 20 and manifold are diagonally offset, with one quick-disconnect 28a positioned opposite to the lateral axis of the liquid-cooled feature 22 and / or the POM 20, and one quick-disconnect 28b positioned opposite to the lateral axis of the liquid-cooled feature 22 and / or the POM 20. Thus, each quick-disconnect 28 is vertically offset to the desired extent, one above and one below. Each quick-disconnect 28 is secured to the liquid-cooled feature 22 and / or the POM body 24 (i.e., the POM 20) by screws 30 or other fixing mechanisms. It is contemplated that the quick-disconnects 28 can be optionally manufactured in pairs, allowing both quick-disconnects 28a and 28b to be secured simultaneously using a single screw 30 or other fixing mechanism. Furthermore, it should be envisioned that the quick-release switch 28 can simply be threaded and screwed into the liquid-cooled feature 22 and / or the POM body 24. Further, where the pitch between plugs and panel plug density are not significant issues, the supply and return quick-release switches 28 on the POM 20 and manifold can simply be horizontally offset, with both quick-release switches 28a and 28b positioned along the transverse axis of the liquid-cooled feature 22 and / or the POM 20, without any vertical offset. This overall configuration not only utilizes the excellent thermal properties of the liquid to cool the POM 20 but also eliminates the need for unattached external heat sinks / cold plates, thus eliminating dry / slip interfaces and further improving the thermal performance of the POM 20.Additionally, placing the positive quick disconnector horizontally results in a shorter POM 20, which leads to less airflow blockage for applications requiring airflow intake to cool downstream devices.

[0028] refer to Figure 3 The cooling features of this disclosure can be integrated / attached in two ways: (1) by replacing the top of the housing of POM 20 with the aforementioned cold plate 22a, or (2) by attaching the cold plate 22a to the top of the housing of POM 20 using a thermal interface material 32 and multiple screws 34 or other (multiple) fixing mechanisms. The latter option can be used for existing plugs to make them liquid-cooled plugs. While a thermal interface material is generally preferred, it is not mandatory. For example, there are cases where it can be completely eliminated when the facing surface has sufficiently low flatness and roughness. The former option results in a new plug, namely a higher plug characterized by an integrated liquid connector. The latter option can be implemented on existing plugs, i.e., the common plug can be air-cooled in an air-cooled system, and / or liquid-cooled in a liquid-cooled system by attaching the cold plate 22a to the liquid-cooled system. This option may require the development of new plug standards in which mounting point locations are specified on the body 24 of the plug for attaching the cold plate 22a.

[0029] like Figure 3As shown, the cold plate 22a constituting the liquid-cooled feature 22 and the quick disconnector 28 are secured to the top of the housing of the body 24 of the POM 20 (which may otherwise be an air-cooled POM or a liquid-cooled POM) via a plurality of screws 34 or (a plurality of) other fixing mechanisms, wherein a thermal interface material 32 is disposed between the liquid-cooled feature 22 and the body 24 of the POM 20, thereby facilitating heat transfer between the POM 20 and the liquid-cooled feature 22. When the liquid-cooled feature 22 is integrated into or attached to the POM 20, an important aspect is that when the POM is inserted into an associated card, circuit pack, or module / when the POM is removed from an associated card, circuit pack, or module, the cold plate 22a no longer slides relative to the POM 20, and therefore there is no dry interface / sliding interface between the cold plate 22a and the POM 20. Essentially, the cold plate 22a is in immovable contact with the POM 20, is part of the POM 20, and is inserted / removed together with the POM 20, with supply and return connections made via engagement / disengagement at the rear of the POM 20 via a quick disconnector 28. One advantage of providing a liquid-cooled POM is the ability to effectively cool the nose of the plug located on the outside of the associated panel, without thermal contact with the riding heat sink / cold plate in conventional cooling solutions. Therefore, the cold plate 22a of this disclosure optionally extends to the nose of the POM 20 and is positioned partially adjacent to components within the nose of the POM 20.

[0030] refer to Figure 4 When a liquid-cooled POM 20 is inserted into the host card 40, the plug liquid connector 42 mates with the coolant line 44 on the host card 40 for supplying and returning coolant. Single-cage (accommodating one POM 20) and multi-cage (accommodating multiple POM 20) variants are shown. To achieve a seamless blind-mating liquid connection, the coolant line 44 on the host card 40 is typically equipped with a female blind-mating liquid connector 42b, which can accommodate radial misalignment of up to ±0.75 mm between, for example, the male connector 42a (on (multiple) POM 20s) and the female connector 42b (on the host card 40).

[0031] The coolant line 44 on the host card 40 consists of two manifolds or flow channel cavities 46, a supply path, and a return path. The supply path delivers fresh coolant to the POM cold plate(s) 22a, and the return path collects warmer coolant from the POM cold plate(s) 22a. If there is sufficient space / height on the host card 40, the supply and return paths can be two separate manifolds 46. Alternatively, the two flow channel cavities 46 can be combined into a single structure to save board space / height and allow for a more uniform distribution of parallel flow cooling paths. Furthermore, the retainer connector 42 can be identical in structure to the manifold(s) or flow channel cavity(s) 46, and can be integrally formed with or separate from the manifold(s) or flow channel cavity(s) 46, and fluidly connected to the manifold(s) or flow channel cavity(s) 46.

[0032] Maintaining a minimum plug pitch for QSFP-DD is of interest in this disclosure. The aim is to keep the QSFP module width constant while achieving maximum port density at the panel.

[0033] refer to Figure 5 To maintain a small (e.g., 22.5 mm) pitch for the QSFP-DD module (i.e., the minimum possible pitch with a single QSFP-DD cage), the liquid connector 42 is diagonally positioned on both the plug 20 (i.e., male connector 42a) and the manifold 46 (i.e., female connector 42b). This diagonal quick-disconnect mounting provides the minimum plug pitch for a given liquid connector diameter but occupies more height, resulting in a taller POM 20 and a taller manifold 46 within the space allowed in the host card / on the host PCB 40. Figure 5 The diagram also shows the panel 48 of the host card / the panel 48 of the host PCB 40.

[0034] refer to Figure 6 To reduce the required height (i.e., to make the POM 20 and manifold 46 shorter), the liquid connectors 42 can be positioned horizontally (i.e., side-by-side), which requires a wider spacing between the QSFP-DD ports. A larger pitch between the plugs (e.g., >24.7 mm) allows the liquid connectors 42 to be placed side-by-side and minimizes the required height. As shown, the male liquid connector 42a can be mounted to the POM cold plate 22a and POM 20 using a single common attachment point with overlapping flanges 50, i.e., by using a single common screw 52 to attach two male liquid connectors 42a in the middle. This allows the male liquid connectors 42a to be mounted on the same horizontal plane. If desired and if space permits, separate flanges 50 and screws 52 can also be used for individual connectors 42a.

[0035] refer to Figure 7 Female liquid connectors 42b are relatively large, especially when designed to accommodate large misalignment tolerances. Therefore, designing a compact QSFP-DD array while maintaining minimal inter-plug pitch is challenging. A typical female blind-mating connector 42b consists of two main components: an inner valve 54a and a housing 54b. The housing 54b confines the inner valve 54a, provides sufficient space for misalignment requirements, and pushes the O-ring 54c of the inner valve against the rear wall to seal the component and prevent leakage.

[0036] refer to Figure 8 To achieve a compact design and maximize port density (i.e., minimize the pitch between plugs), this disclosure combines the housings 54b of multiple connectors 42b into a structure 56 that embeds an inner valve 54a, which may be identical to or separate from the manifold 46 but fluidly connected to it. Thus, the female quick-disconnect array assembly is formed by structure 56, which incorporates and embeds the housings 54b. Similarly, the female quick-disconnect array can be a separate component and attached to (multiple) supply manifold / flow channel cavities 46 and (multiple) return manifold / flow channel cavities 46. It can also be machined to (multiple) supply manifold / flow channel cavities 46 and (multiple) return manifold / flow channel cavities 46. This approach eliminates the need for a bulky housing 54b for the female fluid connectors 42b, as these features are now combined and embedded in structure 56 or manifold 46, allowing for a more compact design. The diameter of the hole 56a in the female quick-closing array is the same as the inner diameter of the female connector housing 54b, and the diameter of the hole 56a is a function of the specified misalignment tolerance. The bottom of the hole 56b is the position where the O-ring 54c of the inner valve is pushed to seal the coolant flow. To hold the inner valve 54a inside the hole 56a and press the inner valve 54a against the rear wall, the front panel 58 is mounted on the body of the structure 56. Alternatively, a rear panel can be used to confine the inner valve 54a within the female quick-closing array. After assembling the inner valve and O-ring 54c, it is necessary to attach the components in the female quick-closing array (i.e., the body and the front / rear panels) to each other. The panel components can be attached in various ways, including brazing / soldering or using screws. If brazing / soldering is used, the O-ring material must be compatible with the associated processing temperature.

[0037] Because the female quick-disconnect array 56 and manifold 46 (individually or in combination) are bulky components, they can obstruct airflow above remaining air-cooled components, for example, on the host PCB / card 40 in a mixed liquid / air cooling system. To address this, unwanted areas (individually or in combination) in the female quick-disconnect array 56 and manifold 46 can be cut out or recessed to allow more airflow to pass through them. This... Figure 9 The diagram is shown. Here, in the bulk material of the female quick-closing array 56 and manifold 46 (individually or in combination) between the holes 56a, semi-circular or arcuate cutouts 60 are provided from front to back, but other shapes and orientations can be used equivalently. This provides an airflow passage through and around the female quick-closing array 56 and manifold 46 (individually or in combination).

[0038] Therefore, this disclosure provides a liquid-cooled compact POM using quick-disconnectors arranged to minimize the pitch between plugs and cooperating with a dual-flow (i.e., dual-channel cavity) manifold assembly mounted on the PCB of a card, circuit package, or module. By integrating liquid cooling into the POM, dry / slip interfaces are eliminated, as are the dry / slip thermal performance losses associated with riding heat sinks. Furthermore, the use of liquid cooling significantly improves cooling performance, where the cold plates used extend into the nose of the POM components, which are typically positioned on the outside of the associated panel after insertion. A new POM can be provided, and existing POMs can be upgraded to integrate liquid cooling and eliminate this dry / slip interface. The array of female quick-disconnectors associated with the dual-flow manifold assembly complements the minimized pitch between plugs in the POM. The two manifolds or channel cavities combined into a single manifold assembly reduce the size and cost of fluid distribution. This idea can be used in compact spaces to allow more space for other devices. Therefore, this disclosure allows for thermal management of high-power POMs (e.g., QSFP-DDs) that would otherwise be extremely challenging to cool, allows for increased port density of high-power plugs at the panel, and allows for future liquid cooling in space-constrained applications.

[0039] This disclosure provides an integration method for integrating liquid cooling into a small POM while maintaining minimal inter-plug pitch, and an integration method for integrating blind-fit liquid quick-disconnectors into the POM. This integration can be accomplished in two ways: by manufacturing a liquid-cooled plug (during plug manufacturing) by replacing the top of the plug housing with a cold plate equipped with a liquid quick-disconnector, and by upgrading an existing plug by attaching a cold plate featuring a liquid quick-disconnector to the top of the plug housing using a thermal interface material. Therefore, this disclosure enables the conversion of existing POMs into liquid-cooled POMs. An array of female quick-disconnectors at the dual-flow manifold assembly combines multiple female quick-disconnectors (thus minimizing the required spacing). The dual-flow (i.e., dual-channel cavity) manifold assembly is provided in combination with the array of female quick-disconnectors. This allows parallel flow to the panel-mounted liquid-cooled POM. The tapered dispensing channels also facilitate flow control along the length of the manifold assembly.

[0040] While this disclosure has been shown and described with reference to preferred embodiments and specific examples thereof, it will be apparent to those skilled in the art that other embodiments and examples can perform similar functions and / or achieve similar results. All such equivalent embodiments and examples are within the spirit and scope of this disclosure, and are thus conceived and intended to be covered by the following non-limiting claims for all purposes.

Claims

1. A pluggable optical module (20), comprising: Main body (24); Cold plate (22), which is connected to the body (24); as well as A pair of quick-disconnectors for the cooling fluid supply line and the quick-disconnector for the cooling fluid return line (28) are connected to the cold plate (22) and extend from the cold plate (22) and the body (24).

2. The pluggable optical module as described in claim 1, wherein, The cold plate extends to the nose of the body and is positioned adjacent to a component disposed in the nose of the body.

3. The pluggable optical module as described in claim 1, wherein, The cold plate is one of the following: Integrate into the main body, and One or more fixing mechanisms (24) are used to connect adjacently to the outer surface of the body, wherein a thermal interface material (32) is disposed between the cold plate and the outer surface of the body.

4. The pluggable optical module as described in claim 1, wherein, The main body and the cold plate are adapted to be inserted into a host card, circuit package, or module (40) as an integrated unit, wherein the pair of cooling fluid supply line quick disconnectors and cooling fluid return line quick disconnectors are adapted to fluidly engage with a corresponding pair of cooling fluid supply line quick disconnectors and cooling fluid return line quick disconnectors connected to a fluid supply manifold or flow channel cavity (46) and a fluid return manifold or flow channel cavity (46) disposed in the host card, the circuit package, or the module.

5. The pluggable optical module as described in claim 4, wherein, The pair of quick-disconnectors for the cooling fluid supply line and the quick-disconnector for the cooling fluid return line connected to the cold plate is one of the following: Positive quick disconnector, and Negative fast disconnector.

6. The pluggable optical module as described in claim 1, wherein, The pair of quick-disconnectors for the cooling fluid supply line and the quick-disconnector for the cooling fluid return line are diagonally disposed on the insertion end of the pluggable optical module, wherein each of the pair of quick-disconnectors for the cooling fluid supply line and the quick-disconnector for the cooling fluid return line is vertically offset relative to the lateral axis of the cold plate and / or the body.

7. The pluggable optical module as described in claim 1, wherein, When the pluggable optical module is inserted into the panel (48) of the host card, circuit package, or module, the vertical offset minimizes the pitch between the plugs on the panel of the host card, circuit package, or module.

8. The pluggable optical module as claimed in claim 1, wherein, The pair of quick-disconnectors for the cooling fluid supply line and the quick-disconnector for the cooling fluid return line are horizontally disposed on the insertion end of the pluggable optical module, wherein each of the pair of quick-disconnectors for the cooling fluid supply line and the quick-disconnector for the cooling fluid return line is adjacent to each other side by side along the transverse axis of the cold plate and / or the body.

9. The pluggable optical module as claimed in claim 1, wherein, One of the following conditions must be met: Each of the pair of quick-connectors for the cooling fluid supply line and the quick-connector for the cooling fluid return line is a separate component connected to the cold plate and the body using one or more fixing mechanisms (30), and The pair of quick disconnectors for the cooling fluid supply line and the quick disconnector for the cooling fluid return line are connected together as a single component using one or more fixing mechanisms (52) to the cold plate and the body.

10. A negative fast disconnector array assembly (56), comprising: The structure defines multiple embedded female fast disconnector housings (54b); as well as Multiple internal valves (54a) of the negative quick disconnector are disposed within the multiple embedded negative quick disconnector housings (54b); The plurality of embedded negative quick disconnector housings (54b) and the plurality of negative quick disconnector inner valves (54a) form a plurality of negative quick disconnectors (42b), which are adapted to receive a corresponding plurality of positive quick disconnectors (42a), which are associated with one or more pluggable optical modules (20).

11. The negative fast disconnector array assembly of claim 10, wherein, The dimensions of each of the embedded negative quick-release valve housings are designed to accommodate misalignment of the quick-release valve by providing a degree of tolerance for receiving the associated inner valve within the housing.

12. The negative fast disconnector array assembly of claim 10, wherein, Each of the embedded female quick-closing device housings receives a sealing O-ring (56c) of the associated inner valve, the sealing O-ring (56c) abutting against the rear wall (56b) of the embedded female quick-closing device housing to prevent leakage.

13. The female quick disconnector array assembly of claim 10, wherein the female quick disconnector array assembly further comprises a wall (58) connected to the structure to secure the plurality of female quick disconnector inner valves within the plurality of embedded female quick disconnector housings.

14. The negative fast disconnector array assembly of claim 10, wherein one of the following conditions is met: The structure is fluidly connected to the cooling fluid supply line and the cooling fluid return line via one or more flow channel cavities or manifolds (46), and The structure is a manifold including a flow channel cavity (46) connected to a cooling fluid supply line and a cooling fluid return line.

15. The negative fast disconnector array assembly of claim 10, wherein, The fluid supply-return pair of the negative quick disconnector is set to one of the following conditions: Diagonally arranged on the surface of the structure, wherein each of the pair of female quick-release switches is vertically offset relative to the transverse axis of the structure, and The devices are arranged horizontally on the surface of the structure, wherein each of the pair of female quick disconnectors is adjacent to the other side by side along the transverse axis of the structure.

16. The negative fast disconnector array assembly of claim 10, wherein, The structure defines one or more recesses or cutouts (60) from front to back in the top and / or bottom surfaces of the structure, thereby providing one or more airflow channels through and around the structure.

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