Embedded wafer level ball grid array package
By introducing a specific arrangement of dielectrics and microstrip lines in the eWLB package, the problem of insufficient frequency bandwidth is solved, thereby enhancing the frequency bandwidth and improving the signal conversion efficiency of high-frequency communication.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Filing Date
- 2023-11-27
- Publication Date
- 2026-06-26
AI Technical Summary
In the prior art, embedded wafer-level ball grid array (eWLB) packages have insufficient frequency bandwidth when providing radio frequency signals, making it difficult to meet the requirements of high-frequency communication.
By introducing a specific arrangement of dielectric and microstrip line in the eWLB package, the dielectric is made to have a size equal to one-quarter of the design wavelength of the microstrip line in the direction perpendicular to the microstrip line and is aligned with the end of the microstrip line, thereby realizing the conversion of signal from microstrip line to waveguide and enhancing frequency bandwidth.
The eWLB package improves the relative operating frequency bandwidth, making it suitable for high-frequency communication, reducing signal leakage and loss, and enhancing coupling efficiency with printed circuit boards.
Smart Images
Figure CN122296089A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to an embedded wafer-level ball grid array package (eWLB package) and a system comprising such an eWLB package and a printed circuit board (PCB) having waveguides with channel-like openings. Background Technology
[0002] Embedded wafer level ball grid array package (eWLB package) is designed to improve the interconnection between the package and the printed circuit board (PCB). Summary of the Invention
[0003] The eWLB package can be used to package integrated circuits specifically configured for communications. Optionally, the integrated circuit may need to be configured to provide signals, such as radio frequency (RF) signals, to an external waveguide.
[0004] In summary, the purpose of this disclosure is to provide an eWLB package for packaging an integrated circuit and enabling the integrated circuit to provide signals to the outside of the package. One object of this disclosure is to provide an eWLB package that enables an integrated circuit to provide signals to an external waveguide.
[0005] The above and other objectives are achieved by means of the solutions described in the independent claims of this disclosure. Advantageous implementations are further specified in the dependent claims.
[0006] A first aspect of this disclosure provides an embedded wafer level ball grid array package (eWLB package). The eWLB package includes: a molded body encapsulating an integrated circuit, a dielectric disposed within the molded body, and a microstrip line electrically connected to the integrated circuit. In a direction toward the connection side of the eWLB package, including a connection element, the end of the microstrip line is disposed below the dielectric. The dielectric has a dimension in a direction perpendicular to the microstrip line equal to one-quarter of the designed wavelength of the microstrip line. The eWLB package is used to connect to a printed circuit board (PCB) via the connection element, the PCB having a waveguide with a channel-like opening such that the ends of the dielectric and the microstrip line are aligned with the waveguide.
[0007] In other words, the first aspect proposes an eWLB package that encapsulates an integrated circuit (IC) within a molded body of the eWLB package. The eWLB package further includes a dielectric disposed within the molded body and a microstrip line electrically connected to the IC. The ends of the microstrip line are disposed below the dielectric. The microstrip line and dielectric allow the IC to provide signals to and / or receive signals from the outside of the eWLB package. Such signals can be, for example, radio frequency (RF) signals. Specifically, due to the arrangement of the microstrip line and dielectric within the eWLB package and their relative positions, the IC can provide signals via the microstrip line and dielectric in the direction of the connection side of the eWLB. When the eWLB is mounted on a PCB, this allows signals to be provided from the IC to a waveguide with a channel-like opening in the PCB.
[0008] The dielectric material, with a dimension equal to one-quarter of the microstrip line's design wavelength in the direction perpendicular to the microstrip line, increases the relative operating frequency bandwidth of the eWLB package, particularly suitable for integrated circuits to provide and / or acquire RF signals. This allows integrated circuits to be used to provide a wide relative operating frequency bandwidth for communication. For example, the relative operating frequency bandwidth could be 40%. The relative operating frequency bandwidth is the frequency band that can be designed for the eWLB package. In contrast, if the ends of the microstrip lines are used as patch radiators instead of the dielectric material and microstrip lines used and arranged according to the first aspect of this disclosure, the relative operating frequency bandwidth will be narrowed to approximately 20%. Compared to the first aspect, if pre-laminated inserts (which are placed like chips during the reconfiguration process of the eWLB process flow) are arranged in the eWLB package to provide signals to the opposite side of the connection side of the eWLB package, instead of the dielectric material used and arranged according to the first aspect, the relative operating bandwidth will be narrowed to approximately 20%.
[0009] The arrangement of dielectrics and microstrip lines in the eWLB package allows signals from the integrated circuit (e.g., RF signals) to propagate towards the connection side of the eWLB package via the microstrip lines and dielectrics. Furthermore, when the eWLB is positioned on a PCB with the dielectrics aligned with the ends of the microstrip lines and the waveguide, the signal propagates to the waveguide of the PCB. This improves the system architecture, which includes the eWLB package and the PCB with waveguides. That is, if a signal from the integrated circuit leaves the eWLB package from a side different from the connection side, the signal must be guided to the waveguide of the PCB by additional components.
[0010] The molded body can be a plastic molded body. The integrated circuit can be a monolithic microwave integrated circuit (MMIC). An integrated circuit is essentially a die in an eWLB package. Integrated circuits can be used to generate signals (e.g., RF signals) and provide them to microstrip lines. Integrated circuits can be used for communication by providing or acquiring signals (e.g., RF signals) to or from microstrip lines. Integrated circuits can be used to provide signals in the form of electromagnetic waves to microstrip lines. For example, integrated circuits can be used to provide RF signals in the form of radio waves to microstrip lines. Integrated circuits can be used to acquire signals (e.g., RF signals) in the form of electromagnetic waves (e.g., radio waves) from microstrip lines. For example, microstrip lines can be configured such that signals propagate from the integrated circuit via the microstrip line in the form of a transverse electromagnetic mode (TEM).
[0011] The dielectric is three-dimensional. A “dielectric” may be referred to as a “dielectric insert” or a “dielectric block.” The dielectric is a waveguide structure. The dielectric can be a preform (e.g., a preformed dielectric insert or a preformed dielectric block). During the reconfiguration of the eWLB process flow for producing eWLB packages, the preformed dielectric can be placed like a chip. Alternatively, the dielectric can be formed by molding a glass wafer, wherein the dielectric can be formed directly within the glass having one or more cavities for one or more dies (i.e., one or more chips).
[0012] The ends of the microstrip line can be arranged relative to the dielectric to allow the transverse electromagnetic mode (TEM) of the microstrip line to be converted to the transverse electric mode (TE) of the dielectric of the waveguide. In other words, the microstrip line and the dielectric can achieve waveguide conversion from the transverse electromagnetic mode (TEM) of the microstrip line to the transverse electric mode (TE) of the dielectric of the waveguide structure. The transverse electric mode (TE) of the dielectric can correspond to the transverse electric mode (TE) of the external waveguide of the PCB. Therefore, the arrangement of the microstrip line and the dielectric allows for the conversion from the transverse electromagnetic mode (TEM) of the microstrip line to the transverse electric mode (TE) of the external waveguide (e.g., the waveguide of the PCB). The microstrip line can be a low-impedance conductive layer. The external waveguide interface can be high-impedance. The waveguide of the PCB can be a rectangular waveguide.
[0013] The arrangement of the microstrip line and dielectric in the eWLB package corresponds to inserting one end of the microstrip line into a short-circuited vertical waveguide represented by the dielectric, where the dimension of the dielectric perpendicular to the microstrip line is equal to one-quarter of the designed wavelength of the microstrip line. The dielectric can be a back short waveguide. A back short waveguide is a waveguide with one end shorted. This allows the current at the end of the microstrip line to couple to the magnetic field (e.g., TE) of the transverse electric mode of the waveguide (and the external waveguide). 10 (Magnetic field of the master model).
[0014] Impedance transformation can be achieved by controlling the length and width of the end of the microstrip line arranged below the dielectric, the size of the dielectric perpendicular to the microstrip line being equal to a quarter wavelength, and the size of the opening between the dielectric and the external waveguide.
[0015] The end of a microstrip line can be referred to as a "microstrip line probe" or simply a "probe." The microstrip line can be called a "redistribution layer (RLD)." The microstrip line can be a metal pattern formed on a substrate. The microstrip line can be a coplanar waveguide (CPW) line. The microstrip line can be at least partially arranged (e.g., patterned) on the surface of a molded body. The microstrip line can be arranged between the molded body and the connection side of the eWLB package. The microstrip line can include one or more radio frequency (RF) lines and / or one or more direct current (DC) lines.
[0016] Because the dielectric material's dimension perpendicular to the microstrip line is one-quarter of the wavelength, it is used to provide a back-short waveguide function. In other words, the dielectric acts as a back-short waveguide. This allows the dielectric to function as a transformer (e.g., an impedance transformer), converting the transverse electromagnetic mode (TEM) of the microstrip line to the transverse electrical mode (TE) of the waveguide on the PCB. To achieve waveguide switching, for example, when an eWLB package is placed on a PCB, converting a signal propagating via the microstrip line (e.g., an RF signal) to a signal propagating through the waveguide on the PCB, a single microstrip line is sufficient because the dielectric itself provides the back-short waveguide function to enable waveguide switching. This allows for low-loss switching and wider RF bandwidth performance, especially by selecting a suitable low-loss dielectric made of a material with a suitable low dielectric constant (Dk).
[0017] The ends of dielectric materials and microstrip lines can form waveguide transitions to external waveguide ports (i.e., external waveguides), such as input-output waveguide transitions. External waveguides can be, for example, waveguides on a PCB.
[0018] Connecting elements can be used to solder to the PCB so that the eWLB package can be connected to the PCB via the connecting elements.
[0019] In the implementation of the first aspect, multiple connecting elements are electrically connected to the ground terminal of the eWLB package. The multiple connecting elements are adapted and arranged on the connecting side of the eWLB package so that when the eWLB package is connected to the PCB via the connecting elements and the ends of the dielectric and microstrip line are aligned with the waveguide, the multiple connecting elements provide conductive connections between the ground terminal of the eWLB package, the ground terminal of the dielectric, and the waveguide of the PCB, respectively.
[0020] In other words, when the eWLB package is connected to the PCB via connecting elements, and the ends of the dielectric and microstrip lines are aligned with the waveguide, multiple connecting elements can be arranged along the edge of the waveguide on the PCB. In other words, multiple connecting elements can be used to form an equivalent waveguide sidewall. The term "electric connection" can be used as a synonym for the term "galvanic connection." An electrical connection between two components refers to establishing a direct conductive connection between the two components, optionally using conductive intermediate components, such as the aforementioned multiple connecting elements (e.g., solder balls or solder leads).
[0021] Multiple connectors within the eWLB package provide conductive connections between the eWLB package's ground terminal, the dielectric's ground terminal, and the PCB's waveguide. This is achieved based on the connectivity of the ball grid array (BGA).
[0022] Multiple connecting elements can be used to connect the waveguide transition of the eWLB package (provided by the microstrip line ends and dielectric) to external waveguide ports, such as waveguide ports of a PCB waveguide. These multiple connecting elements minimize signal leakage and loss that may occur during the transition between the eWLB package and the PCB waveguide. The multiple connecting elements also provide conductive connections between the ground terminal of the eWLB package, the ground terminal of the dielectric, and the waveguide of the PCB, improving the coupling efficiency between the microstrip line of the eWLB package and the waveguide of the PCB (especially the waveguide ports of the PCB waveguide).
[0023] Optionally, when the frequency of the electromagnetic waves propagating through the microstrip line in the eWLB package is higher than 100 GHz (e.g., the D band, i.e., frequencies between 110 GHz and 175 GHz, or frequencies between 130 GHz and 175 GHz), the spacing between multiple connecting elements can be less than 300 μm. m, optionally in 200 m to 300 Between m. This minimizes signal leakage. The term "distance" can be used as a synonym for the term "pitch".
[0024] In one implementation of the first aspect, a plurality of connecting elements are used for connection to an intermediate PCB carrier. The PCB carrier can be adapted and arranged such that, when the eWLB package is connected to the PCB via the PCB carrier, and the ends of the dielectric and the microstrip line are respectively aligned with the waveguide, the PCB carrier provides a conductive connection between the ground terminal of the eWLB package and the waveguide of the PCB. The connecting elements can be used for soldering to the PCB carrier. The PCB carrier can be used for soldering to the PCB so that the eWLB package is connected to the PCB via the PCB carrier.
[0025] In one implementation of the first aspect, one or more of the plurality of connecting elements are electrically connected to a grounded metal housing of the dielectric, and the grounded metal housing includes a channel opening on the surface of the grounded metal housing facing the microstrip line.
[0026] The metal casing of the dielectric can be connected to the ground terminal of the eWLB package. The metal casing serves as the ground terminal for the dielectric. The channel opening can be referred to as an "opening slot".
[0027] In one implementation of the first aspect, the grounded metal housing includes one or more micro-metal vias and / or one or more cavities with metal walls.
[0028] That is, the metal casing can be formed using one or more micro-metal vias and / or one or more cavities with metal walls. The one or more micro-metal vias and / or the one or more cavities with metal walls can realize the sidewalls of the dielectric. The surface of the metal casing facing the side opposite the connection side of the eWLB package can be referred to as the "top metal surface." The surface of the metal casing facing the connection side of the eWLB package can be referred to as the "bottom metal surface." The top and bottom metal surfaces can be metal layers of the dielectric material of the dielectric (e.g., a PCB substrate, glass substrate, or liquid crystal polymer substrate). Electrical connections of one or more connection elements to the grounded metal casing can constitute equivalent waveguide sidewalls for guiding signals in the form of electromagnetic waves (e.g., RF signals in the form of radio waves) from the microstrip line to the waveguide of the PCB.
[0029] The dielectric, such as a grounded metal housing, may optionally include one or more reference points for aligning the dielectric to the correct position within the eWLB package, such as relative to a microstrip line.
[0030] In one implementation of the first aspect, one or more of the plurality of connecting elements are electrically connected to the ground terminal of the microstrip line.
[0031] A microstrip line may include a ground plane. One or more of the multiple connection elements may be electrically connected to the ground plane of the microstrip line.
[0032] In one implementation of the first aspect, the dielectric can be cuboid in shape. That is, the dielectric can be a rectangular waveguide structure.
[0033] In one implementation of the first aspect, the dielectric is made of at least one of the following materials: one or more PCB laminates, glass, and one or more liquid crystal polymers.
[0034] The dielectric is made of at least one of the following materials: one or more PCB laminates, a glass substrate, and one or more liquid crystal polymer substrates. Using glass (e.g., a glass substrate) and / or one or more liquid crystal polymer materials (e.g., one or more liquid crystal polymer substrates) provides better manufacturing tolerances than using one or more PCB laminates (e.g., one or more PCB laminates). In particular, using glass (e.g., a glass substrate) and / or one or more liquid crystal polymer materials (e.g., one or more liquid crystal polymer substrates) provides better reliability and process yield. This is especially true for the high frequencies available for integrated circuits, e.g., for communications via microstrip lines, frequencies greater than 100 GHz. Optionally, the dielectric can be made of one or more PCB laminates, meaning the dielectric can be based on PCB technology. The aforementioned materials have low dielectric constants (Dk), thus enabling low-loss dielectrics. PCB laminates are low-cost. Glass is moderately costly.
[0035] In one implementation of the first aspect, the wavelength is an intermediate wavelength that includes a frequency range greater than 100 GHz.
[0036] The wavelengths described above are used to describe dielectrics with dimensions perpendicular to the microstrip line that are one-quarter of the wavelength. That is, these wavelengths are the design wavelengths of the microstrip line. The dimensions of the dielectric disposed in the molded body can be proportional to the aforementioned wavelengths. Therefore, the dielectric can be easily incorporated into the package. For example, the frequency range can be the D-band of frequencies between 110 GHz and 175 GHz. Optionally, the frequency range includes frequencies between 130 GHz and 175 GHz. This frequency range can be used by integrated circuits in eWLB packages, for example, for communication via microstrip lines. Therefore, this frequency range can be referred to as the "usage frequency range". eWLB packages can be used for high-frequency packages with frequencies greater than 100 GHz (f > 100 GHz). eWLB packages can be used in millimeter-wave and / or Asia-Pacific Hertz applications.
[0037] In one implementation of the first aspect, the eWLB package includes a passivation layer disposed between the dielectric and the microstrip line. Alternatively, the eWLB package may include a passivation layer disposed between the microstrip line and a connection element.
[0038] In one implementation of the first aspect, the connecting element is a solder ball or solder lead.
[0039] In other words, the connecting element can be a solder bump, which can be spherical (i.e., solder ball) or lead-shaped (i.e., solder lead). The solder lead can be square or rectangular. The solder lead can be printed solder lead.
[0040] Optionally, when the frequency of the electromagnetic waves propagating through the microstrip line of the eWLB package is higher than 100 GHz (e.g., the D band, i.e., frequencies between 110 GHz and 175 GHz, or frequencies between 130 GHz and 175 GHz), the diameter of the solder bumps can be 100 mm. m to 150 Between m.
[0041] In one implementation of the first aspect, the solder leads are cubic or cuboid in shape.
[0042] The eWLB package according to the first aspect can be used to design high-frequency chipsets for operation in at least one of the following frequency bands: E band (71 to 76 GHz and / or 81 to 86 GHz), W band (92 to 115 GHz), D band (110 to 175 GHz) and G band (220 to 325 GHz).
[0043] For example, the eWLB package can be used for single-channel or multi-channel chips. The eWLB package can be used for a single waveguide or multiple waveguides. In the case of multiple waveguides (i.e., multiple waveguide ports), the eWLB package can provide a corresponding dielectric and a corresponding microstrip line for each waveguide port, with the end of the corresponding microstrip line positioned below the corresponding dielectric.
[0044] For example, the eWLB package of the first aspect can be used in phased array front-end implementations (e.g., at high frequencies) to enable beam steering functionality with an antenna (e.g., a planar antenna). The phased array front-end implementation can be a phased array device, such as a phased array front-end device.
[0045] To implement the eWLB encapsulation of the first aspect of this disclosure, some or all of the above-described implementations and optional features of the first aspect can be combined with each other.
[0046] A second aspect of this disclosure provides a system. As previously described, the system includes an eWLB package according to a first aspect of this disclosure. The system includes a printed circuit board (PCB) having a waveguide with a channel-like opening. The eWLB package is connected to the PCB via the connection element of the eWLB package such that the dielectric and the ends of the microstrip line are aligned with the waveguide of the PCB.
[0047] The above description of the eWLB package according to the first aspect of this disclosure applies accordingly to the system according to the second aspect of this disclosure.
[0048] The system, its implementation, and optional features provided in the second aspect achieve the same advantages as the device, its corresponding implementation, and optional features provided in the first aspect.
[0049] A third aspect of this disclosure provides an embedded wafer level ball grid array package (eWLB package). The eWLB package includes a molded body encapsulating an integrated circuit and a microstrip line electrically connected to the integrated circuit. The eWLB package is configured to be connected to a printed circuit board (PCB) via connection elements on a connection side of the eWLB package. The PCB has a waveguide with a channel-like opening such that a portion of the microstrip line is aligned with the waveguide. A plurality of connection elements are electrically connected to a ground terminal of the eWLB package. The plurality of connection elements are adapted and arranged on the connection side of the eWLB package to provide a conductive connection between the ground terminal of the eWLB package and the waveguide of the PCB when the eWLB package is connected to the PCB via the connection elements and the portion of the microstrip line is aligned with the waveguide.
[0050] That is, when the eWLB is connected to the PCB via connecting elements, and a portion of the microstrip line is aligned with the waveguide, multiple connecting elements are arranged along the edge of the waveguide on the PCB. In other words, multiple connecting elements can be used to form the equivalent waveguide sidewall.
[0051] Multiple connectors within the eWLB package can be used to provide a conductive connection between the eWLB package's ground terminal and the waveguide on the PCB. This is achieved based on the connectivity of the ball grid array (BGA).
[0052] The multiple connectors in the eWLB package minimize signal leakage and loss that may occur during transitions between the eWLB package and the PCB waveguide. These connectors also provide a conductive connection between the eWLB package's ground terminal and the PCB waveguide, improving coupling efficiency between the eWLB package's microstrip line and the PCB waveguide (especially the waveguide ports of the PCB waveguide).
[0053] Optionally, when the frequency of the electromagnetic waves propagating through the microstrip line in the eWLB package is higher than 100 GHz (e.g., D band, i.e., frequencies between 110 GHz and 175 GHz), the spacing between multiple connecting elements can be less than 300 μm. m, optionally in 200 m to 300 Between m. This minimizes signal leakage.
[0054] According to the third aspect, the eWLB package can be used to design high-frequency chipsets for operation in at least one of the following frequency bands: E band (71 to 76 GHz and / or 81 to 86 GHz), W band (92 to 115 GHz), D band (110 to 175 GHz), and G band (220 to 325 GHz).
[0055] For example, the eWLB package can be used for single-channel or multi-channel chips. The eWLB package can be used for a single waveguide or multiple waveguides. In the case of multiple waveguides (i.e., multiple waveguide ports), the eWLB package can provide a corresponding microstrip line for each waveguide port, with the end of the corresponding microstrip line positioned below the corresponding dielectric.
[0056] For example, the eWLB package of the third aspect can be used in phased array front-end implementations (e.g., at high frequencies) to enable beam steering functionality with an antenna (e.g., a planar antenna). The phased array front-end implementation can be a phased array device, such as a phased array front-end device.
[0057] The above description of the eWLB package according to the first aspect of this disclosure applies accordingly to the eWLB package according to the third aspect of this disclosure.
[0058] The eWLB encapsulation, its implementation, and optional features provided in the third aspect achieve the same advantages as the eWLB encapsulation, its corresponding implementation, and optional features provided in the first aspect.
[0059] To implement the eWLB encapsulation according to the third aspect of this disclosure, some or all of the implementations and optional features of the third aspect described above can be combined with each other.
[0060] A fourth aspect of this disclosure provides a system. As previously described, the system includes an eWLB package according to a third aspect of this disclosure. The system includes a printed circuit board (PCB) having a waveguide with a channel-like opening. The eWLB package is connected to the PCB via connection elements of the eWLB package such that a portion of the microstrip line of the eWLB package is aligned with the waveguide of the PCB. The plurality of connection elements of the eWLB package provide a conductive connection between the ground terminal of the eWLB package and the waveguide of the PCB.
[0061] The eWLB package described above according to the first aspect of this disclosure and the eWLB package according to the third aspect of this disclosure are accordingly applicable to the system according to the fourth aspect of this disclosure.
[0062] The system, its implementation, and optional features provided in the fourth aspect achieve the same advantages as the eWLB encapsulation, its corresponding implementation, and optional features provided in the first aspect.
[0063] All steps performed by the various entities described in this application, and the functions described as being performed by the various entities, are intended to indicate that the respective entities are suitable for or used to perform the respective steps and functions. Although in the following description of specific embodiments, the specific functions or steps performed by external entities are not reflected in the detailed description of the specific elements of the entities performing the specific steps or functions, it will be apparent to those skilled in the art that these methods and functions can be implemented in the corresponding software or hardware elements or any combination thereof. Attached Figure Description
[0064] The above aspects and implementations will be explained below in conjunction with the accompanying drawings, in which:
[0065] Figure 1 Examples of an embedded wafer-level ball grid array package (eWLB package) and an example of a system according to embodiments of the present disclosure are shown.
[0066] Figure 2 Examples of an embedded wafer-level ball grid array package (eWLB package) and an example of a system according to embodiments of the present disclosure are shown.
[0067] Figure 3 It shows Figure 1 Example of dielectric and microstrip line arrangement in eWLB package.
[0068] Figure 4(a) shows Figure 1 A bottom view of an example of how the dielectric of an eWLB package is implemented.
[0069] Figure 4(b) shows Figure 1 A bottom view of an example of how the dielectric of an eWLB package is implemented.
[0070] Figure 5(a) shows Figure 1 A top view of an example implementation of the eWLB wrapper.
[0071] Figure 5(b) shows Figure 1 A top view of an example implementation of the eWLB wrapper.
[0072] Figure 6 It shows Figure 1 An example of how the eWLB wrapper is implemented.
[0073] Figure 7 It shows Figure 1 An example of how the eWLB wrapper is implemented.
[0074] The same components shown in the accompanying drawings are labeled with the same reference numerals and can be implemented in the same manner. The scale and dimensions of the components shown in the figures do not represent the eWLB package or system to scale, but are chosen solely for the purpose of describing the structure and function of the eWLB package or system. Detailed Implementation
[0075] Figure 1 Examples of an embedded wafer-level ball grid array package (eWLB package) and an example of a system according to embodiments of the present disclosure are shown. Figure 1 The eWLB package 1 is an example of an eWLB package according to the first aspect of this disclosure. Therefore, the description of the eWLB package according to the first aspect of this disclosure is accordingly applicable to... Figure 1 eWLB package 1. Figure 1 System 200 is an example of a system according to the second aspect of this disclosure. Therefore, the description of the system according to the second aspect of this disclosure is accordingly applicable to... Figure 1 System 200.
[0076] Figure 1The eWLB package 1 includes: a molded body 2 encapsulating an integrated circuit 3, a dielectric 4 disposed within the molded body 2, and a microstrip line 5 electrically connected to the integrated circuit 3. In the direction toward the connection side 8 of the eWLB package 1, the end 5a of the microstrip line 5 is disposed below the dielectric 4. The connection side 8 includes a connection element 7. Figure 1 Connector 7 is a solder ball. This is merely an example; connector 7 can be implemented in different ways. For instance, connector 7 could be a solder lead.
[0077] The dimension of dielectric 4 in the direction perpendicular to microstrip line 5 is equal to one-quarter of the designed wavelength of microstrip line 5. / 4). This example is in Figure 3 As shown in the image. Figure 1 As shown, the eWLB package 1 is used to connect to a printed circuit board (PCB) 100 via a connecting element 7. The PCB 100 has a waveguide 101 with a channel-shaped opening, such that the ends 5a of the dielectric 4 and the microstrip line 5 are aligned with the waveguide 101. That is, as... Figure 1 As shown, PCB100 includes a waveguide 101 with a channel-shaped opening. eWLB package 1 can be disposed on PCB100 for electrical connection to PCB100 via connecting element 7, such that the ends 5a of dielectric 4 and microstrip line 5 are aligned with waveguide 101. PCB100 may also be referred to as a "motherboard".
[0078] like Figure 1 As shown, the eWLB package 1 optionally includes a passivation layer 9 disposed between the dielectric 4 and the microstrip line 5. Alternatively, the eWLB package 1 optionally includes a passivation layer 10 disposed between the microstrip line 5 and the connecting element 7.
[0079] like Figure 1 As shown, multiple connecting elements 7a in connecting element 7 are electrically connected to the ground terminal of eWLB package 1. These multiple connecting elements 7a are adapted to and arranged on the connecting side 8 of eWLB package 1 so that when eWLB package 1 is connected to PCB 100 via connecting element 7, and the ends 5a of dielectric 4 and microstrip line 5 are aligned with waveguide 101, the multiple connecting elements 7a provide conductive connections between the ground terminal of eWLB package 1, the ground terminal of dielectric 4, and the waveguide 101 of PCB 100, respectively. That is, as... Figure 1 As shown, when the eWLB package 1 is connected to the PCB 100 via the connecting element 7, and the ends 5a of the dielectric 4 and the microstrip line 5 are aligned with the waveguide 101, multiple connecting elements 7a can be arranged along the edge of the waveguide 101 of the PCB 100. In other words, multiple connecting elements 7a can be used to form an equivalent waveguide sidewall.
[0080] like Figure 1As shown, the dielectric 4 may include a grounded metal housing 4a encapsulating the dielectric 4. The grounded metal housing 4a includes a channel opening disposed on the surface of the grounded metal housing 4a facing the microstrip line 5. One or more connecting elements 7a of the connecting elements 7 may be electrically connected to the grounded metal housing 4a of the dielectric 4. Figure 1 As shown, the electrical connection 11 between one or more connecting elements 7a and the grounded metal housing 4a can form an equivalent waveguide sidewall for guiding signals in the form of electromagnetic waves (e.g., RF signals in the form of radio waves) from the microstrip line 5 to the waveguide 101 of the PCB 100.
[0081] like Figure 1 As shown, the eWLB package 1 and PCB 100 can form system 200. System 200 includes eWLB package 1 and PCB 100. The eWLB package 1 of system 200 is connected to PCB 100 of system 200 via connecting element 7 of eWLB package 1, such that the dielectric 4 and the end 5a of microstrip line 5 are aligned with waveguide 101 of PCB 100.
[0082] about Figure 1 Further details of the eWLB package 1 and system 200 can be found in the eWLB package of the first aspect of this disclosure, the system of the second aspect, and... Figure 3 Figure 4(a), Figure 4(b), Figure 5(a), Figure 5(b) Figure 6 and Figure 7 The description.
[0083] Figure 2 Examples of an embedded wafer-level ball grid array package (eWLB package) and an example of a system according to embodiments of the present disclosure are shown. Figure 2 The eWLB package 1a is an example of an eWLB package according to the third aspect of this disclosure. Therefore, the description of the eWLB package according to the third aspect of this disclosure is accordingly applicable to... Figure 2 The eWLB package 1a. Figure 2 System 200a is an example of a system according to the fourth aspect of this disclosure. Therefore, the description of the system according to the fourth aspect of this disclosure is accordingly applicable to... Figure 2 System 200a.
[0084] Figure 2The eWLB package 1a includes a molded body 2 encapsulating an integrated circuit 3 and a microstrip line 5 electrically connected to the integrated circuit 3. The eWLB package 1a is used to connect to a printed circuit board (PCB) via a connection element 7 on a connection side 8 of the eWLB package 1a. The PCB 100 has a waveguide 101 with a channel-like opening, such that a portion 5a of the microstrip line 5 is aligned with the waveguide 101. That is, as... Figure 2 As shown, the PCB 100 includes a waveguide 101 with a channel-shaped opening. An eWLB package 1 can be disposed on the PCB 100 for electrical connection to the PCB 100 via a connecting element 7, such that a portion 5a of the microstrip line 5 is aligned with the waveguide 101. Figure 2 Connector 7 is a solder ball. This is merely an example; connector 7 can be implemented in different ways. For instance, connector 7 could be a solder lead.
[0085] like Figure 2 As shown, multiple connecting elements 7a are electrically connected to the ground terminal of the eWLB package 1a. The multiple connecting elements 7a are adapted and arranged on the connecting side 8 of the eWLB package 1a to provide a conductive connection between the ground terminal of the eWLB package 1a and the waveguide 101 of the PCB 100 when the eWLB package 1a is connected to the PCB 100 via the connecting elements 7a and a portion 5a of the microstrip line 5 is aligned with the waveguide 101.
[0086] That is, such as Figure 2 As shown, when the eWLB package 1a is connected to the PCB 100 via connecting elements 7, and a portion 5a of the microstrip line 5 is aligned with the waveguide 101, multiple connecting elements 7a can be arranged along the edge of the waveguide 101 of the PCB 100. In other words, multiple connecting elements 7a can be used to form an equivalent waveguide sidewall. Figure 2 As shown, the electrical connection 11 between the multiple connecting elements 7a and the ground terminal of the eWLB package 1a can form an equivalent waveguide sidewall for guiding the electromagnetic wave signal (e.g., the radio wave RF signal) of the microstrip line 5 to the waveguide 101 of the PCB 100.
[0087] like Figure 2 As shown, the eWLB package 1a optionally includes a passivation layer 9 disposed between the molded body 2 and the microstrip line 5. Alternatively, the eWLB package 1 optionally includes a passivation layer 10 disposed between the microstrip line 5 and the connecting element 7.
[0088] like Figure 2As shown, the eWLB package 1a and PCB 100 can form system 200a. System 200a includes eWLB package 1a and PCB 100. The eWLB package 1a of system 200a is connected to the PCB 100 of system 200a via connecting elements 7 of the eWLB package 1a, such that a portion 5a of the microstrip line 5 of the eWLB package 1a is aligned with the waveguide 101 of the PCB 100. Multiple connecting elements 7a of the eWLB package 1a provide a conductive connection between the ground terminal of the eWLB package 1a and the waveguide 101 of the PCB 100.
[0089] Based on the above, Figure 2 The eWLB package 1a is different Figure 1 eWLB package 1. Figure 2 The eWLB package 1a does not need to include Figure 1 The dielectric 4 of the eWLB package 1. Therefore, Figure 1 The description of eWLB package 1 in the document can be applied accordingly. Figure 2 The eWLB package 1a. For example, in order to provide an RF signal in the form of radio waves from integrated circuit 3 to waveguide 101 via microstrip line 5, Figure 2 A portion 5a of the microstrip line 5 in the eWLB package 1a may optionally be a patch radiator for radiating radio waves in the direction of the waveguide 101. This is merely an example; therefore, the eWLB package 1a may be implemented in various ways to provide signals (e.g., RF signals) from the microstrip line 5 to the waveguide 101 in the form of electromagnetic waves (e.g., radio waves).
[0090] Figure 2 Further details of the eWLB package 1a and system 200a can be found in the description of the eWLB package in the third aspect, the system description in the fourth aspect, and Figures 5(a) and 5(b). Figure 6 and Figure 7 The description.
[0091] Figure 3 It shows Figure 1 An example of the dielectric and microstrip line arrangement in an eWLB package is provided. The following section primarily describes the arrangement of the dielectric and microstrip lines. Further details can be found in [reference needed]. Figure 1 Description of eWLB package 1.
[0092] like Figure 3 As shown, the end 5a of the microstrip line 5 is positioned below the dielectric 4. The dimension of the dielectric 4 in the direction perpendicular to the microstrip line 5 is equal to one-quarter of the designed wavelength of the microstrip line 5. / 4).
[0093] wavelength It can be an intermediate wavelength encompassing a frequency range greater than 100 GHz. For example, the frequency range could be the D-band, with frequencies between 110 GHz and 175 GHz. Optionally, the frequency range includes frequencies between 130 GHz and 175 GHz. The frequency range can be used by the integrated circuit 3 in the eWLB package 1, for example, for communication via microstrip line 5. The eWLB package can be used for high-frequency packages with frequencies greater than 100 GHz (f > 100 GHz). The eWLB package can be used in millimeter-wave and / or Asia-Pacific Hertz applications.
[0094] Because the dimension of dielectric 4 in the direction perpendicular to microstrip line 5 is one-quarter of the design wavelength of microstrip line 5 ( / 4), therefore dielectric 4 is equivalent to a short-circuit waveguide (its size is one-quarter of the design wavelength of microstrip line 5). / 4). This allows the signal (e.g., an RF signal) provided by the microstrip line 5 at its end 5a to be converted into an electromagnetic wave propagating along the direction of the connection side 8 of the eWLB package 1, and then propagating along the direction of the waveguide 101 (when the eWLB package 1 is arranged on the PCB 100 such that the dielectric 4 and the end 5a of the microstrip line 5 are aligned with the waveguide 101). For example, this enables the transverse electromagnetic mode (TEM) of the microstrip line 5 to be converted into the transverse electric mode (TE) of the waveguide 101.
[0095] The arrangement of the microstrip line 5 and the dielectric 4, and the dimension of the dielectric 4 in the direction perpendicular to the microstrip line 5 being one-quarter of the wavelength ( The design of / 4) provides a back-short function, which enables the signal from the end 5a of the microstrip line 5 to be converted into an electromagnetic wave along the direction of the waveguide 101.
[0096] Optionally, such as Figure 3 As shown, the electrical connection 11 between one or more connecting elements 7a of the eWLB package 1 and the grounded metal housing 4a of the dielectric 4 can form an equivalent waveguide sidewall for guiding a signal in the form of electromagnetic waves (e.g., an RF signal in the form of radio waves) of the microstrip line 5 to the waveguide 101 of the PCB 100.
[0097] Figure 4(a) shows Figure 1 A bottom view of an example of how the dielectric of an eWLB package is implemented. Figure 1 The description of eWLB package 1 in Figure 4(a) applies accordingly. The optional features of the dielectric of eWLB package 1 in Figure 4(a) are described below.
[0098] Figure 4(a) shows the bottom metal layer of the ground metal housing 4a of the dielectric 4. As shown in Figure 4(a), the ground metal housing 4a may include one or more micro-metal vias 4c. The number of micro-metal vias 4c shown in Figure 4(a) is only an example and may vary. Furthermore, Figure 4(a) shows a channel opening 4b disposed on the surface of the ground metal housing 4a facing the microstrip line 5. The bottom metal layer of the ground metal housing 4a corresponds to this surface of the ground metal housing 4a. Therefore, within the region of the channel opening 4b of the ground metal housing, the end 5a of the microstrip line 5 can be arranged below the dielectric 4.
[0099] Figure 4(b) shows Figure 1 A bottom view of an example of how the dielectric of an eWLB package is implemented. Figure 1 The description of eWLB package 1 in Figure 4(b) applies accordingly. The following mainly describes the optional features of the dielectric of eWLB package 1 in Figure 4(b).
[0100] Figure 4(b) shows the bottom metal layer of the ground metal housing 4a of the dielectric 4. As shown in Figure 4(b), the ground metal housing 4a may include one or more cavities 4d with metal walls. The number of cavities 4d with metal walls shown in Figure 4(b) is only an example and may vary. Furthermore, Figure 4(b) shows a channel opening 4b disposed on the surface of the ground metal housing 4a facing the microstrip line 5. The bottom metal layer of the ground metal housing 4a corresponds to this surface of the ground metal housing 4a. Therefore, within the region of the channel opening 4b of the ground metal housing, the end 5a of the microstrip line 5 can be arranged below the dielectric 4.
[0101] Figure 5(a) shows Figure 1 A top view of an example implementation of the eWLB wrapper. Figure 1 The description of eWLB package 1 in Figure 5(a) applies accordingly. The following mainly describes the optional features of eWLB package 1 in Figure 5(a).
[0102] As shown in Figure 5(a), the connecting element 7 of the eWLB package 1 can be a solder ball. That is, the connecting element 7 can be a solder bump, which can be spherical (i.e., a solder ball). Optionally, when the frequency of the electromagnetic wave propagating through the microstrip line 5 of the eWLB package 1 is higher than 100 GHz (e.g., the D band, i.e., the frequency between 110 GHz and 175 GHz, or the frequency between 130 GHz and 175 GHz), the diameter of the solder bump can be 100 mm. m to 150 Between m. Alternatively, the spacing between the plurality of connecting elements 7a of connecting element 7 can be less than 300. m, optionally in 200 m to 300 Between m. This minimizes signal leakage. The number of multiple connecting elements 7a shown in Figure 5(a) is only an example and may vary.
[0103] As shown in Figure 5(a), multiple connecting elements 7a can be arranged along the edge of the dielectric 4 (e.g., a portion of the dielectric 4). This allows the multiple connecting elements 7a to form an equivalent waveguide sidewall. As shown in Figure 5, the end 5a of the microstrip line is arranged below the dielectric 4. The description in Figure 5(a) applies accordingly. Figure 2 The eWLB package 1a (where dielectric 4 is not present).
[0104] Figure 5(b) shows Figure 1 A top view of an example implementation of the eWLB wrapper. Figure 1 The description of the eWLB package 1 applies accordingly to FIG5(b), and the optional features of the eWLB package 1 of FIG5(b) are described below.
[0105] As shown in Figure 5(b), the connecting element 7 of the eWLB package 1 can be a solder lead. That is, the connecting element 7 can be a solder bump, which can be lead-shaped (i.e., a solder lead). The solder lead can be square or rectangular. That is, the solder lead can be cubic or cuboid. The solder lead can be a printed solder lead. Optionally, when the frequency of the electromagnetic wave propagating through the microstrip line 5 of the eWLB package 1 is higher than 100 GHz (e.g., D band, i.e., frequencies between 110 GHz and 175 GHz, or frequencies between 130 GHz and 175 GHz), the spacing between the plurality of connecting elements 7a of the connecting element 7 can be less than 300. m, optionally in 200 m to 300 Between m. This minimizes signal leakage. The number of multiple connecting elements 7a shown in Figure 5(b) is only an example and may vary.
[0106] As shown in Figure 5(b), multiple connecting elements 7a can be arranged along the edge of dielectric 4 (e.g., a portion of dielectric 4). This allows the multiple connecting elements 7a to form an equivalent waveguide sidewall. As shown in Figure 5(b), the end 5a of the microstrip line is arranged below dielectric 4. The description in Figure 5(b) applies accordingly. Figure 2 The eWLB package 1a (where dielectric 4 is not present).
[0107] Figure 6 It shows Figure 1 An example of how the eWLB wrapper is implemented. Figure 1 The description of the eWLB package 1 is accordingly applicable Figure 6 The following text mainly discusses Figure 6 The optional features of the eWLB package 1 are described below.
[0108] Figure 6 One scenario is illustrated where the eWLB package is used to supply and / or obtain electromagnetic waves from two waveguide ports (i.e., two or more waveguides 101 present in PCB 100). The number of waveguides is shown as an example only and can therefore be greater than two. Figure 6 The description then applies accordingly. For example... Figure 6 As shown, for each waveguide 101 (i.e., each waveguide port), the eWLB package 1 may include a dielectric 4 and a microstrip line 5 electrically connected to the integrated circuit 3. The end 5a of each microstrip line 5 is disposed below the corresponding dielectric 4, and the dimension of the corresponding dielectric 4 perpendicular to the microstrip line 5 is equal to one-quarter of the designed wavelength of the microstrip line 5. Due to the arrangement and dimensions of each pair of dielectrics 4 and microstrip lines 5, signals can be provided from the integrated circuit 3 to the corresponding waveguide 101 of the PCB 100 in the form of electromagnetic waves via the corresponding microstrip line 5.
[0109] Figure 1 , Figure 3 The descriptions of Figures 4(a), 4(b), 5(a) and 5(c) are accordingly applicable to an eWLB package comprising multiple dielectrics 4 for providing electromagnetic waves to multiple external waveguides 101.
[0110] like Figure 6 As shown, PCB 100 can be mounted on mechanical carrier 300. Mechanical carrier 300 can have various uses, such as serving as a mechanical support, as a location for waveguide distribution networks (e.g., RF waveguide distribution networks), as a heat sink, and / or providing antenna functionality. For example, mechanical carrier 300 can be part of or constitute an antenna, such as a planar antenna.
[0111] Therefore, signal distribution networks, such as those for RF signals, may not be implemented across the layers of the PCB. This is especially true for high frequencies, such as those above 100 GHz. Such distribution networks can be designed using waveguides (e.g., rectangular waveguides), which allow for small size and low loss at high frequencies. An eWLB package with multiple sets of input / output waveguide transitions is formed by multiple pairs of dielectrics 4 and the ends 5a of corresponding microstrip lines 5, used to couple the waveguide 101 of the PCB. Thus, the distribution network is implemented at the mechanical carrier 300 below the PCB 100.
[0112] The eWLB package 1, PCB 100, and mechanical carrier 300 can form system 200. That is, system 200 can include eWLB package 1, PCB 100, and mechanical carrier 300.
[0113] Figure 6 The description accordingly applies to Figure 2 The eWLB package 1a, in which dielectric 4 is absent.
[0114] Figure 7 It shows Figure 1 An example of how the eWLB wrapper is implemented. Figure 1 The description of the eWLB package 1 is accordingly applicable Figure 7 The following text mainly discusses Figure 7 The optional features of the eWLB package 1 are described below.
[0115] Figure 7 The eWLB package 1 corresponds to one with additional features. Figure 6 The eWLB package 1. Therefore, for description Figure 7 For eWLB1, please refer to Figure 6 The following section describes the additional feature of eWLB1.
[0116] like Figure 7 As shown, multiple connecting elements 7a are used to connect to the intermediate PCB carrier 12. Figure 7 In the example, multiple connecting elements 7a are connected to the intermediate PCB carrier 12. This is only an example. The PCB carrier 12 can be adapted and arranged such that when the eWLB package 1 is connected to the PCB 100 via the PCB carrier 12, and the end 5a of each dielectric 4 and the corresponding microstrip line 5 is aligned with the corresponding waveguide 101, the PCB carrier 12 provides a conductive connection between the ground terminal of the eWLB package 1 and the waveguide 101 of the PCB 100. When the PCB 100 includes only one waveguide 101 or two or more waveguides 101, Figure 7 The description applies accordingly.
[0117] Connecting element 7 can be used to solder to PCB carrier 12. PCB carrier 12 can be used to solder to PCB 100 so that eWLB package 1 can be connected to PCB 100 via PCB carrier 12. Intermediate PCB carrier 12 can be an effective component interface of PCB 100.
[0118] Figure 7 The description accordingly applies to Figure 2 The eWLB package 1a, in which dielectric 4 is absent.
[0119] The eWLB package disclosed herein, for example Figures 1 to 7Any of the options can be used for single-channel or multi-channel chips. The eWLB package can be used for a single external waveguide or multiple external waveguides. In the case of multiple waveguides (i.e., multiple waveguide ports), the eWLB package can provide a corresponding dielectric and a corresponding microstrip line for each waveguide port, wherein the end of the corresponding microstrip line is arranged below the corresponding dielectric (where a dielectric is present).
[0120] For example, the eWLB package of this disclosure can be used in phased array front-end implementations (e.g., at high frequencies) to enable beam steering functionality with an antenna (e.g., a planar antenna). The phased array front-end implementation can be a phased array device, such as a phased array front-end device.
[0121] This disclosure has been described in conjunction with various embodiments as examples and implementations. However, based on a study of the drawings, this disclosure, and the independent claims, those skilled in the art will understand and implement other variations when carrying out the claimed subject matter. In the claims and the description, the word "comprising" does not exclude other elements or steps, and the indefinite article "a" does not exclude a plurality. A single element or other unit can perform the function of several entities or items described in the claims. Listing certain measures in dissimilar dependent claims does not imply that combinations of these measures cannot be used in advantageous implementations.
Claims
1. An embedded wafer-level ball grid array (eWLB) package (1), characterized in that, include - Mold (2) encapsulating integrated circuit (3); - Dielectric (4) arranged in the molded body (2); - A microstrip line (5) electrically connected to the integrated circuit (3); wherein, - In the direction toward the connection side (8) of the eWLB package (1) including the connection element (7), the end (5a) of the microstrip line (5) is arranged below the dielectric (4); - The dimension of the dielectric (4) in the direction perpendicular to the microstrip line (5) is equal to one-quarter of the wavelength designed for the microstrip line (5); - The eWLB package (1) is used to connect to a printed circuit board (PCB) (100) via the connecting element (7), the PCB (100) having a waveguide (101) with a channel-shaped opening, such that the ends (5a) of the dielectric (4) and the microstrip line (5) are aligned with the waveguide (101).
2. The eWLB package (1) according to claim 1, characterized in that, - A plurality of connecting elements (7, 7a) in the connecting element (7) are electrically connected to the ground terminal of the eWLB package (1). The plurality of connecting elements (7, 7a) are adapted and arranged on the connecting side (8) of the eWLB package (1) to provide conductive connections between the ground terminal of the eWLB package (1), the ground terminal of the dielectric (4) and the waveguide (101) of the PCB (100) when the eWLB package (1) is connected to the PCB (100) via the connecting element (7) and the ends (5a) of the dielectric (4) and the microstrip line (5) are respectively aligned with the waveguide (101).
3. The eWLB package (1) according to claim 2, characterized in that, - The plurality of connecting elements (7, 7a) are used to connect to the intermediate PCB carrier (12), and - The PCB carrier (12) is adapted and arranged such that when the eWLB package (1) is connected to the PCB (100) via the PCB carrier (12) and the ends (5a) of the dielectric (4) and the microstrip line (5) are respectively aligned with the waveguide (101), the PCB carrier (12) provides a conductive connection between the ground terminal of the eWLB package (1) and the waveguide (101) of the PCB (100).
4. The eWLB package (1) according to claim 2 or 3, characterized in that, - One or more of the plurality of connecting elements (7, 7a) are electrically connected to the grounded metal housing (4a) of the dielectric (4), and the grounded metal housing (4a) includes a channel opening (4b) on the surface of the grounded metal housing (4a) facing the microstrip line (5).
5. The eWLB package (1) according to claim 4, characterized in that, - The grounded metal housing (4a) includes one or more micro-metal vias (4c) and / or one or more cavities (4d) with metal walls.
6. The eWLB package (1) according to any one of claims 2 to 5, characterized in that, One or more of the plurality of connecting elements (7, 7a) are electrically connected to the ground terminal of the microstrip line (5).
7. The eWLB package (1) according to any one of the preceding claims, characterized in that, - The dielectric (4) is rectangular.
8. The eWLB package (1) according to any one of the preceding claims, characterized in that, - The dielectric (4) is made of at least one of the following materials: one or more PCB laminates, glass and one or more liquid crystal polymers.
9. The eWLB package (1) according to any one of the preceding claims, characterized in that, - The wavelength is an intermediate wavelength that includes a frequency range greater than 100 GHz.
10. The eWLB package (1) according to any one of the preceding claims, characterized in that, - The eWLB package (1) includes a passivation layer (9) disposed between the dielectric (4) and the microstrip line (5), and / or The -eWLB package (1) includes a passivation layer (10) disposed between the microstrip line (5) and the connecting element (7).
11. The eWLB package (1) according to any one of the preceding claims, characterized in that, - The connecting element (7) is a solder ball or solder lead.
12. The eWLB package (1) according to claim 11, characterized in that, - The solder leads are cubic or cuboid in shape.
13. A system (200), characterized in that, include - The eWLB package (1) according to any one of the preceding claims, and - A printed circuit board (PCB) (100), wherein a waveguide (101) has a channel-shaped opening, wherein - The eWLB package (1) is connected to the PCB (100) via the connecting element (7) of the eWLB package (1) such that the ends (5a) of the dielectric (4) and the microstrip line (5) are aligned with the waveguide (101) of the PCB (100).
14. An embedded wafer-level ball grid array (eWLB) package (1a), characterized in that, include - The molded body (2) encapsulating the integrated circuit (3), and - A microstrip line (5) electrically connected to the integrated circuit (3); wherein, - The eWLB package (1a) is used to connect to a printed circuit board (PCB) via a connection element (7) on the connection side (8) of the eWLB package (1a), wherein the PCB (100) has a waveguide (101) with a channel-shaped opening, such that a portion (5a) of the microstrip line (5) is aligned with the waveguide (101), and - A plurality of connecting elements (7, 7a) in the connecting element (7) are electrically connected to the ground terminal of the eWLB package (1a). The plurality of connecting elements (7, 7a) are adapted and arranged on the connecting side (8) of the eWLB package (1a) to provide a conductive connection between the ground terminal of the eWLB package (1a) and the waveguide (101) of the PCB (100) when the eWLB package (1a) is connected to the PCB (100) via the connecting element (7) and the portion (5a) of the microstrip line (5) is aligned with the waveguide (101).
15. A system (200a), characterized in that, include - The eWLB package (1a) according to claim 14, and - A printed circuit board (PCB) (100), wherein a waveguide (101) with a channel-shaped opening is provided, wherein - The eWLB package (1a) is connected to the PCB (100) via the connecting element (7) of the eWLB package (1a), such that a portion (5a) of the microstrip line (5) of the eWLB package (1a) is aligned with the waveguide (101) of the PCB (100), and - The plurality of connecting elements (7, 7a) of the eWLB package (1a) provide a conductive connection between the ground terminal of the eWLB package (1a) and the waveguide (101) of the PCB (100).