A method for transporting semiconductor chips by overhead crane

Abstract

This application discloses a method for transporting semiconductor chips via an overhead crane, including: moving the entire crane to move a clamping unit to a position corresponding to a semiconductor chip carrier; the clamping unit extending horizontally into the placement position of a simulation device and clamping the semiconductor chip carrier; the clamping unit moving the semiconductor chip carrier out of the placement position; and the entire crane moving to transport the semiconductor chip carrier. The clamping unit extends horizontally into the placement position of the simulation device to clamp the semiconductor chip carrier, thus avoiding obstruction of the placement position from the top of the semiconductor chip carrier.

Description

Technical Field

[0001] This application relates to the field of conveying equipment technology, and in particular to a method for conveying semiconductor chips by overhead crane. Background Technology

[0002] In conventional conveying systems, overhead cranes are commonly used to transport goods. The crane approaches the item from the top and grabs it to move it. However, for semiconductor chips placed in analog equipment, the structure of the equipment limits access. The top of the chip is obstructed, and the placement area only has a horizontal opening, making it impossible to grab the chip from the top. Therefore, conventional overhead cranes are unsuitable. Furthermore, conventional overhead cranes require manual operation to reach the item's location, resulting in a low level of automation. Summary of the Invention

[0003] This application aims to address at least one of the technical problems existing in the prior art. To this end, this application proposes a method for transporting semiconductor chips by overhead crane, which can reach into the placement position of a simulation device through horizontal movement, thereby grasping a semiconductor chip carrier.

[0004] According to a first aspect embodiment of the present application, a semiconductor chip overhead crane transport method is applied to an overhead crane, the overhead crane including a clamping unit for clamping a semiconductor chip carrier, and the semiconductor chip overhead crane transport method includes: The entire overhead crane is moved so that the clamping unit moves to the position corresponding to the semiconductor chip carrier; The clamping unit extends horizontally into the placement position of the analog device and clamps the semiconductor chip carrier; The clamping unit moves the semiconductor chip carrier out of the placement position of the analog device; The crane moves as a whole to transport semiconductor chip carriers.

[0005] The overhead crane method for transporting semiconductor chips according to the embodiments of this application has at least the following beneficial effects: the crane first moves as a whole, driving the position of the clamping unit to correspond to the semiconductor chip carrier and the placement position of the analog device; the clamping unit extends into the placement position of the analog device by moving horizontally, thereby clamping the semiconductor chip carrier, avoiding obstruction of the placement position on top of the semiconductor chip carrier by the clamping unit; after the clamping unit clamps the semiconductor chip carrier, it can drive the semiconductor chip carrier out of the placement position; after the semiconductor chip carrier is moved out of the placement position, the crane moves as a whole to complete the transport process of the semiconductor chip carrier.

[0006] According to some embodiments of this application, the clamping unit includes a first gripper and a second gripper. The clamping unit extends horizontally into the placement position of the analog device and clamps a semiconductor chip carrier, including: The first gripper moves to the rear of the semiconductor chip carrier, and the second gripper moves to the front of the semiconductor chip carrier; The first and second grippers hold the semiconductor chip carrier.

[0007] According to some embodiments of this application, the first and second grippers hold a semiconductor chip carrier, including: The first gripper is fixed in position, and the second gripper reduces the distance between itself and the first gripper by moving horizontally, so that the first gripper and the second gripper can hold the semiconductor chip carrier.

[0008] According to some embodiments of this application, the first and second grippers hold a semiconductor chip carrier, including: The second gripper is fixed in position, and the first gripper reduces the distance between itself and the second gripper by moving horizontally, so that the first gripper and the second gripper can hold the semiconductor chip carrier.

[0009] According to some embodiments of this application, the first gripper moves to the rear side of the semiconductor chip carrier, and the second gripper moves to the front side of the semiconductor chip carrier, including: The first gripper avoids the semiconductor chip carrier by rotating; The clamping unit extends horizontally into the placement position of the analog device, so that the second gripper reaches the front side of the semiconductor chip carrier; The first gripper rotates to reach the rear of the semiconductor chip carrier.

[0010] According to some embodiments of this application, the clamping unit includes a first gripper and a second gripper. The clamping unit extends horizontally into the placement position of the analog device and clamps a semiconductor chip carrier, including: The first gripper moves to the bottom of the semiconductor chip carrier, and the second gripper moves to the top of the semiconductor chip carrier; The first and second grippers hold the semiconductor chip carrier.

[0011] According to some embodiments of this application, the clamping unit is equipped with a gripper position sensor, and the clamping unit extends horizontally into the placement position of the analog device to clamp the semiconductor chip carrier, including: The gripper position sensor detects the positions of the first gripper and the second gripper in real time and transmits the position information of the first gripper and the second gripper to the controller; The controller controls the first gripper to move to the rear of the semiconductor chip carrier based on the position information, and controls the second gripper to move to the front of the semiconductor chip carrier; or the controller controls the first gripper to move to the bottom of the semiconductor chip carrier based on the position information, and controls the second gripper to move to the top of the semiconductor chip carrier.

[0012] According to some embodiments of this application, the overall movement of the overhead crane to move the clamping unit to a position corresponding to the semiconductor chip carrier includes: The overhead crane adjusts the horizontal position of the clamping unit by moving in the first direction, so that the horizontal position of the clamping unit corresponds to the placement position of the simulation equipment; The overhead crane adjusts the height of the clamping unit by moving in the second direction, so that the height of the clamping unit corresponds to the placement position of the simulation equipment.

[0013] According to some embodiments of this application, the overhead crane or simulation equipment is provided with a fixing device for positioning the clamping unit. The overhead crane moves as a whole to move the clamping unit to a position corresponding to the semiconductor chip carrier, including: The overhead crane adjusts the horizontal position of the clamping unit by moving in the first direction, so that the horizontal position of the clamping unit corresponds to the placement position of the simulation equipment; The overhead crane moves in the second direction to reach the fixing device, which positions the clamping unit so that the height of the clamping unit corresponds to the placement position of the simulation equipment.

[0014] According to some embodiments of this application, the overhead crane adjusts the horizontal position of the clamping unit by moving in a first direction, so that the horizontal position of the clamping unit corresponds to the placement position of the simulation device, including: The horizontal position of the clamping unit is detected by computer vision and / or sensors, and the horizontal position information of the clamping unit is transmitted to the controller; The controller moves the clamping unit to a horizontal position corresponding to the placement position of the analog device.

[0015] According to some embodiments of this application, the overhead crane adjusts the height of the clamping unit by moving in a second direction, so that the height of the clamping unit corresponds to the placement position of the simulation device, including: The height position of the clamping unit is detected by computer vision and / or sensors, and the height position information of the clamping unit is transmitted to the controller; The controller moves the clamping unit to the height position corresponding to the placement position of the analog device.

[0016] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0017] The present application will be further illustrated below with reference to the accompanying drawings and embodiments. It should be noted that the embodiments illustrated in the following drawings are exemplary and are only used to explain the present application, and should not be construed as limiting the present application.

[0018] Figure 1 This is a schematic diagram of the structure of the overhead crane involved in the semiconductor chip aerial crane transportation method of this application embodiment; Figure 2 This is a schematic diagram of the structure of the semiconductor chip carrier held by the first and second grippers in the semiconductor chip aerial crane transport method of this application embodiment; Figure 3 This is a flowchart of a method for transporting semiconductor chips by overhead crane according to an embodiment of this application; Figure 4 This is a flowchart of the steps of the first and second grippers holding the semiconductor chip carrier in a semiconductor chip overhead crane transport method according to an embodiment of this application; Figure 5 This is a flowchart of the steps in the semiconductor chip overhead crane transport method according to an embodiment of this application, where the clamping unit avoids the semiconductor chip carrier; Figure 6 This is a flowchart of the steps of the first and second grippers holding the semiconductor chip carrier in a semiconductor chip overhead crane transport method according to an embodiment of this application; Figure 7 This is a flowchart of the steps of the first and second grippers clamping the semiconductor chip carrier in another embodiment of the semiconductor chip aerial crane transport method of this application; Figure 8 This is a flowchart of the steps in the semiconductor chip overhead crane transport method according to another embodiment of this application, where the clamping unit avoids the semiconductor chip carrier; Figure 9 This is a flowchart of the step of clamping a semiconductor chip carrier by a clamping unit in a semiconductor chip overhead crane transport method according to another embodiment of this application; Figure 10 This is a flowchart of the steps of the clamping unit corresponding to the semiconductor chip carrier in an embodiment of the overhead crane transport method for semiconductor chips; Figure 11 This is a flowchart of the steps of the clamping unit corresponding to the semiconductor chip carrier in another embodiment of the semiconductor chip aerial crane transport method of this application; Figure 12 This is a flowchart of the step in the method for transporting semiconductor chips by overhead crane according to an embodiment of this application, in which the first direction of the crane movement corresponds to the horizontal position of the placement location; Figure 13 This is a flowchart illustrating the step of the overhead crane moving in the second direction corresponding to the placement height in a semiconductor chip overhead crane transport method according to an embodiment of this application.

[0019] Figure label: 100. Analog equipment; 101. Semiconductor chip carrier; 200. Clamping unit; 2001. First gripper; 2002. Second gripper; 201. Fixing device. Detailed Implementation

[0020] The embodiments of this application are described in detail below with reference to the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0021] In the description of this application, it should be understood that the terms "center", "middle", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0022] In the description of this application, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0023] In the description of this application, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0024] In the description of this application, the use of terms such as "one embodiment," "some embodiments," "an example," "some instances," "some embodiments," "illustrative embodiment," "example," "specific example," and "some examples" indicates that the specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0025] This application provides a method for transporting semiconductor chips via an overhead crane, applicable to overhead cranes. Wherein, as... Figure 1 and Figure 2 As shown, the semiconductor chip is carried inside the semiconductor chip carrier 101, and the overhead crane transports the semiconductor chip by transporting the semiconductor chip carrier 101.

[0026] Specifically, the overhead crane includes a clamping unit 200 for clamping the semiconductor chip carrier 101. The overhead crane can drive the clamping unit 200 to the placement position of the analog device 100 through overall movement, and the semiconductor chip carrier 101 is placed in the placement position.

[0027] Furthermore, the clamping unit 200 can extend horizontally into the placement position, so that the clamping unit 200 corresponds to the semiconductor chip carrier 101 in the placement position, facilitating the clamping unit 200 to grip the semiconductor chip carrier 101. After the clamping unit 200 grips the semiconductor chip carrier 101 and detaches it from the placement position, the overhead crane can drive the clamping unit 200 to move, thereby realizing the transportation process of the semiconductor chip carrier 101.

[0028] Most current overhead cranes clamp materials from the top to achieve material transport. However, the semiconductor chip carrier 101 of this application is placed inside the simulation device 100. Due to the structural limitations of the simulation device 100, the top of the semiconductor chip carrier 101 is obstructed, thus current overhead cranes cannot transport the semiconductor chip carrier 101 in this application scenario. Therefore, the clamping unit 200 of the overhead crane in this application can move horizontally, allowing the clamping unit 200 to extend into the placement position from the horizontal opening, facilitating the removal of the semiconductor chip carrier 101 from the placement position, thereby achieving the transport process of the semiconductor chip carrier 101.

[0029] This application provides a method for transporting semiconductor chips by overhead crane. Based on the above-mentioned overhead crane, various embodiments of the method for transporting semiconductor chips by overhead crane of this application are presented below.

[0030] like Figure 3 As shown, Figure 3 This is a flowchart of a semiconductor chip overhead crane transport method provided in one embodiment of this application. The semiconductor chip overhead crane transport method can be applied to the above-mentioned overhead crane. The semiconductor chip overhead crane transport method includes, but is not limited to, steps S100, S200, S300 and S400.

[0031] In step S100, the crane moves as a whole to move the clamping unit 200 to the position corresponding to the semiconductor chip carrier 101; In step S200, the clamping unit 200 extends horizontally into the placement position of the analog device 100 and clamps the semiconductor chip carrier 101. In step S300, the clamping unit 200 moves the semiconductor chip carrier 101 out of the placement position of the analog device 100; In step S400, the crane moves as a whole to transport the semiconductor chip carrier 101.

[0032] In some examples, the object to be transported by the overhead crane is a semiconductor chip carrier 101, which is placed in the placement position of the analog device 100. It is understood that if the semiconductor chip carrier 101 is to be transported by the overhead crane, the semiconductor chip carrier 101 must first be secured to the overhead crane. The overhead crane of this application has a clamping unit 200, which secures the semiconductor chip carrier 101 to the overhead crane in a clamping manner.

[0033] Furthermore, to ensure that the clamping unit 200 can accurately clamp the semiconductor chip carrier 101 to be transported, the clamping unit 200 needs to move to the position of the semiconductor chip carrier 101 to be transported, that is, the clamping unit 200 needs to move to correspond to the placement position. The overhead crane can drive the clamping unit 200 to move by moving as a whole, so that the clamping unit 200 corresponds to the placement position, which facilitates the subsequent clamping of the semiconductor chip carrier 101 by the clamping unit 200.

[0034] It is worth noting that when the clamping unit 200 corresponds to the placement position, the clamping unit 200 and the semiconductor chip carrier 101 on the placement position are approximately at the same height, which makes it convenient for the clamping unit 200 to extend into the placement position where the semiconductor chip carrier 101 is located by horizontal movement, so as to clamp the semiconductor chip carrier 101.

[0035] Most current overhead cranes clamp items from the top to achieve the conveying function. However, due to the structural limitations of the simulation device 100, the top of the semiconductor chip carrier 101 placed in the placement position is obstructed, preventing the overhead crane from clamping the semiconductor chip carrier 101 from the top. Therefore, conventional overhead cranes are not suitable for the application scenario of this application. Given that the placement position of the simulation device 100 has a horizontal opening, the clamping unit 200 of the overhead crane in this application can move horizontally along the horizontal opening to reach the position of the semiconductor chip carrier 101, facilitating the clamping of the semiconductor chip carrier 101 without interfering with the obstructing structure on the top of the semiconductor chip carrier 101, thus making it suitable for the application scenario of this application.

[0036] Furthermore, after the clamping unit 200 clamps the semiconductor chip carrier 101, the clamping unit 200 can move the semiconductor chip carrier 101 out of the placement position of the analog device 100 by horizontal movement, so that the semiconductor chip carrier 101 is removed from the analog device 100. It can be understood that after the semiconductor chip carrier 101 is removed from the analog device 100, the overhead crane moves again as a whole, thereby driving the clamping unit 200 and the semiconductor chip carrier 101 to transfer positions, thus realizing the transport process of the semiconductor chip carrier 101.

[0037] Additionally, refer to Figure 10 Step S100: The crane moves as a whole to move the clamping unit 200 to the position corresponding to the semiconductor chip carrier 101, which may include, but is not limited to, the following steps: In step S110, the overhead crane adjusts the horizontal position of the clamping unit 200 by moving in the first direction, so that the horizontal position of the clamping unit 200 corresponds to the placement position of the simulation device 100. In step S120, the overhead crane adjusts the height of the clamping unit 200 by moving in the second direction, so that the height of the clamping unit 200 corresponds to the placement position of the simulation device 100.

[0038] In some examples, the overhead crane includes top and bottom horizontal moving tracks that extend in a first direction, which is... Figure 1 In the X-axis direction, the overhead crane can move horizontally along the horizontal moving track in the first direction, thereby driving the clamping unit 200 to adjust its horizontal position. During this process, the height of the clamping unit 200 remains unchanged, but the horizontal position of the clamping unit 200 gradually corresponds to the placement position of the simulation device 100. It can be understood that when the horizontal position of the clamping unit 200 corresponds to the placement position of the simulation device 100, the horizontal movement of the entire overhead crane stops, facilitating subsequent height adjustments of the clamping unit 200.

[0039] Furthermore, the overhead crane includes a winding / unwinding device located at the top, which is connected to the clamping unit 200 via slings. After the overall horizontal position of the overhead crane is adjusted, the winding / unwinding device can wind or unwind the slings, causing the clamping unit 200 to move in a second direction. Figure 1 The Z-axis direction, i.e., the height direction, is used in this context. It can be understood that, since the unwinding / rewinding equipment is located at the top of the overhead crane, the height of the clamping unit 200 increases when the equipment winds up the sling, and decreases when it unwinds. Therefore, the unwinding / rewinding equipment can adjust the height of the clamping unit 200 via the sling, ensuring that the height of the clamping unit 200 corresponds to the placement position of the semiconductor chip carrier 101 to be transported.

[0040] When the clamping unit 200 is aligned with the placement position by adjusting the horizontal position and the height position, the clamping unit 200 extends along the Y-axis direction and reaches the semiconductor chip carrier 101 on the placement position.

[0041] Additionally, refer to Figure 12 Step S110: The overhead crane adjusts the horizontal position of the clamping unit 200 by moving in the first direction, so that the horizontal position of the clamping unit 200 corresponds to the placement position of the simulation device 100. This may include, but is not limited to, the following steps: Step S111: Detect the horizontal position of the clamping unit 200 using computer vision and / or sensors, and transmit the horizontal position information of the clamping unit 200 to the controller; In step S112, the controller controls the clamping unit 200 to move to a horizontal position corresponding to the placement position of the analog device 100.

[0042] In some examples, when the clamping unit 200 is adjusted to a horizontal position, to ensure that the clamping unit 200 can accurately reach the horizontal position corresponding to the placement location, the overhead crane of this application can be equipped with a corresponding camera. The camera can capture the scene image of the current horizontal position of the clamping unit 200 and transmit the corresponding image to the controller of the overhead crane. The controller can determine whether the clamping unit 200 has reached the target horizontal position through the image, thereby controlling the start and stop of the horizontal movement part of the overhead crane to ensure the accuracy of the horizontal positioning of the clamping unit 200.

[0043] The overhead crane of this application can also be equipped with corresponding sensors. The sensors can sense whether the clamping unit 200 has reached the target horizontal position. When the clamping unit 200 reaches the target horizontal position, the sensor sends a signal to the controller, and the controller controls the horizontal movement part of the overhead crane to stop moving, so as to ensure the accuracy of the clamping unit 200 in horizontal position.

[0044] Additionally, refer to Figure 13Step S120: The overhead crane adjusts the height of the clamping unit 200 by moving in the second direction, so that the height of the clamping unit 200 corresponds to the placement position of the simulation device 100. This may include, but is not limited to, the following steps: Step S121: Detect the height position of the clamping unit 200 using computer vision and / or sensors, and transmit the height position information of the clamping unit 200 to the controller; In step S122, the controller controls the clamping unit 200 to move to the height position corresponding to the placement position of the analog device 100.

[0045] In some examples, similar to the horizontal movement control of the overhead crane, when the clamping unit 200 is height adjusted, to ensure that the clamping unit 200 can accurately reach the height corresponding to the placement position, the overhead crane of this application can also be equipped with a corresponding camera. The camera can capture the scene image of the current height position of the clamping unit 200 and transmit the corresponding image to the controller of the overhead crane. The controller can determine whether the clamping unit 200 has reached the target height through the image, thereby controlling the start and stop of the winding and unwinding equipment in the overhead crane to ensure the accuracy of the clamping unit 200 reaching the correct height.

[0046] The overhead crane of this application can also be equipped with corresponding sensors. The sensors can sense whether the clamping unit 200 has reached the target height. When the clamping unit 200 reaches the target height, the sensor sends a signal to the controller, and the controller controls the overhead crane winding and unwinding equipment to stop working, ensuring the accuracy of the clamping unit 200 in the correct height.

[0047] Additionally, refer to Figure 11 Step S100: The crane moves as a whole to move the clamping unit 200 to the position corresponding to the semiconductor chip carrier 101, which may include, but is not limited to, the following steps: In step S130, the overhead crane adjusts the horizontal position of the clamping unit by moving in the first direction, so that the horizontal position of the clamping unit corresponds to the placement position of the simulation device. In step S140, the overhead crane moves in the second direction to the fixing device, and the fixing device positions the clamping unit so that the height of the clamping unit corresponds to the placement position of the simulation equipment.

[0048] In some examples, to further ensure that the position of the clamping unit 200 corresponds to the target placement position, a fixing device 201 is provided on the opening side of the simulation device 100. The fixing device 201 can be set on the simulation device 100, the clamping unit, or placed adjacent to the simulation device 100. The fixing device 201 is used to position the clamping unit and avoid instability caused by the horizontal extension of the clamping unit's grippers.

[0049] Specifically, such as Figure 1As shown, the fixing device 201 can be configured as a positioning frame 201. The positioning frame 201 has corresponding tracks on both sides, specifically, these tracks are set vertically. To allow the clamping unit 200 to cooperate with these tracks, rollers corresponding to the tracks are provided on both sides of the clamping unit 200. When the clamping unit 200 moves into the range of the positioning frame 201, the rollers roll into contact with the tracks, facilitating the movement of the clamping unit 200 along the tracks and standardizing the movement path of the clamping unit 200 during height adjustment.

[0050] During the horizontal movement of the overhead crane in the first direction, the height of the clamping unit 200 is ensured to be greater than the height of the positioning frame 201. As the clamping unit 200 continues to move horizontally, it gradually approaches the positioning frame 201 until the horizontal position of the clamping unit 200 corresponds to the horizontal position of the positioning frame 201. At this point, the clamping unit 200 is directly above the positioning frame 201.

[0051] Once the clamping unit 200 is horizontally aligned with the positioning frame 201, the overhead crane lowers the clamping unit 200 via the unwinding / rewinding equipment until the rollers on the clamping unit 200 contact the track on the positioning frame 201. As the unwinding / rewinding equipment continues to unwind, the clamping unit 200 can adjust its height along the track on the positioning frame 201 until its height corresponds to the placement position. Understandably, the guide rail prevents instability of the clamping unit's center of gravity caused by the extension of the clamping jaws, ensuring accurate positioning of the clamping unit 200.

[0052] It is worth noting that the fixing device 201 can also be configured as other structures for positioning and clamping unit 200, and is not limited to positioning frame 201.

[0053] Additionally, refer to Figure 4 Step S200: The clamping unit 200 extends horizontally into the placement position of the analog device 100 and clamps the semiconductor chip carrier 101, which may include, but is not limited to, the following steps: In step S210, the first gripper 2001 moves to the rear side of the semiconductor chip carrier 101, and the second gripper 2002 moves to the front side of the semiconductor chip carrier 101. In step S220, the first gripper 2001 and the second gripper 2002 clamp the semiconductor chip carrier 101.

[0054] In some examples, the clamping unit 200 includes a first jaw 2001 and a second jaw 2002. The first jaw 2001 and the second jaw 2002 can contact different positions of the semiconductor chip carrier 101 and change the distance between the first jaw 2001 and the second jaw 2002 through relative movement. As the distance between the first jaw 2001 and the second jaw 2002 continuously decreases, the first jaw 2001 and the second jaw 2002 can jointly clamp the semiconductor chip carrier 101.

[0055] When the clamping unit 200 moves horizontally into the placement position, the first gripper 2001 can move to the rear side of the semiconductor chip carrier 101, and the second gripper 2002 can move to the front side of the semiconductor chip carrier 101. Specifically, the rear side of the semiconductor chip carrier 101 refers to the side of the semiconductor chip carrier 101 away from the clamping unit 200, and the front side of the semiconductor chip carrier 101 refers to the side of the semiconductor chip carrier 101 close to the clamping unit 200. Under this premise, as the distance between the first gripper 2001 and the second gripper 2002 decreases, the first gripper 2001 and the second gripper 2002 can clamp the semiconductor chip carrier 101, and the semiconductor chip carrier 101 can be moved out of the placement position by the overall horizontal movement of the first gripper 2001 and the second gripper 2002.

[0056] Additionally, refer to Figure 5 Step S220: The first gripper 2001 and the second gripper 2002 clamp the semiconductor chip carrier 101, which may include, but is not limited to, the following steps: In step S221, the first gripper 2001 is fixed in position, and the second gripper 2002 reduces the distance between itself and the first gripper 2001 by moving horizontally, so that the first gripper 2001 and the second gripper 2002 clamp the semiconductor chip carrier 101.

[0057] In some examples, the first gripper 2001 is fixed in position, and the second gripper 2002 can move horizontally relative to the first gripper 2001, thereby reducing the distance between the first gripper 2001 and the second gripper 2002. As the distance between the first gripper 2001 and the second gripper 2002 decreases, the first gripper 2001 and the second gripper 2002 can clamp the semiconductor chip carrier 101.

[0058] It is understandable that after the first gripper 2001 and the second gripper 2002 grip the semiconductor chip carrier 101, the two move horizontally together, so that the semiconductor chip carrier 101 can move out of the analog device 100 along the opening side of the placement position, which facilitates the subsequent transport of the semiconductor chip carrier 101.

[0059] Additionally, refer to Figure 6Step S220: The first gripper 2001 and the second gripper 2002 clamp the semiconductor chip carrier 101, which may include, but is not limited to, the following steps: In step S222, the position of the second gripper 2002 is fixed, and the first gripper 2001 reduces the distance between itself and the second gripper 2002 by moving horizontally, so that the first gripper 2001 and the second gripper 2002 can clamp the semiconductor chip carrier 101.

[0060] In some examples, the second gripper 2002 is fixed in position, and the first gripper 2001 can move horizontally relative to the second gripper 2002, thereby reducing the distance between the first gripper 2001 and the second gripper 2002. As the distance between the first gripper 2001 and the second gripper 2002 decreases, the first gripper 2001 and the second gripper 2002 can clamp the semiconductor chip carrier 101.

[0061] It is understandable that after the first gripper 2001 and the second gripper 2002 grip the semiconductor chip carrier 101, the two move horizontally together, so that the semiconductor chip carrier 101 can move out of the analog device 100 along the opening side of the placement position, which facilitates the subsequent transport of the semiconductor chip carrier 101.

[0062] Additionally, refer to Figure 7 Step S210: The first gripper 2001 moves to the rear side of the semiconductor chip carrier 101, and the second gripper 2002 moves to the front side of the semiconductor chip carrier 101. This may include, but is not limited to, the following steps: In step S214, the first gripper 2001 avoids the semiconductor chip carrier 101 by rotating; In step S215, the clamping unit 200 extends horizontally into the placement position of the analog device 100, so that the second gripper 2002 reaches the front side of the semiconductor chip carrier 101. In step S216, the first gripper 2001 rotates to reach the rear side of the semiconductor chip carrier 101.

[0063] In some examples, the first gripper 2001 can be rotated by a corresponding driver. Since the first gripper 2001 is rotatable, the gripping unit 200 does not need to change its height to avoid the semiconductor chip carrier 101 when it extends into the placement position.

[0064] Furthermore, because the simulation device 100 has a multi-layered internal structure, each placement position has a partition at its top, and the distance between the top of the semiconductor chip carrier 101 and the partition is small. If the first gripper 2001 is fixed, it will be difficult for the first gripper 2001 to enter the corresponding placement position along the space between the top of the semiconductor chip carrier 101 and the partition. Therefore, making the first gripper 2001 rotatable also facilitates its entry into the placement position.

[0065] Specifically, when the clamping unit 200 adjusts its height using the unwinding / rewinding device, it can be adjusted to the same height as the placement position. At this time, driven by the driver, the first gripper 2001 rotates and retracts to a horizontally extended state. In this position, the first gripper 2001 can avoid the semiconductor chip carrier 101 without requiring the clamping unit 200 to adjust its height to avoid the semiconductor chip carrier 101. In this case, the clamping unit 200 extends horizontally into the placement position until the second gripper 2002 contacts the front side of the semiconductor chip carrier 101.

[0066] When the second gripper 2002 contacts the front side of the semiconductor chip carrier 101, the first gripper 2001 has reached the rear side of the semiconductor chip carrier 101 in a horizontal position. At this time, the driver drives the first gripper 2001 to rotate and open to a vertically extended state, so that the first gripper 2001 contacts the rear side of the semiconductor chip carrier 101.

[0067] That is, the first gripper 2001 can avoid the semiconductor chip carrier 101 by rotating. After the first gripper 2001 moves to the rear side of the semiconductor chip carrier 101, it can then achieve the gripping function by rotating.

[0068] Since the second gripper 2002 and the first gripper 2001 have reached the front and rear sides of the semiconductor chip carrier 101, as the distance between the first gripper 2001 and the second gripper 2002 decreases, the first gripper 2001 and the second gripper 2002 are able to hold the semiconductor chip carrier 101, and finally move the semiconductor chip carrier 101 out of the placement position of the analog device 100.

[0069] Additionally, refer to Figure 8 Step S200: The clamping unit 200 extends horizontally into the placement position of the analog device 100 and clamps the semiconductor chip carrier 101, which may include, but is not limited to, the following steps: In step S230, the first gripper 2001 moves to the bottom of the semiconductor chip carrier 101, and the second gripper 2002 moves to the top of the semiconductor chip carrier 101. In step S240, the first gripper 2001 and the second gripper 2002 clamp the semiconductor chip carrier 101.

[0070] In some examples, in the above embodiments, both the second gripper 2002 and the first gripper 2001 grip the front and rear sides of the semiconductor chip carrier 101. The first gripper 2001 and the second gripper 2002 can also employ other gripping methods. In this embodiment, the first gripper 2001 and the second gripper 2002 can grip the top and bottom of the semiconductor chip carrier 101. Here, the top of the semiconductor chip carrier 101 refers to... Figure 1 The top of the positive Z-axis and the bottom of the semiconductor chip carrier 101 refer to... Figure 1 The bottom of the positive Z-axis direction.

[0071] Specifically, the first gripper 2001 corresponds to the bottom of the semiconductor chip carrier 101, and the second gripper 2002 corresponds to the top of the semiconductor chip carrier 101. It is understood that in this embodiment, there is a height difference between the first gripper 2001 and the second gripper 2002. When the clamping unit 200 is adjusted to the height corresponding to the placement position by the winding and unwinding device, the clamping unit 200 extends into the placement position, causing the first gripper 2001 to extend into the bottom of the semiconductor chip carrier 101, while the second gripper 2002 reaches the top of the semiconductor chip carrier 101. As the distance between the first gripper 2001 and the second gripper 2002 decreases, the first gripper 2001 and the second gripper 2002 are able to clamp the semiconductor chip carrier 101, ultimately removing the semiconductor chip carrier 101 from the simulation device 100.

[0072] It is worth noting that, in this embodiment, a gap needs to be left between the semiconductor chip carrier 101 and the support surface of the placement position so that the first gripper 2001 can extend into the bottom of the semiconductor chip carrier 101 along the gap.

[0073] Additionally, refer to Figure 9 Step S200: The clamping unit extends horizontally into the placement position of the analog device and clamps the semiconductor chip carrier, which may include, but is not limited to, the following steps: In step S250, the gripper position sensor detects the position of the first gripper 2001 and the second gripper 2002 in real time and transmits the position information of the first gripper 2001 and the second gripper 2002 to the controller. In step S260, the controller controls the first gripper 2001 to move to the rear side of the semiconductor chip carrier 101 according to the position information, and controls the second gripper 2002 to move to the front side of the semiconductor chip carrier 101. Alternatively, the controller controls the first gripper 2001 to move to the bottom of the semiconductor chip carrier 101 according to the position information, and controls the second gripper 2002 to move to the top of the semiconductor chip carrier 101.

[0074] In some examples, the clamping unit 200 is equipped with a gripper position sensor, which is used to detect the position of the first gripper 2001 and the second gripper 2002 in real time and transmit the position information of the first gripper 2001 and the second gripper 2002 to the controller.

[0075] When the gripper position sensor detects that the first gripper 2001 and the second gripper 2002 are in position, the gripper position sensor sends a signal to the controller, and the controller controls the first gripper 2001 and the second gripper 2002 to stop moving according to the signal.

[0076] Specifically, when the second gripper 2002 and the first gripper 2001 are clamping the semiconductor chip carrier 101 at the front and rear, respectively, the gripper position sensor detects whether the first gripper 2001 is in position at the rear of the semiconductor chip carrier 101 and whether the second gripper 2002 is in position at the front of the semiconductor chip carrier 101. When the first gripper 2001 and the second gripper 2002 are clamping the semiconductor chip carrier 101 at the top and bottom, respectively, the gripper position sensor detects whether the first gripper 2001 is in position at the bottom of the semiconductor chip carrier 101 and whether the second gripper 2002 is in position at the top of the semiconductor chip carrier 101.

[0077] Meanwhile, the movement of the clamping unit 200 extending into the placement position is also detected by the corresponding sensors. Therefore, the movement of the clamping unit 200 as a whole, the movement of the first gripper 2001 and the second gripper 2002, and the movement of the crane driving the clamping unit 200 to move can all be controlled by the controller, thereby realizing the dynamic closed-loop control of the entire device of this application and ensuring the accuracy of the semiconductor chip carrier 101 conveying process.

[0078] The embodiments of this application have been described in detail above with reference to the accompanying drawings. However, this application is not limited to the above embodiments. Within the scope of knowledge possessed by those skilled in the art, various changes can be made without departing from the spirit of this application. Furthermore, unless otherwise specified, the embodiments and features described in the embodiments of this application can be combined with each other.

Claims

1. A method of aerial crane delivery of semiconductor wafers, comprising: Applied to an overhead crane, the overhead crane includes a clamping unit for clamping a semiconductor chip carrier, and the method for transporting semiconductor chips via an overhead crane includes: The entire overhead crane is moved so that the clamping unit moves to the position corresponding to the semiconductor chip carrier; The clamping unit extends horizontally into the placement position of the analog device and clamps the semiconductor chip carrier; The clamping unit moves the semiconductor chip carrier out of the placement position of the analog device; The crane moves as a whole to transport semiconductor chip carriers.

2. The semiconductor chip air crane delivery method according to claim 1, wherein, The clamping unit includes a first gripper and a second gripper. The clamping unit extends horizontally into the placement position of the analog device and clamps the semiconductor chip carrier, including: The first gripper moves to the rear of the semiconductor chip carrier, and the second gripper moves to the front of the semiconductor chip carrier; The first and second grippers hold the semiconductor chip carrier.

3. The semiconductor chip air crane delivery method of claim 2, wherein, The first and second grippers hold a semiconductor chip carrier, including: The first gripper is fixed in position, and the second gripper reduces the distance between itself and the first gripper by moving horizontally, so that the first gripper and the second gripper can hold the semiconductor chip carrier.

4. The semiconductor chip air crane delivery method of claim 2, wherein The first and second grippers hold a semiconductor chip carrier, including: The second gripper is fixed in position, and the first gripper reduces the distance between itself and the second gripper by moving horizontally, so that the first gripper and the second gripper can hold the semiconductor chip carrier.

5. The semiconductor chip air crane delivery method of claim 2, wherein, The first gripper moves to the rear side of the semiconductor chip carrier, and the second gripper moves to the front side of the semiconductor chip carrier, including: The first gripper avoids the semiconductor chip carrier by rotating; The clamping unit extends horizontally into the placement position of the analog device, so that the second gripper reaches the front side of the semiconductor chip carrier; The first gripper rotates to reach the rear of the semiconductor chip carrier.

6. The method for transporting semiconductor chips by overhead crane according to claim 1, characterized in that, The clamping unit includes a first gripper and a second gripper. The clamping unit extends horizontally into the placement position of the analog device and clamps the semiconductor chip carrier, including: The first gripper moves to the bottom of the semiconductor chip carrier, and the second gripper moves to the top of the semiconductor chip carrier; The first and second grippers hold the semiconductor chip carrier.

7. The method for transporting semiconductor chips by overhead crane according to claim 2 or 6, characterized in that, The clamping unit is equipped with a gripper position sensor. The clamping unit extends horizontally into the placement position of the analog device and clamps the semiconductor chip carrier, including: The gripper position sensor detects the positions of the first gripper and the second gripper in real time and transmits the position information of the first gripper and the second gripper to the controller; The controller controls the first gripper to move to the rear of the semiconductor chip carrier based on the position information, and controls the second gripper to move to the front of the semiconductor chip carrier; or the controller controls the first gripper to move to the bottom of the semiconductor chip carrier based on the position information, and controls the second gripper to move to the top of the semiconductor chip carrier.

8. The method for transporting semiconductor chips by overhead crane according to claim 1, characterized in that, The crane moves as a whole to move the clamping unit to a position corresponding to the semiconductor chip carrier, including: The overhead crane adjusts the horizontal position of the clamping unit by moving in the first direction, so that the horizontal position of the clamping unit corresponds to the placement position of the simulation equipment; The overhead crane adjusts the height of the clamping unit by moving in the second direction, so that the height of the clamping unit corresponds to the placement position of the simulation equipment.

9. The method for transporting semiconductor chips by overhead crane according to claim 8, characterized in that, The overhead crane or simulation equipment is equipped with a fixing device for positioning the clamping unit. The overhead crane moves as a whole to move the clamping unit to a position corresponding to the semiconductor chip carrier, including: The overhead crane adjusts the horizontal position of the clamping unit by moving in the first direction, so that the horizontal position of the clamping unit corresponds to the placement position of the simulation equipment; The overhead crane moves in the second direction to reach the fixing device, which positions the clamping unit so that the height of the clamping unit corresponds to the placement position of the simulation equipment.

10. The method for transporting semiconductor chips by overhead crane according to claim 8, characterized in that, The overhead crane adjusts the horizontal position of the clamping unit by moving in the first direction, so that the horizontal position of the clamping unit corresponds to the placement position of the simulation equipment, including: The horizontal position of the clamping unit is detected by computer vision and / or sensors, and the horizontal position information of the clamping unit is transmitted to the controller; The controller moves the clamping unit to a horizontal position corresponding to the placement position of the analog device.

11. The method for transporting semiconductor chips by overhead crane according to claim 8, characterized in that, The overhead crane adjusts the height of the clamping unit by moving in the second direction, so that the height of the clamping unit corresponds to the placement position of the analog equipment, including: The height position of the clamping unit is detected by computer vision and / or sensors, and the height position information of the clamping unit is transmitted to the controller; The controller moves the clamping unit to the height position corresponding to the placement position of the analog device.

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