A suspended lighting fixture and method of use thereof

Abstract

This invention relates to the field of lighting technology and discloses a suspended lighting fixture and its usage method. The fixture includes: a top cover, a base, a mounting bracket, a lamp bracket, a receiving slot, a control circuit board, a conductive component, a cavity, and a lighting body. The base has a top cover, and both the base and the top cover have a cavity. The control circuit board is placed within the cavity, and a conductive component is mounted on the control circuit board. The base has a mounting bracket and a receiving slot, and the lighting body has a lamp bracket. The receiving slot accommodates and places the lighting body, and the mounting bracket and the lamp bracket are interconnected. The conductive component is electrically connected to the power terminal of the lighting body. This lighting fixture design achieves multi-functionality, intelligent control, good stability, and easy installation on load-bearing objects. The design and use of microLED beads can reduce energy consumption and heat generation. Furthermore, research on plant distance can determine the optimal distance or lighting intensity for plants.

Description

Technical Field

[0001] This invention relates to the field of lighting technology, specifically to a suspended lighting fixture and its method of use. Background Technology

[0002] In industry and daily life, people use lighting fixtures to illuminate spaces. Since Edison invented the lamp, it has been widely used in people's lives. As time went on, people discovered that lamps could provide light to green plants, just like the sun, and that the heat they generated could also provide warmth. People gradually began to place lamps in indoor greenhouses to provide light for plants to photosynthesize. The lighting fixtures on the market are too simple and widely used without specific targeting. Some greenhouses use ordinary lighting fixtures to provide light for plants, unaware that this light may not be necessary for the plants and could have a counterproductive effect, harming their growth or even causing them to die. Furthermore, existing lighting fixtures generate significant heat and consume a lot of energy, affecting plant growth and increasing production costs. Also, lighting fixtures generally require a fixture holder to protect and stabilize them. Currently, various types of fixture holders are available on the market, including round and square ones, but these fixtures have limited functionality and poor stability. During use, if touched, the fixture can wobble significantly, affecting its lighting performance.

[0003] Therefore, existing lighting fixture technologies need further improvement to address the above issues. Summary of the Invention

[0004] The purpose of this invention is to overcome the problems of existing lighting fixtures, such as limited functionality, poor stability, and difficulty in mounting on supports; as well as the high heat generated during manufacturing, mismatch between the light source and plant growth requirements, high energy consumption, and high cost. Through a rational design of the lighting fixture, incorporating a top cover, base, mounting bracket, lamp connector, receiving slot, control circuit board, conductive components, cavity, and lighting body, the invention achieves multifunctionality, intelligent control, good stability, and easy mounting on supports. The design and use of micro LED beads can reduce energy consumption and heat generation; and research on plant distance can determine the appropriate distance or lighting intensity under different conditions.

[0005] The specific technical solution of the present invention is as follows:

[0006] A suspended lighting fixture and its method of use are disclosed. The lighting fixture includes: a top cover, a base, a base connector, a lamp connector, a receiving groove, a control circuit board, a conductive component, a cavity, and a lighting body. The top cover is provided on the base, and the cavity is provided inside the base and the top cover. The control circuit board is placed in the cavity, and the conductive component is provided on the control circuit board. The base has the base connector and the receiving groove, and the lighting body has the lamp connector. The receiving groove is used to accommodate and place the lighting body, and the base connector and the lamp connector are connected to each other. The conductive component is electrically connected to the power terminal of the lighting body.

[0007] Furthermore, the top cover and the base are connected by snap-fit, screw thread, or adhesive bonding.

[0008] Furthermore, the top cover is made of plastic.

[0009] Furthermore, the top cover is provided with top cover reinforcing ribs.

[0010] Furthermore, the top cover reinforcing ribs are arranged in a grid pattern.

[0011] Furthermore, the top cover is arranged symmetrically with respect to its central axis.

[0012] Furthermore, the connection between the seat connector and the lamp connector can be a snap-fit ​​connection, a threaded connection, or a welded connection.

[0013] Furthermore, the connection between the seat connector and the lamp connector is a snap-fit ​​connection;

[0014] The seat connector is selected as a slot, and the lamp connector is selected as a buckle;

[0015] Alternatively, the seat connector may be a buckle, and the lamp connector may be a slot.

[0016] Furthermore, at least two of both the seat connector and the lamp connector are selected.

[0017] Furthermore, the seat connector and the lamp connector are selected from one or more of the slot and the buckle.

[0018] Furthermore, the seat connector is disposed in the middle of the base, and the lamp connector is disposed in the middle of the lighting body.

[0019] Furthermore, the base connector is symmetrically arranged about the central axis of the base, and the lamp connector is symmetrically arranged about the central axis of the lighting body.

[0020] Furthermore, a grounding spring is electrically connected to the control circuit board, the grounding spring passing through the base and electrically connected to the grounding terminal of the lighting body.

[0021] Furthermore, at least two grounding springs are selected.

[0022] Furthermore, the grounding spring is arranged symmetrically about the central axis of the base.

[0023] Furthermore, at least two receiving slots are selected.

[0024] Furthermore, the receiving groove is selected as an elongated groove.

[0025] Furthermore, the receiving grooves are provided at both ends of the base.

[0026] Furthermore, the cavity is disposed on the base.

[0027] Furthermore, the receiving groove is arranged symmetrically about the central axis of the base.

[0028] Furthermore, the receiving groove has a groove wall, and the groove wall is provided with reinforcing ribs and / or reinforcing blocks, which are used to enhance the mechanical strength of the groove wall, etc.

[0029] Furthermore, the reinforcing ribs and / or reinforcing blocks are all disposed on the outer side of the groove wall.

[0030] Furthermore, the base, seat connector, receiving groove, and cavity are all made of plastic.

[0031] Furthermore, the base, seat connector, receiving groove, and cavity are integrally injection molded.

[0032] Furthermore, the conductive element is disposed in the middle of the base.

[0033] Furthermore, the conductive element is disposed between at least two of the grounding springs.

[0034] Furthermore, the base, seat connector, receiving groove and cavity, as well as the reinforcing ribs and / or reinforcing blocks are all made of plastic.

[0035] Furthermore, the base, seat connector, receiving groove and cavity, as well as the reinforcing ribs and / or reinforcing blocks are integrally injection molded.

[0036] Furthermore, the base, seat connector, receiving groove, conductive component, cavity, and reinforcing ribs and / or reinforcing blocks are integrally injection molded.

[0037] Furthermore, the top cover is provided with through holes and / or magnets and / or hanging buckles, that is: the through holes are used to install the lamp holder onto the supporting object with bolts, the magnets are used to attract the lamp holder onto the iron supporting object, and the hanging buckles are used to suspend the lamp holder onto the supporting object.

[0038] Furthermore, the lighting body is selected as a micro-LED type lighting body.

[0039] Furthermore, the micro-LED of the lighting body is electrically connected to the lamp plate on which it is located.

[0040] Furthermore, the exterior of the lighting body is provided with a light-transmitting protective cover, which is fitted over the micro-LED.

[0041] Furthermore, the light-transmitting protective cover is provided with a light conversion film.

[0042] Furthermore, the micro-LED includes an N-type metal layer, a sapphire layer, a gallium nitride (GaN) layer, an N-type GaN layer, an indium gallium nitride (GaN) / GaN layer, an aluminum gallium nitride (GaN) layer, a P-type GaN layer, an ITO layer, a P-type metal layer, and a silicon dioxide layer. The sapphire layer serves as a substrate, on which the GaN layer is disposed. The N-type GaN layer is disposed on the GaN layer. The N-type GaN layer, the N-type metal layer, the silicon dioxide layer, and the indium gallium nitride / GaN layer are disposed on the N-type GaN layer. The silicon dioxide layer is disposed between the indium gallium nitride / GaN layer and the N-type metal layer. The aluminum gallium nitride layer is disposed on the indium gallium nitride / GaN layer. The P-type GaN layer is disposed on the aluminum gallium nitride layer. The ITO layer is disposed on the P-type GaN layer. The P-type metal layer is disposed on the ITO layer. The N-type metal layer and the P-type metal layer are connected to corresponding external electrodes.

[0043] Furthermore, a method for using a suspended lighting fixture includes the following steps:

[0044] Step 1: Formation of micro-LEDs

[0045] A sapphire substrate is selected as the substrate, and a layer of gallium nitride (GaN) material is deposited on the sapphire substrate. Then, N-type ions are implanted and doped into the upper layer of the GaN material using an ion doping machine. After doping is completed, an N-polar metal material, a silicon dioxide material, and a gallium indium nitride (GaN / GaN) material are deposited on the N-type GaN material, with the silicon dioxide material placed between the GaN / GaN material and the N-polar metal material. A layer of gallium aluminum nitride (GaN / GaN) material is deposited on the GaN / GaN material, and a layer of GaN material is deposited on the GaN / GaN material. Then, P-type ions are implanted and doped into the upper layer of the GaN material using an ion doping machine to form a P-type GaN material. An ITO (indium tin oxide) material is deposited on the P-type GaN material, and a P-polar metal material is deposited on the ITO material. The N-polar metal layer and the P-polar metal layer are then connected to the corresponding external electrodes.

[0046] Step 2: Formation of the lighting body

[0047] Select the micro-LED from step 1, encapsulate it into micro-LED beads, then select a lamp board, arrange the micro-LED beads in a matrix and electrically connect them to the lamp board, then install the lamp board on the lamp holder of the lighting body, and snap a light-transmitting protective cover with a light conversion film onto the lamp holder of the lighting body to protect the micro-LED beads, etc.

[0048] Step 3: Light Fixture Assembly

[0049] Select the lighting body from step 2, then select the top cover, base, base connector, lamp connector, receiving slot, control circuit board, conductive component, and cavity, and assemble them. The base has a top cover, and the base and top cover have cavities. The control circuit board is placed in the cavity, and the control circuit board has conductive components. The base has a base connector and receiving slot, and the lighting body has a lamp connector. The receiving slot is used to accommodate and place the lighting body, and the base connector and lamp connector are connected to each other. The conductive component is electrically connected to the power terminal of the lighting body, thus completing the assembly of the lamp.

[0050] Step 4: Lighting installation

[0051] Select the light fixture from step 3, then select a walk-in plant growth chamber. Install the light fixture on the adjustable and height-adjustable bracket inside the walk-in plant growth chamber. Plant plants inside the walk-in plant growth chamber, and then set the light fixture. The light fixture is parallel to the plane where the plant is being illuminated. Adjust the distance between the light fixture and the plant being illuminated by adjusting the height-adjustable bracket.

[0052] Step 5: Creating the Plant Growth Chamber Environment

[0053] Select the walk-in plant growth chamber with lights and plants from step 4, and prepare the environment for the walk-in plant growth chamber. Use the air conditioner in the walk-in plant growth chamber to maintain a daytime temperature of about 23°C and a nighttime temperature of about 22°C, a daytime relative humidity of about 70% and a nighttime relative humidity of about 80%, a daytime carbon dioxide injection of about 800 μmol / mol and a nighttime carbon dioxide injection of about 400 μmol / mol. After the plants have grown for 10 days, observe and test them.

[0054] Further, the control circuit board includes a control circuit, which includes: a power input interface D501, which has terminals 1 / 2 / 3 / 4; terminal 4 of mutual inductor L503 is connected to terminal 3 of power input interface D501; terminal 1 of mutual inductor L503 is connected to terminal 2 of power input interface D501; terminal 3 of mutual inductor L503 is connected to one end of capacitor C503, one end of capacitor C504, and terminal 4 of mutual inductor L502; terminal 2 of mutual inductor L503 is connected to one end of capacitor C506, the other end of capacitor C504, and terminal 1 of mutual inductor L502; the other end of capacitor C503 and the other end of capacitor C506 are grounded together; and terminal 3 of mutual inductor L502 is connected to capacitor C506. One end of the circuit 01 connects to terminal "1" of mutual inductor L501. Terminal "2" of mutual inductor L502 connects to the other end of capacitor C501 and terminal "4" of mutual inductor L501. Terminal "2" of mutual inductor L501 connects to one end of resistor R501, one end of capacitor C502, one end of resistor R526, one end of capacitor C562, and the ZC6 interface. The other end of resistor R501 connects to one end of resistor R502. The other end of resistor R502 connects to one end of resistor R503. Terminal "3" of mutual inductor L501 connects to the other end of resistor R503, the other end of capacitor C502, the other end of resistor R526, one end of capacitor C561, and one end of fuse FU501. The other end of fuse FU501 connects to the ZC5 interface. The other end of capacitor C561 connects to... The other end of capacitor C562 is grounded; terminal "4" of power input interface D501 is grounded; terminal "1" of power input interface D501 is connected to one end of capacitor C505, one end of resistor R507, one end of inductor L504, and one end of capacitor C503. The other end of capacitor C505 is grounded; the other end of capacitor C563 is connected to one end of resistor R530, one end of resistor R527, one end of resistor R528, and ground; the other end of inductor L504 is connected to one end of capacitor C516, one end of resistor R515, one end of capacitor C518, one end of capacitor C519, and one end of inductor L508. The other end of capacitor C516 is grounded; the other ends of resistor R515, capacitor C518, and capacitor C519 are all connected to resistor R57. Terminal 0 of resistor R507 is connected to one end of resistor R571 and one end of resistor R572. The other ends of resistors R570, R571, and R572 are connected to the cathode of diode D504. The other end of resistor R507 is connected to one end of resistor R508. The other end of resistor R508 is connected to one end of capacitor C552 and one end of capacitor C514. The other ends of capacitors C552 and C514 are grounded. Terminal 1 of chip N501 is connected to one end of capacitor C512. The other end of capacitor C512 is grounded. Terminal 2 of chip N501 is connected to one end of resistor R511 and one end of capacitor C508. The other end of capacitor C508 is grounded. The other end of resistor R511 is connected to one end of capacitor C515. The other end of capacitor C515 is grounded.Terminal 3 of chip N501 is connected to one end of capacitor C511, one end of resistor R514, and one end of resistor R520. The other end of resistor R514 and the other end of capacitor C511 are grounded. Terminal 4 of chip N501 is connected to one end of capacitor C517 and one end of resistor R510. The other end of capacitor C517 is grounded. Terminal 5 of chip N501 is grounded. Terminal 6 of chip N501 is connected to one end of resistor R516. The other end of resistor R516 is connected to the cathode of diode D515 and one end of resistor R512. The other end of resistor R512 is connected to one end of resistor R509, the anode of diode D515, and the gate of NMOS transistor V501. The drain of NMOS transistor V501 is connected to one end of capacitor C507 and diode D504. The positive terminal of capacitor C507 is connected to the source of NMOS transistor V501 and the other end of resistor R509. Terminal 7 of chip N501 is connected to one end of capacitor C533, one end of capacitor C509, one end of capacitor C510, and the negative terminal of diode D503. The positive terminal of diode D503 is connected to one end of resistor R518. The other end of resistor R518 is connected to one end of resistor R560. The other end of resistor R560 is connected to one end of resistor 519. The other end of resistor R519 is connected to the other end of resistor R520. The other ends of capacitors C510 and C533 are grounded. Terminal 8 of chip N501 is connected to one end of resistor R513. The other end of resistor R513 is connected to one end of capacitor C513 and one end of resistor R517. 3. The other end is connected to the other end of capacitor C509, one end of resistor R506, and one end of resistor R505, and grounded. The other ends of resistor R506 and R505 are connected to the source of NMOS transistor V501 and one end of resistor R510. The other end of resistor R510 is connected to terminal "4" of chip N501. Terminal "10" of chip N501 is connected to the other end of resistor R508. The other end of resistor R517 is connected to the negative terminal of diode D505, one end of capacitor C520, and terminal "1" of optocoupler N502. Terminal "2" of optocoupler N502, the positive terminal of diode D505, and the other end of capacitor C520 are all grounded. Terminal "3" of optocoupler N502 is connected to one end of resistor R522. The other end of resistor R522 is connected to "PW". The M-interface is connected as follows: Optocoupler N502's "4" terminal is grounded; one end of inductor L510 is grounded; the other end of inductor L510 is connected to one end of capacitor C522; the other end of capacitor C522 is connected to one end of inductor L511; the other end of inductor L511 is grounded; transformer T501's "10" terminal is grounded; transformer T501's "9" terminal is connected to the other end of resistor R518; transformer T501's "8" terminal is connected to the positive terminal of diode D504; transformer T501's "7" terminal is connected to one end of inductor L508; the other end of inductor L508 is connected to one end of capacitor C529; the other end of capacitor C529 is connected to one end of inductor L509; the other end of inductor L509 is connected to transformer T501's "4" and "3" terminals and ground.Transformer T501 connects terminals "6" and "5" to the positive terminal of diode D508, one end of resistor R524, and one end of resistor R525. The other ends of resistors R524 and R525 are connected to one end of capacitor C527. The other end of capacitor C527 is connected to the negative terminal of diode D508, one end of resistor R530, one end of resistor R527, one end of resistor R528, one end of capacitor C528, one end of capacitor C531, one end of capacitor C532, one end of capacitor C534, and one end of inductor L506. The other ends of resistors R530, R527, and R528 are grounded. The other ends of capacitors C528, C531, C532, and C534 are grounded. The circuit is grounded. The other end of inductor L506 is connected to one end of resistor R529, one end of resistor R541, one end of capacitor C540, one end of capacitor C541, and the "55V+" terminal. The other end of resistor R529 is grounded, the other end of resistor R541 is grounded, and the other ends of capacitors C540 and C541 are grounded. The source of NMOS transistor V504 is grounded, the drain of NMOS transistor V504 is connected to the "LED-" terminal, and the gate of NMOS transistor V504 is connected to one end of capacitor C538, one end of resistor R545, and one end of resistor R547. The other end of resistor R547 is connected to the "ON" terminal, and the other ends of capacitor C538 and resistor R545 are both grounded. The "1" terminal of chip N507 is connected to the "ON" terminal via resistor R548. The N507 chip's terminals "Rxd" are connected to terminals "DE" via resistor R549. Terminal "4" is connected to terminal "Txd" via resistor R550. Terminal "5" is grounded. Terminal "6" is connected to one end of resistor R558 and one end of resistor R567. The other end of resistor R567 is connected to terminal "AO" and the negative terminal of Zener diode D513. The positive terminal of Zener diode D513 is grounded. Terminal "7" is connected to one end of resistor R557, one end of resistor R566, and terminal "BO". The other end of resistor R557 is grounded. Terminal "8" is connected to one end of capacitor C544, the other end of resistor R558, and resistor R566. The other end of capacitor C544 is connected to the "5V0" terminal, and the other end of capacitor C544 is grounded. Terminal "1" of chip N504 is connected to one end of capacitor C559. The other end of capacitor C559 is connected to one end of resistor R542. The other end of resistor R542 is connected to terminal "6" of chip N504. Terminal "2" of chip N504 is grounded. Terminal "3" of chip N504 is connected to one end of resistor R540. The other end of resistor R540 is grounded. Terminal "4" of chip N504 is connected to one end of capacitor C558, one end of resistor R539, and one end of resistor R538. The other ends of capacitor C558 and resistor R539 are both grounded. The other end of resistor R538 is connected to one end of capacitor C556 and terminal "5" of chip N504. The other end of capacitor C556 is grounded.Terminal 6 of chip N504 is connected to one end of inductor L507, the cathode of diode D514, and the other end of resistor R542. The other end of inductor L507 is connected to one end of capacitor C560, one end of capacitor C557, one end of capacitor C555, one end of resistor R537, and the +12V terminal. Resistors R537 and R536 are connected in series and to the other end of capacitor C555 and terminal 3 of chip N504. The +12V terminal is connected through a Zener diode. N506 is connected to the "5V0" terminal; terminal "1" of chip N508 is connected to the "5V0" terminal, terminal "2" of chip N508 is connected to the "DE" terminal, terminal "4" of chip N508 is connected to one end of resistor R565, the other end of resistor R565 is connected to the base of NPN transistor V508 and one end of resistor R564, the emitter of NPN transistor V508 and the other end of resistor R564 are grounded together, and the collector of NPN transistor V508 is connected to resistor R56. 3. One end of resistor R563 is connected to the gate of NMOS transistor V507, and one end of resistor R562. The source of NMOS transistor V507 and the other end of resistor R562 are connected to the "55V+" terminal. The drain of NMOS transistor V507 is connected to the "55V_SW" terminal. The cathode of diode D509 is connected to one end of inductor L902, and the other end of inductor L902 is connected to the "W+" terminal. The anode of diode D509 is connected to the "W-" terminal. The anode of inductor L904 is connected to one end of inductor L904, and the other end of inductor L904 is connected to the "LED-" terminal. Terminal 5 of chip N508 is connected to the "ON" terminal through V505. Terminal 6 of chip N508 is connected to LED501. Terminal 13 of chip N508 is connected to the "PWM" terminal. Terminal 12 of chip N508 is connected to the "Rxd" terminal. Terminal 11 of chip N508 is connected to the "Txd" terminal. The "55V_SW" terminal is connected to the auxiliary circuit.

[0055] Beneficial effects

[0056] This invention, through the rational design of lighting fixtures, employs a top cover, base, mounting bracket, lamp bracket, receiving slot, control circuit board, conductive components, cavity, and lighting body. This achieves multi-functionality, intelligent control, good stability, and easy installation on load-bearing surfaces. The interlocking connection between the mounting bracket and lamp bracket allows for quick and easy installation and removal of the lighting body and base, while also ensuring a secure installation of the lighting body. The design and use of micro LED beads reduces energy consumption and heat generation; and research on plant distance allows for determining the appropriate distance or lighting intensity under different conditions. Attached Figure Description

[0057] Figure 1 This is a schematic diagram of the lamp holder structure of a suspended lighting fixture and its usage method according to the present invention.

[0058] Figure 2This is an exploded structural diagram of a suspended lighting fixture and its usage method according to the present invention.

[0059] Figure 3 This is a schematic diagram of the top cover structure of a suspended lighting fixture and its usage method according to the present invention.

[0060] Figure 4 This is a structural schematic diagram from another perspective of the suspended lighting fixture and its usage method according to the present invention.

[0061] Figure 5 This is a structural schematic diagram of a suspended lighting fixture and its usage method according to the present invention.

[0062] Figure 6 This is a cross-sectional structural diagram of a suspended lighting fixture and its usage method according to the present invention.

[0063] Figure 7 This is a schematic diagram illustrating different lighting distances for a suspended lighting fixture and its usage method according to the present invention.

[0064] Figure 8 This is a CCD image of a suspended lighting fixture and its usage method, representing an energy-saving aspect of lighting plants according to the present invention.

[0065] Figure 9 This is a CCD image of a suspended lighting fixture and its usage method for increasing the yield of plants, according to the present invention.

[0066] Figure 10 This invention relates to a suspended lighting fixture and its usage method, showing the relationship between the distance to the illuminated plants and the utilization rate of fresh matter and energy consumption in terms of yield increase.

[0067] Figure 11 This invention relates to a suspended lighting fixture and its usage method, showing the relationship between the distance to the illuminated plants and the dry matter and energy consumption utilization rate in terms of increasing yield.

[0068] Figure 12 This invention relates to the relationship between the distance to the illuminated plants and the fresh material and energy consumption utilization rate in terms of the energy-saving aspects of a suspended lighting fixture and its usage method.

[0069] Figure 13 This invention relates to the relationship between the distance to the lighting plants and the dry matter and energy consumption efficiency in the energy-saving aspect of a suspended lighting fixture and its usage method.

[0070] Figure 14 This is a structural diagram of a micro-LED for a suspended lighting fixture according to the present invention.

[0071] Figure 15 Figure 1 shows the control circuit of a suspended lighting fixture according to the present invention.

[0072] Figure 16 Figure 2 shows the control circuit of a suspended lighting fixture according to the present invention.

[0073] Figure 17 Figure 3 shows the control circuit of a suspended lighting fixture according to the present invention.

[0074] Figure 18 Figure 4 shows the control circuit of a suspended lighting fixture according to the present invention.

[0075] Reference numerals: 1. Lamp holder; 2. Lighting body; 01. Top cover; 02. Base; 03. Control circuit board; 11. Magnet; 21. Receiving slot; 22. Leaving slot; 23. Conductive component; 24. Grounding spring; 25. Reinforcing block; 26. Socket connector; 27. Lamp connector. 201. P-type metal layer; 202. ITO layer; 203. P-type gallium nitride layer; 204. Gallium nitride aluminum layer; 205. Gallium nitride indium / gallium nitride layer; 206. N-type gallium nitride layer; 207. Gallium nitride layer; 208. Sapphire layer; 209. Silicon dioxide layer; 210. N-type metal layer. Detailed Implementation

[0076] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0077] See Figures 1-6 As shown, the present invention provides a suspended lighting fixture and its usage method. The lighting fixture includes: a top cover 01, a base 02, a seat connector 26, a lamp connector 27, a receiving groove 21, a control circuit board 03, a conductive element 23, a cavity, and a lighting body 2. The top cover 01, base 02, seat connector 26, receiving groove 21, control circuit board 03, conductive element 23, and cavity form a lamp holder 1. The top cover 01 is provided on the base 02, and a cavity is provided inside the base 02 and the top cover 01. The cavity is located on the base 02 and a control circuit board 03 is placed inside the cavity. The control circuit board 03 is provided with a conductive element 23 and a grounding spring 24. The seat connector 26 and the receiving groove 21 are provided on the base 02. The lighting body 2 is provided with a lamp connector 27. The receiving groove 21 is used to accommodate and place the lighting body 2. The seat connector 26 and the lamp connector 27 are connected to each other. The conductive element 23 is electrically connected to the power terminal of the lighting body 2.

[0078] The top cover 01 and the base 02 are connected by screw threads. The top cover 01 is made of plastic and has a top cover reinforcing rib. The top cover reinforcing rib is set in a grid. The top cover 01 is symmetrical about its central axis. The top cover 01 and its top cover reinforcing rib are integrally injection molded.

[0079] Two base connectors 26 are selected, both with snap-fit ​​design; two lamp connectors 27 are selected, both with slot design. The base connectors 26 are located in the middle of the base 02 and are symmetrically arranged about the central axis of the base 02. The lamp connectors 27 are located in the middle of the lighting body 2 and are symmetrically arranged about the central axis of the lighting body 2. Two receiving slots 21 are selected and located at both ends of the base 02 and are symmetrically arranged about the central axis of the base 02. A clearance slot 22 is provided between the two receiving slots 21. Each receiving slot 21 has a slot wall with reinforcing blocks 25 on it to enhance the mechanical strength of the slot wall. The reinforcing blocks 25 are all located on the outer side of the slot wall. A grounding spring 24 is electrically connected to the control circuit board. The grounding spring 24 passes through the base and is electrically connected to the grounding terminal of the lighting body 2. Two grounding springs 24 are selected and are symmetrically arranged about the central axis of the base.

[0080] The conductive element 23 is disposed in the middle of the base 02 and is disposed between the two grounding springs 24.

[0081] The base 02, the seat connector 26, the receiving groove 21 and the cavity, and the reinforcing block 25 are all made of plastic, and the base 02, the seat connector 26, the receiving groove 21 and the cavity, and the reinforcing block 25 are integrally injection molded.

[0082] The conductive component 23 is made of copper, and the grounding spring 24 is made of phosphor bronze. The conductive component 23 and the grounding spring 24 are bonded to the base 02 in a secondary coating process; that is, the conductive component 23 and the grounding spring 24 are first coated, and then bonded to the base 02 in a secondary coating process.

[0083] The top cover 01 is provided with a through hole and / or a magnet 11 and / or a hanging buckle. Specifically, the through hole is used to install the lamp holder onto the support object with bolts, the magnet 11 is used to attract the lamp holder onto the iron support object, and the hanging buckle is used to suspend the lamp holder onto the support object. In other words, after the lighting fixture is assembled, it can be installed onto the support object by inserting a screw into the through hole, or it can be attracted onto the iron support object by the magnet.

[0084] The lighting body is a micro-LED type, with the micro-LED electrically connected to the lamp board on which it is located. The outside of the lighting body is equipped with a light-transmitting protective cover, which is fitted over the micro-LED. The light-transmitting protective cover is equipped with a light conversion film.

[0085] Among them, see Figure 14 As shown, the micro-LED includes an N-type metal layer 210, a sapphire layer 208, a gallium nitride layer 207, an N-type gallium nitride layer 206, an indium gallium nitride / gallium nitride layer 205, an aluminum gallium nitride layer 204, a p-type gallium nitride layer 203, an ITO layer 202, a p-type metal layer 201, and a silicon dioxide layer 209. The sapphire layer 208 serves as the substrate, and the gallium nitride layer 207 is disposed on the sapphire layer 208. The N-type gallium nitride layer 206 is disposed on the gallium nitride layer 207, and N-type gallium nitride layers are disposed on the N-type gallium nitride layer 206. The system comprises an N-polar metal layer 210, a silicon dioxide layer 209, and an indium gallium nitride (GaN) / gallium nitride (GaN) layer 205. The silicon dioxide layer 209 is disposed between the GaN / GaN layer 205 and the N-polar metal layer 210. The GaN / GaN layer 205 has an aluminum gallium nitride (GaN) layer 204, the aluminum gallium nitride (GaN) layer 204 has a P-type GaN layer 203, the P-type GaN layer 203 has an ITO layer 202, and the ITO layer 202 has a P-polar metal layer 201. The N-polar metal layer 210 and the P-polar metal layer 201 are connected to corresponding external electrodes.

[0086] One method for using a suspended lighting fixture includes the following steps:

[0087] Step 1: Formation of micro-LEDs

[0088] A sapphire substrate is selected as the substrate, and a layer of gallium nitride (GaN) material is deposited on the sapphire substrate. Then, N-type ions are implanted and doped into the upper layer of the GaN material using an ion doping machine. After doping is completed, an N-type metal material, a silicon dioxide material, and a gallium indium nitride (GaN / GaN) material are deposited on the N-type GaN material, with the silicon dioxide material placed between the GaN / GaN material and the N-type metal material. A layer of gallium aluminum nitride (GaN / GaN) material is deposited on the GaN / GaN material, and a layer of GaN material is deposited on the GaN / GaN material. Then, P-type ions are implanted and doped into the upper layer of the GaN material using an ion doping machine to form a P-type GaN material. An ITO (indium tin oxide) material is deposited on the P-type GaN material, and a P-type metal material is deposited on the ITO material. The N-type metal layer and the P-type metal layer are then connected to the corresponding external electrodes.

[0089] Step 2: Formation of the lighting body

[0090] Select the micro-LED from step 1, encapsulate it into micro-LED beads, then select a lamp board, arrange the micro-LED beads in a matrix and electrically connect them to the lamp board, then install the lamp board on the lamp holder of the lighting body, and snap a light-transmitting protective cover with a light conversion film onto the lamp holder of the lighting body to protect the micro-LED beads, etc.

[0091] Step 3: Light Fixture Assembly

[0092] Select the lighting body from step 2, then select the top cover, base, base connector, lamp connector, receiving slot, control circuit board, conductive component, and cavity, and assemble them. The base has a top cover, and the base and top cover have cavities. The control circuit board is placed in the cavity, and the control circuit board has conductive components. The base has a base connector and receiving slot, and the lighting body has a lamp connector. The receiving slot is used to accommodate and place the lighting body, and the base connector and lamp connector are connected to each other. The conductive component is electrically connected to the power terminal of the lighting body, thus completing the assembly of the lamp.

[0093] Step 4: Lighting installation

[0094] Select the light fixture from step 3, then select a walk-in plant growth chamber. Install the light fixture on the adjustable and height-adjustable bracket inside the walk-in plant growth chamber. Plant plants inside the walk-in plant growth chamber, and then set the light fixture. The light fixture is parallel to the plane where the plant is being illuminated. Adjust the distance between the light fixture and the plant being illuminated by adjusting the height-adjustable bracket.

[0095] Step 5: Creating the Plant Growth Chamber Environment

[0096] Select the walk-in plant growth chamber with lights and plants from step 4, and prepare the environment for the walk-in plant growth chamber. Use the air conditioner in the walk-in plant growth chamber to maintain a daytime temperature of about 23°C and a nighttime temperature of about 22°C, a daytime relative humidity of about 70% and a nighttime relative humidity of about 80%, a daytime carbon dioxide injection of about 800 μmol / mol and a nighttime carbon dioxide injection of about 400 μmol / mol. After the plants have grown for 10 days, observe and test them.

[0097] Among them, the photon flux density of the lighting fixtures was adjusted to 160 μmol / m 2 Then, using an adjustable height bracket, the distance between the lighting fixture and the plant (lettuce) surface is adjusted to 15cm, 25cm, 35cm, and 45cm respectively. The light emission angle of the lighting fixture is 120° beam propagation angle, and the lighting fixture emits 9% 448nm blue light (14μmol / m²). 2 ·s), 9% of 530nm green light (14μmol / m 2·s) and 82% of the 627nm red light (132μmol / m 2 A mixture of white light (·s) was used to illuminate lettuce plants, with only the distance between the lights varying and all other conditions remaining constant. Lettuce was allowed to grow for 10 days, and the total energy consumption of the illumination at different distances (15cm, 25cm, 35cm, and 45cm) was measured, along with the corresponding growth status and weight of the lettuce. The amount of fresh or dried biomass produced per kilowatt-hour of electrical energy consumed by the lighting fixture was then calculated, yielding the following results:

[0098] See Figure 7 As shown, the distances between the lighting fixtures and the plants were set to 15cm (A), 25cm (B), 35cm (C), and 45cm (D), respectively.

[0099] See Figure 8 The image shows the growth of lettuce under light at distances of 15cm (D1), 25cm (C1), 35cm (B1), and 45cm (A1). The brightness of the light source increases with increasing distance. It can be seen that the closer the distance, the greener the lettuce and the fewer the red leaves. (See also...) Figure 12 The graph shows the relationship between distance, freshness, and energy efficiency, assuming that the brightness of the lighting also increases with distance. It can be seen that freshness first increases and then decreases with increasing distance, while the corresponding energy efficiency continuously decreases. (See also...) Figure 13 The graph shows the relationship between distance, dry matter content, and energy efficiency, assuming that the brightness of the lighting also increases with distance. It can be seen that the dry matter content first increases and then decreases with increasing distance, while the corresponding energy efficiency continuously decreases.

[0100] See Figure 9 The image shows the growth of lettuce under light at distances of 15cm (D2), 25cm (C2), 35cm (B2), and 45cm (A2). The brightness of the light source remains constant with increasing distance. It can be seen that the closer the distance, the redder the lettuce and the fewer the green leaves. (See also...) Figure 10 The graph shows the relationship between distance, freshness, and energy efficiency, assuming the brightness of the lighting fixture remains constant with increasing distance. It can be seen that freshness decreases with increasing distance, and correspondingly, energy efficiency continuously decreases. (See also...) Figure 11 The graph shows the relationship between distance, dry matter content, and energy efficiency under the condition that the brightness of the lighting lamp remains constant with increasing distance. It can be seen that the dry matter content decreases with increasing distance, and the corresponding energy efficiency continuously decreases.

[0101] The control circuit includes: a power input interface D501 with terminals 1 / 2 / 3 / 4; terminal 4 of mutual inductor L503 is connected to terminal 3 of power input interface D501; terminal 1 of mutual inductor L503 is connected to terminal 2 of power input interface D501; terminal 3 of mutual inductor L503 is connected to one end of capacitor C503, one end of capacitor C504, and terminal 4 of mutual inductor L502; terminal 2 of mutual inductor L503 is connected to one end of capacitor C506, the other end of capacitor C504, and terminal 1 of mutual inductor L502; the other ends of capacitors C503 and C506 are grounded; terminal 3 of mutual inductor L502 is connected to one end of capacitor C501 and terminal 1 of mutual inductor L501; and mutual inductor L50... Terminal "2" of connector D501 connects to the other end of capacitor C501 and terminal "4" of mutual inductor L501. Terminal "2" of mutual inductor L501 connects to one end of resistor R501, one end of capacitor C502, one end of resistor R526, one end of capacitor C562, and the ZC6 interface. The other end of resistor R501 connects to one end of resistor R502, and the other end of resistor R502 connects to one end of resistor R503. Terminal "3" of mutual inductor L501 connects to the other end of resistor R503, the other end of capacitor C502, the other end of resistor R526, one end of capacitor C561, and one end of fuse FU501. The other end of fuse FU501 connects to the ZC5 interface. The other ends of capacitors C561 and C562 are grounded. Terminal "4" of power input interface D501... The power input interface D501's "1" terminal is connected to one end of capacitor C505, one end of resistor R507, one end of inductor L504, and one end of capacitor C503. The other end of capacitor C505 is grounded. The other end of capacitor C563 is connected to one end of resistor R530, one end of resistor R527, one end of resistor R528, and the ground terminal. The other end of inductor L504 is connected to one end of capacitor C516, one end of resistor R515, one end of capacitor C518, one end of capacitor C519, and one end of inductor L508. The other end of capacitor C516 is grounded. The other ends of resistor R515, capacitor C518, and capacitor C519 are connected to one end of resistor R570, one end of resistor R571, and one end of resistor R572. The other end of resistor R570... The other end of resistor R571 and the other end of resistor R572 are connected to the cathode of diode D504. The other end of resistor R507 is connected to one end of resistor R508. The other end of resistor R508 is connected to one end of capacitor C552 and one end of capacitor C514. The other ends of capacitor C552 and C514 are grounded. Terminal "1" of chip N501 is connected to one end of capacitor C512. The other end of capacitor C512 is grounded. Terminal "2" of chip N501 is connected to one end of resistor R511 and one end of capacitor C508. The other end of capacitor C508 is grounded. The other end of resistor R511 is connected to one end of capacitor C515. The other end of capacitor C515 is grounded. Terminal "3" of chip N501 is connected to one end of capacitor C511, one end of resistor R514, and one end of resistor R520.The other end of resistor R514 is grounded, the other end of capacitor C511 is grounded, terminal "4" of chip N501 is connected to one end of capacitor C517 and one end of resistor R510, the other end of capacitor C517 is grounded, terminal "5" of chip N501 is grounded, terminal "6" of chip N501 is connected to one end of resistor R516, the other end of resistor R516 is connected to the cathode of diode D515 and one end of resistor R512, the other end of resistor R512 is connected to one end of resistor R509, the anode of diode D515 and the gate of NMOS transistor V501, the drain of NMOS transistor V501 is connected to one end of capacitor C507 and the anode of diode D504, the other end of capacitor C507 is connected to the source of NMOS transistor V501 and the other end of resistor R509, chip N501... Terminal "7" connects to one end of capacitor C533, one end of capacitor C509, one end of capacitor C510, and the negative terminal of diode D503. The positive terminal of diode D503 is connected to one end of resistor R518. The other end of resistor R518 is connected to one end of resistor R560. The other end of resistor R560 is connected to one end of resistor R519. The other end of resistor R519 is connected to the other end of resistor R520. The other ends of capacitors C510 and C533 are grounded together. Terminal "8" of chip N501 connects to one end of resistor R513. The other end of resistor R513 is connected to one end of capacitor C513 and one end of resistor R517. The other end of capacitor C513 is connected to the other end of capacitor C509, one end of resistor R506, and one end of resistor R505, and is grounded. Resistor R506 is also grounded. One end of resistor R505 is connected to the source of NMOS transistor V501 and one end of resistor R510. The other end of resistor R510 is connected to terminal "4" of chip N501. Terminal "10" of chip N501 is connected to the other end of resistor R508. The other end of resistor R517 is connected to the cathode of diode D505, one end of capacitor C520, and terminal "1" of optocoupler N502. Terminal "2" of optocoupler N502, the anode of diode D505, and the other end of capacitor C520 are all grounded. Terminal "3" of optocoupler N502 is connected to one end of resistor R522. The other end of resistor R522 is connected to the "PWM" interface. Terminal "4" of optocoupler N502 is grounded. One end of inductor L510 is grounded. The other end of inductor L510 is connected to capacitor C. One end of capacitor C522 is connected to one end of inductor L511, and the other end of inductor L511 is grounded. Terminal 10 of transformer T501 is grounded. Terminal 9 of transformer T501 is connected to the other end of resistor R518. Terminal 8 of transformer T501 is connected to the anode of diode D504. Terminal 7 of transformer T501 is connected to one end of inductor L508. The other end of inductor L508 is connected to one end of capacitor C529. The other end of capacitor C529 is connected to one end of inductor L509. The other end of inductor L509 is connected to terminals 4 and 3 of transformer T501 and ground. Terminals 6 and 5 of transformer T501 are connected to the anode of diode D508, one end of resistor R524, and one end of resistor R525.The other ends of resistors R524 and R525 are connected to one end of capacitor C527. The other end of capacitor C527 is connected to the cathode of diode D508, one end of resistor R530, one end of resistor R527, one end of resistor R528, one end of capacitor C528, one end of capacitor C531, one end of capacitor C532, one end of capacitor C534, and one end of inductor L506. The other ends of resistors R530, R527, and R528 are all grounded. The other ends of capacitors C528, C531, C532, and C534 are all grounded. The other end of inductor L506 is connected to one end of resistor R529, one end of resistor R541, one end of capacitor C540, and one end of capacitor C540. One end of chip N507 is connected to the "55V+" terminal; the other end of resistor R529 and resistor R541 are grounded; the other ends of capacitor C540 and capacitor C541 are grounded; the source of NMOS transistor V504 is grounded; the drain of NMOS transistor V504 is connected to the "LED-" terminal; the gate of NMOS transistor V504 is connected to one end of capacitor C538, one end of resistor R545, and one end of resistor R547; the other end of resistor R547 is connected to the "ON" terminal; the other ends of capacitor C538 and resistor R545 are grounded together; the "1" terminal of chip N507 is connected to the "Rxd" terminal through resistor R548; the "2" and "3" terminals of chip N507 are connected to the "DE" terminals through resistor R549; chip N5... Terminal 4 of chip N507 is connected to terminal "Txd" via resistor R550. Terminal 5 of chip N507 is grounded. Terminal 6 of chip N507 is connected to one end of resistor R558 and one end of resistor R567. The other end of resistor R567 is connected to terminal "AO" and the negative terminal of Zener diode D513. The positive terminal of Zener diode D513 is grounded. Terminal 7 of chip N507 is connected to one end of resistor R557 and one end of resistor R566 and terminal "BO". The other end of resistor R557 is grounded. Terminal 8 of chip N507 is connected to one end of capacitor C544, the other end of resistor R558, the other end of resistor R566, and terminal "5V0". The other end of capacitor C544 is grounded. Terminal 1 of chip N504 is connected to capacitor C559. At one end, the other end of capacitor C559 is connected to one end of resistor R542. The other end of resistor R542 is connected to terminal 6 of chip N504. Terminal 2 of chip N504 is grounded. Terminal 3 of chip N504 is connected to one end of resistor R540. The other end of resistor R540 is grounded. Terminal 4 of chip N504 is connected to one end of capacitor C558, one end of resistor R539, and one end of resistor R538. The other ends of capacitor C558 and resistor R539 are grounded together. The other end of resistor R538 is connected to one end of capacitor C556 and terminal 5 of chip N504. The other end of capacitor C556 is grounded. Terminal 6 of chip N504 is connected to one end of inductor L507, the cathode of diode D514, and the other end of resistor R542.The other end of inductor L507 is connected to one end of capacitor C560, one end of capacitor C557, one end of capacitor C555, one end of resistor R537, and the "+12V" terminal. Resistors R537 and R536 are connected in series and connected to the other end of capacitor C555 and terminal "3" of chip N504. The "+12V" terminal is connected to the "5V0" terminal through Zener diode N506. Terminal "1" of chip N508 is connected to the "5V0" terminal, terminal "2" of chip N508 is connected to the "DE" terminal, terminal "4" of chip N508 is connected to one end of resistor R565, the other end of resistor R565 is connected to the base of NPN transistor V508 and one end of resistor R564, the emitter of NPN transistor V508 and the other end of resistor R564 are grounded together, the collector of NPN transistor V508 is connected to one end of resistor R563, and the other end of resistor R563 is connected to NMOS transistor V50. 7. The gate of NMOS transistor V507 and one end of resistor R562 are connected to the "55V+" terminal. The drain of NMOS transistor V507 is connected to the "55V_SW" terminal. The cathode of diode D509 is connected to one end of inductor L902, and the other end of inductor L902 is connected to the "W+" terminal. The anode of diode D509 is connected to the "W-" terminal. The anode of inductor L904 is connected to one end of inductor L904, and the other end of inductor L904 is connected to the "LED-" terminal. Terminal 5 of chip N508 is connected to the "ON" terminal through V505. Terminal 6 of chip N508 is connected to LED501. Terminal 13 of chip N508 is connected to the "PWM" terminal. Terminal 12 of chip N508 is connected to the "Rxd" terminal. Terminal 11 of chip N508 is connected to the "Txd" terminal. The "55V_SW" terminal is connected to the auxiliary circuit, such as the circuit. Figures 15-18 As shown.

[0102] One auxiliary circuit diagram includes: terminal "1" of chip N601 is connected to the source of NMOS transistor V602 via resistor R612; the drain of NMOS transistor V602 is connected to terminal "560n"; the gate of NMOS transistor V602 is connected to the negative terminal of Zener diode D602 and the collector of NPN transistor V603, and series resistors R611 / R610 / R609; the other end of resistor R609 is connected to terminal "55V_SW"; the positive terminal of Zener diode D602 and the emitter of NPN transistor V603 are connected to terminal "1" of chip N601; and terminal "2" of chip N601... Grounded, chip N601's "3" terminal is connected to the "560n" terminal, chip N601's "4" terminal is connected to the gate of NMOS transistor V601 through resistor R605, the source of NMOS transistor V601 is grounded, the drain of NMOS transistor V601 is connected to the anode of diode D601 and one end of resistor R614, the other end of resistor R614 is connected to one end of capacitor C607, the other end of capacitor C607 and the cathode of diode D601 are connected to the "55V+" terminal, chip N601's "6" terminal is connected to transformer T601's "1" terminal; the other two auxiliary circuits are as follows. Figures 16-17 .

[0103] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A suspended lighting fixture, characterized in that, The lighting fixture includes: a top cover, a base, a seat connector, a lamp connector, a receiving slot, a control circuit board, a conductive component, a cavity, and a lighting body. The top cover is mounted on the base, and the cavity is provided inside the base and the top cover. The control circuit board is placed inside the cavity, and the conductive component is mounted on the control circuit board. The seat connector and the receiving slot are mounted on the base, and the lamp connector is mounted on the lighting body. The receiving slot is used to accommodate and place the lighting body, and the seat connector and the lamp connector are connected to each other. The conductive component is electrically connected to the power terminal of the lighting body.

2. A suspended lighting fixture according to claim 1, characterized in that, The connection between the seat connector and the lamp connector can be a snap-fit ​​connection, a threaded connection, or a welded connection.

3. A suspended lighting fixture according to claim 2, characterized in that, The connection between the seat connector and the lamp connector is a snap-fit ​​connection. The seat connector is selected as a slot, and the lamp connector is selected as a buckle; Alternatively, the seat connector may be a buckle, and the lamp connector may be a slot.

4. A suspended lighting fixture according to claim 1, characterized in that, The lighting fixture is a micro-LED type.

5. A suspended lighting fixture according to claim 4, characterized in that, The base connector is located in the middle of the base, and the lamp connector is located in the middle of the lighting body.

6. A suspended lighting fixture according to claim 1, characterized in that, A grounding spring is electrically connected to the control circuit board. The grounding spring passes through the base and is electrically connected to the grounding terminal of the lighting body.

7. A suspended lighting fixture according to claim 1, characterized in that, At least two receiving slots are selected.

8. A suspended lighting fixture according to claim 7, characterized in that, The receiving groove is a long groove.

9. A suspended lighting fixture according to claim 4, characterized in that, The micro-LED comprises an N-type metal layer, a sapphire layer, a gallium nitride (GaN) layer, an N-type GaN layer, an indium gallium nitride (GaN) / GaN layer, an aluminum gallium nitride (GaN) layer, a P-type GaN layer, an ITO layer, a P-type metal layer, and a silicon dioxide layer. The sapphire layer serves as a substrate, on which the GaN layer is disposed. The N-type GaN layer is disposed on the GaN layer. The N-type GaN layer, the N-type metal layer, the silicon dioxide layer, and the indium gallium nitride / GaN layer are disposed on the N-type GaN layer. The silicon dioxide layer is disposed between the indium gallium nitride / GaN layer and the N-type metal layer. The aluminum gallium nitride (GaN) layer is disposed on the indium gallium nitride / GaN layer. The P-type GaN layer is disposed on the aluminum gallium nitride layer. The ITO layer is disposed on the P-type GaN layer. The P-type metal layer is disposed on the ITO layer. The N-type metal layer and the P-type metal layer are connected to corresponding external electrodes.

10. A method of using a suspended lighting fixture, characterized in that, The method of use includes the following steps: Step 1: Formation of micro-LEDs A sapphire substrate is selected as the substrate, and a layer of gallium nitride (GaN) material is deposited on the sapphire substrate. Then, N-type ions are implanted and doped into the upper layer of the GaN material using an ion doping machine. After doping is completed, an N-polar metal material, a silicon dioxide material, and a gallium indium nitride (GaN / GaN) material are deposited on the N-type GaN material, with the silicon dioxide material placed between the GaN / GaN material and the N-polar metal material. A layer of gallium aluminum nitride (GaN / GaN) material is deposited on the GaN / GaN material, and a layer of GaN material is deposited on the GaN / GaN material. Then, P-type ions are implanted and doped into the upper layer of the GaN material using an ion doping machine to form a P-type GaN material. An ITO (indium tin oxide) material is deposited on the P-type GaN material, and a P-polar metal material is deposited on the ITO material. The N-polar metal layer and the P-polar metal layer are then connected to the corresponding external electrodes. Step 2: Formation of the lighting body Select the micro-LED from step 1, encapsulate it into micro-LED beads, then select a lamp board, arrange the micro-LED beads in a matrix and electrically connect them to the lamp board, then install the lamp board on the lamp holder of the lighting body, and snap a light-transmitting protective cover with a light conversion film onto the lamp holder of the lighting body to protect the micro-LED beads, etc. Step 3: Light Fixture Assembly Select the lighting body from step 2, then select the top cover, base, base connector, lamp connector, receiving slot, control circuit board, conductive component, and cavity, and assemble them. The base has a top cover, and the base and top cover have cavities. The control circuit board is placed in the cavity, and the control circuit board has conductive components. The base has a base connector and receiving slot, and the lighting body has a lamp connector. The receiving slot is used to accommodate and place the lighting body, and the base connector and lamp connector are connected to each other. The conductive component is electrically connected to the power terminal of the lighting body, thus completing the assembly of the lamp. Step 4: Lighting installation Select the light fixture from step 3, then select a walk-in plant growth chamber. Install the light fixture on the adjustable and height-adjustable bracket inside the walk-in plant growth chamber. Plant plants inside the walk-in plant growth chamber, and then set the light fixture. The light fixture is parallel to the plane where the plant is being illuminated. Adjust the distance between the light fixture and the plant being illuminated by adjusting the height-adjustable bracket. Step 5: Creating the Plant Growth Chamber Environment Select the walk-in plant growth chamber with lights and plants from step 4, and prepare the environment for the walk-in plant growth chamber. Use the air conditioner in the walk-in plant growth chamber to maintain a daytime temperature of about 23°C and a nighttime temperature of about 22°C, a daytime relative humidity of about 70% and a nighttime relative humidity of about 80%, a daytime carbon dioxide injection of about 800 μmol / mol and a nighttime carbon dioxide injection of about 400 μmol / mol. After the plants have grown for 10 days, observe and test them.

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