Heat-conducting structure and intelligent device
By combining a heat-conducting film structure and elastic elements, the problem of heat conduction between relatively moving objects in traditional heat dissipation components is solved, achieving stable heat exchange during movement and making it suitable for heat transfer between relatively moving objects.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BEIJING XIAOMI ROBOT TECH CO LTD
- Filing Date
- 2024-12-30
- Publication Date
- 2026-06-30
AI Technical Summary
Traditional metal heat dissipation components cannot meet the heat conduction requirements between two relatively moving objects.
The structure employs a thermally conductive film, comprising a first thermally conductive part, a second thermally conductive part, and a thermally conductive connecting part. The thermally conductive connecting part can be bent or stretched to adjust the distance between the two thermally conductive parts. Combined with an elastic element and an adhesive layer, it ensures effective heat exchange during the movement of the object.
Maintaining a stable heat exchange channel during relative motion of objects improves thermal conductivity and is suitable for heat transfer between relatively moving objects.
Smart Images
Figure CN122305842A_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to the field of heat dissipation technology, and more specifically, to a heat-conducting structure and a smart device. Background Technology
[0002] In the field of modern thermal management technology, the most common solutions for heat conduction between two objects are to use metal heat dissipation components such as heat pipes or vapor chambers (VCs). Heat pipes, through the phase change cycle of their internal working fluid, can efficiently transfer heat from high-temperature regions to low-temperature regions, while vapor chambers, through their complex internal microstructures and vapor chamber design, achieve rapid heat diffusion and equalization, allowing heat to be evenly distributed over a large area, thereby enhancing the heat dissipation effect.
[0003] However, when faced with the need for heat conduction between two relatively moving objects, traditional metal heat dissipation components cannot meet the requirements. Summary of the Invention
[0004] This disclosure provides a heat-conducting structure and an intelligent device that can meet the heat conduction requirements between two relatively moving objects.
[0005] In a first aspect, this disclosure provides a thermally conductive structure, comprising: a thermally conductive film, including a first thermally conductive portion, a second thermally conductive portion, and a thermally conductive connecting portion; the thermally conductive connecting portion is located between the first thermally conductive portion and the second thermally conductive portion, connecting the first thermally conductive portion and the second thermally conductive portion; wherein, the thermally conductive connecting portion is configured to be flexible or extendable to adjust the distance between the first thermally conductive portion and the second thermally conductive portion.
[0006] Optionally, the thermally conductive film has a first thermal conductivity along its thickness direction and a second thermal conductivity along its planar direction, wherein the first thermal conductivity is less than the second thermal conductivity, and the first thermally conductive portion, the thermally conductive connection portion, and the second thermally conductive portion are sequentially connected along the planar direction of the thermally conductive film.
[0007] Optionally, the thermal conductive film may be made of at least one of graphite and graphene.
[0008] Optionally, the thermally conductive film encloses an installation space, and the thermally conductive structure further includes an elastic element disposed within the installation space, in a compressed state, and connected to the first thermally conductive part and the second thermally conductive part respectively.
[0009] Optionally, the thermally conductive film has a partially enclosed structure that surrounds the installation space, with the first thermally conductive portion and the second thermally conductive portion located at opposite ends of the thermally conductive film.
[0010] Optionally, the first heat-conducting part and the second heat-conducting part are connected end to end through the heat conduction connection part to form a closed-loop structure, and the closed-loop structure has the installation space.
[0011] Optionally, the thermal conductive film further includes a fixing portion for fixing the thermal conductive film to the object to be heated, the fixing portion extending outward from a portion of the closed-loop structure.
[0012] Optionally, the thermally conductive structure further includes an adhesive layer disposed on the first thermally conductive portion or the second thermally conductive portion.
[0013] Optionally, the adhesive layer is disposed on a portion of the first heat-conducting part or a portion of the second heat-conducting part.
[0014] Optionally, the elastic element is foam, and the thermally conductive film covers the foam.
[0015] Secondly, this disclosure provides a smart device, comprising:
[0016] First component;
[0017] A second component, the second component being movable relative to the first component; and
[0018] In any of the above-described heat-conducting structures, the first heat-conducting part is connected to the first component, and the second heat-conducting part is connected to the second component.
[0019] Optionally, the first component includes a housing, and the second component includes a joint disposed within the housing and movable relative to the housing; the first heat-conducting part is connected to the housing, and the second heat-conducting part is connected to the joint.
[0020] The heat-conducting structure and intelligent device disclosed herein have at least the following advantages:
[0021] The heat conduction connection is flexible and can be bent or extended, allowing for flexible adjustment of the distance between the first and second heat conduction parts according to the movement of two relatively moving objects. This enables the heat conduction connection to change with the distance between the two objects during relative movement, maintaining an effective heat conduction connection and preventing interruption of heat exchange due to relative displacement or movement. Therefore, the heat conduction structure provided in this solution is suitable for heat conduction between two relatively moving objects. Attached Figure Description
[0022] Figure 1 This is a cross-sectional view of a heat-conducting structure illustrated in an exemplary embodiment of this disclosure;
[0023] Figure 2 This is a cross-sectional view of a heat-conducting structure shown in yet another embodiment of this disclosure;
[0024] Figure 3 This is a cross-sectional view of a heat-conducting structure shown in another embodiment of this disclosure;
[0025] Figure 4 This is a cross-sectional view of a heat-conducting structure shown in another embodiment of this disclosure.
[0026] Explanation of reference numerals in the attached drawings: 10, thermally conductive film; 11, first thermally conductive part; 12, second thermally conductive part; 13, thermal conduction connection part; 14, installation space; 15, fixing part; 20, first object; 30, second object; 40, elastic element. Detailed Implementation
[0027] The technical solutions in the embodiments (or "implementations") of this disclosure will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.
[0028] If this disclosure uses terms relating to directional indications or positional relationships (e.g., up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the accompanying drawings); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, terms such as "first" and "second" in this disclosure are used only for descriptive convenience and should not be construed as indicating or implying relative importance.
[0029] In related technologies, when two objects requiring heat conduction are close together (e.g., about 1 mm apart), a thermal interface material (TIM) is typically added directly between them. The TIM fills the tiny gaps and voids at the interface, effectively reducing contact thermal resistance and promoting heat transfer. When the two objects are far apart, heat pipes or vapor chambers (VCs) are usually used. However, when the two objects are in relative motion (e.g., the joints and shell of a robot), the structures of heat pipes, VCs, and TIMs are relatively fixed, lacking flexibility or having weak flexibility, making them unsuitable for heat conduction between two relatively moving objects.
[0030] In view of this, the present disclosure provides a heat-conducting structure and a smart device. The heat-conducting structure and smart device will be described in detail below with reference to the accompanying drawings. Unless otherwise specified, the features in the following embodiments and implementations can be combined with each other.
[0031] This disclosure provides a heat-conducting structure applicable to two relatively movable objects to be heated. The heat-conducting structure includes a heat-conducting film 10, which includes a first heat-conducting portion 11, a second heat-conducting portion 12, and a heat-conducting connection portion 13.
[0032] The first heat-conducting part 11 is used to connect to one of the two objects, the second heat-conducting part 12 is used to connect to the other of the two objects, and the heat conduction connection part 13 is located between the first heat-conducting part 11 and the second heat-conducting part 12 and connects the first heat-conducting part 11 and the second heat-conducting part 12, so that the two objects can establish a heat conduction channel through the heat-conducting film 10, thereby allowing the two objects to exchange heat through the heat-conducting film 10.
[0033] The heat conduction connection 13 is configured to be flexible or extendable to adjust the distance between the first heat conduction part 11 and the second heat conduction part 12.
[0034] As described above, the heat conduction connection 13 is flexible and can be bent or extended, allowing for flexible adjustment of the distance between the first heat conduction part 11 and the second heat conduction part 12 according to the movement of the two relatively moving objects. This enables the heat conduction connection 13 to change with the distance between the two objects during their relative movement, ensuring an effective heat conduction connection and preventing interruption of heat exchange due to relative displacement or movement. Therefore, the heat conduction structure provided by this solution is suitable for heat conduction between two relatively moving objects.
[0035] For example, please continue to refer to Figure 1 The two movable objects to be heated are a first object 20 and a second object 30. The first heat-conducting part 11 can be attached to the first object 20, and the second heat-conducting part 12 can be attached to the second object 30. During the relative movement of the first object 20 and the second object 30, the heat-conducting connection part 13 can bend or extend accordingly according to the real-time change of the distance between them. For example, when the first object 20 and the second object 30 approach each other, the heat conduction connection 13 will adaptively bend or fold, changing from a relatively stretched state to a relatively curled state, in order to reduce the linear space occupied between the first object 20 and the second object 30, so as to adapt to the change in the distance between the first object 20 and the second object 30, and so that heat can still be transferred between the first object 20 and the second object 30; while when the first object 20 and the second object 30 move away from each other, the heat conduction connection 13 will extend to fill the gradually increasing distance between the first object 20 and the second object 30, ensuring that the heat conduction link between the first heat conduction part 11 and the second heat conduction part 12 is not interrupted, and allowing heat to be exchanged stably between the first object 20 and the second object 30 through the heat conduction film 10.
[0036] In one embodiment, the thermally conductive film 10 has a first thermal conductivity along its thickness direction and a second thermal conductivity along its planar direction, wherein the first thermal conductivity is less than the second thermal conductivity; wherein, along the planar direction of the thermally conductive film 10, the first thermally conductive part 11, the thermally conductive connection part 13, and the second thermally conductive part 12 are connected in sequence.
[0037] With this configuration, since the heat-conducting film 10 has a large second thermal conductivity in the planar direction, and the first heat-conducting part 11, the heat-conducting connection part 13, and the second heat-conducting part 12 are sequentially connected in the planar direction, heat can be transferred rapidly along the planar direction, which helps to improve the thermal conductivity. Furthermore, during relative motion of the objects, the heat-conducting film 10 mainly relies on heat conduction in the planar direction to maintain heat exchange. Even if the heat-conducting connection part 13 undergoes morphological changes such as bending or stretching due to the relative motion of the objects, the heat conduction in the planar direction can still remain relatively stable.
[0038] It should be noted that the planar direction refers to the direction corresponding to the two-dimensional plane in which the thermal conductive film 10 unfolds itself. The thickness direction is the direction perpendicular to the plane of the thermal conductive film 10, that is, the direction from one surface of the thermal conductive film 10 to its opposite surface. At the same position on the thermal conductive film 10, the planar direction of the thermal conductive film 10 is perpendicular to the thickness direction.
[0039] Furthermore, the material of the thermal conductive film 10 includes at least one of graphite and graphene. For example, the thermal conductive film 10 can be a graphite thermal conductive film, a graphene thermal conductive film, or a composite thermal conductive film made by combining graphite and graphene.
[0040] In one embodiment, the thermally conductive film 10 surrounds an installation space 14, and the thermally conductive structure further includes an elastic element 40 in a compressed state. The elastic element 40 is disposed within the installation space 14 and connects the first thermally conductive part 11 and the second thermally conductive part 12. The installation space 14 can be a space of any shape or structure, as long as it can accommodate the elastic element 40.
[0041] Thus, the elastic element 40 can apply an elastic force to the first heat-conducting part 11 and the second heat-conducting part 12 to support their connection to the movable object to be heated. Under the elastic force of the elastic element 40, the first heat-conducting part 11 and the second heat-conducting part 12 can stably adhere to the corresponding surface of the object to be heated, avoiding loosening or detachment between the heat-conducting part and the object due to shaking or displacement caused by the movement of the object. This improves the reliability of the connection between the heat-conducting film 10 and the object to be heated, thereby maintaining the integrity of the heat transfer channel. Furthermore, the elastic element 40 can adaptively adjust the distance between the first heat-conducting part 11 and the second heat-conducting part 12 according to changes in the distance between the two objects. For example, when the distance between the two objects suddenly increases, the elastic element 40 can rebound to continue providing support to the first heat-conducting part 11 and the second heat-conducting part 12; when the distance between the two objects decreases, the elastic element 40 can be further compressed.
[0042] For example, please refer to Figure 2 When the elastic element 40 is in a compressed state, it can apply pressure to the first heat-conducting part 11 toward the first object 20 and to the second heat-conducting part 12 toward the second object 30 by relying on its own elastic force, so that the first heat-conducting part 11 and the first object 20, and the second heat-conducting part 12 and the second object 30 are tightly attached.
[0043] Furthermore, the elastic element 40 can be foam, and the heat-conducting film 10 covers the foam. The foam applies an elastic compressive force to the first heat-conducting part 11 and the second heat-conducting part 12 through its own compression and rebound, so that both the first heat-conducting part 11 and the second heat-conducting part 12 can adhere to the object to be heat-conducted. Of course, in some other embodiments, the elastic element 40 can also be a rubber elastomer, aerogel, or other elastic and repeatedly compressible object.
[0044] In a further embodiment, the heat-conducting structure further includes an adhesive layer, which can be a thermally conductive adhesive or other adhesive layer. The adhesive layer is disposed on the first heat-conducting part 11 or the second heat-conducting part 12. It is easy to understand that the elastic member 40 can apply pressure to the first heat-conducting part 11 toward the first object 20 and apply pressure to the second heat-conducting part 12 toward the second object 30, so that the first heat-conducting part 11 is attached to the first object 20 and the second heat-conducting part 12 is attached to the second object 30. Therefore, this solution only needs to be disposed on the first heat-conducting part 11 or the second heat-conducting part 12 to fix one of the first heat-conducting part 11 and the second heat-conducting part 12 of the heat-conducting film 10, and the other is pressed onto the object to be heat-conducted by the elastic force of the elastic member, without the need to provide adhesive layers on both the first heat-conducting part 11 and the second heat-conducting part 12. This directly reduces the use of adhesive material and saves costs; on the other hand, the thermal conductivity of the adhesive layer is generally lower than that of the heat-conducting film 10, so this solution also reduces the obstruction of heat conduction by the adhesive layer.
[0045] Furthermore, the adhesive layer is disposed on a portion of the first heat-conducting part 11 or a portion of the second heat-conducting part 12. That is, the adhesive layer does not completely cover the first heat-conducting part 11 or the second heat-conducting part 12. This allows heat to be transferred directly between the heat-conducting film 10 and the object in most areas, without passing through the adhesive layer, which has relatively poor thermal conductivity, thus reducing the additional thermal resistance that a large-area adhesive layer might bring.
[0046] The adhesive layer can be disposed on a heat-conducting part with a lower temperature for connecting objects. For example, if the temperature of the first object 20 is higher than the temperature of the second object 30, the first object 20 transfers heat to the second object 30 through the heat-conducting film 10. In this case, the adhesive layer can be disposed on the second heat-conducting part 12, connecting the second heat-conducting part 12 to the second object 30. It is easy to understand that high temperatures will cause the adhesive layer to fail more quickly; therefore, attaching the adhesive layer to an object with a lower temperature can improve its service life.
[0047] The shape of the thermal conductive film 10 will be described in detail below. In addition, the thermal conductive film 10 in the following embodiments can be integrally formed, but is not limited thereto.
[0048] In one embodiment, the thermally conductive film 10 is a partially enclosed structure that forms the aforementioned mounting space 14. The first thermally conductive portion 11 and the second thermally conductive portion 12 are located at opposite ends of the thermally conductive film 10, and the thermally conductive connection portion 13 connects the ends of the first thermally conductive portion 11 and the second thermally conductive portion 12. That is, the first thermally conductive portion 11 is located at one end of the thermally conductive film 10, and the second thermally conductive portion 12 is located at the other end of the thermally conductive film 10.
[0049] Thus, the partially enclosed thermal conductive film 10 saves material while also creating an installation space 14 for the installation of the elastic element 40. This reduces the amount of raw material used in the thermal conductive film 10, which helps save costs. At the same time, the partially enclosed thermal conductive film 10 has an opening, which allows operators to easily install the elastic element 40 into the installation space 14.
[0050] like Figure 2In the described embodiment, the heat-conducting film 10 is U-shaped, and the first heat-conducting part 11 and the second heat-conducting part 12 are planar and extend in the same direction, allowing them to adhere to the surface of the object with a large contact area, which is beneficial for efficient heat conduction. The heat-conducting connection part 13 is arc-shaped, with its two ends connected to the ends of the first heat-conducting part 11 and the second heat-conducting part 12, respectively. When the first object 20 and the second object 30 move relative to each other, the arc-shaped heat-conducting connection part 13 can naturally bend or extend with the change in distance between the objects. For example, when the two objects are close to each other, the arc-shaped heat-conducting connection part 13 can bend inward, shortening the space it occupies between the two objects; when the two objects are far apart, the arc can extend outward, lengthening itself to maintain an effective connection between the first heat-conducting part 11 and the second heat-conducting part 12, ensuring the continuity of the heat conduction channel.
[0051] In another embodiment, please refer to Figure 3 The first heat-conducting part 11 and the second heat-conducting part 12 are connected end to end through the heat conduction connection part 13 to form a closed-loop structure, which has the aforementioned installation space 14. The closed-loop structure can provide a more stable installation space 14, and the elastic element 40 can better perform its function of supporting and assisting in adjusting the spacing within this installation space 14.
[0052] like Figure 3 In the illustrated embodiment, the closed-loop structure is generally O-shaped or elliptical. The first heat-conducting part 11 and the second heat-conducting part 12 are located on opposite sides of the heat-conducting film 10. Under the compression of the internal elastic element 40, the first heat-conducting part 11 and the second heat-conducting part 12 are respectively attached to the first object 20 and the second object 30. There are two heat-conducting connection parts 13. One heat-conducting connection part 13 is located on one side of the first heat-conducting part 11 and the second heat-conducting part 12, with its two ends connected to the ends of the first heat-conducting part 11 and the second heat-conducting part 12, respectively. The other heat-conducting connection part 13 is located on the other side of the first heat-conducting part 11 and the second heat-conducting part 12, with its two ends connected to the ends of the first heat-conducting part 11 and the second heat-conducting part 12, respectively, to form an O-shaped closed-loop structure. When the first heat-conducting part 11 and the second heat-conducting part 12 exchange heat, it can be transferred through the two heat-conducting connection parts 13, which helps to accelerate heat conduction.
[0053] For further details, please refer to... Figure 4The thermally conductive film 10 also includes a fixing part 15 for fixing the thermally conductive film 10 to the object to be thermally conductive. The fixing part 15 extends from a portion of the closed-loop structure to the side away from the closed-loop structure. The fixing part 15 extends from the portion of the closed-loop structure and can be directly connected to the object to be thermally conductive through an adhesive layer, providing an additional fixing point. In this way, it is not necessary to provide an adhesive layer or the like on the first thermally conductive part 11 and the second thermally conductive part 12 on the closed-loop structure to connect with the object to be thermally conductive. Both the first thermally conductive part 11 and the second thermally conductive part 12 can directly contact the heat source of the object to be thermally conductive, which is beneficial to improving the heat conduction effect.
[0054] like Figure 4 In the embodiment described, the heat-conducting film 10 is generally shaped like the letter "Q". The fixing part 15 extends outward from the end of the second heat-conducting part 12 (or the first heat-conducting part 11) and is planar. An adhesive layer is disposed on the fixing part 15 for connecting the fixing part 15 and the second object 30.
[0055] This disclosure also provides an intelligent device, which can be a humanoid robot or a wheeled robot, or an animal-shaped intelligent robot such as a robot dog, or a standalone intelligent device such as a robotic hand or robotic arm.
[0056] The smart device includes a first component, a second component, and a heat-conducting structure as shown in any of the above embodiments. The second component is movable relative to the first component. The first heat-conducting part 11 is connected to the first component, and the second heat-conducting part 12 is connected to the second component.
[0057] In one specific embodiment, the first component includes a housing, and the second component includes a joint disposed within the housing and movable relative to the housing. One of the first heat-conducting part 11 and the second heat-conducting part 12 is connected to the housing, and the other is connected to the joint.
[0058] That is, the first object 20 mentioned above can be a joint of the smart device, and the second object 30 can be the outer shell of the smart device, but neither is limited to these. In addition, the joint can be a joint at any position of the smart device, as long as the joint can move relative to the outer shell, so this disclosure does not specifically limit the type of joint.
[0059] The above description is merely a preferred embodiment of this disclosure and is not intended to limit this disclosure. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.
Claims
1. A thermally conductive structure, characterized in that, include: A thermally conductive film (10) includes a first thermally conductive part (11), a second thermally conductive part (12), and a thermally conductive connecting part (13); the thermally conductive connecting part (13) is located between the first thermally conductive part (11) and the second thermally conductive part (12), connecting the first thermally conductive part (11) and the second thermally conductive part (12); wherein, the thermally conductive connecting part (13) is configured to be flexible or extendable to adjust the distance between the first thermally conductive part (11) and the second thermally conductive part (12).
2. The thermally conductive structure according to claim 1, characterized in that, The thermal conductive film (10) has a first thermal conductivity along its thickness direction and a second thermal conductivity along its planar direction. The first thermal conductivity is less than the second thermal conductivity. The first thermal conductivity part (11), the thermal conduction connection part (13), and the second thermal conductivity part (12) are connected in sequence along the planar direction of the thermal conductive film (10).
3. The thermally conductive structure according to claim 2, characterized in that, The thermal conductive film (10) is made of at least one of graphite and graphene.
4. The thermally conductive structure according to claim 1, characterized in that, The heat-conducting film (10) surrounds an installation space (14). The heat-conducting structure also includes an elastic element (40). The elastic element (40) is disposed in the installation space (14) and is in a compressed state. It is connected to the first heat-conducting part (11) and the second heat-conducting part (12) respectively.
5. The thermally conductive structure according to claim 1 or 4, characterized in that, The thermal conductive film (10) is a partially enclosed structure that encloses the installation space (14), and the first thermal conductive part (11) and the second thermal conductive part (12) are located at opposite ends of the thermal conductive film (10).
6. The thermally conductive structure according to claim 1 or 4, characterized in that, The first heat-conducting part (11) and the second heat-conducting part (12) are connected end to end through the heat conduction connection part (13) to form a closed-loop structure, and the closed-loop structure has an installation space (14).
7. The thermally conductive structure according to claim 6, characterized in that, The thermal conductive film (10) further includes a fixing part (15) for fixing the thermal conductive film (10) to the object to be heated, the fixing part (15) extending outward from a portion of the closed-loop structure.
8. The thermally conductive structure according to claim 4, characterized in that, The heat-conducting structure further includes an adhesive layer, which is disposed on the first heat-conducting part (11) or the second heat-conducting part (12).
9. The thermally conductive structure according to claim 8, characterized in that, The adhesive layer is disposed on a portion of the first heat-conducting part (11) or a portion of the second heat-conducting part (12).
10. The thermally conductive structure according to claim 4, characterized in that, The elastic element (40) is foam, and the thermally conductive film (10) covers the foam.
11. A smart device, characterized in that, include: First component; A second component, which is movable relative to the first component; and The heat-conducting structure as described in any one of claims 1 to 10, wherein the first heat-conducting part (11) is connected to the first component, and the second heat-conducting part (12) is connected to the second component.
12. The intelligent device according to claim 11, characterized in that, The first component includes a housing, and the second component includes a joint disposed within the housing and movable relative to the housing; the first heat-conducting part (11) is connected to the housing, and the second heat-conducting part (12) is connected to the joint.