A Method and System for Monitoring and Controlling Tin Plating Processing of Semiconductor Components Based on the Internet of Things

By constructing a multi-source collaborative acquisition system and a spatiotemporal mapping field using IoT technology, dynamic process determination and multi-variable collaborative control of the tinning process of semiconductor components were realized. This solved the problems of process stability and consistency during the tinning process, enabled early identification and lightweight intervention of potential defects, and improved process stability and adaptability.

CN122308307APending Publication Date: 2026-06-30SICHUAN QIANRUI ELECTRONIC TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SICHUAN QIANRUI ELECTRONIC TECH CO LTD
Filing Date
2026-05-09
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

Existing technologies struggle to achieve spatiotemporal mapping and dynamic evolution analysis of multi-source data in the tinning process of semiconductor components, making it difficult to guarantee process stability and consistency.

Method used

A multi-source collaborative acquisition system based on the Internet of Things is constructed. A time alignment mechanism is used to achieve unified expression of asynchronous data, establish a spatiotemporal mapping field for the tinning process, and form a continuous process state expression through multi-parameter fusion. Combined with deviation identification and local micro-environment modeling, multi-variable collaborative control is carried out to achieve dynamic process judgment and fine adjustment.

Benefits of technology

It significantly improves the process consistency and product yield of the tinning process, enables early identification and lightweight intervention of potential defects, and has self-learning capabilities, reducing unnecessary adjustment actions and improving process stability and adaptability.

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Abstract

This invention relates to the fields of Internet of Things (IoT) and industrial process monitoring and control technology, specifically to a monitoring and control method and system for the tinning process of semiconductor components based on IoT. The method includes: constructing a multi-source collaborative acquisition system; establishing a continuous spatiotemporal mapping field for the tinning process through time alignment and spatial trajectory binding; extracting the time change rate and spatial expansion characteristics based on this mapping field to construct a unified state evolution index for identifying process stages and determining deviation trends; performing local micro-environment modeling and multi-variable collaborative regulation for deviation areas to bring the tinning process back to the target evolution trajectory; constructing a defect precursor fragment library by backtracking the entire process data; matching precursor patterns and implementing lightweight interventions in real-time production; and forming a self-learning mechanism through feedback optimization. This invention achieves a shift from static parameter judgment to dynamic process evolution judgment, and from passive correction to proactive prevention, effectively improving the stability and consistency of tinning quality.
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