Electroplating electrode assembly, electroplating mechanism and electroplating machine

Abstract

This invention provides an electroplating electrode assembly, an electroplating mechanism, and an electroplating machine, relating to the field of metal deposition manufacturing technology. The electroplating electrode assembly includes: a rotating assembly comprising a first rotating mechanism and a second rotating mechanism, the first rotating mechanism and the second rotating mechanism being arranged at intervals and rotating in the same direction; a tension electrode, with its two ends respectively mounted on the first rotating mechanism and the second rotating mechanism, the tension electrode being able to contact the object to be plated during its movement; the rotation direction of the first rotating mechanism and the second rotating mechanism being perpendicular to the movement direction of the object to be plated; the electroplating mechanism including an electroplating solution tank for containing the electroplating solution and the aforementioned electroplating electrode assembly, the electroplating electrode assembly being mounted in the electroplating solution tank, the tension electrode being in contact with the electroplating solution; and the electroplating machine including an electroplating machine tank and the aforementioned electroplating mechanism, the electroplating mechanism being mounted in the electroplating machine tank. The beneficial effect of this invention is that it can both meet the electroplating requirements and replace the daily cleaning process.

Description

Technical Field

[0001] This invention relates to the field of metal deposition manufacturing technology, and in particular to an electroplating electrode assembly, an electroplating mechanism, and an electroplating machine. Background Technology

[0002] The basic design principle of electroplating technology is to place the anode in a space containing an electroplating solution, and connect the object to be plated with the cathode to form a closed electrical circuit, so as to deposit metal ions on the object to be plated.

[0003] Current electroplating equipment typically places the anode and electroplating solution inside the plating tank, while the cathode is placed outside. During continuous electroplating, the workpiece carries the plating solution out and adheres to it, continuously depositing it onto the cathode. This causes metal salts and other substances in the plating solution to precipitate and adhere to the electrode, potentially scratching or puncturing the surface of the workpiece. Alternatively, it can lead to poor conductivity between the electrode and the workpiece, resulting in uneven plating thickness and other quality issues.

[0004] Although existing electroplating machine designs have considered installing water-blocking / water-absorbing rollers or adding air jets before the cathode and after exiting the electroplating tank, these only delay the cathode from being back-adheded by the electroplating solution. Before and after actual production, the electroplating machine still requires manual rinsing of the cathode with clean water and regular disassembly of the cathode for deeper cleaning and maintenance, which is time-consuming and labor-intensive.

[0005] Therefore, there is an urgent need for an electroplating electrode assembly, an electroplating mechanism, and an electroplating machine to solve the above-mentioned technical problems. Summary of the Invention

[0006] The purpose of this invention is to provide an electroplating electrode assembly, an electroplating mechanism, and an electroplating machine to solve the technical problems of poor conductivity between the electrode and the workpiece, and the time-consuming and labor-intensive electrode cleaning and maintenance in the prior art. The various technical effects of the preferred solutions among the many technical solutions provided by this invention are detailed below.

[0007] To achieve the above objectives, the present invention provides the following technical solution:

[0008] The present invention provides an electroplating electrode assembly, comprising:

[0009] The rotating assembly includes a first rotating mechanism and a second rotating mechanism, wherein the first rotating mechanism and the second rotating mechanism are arranged at intervals and rotate in the same direction;

[0010] A tension electrode is mounted at both ends on the first rotating mechanism and the second rotating mechanism, respectively. The tension electrode is able to contact the object to be plated during its operation. The rotation direction of the first rotating mechanism and the second rotating mechanism is perpendicular to the running direction of the object to be plated.

[0011] Preferably, both the rotating assembly and the tension electrode comprise two sets, arranged symmetrically in an upper and lower configuration. The object to be plated moves between the two sets of tension electrodes, and the upper and lower sides of the object to be plated contact the two sets of tension electrodes respectively.

[0012] Preferably, it further includes a porous membrane material that covers the surface of the tension electrode.

[0013] Preferably, the tension electrode comprises a continuous structure or a discontinuous structure with pores.

[0014] Preferably, the tension electrode comprises a flexible conductor with a thickness of 10 μm to 3000 μm.

[0015] Preferably, the gap between the two sets of tension electrodes is set to 50% to 500% of the thickness of the object to be plated.

[0016] Preferably, the rotating assembly further includes a conductive roller, and each conductive roller is provided with a first rotating component and a second rotating component. The first rotating component can drive the first rotating mechanism to rotate, and the second rotating component can drive the second rotating mechanism to rotate.

[0017] An electroplating mechanism includes an electroplating solution tank for containing an electroplating solution and the aforementioned electroplating electrode assembly, wherein the electroplating electrode assembly is installed in the electroplating solution tank and the tension electrode is in contact with the electroplating solution.

[0018] Preferably, the device further includes a conveying assembly for transporting the object to be plated, the conveying assembly including a conveying roller and a roller structure disposed on the conveying roller.

[0019] An electroplating machine includes an electroplating tank and the aforementioned electroplating mechanism, wherein the electroplating mechanism is installed inside the electroplating tank.

[0020] The present invention provides an electroplating electrode assembly, an electroplating mechanism, and an electroplating machine. The electroplating electrode assembly includes a rotating component and a tension electrode. The rotating component comprises a first rotating mechanism and a second rotating mechanism, which are spaced apart and rotate in the same direction. The tension electrode is mounted on the first and second rotating mechanisms respectively. In use, the first and second rotating mechanisms rotate in a directional and quantitative manner, with the rotation direction perpendicular to the running direction of the object to be plated. The tension electrode can contact the object to be plated during its movement. By employing a flexible tension electrode and installing it in the electroplating equipment in a rolled manner, the tension electrode can achieve higher conductivity and better adaptability to the electric field distribution during the electroplating process. This satisfies electroplating requirements and replaces routine cleaning procedures, significantly reducing electrode cleaning and maintenance costs, improving conductivity, and resulting in better uniformity of electroplating thickness. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of the structure of an embodiment of the electroplating electrode assembly of the present invention. Figure 1 ;

[0023] Figure 2 This is a schematic diagram of the structure of an embodiment of the electroplating electrode assembly of the present invention. Figure 2 ;

[0024] Figure 3 This is a schematic diagram of the left side of an embodiment of the electroplating electrode assembly of the present invention;

[0025] Figure 4 This is a schematic diagram of the structure of the continuous tension electrode in the electroplating electrode assembly of the present invention;

[0026] Figure 5 This is a schematic diagram of the discontinuous tension electrode in the electroplating electrode assembly of the present invention;

[0027] Figure 6 This is a schematic diagram of an embodiment of the electroplating mechanism of the present invention.

[0028] In the figure: 1. Rotating assembly; 11. First rotating mechanism; 12. Second rotating mechanism; 13. Conductive roller; 131. First rotating component; 132. Second rotating component; 2. Tension electrode; 3. Object to be plated; 4. Wire; 5. Electroplating solution tank; 6. Conveying assembly; 61. Roller; 62. Roller structure; 7. Electroplating machine tank; 71. Liquid conveying component; 72. Gas conveying component. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of this invention clearer, the technical solutions of this invention will be described in detail below. Obviously, the described embodiments are merely some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other implementation methods obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0030] Figure 1 This is a structural schematic diagram of this embodiment. Figure 1 , Figure 2 This is a structural schematic diagram of this embodiment. Figure 2 ,like Figure 1 and Figure 2 As shown, this embodiment provides an electroplating electrode assembly, including a rotating assembly 1 and a tension electrode 2.

[0031] The rotating assembly 1 includes a first rotating mechanism 11 and a second rotating mechanism 12. The first rotating mechanism 11 and the second rotating mechanism 12 are arranged at intervals and rotate in the same direction. In this embodiment, both the first rotating mechanism 11 and the second rotating mechanism 12 adopt a columnar conductive shaft.

[0032] The tension electrode 2 is mounted on the first rotating mechanism 11 and the second rotating mechanism 12 at its two ends, respectively. The tension electrode 2 is able to contact the workpiece 3 during its operation. Figure 1 The direction of the middle arrow indicates the running direction of the object to be plated 3, and the rotation directions of the first rotating mechanism 11 and the second rotating mechanism 12 are perpendicular to the running direction of the object to be plated 3.

[0033] In use, the tension electrode 2 is rotated in a directional and quantitative manner by the first rotating mechanism 11 and the second rotating mechanism 12. The distance between the first rotating mechanism 11 and the second rotating mechanism 12 is set to be 50% to 250% of the widest width in the direction perpendicular to the direction of travel of the object to be plated 3, with the center of the object to be plated 3 as the reference.

[0034] The tension electrode 2 in this embodiment includes a flexible conductor, including but not limited to conductive cloth, conductive rubber, conductive foam, etc., which are composed of a single layer or composite layer that are conductive and flexible and rollable. Furthermore, the tension electrode 2 must not react with the electroplating liquid and must withstand a temperature range of 5℃ to 80℃.

[0035] In some embodiments, the tension electrode 2 may also be made of metal foil material. This includes, but is not limited to, metal foil made of single metals or composite alloys such as gold, copper, aluminum, titanium, stainless steel, silver, platinum, tungsten, bismuth, tin, nickel, indium, vanadium, iridium, ruthenium, titanium, and graphite that does not react with the electroplating liquid and can withstand a temperature range of 5°C to 80°C.

[0036] Specifically, in this embodiment, the width of the tension electrode 2 is set at 5% to 50% of the length of the object to be plated, and the thickness of the tension electrode 2 ranges from 10 μm to 3000 μm.

[0037] As an optional implementation method, Figure 3 This is a schematic diagram of the left-side structure of this embodiment, as shown below. Figure 3 As shown, in this embodiment, the rotating component 1 and the tension electrode 2 are both set in two groups and arranged symmetrically in the upper and lower positions. The object to be plated 3 moves between the two groups of tension electrodes 2, and the upper and lower sides of the object to be plated 3 are in contact with the two groups of tension electrodes 2 respectively.

[0038] Understandably, when using this technology, single-sided or double-sided electroplating processes can be performed according to the requirements of the object to be plated (3).

[0039] If a double-sided electroplating process is used, the upper and lower tension electrodes 2 need to be supplied with positive (anode) and negative (cathode) current respectively;

[0040] If a single-sided electroplating process is used, only the tension electrode 2 on the side to be electroplated needs to be energized.

[0041] Preferably, in this embodiment, the gap between the upper and lower tension electrodes 2 is 50% to 500% of the thickness of the object to be plated 3, so as to achieve a better electroplating effect.

[0042] As an optional implementation, the tension electrode 2 in this embodiment includes, but is not limited to, direct contact with the object to be plated 3. Therefore, the electroplating electrode assembly in this embodiment further includes a porous film material covering the surface of the tension electrode 2.

[0043] With this configuration, while meeting the requirements for electroplating, the tension electrode 2 can avoid direct contact with the object to be plated 3. By covering the outside of the tension electrode 2 with a porous film, gas can be prevented from contacting and adhering to the object to be plated 3.

[0044] As an optional implementation method, Figure 4 This is a schematic diagram of the structure of the continuum tension electrode in this embodiment. Figure 5 This is a schematic diagram of the discontinuous tension electrode in this embodiment, as shown below. Figure 4 and Figure 5 As shown, in order to allow the electroplating solution to pass through better, the tension electrode in this embodiment includes a continuous structure or a discontinuous structure with pores.

[0045] As an optional implementation, the rotating assembly 1 further includes conductive rollers 13, each of which is provided with a first rotating component 131 and a second rotating component 132. The first rotating component 131 can drive the first rotating mechanism 11 to rotate, and the second rotating component 132 can drive the second rotating mechanism 12 to rotate. Specifically, in this embodiment, the first rotating component 131 and the second rotating component 132 are designed to conduct electricity and drive the first rotating mechanism 11 and the second rotating mechanism 12 to rotate, such as rollers, etc., and are not specifically limited here.

[0046] Optionally, to further improve the stability of the overall device during use, in this embodiment, the conductive rollers 13 are provided in two sets. Both sets of conductive rollers 13 are arranged perpendicularly to the first rotating mechanism 11 and the second rotating mechanism 12, and are respectively located on both sides of the tension electrode 2.

[0047] In this embodiment, the conductive roller 13, the first rotating component 131, the second rotating component 132, the first rotating mechanism 11, and the second rotating mechanism 12 are all made of conductive metals, including but not limited to single metals or composite alloy materials such as gold, copper, aluminum, titanium, stainless steel, silver, platinum, tungsten, bismuth, tin, nickel, indium, vanadium, iridium, ruthenium, titanium, and graphite, which serve to conduct electricity and provide support.

[0048] The conductive roller 13 can be connected to the power supply of the electroplating equipment via the wire 4, and is used for charge transfer and mechanical rotation after being connected to the power supply. In this embodiment, the conductive roller 13, the first rotating component 131, the second rotating component 132, the first rotating mechanism 11, and the second rotating mechanism 12 are all non-reactive to the electroplating liquid and have a temperature tolerance range of 5℃ to 80℃.

[0049] This embodiment also provides an electroplating mechanism. Figure 6 This is a structural schematic diagram of this embodiment, as shown below. Figure 6 As shown, this embodiment includes an electroplating solution tank 5 for containing the electroplating solution and the aforementioned electroplating electrode assembly. The electroplating electrode assembly is installed in the electroplating solution tank 5, and the tension electrode 2 is in contact with the electroplating solution.

[0050] It is understood that the tension electrode 2 in this embodiment can be placed inside the electroplating bath or not, as long as it meets the requirements of electroplating.

[0051] In this embodiment, the electroplating bath 5 can be made of a material that does not react with the electroplating liquid and can withstand a temperature range of 5℃ to 80℃, such as PVS, PVDF, stainless steel, etc.

[0052] As an optional implementation, a conveying assembly 6 is also included for conveying the object to be plated 3.

[0053] In this embodiment, the conveying component 6 includes a roller 61 and a roller structure 62 disposed on the roller 61. The width of the roller structure 62 in contact with the object to be plated 3 is set to 5% to 150% of the widest width in the direction perpendicular to the direction of travel, with the center of the object to be plated 3 as a reference, so as to have the best support and transmission function for the object to be plated 3.

[0054] Among them, roller 61 is made of non-conductive materials, such as EVA, PVA, PVC, PVDF and PP, which are high molecular plastic materials that do not react with electroplating liquid and can withstand a temperature range of 5℃ to 80℃.

[0055] The roller structure 62 can be made of conductive metals or non-conductive materials, such as single metals or composite alloys made of gold, copper, aluminum, titanium, stainless steel, silver, platinum, tungsten, bismuth, tin, nickel, indium, vanadium, iridium, ruthenium, titanium and graphite; or it can be made of conductive rubber, conductive foam and other single or composite materials with conductivity and flexible deformation; non-conductive materials include but are not limited to EVA, PVA, PVC, PVDF and PP and other polymer plastics.

[0056] Preferably, the roller structure in this embodiment is made of conductive foam or PP material.

[0057] This electroplating mechanism, by setting the conveying component 6 including a roller 61 and a roller structure 62 set on the roller 61, the roller structure 62 contacts the object to be plated 3. The roller structure 62 can avoid excessive pressure on the object to be plated. During use, the tension electrode 2 is fully in contact with the surface of the object to be plated 3, reducing the breakage rate of thin objects to be plated 3, and can greatly improve the electroplating capacity and the uniformity of electroplating thickness.

[0058] This embodiment also provides an electroplating machine, including an electroplating tank 7 and the electroplating mechanism described above, wherein the electroplating mechanism is installed inside the electroplating tank 7.

[0059] In this embodiment, the electroplating tank 7 can be made of a material that does not react with the electroplating liquid and can withstand a temperature range of 5℃ to 80℃, such as PVS, PVDF, stainless steel, etc.

[0060] In this embodiment, the electroplating tank 7 is equipped with a liquid conveying component 71 and a gas conveying component 72 to facilitate the smooth progress of the electroplating process.

[0061] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An electroplating electrode assembly, characterized by, include: The rotating assembly includes a first rotating mechanism and a second rotating mechanism, wherein the first rotating mechanism and the second rotating mechanism are arranged at intervals and rotate in the same direction; A tension electrode is mounted at both ends on the first rotating mechanism and the second rotating mechanism, respectively. The tension electrode is able to contact the object to be plated during its operation. The rotation direction of the first rotating mechanism and the second rotating mechanism is perpendicular to the running direction of the object to be plated.

2. The electroplating electrode assembly of claim 1, wherein: Both the rotating assembly and the tension electrode consist of two sets, arranged symmetrically in an upper and lower configuration. The object to be plated moves between the two sets of tension electrodes, and the upper and lower sides of the object to be plated contact the two sets of tension electrodes respectively.

3. The electroplating electrode assembly of claim 1 or 2, wherein: It also includes a porous membrane material that covers the surface of the tension electrode.

4. The electroplating electrode assembly of claim 1 or 2, wherein: The tension electrode may be a continuous structure or a discontinuous structure with pores.

5. The electroplating electrode assembly of claim 1 or 2, wherein: The tension electrode comprises a flexible conductor with a thickness of 10µm to 3000µm.

6. The electroplating electrode assembly of claim 2, wherein: The gap between the two sets of tension electrodes is set to 50% to 500% of the thickness of the object to be plated.

7. The electroplating electrode assembly of claim 1 or 2, wherein: The rotating assembly further includes conductive rollers, each of which is provided with a first rotating component and a second rotating component. The first rotating component can drive the first rotating mechanism to rotate, and the second rotating component can drive the second rotating mechanism to rotate.

8. An electroplating mechanism characterized by, The invention includes an electroplating bath for containing an electroplating solution and an electroplating electrode assembly as described in any one of claims 1-7, wherein the electroplating electrode assembly is installed in the electroplating bath and the tension electrode is in contact with the electroplating solution.

9. The electroplating mechanism of claim 8, wherein: It also includes a conveying assembly for transporting the object to be plated, the conveying assembly including a conveying roller and a roller structure disposed on the conveying roller.

10. An electroplating machine characterized by: It includes an electroplating tank and the electroplating mechanism as described in claim 9, wherein the electroplating mechanism is installed in the electroplating tank.

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