A uniformly diffused gas heating track device

Abstract

This invention relates to the field of semiconductor manufacturing equipment technology, specifically a uniformly dispersed gas heating track device. It includes a track base, a gas guide groove embedded in a groove in the base, a track cover covering the top of the gas guide groove, a heating plate attached to the back of the base, dual thermocouples inserted into the upper and lower side surfaces, and symmetrically arranged air inlets on both ends of the base. The sidewalls of the gas guide groove are provided with a gradient cross-section guide rib array, and the track cover has multiple rows of staggered arrayed circular holes. The heating plate coverage area perfectly matches the gas guide groove. This device achieves temperature difference control within ±1℃ along the entire track length, improves system thermal efficiency, effectively avoids chip position displacement and thermal shock damage, and significantly improves the accuracy of high-temperature chip testing and equipment production capacity.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing equipment technology, and in particular to a uniformly dispersed gas heating track device. Background Technology

[0002] In semiconductor chip manufacturing, high-temperature electrical performance testing is a crucial step in screening qualified chips and ensuring product reliability. Chip sorters are the core equipment for this process, with heating rails responsible for providing a stable high-temperature testing environment for the chips under test. As chip manufacturing processes continue to shrink and integration levels increase, high-end chips face increasingly stringent requirements for the accuracy and uniformity of testing temperatures. Simultaneously, the semiconductor industry places higher demands on equipment production efficiency, energy consumption, and operational stability. Traditional heating rail technology is no longer sufficient to meet the production and testing needs of modern chip manufacturing.

[0003] The existing track heating technology for chip sorting machines has the following main drawbacks: First, it mostly adopts single-end air intake or local heating methods, resulting in a large temperature gradient along the track length, with a temperature difference of 5℃ to 10℃ between the middle and both ends. This cannot meet the temperature accuracy requirements of ±2℃ for chip testing, directly affecting the accuracy and consistency of test results. Second, the gas channel lacks a reasonable flow diversion and dispersion design, which easily generates jet effects and turbulence disturbances, leading to chip position displacement, micro-vibration, or thermal stress damage. Third, the gas path and thermal path are independent of each other, resulting in large heat loss during gas flow, low system thermal efficiency, and a long preheating time from room temperature to a stable operating state of 125℃, which restricts the improvement of equipment capacity. Fourth, it mostly uses single-point temperature detection, which cannot identify the temperature gradient along the entire track in real time. The temperature control response is slow and the stability is poor, and the gas sealing effect is not good, which can easily cause high-temperature gas leakage and thermal failure of surrounding components. Summary of the Invention

[0004] In view of the problems existing in the prior art, the present invention is proposed.

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution: a uniformly dispersed gas heating track device, which includes a track base, wherein a groove extending along the length direction is provided on the front side of the track base, and the back side of the track base is a flat and fitting surface; An air guide groove is embedded in the inner wall of the groove of the track base and forms a long strip-shaped main gas channel; A track cover, which covers the top of the air guide groove and is fixedly connected to the track base, has an array of openings in the area corresponding to the air guide groove; A heating plate is installed in close contact with the flat back surface of the track base; Thermocouples are respectively disposed at the upper and lower ends of the track base, and the temperature sensing end of the thermocouple extends to the area near the air guide groove. The air intake ports are symmetrically arranged on two end faces along the length of the track base. The air intake ports are connected to the corresponding ends of the air guide grooves through the air inlets inside the track base.

[0006] As a preferred embodiment of the uniformly dispersed gas heating track device of the present invention, the track base end face is symmetrically provided with two air inlet mounting holes, and the air inlets are correspondingly installed in the air inlet mounting holes.

[0007] As a preferred embodiment of the uniformly dispersed gas heating track device of the present invention, the end of the air guide groove is provided with an alignment mounting port, which corresponds to the air inlet mounting hole on the outer wall of the track base.

[0008] In a preferred embodiment of the uniformly dispersed gas heating track device of the present invention, the air guide groove is installed on the outer wall of the groove and the inner wall of the air guide groove forms an air intake channel with the groove, and the air intake channel corresponds to the air inlet opened on the outer wall of the groove.

[0009] As a preferred embodiment of the uniformly dispersed gas heating track device of the present invention, a flow-dividing structure is provided on the side wall of the gas guide groove, the flow-dividing structure is an array of guide ribs with a gradually changing cross section, and the flow-dividing structure extends along the length direction of the gas guide groove.

[0010] As a preferred embodiment of the uniformly dispersed gas heating track device of the present invention, the track cover is provided with multiple sets of alignment screw holes, and the track base is provided with corresponding mounting screw holes. Screws are screwed into the mounting screw holes through the alignment screw holes to achieve a fixed connection between the track cover and the track base.

[0011] As a preferred embodiment of the uniformly dispersed gas heating track device of the present invention, the openings on the track cover are small circular holes, and the openings are arranged in multiple staggered arrays with the hole spacing uniformly set along the track length direction.

[0012] In a preferred embodiment of the uniformly dispersed gas heating track device of the present invention, the heating plate is in close contact with the back of the track base, a resistance heating wire is embedded inside the heating plate, and the coverage area of ​​the heating plate matches the length and width of the gas guide groove.

[0013] As a preferred embodiment of the uniformly dispersed gas heating track device of the present invention, the track base has mounting holes perpendicular to the length direction on its upper and lower side surfaces, the thermocouple is inserted into the mounting holes from the side, and the temperature sensing end of the thermocouple is close to the outer wall of the gas guide groove.

[0014] As a preferred embodiment of the uniformly dispersed gas heating track device of the present invention, the outer wall of the gas guide groove and the inner wall of the track base groove are interference-fitted to reduce gas leakage.

[0015] The beneficial effects of this invention are as follows: This application achieves uniform gas distribution and low-speed laminar flow output along the entire length of the track through the coordinated design of symmetrical air intake at both ends, gradual flow distribution of the air guide groove array, and multiple rows of staggered array of circular holes on the track cover. The measured temperature difference along the entire length of the track is controlled within ±1℃, which fully meets the temperature requirements of high-precision chip testing. At the same time, it avoids the jet effect and turbulence disturbance of traditional structures, eliminates the risk of chip position displacement, micro-vibration and thermal shock damage, and significantly improves the chip sorting and positioning accuracy and the consistency of test results.

[0016] The system employs a full-area thermal coupling layout for the heating plate and the air guide channel, with the heating plate coverage area perfectly matching the air guide channel. This effectively compensates for heat loss during gas flow, improving system thermal efficiency and significantly shortening the preheating time from room temperature to a stable operating temperature of 125°C. Combined with dual-point temperature detection via side-inserted thermocouples at both ends, the system can identify the track temperature gradient in real time and dynamically adjust the heating power, significantly improving temperature control response speed and stability. Furthermore, the interference fit sealing structure between the air guide channel and the track base reduces high-temperature gas leakage, lowering the load on the gas source system and the risk of thermal failure of surrounding components. The aligned installation design of each component also improves assembly accuracy and consistency, comprehensively enhancing the operational reliability and production capacity of the chip sorting machine. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of a uniformly dispersed gas heating track device according to the present invention; Figure 2 This is a top view of the overall structure of the track device in this invention; Figure 3 This is an exploded view of the side structure of the track device in this invention.

[0019] Reference numerals: 101, track base; 1011, mounting screw hole; 1012, air inlet mounting hole; 1013, groove; 1014, air inlet; 102, air guide groove; 1021, alignment mounting port; 1022, air inlet channel; 103, track cover; 1031, alignment screw hole; 1032, opening; 104, air inlet; 105, heating plate; 106, thermocouple; 1061, temperature sensing end. Detailed Implementation

[0020] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

[0021] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0022] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0023] Example 1 Reference Figures 1-3 This is the first embodiment of the present invention, which provides a uniformly dispersed gas heating track device.

[0024] Specifically, the track base 101 has a groove 1013 extending along the length direction on the front side and a flat, fitting surface on the back side. The air guide groove 102 is embedded in the inner wall of the groove 1013 of the track base 101 and forms a long strip-shaped main gas channel; The track cover 103 covers the top of the air guide groove 102 and is fixedly connected to the track base 101. The track cover 103 has an array of openings 1032 in the area corresponding to the air guide groove 102. Heating plate 105 is tightly fitted and installed on the flat back surface of track base 101; Thermocouple 106 is respectively disposed at the upper and lower ends of the track base 101, and the temperature sensing end 1061 of the thermocouple 106 extends to the area near the air guide groove 102. The air intake interface 104 is symmetrically arranged on two end faces of the track base 101 along its length. The air intake interface 104 is connected to the corresponding end of the air guide groove 102 through the air intake port 1014 inside the track base 101.

[0025] In this system, high-temperature gas is transported from an external gas source to air inlets 104 symmetrically arranged on both ends of the track base 101 along its length. The gas then flows directly into the corresponding ends of the guide trough 102 through air inlets 1014 inside the track base 101. The high-temperature gas enters the guide trough 102 simultaneously from both ends of the track, forming opposing airflows that converge within the trough. This avoids the problems of excessively high inlet pressure and pressure attenuation at the far end caused by traditional single-end air inlet structures, ensuring a more uniform initial distribution of gas pressure along the track's length.

[0026] The gas guide groove 102 is embedded in the inner wall of the groove 1013 of the track base 101, forming a long strip-shaped main gas channel. The high-temperature gas entering the gas guide groove 102 flows along the length of the track and is gradually dispersed by the flow-dividing structure of the gradually changing cross-section guide rib array set on the side wall of the gas guide groove 102. The high-speed airflow is gradually decelerated and the pressure is balanced, eliminating the jet effect of the airflow inside the track. This makes the gas velocity and temperature in each area of ​​the gas guide groove 102 tend to be uniform, providing stable gas source conditions for subsequent uniform gas output.

[0027] The heating plate 105 is tightly fitted to the flat back surface of the track base 101. The heat generated after power-on is conducted to the air guide groove 102 area through the highly thermally conductive track base 101. The heating plate 105 and the air guide groove 102 form a deep thermal coupling through the track base 101. The heat not only maintains the structural temperature of the track base 101, but also directly and continuously heats and compensates the gas flowing in the air guide groove 102, offsetting the heat loss of the gas to the track wall, effectively suppressing the temperature decay of the gas from the inlet to the outlet, and shortening the preheating time of the system from room temperature to the working temperature.

[0028] The gas, which is fully mixed and reaches a uniform temperature in the gas guide groove 102, flows upward to the track cover 103 covering the top of the gas guide groove 102. It flows out through the array of openings 1032 in the track cover 103 corresponding to the area of ​​the gas guide groove 102. The gas is released from a large number of micropores in a low-speed laminar flow state, rather than the high-speed jet state of traditional slits or large openings. A stable and uniform thermal atmosphere is formed on the chip support surface of the track cover 103, avoiding the generation of turbulence and eddies. This makes the aerodynamic force on the chip uniform and prevents positional displacement, flipping or micro-vibration. At the same time, the heat transfer in the laminar flow state is more gentle and stable, reducing the risk of chip damage caused by thermal shock.

[0029] Thermocouples 106 are respectively set at the upper and lower ends of the track base 101, with their sensing ends 1061 extending to the area near the air guide groove 102. They detect the temperature of the core area of ​​the track base 101 in real time, forming a dual-point temperature detection network along the length of the track. This network can simultaneously obtain the average temperature and temperature gradient information at both ends of the track. Compared with single-point detection, it has higher sensitivity to temperature field distortion and can promptly identify the unbalanced state of overheating at one end of the track and underheating at the other end, providing accurate data support for the dynamic adjustment of the external temperature control system.

[0030] In summary, during operation, the high-temperature gas first enters the gas guide groove 102 synchronously through the air inlet ports 104 at both ends of the track base 101, flows in opposite directions within the gas guide groove 102 and is evenly dispersed by the flow splitting structure; at the same time, the heating plate 105 continuously heats and compensates the gas in the gas guide groove 102 through the track base 101; the uniformly heated gas flows out in a low-speed laminar flow state through the array openings 1032 of the track cover 103, forming a stable thermal atmosphere on the chip carrier surface; the thermocouples 106 at both ends monitor the temperature in real time and feed it back to the external temperature control system, dynamically adjusting the output power of the heating plate 105 to maintain a stable temperature along the entire length of the track.

[0031] Example 2 Reference Figures 1-3 This is the second embodiment of the present invention, which is implemented based on the previous embodiment.

[0032] Specifically, the track base 101 has two symmetrical air inlet mounting holes 1012 on its end face, and the air inlet 104 is installed in the corresponding air inlet mounting holes 1012.

[0033] The track base 101 has two symmetrical air inlet mounting holes 1012 on its two end faces along its length. The air inlet 104 is fixed in the air inlet mounting hole 1012 by a threaded connection. The end of the air guide groove 102 has an alignment mounting port 1021, which is precisely aligned with the air inlet mounting hole 1012 on the end face of the track base 101. This ensures the coaxiality of the air inlet 104 and the air guide groove 102, avoids additional flow resistance and turbulence when the gas enters, and enables the rapid positioning and assembly of the air guide groove 102 and the track base 101, improving assembly accuracy and consistency.

[0034] Preferably, the end of the air guide groove 102 is provided with an alignment mounting port 1021, which corresponds to the air inlet mounting hole 1012 on the outer wall of the track base 101.

[0035] The air guide groove 102 is embedded in the inner wall of the groove 1013, and the air guide groove 102 and the groove 1013 form an air intake channel 1022. The air intake channel 1022 corresponds to the air inlet 1014 opened on the inner wall of the groove 1013. The gas entering from the air inlet 104 first flows into the air intake channel 1022 through the air inlet 1014 inside the track base 101, and then enters the main channel of the air guide groove 102. The air intake channel 1022 serves as a buffer space before the gas enters the main channel, which can initially disperse the high-speed airflow, reduce the airflow impact, and at the same time make the gas initially evenly distributed in the width direction of the air guide groove at the front edge of the main channel, laying the foundation for subsequent uniform flow distribution along the entire length.

[0036] An air guide groove 102 is installed on the outer wall of a groove 1013, and the inner wall of the air guide groove 102 and the groove 1013 form an air intake channel 1022, which corresponds to the air intake port 1014 opened on the outer wall of the groove 1013. A flow-dividing structure is provided on the side wall of the air guide groove 102. The flow-dividing structure is an array of guide ribs with a gradually changing cross section, and the flow-dividing structure extends along the length of the air guide groove 102.

[0037] The air guide channel 102 has a flow-dividing structure on its sidewall. The flow-dividing structure is an array of guide ribs with gradually changing cross-sections, extending along the length of the air guide channel 102. Gas entering the main channel of the air guide channel 102 flows along its length, passing through multiple sets of guide ribs with gradually changing cross-sections. The cross-section of the guide ribs gradually changes along the gas flow direction, progressively dividing and guiding the airflow. This evenly disperses the high-speed airflow across the entire cross-section of the air guide channel 102, keeping the gas velocity and pressure difference at different locations within the air guide channel 102 within a minimal range. This completely eliminates the temperature gradient and velocity difference along the length caused by single-end air intake, ensuring consistent air intake conditions in all areas of the track cover.

[0038] The track cover 103 has multiple sets of alignment screw holes 1031, and the track base 101 has corresponding mounting screw holes 1011. Screws pass through the alignment screw holes 1031 and are screwed into the mounting screw holes 1011 to achieve a fixed connection between the track cover 103 and the track base 101.

[0039] The track cover 103 has multiple sets of alignment screw holes 1031, and the track base 101 has corresponding mounting screw holes 1011. Screws pass through the alignment screw holes 1031 and are screwed into the mounting screw holes 1011 to achieve a fixed connection between the track cover 103 and the track base 101. The multiple sets of alignment screw holes 1031 are evenly distributed along the length of the track. The evenly distributed screws ensure that the clamping force between the track cover 103 and the track base 101 is uniform, avoiding excessive local gaps that could lead to gas leakage. At the same time, it ensures the flatness of the track cover 103, providing a flat bearing surface for the chip and preventing the chip from getting stuck during movement.

[0040] The opening 1032 of the track cover 103 is a small circular hole. The opening 1032 is arranged in multiple rows in an alternating array and the hole spacing is uniformly set along the length of the track.

[0041] The openings 1032 in the track cover 103 are small circular holes arranged in a staggered array with uniform spacing along the track length. Gas uniformly distributed within the air guide grooves 102 flows upwards and exits through these small circular holes with consistent diameter and spacing. These holes allow the gas to flow out at a stable, low speed. The staggered array ensures complete gas coverage across the entire chip-bearing surface of the track cover 103. The uniform hole spacing ensures consistent gas flow in all areas, creating a stable laminar thermal atmosphere, preventing turbulence and eddies, and preventing the chip from shifting, flipping, or vibrating due to airflow impact. It also reduces thermal shock damage to the chip.

[0042] The heating plate 105 is tightly attached to the back of the track base 101. The heating plate 105 is embedded with a resistance heating wire. The coverage area of ​​the heating plate 105 matches the length and width of the air guide groove 102.

[0043] The heating plate 105 is tightly fitted to the back of the track base 101. A resistance heating wire is embedded inside the heating plate 105, and the coverage area of ​​the heating plate 105 matches the length and width of the air guide groove 102. When the heating plate 105 is energized, the internal resistance heating wire generates heat, which is conducted through the track base 101 to the entire length and width of the air guide groove 102. The perfect match between the coverage area of ​​the heating plate 105 and the air guide groove 102 ensures that the gas in all areas of the air guide groove 102 receives uniform heat compensation, avoiding insufficient local heating. The tight-fitting installation reduces thermal resistance, improves heat conduction efficiency, shortens the preheating time from room temperature to operating temperature, and reduces energy consumption.

[0044] The upper and lower ends of the track base 101 are respectively provided with mounting holes perpendicular to the length direction. The thermocouple 106 is inserted into the mounting hole from the side, and the temperature sensing end 1061 of the thermocouple 106 is close to the outer wall of the air guide groove 102.

[0045] The track base 101 has mounting holes perpendicular to its length on its upper and lower sides. Thermocouples 106 are inserted into these mounting holes from the sides, with their sensing ends 1061 close to the outer wall of the gas guide groove 102. The two thermocouples monitor the temperature of the areas near the gas flow channel at both ends of the track in real time. The perpendicular insertion method allows the sensing ends of the thermocouples to be closer to the gas flow channel, resulting in faster temperature detection response and higher accuracy. The dual-point detection at both ends allows for simultaneous acquisition of temperature data at both ends of the track, accurately reflecting the temperature gradient along the entire track length and promptly identifying imbalances such as overheating at one end and underheating at the other, providing a reliable basis for the dynamic adjustment of the temperature control system.

[0046] An interference fit is made between the outer wall of the air guide groove 102 and the inner wall of the groove 1013 of the track base 101 to reduce gas leakage.

[0047] The outer wall of the air guide groove 102 and the inner wall of the groove 1013 of the track base 101 are fitted with an interference fit. The air guide groove 102 is pressed into the groove 1013 by pressure, so that the mating surfaces of the two are in close contact, forming a gapless sealing structure. This effectively prevents gas from leaking from the mating surface of the air guide groove and the groove, improves the utilization rate of high-temperature gas, reduces the gas supply pressure requirement of the external gas source, and avoids thermal damage to other components inside the equipment caused by leaked high-temperature gas, thereby improving the safety and stability of the system operation.

[0048] In summary, during operation, high-temperature gas is delivered from an external gas source to the air inlet ports 104 at both ends of the track base 101. The gas then flows into the air intake channel 1022 formed by the air guide groove 102 and the groove 1013 for initial buffering. Subsequently, the gas enters the main channel of the air guide groove 102 and is gradually and evenly dispersed by the gradually changing guide rib array on the side wall during the opposite flow process. At the same time, the heating plate 105 continuously heats and compensates the gas in the air guide groove 102 throughout the track base 101. The uniformly heated gas flows out in a low-speed laminar flow state through the multiple rows of staggered array of small circular holes on the track cover 103, forming a stable and uniform thermal atmosphere on the chip carrier surface. The thermocouples 106 at both ends detect the temperature in real time and feed it back to the external temperature control system to dynamically adjust the output power of the heating plate 105 and maintain the temperature stability along the entire length of the track.

[0049] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A uniformly diffused gas heated track device, characterized by: include: The track base (101) has a groove (1013) extending along the length direction on the front side and a flat, fitting surface on the back side. The air guide groove (102) is embedded in the inner wall of the groove (1013) of the track base (101) and forms a long strip-shaped main gas channel; The track cover (103) covers the top of the air guide groove (102) and is fixedly connected to the track base (101). The track cover (103) has an array of openings (1032) in the area corresponding to the air guide groove (102). Heating plate (105), the heating plate (105) is tightly fitted and installed on the flat back surface of the track base (101); Thermocouples (106) are respectively disposed at the upper and lower ends of the track base (101), and the temperature sensing end (1061) of the thermocouples (106) extends to the area near the air guide groove (102). An air intake interface (104) is symmetrically arranged on two end faces of the track base (101) along its length. The air intake interface (104) is connected to the corresponding end of the air guide groove (102) through the air inlet (1014) inside the track base (101).

2. The uniform dispersion gas heating track device of claim 1, wherein: The track base (101) has two air inlet mounting holes (1012) symmetrically opened on its end face, and the air inlet (104) is installed in the air inlet mounting hole (1012).

3. The uniform dispersion gas heating track device of claim 2, wherein: The air guide groove (102) has an alignment mounting port (1021) at its end, which corresponds to the air inlet mounting hole (1012) on the outer wall of the track base (101).

4. The uniform, diffuse gas heated track apparatus of claim 3, wherein: The air guide groove (102) is installed on the outer wall of the groove (1013) and the inner wall of the air guide groove (102) and the groove (1013) form an air intake channel (1022). The air intake channel (1022) corresponds to the air inlet (1014) opened on the outer wall of the groove (1013).

5. The uniform, diffuse gas heating track device of claim 4, wherein: A flow-dividing structure is provided on the side wall of the air guide groove (102). The flow-dividing structure is an array of flow-dividing ribs with a gradually changing cross section, and the flow-dividing structure extends along the length direction of the air guide groove (102).

6. The uniformly dispersed gas heating track device as described in claim 5, characterized in that: The track cover (103) has multiple sets of alignment screw holes (1031), and the track base (101) has corresponding mounting screw holes (1011). Screws pass through the alignment screw holes (1031) and are screwed into the mounting screw holes (1011) to achieve a fixed connection between the track cover (103) and the track base (101).

7. The uniformly dispersed gas heating track device as described in claim 6, characterized in that: The opening (1032) of the track cover (103) is a small circular hole, and the opening (1032) is arranged in multiple rows in an alternating array with the hole spacing uniformly set along the track length direction.

8. The uniformly dispersed gas heating track device as described in claim 7, characterized in that: The heating plate (105) is closely attached to the back of the track base (101), and a resistance heating wire is embedded inside the heating plate (105). The coverage area of ​​the heating plate (105) matches the length and width of the air guide groove (102).

9. The uniformly dispersed gas heating track device as described in claim 8, characterized in that: The upper and lower ends of the track base (101) are respectively provided with mounting holes perpendicular to the length direction. The thermocouple (106) is inserted into the mounting hole from the side. The temperature sensing end (1061) of the thermocouple (106) is close to the outer wall of the air guide groove (102).

10. The uniformly dispersed gas heating track device as described in claim 9, characterized in that: The outer wall of the air guide groove (102) and the inner wall of the groove (1013) of the track base (101) are press-fitted to reduce gas leakage.

Images