EMB-based PCB large-current layout structure and method

Abstract

This invention discloses a PCB high-current layout structure and method based on EMB (Electronic Power Module), relating to the field of PCB high-current layout technology. It includes a PCB body, on which high-current trace areas corresponding to the three-phase motor power supply circuit of the EMB system are divided. Each high-current trace area is provided with at least one current-carrying enhancement structure. The current-carrying enhancement structure includes any one or more combinations of a board-edge exposed copper solder enhancement structure, a segmented metal block current-carrying structure, and an integral polygonal metal current-carrying structure. This invention significantly improves the current-carrying capacity of high-current traces without increasing the PCB area through three flexibly combinable current-carrying enhancement structures, perfectly adapting to the compact design requirements of EMB systems with limited installation space. The current-carrying enhancement structure also has a heat dissipation enhancement function, significantly improving heat dissipation efficiency, effectively solving the problem of localized overheating of traces under instantaneous high-current conditions, delaying PCB aging, and improving the operational stability of the EMB system.

Description

Technical Field

[0001] This invention relates to the field of PCB high-current layout technology, specifically to a PCB high-current layout structure and method based on EMB. Background Technology

[0002] Electro-Mechanical Brake (EMB) systems are a new generation of brake-by-wire technology. Their controllers need to drive a three-phase motor to generate braking force. The current drawn during motor startup is extremely high; the power supply current connected to the connector on the PCB can reach tens of amperes or even higher. Existing technologies typically address the issues of high current carrying capacity and heat dissipation by increasing the thickness of the PCB copper layer (e.g., using 2oz, 3oz, or even higher copper thickness) and laying large copper areas on each layer.

[0003] However, as Figure 1 As shown in the shaded area, the aforementioned existing technologies, by thickening the copper layer and laying large areas of copper, significantly increase the bare PCB area, making it unsuitable for the compact installation space requirements of EMB controllers. Simultaneously, the copper foil generates significant heat during high current transmission, and relying solely on the copper foil's own heat dissipation capacity is insufficient to meet thermal design requirements, easily leading to localized overheating and affecting the reliability and lifespan of electronic components. Furthermore, existing solutions lack flexibility and adjustability, failing to optimize design based on different current carrying capacity requirements, cost budgets, and mechanical housing height limitations. Therefore, there is an urgent need for a PCB layout solution that improves current carrying capacity and heat dissipation efficiency without increasing the PCB area. Summary of the Invention

[0004] This invention provides a PCB high-current layout structure and method based on EMB to solve the problems mentioned in the background art.

[0005] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: A PCB high-current layout structure and method based on EMB includes: a PCB body, wherein the PCB body is divided into high-current trace areas corresponding to the three-phase motor power supply circuit of the EMB system, and the high-current trace areas are provided with at least one current-carrying enhancement structure; the current-carrying enhancement structure includes any one or more combinations of board edge exposed copper solder enhancement structure, segmented metal block current-carrying structure, and integral polygonal metal current-carrying structure.

[0006] A further improvement of the technical solution of the present invention is that: the exposed copper solder reinforcement structure at the board edge includes an exposed copper area formed by removing the solder mask layer at the edge position of the high current trace board, and the surface of the exposed copper area is printed with a solder layer.

[0007] A further improvement of the technical solution of the present invention is that: the segmented metal block current-carrying structure includes multiple small metal blocks, and the multiple small metal blocks are welded one-to-one to the narrow section of the high current line and form an electrical connection with the corresponding high current line.

[0008] A further improvement of the technical solution of the present invention is that: the integral polygonal metal current-carrying structure includes a whole polygonal metal part, which is welded to the surface of all high current traces in the high current trace area and forms an electrical connection with each high current trace.

[0009] A further improvement of the technical solution of the present invention is that: the PCB body is a multi-layer board structure, including a top signal routing layer, an intermediate power ground layer, an intermediate power supply layer and a bottom power routing layer, the main return line of the high current routing area is arranged on the bottom power routing layer, and the high current routing area adopts a full-surface copper-filled design.

[0010] A further improvement of the technical solution of the present invention is that: the exposed copper area is set along the extension direction of the high current trace, the thickness of the solder layer is 1mm-1.5mm, and the width of the solder layer is the same as the width of the exposed copper area.

[0011] A further improvement of the technical solution of the present invention is that: the metal block is made of copper, the shape of the metal block is rectangular, both ends of the metal block extend to the outside of the narrow section of the trace, and the cross-sectional area of ​​the metal block is larger than the cross-sectional area of ​​the copper foil of the corresponding narrow section of the trace.

[0012] A further improvement of the technical solution of the present invention is that: the polygonal metal part is made of copper, its outer contour matches the outer contour of the high current trace area, the polygonal metal part has a hollow groove to avoid the pins of components on the PCB body, and the thickness of the polygonal metal part is 0.3mm-2mm.

[0013] A further improvement of the technical solution of the present invention is that: the high current routing area includes the motor positive bus routing, the motor negative bus routing, and the UVW three-phase output routing; the exposed copper solder reinforcement structure on the board edge is located at the board edge of the motor positive and negative bus routing; the segmented metal block current-carrying structure is located in the narrow section of the UVW three-phase output routing; and the integral polygonal metal current-carrying structure simultaneously covers the motor positive and negative bus routing and the UVW three-phase output routing.

[0014] A further improvement of the technical solution of the present invention lies in: adopting the layout structure described in any one of claims 1-9, comprising the following steps: S1: Layout area division: Based on the circuit function of the EMB system, divide the PCB body into high current routing areas corresponding to the three-phase motor power supply circuit. S2: Basic wiring layout: The motor positive busbar wiring, motor negative busbar wiring and UVW three-phase output wiring are laid in the high current wiring area. The whole surface copper pour design is adopted to match the high current transmission requirements of the EMB system three-phase motor starting. S3: Current carrying capacity enhancement scheme matching: Based on the current carrying capacity requirements of the EMB system, the height limit of the PCB installation space and the cost budget, select one or more combinations of the following as the current carrying capacity enhancement structure: exposed copper solder reinforcement structure at the board edge, segmented metal block current carrying structure, and integral polygonal metal current carrying structure; S4: Current-carrying enhancement structure layout: If the exposed copper solder reinforcement structure is selected, the solder mask layer is removed at the edge of the board where the high current trace is located to form an exposed copper area, and a solder layer is printed on the surface of the exposed copper area. If a segmented metal block current-carrying structure is selected, a metal block of the corresponding size is welded to the narrow section of the high-current trace, so that the metal block and the corresponding trace are electrically connected. If an integral polygonal metal current-carrying structure is selected, the polygonal metal parts that match the high current trace area are soldered to the surface of all high current traces, so that the polygonal metal parts and each high current trace are electrically connected. S5: Layout Verification: Perform current carrying capacity simulation and thermal simulation on the completed PCB layout to verify the current carrying capacity and heat dissipation performance of high current traces. If the design requirements are not met, adjust the size, material or combination of the current carrying capacity enhancement structure until the design requirements of the EMB system are met.

[0015] Due to the adoption of the above technical solution, the technical progress achieved by this invention compared to the prior art is as follows: This invention provides a PCB high-current layout structure and method based on EMB. Through three flexibly combinable current-carrying enhancement structures, the current-carrying capacity of high-current traces is significantly improved without increasing the PCB area, perfectly adapting to the compact design requirements of EMB systems with limited installation space. The current-carrying enhancement structure also has a heat dissipation enhancement function, significantly improving heat dissipation efficiency, effectively solving the problem of local overheating of traces under instantaneous high current conditions, delaying PCB aging, and improving the operational stability of the EMB system. It can be flexibly combined according to current carrying requirements, installation height limits, and cost budgets to achieve a precise balance between performance and cost. The optimized via and tin plating layer design further improves the reliability of high-current transmission, and all structures are compatible with existing SMT processes, making them easy to mass-produce and possessing extremely high engineering application value. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the prior art structure of the present invention; Figure 2 This is a schematic diagram of the exposed copper solder reinforcement structure at the board edge of the present invention; Figure 3 This is a schematic diagram of the segmented metal block current-carrying structure of the present invention; Figure 4 This is a schematic diagram of the integral polygonal metal current-carrying structure of the present invention.

[0017] In the diagram: 1. PCB body; 2. High current trace area; 3. Exposed copper solder reinforcement structure at the board edge; 31. Exposed copper area; 32. Solder layer; 4. Segmented metal block current-carrying structure; 41. Small metal block; 5. Integral polygonal metal current-carrying structure; 51. Polygonal metal component; 52. Cutout groove. Detailed Implementation

[0018] The present invention will be further described in detail below with reference to embodiments: Example 1, as Figures 1-4 As shown, this invention provides a PCB high-current layout structure and method based on EMB, including a PCB body 1. The PCB body 1 is divided into high-current trace areas 2 corresponding to the three-phase motor power supply circuit of the EMB system. The high-current trace areas 2 are provided with at least one current-carrying enhancement structure. The current-carrying enhancement structure includes any one or more combinations of the following: a board edge exposed copper solder enhancement structure 3, a segmented metal block current-carrying structure 4, and an integral polygonal metal current-carrying structure 5. The board edge exposed copper solder enhancement structure 3 includes removing the high-current traces at the board edge position. The exposed copper area 31 formed by the solder mask layer has a solder layer 32 printed on its surface. The PCB body 1 is a multi-layer board structure, including a top signal routing layer, an intermediate power ground layer, an intermediate power supply layer, and a bottom power routing layer. The main return line of the high current routing area 2 is arranged on the bottom power routing layer. The high current routing area 2 adopts a full-surface copper-filled design. The exposed copper area 31 is set along the extension direction of the high current routing area. The thickness of the solder layer 32 is 1mm-1.5mm, and the width of the solder layer 32 is the same as the width of the exposed copper area 31.

[0019] It should be noted that: PCB Body 1: This is the circuit carrier substrate of the EMB system controller, providing the foundation for the installation and wiring of all electrical structures; High Current Trace Area 2: This is a dedicated wiring area on the PCB body corresponding to the EMB three-phase motor power supply circuit, used for laying high current transmission lines; Exposed Copper Solder Reinforcement Structure 3: This is a basic current-carrying reinforcement structure used to improve the current-carrying capacity and heat dissipation performance of high current traces; Segmented Metal Block Current-Carrying Structure 4: This is a targeted current-carrying reinforcement structure used to strengthen the current-carrying and heat dissipation capacity of narrow trace sections; Overall Polygonal Metal Current-Carrying Structure 5: This is a full-area current-carrying reinforcement structure used to maximize the current-carrying and heat dissipation performance of the high current trace area; Exposed Copper Area 31: This is the copper foil area exposed after removing the solder mask layer on the edge of the high current trace board, providing an adhesion base for the solder layer; Solder Layer 32: This is a solder layer printed on the surface of the exposed copper area, used to increase the conductive cross-sectional area of ​​the trace and improve the current-carrying capacity; Top Layer Signal Routing Layer: This is the upper routing layer of the PCB body, used for laying EMB... The system's low-voltage control signal lines; intermediate power ground layer: the internal ground layer of the PCB body, used to provide a stable reference ground and achieve electromagnetic shielding; intermediate power layer: the internal power supply layer of the PCB body, used to lay out the low-voltage DC power supply lines of the EMB system; bottom power routing layer: the lower routing layer of the PCB body, used to lay out the main power loop lines of the high-current routing area.

[0020] In this embodiment, by dividing the PCB body into dedicated high-current routing areas and using a multi-layer board structure to lay out power lines and signal lines in layers, electromagnetic interference between strong and weak currents is avoided. At the same time, by reinforcing the structure with exposed copper solder on the board edge, the conductive cross-sectional area and heat dissipation area of ​​the high-current routing are increased without increasing the PCB area. This effectively improves the basic current carrying capacity of the high-current routing of the EMB system PCB, reduces line heating during high-current transmission, and is suitable for EMB system development scenarios with low current carrying capacity and low cost.

[0021] Example 2, as Figures 1-4 As shown, based on Embodiment 1, the present invention provides a technical solution: Preferably, the segmented metal block current-carrying structure 4 includes a plurality of metal blocks 41, which are welded one-to-one to the narrow section of the high-current trace and form an electrical connection with the corresponding high-current trace. The metal blocks 41 are made of copper and are rectangular in shape. The two ends of the metal blocks 41 extend to the outside of the narrow section of the trace, and the cross-sectional area of ​​the metal blocks 41 is larger than the cross-sectional area of ​​the copper foil of the corresponding narrow section of the trace.

[0022] It should be noted that: Metal piece 41 is a metal conductor welded to the narrow section of a high-current trace, used to specifically reinforce the current-carrying capacity at the bottleneck of the trace.

[0023] In this embodiment, by welding small metal blocks one-to-one to the narrow sections of high-current traces, the conductivity at the bottleneck of the trace is enhanced by using metal conductors with larger cross-sectional areas. This solves the problems of insufficient current carrying capacity and local overheating in narrow sections when traces avoid components. At the same time, the specifications of the small metal blocks can be flexibly adjusted according to the size of the narrow section of the trace. Under the premise of controlling costs, the stability and reliability of high current transmission in EMB system PCB under medium current carrying requirements are effectively improved.

[0024] Example 3, as Figures 1-4 As shown, based on Embodiment 1, the present invention provides a technical solution: Preferably, the integral polygonal metal current-carrying structure 5 includes a whole polygonal metal part 51, which is welded to the surface of all high current traces in the high current trace area 2 and forms an electrical connection with each high current trace. The polygonal metal part 51 is made of copper, and its outer contour matches the outer contour of the high current trace area 2. The polygonal metal part 51 has a hollow groove 52 to avoid the pins of components on the PCB body 1. The thickness of the polygonal metal part 51 is 0.3mm-2mm.

[0025] It should be noted that: polygonal metal part 51: is a whole piece of metal conductor covering all surfaces of high current traces, used to improve the current carrying capacity and heat dissipation capacity of high current traces throughout the entire area. Cutout groove 52: This is a clearance groove opened on the polygonal metal part to avoid the component pins on the PCB body, ensuring reliable bonding and soldering between the metal part and the PCB.

[0026] In this embodiment, by welding polygonal metal parts that match the contour of the high-current trace area to all high-current trace surfaces, the conductive cross-sectional area and overall heat dissipation area of ​​the high-current loop are significantly increased, which can meet the high-current transmission requirements of the EMB system under high current carrying capacity. At the same time, by using cutout slots to avoid component pins, reliable welding of the metal parts to the PCB traces is ensured, adapting to the compact and high-reliability design requirements of high-power EMB systems.

[0027] Example 4, as Figures 1-4 As shown, based on Embodiment 1, the present invention provides a technical solution: Preferably, the high current routing area 2 includes the motor positive busbar routing, the motor negative busbar routing, and the UVW three-phase output routing; the board edge exposed copper solder reinforcement structure 3 is provided at the board edge position of the motor positive and negative busbar routing; the segmented metal block current-carrying structure 4 is provided in the narrow section of the UVW three-phase output routing; and the integral polygonal metal current-carrying structure 5 simultaneously covers the motor positive and negative busbar routing and the UVW three-phase output routing. The layout method includes the following steps: S1: Layout area division: Based on the circuit function of the EMB system, divide the PCB body 1 into a high current trace area 2 corresponding to the three-phase motor power supply circuit. S2: Basic wiring layout: The motor positive busbar wiring, motor negative busbar wiring and UVW three-phase output wiring are laid in the high current wiring area 2. The whole surface copper pour design is adopted to match the high current transmission requirements of the three-phase motor starting in the EMB system. S3: Current carrying capacity enhancement scheme matching: Based on the current carrying capacity requirements of the EMB system, the height limit requirements of PCB installation space and cost budget, select one or more combinations of the following as the current carrying capacity enhancement structure: board edge exposed copper solder reinforcement structure 3, segmented metal block current carrying structure 4, and integral polygonal metal current carrying structure 5. S4: Current-carrying enhancement structure layout: If the exposed copper solder reinforcement structure 3 is selected, the solder mask layer is removed at the edge of the high current trace to form an exposed copper area 31, and a solder layer 32 is printed on the surface of the exposed copper area 31. If the segmented metal block current-carrying structure 4 is selected, a metal block 41 of the corresponding size is welded to the narrow section of the high current line so that the metal block 41 and the corresponding line form an electrical connection. If the integral polygonal metal current-carrying structure 5 is selected, the polygonal metal part 51 that matches the high current trace area 2 is soldered to the surface of all high current traces, so that the polygonal metal part 51 and each high current trace are electrically connected. S5: Layout Verification: Perform current-carrying capacity and thermal simulation on the completed PCB layout to verify the current-carrying capacity and heat dissipation performance of high-current traces. If the design requirements are not met, adjust the size, material, or combination of the current-enhancing structure until the design requirements of the EMB system are met. It should be noted that: the positive busbar routing of the motor is the core power supply line in the high current routing area, used to transmit the high forward operating current of the EMB system brake motor; the negative busbar routing of the motor is the core return current line in the high current routing area, used to transmit the high reverse return current of the EMB system brake motor; the UVW three-phase output routing is the three-phase drive line in the high current routing area, used to transmit drive current to the windings of the EMB system three-phase brake motor.

[0028] In this embodiment, a standardized process of layout area division, basic trace layout, current-carrying enhancement scheme matching, current-carrying enhancement structure layout, and layout verification is implemented to achieve standardized design of high-current layout for EMB system PCBs. Based on the actual current-carrying requirements, installation height limits, and cost budget of the EMB system, one or more combinations of current-carrying enhancement structures can be flexibly selected. Simulation verification forms a closed-loop optimized layout scheme, ensuring that the current-carrying capacity and heat dissipation performance of the PCB high-current traces meet design requirements. This significantly shortens the development cycle of the EMB system controller PCB and improves the adaptability and engineering practicality of the layout design.

[0029] The working principle of this EMB-based PCB high-current layout structure and method will be explained in detail below.

[0030] like Figures 1-4 As shown, the PCB body 1 adopts a multi-layer board structure. The top signal routing layer is used to lay out low-voltage control signals, the middle power ground layer and the middle power supply layer provide stable reference ground and low-voltage power supply, and the bottom power routing layer is used to centrally lay out high-current main circuits, thereby achieving strong and weak current isolation and avoiding electromagnetic interference. In the high-current routing area 2 (including the positive and negative busbars of the motor and the UVW three-phase output routing), a full-surface copper-filled design is used to ensure the basic current carrying capacity. To further improve current carrying capacity and heat dissipation without increasing PCB area, one or more combinations of three current carrying capacity enhancement structures can be selected according to actual needs: The first is the exposed copper solder reinforcement structure 3, which removes the solder mask layer at the board edge to form an exposed copper area 31 and prints a solder layer 32, increasing the conductive cross-sectional area and utilizing solder to assist heat dissipation, resulting in the lowest cost; the second is the segmented metal block current carrying structure 4, which welds small copper metal blocks 41 to the narrow sections of high-current traces, using a larger cross-sectional area metal "bridge" to reinforce the bottleneck and avoid local overheating; the third is the integral polygonal metal current carrying structure 5, which welds a copper polygonal metal part 51 matching the contour of the high-current trace area to the surface of all high-current traces, with a cutout groove 52 avoiding component pins, significantly increasing the overall current carrying and heat dissipation area. These three structures can be used in combination to achieve multi-level enhancement of "basic + reinforcement + global". Closed-loop optimization through the standardized layout process from S1 to S5 (area division, trace layout, scheme matching, structural layout, simulation verification) ensures that current carrying capacity and heat dissipation meet design specifications. Heat is mainly dissipated through convection between the metal block and the air or through conduction between the metal block and the mechanical housing, resulting in a significantly improved heat dissipation efficiency compared to pure copper foil.

[0031] The present invention has been described in detail above. However, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, any modifications or improvements that do not depart from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A PCB high-current layout structure based on EMB, characterized in that: The PCB body (1) is divided into a high-current trace area (2) corresponding to the three-phase motor power supply circuit of the EMB system. The high-current trace area (2) is provided with at least one current-carrying enhancement structure. The current-carrying enhancement structure includes any one or more combinations of the following: board edge exposed copper solder enhancement structure (3), segmented metal block current-carrying structure (4), and integral polygonal metal current-carrying structure (5).

2. The PCB high-current layout structure based on EMB according to claim 1, characterized in that: The exposed copper solder reinforcement structure (3) includes an exposed copper area (31) formed by removing the solder mask layer at the edge of the high current trace board, and the surface of the exposed copper area (31) is printed with a solder layer (32).

3. The PCB high-current layout structure based on EMB according to claim 1, characterized in that: The segmented metal block current-carrying structure (4) includes multiple metal blocks (41), which are welded one-to-one to the narrow section of the high current line and form an electrical connection with the corresponding high current line.

4. The PCB high-current layout structure based on EMB according to claim 1, characterized in that: The integral polygonal metal current-carrying structure (5) includes a whole polygonal metal part (51), which is welded to the surface of all high current traces in the high current trace area (2) and forms an electrical connection with each high current trace.

5. A PCB high-current layout structure based on EMB according to claim 1, characterized in that: The PCB body (1) is a multi-layer board structure, including a top signal routing layer, an intermediate power ground layer, an intermediate power supply layer and a bottom power routing layer. The main return line of the high current routing area (2) is laid on the bottom power routing layer. The high current routing area (2) adopts a full-surface copper-filled design.

6. The PCB high-current layout structure based on EMB according to claim 2, characterized in that: The exposed copper area (31) is set along the extension direction of the high current line, the thickness of the solder layer (32) is 1mm-1.5mm, and the width of the solder layer (32) is the same as the width of the exposed copper area (31).

7. A PCB high-current layout structure based on EMB according to claim 3, characterized in that: The metal block (41) is made of copper and is rectangular in shape. Both ends of the metal block (41) extend to the outside of the narrow section of the trace, and the cross-sectional area of ​​the metal block (41) is larger than the cross-sectional area of ​​the copper foil of the corresponding narrow section of the trace.

8. A PCB high-current layout structure based on EMB according to claim 4, characterized in that: The polygonal metal part (51) is made of copper, and its outer contour matches the outer contour of the high current trace area (2). The polygonal metal part (51) has a hollowed-out groove (52) to avoid the component pins on the PCB body (1). The thickness of the polygonal metal part (51) is 0.3mm-2mm.

9. A PCB high-current layout structure based on EMB according to claim 1, characterized in that: The high-current routing area (2) includes the motor positive bus routing, the motor negative bus routing, and the UVW three-phase output routing. The exposed copper solder reinforcement structure (3) is located at the edge of the motor positive and negative bus routing. The segmented metal block current-carrying structure (4) is located in the narrow section of the UVW three-phase output routing. The integral polygonal metal current-carrying structure (5) simultaneously covers the motor positive and negative bus routing and the UVW three-phase output routing.

10. A PCB high-current layout method based on EMB, characterized in that: The layout structure described in any of claims 1-9 is adopted. Includes the following steps: S1: Layout area division: According to the circuit function of the EMB system, divide the high current trace area (2) on the PCB body (1) corresponding to the three-phase motor power supply circuit. S2: Basic wiring layout: In the high current wiring area (2), the motor positive busbar wiring, the motor negative busbar wiring and the UVW three-phase output wiring are laid out. The whole surface copper-filled design is adopted to match the high current transmission requirements of the EMB system three-phase motor starting. S3: Current carrying capacity enhancement scheme matching: Based on the current carrying capacity requirements of the EMB system, the height limit requirements of PCB installation space and cost budget, select one or more combinations of the following as the current carrying capacity enhancement structure: exposed copper solder reinforcement structure (3), segmented metal block current carrying structure (4), and integral polygonal metal current carrying structure (5); S4: Current-carrying enhancement structure layout: If the exposed copper solder reinforcement structure (3) is selected, the solder mask layer is removed at the edge of the high current trace to form an exposed copper area (31), and a solder layer (32) is printed on the surface of the exposed copper area (31). If a segmented metal block current-carrying structure (4) is selected, a metal block (41) of the corresponding size is welded to the narrow section of the high current line so that the metal block (41) and the corresponding line are electrically connected. If an integral polygonal metal current-carrying structure (5) is selected, the polygonal metal part (51) that matches the high current trace area (2) is soldered to the surface of all high current traces, so that the polygonal metal part (51) and each high current trace are electrically connected. S5: Layout Verification: Perform current carrying capacity simulation and thermal simulation on the completed PCB layout to verify the current carrying capacity and heat dissipation performance of high current traces. If the design requirements are not met, adjust the size, material or combination of the current carrying capacity enhancement structure until the design requirements of the EMB system are met.

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