Method for manufacturing a printed circuit board and printed circuit board

Abstract

This invention discloses a method for manufacturing a printed circuit board (PCB) and the PCB itself. The method involves fabricating gold fingers on one side of the PCB, including: fabricating a substrate layer; forming the gold fingers on the outer side of the substrate layer; providing a release element on the substrate layer; providing an outer layer on the outer side of the substrate layer; and removing a portion of the outer layer through the release element to expose the gold fingers. By providing gold fingers on one side of the substrate layer and an outer layer above the gold fingers, with the outer layer connected to the substrate layer, the PCB has a larger circuit printing area, resulting in higher performance after manufacturing. Simultaneously, removing a portion of the outer layer to expose the gold fingers facilitates subsequent use of the PCB, and the assembled connection provides higher strength to meet data transmission requirements, improving the reliability of the PCB.

Description

Technical Field

[0001] This invention relates to the field of printed circuit board technology, and in particular to a method for manufacturing a printed circuit board and a printed circuit board. Background Technology

[0002] In existing printed circuit board (PCB) manufacturing processes, it is suitable to place gold fingers on one side of the PCB for connection and relatively stable signal transmission. However, in related technologies, to make the gold fingers more reliable, the PCB is often placed on one side of the gold fingers, with no circuit structure on the upper side perpendicular to the gold fingers. This results in a relatively small printed area and fewer circuit structures on the PCB, which cannot meet the increasingly demanding performance requirements. Therefore, it is essential to develop a PCB with a larger circuit area. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, one object of the present invention is to provide a method for manufacturing a printed circuit board, which can produce a printed circuit board with higher performance to meet higher usage requirements.

[0004] Another object of the present invention is to provide a printed circuit board manufactured by the method for manufacturing the printed circuit board.

[0005] According to an embodiment of the present invention, a method for manufacturing a printed circuit board includes forming gold fingers on one side of the printed circuit board, comprising: A substrate layer is fabricated, and the gold fingers are formed on the outer side of the substrate layer; A release mechanism is provided on the substrate layer; An outer layer is provided on the outside of the substrate layer; The outer layer is partially removed by the detacher to expose the gold fingers.

[0006] According to the manufacturing method of the printed circuit board of the present invention, gold fingers are provided on one side of the substrate layer, and an outer layer is provided on the upper side of the gold fingers. The outer layer is connected to the substrate layer to give the printed circuit board a larger circuit printing area, thereby improving the performance of the printed circuit board after subsequent manufacturing. At the same time, a partial removal of the outer layer is used to expose the gold fingers, which facilitates the use of the printed circuit board and provides higher connection strength after connection and assembly to meet data transmission requirements, thereby improving the reliability of the printed circuit board.

[0007] In some embodiments, the release element includes: a solder resist block and an adhesive tape. The step of providing the release element on the substrate layer includes: the solder resist block being disposed on the substrate layer, the adhesive tape being adhered to the solder resist block, and the free end of the adhesive tape being aligned with the gold finger.

[0008] In some embodiments, a release element is provided on the outer side of the substrate layer. The release element is adapted to assist in the release of a portion of the outer layer. Specifically, the release element includes a solder mask block and an adhesive tape. The solder mask block is constructed on the substrate layer and is adapted to serve as an assembly restriction position for the adhesive tape, allowing one end of the adhesive tape to be attached to the solder mask block, while the other end of the adhesive tape is adapted to align with the gold fingers. During the removal of a portion of the outer layer, the corresponding outer layer structure can be removed by peeling off the adhesive tape, thereby exposing the gold fingers. This allows the printed circuit board to make more reliable connections through the gold fingers, improving the performance of the printed circuit board. Simultaneously, the circuit printing area of ​​the printed circuit board is adapted to be expanded by the remaining portion of the outer layer structure, further enhancing the performance of the printed circuit board.

[0009] In some embodiments, the step of removing a portion of the outer layer through the release member to expose the gold finger includes: A first perforation is provided on the substrate layer, the first perforation extends upward and passes through the adhesive tape.

[0010] In some embodiments, a first through hole is provided on the substrate layer, through which the adhesive tape is passed, so that the subsequent adhesive tape is separated, avoiding the impact of the overall peeling of the adhesive tape on the structure of the substrate layer, thereby reducing the impact on the gold fingers and improving the reliability of the gold fingers. At the same time, the separated adhesive tape is easier to peel off during the process, improving the production efficiency of the printed circuit board.

[0011] In some embodiments, the step of removing a portion of the outer layer through the release member to expose the gold finger further includes: The outer layer is provided with a second through hole, which extends downward and penetrates the outer layer and extends to the outside of the solder mask block.

[0012] In some embodiments, the second perforation is adapted to provide a positioning function to correspond to the solder mask block, so that the specified outer layer structure can be peeled off according to the design during the subsequent peeling process to meet the design requirements, and the gold fingers can be exposed in subsequent processes.

[0013] In some embodiments, the step of removing a portion of the outer layer through the release member to expose the gold finger further includes: The outer layer is also provided with a third through hole, which is located inside the second through hole and extends at least into the solder resist block.

[0014] In some embodiments, the second through-hole is adapted to determine the position of the third through-hole so that by allowing the third through-hole to pass through the solder mask, the peeling range can be determined by the tape and the second and third through-holes when peeling off the outer layer structure, simplifying the peeling process, improving peeling efficiency, and allowing the specified outer layer structure to be peeled off as needed, resulting in higher production efficiency of the printed circuit board and better performance of the produced printed circuit board.

[0015] In some embodiments, the step of removing a portion of the outer layer through the release member to expose the gold finger further includes: After the first, second, and third perforations are all arranged in the designated positions according to the design, the top cover of the gold finger is opened by removing the tape and the outer layer restricted by the second and third perforations.

[0016] In some embodiments, after determining that the first through hole, the second through hole, and the third through hole are set in the designated positions, it is appropriate to indicate that the positioning of the peeling portion has been completed, and the outer layer can be peeled off according to the positions of the tape and the through holes to complete the construction of the printed circuit board.

[0017] In some embodiments, the substrate layer includes: The first layer and the second layer are located on the upper side of the first layer. The solder resist block and the tape are located on the outer side of the second layer. The gold fingers are located at the same end of the first layer and the second layer.

[0018] In some embodiments, for ease of understanding of this solution, it is suitable to divide the substrate layer into a first layer and a second layer, with the second layer disposed above the first layer, and gold fingers arranged at the same end of the first and second layers to facilitate the subsequent arrangement of solder mask blocks and tape. After the solder mask blocks and tape are arranged in the designated positions, an outer layer is arranged on the solder mask blocks and tape for subsequent processing.

[0019] In some embodiments, a laser blind hole is provided on the first layer, the laser blind hole extends at least to the second layer, and the laser blind hole is filled with a conductive medium.

[0020] In some embodiments, a laser blind via is adapted to be constructed in the first layer. The laser blind via extends at least into the second layer to penetrate multiple conductive layers, and then a conductive medium is filled within the laser blind via to enable signal interaction and transmission between the multiple conductive layers. In this way, when signal interaction is required on the printed circuit board, it is suitable to perform the interaction at a designated location.

[0021] In some embodiments, the step of providing an outer layer on the outside of the substrate layer further includes: A through-hole, one end of which is disposed within the substrate layer and the other end of which is disposed within the outer layer, wherein resin is disposed within the through-hole.

[0022] In some embodiments, by providing through-holes that penetrate the outer layer and the substrate layer, resin is arranged at the through-holes to construct the corresponding printed circuit board for production.

[0023] According to an embodiment of the present invention, the printed circuit board is manufactured by the printed circuit board manufacturing method described above.

[0024] The printed circuit board according to embodiments of the present invention, manufactured by the method described above, features gold fingers on one side of a substrate layer and an outer layer above the gold fingers, with the outer layer connected to the substrate layer. This allows the printed circuit board to have a larger circuit printing area, resulting in higher performance after manufacturing. Furthermore, removing part of the outer layer through a capping process exposes the gold fingers, facilitating subsequent use of the printed circuit board and providing higher connection strength after assembly to meet data transmission requirements, thus improving the reliability of the printed circuit board.

[0025] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0026] The above and / or additional aspects and advantages of the present invention will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic flowchart of a method for manufacturing a printed circuit board according to an embodiment of the present invention; Figure 2 This is a schematic diagram of the manufacturing process of a printed circuit board according to an embodiment of the present invention; Figure 3 This is a schematic diagram of the manufacturing process of a printed circuit board according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the manufacturing process of a printed circuit board according to an embodiment of the present invention; Figure 5 This is a schematic diagram of the manufacturing process of a printed circuit board according to an embodiment of the present invention; Figure 6 This is a schematic diagram of the manufacturing process of a printed circuit board according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the manufacturing process of a printed circuit board according to an embodiment of the present invention; Figure 8This is a schematic diagram of the manufacturing process of a printed circuit board according to an embodiment of the present invention; Figure label: Printed circuit board 10, Substrate layer 100, gold finger 110, first through hole 120, first layer 130, second layer 140, laser blind hole 150, conductive dielectric 160, through hole 170, resin 180. Release component 200, solder resist block 210, tape 220, The outer layer is 300, the second perforation is 310, and the third perforation is 320. Detailed Implementation

[0027] The embodiments of the present invention are described in detail below. The embodiments described with reference to the accompanying drawings are exemplary. The embodiments of the present invention are described in detail below.

[0028] The following is for reference. Figures 1-8 A method for manufacturing a printed circuit board 10 according to an embodiment of the present invention is described, wherein gold fingers 110 are formed on one side of the printed circuit board 10, including: A substrate layer 100 is fabricated, and gold fingers 110 are formed on the outer side of the substrate layer 100. A release member 200 is provided on the substrate layer 100; An outer layer 300 is provided on the outside of the substrate layer 100; Part of the outer layer 300 is removed by removing part 200 to expose the gold finger 110.

[0029] It should be noted that in the existing manufacturing process of the printed circuit board 10, it is suitable to provide gold fingers 110 on one side of the circuit board for connection to achieve relatively stable signal transmission. However, in related technologies, to make the use of the gold fingers 110 more reliable, the printed circuit board 10 is often located on one side of the gold fingers 110, with no circuit structure on the upper side perpendicular to the gold fingers 110. This results in a relatively small printed area and fewer circuit structures for the printed circuit board 10, which cannot meet the increasingly demanding performance requirements. Therefore, it is essential to propose a printed circuit board 10 with a larger circuit area.

[0030] This application proposes a method for manufacturing a printed circuit board 10, which can produce a printed circuit board 10 with a larger circuit area.

[0031] Specifically, the manufacturing process of the printed circuit board 10 may include: preparing a substrate layer 100, providing a release member 200 on the substrate layer 100, providing a gold finger 110 at one end of the substrate layer 100, and providing an outer layer 300 on the upper side of the substrate layer 100. By performing an opening process on the outer side to remove part of the outer layer 300, while exposing the gold finger 110, the substrate layer 100 can also be connected to a portion of the outer layer 300, thereby increasing the circuit layout area of ​​the printed circuit board 10 and improving the performance of the printed circuit board 10.

[0032] According to the manufacturing method of the printed circuit board 10 of the present invention, a gold finger 110 is provided on one side of the substrate layer 100, and an outer layer 300 is provided on the upper side of the gold finger 110. The outer layer 300 is connected to the substrate layer 100 to give the printed circuit board 10 a larger circuit printing area, thereby giving the printed circuit board 10 higher performance after subsequent manufacturing. At the same time, a portion of the outer layer 300 is removed by opening the cover to expose the gold finger 110, which facilitates the subsequent use of the printed circuit board 10, and the connection strength after assembly is higher to meet data transmission requirements, thereby improving the reliability of the printed circuit board 10.

[0033] In some embodiments, the release element 200 includes: a solder resist block 210 and an adhesive tape 220. The step of providing the release element 200 on the substrate layer 100 includes: the solder resist block 210 is disposed on the substrate layer 100, the adhesive tape 220 is bonded to the solder resist block 210 and the free end of the adhesive tape 220 is aligned with the gold finger 110.

[0034] In other words, a release element 200 is provided on the outer side of the substrate layer 100. The release element 200 is adapted to assist in the release of a portion of the outer layer 300. Specifically, the release element 200 includes a solder mask block 210 and an adhesive tape 220. The solder mask block 210 is constructed on the substrate layer 100 and is adapted to be the assembly restriction position of the adhesive tape 220, so that one end of the adhesive tape 220 can be connected to the solder mask block 210, and the other end of the adhesive tape 220 is adapted to be aligned with the gold finger 110. During the process of removing a portion of the outer layer 300, the corresponding outer layer 300 structure can be removed by peeling off the adhesive tape 220, thereby exposing the gold finger 110. This allows the printed circuit board 10 to make a more reliable connection through the gold finger 110, improving the performance of the printed circuit board 10. At the same time, the circuit printing area of ​​the printed circuit board 10 is adapted to be expanded by the remaining portion of the outer layer 300 structure, thereby improving the performance of the printed circuit board 10.

[0035] In some embodiments, the step of removing a portion of the outer layer 300 by means of the release member 200 to expose the gold finger 110 includes: a first perforation 120 is provided on the substrate layer 100, the first perforation 120 extends upward and passes through the adhesive tape 220.

[0036] In this way, a first through hole 120 is provided on the substrate layer 100, and the first through hole 120 passes through the adhesive tape 220 so that the subsequent adhesive tape 220 is separated, avoiding the impact of the overall peeling of the adhesive tape 220 on the structure of the substrate layer 100 during the peeling process, thereby reducing the impact on the gold finger 110 and improving the reliability of the gold finger 110. At the same time, the separated adhesive tape 220 is more convenient to peel during the peeling process, improving the production efficiency of the printed circuit board 10.

[0037] In some embodiments, the step of removing a portion of the outer layer 300 through the release member 200 to expose the gold finger 110 further includes: a second through hole 310 is provided on the outer layer 300, the second through hole 310 extends downward and penetrates the outer layer 300 and extends to the outside of the solder mask block 210.

[0038] Understandably, the second perforation 310 is adapted to provide a positioning function to correspond to the solder mask block 210, so that the specified outer layer 300 structure can be peeled off according to the design during the subsequent peeling process to meet the design requirements, and the gold fingers 110 can be exposed in subsequent processes.

[0039] In some embodiments, the step of removing part of the outer layer 300 by the release member 200 to expose the gold finger 110 further includes: the outer layer 300 is also provided with a third through hole 320, the third through hole 320 is provided in the second through hole 310 and the third through hole 320 extends at least into the solder resist block 210.

[0040] In this way, the second through-hole 310 is suitable for determining the position of the third through-hole 320. By allowing the third through-hole 320 to pass through the solder mask block 210, the peeling range can be determined by the tape 220, the second through-hole 310, and the third through-hole 320 when peeling off the outer layer 300 structure. This simplifies the peeling process, improves peeling efficiency, and allows the specified outer layer 300 structure to be peeled off as needed. This results in higher production efficiency for the printed circuit board 10 and better performance of the produced printed circuit board 10.

[0041] In some embodiments, the step of removing part of the outer layer 300 through the release member 200 to expose the gold finger 110 further includes: after the first perforation 120, the second perforation 310 and the third perforation 320 are all arranged in the designated position according to the design, the top cover of the gold finger 110 is opened by removing the tape 220 and the outer layer 300 restricted by the second perforation 310 and the third perforation 320.

[0042] In other words, once the first perforation 120, the second perforation 310, and the third perforation 320 are positioned at the designated locations, it can be concluded that the positioning of the peeling portion has been completed. Subsequently, it is only necessary to peel off the outer layer 300 according to the positions of the tape 220 and the perforations to complete the construction of the printed circuit board 10.

[0043] In some embodiments, the substrate layer 100 includes a first layer 130 and a second layer 140, the second layer 140 being disposed on the upper side of the first layer 130, the solder resist block 210 and the adhesive tape 220 being disposed on the outer side of the second layer 140, and the gold finger 110 being disposed at the same end of the first layer 130 and the second layer 140.

[0044] It is understood that, for ease of understanding this solution, the substrate layer 100 is suitable to be divided into a first layer 130 and a second layer 140, with the second layer 140 disposed above the first layer 130, and the gold fingers 110 arranged at the same end of the first layer 130 and the second layer 140, so as to facilitate the subsequent arrangement of the solder mask 210 and the adhesive tape 220. After the solder mask 210 and the adhesive tape 220 are arranged in the designated positions, an outer layer 300 is arranged on the solder mask 210 and the adhesive tape 220 and subsequent processing steps are performed.

[0045] In some specific embodiments, the first layer 130, the second layer 140, and the outer layer 300 all include a dielectric layer and a conductive layer, which are arranged alternately. An insulating dielectric layer is disposed between adjacent conductive layers to isolate information interference between conductive layers and improve the reliability of the printed circuit board 10.

[0046] In some embodiments, a laser blind via 150 is provided on the first layer 130, extending at least into the second layer 140, and the laser blind via 150 is filled with a conductive medium 160. Thus, the first layer 130 is adapted to have the laser blind via 150 extending at least into the second layer 140 to penetrate multiple conductive layers, and then the conductive medium 160 is filled within the laser blind via 150 to enable signal exchange and transmission between the multiple conductive layers. In this way, when the printed circuit board 10 needs to perform signal exchange, it is suitable to perform the exchange at a designated location.

[0047] In some embodiments, the step of providing an outer layer 300 on the outside of the substrate layer 100 further includes: a through-hole 170, one end of which is disposed within the substrate layer 100 and the other end within the outer layer 300, and resin 180 disposed within the through-hole 170. Thus, by providing a through-hole 170 penetrating both the outer layer 300 and the substrate layer 100, resin 180 is arranged correspondingly at the through-hole 170, thereby constructing a corresponding printed circuit board 10 to complete production.

[0048] According to an embodiment of the present invention, the printed circuit board 10 is manufactured by the manufacturing method of the printed circuit board 10 described above.

[0049] In other words, during the manufacturing process of the printed circuit board 10 of this application, while maintaining the thickness of the gold fingers 110 to meet usage requirements, more circuit structures can be built on the horizontal side of the gold fingers 110 to improve performance. Simultaneously, a release element 200 is used to remove part of the structure to expose the gold fingers 110, simplifying the operation process and improving production efficiency.

[0050] Thus, since the printed circuit board 10 is manufactured using the method described above, a gold finger 110 is provided on one side of the substrate layer 100, and an outer layer 300 is provided on the upper side of the gold finger 110. The outer layer 300 is connected to the substrate layer 100 to allow the printed circuit board 10 to have a larger circuit printing area, resulting in higher performance after the printed circuit board 10 is manufactured. At the same time, by removing part of the outer layer 300 through a capping method to expose the gold finger 110, it is easier to use the printed circuit board 10, and the connection strength after assembly is higher to meet data transmission requirements, thereby improving the reliability of the printed circuit board 10.

[0051] Other configurations and operations of the printed circuit board 10 according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0052] In the description of this specification, references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example.

[0053] Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A method of manufacturing a printed circuit board, one side of which is built up with a gold finger, characterized by, include: A substrate layer is fabricated, and the gold fingers are formed on the outer side of the substrate layer; A release mechanism is provided on the substrate layer; An outer layer is provided on the outside of the substrate layer; The outer layer is partially removed by the detacher to expose the gold fingers.

2. The method of manufacturing a printed circuit board according to claim 1, characterized by, The release element includes: a solder resist block and adhesive tape, and the step of providing the release element on the substrate layer includes: The solder resist block is disposed on the substrate layer, and the tape is adhered to the solder resist block with the free end of the tape aligned with the gold finger.

3. The method of manufacturing a printed circuit board according to claim 2, characterized by, The step of removing a portion of the outer layer through the release member to expose the gold finger includes: A first perforation is provided on the substrate layer, the first perforation extends upward and passes through the adhesive tape.

4. The method of manufacturing a printed circuit board according to claim 3, characterized by, The step of removing a portion of the outer layer through the detacher to expose the gold finger further includes: The outer layer is provided with a second through hole, which extends downward and penetrates the outer layer and extends to the outside of the solder mask block.

5. The method for manufacturing a printed circuit board according to claim 4, characterized in that, The step of removing a portion of the outer layer through the detacher to expose the gold finger further includes: The outer layer is also provided with a third through hole, which is located inside the second through hole and extends at least into the solder resist block.

6. The method for manufacturing a printed circuit board according to claim 5, characterized in that, The step of removing part of the outer layer through the detacher to expose the gold finger further includes: After the first, second, and third perforations are all arranged in the designated positions according to the design, the top cover of the gold finger is opened by removing the tape and the outer layer restricted by the second and third perforations.

7. The method for manufacturing a printed circuit board according to claim 2, characterized in that, The substrate layer includes: The first layer and the second layer are located on the upper side of the first layer. The solder resist block and the tape are located on the outer side of the second layer. The gold fingers are located at the same end of the first layer and the second layer.

8. The method for manufacturing a printed circuit board according to claim 7, characterized in that, The first layer has a laser blind hole, which extends at least into the second layer and is filled with a conductive medium.

9. The method for manufacturing a printed circuit board according to claim 1, characterized in that, The step of providing an outer layer on the outside of the substrate layer further includes: A through-hole, one end of which is disposed within the substrate layer and the other end of which is disposed within the outer layer, wherein resin is disposed within the through-hole.

10. A printed circuit board, characterized in that, The printed circuit board is manufactured by the method for manufacturing a printed circuit board as described in any one of claims 1-9.

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