Circuit assembly and device with radio frequency contacts

Abstract

A circuit assembly includes a packaged electronic device having a radio frequency (RF) contact and a shield contact. The circuit assembly additionally includes a substrate coupled to the packaged electronic device and at least partially containing an internal conductive structure electrically coupled to the RF contact and an external conductive structure electrically coupled to the shield contact, the internal and external conductive structures forming a vertical coaxial structure through the substrate. The circuit assembly additionally includes a waveguide antenna electrically coupled to the coaxial structure on a side of the substrate opposite the packaged electronic device. Further embodiments are directed to a device suitable for use in a circuit assembly as described above.

Description

Technical Field

[0001] This invention relates to circuit assemblies and devices having radio frequency contacts. Background Technology

[0002] Radio frequency (RF) integrated circuits (“chips”) are typically fabricated in packages that transmit RF signals between the chip and external components. One type of package used for RF chips is a modified ball grid array (BGA). A modified BGA has a surface on which an array of solder balls (also known as solder “bumps”) are mounted. When the package is soldered to a circuit board, the solder balls connect to electrical nodes within the chip and engage with conductive pads on the circuit board.

[0003] The modified BGA includes conductive patches positioned between solder balls along an area on the same surface on which the solder ball array is mounted. The conductive patches are electrically coupled to an RF source within the chip. When the package is soldered to a circuit board, the conductive patches are vertically aligned with rectangular conductive trenches formed in the circuit board. The conductive trenches act as waveguides to transmit signals emitted by the conductive patches to an antenna beneath the circuit board.

[0004] A typical BGA for an RF chip may include multiple conductive pads for transmitting multiple RF signals. In a common arrangement, the RF chip can be implemented as an mmWave monolithic microwave integrated circuit (MMIC), and the aforementioned arrangement for transmitting RF signals can be referred to as an in-package transmitter (LiP). Summary of the Invention

[0005] Some embodiments relate to circuit assemblies. The circuit assembly includes a packaged electronic device having radio frequency (RF) contacts and shielding contacts. The circuit assembly further includes a substrate coupled to the packaged electronic device and at least partially comprising an internal conductive structure electrically coupled to the RF contacts and an external conductive structure electrically coupled to the shielding contacts. The internal and external conductive structures form a vertical coaxial structure through the substrate. The circuit assembly further includes a waveguide antenna electrically coupled to the coaxial structure on the side of the substrate opposite the packaged electronic device.

[0006] According to one or more other embodiments, the waveguide antenna includes a three-dimensional antenna and a stepped coaxial-to-waveguide transition.

[0007] According to one or more other embodiments, the packaged electronic device has a surface that exposes RF contacts and shielding contacts, and the substrate includes plated holes that are vertically aligned with the RF contacts and electrically coupled to the shielding contacts, the plated holes providing an external conductive structure with a coaxial configuration.

[0008] According to one or more other embodiments, the internal conductive structure of the coaxial structure includes RF pins that extend through plated vias in the substrate without touching the plated vias.

[0009] According to one or more other embodiments, a shielding contact is one of a plurality of shielding contacts that at least partially surround an RF contact along the surface of the packaged electronic device. The substrate includes one or more substrate contacts that are aligned with and electrically coupled to a plurality of shielding contacts and plated vias, and the plurality of shielding contacts are electrically coupled to the plated vias through the one or more substrate contacts.

[0010] According to one or more other embodiments, the package includes a package type selected from the group consisting of ball grid array packages and planar grid array packages, and the plurality of shielding contacts include conductive pads.

[0011] According to one or more other embodiments, the RF contact includes a contact pad, and the waveguide antenna includes an RF pin that extends upward from the waveguide antenna through a plated via in the substrate without touching the plated via and makes contact with the contact pad, the RF pin forming an internal conductive structure of a coaxial configuration.

[0012] According to one or more other embodiments, the packaged electronic device further includes RF pins that extend from the surface through plated vias in the substrate without touching the plated vias, the RF pins forming an internal conductive structure of a coaxial configuration.

[0013] According to one or more other embodiments, the pin is a spring-loaded spring-loaded pin.

[0014] According to one or more other embodiments, the shielding contact is one of a plurality of shielding contacts that at least partially surround the RF contact along the surface of the packaged electronics, and the plurality of shielding contacts are electrically coupled to plated vias.

[0015] According to one or more other embodiments, the plurality of shielded contacts include corresponding contact pads that are the same as the contact pads of the RF contacts, and the contact pads of the shielded contacts, rather than the RF contact pads, are connected to the substrate via one or more substrate contacts that are aligned with and electrically coupled to the plated vias.

[0016] According to one or more other embodiments, the contact pads of the shielded contacts are connected to one or more substrate contacts with solder balls, and the contact pads of the RF contacts are not attached to solder balls.

[0017] According to one or more other embodiments, the substrate includes a central through-hole that is vertically aligned with an RF contact and extends from a first side of the substrate to a second side of the substrate, wherein the central through-hole is connected to the RF contact to form an internal conductive structure of a coaxial structure.

[0018] According to one or more embodiments, the substrate includes a plurality of shielded vias, which at least partially surround a central via to form an external conductive structure with a coaxial structure. The shielded vias are electrically coupled to shielded contacts.

[0019] Another embodiment relates to packaged electronic devices. The packaged electronic device includes: an integrated circuit including an RF signal node and a shielding node; a package containing the integrated circuit, the package having a surface; a plurality of electrical contacts at the surface; and an RF pin coupled to the surface. The RF pin is electrically coupled to the RF signal node and extends further outward from the surface than the plurality of electrical contacts. The plurality of electrical contacts includes at least one contact electrically coupled to the shielding node and disposed adjacent to the RF pin.

[0020] According to one or more other embodiments, the plurality of electrical contacts includes at least one additional contact that is electrically coupled to a shielding node and disposed adjacent to an RF pin.

[0021] According to one or more other embodiments, the plurality of electrical contacts include corresponding contact pads.

[0022] According to one or more other embodiments, the packaged electronics further includes at least one additional RF pin coupled to at least one additional RF signal node, each additional RF pin extending further from the surface than the plurality of electrical contacts.

[0023] According to one or more other embodiments, laser-assisted bonding is used to solder RF pins, or each RF pin, to the package.

[0024] According to one or more other embodiments, a plurality of electrical contacts are arranged in a grid having rows and columns. RF pins are disposed at the intersection of a specific row of the grid and a specific column of the grid, and the RF pins are adjacent to (i) a first and second electrical contact among a plurality of electrical contacts in a specific row of the grid and an adjacent column of the grid, and (ii) a third and fourth electrical contact among a plurality of electrical contacts in a specific column of the grid and an adjacent row of the grid. Attached Figure Description

[0025] The foregoing and other features and advantages will become clear from the following description of specific embodiments as illustrated in the accompanying drawings, in which similar reference numerals refer to the same or similar parts in different views. The drawings are not necessarily drawn to scale, but are intended to illustrate the principles of various embodiments.

[0026] Figure 1 It is a front cross-sectional view of a first circuit assembly according to one or more embodiments.

[0027] Figure 2 According to one or more embodiments Figure 1 Example of an integrated circuit package: a bottom view.

[0028] Figure 3 According to one or more embodiments Figure 1 A top view of an example substrate.

[0029] Figure 4 According to one or more embodiments Figure 1 and 3 The example substrate is shown in a bottom view.

[0030] Figure 5 This is a front cross-sectional view of a second circuit assembly according to one or more embodiments.

[0031] Figure 6 This is a front cross-sectional view of a third circuit assembly according to one or more embodiments.

[0032] Figure 7 According to one or more embodiments Figure 6 The example substrate is shown in a bottom view.

[0033] Figure 8 It is a partially transparent upper left isometric view of a first circuit assembly according to one or more embodiments.

[0034] Figure 9 According to one or more embodiments Figure 1 The front view of an example device. Detailed Implementation

[0035] The aforementioned in-package transmitter (LiP), used to transmit RF signals between a chip and an antenna, exhibits low insertion loss and high return loss at microwave frequencies, making LiP technology well-suited for demanding applications such as radar (radio detection and ranging). However, the high performance of LiP technology comes at the cost of space, as the required conductive pad tends to be much larger than typical integrated circuit contacts. For example, even without considering the grounding shield typically required around the conductive pad, a single conductive pad can extend over the same area occupied by ten or more solder balls in a BGA. Careful optimization of the conductive pad's dimensions for coupling with waveguide antennas is required, and the size of the conductive pad cannot be easily changed. Consequently, LiP solutions tend to increase the size of RF device packages, consuming valuable space on the circuit board and resisting size reductions that typically accompany improvements in other components. Therefore, a method is needed to transmit RF signals using less space than that required by LiP solutions without significantly impacting performance.

[0036] The aforementioned requirements are addressed, at least in part, by improved techniques for transmitting RF signals between a packaged electronic device and a waveguide antenna. The packaged electronic device includes an integrated circuit configured to transmit and / or receive RF signals. The device is attached (e.g., soldered) to a first side of a substrate (e.g., a printed circuit board, ceramic substrate, or flexible board), and the waveguide antenna is attached (e.g., soldered, screwed, or otherwise secured) to a second side of the substrate opposite the first side. The device includes RF contacts and adjacent shielding contacts. Within the package of the device, the RF contacts and shielding contacts are electrically coupled to the RF circuitry of the integrated circuit. Outside the package of the device, the RF contacts are electrically coupled to the waveguide antenna along an internal conductive structure extending vertically through the substrate, and the shielding contacts are electrically coupled to the waveguide antenna along an external conductive structure at least partially surrounding the internal conductive structure. The internal and external conductive structures form a coaxial vertical structure that provides a controlled impedance path through the substrate, allowing the RF signal to propagate between the device and the waveguide antenna without significant loss or reflection.

[0037] Advantageously, the improved technique consumes less space than LiP solutions. It also delivers comparable insertion loss to LiP solutions, enabling further miniaturization of RF and microwave components while achieving similar performance.

[0038] According to one or more embodiments, the package includes RF pins electrically and mechanically connected to RF contacts. The RF pins extend through vertical vias in the substrate and into the antenna, thereby providing an internal conductor for the coaxial structure. The vertical vias are plated vias electrically coupled to shielding contacts, which can be provided, for example, as conventional solder balls for a ball grid array (BGA) or conventional connection pads for a planar grid array (LGA). Thus, the RF pins form the center conductor of the coaxial structure, and the plated vias form a shield for the coaxial structure spaced apart from the RF pins.

[0039] According to one or more other embodiments, the RF contact includes a contact pad, which may be flat or substantially flat. For example, the contact pad may be the same type of pad (e.g., same size, shape, and material) as a solder ball provided for attachment to a BGA or a connection pad provided for an LGA. The substrate has vertical plated vias aligned with the RF contact and electrically coupled to the shielding contact. In these embodiments, the antenna includes pins that extend upward through the plated vias in the substrate and abut against the RF contact. Thus, the coaxial structure is formed by an upwardly extending pin as a central conductor and a plated via as a shield.

[0040] According to one or more other embodiments, the RF contacts are provided as conventional contacts, such as solder balls for a BGA or pads for an LGA. The substrate includes a central through-hole electrically connected to the RF contacts. The substrate further includes a plurality of shielding through-holes laterally surrounding the central through-hole. The shielding through-holes are electrically coupled to shielding contacts of a package assembly. The internal through-holes and the shielding through-holes together form a vertical coaxial structure. A waveguide antenna is electrically coupled to a coaxial structure on a second side of the substrate.

[0041] Embodiments of the improved technique will now be described. It should be understood that such embodiments are provided as examples to illustrate certain features and principles, but are not intended to be limiting.

[0042] Figure 1 This is a front cross-sectional view of an example circuit assembly 100 according to one or more embodiments. The circuit assembly 100 includes packaged electronics 110, a substrate 160, and one or more waveguide antennas 180.

[0043] The packaged electronic device (“device”) 110 includes a package 120, one or more integrated circuits (chips) 130 (shown as a single chip) within the package 120, and various terminals. Terminals are formed at or on the bottom surface 122 of the package 120 and provide electrical contacts for transmitting signals, power, and ground to and from the device 110. In the depicted example, the device 110 is a ball grid array (BGA). However, other arrangements are also possible, such as a planar grid array (LGA).

[0044] The terminal includes both a standard terminal 140 and an RF pin 150. The standard terminal 140 includes a plurality of contact pads 142 fused to corresponding solder balls 144 (also referred to as solder "bumps" in the BGA example). The contact pads 142 can be connected to electrical nodes of the chip (or multiple chips) 130 within the package 120.

[0045] Each of the RF pins 150 has a proximal end and a distal end, the proximal end being attached to a corresponding RF contact 146 at or on surface 122, and the distal end extending perpendicularly away from surface 122 through substrate 160 and into a corresponding waveguide antenna 180. To bridge this distance, the RF pins 150 typically have a length of 0.5 cm to 1.0 cm, or approximately 0.5 cm to 1.0 cm, but the length can vary based on, for example, the substrate thickness of the waveguide antenna 180 and the coupling hardware. The RF contact 146 is a contact pad that can be similar in size, shape, and composition to the contact pad 142, but is not required to be identical to the contact pad 142. In this example, the RF pins 150 are attached to the RF contact 146 by soldering (e.g., laser-assisted bonding). Preferably, the RF pins 150 are attached to the contact 146 using a solder with a higher melting point than the solder used in the solder ball 144. A higher melting point ensures that device 110 can be soldered to substrate 160 without the risk of desoldering RF pin 150. In some arrangements (not shown), RF pin 150 may be attached to internal RF contacts within package 120, such as on the chip 130 itself or on contacts disposed on an interposer or fan-out structure encapsulated within package 120. Package 120 may be made of, for example, plastic or ceramic.

[0046] Chip 130 typically includes both an RF circuitry (i.e., a circuitry designed to operate at frequencies of tens of gigahertz or higher) and a non-RF circuitry (i.e., a circuitry designed to operate at lower frequencies). The RF circuitry includes RF signal nodes 132 and corresponding shielding nodes 134 (two of each shown). RF signal nodes 132 are electrically coupled to the RF outputs and / or RF inputs of chip 130, such as the outputs or inputs of an RF power amplifier, sensor, transmission line, splitter, or any other RF input or output terminal, and shielding nodes 134 are electrically coupled to local ground, system ground, or some other stable voltage source. RF signal nodes 132 are electrically coupled to RF contacts 146, and shielding nodes 134 are electrically coupled to contact pads 142, for example, shown as... Figure 1The rightmost RF pin 150 is adjacent to a marked contact pad 142. In some examples, multiple contact pads 142 surround the RF contact 146, with each such contact pad 142 electrically coupled to a shielding node 134. The contact pads 142 electrically coupled to the shielding node 134 may be referred to herein as “shielded contacts.” Preferably, the shielded contacts 142 for the RF contact 150 surround and are immediately adjacent to the RF contact 150. As used herein, “immediately adjacent” means that no other contact is inserted. Thus, two contacts are considered immediately adjacent when they are directly adjacent to each other without any other contact positioned between them.

[0047] Package 110 may include any number of RF pins 150. In this example, chip 130 is a monolithic microwave integrated circuit (MMIC) mounted in package 120 in a flip-chip arrangement, and package 120 is a flip-chip chip-scale package (FCCSP). However, embodiments are not limited to these examples.

[0048] Continue to refer to Figure 1 The substrate 160 has a top side (“first side”) 162 attached to the device 110 and a bottom side (“second side”) 164 attached to the waveguide antenna 180. The substrate 160 further includes one or more plated vias 170. Two plated vias 170 are shown, along with one of each of the two depicted RF pins 150. The RF pins 150 extend through the plated vias 170 without touching the sides of the plated vias 170.

[0049] The inner walls of the plated holes 170 are covered with metal, such as copper, aluminum, gold, etc., and each plated hole 170 has an upper shielding pad 172 and a lower shielding pad 174 electrically continuous with the metal wall of the corresponding plated hole 170. The upper surface 162 of the substrate 160 includes at least one substrate contact 156 (e.g., a pad or connector) adjacent to and electrically coupled to the shielding pad 172 of the corresponding plated hole 170. Preferably, a plurality of substrate contacts 156 closely surround the plated holes 170 and are electrically coupled to the shielding pads 172. Such substrate contacts 156 are additionally electrically coupled to corresponding shielding contacts 142 of the device 110, for example, via corresponding solder balls 144.

[0050] Each RF pin 150 and its associated plated via 170 define a vertical coaxial structure 162 through a substrate 160, wherein the RF pin 150 provides a center conductor and the plated via 170 provides shielding. Furthermore, the geometry of the RF pin 150 and the plated via 170, and the material between them, define the characteristic impedance of the coaxial structure 162, which can be consistently maintained across the thickness of the substrate 160. Preferably, the material between the RF pin 150 and the plated via 170 is air, which provides low dielectric loss at the intended operating frequency. In other words, when the RF pin 150 is inserted, an air dielectric exists between the RF pin 150 and the sides of the plated via 170. However, other materials, such as low-dielectric-constant plastics, can be used. Such plastics can also be used to keep the RF pin 150 centered within the plated via 170 during assembly. The characteristic impedance of the coaxial structure 162 can be altered by changing the width of the RF pin 150, the diameter of the plated via 170, and / or the material between the RF pin 150 and the plated via 170. It should be understood that RF signal transmission through the coaxial structure 162 is insensitive to the material constituting the substrate 160. For example, the substrate 160 can be made of standard FR-4 circuit board material without degrading RF performance.

[0051] Device 110 can form many other connections with substrate 160, such as for carrying power, grounding, signals, etc., which are omitted in the figure for clarity. Moreover, substrate 160 is usually much larger than depicted and typically has multiple devices attached thereto.

[0052] like Figure 1 As further shown, one or more waveguide antennas 180 are coupled to the bottom surface 164 of the substrate 160 opposite the device 110, for example using screws, solder, and / or other types of attachments. Each depicted waveguide antenna 180 has a conductive wall 182, a rectangular cross-section, and a stepped coaxial-to-waveguide transition 184. The stepped transition 184 is a hollow conductive structure inside the waveguide antenna that facilitates impedance matching with the corresponding coaxial structure 162. In some examples, the waveguide antenna 180 further includes a horn portion 186 for efficiently transmitting and / or receiving RF energy.

[0053] The connection between the coaxial structure 162 and the corresponding waveguide antenna 180 can be made in various ways, the details of which are not important to this disclosure. In one example, the waveguide antenna 180 includes a conductive tube 188 electrically coupled between the lower shielding pad 174 and the stepped transition 184. Preferably, the tube 188 has the same inner diameter as the plated hole 170. The RF pin 150 passes through the center of the tube 188 and enters the interior of the stepped transition 184 (e.g., through a gap hole), thereby completing the coaxial-to-waveguide connection. It should be understood that the arrangement shown is merely an example provided for illustration and is not intended to be limiting.

[0054] Figure 2 According to one or more embodiments, before attaching the device 110 to the substrate 160 Figure 1 A bottom plan view of an example device 110. Here, the ends of device 110 are arranged in a grid 210 having rows and columns. In the example shown, each RF pin 150 and its associated RF contact 146 are surrounded by a plurality of shielded contacts 142 (shown in crosshairs). The marked RF pins 150 are positioned in specific rows 220 and specific columns 230 of grid 210. Shielded contacts 142 are positioned in the same row 220 and adjacent columns (left and right), and in the same column 230 and adjacent rows (above and below). Additional shielded contacts 142 are positioned in the four indicated corners. In this way, coaxial shielding is provided around each RF pin 150. Within device 110, each RF pin 150 is electrically coupled to a corresponding RF node 132 ( Figure 1 Furthermore, shielded contacts 142 surrounding each RF pin 150 are coupled to corresponding shielded nodes 134. Other terminals 140 are electrically coupled to power, ground, and various signal nodes within the device 110.

[0055] In the example shown, each RF pin 150 occupies only a single location on grid 210. In fact, the RF pin 150 does not require more space on package 120 than the standard terminal 140. Therefore, RF connections can be made using a much smaller package space than required by existing LiP solutions.

[0056] Figure 3 Before assembly Figure 1 A top plan view of an example substrate 160. A plurality of substrate contacts 310 (e.g., pads or connection pads) are provided as mirror or substantially mirror images of corresponding contacts 142 of the device 110, i.e., for enabling the device 110 to be soldered to the substrate 160 via corresponding solder balls 144. The substrate contacts 310 include the aforementioned contacts 156 (shown with crosshairs), which connect to the shielding contacts 142 of the device 110 when the device is soldered to the substrate 160. Figure 3The plated vias 170 and associated upper shielding pads 172 can also be seen. In this example, substrate contacts 156 surrounding each plated via 170 are connected together via conductive traces 310 and to the corresponding upper shielding pads 172, thereby providing a shielding enclosure around the entrance of the plated via 170. As used herein, “trace” refers to a conductive feature, such as a portion of a patterned conductive layer on a printed circuit board or other substrate. While a shielding enclosure of the component-side pads 156 is preferred for optimal performance, it should be understood that only a single substrate contact 156 is required to be continuous with the shielding contact 142. In one or more embodiments, other substrate contacts may be omitted.

[0057] Figure 4 Before assembly Figure 1 A bottom plan view of the example substrate 160. The plated vias 170 are shown together with the associated lower shield pads 174. In this example, when the waveguide antenna 180 is attached to the substrate 160, the lower shield pads 174 are exposed for electrical connection with the corresponding tubes 188 of the waveguide antenna 180.

[0058] Figure 5 This is a front cross-sectional view of another circuit assembly 500 according to one or more embodiments. The circuit assembly 500 is similar to... Figure 1 The main difference of the circuit assembly 100 is that Figure 1 The RF pin 150 is not in device 110.1, but has been replaced by pin 510 (also referred to as the "RF pin") extending upward from waveguide antenna 180. In this example, pin 510 is a spring-loaded pin that is held compressed against the RF contact 146 of device 110.1 rather than engaged with device 110.1. Note that no solder balls 144 are provided for the RF contact 146. In these embodiments, coaxial structure 162.1 is formed with pin 510 providing a center conductor and plated via 170 providing shielding. Like circuit assembly 100, circuit assembly 500 is also insensitive to the material constituting the substrate because no substrate material is disposed between pin 510 and plated via 170. Other details of circuit assembly 500, including those of device 110.1, substrate 160, and waveguide antenna 180, are similar to or substantially similar to those described above. Figures 1 to 4 The details described.

[0059] Figure 6This is a front cross-sectional view of another circuit assembly 600 according to one or more embodiments. In these embodiments, the RF pin 150 has been replaced by a central via 610, i.e., a vertical conductive structure extending from the substrate contact 620 on the first surface 162 through the substrate (now labeled 160.1) to the substrate contact 630 on the second surface 164. The substrate 160.1 further includes a plurality of shielding vias 640 extending from the substrate contact 650 through the substrate 160.1 to the corresponding substrate contact 660, and laterally or substantially laterally surrounding the central via 610. The device now labeled 110.2 can use conventional terminals, such as solder balls 144 on the RF contact 146. Therefore, no special processing or additional manufacturing activities are required to accommodate these terminals. Preferably, the center through-hole 610 and the shielding through-hole 640 are solid through-holes rather than plated through-holes, because plated through-holes may draw in solder through capillary action and prevent the formation of a reliable solder joint between the device 110.2 and the substrate 160.1.

[0060] In circuit assembly 600, coaxial structure 162.2 is formed with a central via 610 providing a central conductor and a shielding via 640 providing shielding. In these embodiments, pins 670 (e.g., spring-loaded pins) may be disposed between waveguide antenna 180 and connection pad 630. Similar spring-loaded pins (not shown) or other structures may be provided for connecting second connection pad 660 to waveguide antenna 180. Unlike previous examples where the substrate material does not affect RF performance, circuit assembly 600 uses a substrate material between each central via 610 and its surrounding shielding via 640. Therefore, low dielectric constant substrate materials are preferred in these embodiments. Other details of circuit assembly 600, including details of device 110.2, substrate 160.1, and waveguide antenna 180, are similar to or substantially similar to the combination. Figures 1 to 4 The details described.

[0061] Figure 7 According to one or more embodiments Figure 6 A bottom plan view of substrate 160.1. Here, the substrate contact 630 for each central via 630 is surrounded by a total of eight substrate contacts 660 for the corresponding shielded via 640, all of which are preferably electrically coupled to a shielding node 134 within the chip 120. Additional connections between the substrate contacts 660 for the shielded vias 640 can be made using traces 710. The substrate contact 630 for each central via 610 provides contact points for pins 670, and the pads 660 for the shielded vias 640 provide contact points for shielded connections to the waveguide antenna 180, such as pins or other structures.

[0062] Figure 8This is a partially transparent isometric view of a circuit assembly 800 according to one or more embodiments. The circuit assembly 800 is intended to represent circuit assemblies 100, 500, and 600. The circuit assembly 800 can be usefully applied in automotive radar and other RF and microwave technologies. For example, the circuit assembly 800 can be provided as part of a radar sensor used in an automotive radar system.

[0063] Figure 9 It is shown separately from the circuit assembly 100. Figure 1 and 2 The front view of the packaged electronic device 110. For example, device 110 may be manufactured as a separate component, which is later incorporated into circuit assembly 100. According to one or more embodiments, circuit assembly 100 is manufactured by placing the packaged electronic device abutting against a first side 162 of substrate 160, wherein RF pins 150 extend through plated vias 170. Figure 1 And without touching the plating hole 170. The device 110 can then be soldered to the substrate 160, typically as part of the process of soldering other components to the substrate 160. Next, for example, using screws, solder or other accessories, the waveguide antenna 180 is attached to the second side 164 of the substrate 160, such that the RF pin 150 and the corresponding plating hole 170 form a coaxial-to-waveguide connection 162 with the waveguide antenna.

[0064] An improved technique for transmitting RF signals between packaged electronic devices (110, 110.1, 110.2) and waveguide antenna 180 has been described. The packaged electronic devices include an integrated circuit 130 configured to transmit and / or receive RF signals. Device 110 is attached (e.g., soldered) to a first side 162 of a substrate 160 (e.g., a printed circuit board, ceramic substrate, or flexible board), and waveguide antenna 180 is attached (e.g., soldered, screwed, or otherwise secured) to a second side 164 of the substrate 160 opposite the first side 162. The devices include RF contacts 146 and adjacent shielding contacts 142. Within a package 120 of the devices, the RF contacts 146 and shielding contacts 142 are electrically coupled to the RF circuitry of the integrated circuit, such as nodes 132 and 134. Outside of package 120, RF contacts 146 are electrically coupled to waveguide antenna 180 along internal conductive structures (150, 510, 610) extending vertically through substrate 160, and shielded contacts 142 are electrically coupled to waveguide antenna 180 along external conductive structures (170, 640) at least partially surrounding the internal conductive structures. The internal and external conductive structures form a coaxial vertical structure (162, 162.1, 162.2) that provides a controlled impedance path through substrate 160, allowing RF signals to propagate between the device and the waveguide antenna without significant loss or reflection.

[0065] Advantageously, the improved technology consumes less package space and less substrate space than existing LiP solutions. Furthermore, the improved technology provides insertion loss comparable to LiP solutions. For example, simulation results have shown that the insertion loss of circuit assembly 100 differs from that provided by a LiP solution by approximately 0.2 dB, while the insertion loss of circuit assemblies 500 and 600 differs by approximately 0.9 dB. Therefore, the improved technology enables a reduction in the size of RF and microwave devices and assemblies without substantially sacrificing performance.

[0066] Certain embodiments have been described, and many alternative embodiments or variations may be made. Furthermore, although features have been shown and described with reference to specific embodiments herein, such features may be included and are thereby included in any of the disclosed embodiments and variations thereof. Therefore, it should be understood that features disclosed in connection with any embodiment are included in any other embodiment.

[0067] As used throughout this document, the words “comprising,” “including,” “containing,” and “having” are intended to describe certain items, steps, elements, or aspects of something in an open-ended manner. Furthermore, as used herein and unless specifically stated otherwise, the word “set” means one or more of something. This is true whether the phrase “set of” is followed by a singular or plural object, and whether it is combined with a singular or plural verb. Moreover, a “set” of elements can describe fewer than all existing elements. Therefore, there may be additional elements of the same kind that are not part of the said set. Additionally, ordinal expressions, such as “first,” “second,” “third,” etc., may be used herein as adjectives for identification purposes. Unless explicitly stated otherwise, these ordinal expressions are not intended to imply any ordering or sequence. Thus, for example, a “second” event may occur before or after a “first” event, or even in the absence of a first event. Furthermore, the designation of a particular element, feature, or action as “first” herein should not be construed as requiring the existence of a “second” or other such element, feature, or action. In fact, a “first” item can be unique. Additionally, unless specifically stated otherwise, “based on” is intended to be non-exclusive. Therefore, unless otherwise specifically stated, “based on” should be interpreted as meaning “at least partially based on.” Moreover, although the term “user” as used herein can refer to a human being, the term is also intended to cover non-human entities such as robots, automated programs, and other computer-implemented programs and technologies. While certain embodiments are disclosed herein, it should be understood that these embodiments are provided as examples and should not be construed as limiting.

[0068] Furthermore, the foregoing description refers to elements, nodes, or features being "connected" or "coupled" together. As used herein, unless otherwise explicitly stated, "connected" means that one element is directly engaged to (or directly communicates with) another element, and not necessarily mechanically engaged. Similarly, unless otherwise explicitly stated, "coupled" means that one element is directly or indirectly engaged to (or directly or indirectly communicates with) another element electrically or otherwise, and not necessarily mechanically engaged. Therefore, although the schematic diagrams and component features shown in the figures depict an exemplary arrangement of elements, additional intervening elements, devices, features, or components may be present in one or more other embodiments of the depicted subject matter.

[0069] Therefore, those skilled in the art will understand that various changes in form and detail may be made to the embodiments disclosed herein without departing from the scope of the appended claims.

Claims

1. A circuit assembly, characterized in that, include: An encapsulated electronic device having radio frequency (RF) contacts and shielded contacts; A substrate coupled to the packaged electronic device and at least partially comprising an internal conductive structure electrically coupled to the RF contacts and an external conductive structure electrically coupled to the shielding contacts, the internal conductive structure and the external conductive structure forming a vertical coaxial structure through the substrate; as well as A waveguide antenna, which is electrically coupled to the coaxial structure on the side of the substrate opposite to the packaged electronics.

2. The circuit assembly according to claim 1, characterized in that, The packaged electronic device has a surface that exposes the RF contacts and the shielding contacts, and wherein the substrate includes plated holes that are vertically aligned with the RF contacts and electrically coupled to the shielding contacts, the plated holes providing the external conductive structure of the coaxial structure.

3. The circuit assembly according to claim 2, characterized in that, The internal conductive structure of the coaxial structure includes an RF pin that extends through the plated via in the substrate without touching the plated via.

4. The circuit assembly according to claim 2, characterized in that, The RF contact includes a contact pad, and the waveguide antenna includes an RF pin that extends upward from the waveguide antenna through the plated via in the substrate without touching the plated via and makes contact with the contact pad, the RF pin forming the internal conductive structure of the coaxial structure.

5. The circuit assembly according to claim 2, characterized in that, The packaged electronic device further includes RF pins that extend from the surface through the plated vias in the substrate without touching the plated vias, the RF pins forming the internal conductive structure of the coaxial structure.

6. The circuit assembly according to claim 2, characterized in that, The shielding contact is one of a plurality of shielding contacts that at least partially surround the RF contact along the surface of the packaged electronic device, and wherein the plurality of shielding contacts are electrically coupled to the plated via.

7. The circuit assembly according to claim 1, characterized in that, The substrate includes a central through-hole that is vertically aligned with the RF contact and extends from a first side of the substrate to a second side of the substrate, wherein the central through-hole is connected to the RF contact to form the internal conductive structure of the coaxial structure.

8. A packaged electronic device, characterized in that, include: The integrated circuit includes an RF signal node and a shielding node; A package containing the integrated circuit, the package having a surface; Multiple electrical contacts at the surface; as well as An RF pin, coupled to the surface, wherein the RF pin is electrically coupled to the RF signal node and extends further outward from the surface than the plurality of electrical contacts, and The plurality of electrical contacts includes at least one contact that is electrically coupled to the shielding node and is positioned adjacent to the RF pin.

9. The packaged electronic device according to claim 8, characterized in that, The plurality of electrical contacts includes at least one additional contact that is electrically coupled to the shielding node and positioned adjacent to the RF pin.

10. The packaged electronic device according to claim 8, characterized in that, The plurality of electrical contacts are arranged in a grid having rows and columns, wherein the RF pin is disposed at the intersection of a specific row and a specific column of the grid, and wherein the RF pin is adjacent to (i) a first and second electrical contact among the plurality of electrical contacts in the specific row and the adjacent column of the grid, and (ii) a third and a fourth electrical contact among the plurality of electrical contacts in the specific column and the adjacent row of the grid.

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