Wafer detection probe card polishing device

Abstract

This application relates to a probe card polishing device for wafer inspection, comprising a base, a mounting post on the base, a support stage slidably fitted on the outer surface of the mounting post, a micrometer on the base for driving the support stage to slide vertically, a microscope for observation on the top of the mounting post, a fixing component on the support stage, a mounting seat on the base, a support post at the center of the mounting seat, sandpaper on the support post, multiple guide posts on the surface of the mounting seat, a mounting ring slidably fitted on the outer surface of the multiple guide posts, clamping components at the four corners of the sandpaper on the mounting ring, a driving component on the support post, the driving component driving the four clamping components to simultaneously clamp the sandpaper, subsequently driving the mounting ring to move downwards, and a polishing component on the base. This application improves the polishing accuracy of the probe.

Description

Technical Field

[0001] This application relates to the field of probe card processing technology, and in particular to a probe card grinding device for wafer inspection. Background Technology

[0002] Probe cards are key tooling in the electrical performance testing of wafers, primarily used for functional testing of wafer chips. A probe card mainly consists of a circuit board and an array of multiple probes mounted on one side of the board. During testing, it is crucial to ensure that the tips of all probes remain in the same plane to guarantee simultaneous contact with the test points on the wafer surface and achieve synchronous and accurate testing. However, over long-term use, the probes may wear down at different rates, leading to inconsistent probe tip heights and a lack of coplanarity, resulting in unreliable wafer test results. Therefore, when a probe card becomes unusable due to wear, a grinding device must be used to grind and repair the probes, restoring all probe tips to the same plane to meet the requirements of batch wafer testing.

[0003] Existing polishing devices for probe cards generally include a base, a probe card lifting mechanism, a sanding paper support assembly, and a manual drive mechanism. In use, the probe card is fixed on the lifting mechanism, and the lifting mechanism is adjusted to keep the probe and sanding paper in a preset contact state. Then, the manual drive mechanism drives the sanding paper to perform planar reciprocating motion or circular motion, thereby realizing the polishing operation of the probe on the probe card.

[0004] However, existing technologies typically use water spraying to attach and fix the sandpaper to the support column. However, water spraying can easily cause localized wetting and wrinkling of the sandpaper, resulting in uneven adhesion between the sandpaper and the support column, reducing the flatness of the probe grinding and consequently lowering the precision of the probe grinding. Furthermore, as the sandpaper is used over time, water evaporation can cause the sandpaper to loosen or even detach in parts, leading to problems such as suspension or misalignment during circumferential grinding, and consequently causing uneven probe grinding length defects.

[0005] In summary, existing grinding devices suffer from low probe grinding accuracy and have significant shortcomings. Summary of the Invention

[0006] To improve the accuracy of probe polishing, this application provides a probe card polishing device for wafer inspection.

[0007] The wafer inspection probe card polishing device provided in this application adopts the following technical solution: A wafer inspection probe card polishing device includes a base, a mounting post on the base, a support platform slidably fitted on the outer surface of the mounting post, a micrometer on the base for driving the support platform to slide vertically, a microscope on the top of the mounting post for observation, a fixing component for fixing the probe card on the support platform, a mounting seat on the base, a support post at the center of the mounting seat, sandpaper on the support post, multiple guide posts on the surface of the mounting seat, a mounting ring slidably fitted on the outer surface of the multiple guide posts, clamping components at the four corners of the sandpaper on the mounting ring for clamping the edges of the sandpaper, a driving component on the support post for driving the four clamping components to simultaneously clamp the sandpaper, and then driving the mounting ring to move downwards, and a polishing component on the base for driving the support post to perform planar circular motion.

[0008] By adopting the above technical solution, the worker places the sandpaper on the surface of the support column, ensuring that all four edges of the sandpaper are within the clamping gaps of the clamping components. The worker then operates the drive component, which first causes the four clamping components to simultaneously clamp the corners of the sandpaper, ensuring that the sandpaper is initially clamped flat and without deviation. After clamping, the drive component continues to drive the mounting ring downwards along the guide column. The mounting ring drives the clamping components to move downwards synchronously, applying uniform tension to the sandpaper by pulling down the four corners simultaneously. This ensures that the sandpaper is taut and flat against the upper surface of the support column, effectively preventing wrinkles and ensuring the stability of the sandpaper's position during polishing. Compared to the existing technology that uses water spray to attach the sandpaper, the clamping and drive components achieve fixation and tension of the sandpaper on the support column surface, ensuring that the sandpaper maintains a high degree of flatness, thereby improving the polishing accuracy of the probe.

[0009] Optionally, the clamping assembly includes an extension plate disposed on the surface of the mounting ring, an air cylinder disposed at the end of the extension plate, an air rod slidably connected inside the air cylinder, a clamping plate hinged to the free end of the air rod, and a front end of the clamping plate rotatably connected to the surface of the extension plate. The inner circumferential sidewall of the mounting ring has mounting grooves corresponding to the four extension plates one by one. An elastic bag containing gas is disposed inside the mounting groove. The elastic bag is connected to the corresponding air cylinder through an air pipe. A compression plate is slidably connected inside the mounting groove. The driving assembly synchronously drives the four compression plates to compress the elastic bag. The air rod extends and pushes the clamping plate to rotate toward the sandpaper.

[0010] By adopting the above technical solution, the worker places the sandpaper on the surface of the support column, and makes the edge of the sandpaper extend to the surface of the extension plate to complete the initial positioning. After placement, the drive component drives the four extrusion plates to simultaneously extrude the corresponding elastic bags. After the elastic bags are compressed, the internal gas is synchronously transported to each air cylinder through the air pipe, pushing the air rod to extend synchronously. After the air rod extends, it pushes the clamping plate to rotate around the extension plate, so that the clamping plate presses and fixes the edges and corners of the sandpaper on the extension plate, thus realizing the synchronous clamping of the four clamping components.

[0011] Optionally, a limiting plate is provided on the surface of the extension plate, and the frosted paper extends from the edge of the bearing column, lies flat on the surface of the extension plate, and abuts against the limiting plate.

[0012] By adopting the above technical solution, the edge position of the sandpaper extending out of the support column is restricted by the limiting plate, so that the four corners of the sandpaper can be laid to the preset clamping area of ​​the corresponding extension plate, thereby realizing the rapid positioning and alignment of the sandpaper.

[0013] Optionally, the drive assembly includes a drive ring threadedly connected to the outer surface of the bearing column. A push protrusion is provided on the outer periphery of the drive ring. The end faces of the push protrusion and the extrusion plate are in a matching guide arc shape. A push ring is provided on the inner periphery of the mounting ring. The inner diameter of the push ring is smaller than the outer diameter of the push protrusion. When the push protrusion moves to face the extrusion plate, the bottom surface of the push protrusion abuts against the surface of the push ring. A spring is sleeved on the outer surface of each guide column. One end of the spring is located on the outer surface of the guide column, and the other end is located on the mounting ring. In the natural state of the spring, the surface of the extension plate is flush with the surface of the bearing column.

[0014] By adopting the above technical solution, the worker rotates the drive ring, which moves downward along the bearing column axis. When the pushing convex of the drive ring moves to face the extrusion plate, the pushing convex synchronously extrudes each extrusion plate through the guide arc end face, causing the extrusion plate to compress the elastic bladder and achieve gas output, thus completing the synchronous clamping of the sandpaper by the clamping assembly. As the drive ring continues to move downward, the bottom surface of the pushing convex abuts against the surface of the pushed ring and applies downward pressure, driving the mounting ring to slide downward along the guide column against the spring force, thereby driving the clamping assembly to move downward synchronously, forming uniform tension on the sandpaper. After the extension plate moves downward, it is lower than the bearing surface of the bearing column, which can avoid the clamping assembly from interfering with the probe grinding process and ensure smooth grinding operation. The setting of the drive assembly realizes the continuous linkage and automatic sequential execution of the clamping and downward movement steps of the clamping assembly. The entire process only requires the worker to rotate the drive ring, which is simple and quick to operate, without the need for additional tools and external power, effectively improving the efficiency and accuracy of sandpaper clamping.

[0015] Optionally, the surface of the support platform is provided with a positioning groove, and the inner sidewall of the positioning groove is provided with a slot. The fixing component includes two clamping plates arranged opposite to each other along the width direction of the positioning groove. A connecting shaft is provided on the clamping plate. Guide platforms are provided on both sides of the support platform in the axial direction of the connecting shaft. The connecting shaft is rotatably disposed inside the guide platforms. A connecting bolt is slidably passed through the clamping plate. A threaded hole is provided on the support platform that is threadedly engaged with the connecting bolt.

[0016] By adopting the above technical solution, the worker first unscrews the two connecting bolts on the card plate out of the threaded holes, then rotates the card plate around the connecting shaft so that the card plate does not obstruct the placement of the probe card. Next, the probe card is inserted into the positioning slot along the length of the slot. After the probe card is positioned, the worker rotates the card plate in the direction of the probe card so that the end of the card plate abuts against the surface of the probe card. Finally, the worker tightens the connecting bolts in the threaded holes. The slot restricts the horizontal movement of the probe card, and the card plate restricts the vertical displacement of the probe card. In this way, the probe card is fixed and the possibility of displacement of the probe card during the grinding process is avoided.

[0017] Optionally, the grinding assembly includes an X-axis guide rail mounted on the base, a Y-axis guide rail mounted on the movable part of the X-axis guide rail, the Y-axis guide rail being perpendicular to the X-axis guide rail, an adjusting plate mounted on the movable part of the Y-axis guide rail, a mounting base mounted on the adjusting plate, a rotary seat mounted at the end of the base, a rocker arm ball-connected inside the rotary seat, a drive arm mounted at the end of the adjusting plate, the end of the drive arm extending to the rotary seat and having a connecting groove, and the rocker arm obliquely passing through the connecting groove.

[0018] By adopting the above technical solution, after the sandpaper is clamped, the worker turns the crank handle. Since the crank handle and the rotary seat are ball-jointed, the crank handle can make a universal circumferential swing when it rotates. The crank handle is inclined and passes through the connecting groove of the drive arm. During the swing, it will drive the drive arm to move synchronously through the connecting groove. The drive arm drives the adjustment plate to make a two-dimensional composite movement along the Y-axis guide rail and the X-axis guide rail, thereby driving the bearing column on the mounting base and the sandpaper to make a stable planar circumferential movement, so as to achieve uniform grinding of the probe on the probe card.

[0019] Optionally, the surface of the adjusting plate is provided with an adjusting groove along the length direction of the X-axis guide rail, the mounting base is provided with an adjusting block slidably connected in the adjusting groove, and the adjusting plate is provided with an adjusting component that drives the adjusting block to move along the adjusting groove.

[0020] By adopting the above technical solution, when a certain area of ​​the sandpaper is worn, the worker drives the adjusting block to move along the adjusting groove through the adjusting component. The adjusting block drives the mounting base to move on the adjusting plate, thereby moving the brand-new area of ​​the sandpaper that is not worn to the probe card. This ensures that the sandpaper can stably and continuously polish the probe, making full use of the entire effective working surface of the sandpaper, improving the utilization rate of consumables, reducing the frequency of replacement, and ensuring the continuity and consistency of the polishing operation.

[0021] Optionally, the adjusting component is an adjusting screw rotatably connected in the adjusting groove, the adjusting block is threadedly connected to the adjusting screw, and both the adjusting block and the adjusting groove have square cross-sections. An adjusting knob is coaxially provided at the end of the adjusting screw.

[0022] By adopting the above technical solution, workers can drive the adjusting screw to rotate by turning the adjusting knob. With the sliding limit cooperation of the adjusting groove and the adjusting block, the adjusting screw drives the adjusting block to move smoothly along the length direction of the adjusting groove. The adjusting block drives the mounting base to make fine adjustments to the displacement along the X-axis on the adjusting plate.

[0023] In summary, this application includes at least one of the following beneficial technical effects: This application uses a clamping assembly to fix the abrasive paper on the surface of the support column, thereby preventing the abrasive paper from loosening or even falling off due to water vapor evaporation. This ensures that the abrasive paper maintains a stable clamping state during the grinding process and improves the grinding accuracy of the probe. This application sets up a driving component, which allows the worker to simultaneously clamp the four clamping components. At the same time, the four corners are pulled down synchronously to apply uniform tension to the sandpaper, so that the sandpaper is tightly and flatly attached to the upper end face of the support column, effectively avoiding wrinkles in the sandpaper and further improving the polishing accuracy of the probe. Attached Figure Description

[0024] Figure 1 This is a structural diagram of this application.

[0025] Figure 2 This is a schematic diagram of the structure of the fixed component in the embodiments of this application.

[0026] Figure 3 This is a schematic diagram of the structure of the polishing component in the embodiments of this application.

[0027] Figure 4 This is an exploded view of the adjustment plate and the mounting base in an embodiment of this application.

[0028] Figure 5 This is a cross-sectional view of the drive ring in an embodiment of this application.

[0029] Explanation of reference numerals in the attached drawings: 1. Base; 101. Mounting post; 102. Micrometer; 103. Microscope; 2. Support stage; 21. Positioning groove; 211. Slot; 3. Fixing assembly; 31. Clamping plate; 32. Guide stage; 33. Connecting bolt; 4. Grinding assembly; 41. X-axis guide rail; 42. Y-axis guide rail; 43. Adjusting plate; 431. Adjusting groove; 44. Mounting base; 441. Guide post; 442. Adjusting block; 45. Support post; 46. 47. Sandpaper; 48. Rotary seat; 49. Handle; 40. Drive arm; 41. Connecting groove; 5. Mounting ring; 51. Mounting groove; 6. Clamping assembly; 61. Extension plate; 62. Limiting plate; 63. Clamping plate; 64. Air cylinder; 65. Air rod; 7. Drive assembly; 71. Drive ring; 72. Elastic bladder; 73. Air tube; 74. Squeezing plate; 75. Pushing protrusion; 76. Push ring; 77. Spring; 8. Adjusting screw; 81. Adjusting knob. Detailed Implementation

[0030] The following is in conjunction with the appendix Figure 1-5 This application will be described in further detail.

[0031] This application discloses a probe card polishing device for wafer inspection.

[0032] Reference Figure 1 A wafer inspection probe card polishing device includes a base 1. Mounting posts 101 are mounted on opposite sides of the upper surface of the base 1 along the length direction. A support stage 2 is slidably connected to the two mounting posts 101. A micrometer 102 for driving the support stage 2 to move vertically is fixedly mounted on the base 1. A microscope 103 for inspection is mounted on the top of the mounting posts 101. In this embodiment, the microscope 103 and the micrometer 102 are both existing technologies commonly used in the field of probe card processing. Their specific composition and operating principle will not be described in this embodiment.

[0033] Reference Figure 1 and Figure 2 The support platform 2 has a positioning groove 21 for positioning probe cards. The inner sidewalls of the positioning groove 21 are provided with slots 211. The support platform 2 is provided with a fixing component 3, which includes two clamping plates 31. The two clamping plates 31 are L-shaped and are respectively set on both sides of the positioning groove 21 in the width direction. The ends of the clamping plates 31 away from the positioning groove 21 are fixedly connected to a connecting shaft (not shown in the figure). The support platform 2 is equipped with guide platforms 32 on both sides of the connecting shaft axis. The connecting shaft is rotatably set inside the guide platform 32. Each clamping plate 31 has a connecting bolt 33 slidingly passing through both sides of the opposite side in the length direction. The support platform 2 has a threaded hole (not shown in the figure) that is threaded to the connecting bolt 33.

[0034] During the polishing process, the worker first unscrews the two connecting bolts 33 on the clamping plate 31 out of the threaded holes. Then, the worker rotates the clamping plate 31 around the connecting shaft so that the clamping plate 31 does not obstruct the placement of the probe card. Next, the worker inserts the probe card into the positioning groove 21 along the length direction of the slot 211. After the probe card is positioned, the worker rotates the clamping plate 31 toward the probe card so that the end of the clamping plate 31 abuts against the surface of the probe card. Finally, the worker tightens the connecting bolts 33 inside the threaded holes, and the probe card is fixed by restricting it through the slot 211.

[0035] Reference Figure 1 and Figure 3 The base 1 has a polishing assembly 4 on its surface. The polishing assembly 4 includes an X-axis guide rail 41 fixedly mounted on the base 1, a Y-axis guide rail 42 mounted on the moving part of the X-axis guide rail 41, an adjusting plate 43 fixedly mounted on the moving part of the Y-axis guide rail 42, a mounting base 44 fixedly mounted on the adjusting plate 43, a bearing column 45 mounted at the center of the mounting base 44, and abrasive paper 46 for polishing the probe fixed on the bearing column 45.

[0036] Reference Figure 1 and Figure 3 A rotary seat 47 is fixedly installed at the edge of the base 1. A rocker arm 48 is ball-jointed inside the rotary seat 47. The rocker arm 48 includes a gripping section, a limiting shaft section and a ball joint arranged sequentially from top to bottom. The ball joint is fitted into the rotary seat 47 and forms a ball joint. The rocker arm 48 can swing in a universal circumferential direction relative to the rotary seat 47 through the ball joint. A drive arm 49 is fixedly installed at the end of the adjusting plate 43. The end of the drive arm 49 extends to the rotary seat 47 and has a connecting groove 491. The limiting shaft section passes through the connecting groove 491.

[0037] After the probe card is fixed, the worker drives the support platform 2 to move downward along the mounting column 101 by rotating the operating end of the micrometer 102, and observes the probe position in real time through the microscope 103 on the top of the mounting column 101. When the microscope 103 observes that the probe of the probe card is in contact with the sandpaper 46, the adjustment of the micrometer 102 is stopped. When the worker shakes the grip section of the crank handle 48 to make it swing in a circular motion, the ball joint rotates synchronously in the rotary seat 47. The limiting shaft section drives the drive arm 49 to make a planar circular motion through the connecting groove 491. When the drive arm 49 swings, it drives the adjusting plate 43 and the mounting seat 44 to make a two-dimensional composite movement along the X-axis guide rail 41 and the Y-axis guide rail 42, thereby driving the sandpaper 46 on the support column 45 to make a smooth circular motion, completing the initial polishing of the probe. After a single polishing is completed, the worker rotates the micrometer 102 again, causing the stage 2 to move slightly downward in the vertical direction, and uses the microscope 103 to calibrate the contact state between the probe and the sandpaper 46 in real time. When the shorter probe on the probe card comes into contact with the sandpaper 46 again, the worker shakes the handle 48 again to drive the sandpaper 46 to polish the probe. The above step-by-step downward polishing and real-time observation steps are repeated until all the probes on the probe card are of the same length, reaching the preset standard for wafer inspection. In this way, all the probes on the probe card are polished.

[0038] Reference Figure 3 and Figure 4 Multiple guide posts 441 are fixedly connected to the surface of the mounting base 44 on the outer periphery of the bearing post 45. In this embodiment, there are four guide posts 441. The four guide posts 441 are slidably fitted with mounting rings 5. Clamping components 6 are provided at the four corners of the mounting rings 5. The clamping components 6 can tighten and fix the sandpaper 46 to the top of the bearing post 45 to prevent the sandpaper 46 from shifting during the sanding process.

[0039] Reference Figure 4 and Figure 5 The clamping assembly 6 includes an extension plate 61 arranged radially along the support column 45. A limiting plate 62 is fixedly connected to the surface of each extension plate 61. The edge portion of the sandpaper 46 extending out of the support column 45 is laid flat on the surface of the extension plate 61 and abuts against the limiting plate 62 to achieve initial positioning. A clamping plate 63 is rotatably connected to the surface of the extension plate 61. An air cylinder 64 is fixedly installed at the end of the extension plate 61 away from the support column 45. An air rod 65 is slidably connected inside the air cylinder 64. The free end of the air rod 65 is hinged to the clamping plate 63. When the air rod 65 is fully extended, the air rod 65 pushes the clamping part of the clamping plate 63 to abut against and press against the surface of the sandpaper 46.

[0040] Reference Figure 4 and Figure 5 A drive assembly 7 is provided on the support column 45. The drive assembly 7 includes a drive ring 71 threadedly connected to the outer surface of the support column 45. The mounting ring 5 has mounting grooves 51 that correspond one-to-one with the four air cylinders 64 on the inner circumferential side wall facing the support column 45. Each mounting groove 51 is equipped with an elastic bag 72. The elastic bag 72 stores gas and is sealed and connected to the air cavity in the corresponding air cylinder 64 through an air pipe 73.

[0041] Reference Figure 4 and Figure 5The mounting groove 51 is slidably connected to a compression plate 74 for compressing the elastic bladder 72. The outer periphery of the drive ring 71 is integrally formed with a pushing protrusion 75. The end faces of the pushing protrusion 75 and the compression plate 74 are in a matching guide arc shape. The inner periphery of the mounting ring 5 located below the mounting groove 51 is fixedly connected to a push ring 76. The inner diameter of the push ring 76 is smaller than the outer diameter of the pushing protrusion 75. After the pushing protrusion 75 abuts against the compression plate 74 and completes the compression of the elastic bladder 72, the bottom surface of the pushing protrusion 75 continues to move downward and abuts against the surface of the push ring 76. Each guide post 441 is fitted with a spring 77 on its outer surface. One end of the spring 77 is fixedly connected to the outer surface of the guide post 441, and the other end is fixedly connected to the bottom surface of the mounting ring 5. In its natural state, the surface of the extension plate 61 is flush with the bearing surface of the bearing post 45.

[0042] The worker first lays the sandpaper 46 to be used flat on the bearing surface of the bearing column 45, so that the four corners of the sandpaper 46 extend to the surface of the corresponding extension plate 61 and abut against the limiting plate 62 to complete the initial positioning; then the drive ring 71 is rotated, and the drive ring 71 moves downward along the outer surface of the bearing column 45. The pushing protrusion 75 of the drive ring 71 moves down and contacts the extrusion plate 74. Under the guiding action of the arc surface, the pushing protrusion 75 pushes the extrusion plate 74 into the mounting groove 51. The extrusion plate 74 squeezes the elastic bag 72 to compress the gas inside, and it is simultaneously transported to the four air cylinders 64 through the air pipe 73. The air rod 65 is pushed out simultaneously. After the air rod 65 extends, it drives the clamping plate 63 to swing around the rotating end, so that the clamping part of the clamping plate 63 presses the corners of the sandpaper 46, completing the initial clamping of the sandpaper 46. After clamping, continue to rotate the drive ring 71 to make it rotate downward, pushing the bottom surface of the convex 75 to abut against the surface of the push ring 76 and applying downward pressure. This drives the mounting ring 5 to slide downward along the guide post 441 against the elastic force of the spring 77. The mounting ring 5 drives the four extension plates 61 that have clamped the corners of the sandpaper 46 to move downward synchronously. The extension plates 61 pull the sandpaper 46 outward and evenly tighten it through the clamping plate 63, so that the sandpaper 46 is laid flat and taut on the surface of the support post 45, effectively avoiding the sandpaper 46 from wrinkling or shifting and affecting the grinding accuracy. At the same time, after the extension plates 61 move downward, they are lower than the support surface of the support post 45, which can avoid the clamping component 6 from interfering with the probe grinding process and ensure that the grinding operation is carried out smoothly. When the sandpaper 46 needs to be replaced, the worker rotates the drive ring 71 in the opposite direction. The drive ring 71 rotates upward along the outer surface of the bearing column 45, and the pushing protrusion 75 moves upward synchronously with the drive ring 71. The downward pressure on the pushed ring 76 gradually disappears. At this time, the spring 77 resets and pushes the mounting ring 5 to slide upward along the guide column 441 to reset. The mounting ring 5 drives the extension plate 61 to move upward synchronously until the surface of the extension plate 61 is flush with the bearing surface of the bearing column 45. When the pushing protrusion 75 rotates upward to the initial position, the pressure of the pushing protrusion 75 on the extrusion plate 74 is released, the elastic bladder 72 returns to its original state and the internal gas flows back. The air rod 65 retracts synchronously into the air cylinder 64 under the action of the elastic force of the elastic bladder 72. The air rod 65 pulls the clamping plate 63 to swing in the opposite direction around the rotating end, so that the clamping part of the clamping plate 63 is disengaged from the corner of the sandpaper 46, releasing the clamping of the sandpaper 46. At this time, the worker can easily remove the old sandpaper 46 and complete the replacement of the sandpaper 46.

[0043] Reference Figure 4 and Figure 5 During the long-term circumferential grinding of the probe, the area in continuous contact with the probe will wear down, resulting in a decrease in the flatness of the grinding area and a reduction in the grinding accuracy of the probe.

[0044] Reference Figure 4 and Figure 5 To solve the above technical problems, an adjustment groove 431 is provided on the surface of the adjustment plate 43 along the length of the X-axis guide rail 41. An adjustment block 442 is fixedly connected to the bottom surface of the mounting base 44 and slidably connected in the adjustment groove 431. The cross-sections of the adjustment block 442 and the adjustment groove 431 are both square. An adjustment screw 8 is rotatably connected inside the adjustment groove 431. The end of the adjustment screw 8 extends to the outer surface of the adjustment plate 43 and is coaxially fixedly connected to an adjustment knob 81. The adjustment block 442 is threadedly connected to the adjustment screw 8.

[0045] During the polishing process, when a certain area of ​​the sandpaper 46 is worn, the worker can rotate the adjusting knob 81 to drive the adjusting screw 8 to rotate. With the sliding limit cooperation of the adjusting groove 431 and the adjusting block 442, the adjusting screw 8 drives the adjusting block 442 to move smoothly along the length direction of the adjusting groove 431. The adjusting block 442 drives the mounting base 44 to make a slight adjustment of the displacement along the X-axis on the adjusting plate 43, so that the brand-new area of ​​the sandpaper 46 that is not worn is moved to the bottom of the probe card. This ensures that the sandpaper 46 can stably and continuously polish the probe, making full use of the entire effective working surface of the sandpaper 46, improving the utilization rate of consumables, reducing the frequency of replacement, and ensuring the continuity and consistency of polishing operations.

[0046] The implementation principle of the wafer inspection probe card polishing device in this application embodiment is as follows: The worker first lays the sandpaper 46 to be used flat on the bearing surface of the bearing column 45, so that the four corners of the sandpaper 46 extend to the surface of the corresponding extension plate 61 and abut against the limiting plate 62 to complete the initial positioning; then the drive ring 71 is rotated, and the drive ring 71 moves downward along the outer surface of the bearing column 45. The pushing protrusion 75 of the drive ring 71 moves downward and contacts the extrusion plate 74. Under the guiding action of the arc surface, the pushing protrusion 75 pushes the extrusion plate 74 into the mounting groove 51. The extrusion plate 74 squeezes the elastic bag 72 to compress the gas inside, and it is simultaneously transported to the four air cylinders 64 through the air pipe 73. The air rod 65 is pushed out simultaneously. After the air rod 65 extends, it drives the clamping plate 63 to swing around the rotating end, so that the clamping part of the clamping plate 63 presses the corners of the sandpaper 46, completing the initial clamping of the sandpaper 46. After clamping is completed, continue to rotate the drive ring 71 to make it rotate downward, push the bottom surface of the convex 75 to abut against the surface of the push ring 76 and apply downward pressure, drive the mounting ring 5 to slide downward along the guide post 441 against the elastic force of the spring 77, and the mounting ring 5 drives the four extension plates 61 that have clamped the corners of the sandpaper 46 to move downward synchronously. The extension plates 61 pull the sandpaper 46 outward evenly through the clamping plate 63, so that the sandpaper 46 is laid flat and taut on the surface of the support post 45. Compared to the existing technology that uses water spray to attach the sandpaper 46, the clamping component 6 and the driving component 7 fix and tension the sandpaper 46 on the surface of the support column 45, thereby ensuring that the sandpaper 46 always maintains a high flatness working state, thus improving the polishing accuracy of the probe.

[0047] The above are all preferred embodiments of this application and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.

Claims

1. A wafer inspection probe card polishing device, comprising a base (1), wherein a mounting post (101) is disposed on the base (1), a support stage (2) is slidably fitted on the outer surface of the mounting post (101), a micrometer (102) is disposed on the base (1) to drive the support stage (2) to slide in the vertical direction, and a microscope (103) for observation is disposed on the top of the mounting post (101), characterized in that, The support platform (2) is provided with a fixing component (3) for fixing the probe card. The base (1) is provided with a mounting seat (44). The center of the mounting seat (44) is provided with a support column (45). The support column (45) is provided with sandpaper (46). The surface of the mounting seat (44) is provided with multiple guide columns (441). The outer surfaces of the multiple guide columns (441) are slidably fitted with a mounting ring (5). The mounting ring (5) is provided with clamping components (6) at the four corners of the sandpaper (46). The clamping components (6) clamp the edge of the sandpaper (46). The support column (45) is provided with a driving component (7). The driving component (7) drives the four clamping components (6) to clamp the sandpaper (46) simultaneously. Then, it drives the mounting ring (5) to move down. The base is provided with a polishing component (4) for driving the support column (45) to make planar circular motion.

2. The wafer inspection probe card polishing device according to claim 1, characterized in that, The clamping assembly (6) includes an extension plate (61) disposed on the surface of the mounting ring (5). An air cylinder (64) is disposed at the end of the extension plate (61). An air rod (65) is slidably connected inside the air cylinder (64). A clamping plate (63) is hinged to the free end of the air rod (65). The front end of the clamping plate (63) is rotatably connected to the surface of the extension plate (61). The inner circumferential sidewall of the mounting ring (5) has mounting holes corresponding to the four extension plates (61) one by one. The mounting groove (51) is provided with an elastic bag (72) containing gas. The elastic bag (72) is connected to the corresponding air cylinder (64) through an air pipe (73). An extrusion plate (74) is slidably connected inside the mounting groove (51). The drive assembly (7) synchronously drives the four extrusion plates (74) to extrude the elastic bag (72). The air rod (65) extends out and pushes the clamping plate (63) to rotate toward the sandpaper (46).

3. The wafer inspection probe card polishing device according to claim 2, characterized in that, The extension plate (61) is provided with a limiting plate (62), and the sandpaper (46) extends out of the edge of the bearing column (45) and is laid flat on the surface of the extension plate and abuts against the limiting plate (62).

4. The wafer inspection probe card polishing device according to claim 3, characterized in that, The drive assembly (7) includes a drive ring (71) threadedly connected to the outer surface of the bearing post (45). A push protrusion (75) is provided on the outer periphery of the drive ring (71). The end faces of the push protrusion (75) and the extrusion plate (74) are in a matching guide arc shape. A push ring (76) is provided on the inner periphery of the mounting ring (5). The inner diameter of the push ring (76) is smaller than the outer diameter of the push protrusion (75). When the push protrusion (75) moves to face the extrusion plate (74), the bottom surface of the push protrusion (75) abuts against the surface of the push ring (76). A spring (77) is sleeved on the outer surface of each guide post (441). One end of the spring (77) is provided on the outer surface of the guide post (441), and the other end is provided on the mounting ring (5). In the natural state of the spring (77), the surface of the extension plate (61) is flush with the surface of the bearing post (45).

5. The wafer inspection probe card polishing device according to claim 1, characterized in that, The surface of the support platform (2) is provided with a positioning groove (21), and the inner side wall of the positioning groove (21) is provided with a slot (211). The fixing component (3) includes two clamping plates (31) arranged opposite to each other along the width direction of the positioning groove (21). A connecting shaft is provided on the clamping plate (31). The support platform (2) is provided with guide platforms (32) on both sides of the axis of the connecting shaft. The connecting shaft is rotatably disposed inside the guide platform (32). A connecting bolt (33) is slidably passed through the clamping plate (31). A threaded hole is provided on the support platform (2) that is threadedly engaged with the connecting bolt (33).

6. The wafer inspection probe card polishing device according to claim 1, characterized in that, The grinding assembly (4) includes an X-axis guide rail (41) disposed on the base (1), a Y-axis guide rail (42) disposed on the moving part of the X-axis guide rail (41), the Y-axis guide rail (42) being perpendicular to the X-axis guide rail (41), an adjusting plate (43) disposed on the moving part of the Y-axis guide rail (42), a mounting base (44) disposed on the adjusting plate (43), a rotary seat (47) disposed at the end of the base (1), a rocker arm (48) ball-connected inside the rotary seat (47), a drive arm (49) disposed at the end of the adjusting plate (43), the end of the drive arm (49) extending to the rotary seat (47) and having a connecting groove (491), and the rocker arm (48) obliquely passing through the connecting groove (491).

7. The wafer inspection probe card polishing device according to claim 6, characterized in that, The surface of the adjusting plate (43) is provided with an adjusting groove (431) along the length direction of the X-axis guide rail (41). The mounting base (44) is provided with an adjusting block (442) slidably connected in the adjusting groove (431). The adjusting plate (43) is provided with an adjusting member that drives the adjusting block (442) to move along the adjusting groove (431).

8. The wafer inspection probe card polishing device according to claim 7, characterized in that, The adjusting component is an adjusting screw (8) rotatably connected in the adjusting groove (431), the adjusting block (442) is threadedly connected to the adjusting screw (8), and the cross-section of the adjusting block (442) and the adjusting groove (431) are both square. An adjusting knob (81) is coaxially provided at the end of the adjusting screw (8).

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