High multilayer high-speed product dense hole quality improvement method and printed circuit board

By optimizing the drilling trajectory and hole edge distance, the problems of insufficient hole plugs and hole wall drilling quality in high-density, multi-layer, high-speed products have been solved, achieving high-quality machining of the hole wall and improved electroplating reliability.

CN122373250APending Publication Date: 2026-07-10HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
HUIZHOU ZHONGJING ELECTRONICS TECH CO LTD
Filing Date
2026-05-18
Publication Date
2026-07-10

AI Technical Summary

Technical Problem

In existing technologies, the quality of the dense hole plugs and hole wall drilling in high-density, multi-layer, high-speed products is insufficient, making it impossible to effectively eliminate the problem.

Method used

The drilling trajectory optimization method is adopted, which involves moving the drill bit a long distance along a zigzag path. Combined with the hole edge distance optimization design, the drilling path is optimized to avoid local heat/stress concentration. The drilling process is optimized by using hierarchical clustering, local farthest path solving and real-time dynamic adjustment.

Benefits of technology

It effectively eliminates dense hole plugging, improves the quality of hole wall processing, reduces drill bit temperature, reduces fiberglass pulling and roughness on hole walls, improves electroplating reliability, and extends tool life.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN122373250A_ABST
    Figure CN122373250A_ABST
Patent Text Reader

Abstract

This invention belongs to the field of printed circuit board technology and discloses a method for improving the quality of dense vias in high-multilayer, high-speed products, as well as a printed circuit board. This method utilizes a skip-drill trajectory optimization method to design a skip-drilling mode where the drill bit moves a long distance along a zigzag path for dense vias with a diameter ≤0.5mm. Based on the skip-drilling trajectory optimization method, a hole edge distance of 70mil is selected for skip-drilling during drilling using a hole edge distance optimization method. This method is applied to drilling of high-multilayer, high-speed products. This invention does not add any steps and can effectively prevent drill bit plugging in dense vias. The skip-drilling design in dense vias facilitates drill bit heat dissipation and improves the quality of the drilled hole wall.
Need to check novelty before this filing date? Find Prior Art