Thermal management assembly for sliding applications and electronic device

Abstract

Thermal management components and electronic devices for sliding applications are provided. Exemplary embodiments of thermal management components or thermal solutions (e.g., those with improved durability) for sliding applications are disclosed. In the exemplary embodiments, the thermal management components or thermal solutions are robust and provide a durable, non-slip thermal interface material (TIM) with superior performance compared to conventional thermal solutions by improving heat transfer between the sliding heat source and the stationary heat sink via a durable layer (e.g., a metallic abrasion-resistant layer defined by a stainless steel, copper, beryllium copper, aluminum, brass, other metal substrate or cap, or other materials having high thermal conductivity and puncture resistance in addition to abrasion resistance) disposed on or along the thermal interface material (broadly, interface materials) or along the thermal interface material.

Description

Technical Field

[0001] This disclosure generally relates to thermal management components and solutions for sliding applications (e.g., with improved durability, etc.). Background Technology

[0002] This section provides background information in connection with this disclosure, which is not necessarily prior art.

[0003] Electrical components such as semiconductors, integrated circuit packages, and transistors typically have a pre-designed temperature at which they operate optimally. Ideally, this pre-designed temperature is close to the ambient air temperature. However, the operation of electrical components generates heat. If this heat is not dissipated, the components can operate at temperatures significantly higher than their normal or desired operating temperature. Such excessively high temperatures can adversely affect the operating characteristics of the components and the operation of related devices.

[0004] To avoid or at least reduce adverse operating characteristics caused by heat generation, heat should be removed, for example, by conducting heat from the operating electrical components to a heat sink. The heat sink can then be cooled by conventional convection and / or radiation techniques. During conduction, heat can be transferred from the operating electrical components to the heat sink through direct surface contact between the electrical components and the heat sink and / or through contact between the electrical components and the heat sink surfaces via an intermediate medium or thermal interface material (TIM). Thermal interface materials can be used to fill gaps between heat transfer surfaces to increase heat transfer efficiency compared to using air to fill gaps, which are relatively poor thermal conductors. Summary of the Invention

[0005] According to one aspect, a thermal management component for a sliding application is provided, the thermal management component for a sliding application comprising: a substrate having opposing inner and outer surfaces; and an interface material along the inner surface of the substrate; wherein the substrate defines a durability layer disposed on and / or along the interface material, and the durability layer is configured to contact the first surface when the thermal management component for a sliding application is along a second surface of a second component and when a first surface of a first component is slidably movable relative to the second surface.

[0006] According to another aspect, a thermal management assembly for a sliding application is provided, the thermal management assembly for a sliding application comprising: a metal cap having an outer sliding surface and an inner surface; an interface material disposed on the inner surface of the metal cap; a plurality of inwardly projecting recesses along spaced-apart spring fingers of the metal cap, the recesses being configured to be received in corresponding insertion slots of a heat-removing component; and a first adhesive reinforcing strip and a second adhesive reinforcing strip positioned on opposite edges of the interface material and extending along edges perpendicular to the sliding direction, wherein the interface material is confined between the first adhesive reinforcing strip and the second adhesive reinforcing strip such that during sliding insertion of a heat source along the outer sliding surface of the metal cap, the first adhesive reinforcing strip and the second adhesive reinforcing strip absorb edge compression and inhibit migration of the interface material; wherein the metal cap retains the interface material such that the interface material is durable during repeated sliding insertion and removal cycles, and such that the heat transfer path through the metal cap, the interface material, and into the heat-removing component is maintained.

[0007] According to another aspect, an electronic device is provided, the electronic device comprising: a heat sink having a socket along a sidewall of a base; a thermal management component according to the above, the thermal management component for sliding applications being engaged with the heat sink by receiving the recess into the socket along the sidewall of the base via spaced-apart spring fingers along the metal cover; and a heat source configured to establish and release thermal contact with the outer sliding surface of the metal cover by sliding in and out; wherein the metal cover protects the interface material during repeated sliding insertion and removal cycles and maintains a thermal path from the heat source through the metal cover and the interface material into the heat sink. Attached Figure Description

[0008] The accompanying drawings described herein are for illustrative purposes only, representing not all possible implementations, and are not intended to limit the scope of this disclosure.

[0009] Figure 1 An exemplary embodiment of a thermal management component or thermal solution is illustrated, which includes a metal wear-resistant layer (broadly, a durability layer) (e.g., a stainless steel substrate, other metal substrates, etc.) and a thermal interface material (TIM) (broadly, an interface material) (e.g., a thermal phase change material (PCM) etc.) beneath the metal wear-resistant layer, thereby improving the durability of the TIM.

[0010] Figure 2 This is an example based on Figure 1A partial cross-sectional view of the thermal interface material (TIM) (broadly, interface material) (e.g., thermal phase change material (PCM)) beneath the metal wear-resistant layer in an exemplary embodiment. The metal wear-resistant layer improves the durability of the TIM between the slidable heat source and the stationary heat sink, such as when the heat source slides relative to the heat sink along the metal wear-resistant layer and in physical sliding contact with the metal wear-resistant layer (e.g., during insertion, removal, and re-insertion).

[0011] Figure 3 Examples are given based on Figure 1 An exemplary embodiment of the present invention includes a removable protective liner (e.g., a protective foil, etc.) disposed on a thermal interface material. Figure 3 Also illustrated are the first or second line or line of adhesive material (e.g., pressure-sensitive adhesive, etc.) on the opposite first and second (or front and rear) end portions of the protective liner disposed on the TIM.

[0012] Figure 4 Examples are given based on Figure 1 An exemplary tab of an exemplary implementation is configured to facilitate the removal of a removable protective liner (e.g., protective foil, etc.) disposed on a thermal interface material.

[0013] Figure 5 This is a graph showing the relationship between the zero-time normalized thermal resistance (Rth / Rth Initial) and the number of re-insertions from the first insertion of a thermal management component or thermal solution according to an exemplary embodiment of this disclosure, the thermal management component or thermal solution including a metal wear-resistant layer (broadly, a durable layer) (e.g., a stainless steel substrate, other metal substrates, etc.) and a thermal interface material (TIM) (broadly, an interface material) (e.g., a thermal phase change material (PCM), etc.) beneath the metal wear-resistant layer.

[0014] Figure 6 Results of three test samples of a thermal management component or thermal solution according to an exemplary embodiment of this disclosure are shown. Each test sample includes a metal wear-resistant layer (broadly, a durability layer) (e.g., a stainless steel substrate, other metal substrates, etc.) and a thermal interface material (TIM) (broadly, an interface material) (e.g., a thermal phase change material (PCM), etc.) beneath the metal wear-resistant layer. Each sample was visually inspected after every 100 to 500 insertions. Figure 6 As shown, no tearing was observed after the intense insertion cycle.

[0015] In the various figures of the accompanying drawings, corresponding reference numerals may indicate corresponding (but not necessarily identical) parts. Detailed Implementation

[0016] The exemplary implementation will now be described more fully with reference to the accompanying drawings.

[0017] Exemplary embodiments of thermal management components or thermal solutions for sliding applications are disclosed. In the exemplary embodiments, the thermal management components or thermal solutions are robust and provide a durable, non-slip thermal interface material (TIM) with superior performance compared to conventional thermal solutions. This is achieved by improving heat transfer between the sliding heat source and the stationary heat sink via a durable layer (e.g., a metallic abrasion layer defined by a stainless steel, copper, beryllium copper, aluminum, brass, other metal substrate or cap, or other materials having high thermal conductivity and puncture resistance in addition to abrasion resistance) disposed on or along the thermal interface material (broadly, interface materials) or along the thermal interface material.

[0018] In an exemplary embodiment, a thermal interface material (TIM) assembly (broadly defined, a thermal management assembly or thermal solution) is mounted on a heat sink (broadly defined, a heat removal / dissipation structure). The TIM assembly includes a wear-resistant metal layer (broadly defined, a durable layer) (e.g., stainless steel, other metals, etc.) on and / or along the thermal interface material (broadly defined, an interface material) (e.g., a thermal phase change material (PCM)). The wear-resistant metal layer protects the TIM as a heat source slides into and out of positions relative to the TIM assembly and the heat sink. The wear-resistant metal layer may have a thickness ranging from about 17.5 micrometers to about 300 micrometers. The thermal interface material applied to the inner side of the wear-resistant metal layer may have a thermal conductivity ranging from about 1 W / mK to about 50 W / mK.

[0019] When the heat source is slidably inserted into place relative to the TIM assembly, heat can be conducted along a defined heat transfer path through the abrasion-resistant metal layer, the TIM layer, and into the heat sink. The TIM assembly can be held in place relative to the heat sink by a series of notches, recesses (or other similar self-locking, retaining, latching, snap-locking mechanisms such as frames / fences for holding the shielding cover to the board-level shield (BLS)) and adhesive sections. The notch-recess design (or other suitable attachment units / mechanisms) allows for quick and easy alignment during installation while also taking into account the necessary deflection to conform to or mold to the surface topology of the heat source.

[0020] As disclosed herein, a metal wear-resistant layer (e.g., a stainless steel or other metal substrate or cap, etc.) may include recesses or protrusions (broadly, inwardly projecting portions, protrusions, or retaining members) along spaced-apart fingers (e.g., spring fingers, etc.). The recesses or protrusions are configured to engage with corresponding fingers of the radiator within recesses or sockets (broadly, openings or recesses), for example, by pressing the TIM assembly onto the radiator. The engagement of the metal wear-resistant layer's recesses or protrusions within the radiator's recesses or sockets facilitates the alignment and retention of the TIM assembly onto the radiator. After the metal wear-resistant layer's recesses or protrusions engage within the radiator's recesses or sockets, heat can be applied to the TIM assembly, for example, for setting the TIM, TIM curing (e.g., via chemical reactions during a heating process, etc.), TIM melting, TIM burn-in, TIM phase change, TIM softening, causing TIM thinning, and / or wetting of the surface, etc.

[0021] Advantageously, using a stainless steel or other metal wear-resistant layer to protect the thermal interface material (broadly, the interface material) provides increased durability compared to easily torn polyimide films. Furthermore, using a stainless steel or other metal wear-resistant layer to protect the interface material also improves thermal performance compared to conventional thermal solutions that use a polyimide film as a wear-resistant layer to protect the thermal interface material. And manufacturability is improved during assembly by using recesses or protrusions (broadly, inwardly projecting portions, protrusions, or retaining members) along spaced-apart fingers (e.g., spring fingers, etc.), which are configured to engageably receive, retain, latch, or lock within recesses or slots (generally openings or grooves) along the corresponding fingers of the radiator.

[0022] Now refer to the attached diagram, Figures 1 to 4 An exemplary embodiment of a thermal management component 100 or thermal solution is illustrated, which includes a metal wear-resistant layer 104 (broadly, a durable layer) (e.g., a stainless steel substrate, other metal substrate, etc.) and a thermal interface material (TIM) 108 (broadly, an interface material) (e.g., a thermal phase change material (PCM), etc.) beneath the metal wear-resistant layer 104. The metal wear-resistant layer 104 improves the durability of the thermal interface material 108 between a slidable heat source and a heat sink 112, such as when the heat source slides relative to the heat sink 112 along the metal wear-resistant layer 104 and in physical sliding contact with the metal wear-resistant layer 104 (e.g., during insertion, removal, re-insertion, etc.).

[0023] exist Figure 1In the diagram, the thermal management component 100 is shown mounted on the base of the heat sink 112. Alternatively, the thermal management component 100 may be mounted differently, for example, to different heat sinks, to different heat dissipation / cooling components, to heat sources or other components, etc.

[0024] The metal wear-resistant layer 104 includes recesses or protrusions 116 (broadly, inwardly projecting portions, protrusions, or retaining members) along spaced-apart fingers 120 (e.g., spring fingers, etc.) (generally, sidewall portions). The recesses or protrusions 116 are configured to engage with corresponding fingers (generally sidewall portions) of the radiator 112, receiving, retaining, latching, or locking within recesses or sockets 124 (generally openings or recesses), for example, by pressing the thermal management assembly 100 onto the radiator 112. The engagement of the recesses or protrusions 116 of the metal wear-resistant layer 104 within the recesses or sockets 124 of the radiator 112 facilitates the alignment and retention of the thermal management assembly 100 onto the radiator 112. After the recesses or protrusions 116 of the metal wear-resistant layer 104 are engaged within the recesses or sockets 124 of the heat sink 112, heat can be applied to the thermal management assembly 100, for example, to set the thermal interface material 108, cure the thermal interface material 108 (e.g., via chemical reactions during the heating process, etc.), melt the TIM, ablate the TIM, undergo a phase change of the thermal interface material 108, soften the thermal interface material 108, cause the thermal interface material 108 to thin and / or wet the surface, etc.

[0025] Alternative embodiments may be constructed differently from those shown in the accompanying drawings. For example, another exemplary embodiment may include a stainless steel substrate defining a wear-resistant layer, wherein the stainless steel substrate does not include any recesses or protrusions along spaced-apart fingers that are configured to engage, receive, retain, latch, or lock within recesses or sockets along corresponding fingers of the radiator. Other exemplary embodiments may include a metallic wear-resistant layer having other suitable units, mechanisms, or features (e.g., pawls, full recesses, half recesses, non-circular recesses, latches, plate-level shielding (BLS) covers, other means of attaching to frames / fences, etc.) to replace or in addition to the recesses or protrusions of the wear-resistant layer and the recesses or sockets of the radiator.

[0026] Figure 2 Examples are given based on Figure 1 The exemplary embodiment includes a thermal interface material (TIM) 108 (broadly, an interface material) (e.g., a thermal phase change material (PCM)) located beneath the metal wear layer 104. The metal wear layer 104 improves the durability of the thermal interface material 108 between the slidable heat source and the heat sink 112, such as when the heat source slides relative to the heat sink 112 along the metal wear layer 104 and in physical sliding contact with the metal wear layer 104 (e.g., during insertion, removal, re-insertion, etc.).

[0027] Figure 3 Examples are given based on Figure 1 An exemplary embodiment of the thermal management assembly 100 includes a removable protective liner 128 (e.g., a protective foil, etc.) disposed on the thermal interface material 108 of the thermal management assembly 100. Figure 3 Also illustrated are first adhesive material (e.g., pressure-sensitive adhesive, etc.) strips or lines and second adhesive material strips 132 or lines adjacent to the first and second (or front and rear) portions of the protective liner 128 disposed on the thermal interface material 108 of the thermal management assembly 100. The thermal interface material 108 is located in a channel or region generally defined between the first adhesive material strip and the second adhesive material strip 132. Figure 4 An exemplary tab 136 is illustrated, which is configured to facilitate the removal of features provided according to... Figure 1 A removable protective liner 128 (e.g., protective foil, etc.) on the thermal interface material 108 of the thermal management component 100 in an exemplary embodiment.

[0028] The first and second adhesive strips 132 can be configured to provide reinforcement along the front and rear edge portions of the thermal interface material 108, perpendicular to the sliding direction between the slidable heat source and the radiator 112 (generally, a heat removal / heat dissipation structure), to which the thermal management assembly 100 is attached (e.g., adhesive attachment, joint attachment via recesses / protrusions within a notch / socket, etc.). The fingers 120 (generally, sidewall portions) of the metal wear-resistant layer 104 can be configured to provide reinforcement along the side edge portions of the thermal interface material 108, parallel to the sliding direction between the slidable heat source and the radiator 112 (generally, a heat removal / heat dissipation structure) to which the thermal management assembly 100 is attached (e.g., adhesive attachment, joint attachment via recesses / protrusions within a notch / socket, etc.). The reinforcement along the edge portion of the thermal interface material 108 can absorb compressive forces and help confine the thermal interface material 108 to a channel or region generally defined between the first and second adhesive material strips 132, thereby helping to maintain the integrity of the thermal interface material 108 and inhibit its migration.

[0029] The first adhesive strip and the second adhesive strip 132 or line may comprise first and second layers or coatings of pressure-sensitive adhesive along opposite first and second sides of a polymer film (e.g., polyethylene terephthalate film, thermoplastic polymer film, organic thermal expansion film, flame-retardant meta-aramid film, other aromatic polyamide film, etc.). For example, the first adhesive strip and the second adhesive strip 132 or line may comprise first and second layers or coatings of pressure-sensitive adhesive along opposite first and second sides of a polyethylene terephthalate film. In the latter example, the polyethylene terephthalate film may have a thickness of about 50 micrometers, and the pressure-sensitive adhesive may have a thickness of about 25 micrometers along each side of the polyethylene terephthalate film.

[0030] As another example, the first and second adhesive tapes or wires may include an organic thermal extender comprising a polymer film coated with a thermally conductive pressure-sensitive adhesive. The organic thermal extender may be configured to have high thermal conductivity (e.g., in-plane thermal conductivity of about 50 W / mK, etc.) and high resistivity (e.g., greater than 10¹⁵ W / cm, etc.) exceeding the transplane thermal conductivity (e.g., about 0.2 W / mK, etc.) within the plane of the film. The first and second adhesive tapes or wires may include pressure-sensitive adhesives with thicknesses ranging from about 25 micrometers to about 200 micrometers, such as 25 micrometers, 80 micrometers, 100 micrometers, 125 micrometers, 140 micrometers, 150 micrometers, 160 micrometers, etc.

[0031] In an exemplary embodiment, the thermal interface material, the metal wear-resistant layer, and the first adhesive strip or line and the second adhesive strip or line are not slippery relative to each other. Conversely, the positions of the thermal interface material, the metal wear-resistant layer, and the first and second adhesive strips or lines can be fixed relative to each other.

[0032] In exemplary embodiments, a variety of materials can be used for the durability layer, such as stainless steel (e.g., 301 / 302 stainless steel, etc.), phosphor bronze, copper-clad steel, brass, Monel alloy, nickel-silver alloy, aluminum, aluminum alloy, steel, carbon steel, cold-rolled steel, sheet metal, brass, copper, copper-nickel alloy, beryllium copper alloy, other copper-based alloys, magnesium alloys, other materials that, in addition to wear resistance, have high thermal conductivity and puncture resistance, other metals, other alloys, other materials, etc., that have higher thermal conductivity and are more durable (e.g., puncture and wear resistant) than polyimide films. Various aspects of this disclosure should not be limited to the use of any particular durability layer or metal wear-resistant layer, as exemplary embodiments may include a variety of metals, metal alloys, and other materials (e.g., puncture-resistant and wear-resistant layers, etc.) for providing the durability layer.

[0033] A variety of materials can be used for interface materials, such as thermal gap fillers, thermal phase change materials, thermally conductive EMI absorbers or hybrid thermal / EMI absorbers, thermal putties, thermal greases, and other thermal interface materials disclosed herein. In exemplary embodiments, the interface material includes a thermal phase change material with a thermal conductivity ranging from about 1 W / mK to about 50 W / mK. For example, the interface material may include a thermal phase change material having a thermal conductivity of about 7.5 W / mK. The interface material may be naturally tacky and / or self-adhesive to another surface of the component. The interface material may be softer, more compliant, less durable, and / or more easily worn than a metallic wear layer. As disclosed herein, thermal management components or thermal solutions can provide sufficiently good durability and wear resistance to the interface material, thereby allowing the interface material to withstand and / or undergo sliding operations. Aspects of this disclosure should not be limited to use with any particular interface material, as exemplary embodiments may include a wide range of thermal interface materials and other interface materials.

[0034] In an exemplary embodiment, Figure 1 The thermal management component 100 shown can be assembled onto a heat sink 112, heat source, or other component via the following exemplary process. The assembly process may include removing or peeling off a protective liner 128 (e.g., a protective foil, etc.) to expose a thermal interface material 108 (broadly, an interface material). After the protective liner 128 has been removed, the thermal management component 100 can be positioned onto the heat sink 112, heat source, or other component such that the thermal interface material 108 is in thermal contact (e.g., direct physical contact, compressed, etc.) with the heat sink 112, heat source, or other component. Positioning the thermal management component 100 onto the heat sink 112, heat source, or other component may also include engagingly receiving, retaining, latching, or locking recesses or sockets 116 of the fingers 120 along the metal substrate of the thermal management component 100 within recesses or sockets 124 of corresponding fingers along the heat sink 112, heat source, or other component, for example, by pressing the thermal management component 100 onto the heat sink 112, heat source, or other component. The engagement of the recesses or protrusions 116 of the metal substrate within the recesses or sockets 124 of the radiator 112, heat source, or other component facilitates the alignment and holding of the thermal management assembly 100 to the radiator 112, heat source, or other component. After the recesses or protrusions 116 of the metal substrate engage within the recesses or sockets 124 of the radiator 112, heat source, or other component, heat can be applied to the thermal management assembly 100, for example, for setting the thermal interface material 108, curing the thermal interface material 108 (e.g., via chemical reactions during a heating process), TIM melting, TIM ablation, phase transformation of the thermal interface material 108, softening of the thermal interface material 108, causing thinning of the thermal interface material 108, and / or wetting of the surface, etc.

[0035] Compared to conventional solutions that use polyimide films to define abrasion-resistant layers on or along a thermal interface material (TIM), defining durability layers (e.g., puncture-resistant and abrasion-resistant layers) on or along a thermal interface material (TIM) using a metal substrate (e.g., stainless steel, copper, beryllium copper, aluminum, brass, nickel, nickel plating, chromium plating, and / or non-metallic films bonded to or metallized to a metal) improves heat transfer between a slidable heat source and a heat sink. The improved thermal performance compared to conventional TIM assemblies that use polyimide films to define abrasion-resistant layers is due to the use of components with higher thermal conductivity (metals compared to polyimide).

[0036] The thermal management components and thermal solutions disclosed herein can be used with a wide range of devices and components. Therefore, aspects of this disclosure are not limited to use only with heat sinks, as the thermal management components and thermal solutions disclosed herein can be used with other heat removal / dissipation structures and / or components, such as heat removal / dissipation structures that are part of the housing or frame itself, heat pipes, vapor chambers, thermal extensions, cold plates, etc. The thermal management components and thermal solutions disclosed herein can be used with connector plugs, sliding parts of tablets or other modular portable devices, frames of transceivers (e.g., Small Form Factor Pluggable (SFP) transceivers, SFP+ transceivers, Quad Small Form Factor Pluggable (QSFP) transceivers, QSFP+ transceivers, XFP transceivers, Eight-Channel Small Form Factor Pluggable (OSFP) transceivers, any hot-swappable components, E1.2 memory applications, E3.s memory applications, etc.

[0037] In an exemplary embodiment, the thermal management component is configured to improve heat transfer between a slidable heat source and a heat sink by providing a durable layer on and / or along the thermal interface material, thereby providing a durable, non-slip thermal interface material with improved performance.

[0038] In an exemplary embodiment, the thermal management assembly includes a thermal interface material and a durable layer disposed on and / or along the thermal interface material. The durable layer is configured to protect the thermal interface material when a heat source or other component slides into and out of positions relative to the thermal management assembly.

[0039] In an exemplary embodiment, the thermal management assembly includes a substrate having opposing inner and outer surfaces. A thermal interface material runs along the inner surface of the substrate. The substrate defines a durable layer disposed on and / or along the thermal interface material. The durable layer is configured to slide along and contact the first surface when the thermal management assembly runs along the second surface of the second component and when the first and second surfaces of the first component are slidably moved relative to each other.

[0040] In an exemplary embodiment, the substrate includes a metal substrate. For example, the substrate may include metals such as (but not limited to) stainless steel, copper, beryllium copper, etc.

[0041] In an exemplary embodiment, the durability layer has a higher thermal conductivity than the polyimide film and is more abrasion-resistant and puncture-resistant than the polyimide film.

[0042] In an exemplary embodiment, the substrate includes a metal substrate defining a metal wear-resistant layer disposed on and / or along a thermal interface material. The metal wear-resistant layer is configured such that when the thermal management assembly moves along a second surface of the second component and when the second surface and the first surface of the first component are slidably moved relative to each other, the metal wear-resistant layer slides along the first surface and contacts the first surface.

[0043] The thermal management components are adhesively attached to the inner surface of the substrate.

[0044] In an exemplary embodiment, the thermal management component is naturally adhesive and / or self-adhesive, such that the thermal interface material self-adheres to the inner surface of the substrate without the need for additional adhesives.

[0045] In an exemplary embodiment, the first component includes a heat source. The second component includes a heat sink. A thermal management component is applied to the heat sink such that a thermal interface material is between the heat sink and a durable layer, and that the durable layer is between the thermal interface material and the heat source. The durable layer is configured to slide relative to the heat source in contact with the heat source as the heat source is slidably moved relative to the heat sink and the thermal management component applied to the heat sink.

[0046] In an exemplary embodiment, the first component includes a heat sink. The second component includes a heat source. A thermal management component is applied to the heat source such that a thermal interface material is between the heat source and the durable layer, and that the durable layer is between the thermal interface material and the heat sink. The durable layer is configured to slide relative to the heat sink as the heat source and the thermal management component applied to the heat source are slidably moved relative to the heat sink.

[0047] In an exemplary embodiment, the durability layer comprises stainless steel. For example, the durability layer may comprise metals such as (but not limited to) stainless steel, copper, beryllium copper, etc.

[0048] In an exemplary embodiment, the durability layer is abrasion-resistant and puncture-resistant.

[0049] In an exemplary embodiment, the durability layer has a higher thermal conductivity than the polyimide film and is more abrasion-resistant and puncture-resistant than the polyimide film.

[0050] In an exemplary embodiment, the durability layer is a metallic wear-resistant layer disposed on and / or along the thermal interface material. The metallic wear-resistant layer is configured to slide along and in contact with the first surface of the first component when the thermal management assembly moves along the second surface of the second component and when the second surface and the first surface of the first component are slidably moved relative to each other.

[0051] In an exemplary embodiment, the thermal interface material includes a thermal phase change material. In other exemplary embodiments, the thermal interface material is not a thermal phase change material.

[0052] In an exemplary embodiment, the durability layer is configured to protect the thermal interface material when the heat source slides into and out of positions relative to the thermal management components and the heat sink.

[0053] In an exemplary embodiment, the thickness of the durability layer ranges from about 17.5 micrometers to about 300 micrometers.

[0054] In an exemplary embodiment, the thermal conductivity of the thermal interface material is in the range of about 1 watt / meter Kelvin (W / mK) to about 50 W / mK.

[0055] In an exemplary embodiment, the durability layer is defined by a substrate or cover, the substrate or cover including inwardly projecting portions, protrusions, or retaining members of spaced-apart fingers along the substrate or cover, the inwardly projecting portions, protrusions, or retaining members being configured to engageably receive, retain, latch, or lock within openings, holes, or recesses along a heat sink, heat source, or other component. The substrate or cover may include metals, such as (but not limited to) stainless steel, copper, beryllium copper, etc.

[0056] In an exemplary embodiment, a removable protective liner is disposed on the thermal interface material.

[0057] In an exemplary embodiment, the first adhesive portion and the second adhesive portion are respectively adjacent to opposite front and rear edge portions of the thermal interface material. The first adhesive portion and the second adhesive portion provide reinforcement along the front and rear edge portions of the thermal interface material, which helps to confine the thermal interface material within the area defined by the reinforcement, thereby inhibiting the migration of the thermal interface material.

[0058] In an exemplary embodiment, the thermal interface material includes at least one of a thermally conductive pad, a thermally conductive gap filler, a phase change thermal interface material, a dispensable thermal interface material, a thermal filler, and a thermal grease.

[0059] In an exemplary embodiment, an apparatus includes a thermal management component, a heat sink, and a heat source slidable relative to the heat sink, substantially as disclosed herein. The thermal management component is applied to the heat sink such that a thermal interface material is between the heat sink and a durable layer, and that the durable layer is between the thermal interface material and the heat source. The durable layer is configured to slide relative to the heat source in contact with the heat source as the heat source is slidably moved relative to the heat sink and the thermal management component applied to the heat sink.

[0060] In an exemplary embodiment, the apparatus includes a thermal management component substantially as disclosed herein, a heat sink, and a heat source slidable relative to the heat sink. The thermal management component is applied to the heat source such that a thermal interface material is between the heat source and a durable layer, and that the durable layer is between the thermal interface material and the heat sink. The durable layer is configured to slide relative to the heat sink in contact with the heat sink as the heat source (including the thermal management component applied to the heat source) is slidably moved relative to the heat sink.

[0061] Exemplary methods for assembling thermal management components to a heat sink or heat source, substantially as disclosed herein, are also disclosed. In an exemplary embodiment, the thermal management component includes a durable layer disposed on and / or along a thermal interface material.

[0062] An exemplary method of mounting a sliding thermal management assembly includes applying a thermal interface material (TIM) (e.g., a thermal phase change material, etc.) directly to the inner surface of a metal cap, the metal cap also including an outer sliding surface and a spring finger with an inwardly recessed recess. The exemplary method further includes applying a first adhesive reinforcement strip and a second adhesive reinforcement strip along opposite edges of the thermal interface material perpendicular to the intended sliding direction. The exemplary method may also include removing a protective liner from the top of the thermal interface material. The exemplary method may further include pressing the metal cap onto a heat-dissipating component (e.g., a radiator, etc.) such that the inwardly recessed recess is received in a socket of the heat-dissipating component and the thermal interface material contacts the heat-dissipating component.

[0063] In some exemplary methods, the method may also include heating the component to an ablation temperature between 45°C and 75°C to soften the thermal interface material and reduce its thickness by 10% to 40%, thereby improving wettability and reducing contact resistance.

[0064] In some exemplary methods, the metal cover may include stainless steel and have a thickness of approximately 50 to 100 micrometers. Each adhesive reinforcement strip may include a PET film with a thickness of 50 micrometers and an adhesive layer 25 micrometers thick on each side. The socket may be formed as a recess in a heatsink base. The assembly may be mounted into a pluggable transceiver frame such as an SFP, SFP+, QSFP, QSFP+, or OSFP.

[0065] In an exemplary embodiment, the sliding thermal management assembly includes a metal cap (e.g., stainless steel, copper, beryllium copper, etc.) having an outer sliding surface and an inner surface. A thermal interface material is disposed on the inner surface of the metal cap, for example, directly on the inner surface without any intermediate components. Spaced-apart spring fingers along the metal cap form a plurality of inwardly projecting recesses. These recesses are configured to be received in corresponding slots of a heat-removing component (e.g., the base of a radiator, etc.). A first adhesive reinforcing strip and a second adhesive reinforcing strip are located on opposite edges of the thermal interface material and extend along edges perpendicular to the sliding direction, thereby confining the thermal interface material between the first and second adhesive reinforcing strips, such that during sliding insertion of a heat source along the outer sliding surface of the metal cap, the first and second adhesive reinforcing strips absorb edge compression and inhibit the migration of the thermal interface material. The heat transfer path extends through the metal cap, the thermal interface material, and into the heat-removing component.

[0066] In an exemplary embodiment, an apparatus includes a heat sink having a socket along a sidewall of a base. The apparatus also includes a sliding thermal management assembly as disclosed herein. The sliding thermal management assembly engages the heat sink by receiving recesses of spaced-apart spring fingers along a metal cap into the socket along the sidewall of the base. A heat source is configured to establish and disengage thermal contact with the outer sliding surface of the metal cap by sliding in and out. The metal cap protects the thermal interface material during repeated sliding insertion and removal cycles and maintains a thermal path from the heat source through the metal cap and the thermal interface material into the heat sink.

[0067] In an exemplary embodiment, the metal cap may comprise stainless steel and have a thickness from 50 micrometers to 100 micrometers. The thermal interface material may comprise a thermal phase change material having a transplanar thermal conductivity from 5 W / m Kelvin to 15 W / mK. Both the first and second adhesive reinforcing strips may comprise polymer films (PET films) having pressure-sensitive adhesives on opposite sides and having a total thickness from 75 micrometers to 150 micrometers. The spring finger may be integral with the sidewall of the metal cap. And the socket may be formed as a recess in the base of the heat sink.

[0068] In an exemplary embodiment, the heat source may include a pluggable transceiver module. The heat sink may include a machined aluminum base having a recessed socket. The sliding insertion direction may be parallel to the edge reinforced by spring fingers and perpendicular to the edge reinforced by adhesive tape. The device may also include a frame or housing providing sliding alignment.

[0069] In an exemplary embodiment, cyclic durability testing demonstrates that after repeated (e.g., at least 500 times, etc.) slide-in / slide-out cycles, the component maintains sufficient contact resistance (e.g., ≤0.2 K·cm). 2(e.g., / W). Exemplary embodiments may include an adhesive reinforcement tape comprising a polyethylene terephthalate (PET) film with a thickness of about 50 micrometers, having a pressure-sensitive adhesive layer of about 25 micrometers on each side, for a total thickness of about 100 micrometers. Exemplary embodiments may include an ablation process to reduce the thickness of the TIM by about 10% to about 40% relative to its unablated thickness, improving wettability and reducing contact resistance.

[0070] In an exemplary embodiment, the thermal interface material may include a thermal phase change material having a transplanar thermal conductivity of about 5 W / m·K to about 15 W / m·K and a melting temperature between about 45°C and about 75°C.

[0071] In an exemplary embodiment, the metal wear-resistant layer may consist essentially of 301 or 302 grade stainless steel with a thickness of about 50 micrometers to about 100 micrometers, providing at least ten times greater thermal conductivity than a polyimide film of the same thickness.

[0072] In an exemplary embodiment, the metal cover may comprise copper-clad steel or a beryllium copper alloy. In an exemplary embodiment, the recess may comprise a semi-recess with a non-circular planar shape. In an exemplary embodiment, the heat dissipation component may comprise a radiator, a steam chamber, or a cold plate.

[0073] Figure 5 This is a graph of the zero-time normalized thermal resistance (Rth / Rth initial) versus the number of re-insertions for a test sample of a thermal management component or thermal solution according to an exemplary embodiment of this disclosure, the thermal management component or thermal solution comprising a metal wear-resistant layer (broadly, a durable layer or wear-resistant layer) (e.g., a stainless steel substrate, other metal substrates, etc.) and a thermal interface material (TIM) (e.g., a thermal phase change material (PCM), etc.) beneath the metal wear-resistant layer.

[0074] For this specific test, the sample includes a stainless steel layer on the thermal interface material (TIM). The purpose of the test is to characterize the durability and performance of the sample product after 500 re-insertion cycles.

[0075] Test conditions: Tests were conducted in a laboratory environment with the ambient temperature maintained between 20°C and 25°C. During testing, the interface load applied to the OSFP-IHS module (Eight-Channel Small Pluggable (OSFP) Integrated Heatsink (IHS) Module) was 36 Newtons, consistent with the guidelines specified in Section 5.5 of OSFP MSA Revision 5.1. The cold plate inlet temperature was set to 20°C.

[0076] Test preparation: To ablate the sample, the sample was loaded onto a glass plate with a known surface flatness of less than 50 micrometers and subjected to the following conditions:

[0077] - Pressure: 13.8 kPa;

[0078] - Temperature and time: The cold plate was held at 70°C for 30 minutes; and

[0079] - Ensure the cold plate is below 35°C before removing pressure from the interface.

[0080] Testing process:

[0081] 1. Set up a liquid circuit so that the inlet temperature of the cold plate is 20℃.

[0082] 2. Insert the TTV (thermal test vehicle) and characterize the thermal resistance before re-inserting it.

[0083] 3. Remove and reinsert the TTV by hand 100 times.

[0084] 4. Visually inspect the surface of the sample product for tears, and record the surface condition with pictures (e.g., see...). Figure 6 ).

[0085] 5. Characterize thermal resistance.

[0086] 6. Remove and reinsert the TTV by hand 100 times.

[0087] 7. Repeat steps 4 through 6 until 500 insertions have been completed.

[0088] Thermal performance results: Thermal performance was measured at 100 insertion intervals to track whether thermal resistance increased with the number of insertions. The thermal resistance remained consistent after each round of 100 insertions compared to the initial thermal resistance, and even slightly improved at the end of 500 insertions, for example, as... Figure 5 As shown.

[0089] Figure 6 The results of 500 insertions are shown for three test samples of a thermal management component or thermal solution according to an exemplary embodiment of this disclosure. Each test sample includes a metal wear-resistant layer (broadly, a durability layer) (e.g., a stainless steel substrate, other metal substrates, etc.) and a thermal interface material (TIM) (e.g., a thermal phase change material (PCM), etc.) beneath the metal wear-resistant layer. Each sample was visually inspected after every 100 insertions. Figure 6 As shown, no tearing was observed after the intense insertion cycle.

[0090] Various aspects of the invention according to this disclosure include, but are not limited to, those listed in the following numbered clauses.

[0091] Clause 1. A thermal management assembly for a sliding application, the assembly comprising: a substrate having opposing inner and outer surfaces; and an interface material along the inner surface of the substrate; wherein the substrate defines a durability layer disposed on and / or along the interface material, and the durability layer is configured to contact the first surface when the thermal management assembly is slidably moved along a second surface of a second component and when a first surface of a first component is slidably moved relative to the second surface.

[0092] Clause 2. The component according to Clause 1, wherein: the substrate includes a metal cap having an outer sliding surface and an inner surface; the interface material is disposed on the inner surface of the metal cap; a plurality of inwardly projecting recesses are arranged along spaced-apart spring fingers of the metal cap, the recesses being configured to be received in corresponding sockets of the heat-removing component; and a heat transfer path extends through the metal cap, the interface material and into the heat-removing component.

[0093] Clause 3. The component according to Clause 2, wherein the first adhesive reinforcing strip and the second adhesive reinforcing strip are positioned on opposite edges of the interface material and extend along an edge perpendicular to the sliding direction, wherein the interface material is confined between the first adhesive reinforcing strip and the second adhesive reinforcing strip such that during the sliding insertion of a heat source along the outer sliding surface of the metal cap, the first adhesive reinforcing strip and the second adhesive reinforcing strip absorb edge compression and inhibit migration of the interface material.

[0094] Clause 4. The component according to Clause 3, wherein: the metal cap comprises stainless steel; the interface material comprises a thermal phase change material; and both the first adhesive reinforcing tape and the second adhesive reinforcing tape comprise polymer films having pressure-sensitive adhesives on opposite sides.

[0095] Clause 5. The component according to Clause 3, wherein: the metal cap comprises stainless steel having a thickness of 50 micrometers to 100 micrometers; the interface material comprises a thermal phase change material having a through-plane thermal conductivity of 5 W / mK to 15 W / mK; and both the first adhesive reinforcing tape and the second adhesive reinforcing tape comprise polymer films having pressure-sensitive adhesives on opposite sides and having a total thickness of 75 micrometers to 150 micrometers.

[0096] Clause 6. The component according to Clause 3, wherein: the metal cap comprises stainless steel having a thickness of 6 micrometers to 200 micrometers; the interface material comprises a thermal phase change material having a through-plane thermal conductivity of 0.15 W / mK to 50 W / mK; and both the first adhesive reinforcing tape and the second adhesive reinforcing tape comprise polymer films having pressure-sensitive adhesives on opposite sides and having a total thickness of not more than 200 micrometers.

[0097] Clause 7. The component according to Clause 2 or 3, wherein: the metal cap comprises stainless steel having a thickness of 50 micrometers to 100 micrometers; and the interface material comprises a thermal phase change material having a through-plane thermal conductivity of 5 W / mK to 15 W / mK.

[0098] Clause 8. The component according to Clause 2 or 3, wherein: the metal cap comprises stainless steel having a thickness of 6 micrometers to 200 micrometers; and the interface material comprises a thermal phase change material having a through-plane thermal conductivity of 0.15 W / mK to 50 W / mK.

[0099] Clause 9. The component according to any one of Clauses 2 to 8, wherein the thermal conductivity of the metal cap is at least ten times greater than that of a polyimide film of the same thickness.

[0100] Clause 10. The component according to any one of Clauses 2 to 9, wherein: the spring finger is integral with the sidewall of the metal cover; and the socket is a recess on the base of the heat sink.

[0101] Clause 11. The component according to Clause 1, wherein the substrate includes a self-locking feature configured to abut and engage with a corresponding self-locking feature of the heat-removing component, thereby retaining the substrate to the heat-removing component.

[0102] Clause 12. The component according to Clause 1, wherein the substrate includes a protruding recess configured to be received in a corresponding socket of the heat-removing component, thereby retaining the substrate to the heat-removing component.

[0103] Clause 13. The component according to Clause 1, wherein the base includes a plurality of sockets configured to receive protruding recesses of a heat-removing component therein, thereby retaining the base to the heat-removing component.

[0104] Clause 14. The component according to Clause 1, wherein: the base includes a plurality of sockets configured to engagely receive a metal cap having an outer sliding surface and an inner surface; the interface material is disposed on the inner surface of the metal cap; a plurality of inwardly projecting recesses are arranged along spaced-apart spring fingers of the metal cap, the recesses being configured to be received in corresponding sockets of the heat-removing component; and a heat transfer path extends through the metal cap, the interface material and into the heat-removing component.

[0105] Clause 15. The component according to any one of Clauses 1 to 14, wherein the thickness of the interface material is reduced by 10% to 40% after ablation relative to the thickness of the interface material before ablation.

[0106] Clause 16. The component according to any one of Clauses 1 to 15, wherein the substrate comprises a metal substrate, the metal substrate comprising stainless steel, copper or beryllium copper.

[0107] Clause 17. The component according to any one of Clauses 1 to 16, wherein: the durability layer is abrasion-resistant and puncture-resistant; and the durability layer has a higher thermal conductivity than the polyimide film and is abrasion-resistant and puncture-resistant than the polyimide film.

[0108] Clause 18. The component according to any one of Clauses 1 to 17, wherein: the durability layer is abrasion-resistant and puncture-resistant; and the durability layer has substantially the same or better thermal conductivity, abrasion resistance and / or puncture resistance as the polyimide film.

[0109] Clause 19. The component according to any one of Clauses 1 to 18, wherein the substrate includes a metal substrate defining a metal wear-resistant layer disposed on and / or along the interface material, and the metal wear-resistant layer is configured to slide along and contact the first surface when the thermal management component is along the second surface of the second component and when the first surface of the first component is slidably movable relative to the second surface.

[0110] Clause 20. The component according to any one of Clauses 1 to 19, wherein: the interface material is naturally adhesive and self-adhesive to the inner surface of the substrate without the need for additional adhesives.

[0111] Clause 21. The component according to any one of Clauses 1 to 20, wherein: the first component includes a heat source; the second component includes a heat sink; and the thermal management component is applied to the heat sink such that the interface material is located between the heat sink and the durable layer, and the durable layer is located between the interface material and the heat source; and the durable layer is configured to slide relative to the heat source in contact with the heat source when the heat source is slidably moved relative to the heat sink and the thermal management component applied to the heat sink.

[0112] Clause 22. The component according to any one of Clauses 1 to 20, wherein: the first component includes a heat sink; the second component includes a heat source; and the thermal management component is applied to the heat source such that the interface material is located between the heat source and the durable layer, and the durable layer is located between the interface material and the heat sink; and the durable layer is configured to slide relative to the heat sink in contact with the heat sink when the heat source and the thermal management component applied to the heat source are slidably movable relative to the heat sink.

[0113] Clause 23. The component according to any one of Clauses 1 to 22, wherein: the durable layer has a thickness in the range of about 17.5 micrometers to about 300 micrometers; and / or the interface material has a thermal conductivity in the range of about 1 W / mK to about 50 W / mK.

[0114] Clause 24. The component according to any one of Clauses 1 to 23, wherein the base includes inwardly projecting portions of spaced-apart fingers along the base, the inwardly projecting portions being engagedly received within an opening along a radiator, heat source or other component.

[0115] Clause 25. The component according to any one of Clauses 1 to 24, the component further comprising: a removable protective liner disposed on the interface material, the protective liner having tear tabs aligned with the sliding direction.

[0116] Clause 26. The component according to any one of Clauses 1 to 25, the component further comprising a first adhesive portion and a second adhesive portion respectively adjacent to opposite front and rear edge portions of the interface material, wherein the first adhesive portion and the second adhesive portion provide reinforcement along the front and rear edge portions of the interface material, the reinforcement helping to confine the interface material within the area defined by the reinforcement, thereby inhibiting the migration of the interface material.

[0117] Clause 27. The component according to any one of Clauses 1 to 26, wherein: the interface material comprises at least one of: a thermally conductive pad, a thermally conductive gap filler, a dispensable thermal interface material, a phase change thermal interface material, a thermal filler, and a thermal grease; the substrate is configured to protect the interface material when a heat source or other component slides into and out of the thermal management assembly; and the thermal management assembly is configured to improve heat transfer between a slidable heat source and a heat sink via a substrate defining a durable layer on and / or along the interface material, thereby providing a durable, non-slip interface material with improved performance.

[0118] Clause 28. The component according to any one of Clauses 1 to 27, wherein: the substrate protects the interface material during repeated sliding insertion and removal cycles and maintains a thermal path through the substrate and the interface material.

[0119] Clause 29. The component according to any one of Clauses 1 to 28, wherein: the substrate includes a portion of an EMI frame for an optical transceiver application, the EMI frame defining the durable layer disposed on and / or along the interface material.

[0120] Clause 30. A thermal management assembly for a sliding application, the assembly comprising: a metal cap having an outer sliding surface and an inner surface; an interface material disposed on the inner surface of the metal cap; a plurality of inwardly projecting recesses along spaced-apart spring fingers of the metal cap, the recesses being configured to be received in corresponding inserts of a heat-removing component; and a first adhesive reinforcing strip and a second adhesive reinforcing strip positioned on opposite edges of the interface material and extending along edges perpendicular to the sliding direction, wherein the interface material is confined between the first adhesive reinforcing strip and the second adhesive reinforcing strip such that during sliding insertion of a heat source along the outer sliding surface of the metal cap, the first adhesive reinforcing strip and the second adhesive reinforcing strip absorb edge compression and inhibit migration of the interface material; wherein the metal cap retains the interface material such that the interface material is durable during repeated sliding insertion and removal cycles, and such that a heat transfer path through the metal cap, the interface material, and into the heat-removing component is maintained.

[0121] Clause 31. An electronic device comprising: a heat sink having a socket along a sidewall of a base; a thermal management assembly according to Clause 30, the thermal management assembly being engaged with the heat sink by receiving the recess into the socket along the sidewall of the base via spaced-apart spring fingers along a metal cap; and a heat source configured to establish and de-establish thermal contact with the outer sliding surface of the metal cap by sliding in and out; wherein the metal cap protects the interface material during repeated sliding insertion and removal cycles and maintains a thermal path from the heat source through the metal cap and the interface material into the heat sink.

[0122] The provision of exemplary embodiments makes this disclosure thorough and fully conveys the scope to those skilled in the art. Numerous specific details, such as examples of specific components, apparatus, and methods, are set forth to provide a thorough understanding of embodiments of this disclosure. It will be apparent to those skilled in the art that specific details are not required, exemplary embodiments may be implemented in many different forms, and neither should be construed as limiting the scope of this disclosure. In some exemplary embodiments, well-known processes, well-known device structures, and well-known techniques are not described in detail. Furthermore, advantages and improvements that can be achieved using one or more exemplary embodiments of this disclosure are provided for illustrative purposes only and do not limit the scope of this disclosure, as the exemplary embodiments disclosed herein may or may not provide all of the aforementioned advantages and improvements and still fall within the scope of this disclosure.

[0123] The specific numerical dimensions and values, specific materials and / or specific shapes disclosed herein are exemplary in nature and do not limit the scope of this disclosure. The disclosure herein of specific values ​​and specific ranges of values ​​for a given parameter does not exclude other values ​​and ranges of values ​​that may be useful in one or more examples disclosed herein. Furthermore, it is contemplated that any two specific values ​​of a particular parameter described herein can define endpoints that can be appropriate for a range of values ​​for the given parameter (the disclosure of a first and second value of a given parameter can be interpreted as disclosing that any value between the first and second values ​​can also be used for the given parameter). For example, if parameter X is exemplified herein as having a value A and also exemplified herein as having a value Z, it is contemplated that parameter X can have a range of values ​​from approximately A to approximately Z. Similarly, it is contemplated that the disclosure of two or more ranges of values ​​for a parameter (whether these ranges are nested, overlapping, or distinct) encompasses all possible combinations of the ranges of values ​​claimed using the endpoints of the disclosed ranges. For example, if the parameter X is exemplified in this document as having a value in the range of 1-10, or 2-9, or 3-8, it is also conceivable that the parameter X could have other ranges of values ​​including 1-9, 1-8, 1-3, 1-2, 2-10, 2-8, 2-3, 3-10, and 3-9.

[0124] The terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” may also be intended to include the plural forms unless the context clearly indicates otherwise. The terms “comprises,” “comprising,” “includes,” “including,” “having,” and “having” are inclusive and thus specify the presence of the stated feature, integer, step, operation, element, and / or component, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. Unless specifically identified as an order of execution, the method steps, processes, and operations described herein should not be construed as requiring them to be performed in the particular order discussed or shown. It should also be understood that additional or alternative steps may be employed.

[0125] When an element or layer is referred to as “on another element or layer,” “joined to,” “connected to,” or “attached to” another element or layer, it may be directly on, joined to, connected to, or attached to the other element or layer, or there may be intermediate elements or layers present. Conversely, when an element is referred to as “directly on another element or layer,” “directly joined to,” “directly connected to,” or “directly attached to” another element or layer, there may be no intermediate elements or layers present. Other terms used to describe relationships between elements should be interpreted in a similar manner (e.g., “between” versus “directly between,” “adjacent” versus “directly adjacent,” etc.). As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items.

[0126] When applied to values, the term “about” indicates a slight degree of inaccuracy in the calculated or measured value (some degree of near-accuracy; approximate or reasonably close to the value; almost). If, for some reason, the inaccuracy provided by “about” is not understood in the art to have that general meaning, then “about” as used herein at least indicates a variation that may arise from the common methods of measuring or using such parameters. For example, the terms “usually,” “about,” and “substantially” may be used herein to indicate within manufacturing tolerances.

[0127] Although the terms first, second, third, etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as “first,” “second,” and other numerical terms used herein do not imply sequence or order. Therefore, a first element, component, region, layer, or segment may be referred to as a second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0128] For ease of description, spatial relative terms such as “inside,” “outside,” “below,” “lower,” “lower part,” “above,” and “upper part” are used herein to describe the relationship between one element or feature and another element or feature as shown in the figures. In addition to the orientations depicted in the figures, spatial relative terms may be intended to cover different orientations of the device in use or operation. For example, if the device in the figure is flipped, an element described as “below” or “under” other elements or features will be oriented “above” other elements or features. Thus, the example term “below” can cover both above and below orientations. The device may be oriented in other ways (rotated 90 degrees or otherwise), and the spatial relative descriptors used herein shall be interpreted accordingly.

[0129] The foregoing description of embodiments has been provided for purposes of illustration and description. It is not intended to be exhaustive or limiting of this disclosure. Various elements, intended or stated uses or features of a particular embodiment are generally not limited to that particular embodiment, but are interchangeable where applicable and can be used in selected embodiments, even if not specifically shown or described. It can also be varied in many ways. Such variations should not be considered as departing from this disclosure, and all such modifications are intended to be included within the scope of this disclosure.

Claims

1. A thermal management component for a sliding application, the thermal management component for a sliding application comprising: A substrate with opposite inner and outer surfaces; as well as The interface material along the inner surface of the substrate; The substrate defines a durability layer disposed on and / or along the interface material, and the durability layer is configured to contact the first surface when the thermal management component for sliding application is along the second surface of the second component and when the first surface of the first component is slidably movable relative to the second surface.

2. The component according to claim 1, wherein: The substrate includes a metal cap having an outer sliding surface and an inner surface; The interface material is disposed on the inner surface of the metal cover; Multiple inwardly protruding recesses are arranged along the spaced spring fingers of the metal cover, the recesses being configured to be received in corresponding slots of the heat-dissipating component. and The heat transfer path extends through the metal cover, the interface material, and into the heat removal component.

3. The component according to claim 2, wherein, The first and second adhesive reinforcing strips are positioned on opposite edges of the interface material and extend along edges perpendicular to the sliding direction, wherein the interface material is confined between the first and second adhesive reinforcing strips such that during the sliding insertion of a heat source along the outer sliding surface of the metal cap, the first and second adhesive reinforcing strips absorb edge compression and inhibit the migration of the interface material.

4. The component according to claim 3, wherein: The metal cover includes stainless steel; The interface material includes a thermal phase change material; and Both the first adhesive reinforcing tape and the second adhesive reinforcing tape comprise polymer films having pressure-sensitive adhesives on opposite sides.

5. The component according to claim 3, wherein: The metal cap comprises stainless steel with a thickness of 50 micrometers to 100 micrometers; The interface material includes a thermal phase change material having a transplanar thermal conductivity from 5 W / mK to 15 W / mK; and Both the first adhesive reinforcing tape and the second adhesive reinforcing tape comprise a polymer film having a pressure-sensitive adhesive on opposite sides and have a total thickness of 75 micrometers to 150 micrometers.

6. The component according to claim 3, wherein: The metal cap comprises stainless steel with a thickness of 6 micrometers to 200 micrometers; The interface material comprises a thermal phase change material having a transplanar thermal conductivity of 0.15 W / mK to 50 W / mK; and Both the first adhesive reinforcing tape and the second adhesive reinforcing tape comprise polymer films having pressure-sensitive adhesives on opposite sides, and have a total thickness of no more than 200 micrometers.

7. The component according to claim 2, wherein: The metal cap comprises stainless steel with a thickness of 50 micrometers to 100 micrometers; and The interface material includes a thermal phase change material having a transplane thermal conductivity ranging from 5 W / mK to 15 W / mK.

8. The component according to claim 2, wherein: The metal cap comprises stainless steel with a thickness of 6 micrometers to 200 micrometers; and The interface material includes a thermal phase change material with a transplanar thermal conductivity of 0.15 W / mK to 50 W / mK.

9. The component according to claim 2, wherein, The thermal conductivity of the metal cap is at least ten times greater than that of a polyimide film of the same thickness.

10. The component according to claim 2, wherein: The spring finger is integral with the side wall of the metal cover; and The socket is a notch on the base of the radiator.

11. The component according to claim 1, wherein, The substrate includes a self-locking feature configured to mate and engage with a corresponding self-locking feature of the heat removal component, thereby holding the substrate to the heat removal component.

12. The component according to claim 1, wherein, The substrate includes protruding recesses configured to be received in corresponding slots of the heat-removing component, thereby holding the substrate to the heat-removing component.

13. The component according to claim 1, wherein, The substrate includes a plurality of sockets configured to receive protruding recesses of a heat-removing component therein, thereby holding the substrate to the heat-removing component.

14. The component of claim 1, wherein: The base includes a plurality of sockets configured to engage a metal cap having an outer sliding surface and an inner surface; The interface material is disposed on the inner surface of the metal cover; Multiple inwardly protruding recesses are arranged along the spaced spring fingers of the metal cover, the recesses being configured to be received in corresponding slots of the heat-dissipating component. and The heat transfer path extends through the metal cover, the interface material, and into the heat removal component.

15. The component according to claim 1, wherein, The thickness of the interface material decreases by 10% to 40% after ablation, relative to the thickness of the interface material before ablation.

16. The component of claim 1, wherein, The substrate includes a metal substrate, which may be stainless steel, copper, or beryllium copper.

17. The component of claim 1, wherein: The durable layer is abrasion-resistant and puncture-resistant; and The durable layer has a higher thermal conductivity than the polyimide film, and is more wear-resistant and puncture-resistant than the polyimide film.

18. The component of claim 1, wherein: The durable layer is abrasion-resistant and puncture-resistant; and The durable layer has thermal conductivity, abrasion resistance and / or puncture resistance that are substantially the same as or better than those of the polyimide film.

19. The component of claim 1, wherein, The substrate includes a metal substrate defining a metal wear-resistant layer disposed on and / or along the interface material, and the metal wear-resistant layer is configured to slide along and contact the first surface when the thermal management assembly for sliding application is along the second surface of the second component and when the first surface of the first component is slidably movable relative to the second surface.

20. The component of claim 1, wherein: The durability layer has a thickness ranging from 17.5 micrometers to 300 micrometers; and / or The interface material has a thermal conductivity in the range of 1 W / mK to 50 W / mK.

21. The component according to claim 1, wherein, The substrate includes inwardly projecting portions of spaced-apart fingers along the substrate, the inwardly projecting portions being engagedly received within an opening along a radiator or heat source.

22. The component of claim 1, wherein the thermal management component for sliding applications further comprises: A removable protective liner, the protective liner being disposed on the interface material, the protective liner having tear tabs aligned with the sliding direction; and / or The interface material is naturally adhesive and self-adheres to the inner surface of the substrate without the need for additional adhesives.

23. The component of claim 1, wherein the thermal management component for sliding applications further comprises a first adhesive portion and a second adhesive portion respectively adjacent to opposite front and rear edge portions of the interface material, wherein, The first adhesive portion and the second adhesive portion provide reinforcement along the front edge portion and the rear edge portion of the interface material, the reinforcement helping to confine the interface material within the area defined by the reinforcement, thereby inhibiting the migration of the interface material.

24. The component of claim 1, wherein, The substrate protects the interface material during repeated sliding insertion and removal cycles and maintains a thermal path through the substrate and the interface material.

25. The component according to claim 1, wherein, The substrate includes a portion of an EMI frame for optical transceiver applications, the EMI frame defining the durable layer disposed on and / or along the interface material.

26. The component of claim 1, wherein: The interface material includes at least one of the following: thermally conductive pad, thermally conductive gap filler, phase change thermal interface material, dispensable thermal interface material, thermal filler, and thermal grease; The substrate is configured to protect the interface material when the heat source slides into and out of the thermal management component for the sliding application. and The thermal management component for sliding applications is configured to improve heat transfer between a sliding heat source and a heat sink via the substrate defining the durable layer on and / or along the interface material, thereby providing a durable, non-slip interface material with improved performance.

27. The component according to any one of claims 1 to 26, wherein: The first component includes a heat source; The second component includes a heat sink; and The thermal management component for sliding applications is applied to the heat sink such that the interface material is located between the heat sink and the durability layer, and that the durability layer is located between the interface material and the heat source; and The durability layer is configured to slide relative to the heat source in contact with the heat source when the heat source is slidably moved relative to the heat sink and the thermal management components applied to the heat sink for sliding applications.

28. The component according to any one of claims 1 to 26, wherein: The first component includes a heat sink; The second component includes a heat source; and The thermal management component for sliding applications is applied to the heat source such that the interface material is located between the heat source and the durable layer, and that the durable layer is located between the interface material and the heat sink; and The durability layer is configured to slide relative to the heat sink in contact with the heat sink when the heat source and the thermal management components applied to the heat source for sliding applications are slidably moved relative to the heat sink.

29. A thermal management component for a sliding application, the thermal management component for a sliding application comprising: A metal cap having an outer sliding surface and an inner surface; An interface material is disposed on the inner surface of the metal cover; Multiple inwardly protruding recesses along the spaced-apart spring fingers of the metal cover are configured to be received in corresponding sockets of the heat-removing component. as well as A first adhesive reinforcing strip and a second adhesive reinforcing strip are positioned on opposite edges of the interface material and extend along an edge perpendicular to the sliding direction, wherein the interface material is confined between the first adhesive reinforcing strip and the second adhesive reinforcing strip, such that during the sliding insertion of a heat source along the outer sliding surface of the metal cap, the first adhesive reinforcing strip and the second adhesive reinforcing strip absorb edge compression and inhibit the migration of the interface material. The metal cap retains the interface material, making the interface material durable during repeated sliding insertion and removal cycles, and maintaining the heat transfer path through the metal cap, the interface material, and into the heat removal component.

30. An electronic device, the electronic device comprising: A radiator having a socket along the side wall of the base; According to claim 29, the thermal management assembly for sliding applications engages with the heat sink by receiving the recess into the socket along the sidewall of the base via spaced-apart spring fingers along the metal cap; and A heat source configured to establish and disengage thermal contact with the outer sliding surface of the metal cover by sliding in and out; in, The metal cap protects the interface material during repeated sliding insertion and removal cycles and maintains the thermal path from the heat source through the metal cap and the interface material into the heat sink.

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