Package structure of magnetic memory device and packaging method thereof

Abstract

This invention provides a packaging structure and method for a magnetic storage device. The packaging structure includes: a substrate; a magnetic storage device and a package body fixed above the substrate, wherein a storage chamber is formed within the package body, the magnetic storage device is located within the storage chamber and electrically connected to the substrate; and a permanent magnet connected to the package body and surrounding the periphery of the magnetic storage device. The permanent magnet is used to generate a stable magnetic field within the storage chamber and to achieve deterministic flipping of the magnetic storage device located within the storage chamber. This invention can reduce the complexity of the fabrication process for the corresponding memory.

Description

Technical Field

[0001] This invention relates to the field of magnetic memory technology, and in particular to a packaging structure and packaging method for a magnetic memory device. Background Technology

[0002] Spin-orbit-moment magnetic random access memory (SOT-MRAM) possesses advantages such as non-volatility, fast erase / write speeds, long lifespan, and low power consumption, making it a promising memory device. SOT-MRAM devices, specifically the magnetic storage devices within the SOT-moment memory family, consist of a spin-orbit-moment providing layer and a magnetic tunnel junction. Writing requires a current flowing through the spin-orbit-moment providing layer; different current directions can write different stored information. Among these, SOT-MRAM devices with perpendicular magnetic anisotropy offer the advantage of easy miniaturization and have the potential for large-capacity data storage. However, writing data requires applying an in-plane magnetic field parallel to the current flow direction.

[0003] Currently, SOT-MRAM with perpendicular magnetic anisotropy and no external magnetic field is mainly achieved by breaking the symmetry of the MTJ structure and achieving field-free flipping during the fabrication of magnetic tunnel junction (MTJ) bits through processes such as ion doping, preparation of wedge-shaped thin films, and addition of magnetic bias layers. However, due to its relatively complex process and high fabrication cost and difficulty, it is not suitable for large-scale MRAM arrays. Summary of the Invention

[0004] To address the aforementioned issues, the magnetic storage device packaging structure and packaging method provided by this invention, by setting up a substrate, a package body, and a permanent magnet, not only enables deterministic flipping of the magnetic storage device when energized, but also reduces the complexity of the corresponding memory fabrication process and manufacturing cost.

[0005] In a first aspect, the present invention provides a packaging structure for a magnetic storage device, the packaging structure comprising:

[0006] Substrate;

[0007] A magnetic storage device and a package are fixed above a substrate. A storage chamber is formed within the package. The magnetic storage device is located within the storage chamber and is electrically connected to the substrate.

[0008] A permanent magnet is connected to the package and surrounds the periphery of the magnetic storage device;

[0009] The permanent magnet is used to generate a stable magnetic field in the storage chamber and to achieve deterministic flipping of the magnetic storage devices located in the storage chamber.

[0010] Optionally, the magnetic storage device includes: a bottom electrode layer, a spin orbital layer, a free layer, a barrier layer, a reference layer, and a top electrode layer stacked sequentially from bottom to top;

[0011] The bottom electrode layer is used to provide the spin orbital layer with a current flowing through the spin orbital layer in a first direction, and the permanent magnet is used to apply an external magnetic field with the magnetic field direction in the first direction to the magnetic storage device located in the storage chamber, so as to achieve deterministic flipping of the magnetic storage device.

[0012] Optionally, the permanent magnet includes multiple permanent magnet blocks;

[0013] When there are no fewer than four permanent magnet blocks, the included angles of the magnetization directions of adjacent permanent magnet blocks are the same, and the magnetization directions of the two permanent magnet blocks that are furthest apart in the first direction are both in the first direction.

[0014] Optionally, the permanent magnet includes 2 n There are n permanent magnet blocks, where n is a positive integer;

[0015] 2 n Permanent magnets are evenly spaced around the periphery of the magnetic storage device.

[0016] Optionally, a contact pad is fixedly disposed on the upper surface of the substrate, conductive traces are disposed inside the substrate, and conductive pins are fixedly disposed on the lower surface of the substrate.

[0017] The contact pad is electrically connected to the conductive pin via conductive traces, and the magnetic storage device is electrically connected to the contact pad.

[0018] Optionally, a positioning groove is formed on the upper surface of the substrate, and the bottom end of the permanent magnet is adapted to the positioning groove and connected to the substrate through the positioning groove.

[0019] Optionally, a chip island is fixedly disposed on the upper surface of the substrate, and a magnetic storage device is fixedly disposed on the chip island.

[0020] Alternatively, the magnetic storage device is fixedly connected to the substrate by an adhesive and electrically connected to the substrate by metal leads.

[0021] Secondly, the present invention provides a method for packaging a magnetic storage device, the method comprising:

[0022] A substrate and a package are provided, with a storage chamber formed within the package;

[0023] The magnetic storage device is fixed on the substrate and electrically connected to the substrate;

[0024] The package is fixedly connected to the substrate, and the magnetic storage device is covered in the storage chamber;

[0025] The package also includes a permanent magnet that surrounds the magnetic storage device. The permanent magnet is used to generate a stable magnetic field in the storage chamber and to achieve deterministic flipping of the magnetic storage device located in the storage chamber.

[0026] Optionally, before fixing the magnetic storage device onto the substrate and electrically connecting it to the substrate, the method further includes:

[0027] Contact pads and conductive pins are formed on opposite surfaces of the substrate, and the contact pads are electrically connected to the conductive pins through conductive traces inside the substrate.

[0028] The steps of fixing the magnetic storage device onto the substrate and electrically connecting it to the substrate include:

[0029] The magnetic storage device is fixedly disposed on the side of the substrate where the contact pad is formed, and the magnetic storage device is electrically connected to the contact pad.

[0030] Optionally, prior to the step of fixing the magnetic storage device onto the substrate and electrically connecting it to the substrate, the method further includes:

[0031] Chip base islands are fixedly disposed on the surface of the substrate;

[0032] The steps of fixing the magnetic storage device onto the substrate and electrically connecting it to the substrate include:

[0033] The magnetic storage device is fixed on the base island and electrically connected to the substrate via metal leads.

[0034] Optionally, before fixing the package to the substrate, the method further includes:

[0035] The permanent magnet is fixed on the substrate;

[0036] After the step of fixing the magnetic storage device onto the substrate and electrically connecting it to the substrate, the method further includes:

[0037] An insulating covering layer is formed inside the permanent magnet, which covers the magnetic storage device. Both the permanent magnet and the magnetic storage device are located in the storage chamber.

[0038] The packaging structure and packaging method of the magnetic storage device provided in this invention, by setting a substrate, a package body and a permanent magnet surrounding the magnetic storage device, not only enables deterministic flipping of the magnetic storage device when energized, so that the memory with the package structure can be accurately read and written, but also eliminates the need to use a high-precision etching process to etch the structure that enables deterministic flipping of the magnetic storage device during the formation of the magnetic storage device, thereby reducing the complexity of the corresponding storage device fabrication process and manufacturing cost. Attached Figure Description

[0039] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0040] Figure 1 This is a schematic cross-sectional view of the packaging structure according to an embodiment of this application;

[0041] Figure 2 This is a schematic top view of a permanent magnet containing three permanent magnet blocks according to an embodiment of this application;

[0042] Figure 3 This is a schematic top view of a permanent magnet containing two permanent magnet blocks according to an embodiment of this application;

[0043] Figure 4 This is a schematic top view of a permanent magnet comprising eight permanent magnet blocks according to an embodiment of this application;

[0044] Figures 5 to 7 These are schematic top views of a permanent magnet comprising sixteen permanent magnet blocks according to an embodiment of this application;

[0045] Figure 8 This is a schematic perspective view of a permanent magnet comprising sixteen permanent magnet blocks according to an embodiment of this application;

[0046] Figure 9 This is a schematic diagram of the magnetic field strength at the center of a permanent magnet containing two permanent magnet blocks, according to an embodiment of this application.

[0047] Figure 10 This is a schematic partial top view of a magnetic storage device according to an embodiment of this application;

[0048] Figure 11 This is a schematic partial side view of a magnetic storage device according to an embodiment of this application;

[0049] Figure 12 This is a schematic partial cross-sectional view of the packaging structure according to an embodiment of this application;

[0050] Figure 13 This is a schematic partial cross-sectional view of the packaging structure according to an embodiment of this application;

[0051] Figure 14 This is a schematic cross-sectional view of a substrate according to an embodiment of this application;

[0052] Figure 15 This is a schematic cross-sectional view of a package according to an embodiment of this application;

[0053] Figure 16 This is a schematic cross-sectional view of the package and permanent magnet in an assembled state according to an embodiment of this application;

[0054] Figure 17 This is a schematic cross-sectional view of a chip and substrate in a connected state according to an embodiment of this application;

[0055] Figure 18 This is a schematic cross-sectional view of a chip base island and a substrate in a connected state according to an embodiment of this application;

[0056] Figure 19 This is a schematic cross-sectional view of a chip, chip island, and substrate in a connected state according to an embodiment of this application.

[0057] Figure 20 This is a schematic cross-sectional view of a package according to an embodiment of this application;

[0058] Figure 21 This is a schematic cross-sectional view of a substrate according to an embodiment of this application;

[0059] Figure 22 This is a schematic cross-sectional view of a chip and substrate in a connected state according to an embodiment of this application;

[0060] Figure 23 This is a schematic cross-sectional view of a chip, permanent magnet and substrate in a connected state according to an embodiment of this application.

[0061] in, Figures 2 to 7 The solid arrows in the permanent magnet blocks are used to indicate the magnetization direction of the corresponding permanent magnet blocks. Figures 2 to 7 The dashed arrows in the diagram are used to indicate the direction of the magnetic field at the inner center position of the corresponding permanent magnet.

[0062] Figure label:

[0063] 1. Substrate; 11. Conductive pin; 12. Positioning groove; 2. Chip; 21. Magnetic storage device; 211. Bottom electrode layer; 212. Spin-orbit layer; 213. Free layer; 214. Barrier layer; 215. Reference layer; 216. Top electrode layer; 3. Package; 31. Storage chamber; 32. Mounting chamber; 4. Permanent magnet; 41. Permanent magnet block; 5. Chip base island; 61. Metal lead; 62. Insulating cover layer. Detailed Implementation

[0064] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0065] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of this application.

[0066] Spatial relation terms such as "below," "under," "below," "below," "above," and "above" are used here to describe the relationship between one element or feature shown in the figure and other elements or features. Similarly, phrases such as "directly above the packaging structure and packaging method of the magnetic storage device" can be used here to describe that one element or feature shown in the figure coincides in the vertical direction, which may be partial or complete, depending on the actual situation or the content of the illustration. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, an element or feature described as "below" or "below" other elements or features will be oriented "above" other elements or features. Therefore, the exemplary terms "below" and "below" can include both upper and lower orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0067] It should be noted that when an element is referred to as "fixedly connected" to another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intervening element. Conversely, when an element is referred to as being "directly on" another element, there is no intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0068] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising,” “including,” or “having,” etc., specify the presence of the stated feature, whole, step, operation, component, part, or combination thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof.

[0069] In a first aspect, an embodiment of the present invention provides a packaging structure for a magnetic storage device 21, the packaging structure of which includes:

[0070] Substrate 1;

[0071] A magnetic storage device 21 and a package 3 are fixed above the substrate 1. A storage chamber 31 is formed inside the package 3. The magnetic storage device 21 is located in the storage chamber 31 and is electrically connected to the substrate 1.

[0072] The permanent magnet 4 is connected to the package 3 and surrounds the periphery of the magnetic storage device 21.

[0073] The permanent magnet 4 is used to generate a stable magnetic field in the storage chamber 31 and to achieve deterministic flipping of the magnetic storage device 21 located in the storage chamber 31.

[0074] Furthermore, there are multiple magnetic storage devices 21 located within the same chip 2. The upper surface of the substrate 1 and the package 3 enclose a closed space containing the magnetic storage devices 21. That is, the space formed by the storage chamber 31 can be the entire closed space or only a part of it, depending on the shape of the upper surface of the substrate 1. In this embodiment, the upper surface of the substrate 1 is planar, meaning the space formed by the storage chamber 31 is the entire closed space. The chip 2 is a SOT-MRAM chip 2 with perpendicular magnetic anisotropy. It is understood that in this embodiment, the storage chamber 31 contains an SOT-MRAM chip 2 containing multiple magnetic storage devices 21.

[0075] Furthermore, the package 3 can be fixedly connected to the substrate 1 by adhesive, bolts, or a clamping mechanism to achieve fixation between the package 3 and the substrate 1. Simultaneously, the magnetic storage device 21 can be embedded in the storage chamber 31, or it can be first fixedly connected to the substrate 1 and then stored in the storage chamber 31. Additionally, the permanent magnet 4 can be located in the same chamber as the magnetic storage device 21, or it can be located in different chambers.

[0076] In this embodiment, the package 3 and the magnetic storage device 21 are fixedly connected to the substrate 1 by an adhesive. The magnetic storage device 21 is electrically connected to the substrate 1 by a metal lead 61 using bonding technology. The permanent magnet 4 is arrayed on the periphery of the storage chamber 31. The width of the storage chamber 31 is greater than the width of the SOT-MRAM chip 2, and the depth of the storage chamber 31 is greater than the thickness of the SOT-MRAM chip 2.

[0077] Specifically, the package 3 has an installation chamber 32 formed on the periphery of the storage chamber 31, and the installation chamber 32 is adapted to the permanent magnet 4. The permanent magnet 4 is located inside the installation chamber 32.

[0078] The permanent magnet 4 is made of at least one of ferrite and neodymium iron boron; the metal lead 61 is made of at least one of gold, copper, and aluminum; the adhesive is made of at least one of epoxy resin, polypropylene, and silicone; and the encapsulation body 3 is made of at least one of ceramic, halogen-free epoxy resin, PETG, POE, TPU, and other plastic raw materials. This embodiment does not specifically limit the materials used in this regard. The encapsulation body 3 can be manufactured using injection molding, welding, firing, or splicing processes. In this embodiment, the encapsulation body 3 is formed using injection molding.

[0079] For example, the encapsulation material can be filled into a molding die having the shape of the encapsulation body 3, and then cured in UV (ultroviolet) or an ambient atmosphere or heated to eventually form a solid, thus obtaining the encapsulation body 3 described above.

[0080] The permanent magnet 4 is composed of multiple permanent magnet blocks 41. The number of permanent magnet blocks 41 can be odd or even. The size of the permanent magnet blocks 41 in the same permanent magnet 4 can be the same or different. As long as the permanent magnet 4 is composed of multiple permanent magnet blocks 41, the magnetic field strength generated inside the permanent magnet is sufficient to make the corresponding magnetic storage device 21 achieve deterministic flipping.

[0081] Combination Figure 2 If a permanent magnet 4 contains three permanent magnet blocks 41, and the three permanent magnet blocks 41 are arc-shaped with the same size, and the magnetic fields provided by the three permanent magnet blocks 41 are the same, then two of the permanent magnet blocks 41 are symmetrical with respect to the x-axis, the third permanent magnet block 41 is symmetrical with respect to the x-axis and its magnetization direction is towards the x-axis, the magnetization directions of the two symmetrical permanent magnet blocks 41 are symmetrical with respect to the x-axis and are tilted straight towards the third permanent magnet block 41, and the angle between them and the x-axis is 60 degrees.

[0082] In a further optional embodiment of this embodiment, combined with Figures 3 to 8 The permanent magnet 4 includes 2 n There are 41 permanent magnet blocks of the same size, where n is a positive integer (including a positive integer number of permanent magnet blocks). The shape of the permanent magnet blocks 41 can be trapezoidal, square, arc-shaped, or circular, etc. n Permanent magnet blocks 41 are evenly spaced around the periphery of the magnetic storage device 21. When the spacing between adjacent permanent magnet blocks 41 is zero, 2 n The permanent magnet blocks 41 form a closed ring, and a magnetic field with uniform magnetic field strength and a fixed direction can be generated at the center of the ring.

[0083] Combination Figure 3For example, if there are two permanent magnet blocks 41, and the two permanent magnet blocks 41 are semi-circular arcs of the same size, when the two permanent magnet blocks 41 are assembled into a permanent magnet 4, the magnetization direction of each permanent magnet block 41 is towards the x-axis direction, and the magnetic field direction of the inner space of the permanent magnet 4 is also towards the x-axis direction.

[0084] Combination Figures 4 to 8 When the number of permanent magnet blocks 41 is not less than four, the included angles of the magnetization directions of adjacent permanent magnet blocks 41 are the same, and the magnetization directions of the two permanent magnet blocks 41 that are farthest apart in the first direction are both in the first direction. The first direction is the x-axis direction mentioned above. In this embodiment, the first direction is from left to right. Figures 3 to 7 as well as Figure 10 The y-axis direction is the same as the second direction, both being from front to back.

[0085] Combination Figure 4 For example, when there are eight permanent magnet blocks 41, the angle between the magnetization directions of adjacent permanent magnet blocks 41 is 90 degrees. Combined with... Figures 5 to 7 When there are sixteen permanent magnet blocks 41, the angle between the magnetization directions of adjacent permanent magnet blocks 41 is 45 degrees.

[0086] It is understandable that the stable magnetic field generated by the permanent magnet 4 within the storage chamber 31 is a uniform and stable magnetic field formed by the permanent magnet 4 in the inner space it surrounds. This magnetic field is of uniform intensity. Specifically, taking a closed ring structure composed of 16 permanent magnet blocks 41 as an example, the strength of its magnetic field diffuses uniformly outward from the center of the storage chamber 31 in an elliptical pattern, gradually increasing in intensity. Therefore, a uniform magnetic field exists within the elliptical region of the storage chamber 31. Figure 9 .in, Figure 9 The black dot at the center of the colored rectangle represents the geometric center of permanent magnet 4. The magnetic field generated inside the designed permanent magnet structure is simulated using finite element simulation software. Figure 9 The permanent magnet has an outer diameter of 11mm and an inner diameter of 10mm, and is composed of 16 permanent magnet blocks arranged in a specific order. Figure 9 The arrangement of the permanent magnets is configured such that the permanent magnet block material is neodymium iron boron, and the magnetic field strength of the 3*3mm rectangular area at the center of the permanent magnet structure is 260~340Oe. The magnetic field direction is all towards the x-axis direction, so that the magnetic field meets the magnetic field requirements of the corresponding magnetic storage device, so as to enable the memory with this package structure to perform accurate reading and writing.

[0087] Generally, magnetic storage devices can achieve deterministic flipping in a magnetic field of around 250 Oe. The specific values ​​may vary slightly depending on the materials used and the manufacturing process of the magnetic storage device. This embodiment will not elaborate on this further.

[0088] Combination Figure 10 and Figure 11 The magnetic storage device 21 includes a magnetic tunnel junction (MTJ). Specifically, the magnetic storage device 21 includes, from bottom to top, a bottom electrode layer 211, a spin orbital layer 212, a free layer 213, a barrier layer 214, a reference layer 215, and a top electrode layer 216. Figure 11 The third direction in the text is from bottom to top.

[0089] The bottom electrode layer 211 is used to provide the spin orbital layer 212 with a current flowing through the spin orbital layer 212 in the first direction. The permanent magnet 4 is used to apply an external magnetic field with the magnetic field direction in the first direction to the magnetic storage device 21 located in the storage chamber 31, so as to realize the deterministic flipping of the magnetic storage device 21, thereby enabling the memory with the package structure to be accurately read and written.

[0090] It should be noted that at least one of the bottom electrode and the top electrode in the bottom electrode layer 211 is electrically connected to the substrate 1. When only the top electrode layer 216 is electrically connected to the substrate 1, the bottom electrode can be electrically connected to an external power source through the metal lead 61 passing through the package 3; when only the bottom electrode is electrically connected to the substrate 1, the top electrode layer 216 can be electrically connected to an external power source through the metal lead 61 passing through the package 3. This embodiment does not specifically limit this.

[0091] Furthermore, substrate 1 can be a metal substrate 1, such as a multilayer metal substrate 1 made of alloy, copper, silver, etc., or a non-metal substrate 1, such as ABF (Ajinomoto Build-up Film), MIS (Molded Interconnect Substrate), or a multilayer printed circuit board (PCB). When substrate 1 is a metal substrate 1, wires can be directly bonded inside the metal substrate 1 to electrically interconnect the magnetic storage device 21 with the external circuit structure.

[0092] In a further optional embodiment of this embodiment, combined with Figure 1 A contact pad (not shown in the figure) is fixedly disposed on the upper surface of substrate 1, and a conductive trace (not shown in the figure) is disposed inside substrate 1. A conductive pin 11 is fixedly disposed on the lower surface of substrate 1. The contact pad is electrically connected to the conductive pin 11 through the conductive trace, and the magnetic storage device 21 is electrically connected to the contact pad.

[0093] In this embodiment, the conductive pin 11 is a solder ball, and the electrodes of the magnetic storage device 21 are electrically interconnected with the external circuit structure through the contact substrate 1, the conductive trace, and the conductive pin 11.

[0094] The packaging structure and packaging method of the magnetic storage device 21 provided in this embodiment, by setting a substrate 1, a package body 3 and a permanent magnet 4 surrounding the magnetic storage device 21, not only can the magnetic storage device 21 achieve deterministic flipping when powered on, but also eliminates the need to etch a structure that enables deterministic flipping of the magnetic storage device 21 through a high-precision etching process during the formation of the magnetic storage device 21, thereby reducing the complexity of the corresponding storage device fabrication process and manufacturing cost.

[0095] Secondly, one embodiment of the present invention provides a packaging structure for a magnetic storage device 21. The packaging structure of the magnetic storage device 21 differs from the packaging structure in Embodiment 1 in that: [The following text appears to be incomplete and requires further context: "combining..."] Figure 12 A chip island 5 is fixedly disposed on the upper surface of the substrate 1, and a magnetic storage device 21 is fixedly disposed on the chip island 5.

[0096] The chip island 5 is fixedly mounted on the upper surface of the substrate 1 by brazing or adhesive, and the material of the chip island 5 includes, but is not limited to, at least one of silicon, silicon carbide and ceramic.

[0097] In this embodiment, both the chip base island 5 and the contact pad are located within the enclosed space formed by the storage chamber 31, and the geometric center of the chip base island 5 coincides with the geometric center of the substrate 1 and the geometric center of the package 3. By setting the chip base island 5, not only can the chip 2 be isolated from high voltage and heat, but the chip 2 can also be protected from damage caused by deformation of the substrate 1.

[0098] Thirdly, one embodiment of the present invention provides a packaging structure for a magnetic storage device 21, wherein the packaging structure for the magnetic storage device 21 differs from the packaging structure in Embodiment 1 or 2 in that: [The following text appears to be incomplete and requires further context: "combining..."] Figure 13 The upper surface of the substrate 1 is provided with a positioning groove 12, and the bottom end of the permanent magnet 4 is adapted to the positioning groove 12 and connected to the substrate 1 through the positioning groove 12.

[0099] The top of the permanent magnet 4 can be located inside the storage chamber 31 or on the inner side of the storage chamber 31.

[0100] In this embodiment, the packaging structure is based on the packaging structure in the first aspect, and a positioning groove 12 is formed on the substrate 1. The top of the permanent magnet 4 is located in the storage chamber 31, the depth of the positioning groove 12 is half the thickness of the permanent magnet 4, and the depth of the mounting chamber 31 is not less than half the thickness of the permanent magnet 4, but is not limited thereto. The bottom end of the permanent magnet 4 is inserted into the positioning groove 12 and fixedly connected to the substrate 1 by adhesive, and the top end of the permanent magnet 4 is inserted.

[0101] By setting the positioning groove 12, not only can the stability of the permanent magnet 4 be ensured, but also the SOT-MRAM chip 2 can be located at the center of the permanent magnet 4, so that the SOT-MRAM chip 2 can be in a magnetic field with the magnetic field direction as the first direction and the intensity is uniform.

[0102] In a further optional embodiment of this invention, an insulating cover layer 62 is formed on the inner side of the permanent magnet 4, covering the magnetic storage device 21. The material of the insulating cover layer 62 can be an insulating material such as epoxy resin, and this embodiment does not specifically limit it. By providing the insulating cover layer 62, the internal SOT-MRAM chip 2 is protected from physical damage and chemical corrosion, while improving the reliability of the chip 2.

[0103] Fourthly, an embodiment of the present invention provides a packaging method for a magnetic storage device 21 as provided in the first, second or third aspects, the method comprising steps S101 to S103.

[0104] Step S101: Provide a substrate 1 and a package 3, wherein a storage chamber 31 is formed within the package 3, and combine... Figure 14 , Figure 15 , Figure 20 and Figure 21 .

[0105] Step S102: Fix the magnetic storage device 21 onto the substrate 1 and electrically connect it to the substrate 1, combining... Figure 17 , Figure 19 and Figure 22 .

[0106] Step S103: Fix the package 3 to the substrate 1, and cover the magnetic storage device 21 inside the storage chamber 31, combining... Figure 1 , Figure 12 and Figure 13 .

[0107] Among them, combined Figure 1 , Figure 12 , Figure 13 and Figure 16 The package 3 is also provided with a permanent magnet 4, which surrounds the periphery of the magnetic storage device 21. The permanent magnet 4 is used to generate a stable magnetic field in the storage chamber 31 and to achieve deterministic flipping of the magnetic storage device 21 located in the storage chamber 31.

[0108] In a further optional embodiment of this embodiment, before fixing the magnetic storage device 21 on the substrate 1 and electrically connecting it to the substrate 1, the method further includes: forming contact pads and conductive pins 11 on opposite surfaces of the substrate 1, wherein the contact pads are electrically connected to the conductive pins 11 through conductive traces inside the substrate 1.

[0109] Furthermore, the step of fixing the magnetic storage device 21 on the substrate 1 and electrically connecting it to the substrate 1 includes: fixing the magnetic storage device 21 on the side of the substrate 1 where a contact pad is formed, and electrically connecting the magnetic storage device 21 to the contact pad.

[0110] Fifthly, an embodiment of the present invention provides a packaging method for a magnetic storage device 21 as provided in the second aspect, the method comprising steps S201 to S205.

[0111] Step S201: Provide a substrate 1 and a package 3, wherein a storage chamber 31 is formed within the package 3, and combine... Figure 14 and Figure 15 .

[0112] Step S202: Fix the permanent magnet 4 inside the package 3, and combine Figure 16 .

[0113] Step S203: A chip base island 5 is fixedly disposed on the upper surface of the substrate 1, and a contact pad electrically connected to the conductive pins 11 on the lower surface of the substrate 1 is formed, combined with... Figure 18 .

[0114] Step S204: Fix the magnetic storage device 21 onto the base island and electrically connect it to the contact pad via the metal lead 61, thus combining... Figure 19 .

[0115] Step S205: Fix the package 3 to the substrate 1, and cover the magnetic storage device 21 inside the storage chamber 31, combining... Figure 12 .

[0116] In a sixth aspect, an embodiment of the present invention provides a packaging method for a magnetic storage device 21 as provided in the third aspect, the method comprising steps S301 to S307.

[0117] Step S301: Provide a substrate 1 and a package 3, wherein a storage chamber 31 is formed within the package 3, and combine... Figure 14 and Figure 20 .

[0118] Step S302: Etch positioning grooves 12 on the upper surface of substrate 1, and combine... Figure 21 .

[0119] The positioning groove 12 is a continuous or discontinuous annular groove structure.

[0120] Step S303: Form a contact pad on the upper surface of substrate 1 that is electrically connected to the conductive pin 11 on the lower surface of substrate 1.

[0121] Step S304: Fix the magnetic storage device 21 onto the upper surface of the substrate 1 and electrically connect it to the contact pad via metal leads 61, thus combining... Figure 22 .

[0122] Step S305: Fix the bottom end of the permanent magnet 4 into the positioning groove 12 with adhesive.

[0123] Step S306: An insulating covering layer 62 is formed inside the permanent magnet 4, and then... Figure 23 .

[0124] Step S307: Fix the package 3 to the substrate 1 to cover the magnetic storage device 21 and the permanent magnet 4 inside the storage chamber 31, and combine... Figure 13 .

[0125] In a seventh aspect, an embodiment of the present invention provides a packaging method for a magnetic storage device 21, the method comprising steps S401 to S407.

[0126] Step S401: Provide a substrate and a package, wherein a storage chamber is formed within the package.

[0127] Step S402: Etch a positioning groove on the upper surface of the substrate.

[0128] The positioning groove can be a continuous or discontinuous annular groove structure.

[0129] Step S403: A contact pad and a contact liner are formed on the upper surface of the substrate and inside the annular groove structure, which are electrically connected to the conductive pins on the lower surface of the substrate.

[0130] Step S404: Fix the magnetic storage device on the contact pad and electrically connect it to the contact pad via a metal lead.

[0131] Step S405: Fix the bottom end of the permanent magnet into the positioning groove with adhesive.

[0132] Step S406: Form an insulating covering layer inside the permanent magnet.

[0133] Step S407: Secure the package to the substrate and cover the magnetic storage device in the storage chamber.

[0134] In the description of this specification, the references to terms such as "some embodiments," "other embodiments," "ideal embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example that are included in at least one embodiment or example of this application. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0135] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0136] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A packaging structure for a magnetic storage device, characterized in that, The packaging structure of the magnetic storage device includes: Substrate; A magnetic storage device and a package fixed above the substrate, wherein a storage chamber is formed within the package, and the magnetic storage device is located within the storage chamber and electrically connected to the substrate. A permanent magnet, which is connected to the package and surrounds the periphery of the magnetic storage device; The permanent magnet is used to generate a stable magnetic field in the storage chamber and to achieve deterministic flipping of the magnetic storage device located in the storage chamber.

2. The packaging structure according to claim 1, characterized in that, The magnetic storage device comprises, from bottom to top, a bottom electrode layer, a spin orbital layer, a free layer, a barrier layer, a reference layer, and a top electrode layer. The bottom electrode layer is used to provide the spin orbital layer with a current flowing through the spin orbital layer in a first direction, and the permanent magnet is used to apply an external magnetic field with the magnetic field direction in the first direction to the magnetic storage device located in the storage chamber, so as to achieve deterministic flipping of the magnetic storage device.

3. The packaging structure according to claim 2, characterized in that, The permanent magnet comprises multiple permanent magnet blocks; When the number of permanent magnet blocks is not less than four, the included angle of the magnetization direction of adjacent permanent magnet blocks is the same, and the magnetization direction of the two permanent magnet blocks that are farthest apart in the first direction is the first direction.

4. The packaging structure according to claim 3, characterized in that, The permanent magnet includes 2 n There are n permanent magnet blocks, where n is a positive integer; 2 n The permanent magnet blocks are evenly spaced around the periphery of the magnetic storage device.

5. The packaging structure according to claim 1, characterized in that, A contact pad is fixedly disposed on the upper surface of the substrate, a conductive trace is disposed inside the substrate, and a conductive pin is fixedly disposed on the lower surface of the substrate. The contact pad is electrically connected to the conductive pin via the conductive trace, and the magnetic storage device is electrically connected to the contact pad.

6. The packaging structure according to claim 1, characterized in that, The upper surface of the substrate is provided with a positioning groove, and the bottom end of the permanent magnet is adapted to the positioning groove and connected to the substrate through the positioning groove.

7. The packaging structure according to claim 1, characterized in that, A chip island is fixedly disposed on the upper surface of the substrate, and the magnetic storage device is fixedly disposed on the chip island.

8. The packaging structure according to any one of claims 1 to 7, characterized in that, The magnetic storage device is fixedly connected to the substrate by an adhesive and electrically connected to the substrate by metal leads.

9. A method for packaging a magnetic storage device, characterized in that, The method includes: A substrate and a package are provided, wherein a storage chamber is formed within the package; The magnetic storage device is fixed on the substrate and electrically connected to the substrate; The package is fixedly connected to the substrate, and the magnetic storage device is covered in the storage cavity; The package body is further provided with a permanent magnet, which surrounds the periphery of the magnetic storage device. The permanent magnet is used to generate a stable magnetic field in the storage chamber and to achieve deterministic flipping of the magnetic storage device located in the storage chamber.

10. The method according to claim 9, characterized in that, Prior to fixing the magnetic storage device onto the substrate and electrically connecting it to the substrate, the method further includes: Contact pads and conductive pins are formed on opposite surfaces of the substrate, and the contact pads are electrically connected to the conductive pins through conductive traces inside the substrate. The step of fixing the magnetic storage device onto the substrate and electrically connecting it to the substrate includes: The magnetic storage device is fixedly disposed on the side of the substrate where a contact pad is formed, and the magnetic storage device is electrically connected to the contact pad.

11. The method according to claim 9, characterized in that, Prior to the step of fixing the magnetic storage device onto the substrate and electrically connecting it to the substrate, the method further includes: Chip base islands are fixedly disposed on the surface of the substrate; The step of fixing the magnetic storage device onto the substrate and electrically connecting it to the substrate includes: The magnetic storage device is fixed on the base island and electrically connected to the substrate via metal leads.

12. The method according to any one of claims 9 to 11, characterized in that, Before fixing the package to the substrate, the method further includes: The permanent magnet is fixed on the substrate; After the step of fixing the magnetic storage device onto the substrate and electrically connecting it to the substrate, the method further includes: An insulating covering layer is formed inside the permanent magnet, which covers the magnetic storage device. Both the permanent magnet and the magnetic storage device are located within the storage chamber.

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