Wafer pick anti-microphonic film stabilization system

Abstract

This invention discloses a wafer pickup anti-micro-vibration crystalline film stabilization system, belonging to the field of semiconductor device technology. It includes a wafer, a push pin assembly, a driven shaft, a drive assembly, a push pin holder, and a crystalline film support. The drive assembly is mounted on the side of the push pin holder, and the driven shaft is rotatably connected above the push pin holder, meshing with the top output end of the drive assembly. The push pin assembly is mounted on top of the push pin holder, and the crystalline film support is mounted on top of the driven shaft. A wafer is placed above the push pin assembly and the crystalline film support, and a crystalline film is disposed between the wafer, the crystalline film support, and the push pin assembly. This invention solves the problem of wafer jitter and displacement during pickup caused by the lack of a support structure in the prior art, thus improving the stability and efficiency of the wafer pickup process.

Description

Technical Field

[0001] This invention relates to the field of semiconductor device technology, and more specifically to a wafer pickup anti-micro-vibration film stabilization system. Background Technology

[0002] In semiconductor packaging processes, die bonding is one of the key steps. Its function is to pick up the individual wafers that have been divided on the wafer and mount them onto the lead frame or substrate.

[0003] During this process, the airflow disturbance caused by the rotation or movement of the wafer pick-up device, along with various vibrations generated by the entire mechanical system, will cause slight vibrations in the wafer-bearing film, resulting in wafer position shift and vertical shaking, which will greatly affect the accuracy and speed of die bonding.

[0004] Therefore, how to provide a micro-vibration-resistant crystalline film stabilization system for wafer pickup, and solve the problem of the lack of anti-vibration devices in the existing technology during wafer pickup, is a technical problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] To address this issue, the present invention provides a wafer pickup anti-micro-vibration crystalline film stabilization system to solve the problem in the prior art where wafers are prone to shaking and shifting during pickup due to the lack of a support structure.

[0006] To achieve the above objectives, the present invention provides the following technical solution: This invention discloses a wafer pickup anti-micro-vibration crystalline film stabilization system, comprising: Ejector socket, with a drive assembly mounted on the side; The driven shaft is rotatably connected above the ejector pin seat, and the driven shaft engages with the top output end of the drive assembly; The ejector pin assembly is mounted on top of the ejector pin seat; A crystal film support is installed on the top of the driven shaft. A wafer is placed above the ejector pin assembly and the crystal film support. A crystal film is disposed between the wafer, the crystal film support, and the ejector pin assembly.

[0007] In one possible implementation, the ejector pin seat includes: The mounting bracket has a vacuum seat mounted on top, the drive assembly is mounted on the right side of the mounting bracket, and the ejector pin assembly is mounted above the vacuum seat; A sensor mount is installed on the left side of the mounting bracket, and a sensor is mounted on top of the sensor mount. The bearings are arranged in pairs and installed on the outside of the vacuum seat, and the driven shaft is installed on the outside of the bearings.

[0008] In one possible implementation, the driving component includes: The motor has a connecting sleeve installed at the top output end; A drive shaft is mounted on the top of the connecting sleeve, and the drive shaft meshes with the driven shaft.

[0009] In one possible implementation, a light-blocking plate is mounted at the bottom of the driven shaft, and the light-blocking plate sweeps across the sensor.

[0010] In one possible implementation, the crystal film support is composed of a fan-shaped plate and an arc-shaped plate, the fan-shaped plate being mounted above the driven shaft, the arc-shaped plate being mounted above the fan-shaped plate, and the arc-shaped plate abutting against the bottom of the crystal film.

[0011] In one possible implementation, the ejector pin assembly includes: The ejector pin cap is attached to the top of the vacuum seat; Several air holes are formed on the top of the pin cap.

[0012] In one possible implementation, the crystal film support is composed of two or three L-shaped rods, one end of which is mounted on the top of the driven shaft, and the other end of which abuts against the bottom of the crystal film.

[0013] In one possible implementation, the top of the film support is flush with the ejector assembly, or the top of the film support is higher than the ejector assembly.

[0014] In one possible implementation, a supporting iron ring is provided on the outer side of the wafer.

[0015] In one possible implementation, the outer ring of the crystal film is mounted on the supporting iron ring, and the supporting iron ring is mounted on the translation mechanism; The translation mechanism includes: The connecting plate has a first drive structure mounted on its side; A displacement frame is disposed above the connecting plate. The side of the displacement frame is connected to the first driving structure. A second driving structure is installed on the side of the displacement frame. The first driving structure and the second driving structure are arranged perpendicularly. The sliders are arranged in pairs and slidably connected above the displacement frame. One of the sliders is connected to the second driving structure. A placement plate is installed above the two sliders. A circular hole is opened in the placement plate, and the crystal film is disposed in the circular hole. An upper pressure plate is installed above the shelf, and the outer ring of the supporting iron ring is installed between the upper pressure plate and the shelf.

[0016] This invention uses a wafer support component and a ejector pin assembly to jointly support the wafer, preventing wafer jitter caused by airflow disturbance and mechanical vibration. This significantly improves the accuracy of wafer ejection or pick-up. By using the cooperation of the drive component and the driven shaft to drive the wafer support component to rotate and change its position, when picking up wafers in non-central positions, the entire wafer is placed between the wafer support component and the ejector pin assembly, which can provide good support for the wafer and significantly improve the wafer bonding speed and accuracy. Attached Figure Description

[0017] To more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are merely exemplary, and those skilled in the art can derive other embodiments based on the provided drawings without creative effort.

[0018] The structures, proportions, sizes, etc. illustrated in this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed herein, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0019] Figure 1 A perspective view of the wafer pickup anti-micro-vibration crystalline film stabilization system provided by the present invention; Figure 2 A perspective view of the ejector pin seat provided by the present invention; Figure 3 A perspective view of the driving component provided by the present invention; Figure 4 A perspective view of the driven shaft provided by the present invention; Figure 5 A perspective view of the crystal film support provided by the present invention; Figure 6 A perspective view of the ejector pin assembly provided by the present invention; Figure 7 A perspective view of the translation mechanism provided by the present invention; Figure 8 A perspective view of the L-shaped rod provided for this invention; In the figure: 1. Wafer; 2. Ejector pin assembly; 21. Air hole; 22. Ejector pin cap; 3. Driven shaft; 31. Light blocking plate; 4. Drive assembly; 41. Drive shaft; 42. Connecting sleeve; 43. Motor; 5. Ejector pin seat; 51. Bearing; 52. Vacuum seat; 53. Mounting bracket; 54. Sensor seat; 55. Sensor; 6. Crystal film support; 7. Supporting iron ring; 81. Upper pressure plate; 82. Placement plate; 83. Slider; 84. Second drive structure; 85. Connecting plate; 86. First drive structure; 87. Displacement frame. Detailed Implementation

[0020] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] Please refer to Figures 1-8 The present invention will now describe a wafer pickup anti-micro-vibration crystalline film stabilization system, as disclosed in this invention. Figure 1 The device includes a wafer 1, a ejector assembly 2, a driven shaft 3, a drive assembly 4, an ejector seat 5, and a crystal film support 6. The drive assembly 4 is mounted on the side of the ejector seat 5. The driven shaft 3 is rotatably connected above the ejector seat 5 and engages with the top output end of the drive assembly 4. The ejector assembly 2 is mounted on top of the ejector seat 5, and the crystal film support 6 is mounted on top of the driven shaft 3. The wafer 1 is placed above the ejector assembly 2 and the crystal film support 6. A crystal film is positioned between the wafer 1, the crystal film support 6, and the ejector assembly 2. The ejector seat 5 is connected to a vacuum pipe. Utilizing the negative pressure effect generated by vacuum and atmospheric pressure, in conjunction with the overall movement of the device, the wafer 1 is extracted. The drive assembly 4 drives the driven shaft 3 to rotate. The crystal film itself has a certain degree of flexibility.

[0022] In a specific embodiment, such as Figure 2 The ejector seat 5 includes a bearing 51, a vacuum seat 52, a mounting bracket 53, a sensor seat 54, and a sensor 55. The vacuum seat 52 is mounted on top of the mounting bracket 53, and a drive assembly 4 is mounted on the right side of the mounting bracket 53. The ejector assembly 2 is mounted above the vacuum seat 52. The sensor seat 54 is mounted on the left side of the mounting bracket 53, and the sensor 55 is mounted above the sensor seat 54. The bearings 51 are arranged in pairs and mounted on the outside of the vacuum seat 52, and the driven shaft 3 is mounted on the outside of the bearings 51. The vacuum seat 52 is used to connect to a vacuum pipe, the bearings 51 allow the driven shaft 3 to rotate stably, and the sensor seat 54 is used to mount the sensor 55.

[0023] In a specific embodiment, such as Figure 3The drive assembly 4 includes a drive shaft 41, a connecting sleeve 42, and a motor 43. The connecting sleeve 42 is mounted on the top output end of the motor 43, and the drive shaft 41 is mounted on the top of the connecting sleeve 42. The drive shaft 41 meshes with the driven shaft 3. The motor 43 drives the connecting sleeve 42 to rotate, and the connecting sleeve 42 is connected to the rotating shaft at the output end of the motor 43 by bolts. The rotation of the connecting sleeve 42 will cause the drive shaft 41 to rotate, and the drive shaft 41 will drive the driven shaft 3 to rotate. The drive shaft 41 and the driven shaft 3 can be connected by gears or synchronous belts to ensure stable transmission.

[0024] In a specific embodiment, such as Figure 4 A light-blocking plate 31 is installed at the bottom of the driven shaft 3, and the light-blocking plate 31 sweeps across the sensor 55. The origin of rotation is determined by using the light-blocking plate 31 to sweep across the sensor 55.

[0025] In a specific embodiment, such as Figure 5 This provides the first support method for the structure. The crystal film support member 6 is composed of a sector-shaped plate and an arc-shaped plate. The sector-shaped plate is installed above the driven shaft 3, and the arc-shaped plate is installed above the sector-shaped plate, with the arc-shaped plate abutting against the bottom of the crystal film. The crystal film support member 6 abuts against the bottom of the crystal film to achieve support, and the top of the sector-shaped plate abuts against the bottom of the crystal film to achieve support.

[0026] In a specific embodiment, such as Figure 6 The ejector assembly 2 includes vents 21 and an ejector cap 22. The ejector cap 22 is connected to the top of the vacuum seat 52, and several vents 21 are formed on the top of the ejector cap 22. The vacuum seat 52 is connected to a vacuum pipe to generate suction. Under the action of negative pressure, the wafer 1 will be attracted to the top of the ejector cap 22. In conjunction with the overall movement of the device, the wafer 1 is extracted.

[0027] In one specific embodiment, a second support method is provided for this structure, wherein the crystal film support 6 is composed of two or three L-shaped rods, such as... Figure 8 The L-shaped rod has one end mounted on the top of the driven shaft 3 and the other end resting against the bottom of the crystal film. Multiple L-shaped rods are connected by arc-shaped blocks, which are mounted on the top of the driven shaft 3. The ends of the long rods supported by the multiple L-shaped rods rest against the bottom of the crystal film, thus providing support for the crystal film.

[0028] In a specific embodiment, such as Figure 1The top of the crystal film support 6 is flush with or slightly higher than the ejector assembly 2. By aligning the crystal film support 6 with or slightly higher than the ejector assembly 2, vibration waves can be absorbed when the crystal film vibrates, reducing the amplitude of vibration. When the crystal film remains stable, the stability and efficiency of the wafer 1 extraction process are improved. This is because when the vibration passes through the crystal film support 6, it is blocked by the crystal film support 6. This process is inspired by the vibration generated when a drum is struck. If a hand is placed on the drum surface, the vibration will be quickly reduced or even eliminated. The support of the crystal film support 6 applies a damping force to the crystal film, blocking vibration and significantly preventing crystal film vibration.

[0029] In a specific embodiment, such as Figure 1 A supporting iron ring 7 is provided on the outer side of the chip 1.

[0030] In a specific embodiment, such as Figure 7 The outer ring of the crystal film is mounted on the supporting iron ring 7, which is mounted on the translation mechanism. The translation mechanism includes an upper pressure plate 81, a placement plate 82, a slider 83, a second drive structure 84, a connecting plate 85, a first drive structure 86, and a displacement frame 87. The first drive structure 86 is mounted on the side of the connecting plate 85. The displacement frame 87 is positioned above the connecting plate 85 and is connected to the first drive structure 86. The second drive structure 84 is mounted on the side of the displacement frame 87. The first drive structure 86 and the second drive structure 84 are perpendicular to each other. The sliders 83 are arranged in pairs and slidably connected above the displacement frame 87. One slider 83 is connected to the second drive structure 84. The placement plate 82 is mounted above the two sliders 83. A circular hole is opened in the placement plate 82, and the crystal film is placed in the circular hole. The upper pressure plate 81 is mounted above the placement plate 82, and the outer ring of the supporting iron ring 7 is mounted between the upper pressure plate 81 and the placement plate 82. The crystal film is placed on the translation mechanism. The middle part of the crystal film is still supported by the ejector pin assembly 2 and the crystal film support 6. Therefore, the displacement frame 87 is driven to move by the first drive structure 86, which in turn causes the placement plate 82 to move with the support iron ring 7, thereby pushing the crystal film to move along the X direction. The second drive structure 84 will carry the slider 83 to move and drive the placement plate 82 to move with the support iron ring 7, so that the crystal film moves along the Y axis. Both the second drive structure 84 and the first drive structure 86 are composed of a lead screw motor and a lead screw.

[0031] In use, the entire diced wafer 1 is placed on the crystal film. A suitable support ring 7 is then connected to the translation mechanism. The wafer 1 with the crystal film attached is placed above the ejector assembly 2, aligning the center of the support ring 7 with the center of the top of the ejector assembly 2. When the wafer 1 is being picked up or pushed out, there are two scenarios: When picking up the central wafer 1 (the central wafer 1 refers to the very middle wafer and the wafers surrounding it), the crystal film support 6 does not rotate. In this case, the ejector assembly 2 generates suction, which, in conjunction with the overall movement of the device, removes the central wafer 1. When picking up wafers other than the central wafer 1, the position of the crystal film support 6 needs to be adjusted. When picking up wafers in other positions, the support ring 7 is driven by the translation mechanism to push the wafer 1 to align it with the ejector assembly 2. Because of the displacement of the wafer 1, the center shifts. For example, if it is necessary to remove... Figure 1 If the wafer 1 on the left is pushed to the right, the center will shift to the right. At this point, the motor 43 drives the drive shaft 41 to rotate, which in turn drives the driven shaft 3. The wafer support 6 will then rotate with the driven shaft 3. Using the example above, the driven shaft 3 needs to rotate the wafer support 6 to the right, placing it under the wafer to prevent mechanical vibration during wafer 1 removal. When wafer 1 is no longer being removed, it is positioned above the ejector assembly 2 and the wafer support 6. Since both wafer 1 and the wafer are relatively light, the wafer will vibrate due to airflow and mechanical vibration during device movement. The wafer support 6, positioned under the wafer, absorbs and dissipates the vibration energy quickly, eliminating vibration and ensuring the stability of the wafer and wafer 1, thus guaranteeing accuracy and efficiency during wafer 1 removal.

[0032] Although the present invention has been described in detail above with general descriptions and specific embodiments, modifications or improvements can be made to it, which will be obvious to those skilled in the art. Therefore, all such modifications or improvements made without departing from the spirit of the present invention fall within the scope of protection claimed by the present invention.

Claims

1. A wafer pickup anti-micro-vibration crystalline film stabilization system, characterized in that, include: Ejector seat (5), with a drive assembly (4) mounted on the side; Driven shaft (3) is rotatably connected above the ejector seat (5), and driven shaft (3) meshes with the top output end of drive assembly (4); The ejector assembly (2) is mounted on top of the ejector seat (5); A crystal film support (6) is installed on the top of the driven shaft (3). A wafer (1) is placed above the ejector assembly (2) and the crystal film support (6). A crystal film is disposed between the wafer (1), the crystal film support (6), and the ejector assembly (2).

2. The wafer pickup anti-micro-vibration crystal film stabilization system as described in claim 1, characterized in that, The ejector seat (5) includes: Mounting bracket (53), with vacuum seat (52) mounted on top, drive assembly (4) mounted on the right side of mounting bracket (53), and ejector assembly (2) mounted above vacuum seat (52); A sensor base (54) is installed on the left side of the mounting bracket (53), and a sensor (55) is installed above the sensor base (54). The bearings (51) are arranged in pairs and installed on the outside of the vacuum seat (52), and the driven shaft (3) is installed on the outside of the bearings (51).

3. The wafer pickup anti-micro-vibration crystal film stabilization system as described in claim 1, characterized in that, The driving component (4) includes: The motor (43) has a connecting sleeve (42) installed at the top output end; The drive shaft (41) is mounted on the top of the connecting sleeve (42), and the drive shaft (41) meshes with the driven shaft (3).

4. The wafer pickup anti-micro-vibration crystal film stabilization system as described in claim 2, characterized in that, A light-blocking plate (31) is installed at the bottom of the driven shaft (3), and the light-blocking plate (31) sweeps across the sensor (55).

5. The wafer pickup anti-micro-vibration film stabilization system as described in claim 1, characterized in that, The crystal film support (6) is composed of a fan-shaped plate and an arc-shaped plate. The fan-shaped plate is installed above the driven shaft (3), and the arc-shaped plate is installed above the fan-shaped plate. The arc-shaped plate abuts against the bottom of the crystal film.

6. The wafer pickup anti-micro-vibration film stabilization system as described in claim 2, characterized in that, The ejector pin assembly (2) includes: A pin cap (22) is attached to the top of the vacuum seat (52); Several air holes (21) are provided on the top of the pin cap (22).

7. The wafer pickup anti-micro-vibration film stabilization system as described in claim 1, characterized in that, The crystal film support (6) is also composed of two or three L-shaped rods, one end of which is installed on the top of the driven shaft (3), and the other end of which abuts against the bottom of the crystal film.

8. The wafer pickup anti-micro-vibration film stabilization system as described in claim 1, characterized in that, The top of the crystal film support (6) is flush with the top of the ejector assembly (2), or the top of the crystal film support (6) is higher than the top of the ejector assembly (2).

9. The wafer pickup anti-micro-vibration film stabilization system as described in claim 1, characterized in that, A supporting iron ring (7) is provided on the outer side of the wafer (1).

10. The wafer pickup anti-micro-vibration film stabilization system as described in claim 9, characterized in that, The outer ring of the crystal film is mounted on the supporting iron ring (7), and the supporting iron ring (7) is mounted on the translation mechanism; The translation mechanism includes: The connecting plate (85) has a first drive structure (86) installed on its side; A displacement frame (87) is disposed above the connecting plate (85). The displacement frame (87) is connected to the first driving structure (86) on its side. A second driving structure (84) is installed on the side of the displacement frame (87). The first driving structure (86) and the second driving structure (84) are arranged perpendicularly. Slider (83) is arranged in pairs and slidably connected above the displacement frame (87). One of the sliders (83) is connected to the second drive structure (84). A placement plate (82) is installed above the two sliders (83). A circular hole is opened in the placement plate (82), and the crystal film is disposed in the circular hole. An upper pressure plate (81) is installed above the shelf (82), and the outer ring of the supporting iron ring (7) is installed between the upper pressure plate (81) and the shelf (82).

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