A special grinding wheel for semiconductor silicon carbide wafer notch groove grinding and a preparation method thereof
By using metallic binders and ceramic additives made of copper-tin powder, cobalt powder, and silver powder, the wear resistance and bonding strength of the grinding wheel are improved, solving the problem of easy wear of existing silicon carbide wafer Notch groove grinding wheels, and realizing efficient and low-cost industrial production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SHENZHEN CITY XINGHUA DIAMOND ABRASIVE LTD
- Filing Date
- 2026-06-02
- Publication Date
- 2026-07-17
AI Technical Summary
The existing grinding wheels for machining Notch grooves on silicon carbide wafers have insufficient wear resistance, are prone to wear, and have insufficient bond strength, leading to frequent replacements, which affects production continuity and processing quality.
Copper-tin powder and cobalt powder are used as metal binders, combined with ceramic additives, to form a grinding wheel with high density and high hardness. Silver powder forms a heat-conducting network to enhance the mechanical holding force and interfacial bonding strength of the abrasive, thereby reducing the wear rate.
It significantly extends the service life of grinding wheels, improves processing efficiency, reduces production costs, and ensures high-precision and high-quality Notch groove processing.
Smart Images
Figure SMS_1