CNC machine tool processing path optimization method for batch processing of ion implanter consumables
By optimizing the CNC machine tool machining path, generating smooth toolpaths and outputting interpolation command streams, the problems of micro-chipping and particle contamination of consumables were solved, improving the yield and consistency of semiconductor processing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Filing Date
- 2026-06-01
- Publication Date
- 2026-07-17
AI Technical Summary
In semiconductor ion implantation equipment, existing CNC machine tool processing paths cannot effectively avoid microscopic damage to consumables in weak areas, leading to micro-edge chipping and particle contamination, which affects the yield of doped wafers.
By acquiring the initial toolpath and dynamic constraints, particle sensitivity and servo impact risk are extracted, a smooth transition segment is generated, the machining path is optimized to eliminate servo impact risks, a smooth toolpath is generated, and an interpolation command stream is output.
It can accurately locate and eliminate micro-chipping and particle release in the batch processing of identical parts, reduce the risk of wafer contamination, and improve processing consistency and yield.
Smart Images
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