Anisotropic integrated circuit high voltage busbar connector and method of manufacturing the same

By stacking and laminating copper substrates and printed circuit boards and processing with controlled-depth soldering, a high-voltage busbar connector for irregular integrated circuits is formed. This solves the shortcomings of existing busbar connectors in terms of three-dimensional structure, parasitic inductance, heat dissipation efficiency and soldering stability, and is suitable for high-speed and high-frequency applications.

CN122418344APending Publication Date: 2026-07-17YIYANG NORMAL COLLEGE
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
YIYANG NORMAL COLLEGE
Filing Date
2026-04-16
Publication Date
2026-07-17

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Abstract

本发明公开了一种异型集成电路高压母排连接器及其制造方法，包括由铜基板、印刷电路板、半固化片依次叠放压合成型制成的初胚，铜基板的宽度与印刷电路板的加工尺寸匹配；铜基板的两端分别设置有用于与外部电路连接的连接端子，铜基板设置有一个或多个弯曲区域，弯曲区域的印刷电路板完全锣断，弯曲区域的铜基板用于在预设加热条件下弯折预设角度。实现了高载流的铜面母排与PCB工艺相结合，形成高度集成的母排，PCB上符合各类器件焊接需求，形成符合高压工作抗干扰的电容消电弧辐射的网络屏蔽，且可以满足原有铜片母排的各向异性的结构，既克服纯铜片母排不能集成的问题，也解决了传统PCB不能实现各项异性的问题。
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Citation Information

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