A measurement assembly for measuring a deposition rate of an evaporation source, an evaporation source, a deposition apparatus and a method of measuring a set rate

By introducing a measurement component and a cooling system into the evaporation source, the accuracy and stability issues of evaporator deposition rate measurement were resolved, enabling precise control of material deposition in OLED production and improving production efficiency and product quality.

CN122423344APending Publication Date: 2026-07-17APPLIED MATERIALS INC
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
APPLIED MATERIALS INC
Filing Date
2024-06-12
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing vapor deposition equipment lacks accuracy and stability in measuring deposition rates over long periods, affecting quality control in OLED production.

Method used

A measurement assembly is provided, including a measuring device and a pipe, with a cooling element connected via the pipe, for measuring the deposition rate of a vapor deposition source, and for reducing stray coating and temperature effects through a rotating orifice and a cooling system, thereby ensuring the stability and accuracy of the measuring device.

Benefits of technology

It improves the measurement stability and accuracy of the deposition rate of the vapor deposition source, reduces the thermal load and crosstalk of the measurement device, and improves the precision and efficiency of OLED production.

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Abstract

描述了一种用于测量蒸镀源的沉积速率的测量组件(100)。所述测量组件(100)包括测量装置(110),所述测量装置用于测量所述沉积速率。附加地,所述测量组件(100)包括管道(120),所述管道用于提供供经蒸镀的材料从所述蒸镀源的测量出口(205)穿过所述蒸镀源的壁(201)到所述测量装置(110)的通路。所述管道(120)经由所述管道(120)的凸缘(121)连接到设置在所述壁(201)处的冷却元件(210)。
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