Laser processing system and method based on dynamic light field of time-sequential rotary scanning and spatial phase partitioning

Abstract

The application provides a kind of laser processing system and method based on timing rotary scanning and dynamic light field of space phase division, laser processing system includes laser and is sequentially arranged along optical path expansion mirror, light field regulation module, galvanometer and field lens.Laser is used to output laser beam;Expansion mirror is used to expand collimation to laser beam;Light field regulation module is used to switch from static single form efficient processing to dynamic multi-form integrated processing flexibly;Galvanometer is used to realize high-speed, high-precision two-dimensional scanning in field lens processing area;Field lens is used to focus light beam on the surface of sample.The laser processing system and method based on timing rotary scanning and dynamic light field of space phase division of the application effectively save processing time, improve processing efficiency, while reducing error, improve alignment accuracy, ensure the consistency of processing.

Description

Technical Field

[0001] This invention relates to the field of laser processing technology, and in particular to a laser processing system and method based on a dynamic light field of temporal rotation scanning and spatial phase partitioning. Background Technology

[0002] With the rapid development of consumer electronics, semiconductors, aerospace, and medical devices, increasingly higher demands are being placed on the efficiency, precision, and flexibility of laser processing. Laser cutting, laser etching, laser marking, and laser drilling have become indispensable processing methods in modern manufacturing. However, existing laser processing systems mainly suffer from the following shortcomings: 1. The focus mode is limited and cannot be dynamically switched. Traditional laser processing systems typically produce a single type of focal spot—the Gaussian spot being the most common. However, different processing tasks have different requirements for focal spot shape. For example, high-efficiency cutting requires a Gaussian focal spot distribution to achieve higher energy density and cutting speed; precision etching requires a flat-topped spot distribution to achieve uniform energy distribution and a smooth etched surface; marking requires a circular focal spot to achieve uniform line width; welding requires a ring-shaped or dot-ring-shaped focal spot to optimize weld quality; and machining irregularly shaped holes requires focal spots of special shapes such as elliptical, rectangular, and triangular. Currently, processing features of different shapes often requires changing optical components (such as shaping DOEs, slits, etc.) or completing the process in multiple steps, which seriously affects processing efficiency and consistency.

[0003] 2. Low efficiency in multi-stage processing In processing scenarios that require combining multiple focal shapes (such as marking text, etching patterns, and cutting contours on a single workpiece), traditional laser processing systems need to complete multiple steps sequentially. First, circular focal marking is performed, then optical elements are replaced or the optical path is adjusted for flat-top photolithography, and finally, cutting is performed using a Gaussian intensity distribution focal point. Switching between multiple steps consumes a lot of time, multiple positioning errors accumulate significantly, and the alignment accuracy between different steps is difficult to guarantee.

[0004] 3. The spatial light modulator has a low refresh rate, which cannot meet the requirements of dynamic switching. Spatial light modulators (SLMs) are the core components for achieving dynamic focus pattern control. However, the refresh rates of traditional liquid crystal SLMs are typically only 60-100Hz, with high-end products reaching approximately 600Hz. This means that switching focus patterns once requires 1.7ms to 16.7ms, far shorter than the response time of galvanometer scanning (tens of microseconds), making it impossible to switch focus patterns in real time and at high speed during scanning. Therefore, the low refresh rate of SLMs has become a major factor restricting the application of dynamic light field processing. Summary of the Invention

[0005] This invention provides a laser processing system and method based on a dynamic light field that can fully utilize the ultra-high frame rate dynamic light field switching capability of the light field control module to achieve flexible switching from static single-mode high-efficiency processing to dynamic multi-mode integrated processing.

[0006] The technical solution adopted in this invention is: a laser processing system based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning, which includes a laser, a control system, and a beam expander, an optical field control module, a galvanometer, and a field mirror arranged sequentially along the optical path; The light field control module includes a first parallel plate glass, a half-wave plate, a spatial light modulator, a first focusing lens, a multi-aperture aperture, a second focusing lens, and a second parallel plate glass arranged sequentially along the light path; The laser is used to output a laser beam; the beam expander is used to expand, collimate, and control the divergence angle of the laser beam. The first parallel flat glass is used to deviate the output beam from the rotation center; and the first parallel flat glass is coaxially mounted on a first high-speed rotating motor, which drives the first parallel flat glass to rotate at high speed around its rotation center to realize time-series rotation scanning. The half-wave plate is used to modulate the polarization direction of the beam, which is parallel to the liquid crystal orientation of the spatial light modulator; the target surface of the spatial light modulator is divided into multiple partitions at equal angles with the center point as the origin, and different phase modulation information is loaded in each partition to form different modulation regions. The front focal plane of the first focusing lens coincides with the target surface of the spatial light modulator; the front focal point of the second focusing lens coincides with the rear focal point of the first focusing lens; and the second focusing lens and the first focusing lens constitute a 4f imaging system; The aperture stop is located near the back focal plane of the first focusing lens, and the aperture stop has multiple micro-holes. The number of micro-holes is equal to the number of partitions. Each micro-hole is aligned with the focused spot of the modulation region of each partition to filter crosstalk of the beam in the region that is not fully phase modulated. The second parallel plate glass is used to convert the off-axis rotating beam into a beam propagating along the center of the optical axis; and the second parallel plate glass is coaxially mounted on a second high-speed rotating motor, which drives the second parallel plate glass to rotate at high speed around its rotation center. The galvanometer is used to achieve high-speed scanning within the processing area of ​​the field lens; the field lens is used to focus the light beam onto the surface of the sample; The control system is electrically connected to the laser, the first high-speed rotating motor, the second high-speed rotating motor, the spatial light modulator, and the galvanometer.

[0007] Furthermore, the light field control module has two working modes: a static single-form processing mode and a dynamic multi-form integrated processing mode. In the static single-form processing mode, the first high-speed rotating motor and the second high-speed rotating motor are locked at a fixed angle, and the first parallel flat glass and the second parallel flat glass remain stationary. In the dynamic multi-form integrated processing mode, the first high-speed rotating motor and the second high-speed rotating motor rotate at the same speed, with an initial phase difference of 180° and the same rotation direction.

[0008] Furthermore, the front focal plane of the field lens coincides with the center of the outgoing optical axis of the light field control module; and the front focal point of the field lens is located at the center of the X-axis and Y-axis mirrors of the galvanometer.

[0009] Furthermore, the light field control module also includes a sealed housing, in which the first parallel flat glass, the half-wave plate, the spatial light modulator, the first focusing lens, the multi-aperture aperture, the second focusing lens, and the second parallel flat glass are arranged sequentially along the optical path within the sealed housing.

[0010] Furthermore, the sealed housing is provided with a light inlet, a light outlet, an electrical interface, a gas interface, and a water interface; the light inlet is used to receive the laser beam and align the incident beam with the rotation center of the first parallel flat glass; the light outlet is used to output a modulated beam that propagates along the optical axis center and switches phase at high speed; the electrical interface is used to provide the spatial light modulator control signal input, the drive of the first high-speed rotating motor and the second high-speed rotating motor, and the phase feedback signal interface; the gas interface is used to introduce positive pressure clean and dry gas into the sealed housing; the water interface is used to introduce circulating cooling water to cool the first high-speed rotating motor and the second high-speed rotating motor.

[0011] Furthermore, it also includes a first reflecting mirror and a second reflecting mirror arranged along the optical path between the beam expander and the first parallel plate glass. The first reflecting mirror and the second reflecting mirror are used to adjust the transmission direction of the light beam so that the light beam is perpendicularly incident on the light entrance and incident on the first parallel plate glass at a 45° angle along the rotation center of the first parallel plate glass.

[0012] Furthermore, the light field modulation module also includes a third and a fourth reflecting mirror arranged along the light path between the first parallel flat glass and the half-wave plate. The third and fourth reflecting mirrors are used to adjust the transmission direction of the light beam so that the light beam illuminates the target surface of the spatial light modulator at a preset angle.

[0013] Furthermore, the light field control module also includes a fifth and a sixth reflecting mirror arranged along the optical path between the second focusing mirror and the second parallel plate glass. The fifth and the sixth reflecting mirrors are used to adjust the transmission direction of the light beam so that the light beam enters the second parallel plate glass at a 45° angle and exits along the rotation center of the second parallel plate glass.

[0014] The present invention further provides the following technical solutions: A laser processing method, employing the aforementioned laser processing system based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning, includes the following steps: The control system issues a command to select either a static single-mode machining mode or a dynamic multi-mode integrated machining mode. When the dynamic multi-form integrated processing mode is selected, the following steps are performed: S1': The control system issues a command to control the first high-speed rotary motor and the second high-speed rotary motor to rotate at the same speed, with an initial phase difference of 180° and the same direction of rotation. S2': The target surface of the spatial light modulator is divided into multiple partitions at equal angles with the center point as the origin. Each partition is loaded with a modulation phase of different focal shape, forming a region loaded with phase information. S3': The control system activates the laser. The laser beam is expanded and collimated by a beam expander before entering the optical field control module. It is incident on the first parallel plate glass at a 45° angle along the rotation center. The beam experiences a lateral translation δy1 away from the rotation center. Driven by a first high-speed rotating motor, the beam with the lateral translation δy1 moves in a circle around the rotation center with a radius δy1 and a rotation speed r1, forming a time-sequential rotating scanning beam that sequentially scans multiple zones on the target surface of the spatial light modulator. , In the formula, D1 is the thickness of the first parallel flat glass, and n1 is the refractive index of the first parallel flat glass. When the rotating beam illuminates the regions of each partition that are loaded with phase information, it is subjected to corresponding phase modulation, modulating them to carry the equivalent frame rate. A beam of phase-modulated information; among which...

[0015] In the formula, R is the refresh rate (Hz) of the spatial light modulator; N is the number of target partitions of the spatial light modulator; and r1 is the rotational speed (rps) of the first high-speed rotating motor. The modulated beam is filtered by a multi-aperture to remove crosstalk from the region where the phase modulation was not complete. Simultaneously, it is scaled by a 4f imaging system at a ratio of F2 / F1 and incident at a 45° angle onto a second parallel plate. The beam rotates synchronously and in the same direction through the second parallel plate, causing a lateral translation δy2 opposite to the direction of δy1. Eliminate off-axis offset, and output propagates along the optical axis center at an equivalent frame rate. The focus pattern of each zone in a loop; among them, , In the formula, D2 is the thickness of the second parallel plate glass, n2 is the refractive index of the second parallel plate glass; F1 is the focal length of the first focusing lens, and F2 is the focal length of the second focusing lens. S4': The control system plans the scanning path of the galvanometer according to the processing task, and matches different processing areas with the required focal point shape; S5': The control system synchronously coordinates the optical field modulation module and the galvanometer scanning to complete the timing coordination matching; S6': The galvanometer scans through all processing areas in a single scan, and the light field control module switches the focus mode synchronously during the galvanometer scan, completing multiple processing tasks of different forms at once.

[0016] Furthermore, when the static single-mode processing mode is selected, the following steps are performed: S1: The control system controls the first high-speed rotating motor and the second high-speed rotating motor to lock at any fixed angle simultaneously, so that the first parallel flat glass and the second parallel flat glass remain stationary. S2: The control system selects the single focal phase corresponding to the spatial light modulator for loading according to the processing task requirements; S3: The light field control module outputs a stable single-focus pattern; S4: The control system controls the galvanometer to scan at high speed within the processing area of ​​the field lens, guiding the stable focal point to the predetermined processing position of the sample; S5: The field lens focuses the light beam onto the surface of the sample, forming a micron-scale focal spot, enabling efficient cutting or precision etching.

[0017] Compared to existing technologies, the laser processing system and method based on a dynamic light field using temporal rotation scanning and spatial phase partitioning, as described in this invention, enables the laser processing system to operate in both a static single-mode processing mode and a dynamic multi-mode integrated processing mode by setting up an independently packaged light field control module. Furthermore, the two modes can be switched in real-time via a control system with a switching time in the millisecond range, meeting the rapid changeover requirements of production lines. In the static single-mode processing mode, the light field control module is locked, resulting in good system stability, high energy utilization, and a cutting speed that can reach the upper limit of galvanometer scanning. This is suitable for large-scale single-process batch production, effectively improving processing efficiency. In the dynamic multi-mode integrated processing mode, multiple processes such as marking, etching, and cutting can be integrated into a single scan, eliminating switching time and repetitive alignment between processes. This further improves processing efficiency while effectively saving processing time, reducing errors, improving alignment accuracy, and ensuring processing consistency. Attached Figure Description

[0018] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the following detailed description to explain the invention, but should not be construed as limiting the invention. In the drawings, Figure 1 This is a schematic diagram of a laser processing system based on a dynamic optical field with temporal rotation scanning and spatial phase partitioning. Figure 2 This is a schematic diagram of the optical field modulation module; Figure 3 This is a schematic diagram of the target surface partitioning and focal point morphology phase loading of a spatial light modulator; Figure 4 This is a schematic diagram of the dual-mode working principle; Figure 5 This is a schematic diagram illustrating the principle of eliminating off-axis offset between the first and second parallel flat glass panes. Figure 6 This is a flowchart of the laser processing method.

[0019] Names and numbers of each component Laser 1; Beam expander 2; First reflector 3; Second reflector 4; First parallel plate glass 5; First high-speed rotating motor 6; Third reflector 7; Fourth reflector 8; Half-wave plate 9; Spatial light modulator 10; First focusing lens 11; Aperture diaphragm 12; Second focusing lens 13; Fifth reflector 14; Sixth reflector 15; Second parallel plate glass 16; Second high-speed rotating motor 17; Galvanometer 18; Field lens 19; Sample 20; Motion platform 21; Control system 22; Sealed housing 23; Light inlet 24; Light outlet 25; Electrical interface 26; Gas interface 27; Water interface 28. Detailed Implementation

[0020] The specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0021] like Figure 1 and Figure 2 As shown, the laser processing system based on the dynamic light field of temporal rotation scanning and spatial phase partitioning of the present invention includes a laser 1, a control system 22, and a beam expander 2, a first reflector 3, a second reflector 4, a light field control module, a galvanometer 18, a field mirror 19, and a motion platform 21 arranged sequentially along the optical path.

[0022] Please refer to Figure 2 The light field control module is an ultra-high frame rate light field control module, including a sealed housing 23, and a first parallel plate glass 5, a third reflector 7, a fourth reflector 8, a half-wave plate 9, a spatial light modulator 10, a first focusing lens 11, a multi-aperture stop 12, a second focusing lens 13, a fifth reflector 14, a sixth reflector 15 and a second parallel plate glass 16 arranged sequentially in the sealed housing 23 along the light path.

[0023] The sealed housing 23 is provided with an inlet 24 and an outlet 25. The inlet 24 is used to receive a collimated, linearly polarized laser beam with an adaptable diameter, requiring the incident beam to be precisely aligned with the rotation center of the first parallel flat glass 5. The outlet 25 is used to output a modulated beam that propagates along the center of the optical axis and switches phase at high speed.

[0024] Laser 1 is used to output a high-quality linearly polarized laser beam with a wavelength between 180nm and 1600nm, and can be a femtosecond laser, picosecond laser, or nanosecond laser.

[0025] The beam expander 2 is used to expand, collimate, and control the divergence angle of the laser beam, so that the diameter of the output beam matches the diameter of the light inlet 24 of the light field control module. The first reflector 3 and the second reflector 4 are used to adjust the transmission direction of the laser beam and provide fine-tuning dimension, so that the beam is perpendicularly incident on the light inlet 24 of the light field control module and incident on the first parallel plate glass 5 at a 45° angle along the rotation center of the first parallel plate glass 5.

[0026] The first parallel flat glass plate 5 has a thickness of D1 and a refractive index of n1. It is used to generate a lateral translation δy1 off the rotation center of the output beam, where δy1 ≥ d (the diameter of the light spot illuminating the spatial light modulator 10), to ensure that the rotating beam forms a complete circular scanning trajectory on the target surface. The first parallel flat glass plate 5 is coaxially mounted on a first high-speed rotary motor 6, which drives the first parallel flat glass plate 5 to rotate at a high speed r1 around the rotation center, achieving sequential rotational scanning. .

[0027] The third reflector 7 and the fourth reflector 8 are used to adjust the beam transmission direction so that the rotating beam illuminates the target surface of the spatial light modulator 10 at a preset angle (i.e., polarization direction).

[0028] The half-wave plate 9 is used to adjust the polarization direction of the rotating laser beam to be parallel to the liquid crystal orientation of the spatial light modulator 10, so as to meet the polarization state requirements of the spatial light modulator 10.

[0029] like Figure 1 and Figure 3 As shown, the target surface of the spatial light modulator 10 is divided into N equal-angled regions (N≥2) with the center point as the origin. Different phase modulation information is loaded into each region to form different modulation areas (please refer to...). Figure 3 This demonstrates the phase modulation information partitioning arrangement corresponding to different focal point shapes, such as Gaussian, flat-top, rectangular, triangular, and ring-shaped. Among them, the diameter d of the loaded modulation phase region of the spatial light modulator 10... mod ≥ d, apply a gradient phase outside the modulation region to diffract the incident beam out of the system, ensuring complete phase modulation when the rotating beam illuminates the area. To ensure complete phase modulation in each section of the beam within one rotation, the following must be satisfied: (k represents an integer, indicating that the rotation speed r1 must satisfy the refresh rate of the spatial light modulator 10.) (integer multiples thereof) to ensure that the spatial light modulator 10 refreshes within one rotation of the beam. Different phase diagrams ensure that no issues arise due to the spatial light modulator's 10 refresh rate. The mismatch between the beam rotation speed r1 and the beam rotation speed r1 leads to the inability to load complete phase information.

[0030] After being modulated by the spatial light modulator 10, the light beam carries an equivalent frame rate. The formula for calculating the equivalent frame rate based on phase modulation information is as follows: , In the formula, N is the number of target surface partitions in the spatial light modulator. R1 is the refresh rate (Hz) of the spatial light modulator 10, and R2 is the rotational speed (rps) of the first high-speed rotating motor.

[0031] The following verification is performed using typical parameters: When N=6, f SLM =60Hz, r1=500rps (30000rpm), f mod =180,000Hz, which is 3,000 times higher than the traditional SLM used directly (60Hz).

[0032] The first focusing lens 11 has a focal length of F1, and its front focal plane coincides with the target surface of the spatial light modulator 10. The second focusing lens 13 has a focal length of F2, and its front focal point coincides with the rear focal point of the first focusing lens 11; and the second focusing lens 13 and the first focusing lens 11 constitute a 4f imaging system, the magnification of which is F2 / F1.

[0033] The multi-aperture stop 12 is located near the back focal plane of the first focusing lens 11 and has M micro-apertures (M=N). The position of each micro-aperture is precisely aligned with the focused spot of the modulation area of ​​each partition, which is used to filter crosstalk of the beam in the area that is not fully phase modulated.

[0034] The fifth reflector 14 and the sixth reflector 15 are used to adjust the direction of the beam so that the scaled beam enters the second parallel plate glass 16 at a 45° angle and exits along the rotation center of the second parallel plate glass 16.

[0035] The second parallel plate glass 16 has a thickness of D2 and a refractive index of n2, and is used to convert the off-axis rotating beam into a beam propagating along the optical axis center. The second parallel plate glass 16 is coaxially mounted on the second high-speed rotary motor 17, which drives the second parallel plate glass 16 to rotate at a high speed r2 around its rotation center, where r2 = r1. Furthermore, the initial phase difference between the second parallel plate glass 16 and the first parallel plate glass 5 is 180° (i.e., the initial phase difference between the first high-speed rotary motor 6 and the second high-speed rotary motor 17 is 180°), and they rotate in the same direction, causing the beam passing through the second parallel plate glass 16 to produce a lateral translation δy2 opposite to the direction of δy1. This precisely offsets the off-axis lateral translation of the first parallel flat glass 5 after scaling by the 4f imaging system (please refer to...). Figure 5 , Figure 5 This is a schematic diagram illustrating the principle of eliminating off-axis beam offset. It shows that the first parallel plate glass 5 generates an off-axis rotating beam, and the second parallel plate glass 16 converts it into a beam propagating along the center of the optical axis. Here, θ1 is the incident angle of the beam entering the first parallel plate glass 5 and the second parallel plate glass 16, θ1=45°.

[0036] in, .

[0037] That is, when the second parallel plate glass 16 and the first parallel plate glass 5 rotate at the same speed, in the same direction, and have an initial phase difference of 180°, the lateral translation of the second parallel plate glass 16 at each moment is exactly equal to the lateral translation after the offset of the first parallel plate glass 5 and the scaling of the 4f imaging system (i.e.: The directions are opposite, thus causing the rotating beam to return to the center of the optical axis, and the output beam to propagate along the center of the optical axis, eliminating the aberrations and optical path coupling difficulties that off-axis beams may cause in subsequent optical systems.

[0038] In addition, the light field control module has two working modes: static mode (first high-speed rotating motor 6 and second high-speed rotating motor 17 locked) outputs a single fixed focus shape, and dynamic mode (first high-speed rotating motor 6 and second high-speed rotating motor 17 rotate synchronously at high speed) outputs at an equivalent frame rate. It cycles through various focus modes for output.

[0039] Please refer to Figure 4 The dual-mode working mechanism of the light field modulation module is as follows: The light field control module supports two operating modes, which are switched by controlling the operating status of the first high-speed rotating motor 6 and the second high-speed rotating motor 17: 1. Mode 1: Static single-form processing mode, please refer to... Figure 4 (a) shows the static single-mode machining mode (first high-speed rotary motor 6 and second high-speed rotary motor 17 locked).

[0040] Operating state: The first high-speed rotary motor 6 and the second high-speed rotary motor 17 are locked at any fixed angle, and the first parallel flat glass 5 and the second parallel flat glass 16 remain stationary; Output characteristics: The module outputs a single, fixed focal shape, corresponding to the phase modulation of a specific zone of the spatial light modulator 10; Equivalent frame rate: No switching involved, stable output; Applicable scenarios: large-volume single-process processing, such as large-format metal sheet cutting, batch marking, uniform etching, etc. Technical advantages: High system stability, high energy utilization, and fast processing speed.

[0041] 2. Mode Two: Dynamic Multi-Form Integrated Processing Mode, please refer to... Figure 4 (b) shows a multi-form integrated processing mode (the first high-speed rotary motor 6 and the second high-speed rotary motor 17 rotate at the same speed).

[0042] Operating status: The first high-speed rotary motor 6 and the second high-speed rotary motor 17 rotate at the same speed r1 = r2, with an initial phase difference of 180° and the same direction of rotation; Output characteristics: The light field module operates at an equivalent frame rate Cyclicly switch between different focus modes of N output partitions; Equivalent frame rate: (Up to hundreds of thousands of hertz); Applicable scenarios: Complex workpieces that require processing with a combination of multiple focal points, where multiple processes are combined into a single process; Technical advantages: Eliminates changeover time and repetitive alignment between processes, improving efficiency by 3-8 times.

[0043] 3. Coordinated control of mode switching The control system 22 automatically selects or allows the user to specify the working mode based on the processing task:

[0044] The two modes can be switched in real time by the control system 22. When the processing task changes, the control system 22 automatically determines the current mode and instructs the first high-speed rotary motor 6 and the second high-speed rotary motor 17 to decelerate and lock from the rotating state (dynamic → static) or accelerate from the locked state to the target speed (static → dynamic). The switching time can be controlled in milliseconds.

[0045] like Figure 1 As shown, the galvanometer 18 is positioned between the light output port 25 of the light field control module and the field lens 19, and is used to achieve high-speed, high-precision two-dimensional scanning within the processing area of ​​the field lens 19. The galvanometer 18 can be a two-dimensional scanning galvanometer (2D galvanometer), a three-dimensional scanning galvanometer (3D galvanometer), or a five-dimensional scanning galvanometer (5D galvanometer), and is not limited to these.

[0046] With the output beam direction of laser 1 as the X-axis, the natural horizontal direction as the Y-axis, and the vertical direction as the Z-axis, the optical field control module outputs a modulated beam that propagates along the center of the optical axis. This beam enters the galvanometer 18, and after being deflected by the X and Y axis mirrors of the galvanometer 18, it enters the field lens 19 and is focused on the surface of the sample 20.

[0047] Field lens 19 is used to focus the laser beam to produce a micrometer-scale focal spot. Its focal length is F3, and its front focal plane coincides with the center of the outgoing optical axis of the optical field control module. The front focal point of field lens 19 is positioned at the center of the X-axis and Y-axis mirrors of galvanometer 18 to satisfy the object-side telecentric condition. Sample 20 is placed near the focal plane of field lens 19.

[0048] The motion platform 21 is used to carry the sample 20 and can perform one-dimensional, two-dimensional or three-dimensional high-precision motion to realize large-format splicing processing and three-dimensional curved surface conformal processing.

[0049] The control system 22 is electrically connected to the laser 1, the first high-speed rotating motor 6, the spatial light modulator 10, the second high-speed rotating motor 17, the galvanometer 18, and the motion platform 21. It is used to coordinate the control of the timing, speed, frequency, and position parameters of each module, and select the working mode (including static mode or dynamic mode) of the light field control module according to the processing task to achieve seamless switching between the two modes.

[0050] The collaborative processing principle between the light field manipulation module and the galvanometer 18 is as follows: In the dynamic multi-morphic integrated processing mode, the light field modulation module operates at an equivalent frame rate. The frequency of the focus shape is cyclically switched. When planning the scanning path of the galvanometer 18, different processing areas are associated with different focus shapes: Processing task = {(x1, y1, shape 1), (x2, y2, shape 2), ..., (x K y K ,form K )} The control system 22 ensures that when the galvanometer 18 scans the region of the desired shape i (i=1, 2, 3...), the focal shape output by the light field control module is exactly the desired shape for that region. This is because the light field control module has an equivalent frame rate... With a resolution reaching hundreds of thousands of hertz, the spatial resolution of the focus mode switching is fine enough to precisely match the needs of different processing areas.

[0051] By setting up a light field control module and galvanometer 18 for collaborative processing, the efficiency of multi-step processes is improved by simplifying them into sequential processing. Traditional multi-process manufacturing workflows require multiple positioning and scanning operations: (1) After the light field modulation module is combined with the galvanometer 18, all processes are integrated into a single scan: T 本发明 =T 对准 +T 加工 ≈T 加工 (2) By comparing equations (1) and (2), it can be seen that this technical solution can effectively save a lot of time, improve processing efficiency, reduce errors, and improve alignment accuracy.

[0052] like Figure 2 As shown, in addition to the above, the sealed housing 23 is also equipped with an electrical interface 26, a gas interface 27, and a water interface 28. The electrical interface 26 is used to provide control signal input for the spatial light modulator 10, drive the first high-speed rotating motor 6 and the second high-speed rotating motor 17, and provide a phase feedback signal interface. The gas interface 27 is used to introduce positive pressure clean and dry gas (such as nitrogen) into the sealed housing 23 to prevent external dust from entering and extend service life. The water interface 28 is used to cool the first high-speed rotating motor 6 and the second high-speed rotating motor 17. Circulating cooling water is introduced through the water interface 28 to quickly remove the heat generated by the first high-speed rotating motor 6 and the second high-speed rotating motor 17 during operation, preventing temperature exceedances and optical drift.

[0053] The following describes different application scenarios of the laser processing system based on temporal rotation scanning and spatial phase partitioning dynamic light field through different embodiments: Example 1 (Static Single-Form Processing Mode - High-Efficiency Laser Cutting) like Figure 1 and Figure 4 As shown in (a), Figure 4 (a) in the example demonstrates the static single-form processing mode. This embodiment illustrates the basic principle of configuring the system in static single-form processing mode for metal sheet cutting.

[0054] System configuration: The first high-speed rotating motor 6 and the second high-speed rotating motor 17 in the command light field modulation module of the control system 22 are locked at a fixed angle; the spatial light modulator 10 selects to load the Gaussian focal phase (i.e., the spherical wave phase).

[0055] Basic principle: When the first parallel flat glass 5 and the second parallel flat glass 16 are locked at a fixed angle, the light field module outputs a stable Gaussian focused spot. This Gaussian spot has the characteristics of high energy at the center and gradually decaying outwards, making it suitable for cutting processes requiring high energy density. The galvanometer 18 scans at high speed within the area of ​​the field lens 19, guiding the Gaussian spot to the preset cutting path. The field lens 19 focuses the beam onto the sample surface, realizing laser cutting.

[0056] Application variations: The static mode of this embodiment can also be used in other processing scenarios that require a single focal point, such as: changing the phase loaded by the spatial light modulator 10 to a flat-top spot phase, which can be used for large-area uniform etching; changing the phase loaded by the spatial light modulator 10 to a ring focal point phase, which can be used for cutting transparent materials.

[0057] Example 2 (Static Single-Modal Machining Mode - Precision Etching) like Figure 1 and Figure 4 As shown in (a), Figure 4 (a) in the example demonstrates the static single-morph processing mode. This embodiment illustrates the basic principle of configuring the system in static single-morph processing mode for large-area uniform etching.

[0058] System configuration: In the control system 22 command light field control module, the first high-speed rotating motor 6 and the second high-speed rotating motor 17 are locked at a fixed angle; the spatial light modulator 10 selects the loading flat-top light spot shaping phase.

[0059] Basic principle: The flat-top light spot has the characteristics of uniform energy distribution and steep edges, making it suitable for etching processes that require uniform material removal. The light field control module outputs a stable flat-top light spot, the galvanometer 18 covers the entire area to be etched in a fill-scan manner, and the field lens 19 focuses the flat-top light spot on the surface of the sample 20 to achieve large-area uniform etching.

[0060] Application variations: The static mode of this embodiment is also applicable to processing scenarios that require specific focal point shapes, such as laser marking and surface treatment.

[0061] Example 3 (Dynamic Multi-morphic Integrated Processing Mode - Multi-morphic Combination Processing) like Figure 1 and Figure 4 As shown in (b) in the figure, Figure 4 (b) in the example demonstrates a multi-form integrated processing mode. This example shows the basic principle of configuring the system into a dynamic multi-form integrated processing mode to achieve three different forms of processing—circular marking, rectangular etching, and ring cutting—in one operation.

[0062] System configuration: The first high-speed rotating motor 6 and the second high-speed rotating motor 17 in the light field control module of the control system 22 rotate at the same high speed (e.g., 30,000 rpm), with an initial phase difference of 180° and the same rotation direction. The target surface of the spatial light modulator 10 is divided into 6 equal-angled zones, each zone loading: circular focal phase, rectangular focal phase, flat-top light spot phase, annular focal phase, elliptical focal phase, and triangular focal phase. The light field control module outputs an equivalent frame rate. .

[0063] Basic principle: The light beam undergoes a lateral translation after passing through the first parallel plate glass 5 and rotates at a high speed of r1. The emitted beam sequentially scans each partition of the spatial light modulator 10. For example, when the beam scans partition 1, a circular focal point is output; when it scans partition 2, a rectangular focal point is output; when it scans partition 3, a flat-top spot is output; and so on, switching cyclically. The second parallel plate glass 16 rotates synchronously and in the same direction, eliminating off-axis offset and causing the output beam to propagate along the center of the optical axis.

[0064] The control system 22 plans the scanning path of the galvanometer 18 to pass through region A (requiring circular marking), region B (requiring rectangular etching), and region C (requiring circular cutting) in sequence. When the galvanometer scans region A, the module outputs a circular focus; when it scans region B, the module outputs a rectangular focus; when it scans region C, the module outputs a circular focus. Three different processing tasks can be completed in one scan.

[0065] Application variations: The dynamic mode of this embodiment can be flexibly configured according to actual processing needs, for example: increasing or decreasing the number of spatial light modulator 10 partitions (e.g., N=4, 8, 12, etc.); loading different phase information into each partition (e.g., circular focal points of different diameters, rectangular focal points of different aspect ratios, annular focal points of different topological charge numbers, etc.); adjusting the rotation speed of the first high-speed rotating motor 6 and the second high-speed rotating motor 17 to change the focal point shape switching frequency; adjusting the correspondence between the scanning path of the galvanometer 18 and the focal point shape.

[0066] Example 4 (Mode Switching and Hybrid Processing) like Figure 1 and Figure 4 As shown, Figure 4 (a) shows the static single-form processing mode, and (b) shows the multi-form integrated processing mode. This embodiment demonstrates the basic principle of adaptively switching between the static single-form processing mode and the dynamic multi-form integrated processing mode in the same processing task.

[0067] System configuration: This system supports both static single-form processing mode and dynamic multi-form integrated processing mode on the same hardware architecture.

[0068] Basic principle: For workpieces that contain a large number of identical features and multiple irregular features, the static mode can be used to quickly process a large number of identical feature areas (the first high-speed rotary motor 6 and the second high-speed rotary motor 17 are locked, outputting a single focus shape, and the galvanometer 18 scans at high speed). Then, the dynamic mode can be switched to process multiple irregular feature areas (the first high-speed rotary motor 6 and the second high-speed rotary motor 17 rotate at the same speed, cyclically switching multiple focus shapes, and the galvanometer 18 matches synchronously).

[0069] Mode switching is achieved by controlling the start and stop of the first high-speed rotating motor 6 and the second high-speed rotating motor 17: after the switching command is issued, the first high-speed rotating motor 6 and the second high-speed rotating motor 17 decelerate and lock from the rotating state (dynamic → static), or accelerate from the locked state to the target speed (static → dynamic), and the switching time can be controlled in milliseconds; during the switching process, the spatial light modulator 10 synchronously switches the phase loading configuration.

[0070] Application variations: This embodiment demonstrates the system's flexible adaptability in the machining of complex workpieces. The two modes can be freely combined according to the actual needs of the machining task, giving full play to their respective advantages.

[0071] Example 5 (Light field control module and 5D galvanometer working together - 3D curved surface processing) This embodiment demonstrates the basic principle of using a light field control module in conjunction with a five-dimensional (i.e., 5D) scanning galvanometer for three-dimensional surface processing.

[0072] System configuration: The galvanometer 18 adopts a 5D galvanometer (which can independently control the X and Y positions, incident angle and Z-direction focus), and the motion platform adopts a five-axis linkage platform.

[0073] Basic principle: When machining three-dimensional curved surfaces, the 5D galvanometer controls the incident angle of the light beam to always be perpendicular to the curved surface, ensuring the roundness of the light spot; the light field control module switches the focus shape as needed (e.g., different curvature regions require different focus compensations); the motion platform 21 adjusts the attitude. The three work together to achieve conformal machining on complex free-form surfaces.

[0074] Application variations: This embodiment can be extended to work in conjunction with a 3D galvanometer (integrated Z-axis dynamic focusing) for scanning and processing of three-dimensional structures. Example 6 (Diverse configurations of 10-segment phase of spatial light modulator) like Figure 1 and Figure 3 As shown, this embodiment demonstrates diverse configuration schemes for loading phases in each partition of the spatial light modulator 10, including but not limited to the following configurations and schemes:

[0075] Basic principle: Users can arbitrarily configure the required phase information in each of the 10 zones of the spatial light modulator according to actual processing needs. In dynamic mode, the light field modulation module operates at an equivalent frame rate. The focal shape of each zone is output in a loop, and the 18 galvanometers scan synchronously to achieve integrated processing of multiple processing modes.

[0076] Example 7 (Coordination of Laser 1 Pulse and Optical Field Control Module Output) like Figure 1 As shown in the figure, this embodiment demonstrates the basic principle of the coordination between the output focal shape of the light field control module and the laser pulse 1.

[0077] System configuration: Laser 1 is a pulsed laser, and control system 22 has pulse-level synchronization capability.

[0078] Basic principle: The control system 22 acquires the pulse trigger signal of the laser 1 (or actively controls the pulse output of the laser 1), determines the focal shape number to be output according to the current pulse sequence number, and ensures that when the pulse arrives at the module, the rotating beam just illuminates the partition with the corresponding shape phase.

[0079] When the light field modulation module has an equivalent frame rate Laser 1 repetition frequency At the same time, each laser pulse can independently load different focal shapes, realizing pulse-level optical field modulation and shaping.

[0080] Application variations: The pulse-level coordination in this embodiment can be used in advanced application scenarios such as single-pulse irregular spot processing and pulse sequence encoding processing.

[0081] like Figure 1 and Figure 6 As shown, this invention provides a laser processing method based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning, comprising the following steps: First, the mode is configured: the control system 22 issues a command to select either the static single-mode machining mode or the dynamic multi-mode integrated machining mode; when the static single-mode machining mode is selected, the following steps are executed: S1: The control system 22 controls the first high-speed rotating motor 6 and the second high-speed rotating motor 17 to be locked at any fixed angle simultaneously, so that the first parallel flat glass 5 and the second parallel flat glass 16 remain stationary.

[0082] S2: Focus Shape Selection According to the processing task requirements, the control system 22 selects the single focal phase corresponding to the spatial light modulator 10 for loading (please refer to...). Figure 4 (a) If efficient cutting is required, load a Gaussian focal phase (i.e., spherical wave phase); if precise etching is required, load a flat-top spot phase (i.e., beam shaping phase).

[0083] S3: The light field modulation module outputs a stable focus. The light field control module outputs a stable single-focus pattern. Among them, the energy of the Gaussian focus is distributed in a Gaussian pattern with high energy density at the center, which is suitable for high-speed cutting; the energy distribution of the flat-top spot is uniform and the edges are steep, which is suitable for precision etching.

[0084] S4: High-speed scanning with 18 galvanometers The control system 22 controls the galvanometer 18 to scan at high speed within the processing area of ​​the field mirror 19, guiding the stable focal point to the predetermined processing position of the sample 20.

[0085] S5: Field Lens 19 Focusing Process Field lens 19 focuses the light beam onto the surface of sample 20, forming a micron-scale focal spot to complete efficient cutting or precision etching.

[0086] S6: Batch processing The control system 22 controls the motion platform 21 to move step by step, and the galvanometer 18 scans repeatedly to achieve continuous and efficient processing of a large batch of single processes.

[0087] When the dynamic multi-form integrated processing mode is selected, the following steps are performed: S1': The control system 22 issues a command to control the first high-speed rotary motor 6 and the second high-speed rotary motor 17 to rotate at the same speed, with an initial phase difference of 180° and the same rotation direction.

[0088] S2': Spatial light modulator 10-zone loading The target surface of the spatial light modulator 10 is divided into multiple zones (e.g., 6 zones) at equal angles with the center point as the origin. Each zone is loaded with a modulation phase of a different focal shape, forming a region loaded with phase information; for example: zone 1 is loaded with a circular focal phase; zone 2 with a rectangular focal phase; zone 3 with a flat-topped spot phase; zone 4 with a ring-shaped focal phase; zone 5 with an elliptical focal phase; and zone 6 with a triangular focal phase (please refer to...). Figure 4 (b) in the middle.

[0089] S3': Light field modulation module cycles through output. The control system 22 activates the laser 1. The beam emitted by the laser 1 is expanded and collimated by the beam expander 2, and then adjusted by the first reflector 3 and the second reflector 4 before entering the light field control module through the light inlet 24. The beam is incident on the first parallel plate glass 5 at a 45° angle along the rotation center of the first parallel plate glass 5. The beam experiences a lateral translation δy1 away from the rotation center after passing through the first parallel plate glass 5. Driven by the first high-speed rotating motor 6, the beam with the lateral translation δy1 moves in a circle around the rotation center with a radius δy1 and a rotation speed r1, forming a time-sequential rotating scanning beam that sequentially scans multiple zones on the target surface of the spatial light modulator 10 (see reference). Figure 4 (b) in the middle); where, , In the formula, D1 is the thickness of the first parallel flat glass, and n1 is the refractive index of the first parallel flat glass. When the rotating beam illuminates the regions of each partition that are loaded with phase information, it is subjected to corresponding phase modulation, modulating them to carry the equivalent frame rate. A beam of phase-modulated information; among which...

[0090] In the formula, This is the refresh rate of the spatial light modulator; The modulated beam is filtered by the aperture stop 12 to remove crosstalk from the region of beam not fully phase modulated. Simultaneously, it is scaled by the 4f imaging system at a ratio of F2 / F1 and incident at a 45° angle onto the second parallel plate glass 16. The second parallel plate glass 16 rotates synchronously in the same direction, causing a lateral translation δy2 opposite to the direction of δy1. This precisely cancels out the off-axis offset caused by the scaling of the beam through the first parallel flat glass 5 and 4f imaging system, thus eliminating the off-axis offset (please refer to...). Figure 5The output propagates along the optical axis center, with a focal shape at an equivalent frame rate. A cyclically switching modulated beam; wherein, , In the formula, D2 is the thickness of the second parallel flat glass, and n2 is the refractive index of the second parallel flat glass.

[0091] In other words: Finally, the light field modulation module uses an equivalent frame rate Cyclicly switch the focus pattern of each zone output from output port 25 (e.g.: =60,000Hz, switching cycle approximately 16.7μs), output timing sequence is: circle → rectangle → flat top → ring → ellipse → triangle → circle → ...

[0092] S4': Mirror 18 scanning path planning The control system 22 plans the scanning path of the galvanometer 18 according to the processing task, and matches different processing areas with the required focal point shape. For example: Area A (circular logo marking) requires a circular focal point; Area B (text etching) requires a rectangular focal point; Area C (border cutting) requires a ring focal point.

[0093] S5': Timing Coordination Matching The control system 22 synchronizes and coordinates the optical field modulation module with the galvanometer 18 for scanning. When galvanometer 18 scans region A, the light field control module outputs a circular focal point; When galvanometer 18 scans region B, the light field control module outputs a rectangular focal point; When galvanometer 18 scans region C, the light field control module outputs a ring-shaped focal point.

[0094] In this step, since the switching cycle of the light field modulation module (16.7μs) is much smaller than the dwell time of the galvanometer 18 in each region, accurate region-morphology matching can be achieved.

[0095] S6': Complete all processing in one scan. The galvanometer 18 scans through all processing areas in a single pass. The light field control module switches the focus mode synchronously during the scanning process of the galvanometer 18, completing three different processing tasks in one go: circular logo marking, text etching, and border cutting. No need to change equipment or re-align, effectively saving processing time, improving processing efficiency, reducing errors, improving alignment accuracy, and ensuring processing consistency.

[0096] After processing, each area on sample 20 achieves the corresponding processing effect. For example, the circular logo area is marked with a circular focus, and the lines are uniform and clear; the text area is etched with a rectangular focus, and the edges are neat; the border area is cut with a ring focus, and the cut is smooth.

[0097] In summary, the laser processing system and method based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning of the present invention have the following advantages: 1. By setting up an independently packaged light field control module, the laser processing system can have both static single-mode processing and dynamic multi-mode integrated processing modes. The static single-mode processing mode is suitable for efficient batch processing of single operations, while the dynamic multi-mode integrated processing mode is suitable for complex multi-operation integrated processing. One system covers multiple application scenarios, and users can flexibly choose according to the processing task. Moreover, the two modes can be switched in real time via the control system 22, with a switching time in milliseconds, meeting the rapid changeover requirements of the production line. When the system is in static single-mode processing mode, the light field control module is locked, resulting in good system stability, high energy utilization, and a cutting speed that can reach the upper limit of the galvanometer scan, suitable for large-scale batch production of single operations, effectively improving processing efficiency. When the system is in dynamic multi-mode integrated processing mode, multiple operations such as marking, etching, and cutting can be integrated into a single scan, eliminating the switching time and repetitive alignment between operations, further improving processing efficiency while effectively saving processing time, reducing errors, improving alignment accuracy, and ensuring processing consistency.

[0098] 2. By setting up an independently packaged light field control module, the light field control module can be independently replaced and upgraded, facilitating the maintenance and technological iteration of the laser processing system. Furthermore, the light field control module is equipped with a standard inlet port 24 and outlet port 25, allowing for plug-and-play integration into the laser processing system. This facilitates system upgrades and maintenance, provides application protection for the core module, and reduces the integration difficulty of the laser processing system.

[0099] 3. The focus shape output of the light field control module is precisely synchronized with the position scanning of the galvanometer 18 through the control system 22 to achieve “region-shape” matching and give full play to the advantages of the light field control module’s ultra-high frame rate light field switching capability.

[0100] 4. The light field control module supports preset and high-speed switching of various focal point shapes such as Gaussian, flat-top, rectangular, triangular, ring, and elliptical. Moreover, in the dynamic multi-shape integrated processing mode, the focal point shape is cyclically switched to disperse energy in time and space, which greatly reduces the heat-affected zone when processing heat-sensitive materials.

[0101] 5. By setting galvanometer 18 to provide high-speed and high-precision scanning, the switching of the light field of the light field control module does not affect the beam pointing accuracy, and eliminates the accumulation of alignment errors between multiple processes, effectively improving the processing accuracy.

[0102] 6. The laser processing system is suitable for various application scenarios such as laser cutting, laser etching, laser marking, and laser drilling, and has a wide range of applications.

[0103] Any combination of various embodiments of the present invention, provided it does not violate the inventive concept of the present invention, shall be regarded as the content disclosed by the present invention; within the scope of the technical concept of the present invention, any simple modifications to the technical solution and any combination of different embodiments that do not violate the inventive concept of the present invention shall be within the protection scope of the present invention.

Claims

1. A laser processing system based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning, characterized in that, include: Laser, control system, and beam expander, optical field control module, galvanometer and field mirror arranged sequentially along the optical path; The light field control module includes a first parallel plate glass, a half-wave plate, a spatial light modulator, a first focusing lens, a multi-aperture aperture, a second focusing lens, and a second parallel plate glass arranged sequentially along the light path; The laser is used to output a laser beam; the beam expander is used to expand, collimate, and control the divergence angle of the laser beam. The first parallel flat glass is used to deviate the output beam from the rotation center; and the first parallel flat glass is coaxially mounted on a first high-speed rotating motor, which drives the first parallel flat glass to rotate at high speed around its rotation center to realize time-series rotation scanning. The half-wave plate is used to modulate the polarization direction of the beam, which is parallel to the liquid crystal orientation of the spatial light modulator; the target surface of the spatial light modulator is divided into multiple partitions at equal angles with the center point as the origin, and different phase modulation information is loaded in each partition to form different modulation regions. The front focal plane of the first focusing lens coincides with the target surface of the spatial light modulator; the front focal point of the second focusing lens coincides with the rear focal point of the first focusing lens; and the second focusing lens and the first focusing lens constitute a 4f imaging system; The aperture stop is located near the back focal plane of the first focusing lens, and the aperture stop has multiple micro-holes. The number of micro-holes is equal to the number of partitions. Each micro-hole is aligned with the focused spot of the modulation region of each partition to filter crosstalk of the beam in the region that is not fully phase modulated. The second parallel plate glass is used to convert the off-axis rotating beam into a beam propagating along the center of the optical axis; and the second parallel plate glass is coaxially mounted on a second high-speed rotating motor, which drives the second parallel plate glass to rotate at high speed around its rotation center. The galvanometer is used to achieve high-speed scanning within the processing area of ​​the field lens; the field lens is used to focus the light beam onto the surface of the sample. The control system is electrically connected to the laser, the first high-speed rotating motor, the second high-speed rotating motor, the spatial light modulator, and the galvanometer.

2. The laser processing system based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning as described in claim 1, characterized in that: The light field control module has two working modes: a static single-form processing mode and a dynamic multi-form integrated processing mode. In the static single-form processing mode, the first high-speed rotating motor and the second high-speed rotating motor are locked at a fixed angle, and the first parallel flat glass and the second parallel flat glass remain stationary. In the dynamic multi-form integrated processing mode, the first high-speed rotating motor and the second high-speed rotating motor rotate at the same speed, with an initial phase difference of 180° and the same rotation direction.

3. The laser processing system based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning as described in claim 1, characterized in that: The front focal plane of the field lens coincides with the center of the output optical axis of the light field control module; and the front focal point of the field lens is located at the center of the X-axis and Y-axis mirrors of the galvanometer.

4. The laser processing system based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning as described in claim 1, characterized in that: The light field control module also includes a sealed housing, in which the first parallel plate glass, the half-wave plate, the spatial light modulator, the first focusing lens, the multi-aperture, the second focusing lens, and the second parallel plate glass are arranged sequentially along the optical path within the sealed housing.

5. The laser processing system based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning as described in claim 4, characterized in that: The sealed housing is provided with a light inlet, a light outlet, an electrical interface, a gas interface, and a water interface. The light inlet is used to receive the laser beam and align the incident beam with the rotation center of the first parallel flat glass. The light outlet is used to output a modulated beam that propagates along the optical axis center and switches phase at high speed. The electrical interface is used to provide the spatial light modulator control signal input, the drive of the first high-speed rotating motor and the second high-speed rotating motor, and the phase feedback signal interface. The gas interface is used to introduce positive pressure clean and dry gas into the sealed housing. The water interface is used to introduce circulating cooling water to cool the first high-speed rotating motor and the second high-speed rotating motor.

6. The laser processing system based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning as described in claim 5, characterized in that: It also includes a first reflecting mirror and a second reflecting mirror arranged along the optical path between the beam expander and the first parallel plate glass. The first reflecting mirror and the second reflecting mirror are used to adjust the transmission direction of the beam so that the beam is perpendicularly incident on the light inlet and incident on the first parallel plate glass at a 45° angle along the rotation center of the first parallel plate glass.

7. The laser processing system based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning as described in claim 1, characterized in that: The light field modulation module further includes a third and a fourth reflecting mirror arranged along the light path between the first parallel flat glass and the half-wave plate. The third and fourth reflecting mirrors are used to adjust the transmission direction of the light beam so that the light beam illuminates the target surface of the spatial light modulator at a preset angle.

8. The laser processing system based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning as described in claim 1, characterized in that: The light field control module further includes a fifth and a sixth reflecting mirror arranged along the light path between the second focusing mirror and the second parallel plate glass. The fifth and sixth reflecting mirrors are used to adjust the transmission direction of the light beam so that the light beam enters the second parallel plate glass at a 45° angle and exits along the rotation center of the second parallel plate glass.

9. A laser processing method, characterized in that... The laser processing system based on a dynamic optical field of temporal rotation scanning and spatial phase partitioning as described in any one of claims 1 to 8 includes the following steps: The control system issues a command to select either a static single-mode machining mode or a dynamic multi-mode integrated machining mode. When the dynamic multi-form integrated processing mode is selected, the following steps are performed: S1': The control system issues a command to control the first high-speed rotary motor and the second high-speed rotary motor to rotate at the same speed, with an initial phase difference of 180° and the same direction of rotation. S2': The target surface of the spatial light modulator is divided into multiple partitions at equal angles with the center point as the origin. Each partition is loaded with a modulation phase of different focal shape, forming a region loaded with phase information. S3': The control system activates the laser. The laser beam is expanded and collimated by a beam expander before entering the optical field control module. It is incident on the first parallel plate glass at a 45° angle along the rotation center. The beam experiences a lateral translation δy1 away from the rotation center. Driven by a first high-speed rotating motor, the beam with the lateral translation δy1 moves in a circle around the rotation center with a radius δy1 and a rotation speed r1, forming a time-sequential rotating scanning beam that sequentially scans multiple zones on the target surface of the spatial light modulator. , In the formula, D1 is the thickness of the first parallel flat glass, and n1 is the refractive index of the first parallel flat glass. When the rotating beam illuminates the regions of each partition that are loaded with phase information, it is subjected to corresponding phase modulation, modulating them to carry the equivalent frame rate. A beam of phase-modulated information; among which... In the formula, R is the refresh rate (Hz) of the spatial light modulator; N is the number of target partitions of the spatial light modulator; and r1 is the rotational speed (rps) of the first high-speed rotating motor. The modulated beam is filtered by a multi-aperture to remove crosstalk from the region where the phase modulation was not complete. Simultaneously, it is scaled by a 4f imaging system at a ratio of F2 / F1 and incident at a 45° angle onto a second parallel plate. The beam rotates synchronously and in the same direction through the second parallel plate, causing a lateral translation δy2 opposite to the direction of δy1. Eliminate off-axis offset, and output propagates along the optical axis center at an equivalent frame rate. The focus pattern of each zone in a loop; among them, ， In the formula, D2 is the thickness of the second parallel plate glass, n2 is the refractive index of the second parallel plate glass; F1 is the focal length of the first focusing lens, and F2 is the focal length of the second focusing lens. S4': The control system plans the scanning path of the galvanometer according to the processing task, and matches different processing areas with the required focal point shape; S5': The control system synchronously coordinates the optical field modulation module and the galvanometer scanning to complete the timing coordination matching; S6': The galvanometer scans through all processing areas in a single scan, and the light field control module switches the focus mode synchronously during the galvanometer scan, completing multiple processing tasks of different forms at once.

10. The laser processing method as described in claim 9, characterized in that: When the static single-mode processing mode is selected, the following steps are performed: S1: The control system controls the first high-speed rotating motor and the second high-speed rotating motor to lock at any fixed angle simultaneously, so that the first parallel flat glass and the second parallel flat glass remain stationary. S2: The control system selects the single focal phase corresponding to the spatial light modulator for loading according to the processing task requirements; S3: The light field control module outputs a stable single-focus pattern; S4: The control system controls the galvanometer to scan at high speed within the processing area of ​​the field lens, guiding the stable focal point to the predetermined processing position of the sample; S5: The field lens focuses the light beam onto the surface of the sample, forming a micron-scale focal spot, enabling efficient cutting or precision etching.

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