Package and packaging system employing the same

Abstract

The application provides a package and a packaging system, high-density three-dimensional integration is realized by vertically stacking the processing chip and the radio frequency chip, the physical volume and complexity of the packaging system are significantly reduced, the processing chip and the radio frequency chip are vertically interconnected through the conductive column in the substrate, the interconnection length is significantly shortened, signal transmission delay and energy loss are reduced, and system reliability is enhanced. The package and the packaging system provided by the application also utilize the first electromagnetic guide wall extending around the radiation unit and along the electromagnetic wave transmission path to form a controlled waveguide channel, effectively guiding the radio frequency signal to be directionally radiated or received from the radiation unit, suppressing signal leakage and inter-channel crosstalk, thereby reducing interconnection loss and improving signal integrity.

Description

Technical Field

[0001] This invention relates to the field of antenna packaging, and more particularly to a package and a packaging system using the package. Background Technology

[0002] In the field of antenna packaging, the Launcher-in-Package (LIP) is an advanced structure that integrates the high-frequency signal transmitting unit (i.e., coupler) within the chip package to achieve efficient signal coupling and transmission from the chip to the antenna. This technology is mainly used in high-frequency bands such as millimeter waves. By combining waveguide antennas with the in-package transmitter, it aims to shorten the signal transmission path, reduce transmission loss, and reduce dependence on the high-frequency performance of the motherboard (PCB) materials, thereby improving system performance while controlling overall cost and size.

[0003] However, existing LIP technology still lays out and connects the RF chip module and other core functional modules as discrete units. This discrete architecture not only increases the physical size and complexity of the system, but also introduces additional signal interconnection losses and potential reliability risks, limiting its application.

[0004] Therefore, reducing the physical size and complexity of packaging systems, as well as reducing signal interconnection losses and potential reliability risks, has become one of the key research focuses. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a package and a packaging system using the package, which can reduce the physical volume and complexity of the packaging system, as well as reduce signal interconnection loss and potential reliability risks.

[0006] To address the above problems, the present invention provides a package comprising: A substrate includes a carrier, conductive pillars, and conductive lines. The carrier includes a first surface and a second surface disposed opposite to each other. The conductive pillars penetrate the carrier in a direction perpendicular to the first surface of the carrier. The conductive lines are disposed on the first surface of the carrier and / or disposed within the carrier. An radio frequency chip is disposed on the first surface of the carrier; A processing chip is disposed on the second surface of the carrier and is vertically interconnected with the radio frequency chip through the conductive pillars; A radiation unit is disposed on the first surface or the second surface of the carrier and interconnected with the radio frequency chip through the conductive line; A first electromagnetic guide wall is disposed around the periphery of the radiation unit on the first surface or the second surface of the carrier, and the first electromagnetic guide wall extends along the electromagnetic wave transmission path of the radiation unit. A molding compound covers the substrate, the radio frequency chip, the processing chip, the radiating unit, and the first electromagnetic guide wall, wherein the end of the first electromagnetic guide wall facing away from the substrate is flush with or protrudes from the surface of the molding compound.

[0007] In one embodiment, when the radiating element is disposed on the second surface of the carrier, the conductive line includes: A first interconnect line is disposed on the first surface of the carrier or within the carrier, extends in a direction parallel to the first surface of the carrier, and is electrically connected to the radio frequency chip. A second interconnecting line is disposed within the carrier and extends in a direction perpendicular to the first surface of the carrier. One end of the second interconnecting line is electrically connected to the first interconnecting line, and the other end is electrically connected to the radiating unit.

[0008] In one embodiment, the substrate further includes a grounded electromagnetic shielding wall disposed within the carrier and surrounding the second interconnect.

[0009] In one embodiment, the electromagnetic shielding wall is grounded via a grounding line within the carrier.

[0010] In one embodiment, the first electromagnetic guide wall is disposed on the second surface of the carrier and extends into the carrier, with the extended area serving as the electromagnetic shielding wall.

[0011] In one embodiment, the electromagnetic shielding wall is composed of a plurality of metal pillars arranged in a direction surrounding the outer periphery of the second interconnect line according to a predetermined rule.

[0012] In one embodiment, the package further includes: A conductive bump is disposed on a first surface or a second surface of the carrier, the encapsulation covers the conductive bump, and one end of the conductive bump facing away from the carrier is exposed on the surface of the encapsulation. An external connection block is disposed on the surface of the encapsulation body and is electrically connected to the conductive bump.

[0013] In one embodiment, when both the radiating unit and the conductive bump are disposed on the first or second surface of the carrier, a plurality of the conductive bumps are disposed in a direction surrounding the radiating unit according to a set rule, so as to serve as the first electromagnetic guide wall.

[0014] In one embodiment, a plurality of the external connection blocks are arranged according to a set rule to serve as a second electromagnetic guide wall.

[0015] In one embodiment, the external connection block is a solder ball.

[0016] In one embodiment, when both the radiating element and the conductive bump are disposed on the first surface of the carrier, or when both the radiating element and the conductive bump are disposed on the second surface of the carrier, the conductive bump is located outside the area defined by the first electromagnetic guide wall in a direction parallel to the first surface of the carrier.

[0017] In one embodiment, a plurality of the conductive bumps are arranged in a direction surrounding the first electromagnetic guide wall according to a set rule, as a supplementary electromagnetic shielding wall.

[0018] In one embodiment, the first electromagnetic guide wall is composed of a plurality of metal pillars arranged in a direction surrounding the radiation unit according to a set rule.

[0019] In one embodiment, the surface of the radio frequency chip facing away from the substrate is exposed to the surface of the encapsulation.

[0020] In one embodiment, the surface of the processing chip facing away from the substrate is exposed to the surface of the molding compound.

[0021] In one embodiment, the processing chip and the radio frequency chip are positioned opposite each other in a direction perpendicular to the first surface of the substrate.

[0022] In one embodiment, the radio frequency chip is a millimeter-wave chip.

[0023] In one embodiment, the processing chip is a field-programmable gate array (FPGA) chip.

[0024] In one embodiment, the conductive post is a through-silicon via (TSV).

[0025] To address the aforementioned technical problems, embodiments of the present invention also provide a packaging system, including the packaging body as described above.

[0026] In one embodiment, the packaging system further includes: Carrier plate; The package is disposed on the upper surface of the carrier plate; A waveguide antenna is aligned with the radiating element of the package to form a continuous electromagnetic wave transmission channel.

[0027] In one embodiment, the electromagnetic wave transmission direction of the radiating unit of the package is away from the carrier plate, and the waveguide antenna is disposed on the surface of the package away from the carrier plate. The waveguide antenna includes a waveguide cavity, which is aligned with the area enclosed by the first electromagnetic guide wall to jointly form the electromagnetic wave transmission channel.

[0028] In one embodiment, the packaging system further includes a mechanical support member located around the periphery of the package and disposed between the waveguide antenna and the carrier plate, for supporting the waveguide antenna.

[0029] In one embodiment, the electromagnetic wave transmission direction of the radiating unit of the package is toward the carrier plate, and the waveguide antenna is disposed on the surface of the carrier plate away from the package. The carrier plate includes a waveguide transition cavity, the waveguide antenna includes a waveguide cavity, the waveguide transition cavity is aligned with the area enclosed by the first electromagnetic guide wall, and the waveguide cavity and the waveguide transition cavity are aligned to jointly form the electromagnetic wave transmission channel.

[0030] In one embodiment, the inner wall of the waveguide transition cavity has an electromagnetic wave reflecting layer.

[0031] In one embodiment, the packaging system further includes a heat dissipation component disposed on the surface of the package body opposite to the carrier plate.

[0032] In one embodiment, the inner wall of the waveguide cavity has an electromagnetic wave reflecting layer.

[0033] In one embodiment, the package is soldered to the carrier plate via an external connection block and is electrically connected to the carrier plate via the external connection block.

[0034] In one embodiment, the carrier plate is an FR-4 carrier plate.

[0035] The above technical solution achieves high-density three-dimensional integration by vertically stacking the processing chip and the RF chip, significantly reducing the physical volume and complexity of the packaging system. Furthermore, the processing chip and the RF chip are vertically interconnected via conductive pillars within the substrate, significantly shortening the interconnection length, reducing signal transmission delay and energy loss, and enhancing system reliability. The package and packaging system provided in this embodiment also utilize a first electromagnetic guiding wall surrounding the radiating unit and extending along the electromagnetic wave transmission path to form a controlled waveguide channel, effectively guiding the RF signal to be directionally radiated or received from the radiating unit, suppressing signal leakage and inter-channel crosstalk, thereby reducing interconnection loss and improving signal integrity.

[0036] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit the invention. Techniques, methods, and apparatus known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and apparatus should be considered part of the specification. Attached Figure Description

[0037] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0038] Figure 1A This is a cross-sectional schematic diagram of the package provided in the first embodiment of the present invention; Figure 1B This is a top view schematic diagram of the package provided in the first embodiment of the present invention; Figure 2 This is a cross-sectional schematic diagram of the package provided in the second embodiment of the present invention; Figure 3 This is a cross-sectional schematic diagram of the package provided in the third embodiment of the present invention; Figure 4 This is a cross-sectional schematic diagram of the package provided in the fourth embodiment of the present invention; Figure 5 This is a cross-sectional schematic diagram of the package provided in the fifth embodiment of the present invention; Figure 6 This is a cross-sectional schematic diagram of the package provided in the sixth embodiment of the present invention; Figure 7 This is a cross-sectional schematic diagram of the package provided in the seventh embodiment of the present invention; Figure 8 This is a cross-sectional schematic diagram of the package provided in the eighth embodiment of the present invention; Figure 9 This is a cross-sectional schematic diagram of the packaging system provided in the ninth embodiment of the present invention; Figure 10 This is a cross-sectional schematic diagram of the packaging system provided in the tenth embodiment of the present invention; Figure 11 This is a cross-sectional schematic diagram of the packaging system provided in the eleventh embodiment of the present invention; Figure 12 This is a cross-sectional schematic diagram of the packaging system provided in the twelfth embodiment of the present invention.

[0039] Explanation of reference numerals in the attached figures: 100 substrates 101 carrier 101A First Surface 101B Second Surface 102 conductive pillars 103 conductive circuit 1031 First Interconnect 1032 Second Interconnect 110 RF chip 120 processing chip 130 radiation units 140 First Electromagnetic Guide Wall 150 molded body 160 conductive bump 170 external connection block 180 electromagnetic shielding wall 200 carrier board 201 waveguide transition cavity 202, 222 Electromagnetic wave reflector layer 210 package 220 waveguide antenna 221 waveguide cavity 230 Mechanical Support Components 240 heat dissipation components. Detailed Implementation

[0040] The technical solutions in the embodiments of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] Figure 1A This is a cross-sectional schematic diagram of the package provided in the first embodiment of the present invention. Figure 1B This is a top view schematic diagram of the package provided in the first embodiment of the present invention, as shown below. Figure 1A and Figure 1BAs shown, the package includes: a substrate 100, including a carrier 101, conductive pillars 102, and conductive lines 103. The carrier 101 includes a first surface 101A and a second surface 101B disposed opposite to each other. In a direction perpendicular to the first surface 101A of the carrier 101 (direction D1), the conductive pillars 102 penetrate the carrier 101, and the conductive lines 103 are disposed on the first surface 101A of the carrier 101 and / or disposed within the carrier 101; an RF chip 110 disposed on the first surface 101A of the carrier 101; a processing chip 120 disposed on the second surface 101B of the carrier 101 and perpendicularly interconnected with the RF chip 110 through the conductive pillars 102; and a radiation unit 130 disposed on... The first surface 101A or the second surface 101B of the carrier 101 is interconnected with the radio frequency chip 110 through the conductive line 103; a first electromagnetic guide wall 140 is disposed around the periphery of the radiation unit 130 on the first surface 101A or the second surface 101B of the carrier 101, and the first electromagnetic guide wall 140 extends along the electromagnetic wave transmission path of the radiation unit 130; a molding compound 150 covers the substrate 100, the radio frequency chip 110, the processing chip 120, the radiation unit 130, and the first electromagnetic guide wall 140, and the end of the first electromagnetic guide wall 140 facing away from the substrate 100 is flush with or protrudes from the surface of the molding compound 150. Wherein, in Figure 1B The conductive line 103 and the radiating unit 130 are shown in dashed lines.

[0042] The package provided in this embodiment of the invention achieves high-density three-dimensional integration by vertically stacking the processing chip 120 and the radio frequency chip 110, significantly reducing the physical volume and complexity of the packaging system using the package. Furthermore, the processing chip 120 and the radio frequency chip 110 are vertically interconnected via the conductive pillars 102 within the substrate 100, significantly shortening the interconnection length, reducing signal transmission delay and energy loss, and enhancing the reliability of the package. The package provided in this embodiment of the invention also utilizes the first electromagnetic guide wall 140 surrounding the radiating unit 130 and extending along the electromagnetic wave transmission path to form a controlled waveguide channel, effectively guiding the radio frequency signal to be directionally radiated or received from the radiating unit 130, suppressing electromagnetic signal leakage and inter-channel crosstalk, thereby reducing interconnection loss and improving signal integrity.

[0043] The carrier 101 serves as the basic support structure of the substrate 100, and its materials include organic resins (such as epoxy resin or polytetrafluoroethylene), silicon, glass, and ceramics (such as alumina Al2O3 or aluminum nitride AlN). The carrier 101 includes a first surface 101A and a second surface 101B disposed opposite to each other. In this embodiment, the upper surface of the carrier 101 is defined as the first surface 101A of the carrier 101, and the lower surface of the carrier 101 is defined as the second surface 101B of the carrier 101.

[0044] The conductive post 102 serves as a vertical electrical interconnect structure of the substrate 100, penetrating the carrier 101 in a direction perpendicular to the first surface 101A of the carrier 101, and is used to realize a three-dimensional electrical connection between the radio frequency chip 110 and the processing chip 120. The direction perpendicular to the first surface 101A of the carrier 101 is as follows: Figure 1A and Figure 1B In some embodiments, the conductive post 102 is a through-silicon via (TSV), which comprises, from the inside out, a conductive filling layer, an insulating layer, and a barrier layer. The conductive filling layer is made of copper or silicon germanide to provide good conductivity; the insulating layer is made of silicon dioxide or silicon nitride to ensure electrical isolation between the conductive post 102 and the carrier 101; the barrier layer is made of materials such as tantalum, tantalum nitride, or titanium to prevent conductive materials from diffusing into the carrier 101 and to enhance interlayer adhesion.

[0045] The conductive line 103 serves as an interconnect structure for high-frequency signal transmission between the radiating unit 130 and the RF chip 110. It is formed by being disposed on the first surface 101A of the carrier 101 and / or embedded within the carrier 101, creating a fine conductor pattern including microstrip lines, coplanar waveguides, or redistribution layers. The conductive line 103 is made of low-resistivity metal materials such as copper or aluminum and is fabricated using a semi-additive method or electroplating process to achieve sub-micron linewidth accuracy, thereby ensuring signal integrity in the millimeter-wave band. In some embodiments, the design parameters of the conductive line 103 are strictly controlled to achieve characteristic impedance matching. Simultaneously, an insulating dielectric layer with controllable dielectric constant isolates the conductive line 103 from adjacent lines or ground layers, effectively reducing insertion loss and electromagnetic crosstalk. Ultimately, a high-density, low-loss two-dimensional or three-dimensional electrical path is constructed within the substrate 100, providing an efficient and reliable connection between the RF front-end and the antenna unit. In this embodiment, the conductive line 103 is disposed on the first surface 101A of the carrier 101 as an example.

[0046] The radio frequency (RF) chip 110 serves as an RF signal processing unit within the package. In some embodiments, the RF chip 110 modulates and amplifies the baseband signal to be transmitted to a specific frequency band via an internally integrated power amplifier, driving the radiation unit 130 to radiate electromagnetic waves via the conductive line 103. Simultaneously, the RF chip 110 also receives and amplifies the weak RF signal coupled by the radiation unit 130, converts it into a baseband signal after down-conversion and demodulation, and transmits it to the processing chip 120 for subsequent calculations. In some embodiments, the RF chip 110 is a millimeter-wave chip, operating in the millimeter-wave range of 24 GHz to 100 GHz, and is implemented using silicon-based CMOS or germanium-silicon BiCMOS processes for high-density integration.

[0047] In some embodiments, the RF chip 110 is flip-chipped onto the first surface 101A of the carrier 101 via a conductive structure. The conductive structure includes one or more of solder bumps, copper pillar bumps, or gold bumps formed on the active surface of the RF chip 110. The bumps are electrically and mechanically connected to the corresponding pads on the first surface 101A of the carrier 101 through a reflow soldering process or a thermo-mechanical pressing process. At the same time, the gap between the RF chip 110 and the carrier 101 is filled with underfill adhesive to enhance connection reliability and resist thermo-mechanical stress. This flip-chip connection method significantly shortens the interconnect length, reduces parasitic inductance and resistance, and is beneficial for improving the integrity of RF signal transmission and achieving high-density integration.

[0048] The processing chip 120, acting as a processor, performs functions such as baseband signal modulation and demodulation, protocol stack control, and real-time task scheduling within the package. It can encode, decode, perform beamforming calculations, and correct errors for the baseband signals transmitted by the RF chip 110, and coordinate data conversion and transmission between the physical layer and higher-layer protocols according to communication protocol requirements. Simultaneously, the processing chip 120 achieves low-latency vertical interconnection with the RF chip 110 through the conductive pillars 102 in the substrate 100, significantly shortening the signal transmission path to reduce interconnection losses and power consumption. Furthermore, its programmable logic dynamically configures RF front-end parameters to support multi-band adaptive communication and beam scanning, thereby achieving efficient computing power collaboration and system-level functional reconfiguration within a heterogeneous integrated package. In some embodiments, the processing chip 120 is a field-programmable gate array (FPGA) chip, which includes configurable logic blocks (CLBs), lookup tables (LUTs), and programmable interconnect networks. It can implement customized digital signal processing algorithms, protocol control, and system scheduling functions through hardware description language programming, and use its hardware parallel processing capabilities to perform real-time, high-speed calculations on the data stream transmitted by the RF chip 110, thereby improving the overall system throughput and reconfiguration flexibility.

[0049] The processing chip 120 is disposed on the second surface 101B of the carrier 101. In some embodiments, the processing chip 120 is flip-chip mounted on the second surface 101B of the carrier 101 via a conductive structure. The conductive structure includes one of solder bumps, copper pillar bumps, or gold bumps, and achieves mechanical and electrical connection with corresponding pads on the carrier 101 through reflow soldering or thermoforming processes. Simultaneously, bottom filler is filled in the gap between the processing chip 120 and the carrier 101 to enhance connection reliability and resist thermomechanical stress. The flip-chip connection of the processing chip 120 supports high-density three-dimensional integration with the RF chip 110 in the direction perpendicular to the first surface 101A of the carrier 101, thereby optimizing the overall system power consumption and performance.

[0050] The processing chip 120 is vertically interconnected with the radio frequency chip 110 via the conductive post 102. Specifically, in some embodiments, the conductive structure of the processing chip 120 is electrically connected to one end of the conductive post 102, and the conductive structure of the radio frequency chip 110 is electrically connected to the other end of the conductive post 102, thereby achieving the vertical interconnection between the processing chip 120 and the radio frequency chip 110.

[0051] In some embodiments, the processing chip 120 and the radio frequency chip 110 are positioned opposite each other in a direction perpendicular to the first surface 101A of the substrate 100 (direction D1). Specifically, the functional areas of the processing chip 120 and the radio frequency chip 110 precisely overlap in vertical projection, minimizing the length of the interconnect conductive path, significantly reducing signal transmission delay and parasitic inductance-capacitance effects, thereby improving the efficiency of high-speed data synchronization processing and reducing overall power consumption. The opposite positioning of the processing chip 120 and the radio frequency chip 110 also forms a compact integration in the vertical direction, further reducing the size of the package in the horizontal direction, which is beneficial for achieving high-density system-in-package.

[0052] The radiating element 130 (lunch pad) is a component of the antenna. In the transmitting state, it converts the high-frequency current signal from the feed line into an electromagnetic wave signal and radiates it into space. In the receiving state, it converts the electromagnetic wave signal in space back into a current signal in the transmission line, thereby realizing the mutual conversion between electrical signals and electromagnetic wave energy. In some embodiments, the number of radiating elements 130 is two or more. When there are two, they are used for transmitting and receiving respectively to achieve full-duplex communication; when there are more than two, they are used to form a multi-channel transceiver antenna array.

[0053] The radiating unit 130 is disposed on the first surface 101A or the second surface 101B of the carrier 101 and interconnected with the radio frequency chip 110 through the conductive line 103. In this embodiment, the radiating unit 130 is disposed on the first surface 101A of the carrier 101, that is, the radiating unit 130 and the radio frequency chip 110 are disposed on the same surface of the carrier 101, which shortens the signal transmission path between the radio frequency chip 110 and the radiating unit 130, effectively reduces the parasitic inductance and transmission loss introduced by the interconnection, and improves the integrity of high-frequency signal transmission and the overall radiation efficiency of the antenna system.

[0054] The first electromagnetic guide wall 140 is disposed around the periphery of the radiating unit 130 on the first surface 101A or the second surface 101B of the carrier 101, and the first electromagnetic guide wall 140 extends along the electromagnetic wave transmission path of the radiating unit 130. That is, the first electromagnetic guide wall 140 and the radiating unit 130 are disposed on the same surface of the carrier 101, and their positions correspond to those of the radiating unit 130, thereby constructing a guiding structure that matches the waveguide antenna 220 in three-dimensional space. In this embodiment, both the first electromagnetic guide wall 140 and the radiating unit 130 are disposed on the first surface 101A of the carrier 101.

[0055] The first electromagnetic guide wall 140 utilizes the reflection and guidance characteristics of metal conductors to constrain the electromagnetic wave signals of the radiation unit 130 within a preset path for directional transmission towards the target direction or for directional reception of electromagnetic wave signals emitted in the target direction (such as waveguide antenna) within a preset path. This effectively suppresses the leakage of electromagnetic wave signals to the surroundings and crosstalk (i.e., electromagnetic interference) between different channels, reduces energy loss, and ultimately ensures the integrity of high-frequency signal transmission and the electromagnetic compatibility of the system.

[0056] In some embodiments, the first electromagnetic guide wall 140 is formed by a plurality of metal pillars arranged in a direction surrounding the radiating unit 130 according to a predetermined rule. The predetermined rule refers to the plurality of metal pillars forming the first electromagnetic guide wall 140 according to wavelength theory. That is, the spacing, shape, size, and overall layout of the plurality of metal pillars must follow the wavelength (λ) theory of electromagnetic wave propagation in the molding compound. Specifically, the spacing between the centers of adjacent metal pillars is typically set to be less than or equal to half the wavelength corresponding to the center frequency of the operating frequency band of the RF chip 110 (≤λ / 2) to effectively suppress electromagnetic wave leakage in a specific frequency band and form an electromagnetic bandgap (EBG) structure, thereby constructing a continuous electromagnetic shielding boundary around the radiating unit 130. In some embodiments, the cross-sectional shape of the metal pillars can be circular, rectangular, or cross-shaped, with its diameter or side length optimized within the range of 20μm to 50μm. In some embodiments, the overall arrangement of the metal pillars includes a single row of closely spaced pillars or multiple rows of staggered pillars. This periodic arrangement can guide electromagnetic waves to propagate along a predetermined path and significantly suppress energy leakage and crosstalk between adjacent channels.

[0057] The molding compound 150 encapsulates the substrate 100, the radio frequency chip 110, the processing chip 120, the radiating unit 130, and the first electromagnetic guide wall 140. Specifically, the molding compound 150, through its insulating resin matrix, encapsulates all internal components such as the substrate 100, the radio frequency chip 110, the processing chip 120, the radiating unit 130, and the first electromagnetic guide wall 140, providing mechanical support and protection for the entire package and shielding it from external environmental factors such as moisture and dust.

[0058] If the height of the first electromagnetic guide wall 140 is insufficient, its top end will be deeply embedded inside the encapsulation 150, causing significant leakage of electromagnetic energy at the assembly gap between the package and the antenna, thereby increasing insertion loss and causing inter-channel crosstalk. In the packaging structure provided by this embodiment, the end of the first electromagnetic guide wall 140 facing away from the substrate 100 is flush with or protrudes from the surface of the encapsulation 150, so that the top end of the first electromagnetic guide wall 140 can achieve reliable electrical contact or close-range efficient coupling with the cavity wall of the external waveguide antenna 220. This ensures that the first electromagnetic guide wall 140 can serve as an effective electromagnetic boundary extension structure, forming a complete, continuous, and impedance-controllable electromagnetic shielding cavity when the package and the external waveguide antenna 220 are assembled. This allows for precise guidance of high-frequency electromagnetic waves along a preset path for directional transmission, effectively suppressing signal energy leakage and inter-channel crosstalk, thereby ensuring the integrity of signal transmission.

[0059] Furthermore, by making the end of the first electromagnetic guide wall 140 at least flush with the surface of the molding compound 150, a clear physical reference plane can be provided for the integration of the packaging system, which facilitates the precise alignment and installation of the waveguide antenna. At the same time, it is also beneficial to take advantage of the hardness difference between the metal and the molding compound during the manufacturing process to naturally form an interface for connection with the external structure, thereby improving process stability and packaging reliability.

[0060] In some embodiments, the surface of the RF chip 110 facing away from the substrate 100 is exposed on the surface of the molding compound 150. For example, the back surface of the RF chip 110 is flush with the upper surface of the molding compound 150. The surface of the RF chip 110 facing away from the substrate 100 directly serves as a heat dissipation interface, thereby efficiently dissipating the heat generated by the RF chip 110 during operation, effectively reducing the junction temperature of the RF chip 110, and improving the reliability and long-term stability of the package under high power loads.

[0061] In some embodiments, the surface of the processing chip 120 facing away from the substrate 100 is exposed on the surface of the molding compound 150. For example, the back surface of the processing chip 120 is flush with the lower surface of the molding compound 150. The surface of the processing chip 120 facing away from the substrate 100 directly serves as a heat dissipation interface, thereby efficiently dissipating the heat generated by the processing chip 120 during operation, effectively reducing the junction temperature of the processing chip 120, and improving the reliability and long-term stability of the package under high power loads.

[0062] In some embodiments, the package further includes conductive bumps 160 and external connection blocks 170. The conductive bumps 160 are electrically connected to the RF chip 110 and the processing chip 120 through redistribution layers or wires distributed inside the molding compound 150, and are connected to an external carrier board or system motherboard via the external connection blocks 170 to achieve power distribution, signal transmission and grounding connection, thereby completing the stable and reliable external electrical interconnection of the package.

[0063] Specifically, the conductive bump 160 is disposed on the first surface 101A or the second surface 101B of the carrier 101 and is electrically connected to the carrier 101. The encapsulation body 150 covers the conductive bump 160, and one end of the conductive bump 160 facing away from the carrier 101 is exposed on the surface of the encapsulation body 150. In this embodiment, the conductive bump 160 is disposed on the second surface 101B of the carrier 101 as an example. The conductive bump 160 can be designed into various structures such as columnar or block shapes according to interconnection requirements, and the material of the conductive bump 160 includes highly conductive metals such as copper and gold.

[0064] In some embodiments, the conductive bumps 160, in addition to providing electrical interconnection, can also serve as efficient heat dissipation channels for the substrate 100. They can rapidly conduct the heat generated by the substrate 100 and the RF chip 110 and processing chip 120 during operation to the external connection block 170, and then dissipate it to the external environment through heat dissipation paths on an external carrier board or system motherboard (such as a ground plane or a dedicated heatsink). By utilizing existing interconnect systems for thermal management, the package reduces the need for additional heat dissipation structures, contributing to improved overall package power density and reliability.

[0065] The external connection block 170 is disposed on the surface of the molding compound 150 and electrically connected to the conductive bump 160. It serves as an electrical interface and mechanical connection point between the package and an external system, used for transmitting high-speed signals, distributing power, and providing a grounding path. Simultaneously, its array arrangement enhances the structural stability between the package and the carrier board and assists in heat dissipation. In this embodiment, the external connection block 170 is described as being disposed on the lower surface of the molding compound 150.

[0066] In some embodiments, the external connection block 170 is a spherical or near-spherical structure, made of lead-free solder alloys such as tin-silver-copper or high-lead solder to meet conductivity, thermal fatigue resistance, and environmental protection requirements. Through its own shaping ability, it forms stable solder joints during the welding process, thereby ensuring the long-term electrical interconnection integrity and mechanical support strength of the package under harsh operating conditions. In this embodiment, the external connection block 170 is a solder ball; specifically, it is a solder ball.

[0067] In the first embodiment, the upper surface of the carrier 101 is defined as its first surface 101A and the lower surface as its second surface 101B. At this time, the radiation unit 130, the radio frequency chip 110 and the first electromagnetic guide wall 140 are disposed on the upper surface (first surface 101A), while the processing chip 120 and the conductive bump 160 are disposed on the lower surface (second surface 101B), and the external connection block 170 is located on the lower surface of the encapsulation body 150.

[0068] The present invention also provides a second embodiment with a layout opposite to the first embodiment, wherein the lower surface of the carrier 101 is defined as its first surface 101A and the upper surface as its second surface 101B. Accordingly, the radiation unit 130, the radio frequency chip 110, and the first electromagnetic guide wall 140 are disposed on the lower surface (first surface 101A), while the processing chip 120 is disposed on the upper surface (second surface 101B). Furthermore, the conductive bump 160 is still disposed on the lower surface (first surface 101A) of the carrier 101, and the external connection block 170 is still located on the lower surface of the encapsulation body 150.

[0069] Specifically, such as Figure 2 The diagram shows a cross-sectional view of the package provided in the second embodiment of the present invention. In the second embodiment, the lower surface of the carrier 101 is defined as its first surface 101A, and the upper surface is defined as its second surface 101B. The radiating unit 130, the radio frequency chip 110, and the conductive bump 160 are disposed on the lower surface (first surface 101A) of the carrier 101. The conductive lines 103 of the substrate 100 are disposed on the lower surface (first surface 101A) of the carrier 101 to realize high-frequency signal transmission between the radiating unit 130 and the radio frequency chip 110. The processing chip 120 is disposed on the upper surface (second surface 101B) of the carrier 101, and the processing chip 120 and the radio frequency chip 110 are electrically connected through the conductive post 102 penetrating the carrier 101.

[0070] In the second embodiment, the radiating unit 130 and the conductive bumps 160 are both disposed on the same surface (i.e., the first surface 101A) of the carrier 101. Furthermore, multiple conductive bumps 160 are arranged according to a set rule along the direction surrounding the radiating unit 130, thereby jointly forming an electromagnetic guiding structure surrounding the radiating unit 130, serving as the first electromagnetic guiding wall 140, achieving functional reuse of electrical interconnection and electromagnetic guidance. The set rule refers to the multiple conductive bumps 160 being arranged according to wavelength theory, thus serving as the first electromagnetic guiding wall 140. That is, the spacing, shape, size, and overall layout of the multiple conductive bumps 160 must follow the wavelength (λ) theory of electromagnetic wave propagation in the molding compound. Specifically, the center-to-center spacing of adjacent conductive bumps 160 is typically set to be less than or equal to half the wavelength corresponding to the center frequency of the operating frequency band of the RF chip 110 (≤λ / 2), to effectively suppress electromagnetic wave leakage in a specific frequency band and form an electromagnetic bandgap structure, thereby constructing a continuous electromagnetic shielding boundary around the radiating unit 130. The conductive line 103 passes through the gap between two adjacent conductive bumps 160.

[0071] In the second embodiment, the external connection block 170 is disposed on the lower surface of the molding compound 150 and electrically connected to the conductive bump 160, serving as an electrical interface and mechanical connection point between the package and the external carrier. When the package is mounted on the carrier, there is an assembly gap between the lower surface of the molding compound 150 and the upper surface of the carrier. The external connection block 170 is located within this gap to achieve electrical connection. However, this gap area lacks an electromagnetic guiding structure, which can easily cause signal leakage. Therefore, the second embodiment of the present invention arranges multiple external connection blocks 170 periodically according to a setting rule based on wavelength theory (e.g., a spacing of ≤λ / 2), so that they collectively form a second electromagnetic guiding wall surrounding the signal transmission area within the gap. This second electromagnetic guiding wall can effectively limit the diffusion of the electromagnetic field in the gap, suppress signal energy leakage and crosstalk between channels, and ensure that the entire transmission path from the radiating unit 130 through the gap to the waveguide antenna on the carrier has a continuous electromagnetic shielding and guiding effect. Thus, without the need to add an additional independent shielding structure, the multiplexed interconnect system achieves the guarantee of signal integrity at the assembly interface.

[0072] In the second embodiment, the conductive bump 160 is reused as the first electromagnetic guide wall 140. The present invention also provides a third embodiment, which differs from the second embodiment in that the package body is provided with a separate first electromagnetic guide wall 140.

[0073] Specifically, such as Figure 3The diagram shown is a cross-sectional schematic of the package provided in the third embodiment of the present invention. In the third embodiment, the package further includes a first electromagnetic guide wall 140. The first electromagnetic guide wall 140 is disposed around the periphery of the radiating unit 130 on the lower surface (first surface 101A) of the carrier 101, and extends along the electromagnetic wave transmission path of the radiating unit 130. That is, the first electromagnetic guide wall 140 and the radiating unit 130 are both disposed on the same surface (first surface 101A) of the carrier 101, and the first electromagnetic guide wall 140 corresponds to the radiating unit 130, thereby constructing a guiding structure that matches the waveguide antenna in three-dimensional space.

[0074] In the third embodiment, the conductive bumps 160 are disposed on the lower surface (first surface 101A) of the carrier 101, and in the direction parallel to the first surface 101A of the carrier 101 (direction D2), the conductive bumps 160 are all located outside the area defined by the first electromagnetic guide wall 140. This ensures that while the conductive bumps 160 perform their electrical connection and heat conduction functions, their physical positions avoid the electromagnetic wave guiding area established by the first electromagnetic guide wall 140. This avoids the interference of the conductive bumps 160 on the high-frequency electromagnetic field distribution of the electromagnetic wave guiding area, and ensures that the electromagnetic waves emitted or received from the radiation unit 130 can be transmitted efficiently and with low loss along the designed path within the first electromagnetic guide wall 140.

[0075] Furthermore, in the third embodiment, multiple conductive bumps 160 are arranged according to a set rule along the direction surrounding the first electromagnetic guide wall 140 to serve as a supplementary electromagnetic shielding wall. This effectively suppresses electromagnetic field energy leakage in the outer region of the first electromagnetic guide wall 140, significantly reduces signal crosstalk between different functional circuits (such as digital processing units and RF analog units), and optimizes impedance matching of signal transmission paths. This embodiment reuses some of the conductive bumps 160 that were originally only used for electrical interconnection and heat conduction. Without adding an additional independent shielding structure or changing the overall package size, it enhances the electromagnetic compatibility at the assembly interface and gaps, thereby synergistically improving the integrity of high-frequency signal transmission, system reliability, and anti-interference capability, while maintaining high integration and process simplicity of the package.

[0076] Furthermore, in the third embodiment, the multiple external connection blocks 170 are arranged periodically according to a setting rule based on wavelength theory, so that they together form a second electromagnetic guiding wall surrounding the signal transmission area within the gap, thereby effectively limiting the diffusion of electromagnetic field in the gap, suppressing signal energy leakage and crosstalk between channels, and ensuring that the entire transmission path from the radiation unit 130 through the gap to the waveguide antenna on the carrier plate has a continuous electromagnetic shielding and guiding effect.

[0077] In some embodiments of the present invention, the radiation unit 130 and the radio frequency chip 110 are disposed on the same surface of the carrier 101, such as in the first embodiment, the second embodiment and the third embodiment. In other embodiments, the radiation unit 130 and the radio frequency chip 110 are disposed on different surfaces of the carrier 101.

[0078] Specifically, such as Figure 4 The diagram shown is a cross-sectional schematic of the package provided in the fourth embodiment of the present invention. In the fourth embodiment, the upper surface of the carrier 101 is defined as its first surface 101A and the lower surface as its second surface 101B. The radio frequency chip 110 is disposed on the upper surface (first surface 101A) of the carrier 101, and the radiation unit 130 is disposed on the lower surface (second surface 101B) of the carrier 101. The radio frequency chip 110 and the radiation unit 130 are electrically connected through the conductive line 103 to realize high-frequency signal transmission between the radiation unit 130 and the radio frequency chip 110.

[0079] Furthermore, in this embodiment, the conductive line 103 includes a first interconnect 1031 and a second interconnect 1032, so as to realize high-frequency signal transmission between the radiating unit 130 and the radio frequency chip 110 through the first interconnect 1031 and the second interconnect 1032.

[0080] The first interconnect 1031 is disposed on the first surface 101A of the carrier 101 or within the carrier 101, and extends in a direction parallel to the first surface 101A of the carrier 101 (direction D2), and is electrically connected to the RF chip 110. The first interconnect 1031 typically adopts a microstrip line or coplanar waveguide structure, and by selecting a low-loss metal material and optimizing its linewidth and spacing, the specific characteristic impedance required in the millimeter-wave band is maintained.

[0081] The second interconnect 1032 is disposed within the carrier 101 and extends along a direction perpendicular to the first surface 101A of the carrier 101 (direction D1). One end of the second interconnect 1032 is electrically connected to the first interconnect 1031, and the other end is electrically connected to the radiating unit 130. The second interconnect 1032 is implemented through conductive pillars 102, metal-filled vias, or silicon via structures. One end of the second interconnect 1032 is electrically connected to the first interconnect 1031 within the carrier 101, and the other end extends to the surface where the radiating unit 130 is located and connects to its feed point. This completes the vertical transition of the signal from the horizontal layer to the layer where the radiating unit 130 is located. This three-dimensional interconnection method significantly shortens the overall transmission path and helps reduce signal delay and parasitic effects.

[0082] In the fourth embodiment, a plurality of conductive bumps 160 are arranged on the lower surface (second surface 101B) of the carrier 101 in a direction surrounding the radiation unit 130 according to a set rule, thereby jointly forming an electromagnetic guiding structure surrounding the radiation unit 130 as the first electromagnetic guiding wall 140.

[0083] In other embodiments, the package body is provided with a separate first electromagnetic guide wall 140. For example, as Figure 5 The diagram shown is a cross-sectional schematic of the package provided in the fifth embodiment of the present invention. In the fifth embodiment, the package further includes a first electromagnetic guide wall 140. The first electromagnetic guide wall 140 is disposed around the periphery of the radiating unit 130 on the lower surface (second surface 101B) of the carrier 101, and extends along the electromagnetic wave transmission path of the radiating unit 130. That is, the first electromagnetic guide wall 140 and the radiating unit 130 are both disposed on the same surface (second surface 101B) of the carrier 101, and the position of the first electromagnetic guide wall corresponds to that of the radiating unit 130, thereby constructing a guiding structure that matches the waveguide antenna 220 in three-dimensional space.

[0084] Furthermore, in the fifth embodiment, the conductive bumps 160 are disposed on the lower surface (second surface 101B) of the carrier 101, and in a direction parallel to the first surface 101A of the carrier 101 (direction D2), the conductive bumps 160 are all located outside the area defined by the first electromagnetic guiding wall 140, ensuring that the conductive bumps 160 perform their electrical connection and heat conduction functions while avoiding interference with the high-frequency electromagnetic field distribution of the electromagnetic wave guiding area. Furthermore, in the fifth embodiment, multiple external connection blocks 170 are periodically arranged according to a wavelength-based setting rule, so that they collectively form a second electromagnetic guiding wall surrounding the signal transmission area within the gap, ensuring that the entire transmission path from the radiating unit 130 through the gap to the waveguide antenna on the carrier plate has a continuous electromagnetic shielding and guiding effect.

[0085] Furthermore, in some embodiments of the present invention, the substrate 100 further includes a grounded electromagnetic shielding wall 180, which shields the second interconnect line 1032. Specifically, as Figure 6The diagram shown is a cross-sectional schematic of the package provided in the sixth embodiment of the present invention. In the sixth embodiment, the substrate 100 further includes a grounded electromagnetic shielding wall 180, which is disposed within the carrier 101 and surrounds the second interconnect 1032. When the electromagnetic shielding wall 180 is reliably connected to the system ground potential, it can construct an equivalent Faraday cage in the peripheral space of the second interconnect 1032, effectively suppressing the outward radiation of electromagnetic fields generated during high-frequency signal transmission, and blocking the coupling of external electromagnetic interference to the signal within the second interconnect 1032. This not only improves signal integrity and reduces crosstalk and insertion loss, but also helps to improve the electromagnetic compatibility and reliability of the entire packaging system.

[0086] Furthermore, in some embodiments, the electromagnetic shielding wall 180 is grounded through a grounding line within the carrier 101. For example, the electromagnetic shielding wall 180 is reliably grounded through a pre-installed dedicated grounding line within the carrier 101. In other embodiments, the electromagnetic shielding wall 180 can be grounded through the conductive bump 160 and the external connection block 170.

[0087] Furthermore, in some embodiments, the electromagnetic shielding wall 180 is composed of multiple metal pillars arranged according to a predetermined rule along the direction surrounding the outer periphery of the second interconnect 1032. Specifically, the electromagnetic shielding wall 180 is formed by multiple highly conductive metal pillars arranged along the direction surrounding the outer periphery of the second interconnect 1032 according to a predetermined period and spacing. The metal pillars are made of copper, tungsten, or their alloys, and are reliably electrically grounded through a grounding line within the carrier 101, thereby forming a continuous electromagnetic shielding bandgap structure around the second interconnect 1032 to effectively suppress electromagnetic field leakage and external interference coupling during high-frequency signal transmission.

[0088] In the sixth embodiment, a plurality of conductive bumps 160 are arranged on the lower surface (second surface 101B) of the carrier 101 in a direction surrounding the radiation unit 130 according to a set rule, thereby jointly forming an electromagnetic guiding structure surrounding the radiation unit 130 as the first electromagnetic guiding wall 140.

[0089] Furthermore, in some embodiments, the package body is provided with a separate first electromagnetic guiding wall 140, and the first electromagnetic guiding wall 140 is disposed on the second surface 101B of the carrier 101 and extends into the carrier 101, with the extended area serving as the electromagnetic shielding wall 180. Specifically, as Figure 7The diagram shown is a cross-sectional schematic of the package provided in the seventh embodiment of the present invention. In the seventh embodiment, the package further includes a first electromagnetic guiding wall 140. The first electromagnetic guiding wall 140 is disposed around the periphery of the radiating unit 130 on the lower surface (second surface 101B) of the carrier 101, and extends along the electromagnetic wave transmission path of the radiating unit 130. The first electromagnetic guiding wall 140 extends into the carrier 101, and the extended area surrounds the second interconnect line 1032 to serve as the electromagnetic shielding wall 180, thereby integrally forming a structure that has both surface electromagnetic wave guiding and internal interconnect line shielding functions, realizing the synergistic optimization of structural reuse and electromagnetic performance.

[0090] In some embodiments, the radiating unit 130 and the radio frequency chip 110 are disposed on different surfaces of the carrier 101, and the upper surface of the carrier 101 is defined as its first surface 101A and the lower surface as its second surface 101B, for example, in embodiments four to seven; in other embodiments, the radiating unit 130 and the radio frequency chip 110 are disposed on different surfaces of the carrier 101, and the lower surface of the carrier 101 is defined as its first surface 101A and the upper surface as its second surface 101B.

[0091] Specifically, such as Figure 8 The diagram shown is a cross-sectional schematic of the package provided in the eighth embodiment of the present invention. In the eighth embodiment, the lower surface of the carrier 101 is defined as its first surface 101A and the upper surface is defined as its second surface 101B. The radio frequency chip 110 is disposed on the lower surface (first surface 101A) of the carrier 101, the radiation unit 130 is disposed on the upper surface (second surface 101B) of the carrier 101, the first electromagnetic guide wall 140 is disposed on the upper surface (second surface 101B) of the carrier 101, and the processing chip 120 is disposed on the upper surface (second surface 101B) of the carrier 101.

[0092] In the eighth embodiment, the radio frequency chip 110 and the radiating unit 130 are electrically connected through the conductive line 103 to realize high-frequency signal transmission between the radiating unit 130 and the radio frequency chip 110. Further, the conductive line 103 includes a first interconnect line 1031 and a second interconnect line 1032. The first interconnect line 1031 is disposed on the first surface 101A of the carrier 101 or within the carrier 101, and extends in a direction parallel to the first surface 101A of the carrier 101 (direction D2), and is electrically connected to the radio frequency chip 110. The second interconnect line 1032 is disposed within the carrier 101, and extends in a direction perpendicular to the first surface 101A of the carrier 101 (direction D1), with one end electrically connected to the first interconnect line 1031 and the other end electrically connected to the radiating unit 130.

[0093] Furthermore, in the eighth embodiment, the substrate 100 further includes a grounded electromagnetic shielding wall 180. The electromagnetic shielding wall 180 is disposed within the carrier 101 and surrounds the second interconnect 1032 to effectively suppress the outward radiation of electromagnetic fields generated during high-frequency signal transmission, while blocking external electromagnetic interference from coupling to the signal within the second interconnect 1032. This not only improves signal integrity and reduces crosstalk and insertion loss, but also helps to enhance the electromagnetic compatibility and reliability of the entire packaging system.

[0094] Furthermore, in the eighth embodiment, the package further includes conductive bumps 160 and external connection blocks 170. The conductive bumps 160 are disposed on the lower surface (first surface 101A) of the carrier 101 and are electrically connected to the carrier 101. The external connection blocks 170 are disposed on the lower surface of the molding compound 150. The conductive bumps 160 are electrically connected to the RF chip 110 and the processing chip 120 through redistribution layers or wires distributed inside the molding compound 150, and via the external connection blocks 170, they achieve power distribution, signal transmission, and grounding connections with the external carrier board 200 or the system motherboard, thereby completing a stable and reliable external electrical interconnection of the package.

[0095] The package provided in this embodiment of the invention achieves high-density three-dimensional integration by vertically stacking the processing chip 120 and the radio frequency chip 110, significantly reducing the physical volume and complexity of the packaging system. Furthermore, the processing chip 120 and the radio frequency chip 110 are vertically interconnected via the conductive pillars 102 within the substrate 100, significantly shortening the interconnection length, reducing signal transmission delay and energy loss, and enhancing system reliability. The package provided in this embodiment of the invention also utilizes a first electromagnetic guiding wall 140 surrounding the radiating unit 130 and extending along the electromagnetic wave transmission path to form a controlled waveguide channel, effectively guiding the radio frequency signal to be directionally radiated or received from the radiating unit 130, suppressing signal leakage and inter-channel crosstalk, thereby reducing interconnection loss and improving signal integrity.

[0096] Based on the same inventive concept, this embodiment of the invention also provides a packaging system, which includes a package as described in any of the above embodiments. The packaging system forms a high-density three-dimensional heterogeneous integration by vertically stacking the processing chip 120 and the radio frequency chip 110, which significantly reduces the physical size and structural complexity. It also utilizes the short-path vertical interconnection between the processing chip 120 and the radio frequency chip 110 to reduce signal transmission delay and energy loss, thereby improving the reliability of the packaging system. At the same time, the first electromagnetic guide wall 140 forms a controlled waveguide channel, which effectively guides the radio frequency signal to be directionally radiated or received from the radiation unit 130, suppressing signal leakage and crosstalk between channels, thereby reducing interconnection loss and improving signal integrity.

[0097] like Figure 9 The diagram shown is a cross-sectional schematic of the packaging system provided in the ninth embodiment of the present invention. In the ninth embodiment, the packaging system includes: a carrier plate 200; and a package 210 disposed on the upper surface of the carrier plate 200. The package 210 adopts the package described in the first embodiment (see reference). Figure 1A and Figure 1B The waveguide antenna 220 is aligned with the radiating element 130 of the package 210 to form a continuous electromagnetic wave transmission channel.

[0098] The carrier board 200 serves as the mounting carrier for the packaging system, providing mechanical support, electrical interconnection, and heat dissipation management. Through its surface wiring and solder joints (such as solder ball arrays), the carrier board 200 provides stable physical fixation and reliable electrical connection to the package 210 above it, ensuring signal and power transmission between the package 210 and external systems (such as motherboards). Regarding heat dissipation, the carrier board 200 utilizes its thermal conductivity to absorb and dissipate the heat generated by the RF chip 110 and processing chip 120 within the package 210 during operation, thereby improving the heat dissipation efficiency and reliability of the packaging system.

[0099] In some embodiments, the carrier 200 may be a metal substrate, a ceramic substrate, or a PCB substrate. In this embodiment, the carrier 200 is an FR-4 carrier. FR-4 carrier is an epoxy glass cloth laminate using epoxy resin as an adhesive and electronic-grade glass fiber cloth as reinforcement, belonging to the flame-retardant material category. FR-4 carrier has high mechanical properties and good dimensional stability, providing robust mechanical support for the package 210 mounted on it. Its stable electrical insulation properties ensure reliable operation of the packaging system circuitry. Simultaneously, the low water absorption and good heat resistance of the FR-4 carrier material allow it to adapt to various working environments. Combined with its mature processing technology and cost advantages, the packaging system ultimately achieves an excellent balance between mechanical strength, electrical insulation, environmental adaptability, and cost-effectiveness.

[0100] In the ninth embodiment, the package 210 has the same structure as the package provided in the first embodiment, which can be referred to. Figure 1A and Figure 1B The relevant description is as follows. Further, the package 210 is soldered to the carrier plate 200 via external connecting blocks 170, and is electrically connected to the carrier plate 200 via the external connecting blocks 170. Specifically, the package 210 is soldered to the corresponding pad positions on the upper surface of the carrier plate 200 via external connecting blocks 170 on the lower surface of its molding compound 150 using surface mount technology such as reflow soldering. The external connecting blocks 170 are typically arrays of solder balls made of solder alloys such as tin, silver, and copper. These solder balls form a reliable metallurgical bond through fusion welding, thereby achieving a stable mechanical fixation and low-impedance electrical interconnection between the package 210 and the carrier plate 200. Furthermore, long-term reliability of the connection under thermomechanical stress can be ensured by optimizing the soldering process and solder composition.

[0101] The waveguide antenna 220 is aligned with the radiating element 130 of the package 210 to form a continuous electromagnetic wave transmission channel. Specifically, the waveguide antenna 220 and the radiating element 130 of the package 210 are precisely aligned in three-dimensional space through a precision structural design. The feed port of the waveguide antenna 220 coincides with the phase center of the radiating element 130 in both horizontal and vertical positions. The alignment tolerance between the two is controlled to be much smaller than the operating wavelength (for example, in the millimeter-wave band, it is usually required to be less than one-tenth of the wavelength), thereby enabling the electromagnetic waves excited by the radiating element 130 to be efficiently coupled into the waveguide cavity defined by the waveguide antenna 220. The waveguide antenna 220 is aligned with the radiating element 130 of the package 210, ensuring that electromagnetic waves can propagate in a continuous, low-loss transmission channel formed by the area enclosed by the radiating element 130, the first electromagnetic guide wall 140, and the waveguide cavity of the waveguide antenna 220, thereby achieving high-efficiency and high-integrity radio frequency signal transmission from the chip level to the antenna level.

[0102] In this embodiment, the electromagnetic wave transmission direction of the radiating element 130 of the package 210 is away from the carrier plate 200, and the waveguide antenna 220 is disposed on the surface of the package 210 away from the carrier plate 200, that is, the waveguide antenna 220 and the carrier plate 200 are respectively disposed on opposite sides of the package 210. In this embodiment, the package 210 adopts the package shown in the first embodiment of the present invention. In other embodiments, the package 210 may also adopt the package shown in the eighth embodiment.

[0103] The waveguide antenna 220 includes a waveguide cavity 221, which is aligned with the area enclosed by the first electromagnetic guide wall 140 to jointly form the electromagnetic wave transmission channel. Specifically, the waveguide cavity 221 of the waveguide antenna 220 is precisely aligned and connected in three-dimensional space with the top opening area formed by the first electromagnetic guide wall 140 on the package 210. This allows the waveguide cavity 221 and the first electromagnetic guide wall 140 to jointly define a continuous and closed electromagnetic wave transmission channel from the radiating element 130 to free space. This structure ensures that the millimeter-wave signal excited by the radiating element 130 is efficiently confined and guided into the waveguide cavity 221 for transmission in a specific waveguide mode, thereby minimizing signal leakage, reflection, and mode distortion in the transition region and achieving high-integrity radiation of high-frequency signals.

[0104] Furthermore, in some embodiments, the inner wall of the waveguide cavity 221 has an electromagnetic wave reflecting layer 222. The electromagnetic wave reflecting layer 222 is formed by electroplating or depositing high-conductivity metal materials such as gold, silver, and aluminum on the metal substrate surface of the waveguide cavity 221. Its smooth surface treatment and excellent conductivity can efficiently reflect the electromagnetic wave energy leaking to the cavity wall during transmission back into the waveguide cavity 221, thereby significantly reducing conductor loss, suppressing signal attenuation, and ensuring that high-frequency signals are transmitted stably in a specific mode in the waveguide, ultimately improving the radiation efficiency and signal integrity of the entire antenna system.

[0105] Furthermore, to enhance the mounting stability and structural reliability of the waveguide antenna 220 on the carrier plate 200, in some embodiments, the packaging system further includes a mechanical support member 230. For example... Figure 10 As shown, it is a cross-sectional schematic diagram of the packaging system provided in the tenth embodiment of the present invention. In the tenth embodiment, the packaging system further includes a mechanical support member 230. The mechanical support member 230 is located on the periphery of the package body 210 and is disposed between the waveguide antenna 220 and the carrier plate 200 for supporting the waveguide antenna 220.

[0106] The mechanical support component 230 is precisely set between the waveguide antenna 220 and the carrier plate 200 in a frame or column array structure. It is fixed to the surface of the waveguide antenna 220 and the carrier plate 200 by bonding, welding or snap-fitting, thereby providing stable mechanical support for the waveguide antenna 220, ensuring that the antenna radiating surface and the radiating element 130 of the package are always accurately aligned, while effectively dispersing the antenna's own weight and external mechanical stress, improving the reliability of the system in harsh environments such as vibration and shock, and assisting in heat dissipation by selecting a composite structure of metal with good thermal conductivity or filled with thermal interface material.

[0107] In some embodiments of the present invention, the waveguide antenna 220 and the carrier plate 200 are respectively disposed on opposite sides of the package 210, such as in the ninth and tenth embodiments. In other embodiments, the waveguide antenna 220 and the package 210 are respectively disposed on opposite sides of the carrier plate 200.

[0108] Specifically, such as Figure 11The diagram shown is a cross-sectional schematic of the packaging system provided in the eleventh embodiment of the present invention. In the eleventh embodiment, the electromagnetic wave transmission direction of the radiating unit 130 of the package 210 is towards the carrier plate 200. The waveguide antenna 220 is disposed on the surface of the carrier plate 200 away from the package 210. The carrier plate 200 includes a waveguide transition cavity 201, and the waveguide antenna 220 includes a waveguide cavity 221. The waveguide transition cavity 201 is aligned with the area enclosed by the first electromagnetic guide wall 140, and the waveguide cavity 221 is aligned with the waveguide transition cavity 201 to jointly form the electromagnetic wave transmission channel.

[0109] In the eleventh embodiment, the package 210 has the same structure as the package provided in the second embodiment, and can be referred to accordingly. Figure 2 The relevant description is provided. In some other embodiments, the package 210 has the same structure as the package provided in the third, fourth, fifth, sixth, and seventh embodiments.

[0110] In the eleventh embodiment, in the package 210, a plurality of conductive bumps 160 are arranged in a direction surrounding the radiating unit 130 according to a set rule, thereby jointly forming an electromagnetic guiding structure surrounding the radiating unit 130 as the first electromagnetic guiding wall 140. The external connecting block 170 is disposed on the lower surface of the molding compound 150 and electrically connected to the conductive bumps 160. The package 210 is welded to the carrier plate 200 via the external connecting block 170 and electrically connected to the carrier plate 200 via the external connecting block 170. Furthermore, the plurality of external connecting blocks 170 are periodically arranged according to a set rule based on wavelength theory (e.g., with a spacing ≤λ / 2), so that they jointly form a second electromagnetic guiding wall surrounding the signal transmission area within the gap.

[0111] In the eleventh embodiment, the electromagnetic wave transmission direction of the radiating element 130 of the package 210 is configured to face the carrier plate 200, and the waveguide antenna 220 is correspondingly disposed on the lower surface of the carrier plate 200 away from the package 210. To achieve efficient signal transmission, a waveguide transition cavity 201 is precisely machined inside the carrier plate 200. The waveguide transition cavity 201 is strictly aligned in three-dimensional space with the bottom opening area formed by the first electromagnetic guide wall 140 and the second electromagnetic guide wall on the package 210; at the same time, the waveguide cavity 221 included in the waveguide antenna 220 is precisely aligned with the outlet of the waveguide transition cavity 201 in the carrier plate 200. Thus, the electromagnetic waves emitted downward from the radiating unit 130 can sequentially pass through the area defined by the first electromagnetic guiding wall 140, the area defined by the second electromagnetic guiding wall, the waveguide transition cavity 201 of the carrier plate 200, and the waveguide cavity 221 of the waveguide antenna 220, forming a continuous, low-loss electromagnetic wave transmission channel extending from the inside of the package to the external antenna, effectively ensuring the directional transmission and integrity of the millimeter-wave signal. This embodiment integrates a waveguide structure on the carrier plate 200, achieving vertical radiation and guidance of the signal, providing greater design flexibility and space utilization for system-level stacking layouts.

[0112] Furthermore, the substrate of the waveguide transition cavity 201 is made of insulating material, which itself does not have the ability to guide electromagnetic waves. Therefore, an electromagnetic wave reflecting layer 202 needs to be set on its inner wall. The electromagnetic reflecting layer 202 is formed on the surface of the insulating substrate by electroplating or deposition process to form a continuous high conductivity metal film (such as gold, silver or aluminum), thereby transforming the insulating material waveguide transition cavity 201 into a quasi-metallic waveguide structure that can effectively confine and guide electromagnetic waves. This ensures that the electromagnetic waves are confined within the cavity and propagate efficiently along a predetermined path during transmission, avoiding energy leakage and mode distortion, and ultimately achieving low-loss signal coupling from the internal radiating unit 130 to the external waveguide antenna 220.

[0113] Furthermore, in some embodiments, the inner wall of the waveguide cavity 221 also has an electromagnetic wave reflecting layer 222. The electromagnetic wave reflecting layer 222 is formed by electroplating or depositing highly conductive metal materials such as gold, silver, and aluminum on the metal substrate surface of the waveguide cavity 221. It can efficiently reflect the electromagnetic wave energy that leaks to the cavity wall during transmission back into the waveguide cavity 221, thereby significantly reducing conductor loss, suppressing signal attenuation, and ensuring that high-frequency signals are stably transmitted in a specific mode in the waveguide.

[0114] To further enhance the heat dissipation capability and long-term reliability of the packaging system under high-power operating conditions, some improved embodiments, based on the aforementioned embodiments, also add dedicated heat dissipation components.

[0115] Specifically, such as Figure 12 As shown, it is a cross-sectional schematic diagram of the packaging system provided in the twelfth embodiment of the present invention. In the twelfth embodiment, the packaging system further includes a heat dissipation component 240, which is disposed on the surface of the package 210 away from the carrier plate 200, and is used to provide an efficient heat dissipation path for the chips (e.g., processing chip 120 and radio frequency chip 110) inside the package 210.

[0116] The heat dissipation component 240 can be a heat sink, a vapor chamber, or a cold plate with integrated microchannels. It is in close contact with the upper surface of the package 210 (e.g., the exposed RF chip 110, the back of the processing chip 120, or the surface of the molding compound 150) through a thermally conductive interface material. Utilizing the high thermal conductivity of the metal or the convective heat transfer of the coolant, the heat generated during chip operation is quickly conducted to the heat dissipation component 240 and ultimately dissipated into the surrounding environment. This effectively reduces the chip junction temperature, significantly improves the system's heat dissipation efficiency, avoids performance degradation or reliability issues caused by overheating, and extends the long-term service life of the entire packaging system.

[0117] The packaging system provided in this invention compactly packages the radio frequency chip, processing chip, and radiating unit through high-density three-dimensional integration. By utilizing vertical interconnects and electromagnetic guide walls, it significantly shortens the signal path, reduces transmission loss and delay, and enhances heat dissipation performance, thereby achieving excellent performance of high signal integrity, high reliability, and miniaturization in the millimeter-wave band.

[0118] It should be noted that references to "an embodiment," "an embodiment," "an exemplary embodiment," "some embodiments," etc., in the specification indicate that the described embodiments may include specific features, structures, or characteristics, but each embodiment may not necessarily include that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. In addition, when a specific feature, structure, or characteristic is described in connection with an embodiment, whether explicitly described or not, implementing such a feature, structure, or characteristic in conjunction with other embodiments is within the knowledge of those skilled in the art.

[0119] It should be noted that the terms "comprising" and "having," and their variations, used in this invention document are intended to cover non-exclusive inclusion. The terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence, unless explicitly indicated by the context. It should be understood that such data used interchangeably where appropriate. Furthermore, embodiments and features within embodiments of this invention can be combined with each other unless otherwise specified. In addition, descriptions of well-known components and technologies have been omitted in the above description to avoid unnecessarily obscuring the concepts of this invention. In the various embodiments described above, each embodiment focuses on its differences from other embodiments; similar or identical parts between embodiments can be referred to interchangeably.

[0120] The above description is only a preferred embodiment of the present invention. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A package, characterized by, include: A substrate includes a carrier, conductive pillars, and conductive lines. The carrier includes a first surface and a second surface disposed opposite to each other. The conductive pillars penetrate the carrier in a direction perpendicular to the first surface of the carrier. The conductive lines are disposed on the first surface of the carrier and / or disposed within the carrier. An radio frequency chip is disposed on the first surface of the carrier; A processing chip is disposed on the second surface of the carrier and is vertically interconnected with the radio frequency chip through the conductive pillars; A radiation unit is disposed on the first surface or the second surface of the carrier and interconnected with the radio frequency chip through the conductive line; A first electromagnetic guide wall is disposed around the periphery of the radiation unit on the first surface or the second surface of the carrier, and the first electromagnetic guide wall extends along the electromagnetic wave transmission path of the radiation unit. A molding compound covers the substrate, the radio frequency chip, the processing chip, the radiating unit, and the first electromagnetic guide wall, wherein the end of the first electromagnetic guide wall facing away from the substrate is flush with or protrudes from the surface of the molding compound.

2. The package of claim 1, wherein, When the radiating element is disposed on the second surface of the carrier, the conductive circuit includes: A first interconnect line is disposed on the first surface of the carrier or within the carrier, extends in a direction parallel to the first surface of the carrier, and is electrically connected to the radio frequency chip. A second interconnecting line is disposed within the carrier and extends in a direction perpendicular to the first surface of the carrier. One end of the second interconnecting line is electrically connected to the first interconnecting line, and the other end is electrically connected to the radiating unit.

3. The package of claim 2, wherein, The substrate also includes a grounded electromagnetic shielding wall, which is disposed within the carrier and surrounds the second interconnect.

4. The package of claim 3, wherein, The electromagnetic shielding wall is grounded through a grounding line within the carrier.

5. The package of claim 3, wherein, The first electromagnetic guide wall is disposed on the second surface of the carrier and extends into the carrier, with the extended area serving as the electromagnetic shielding wall.

6. The package of claim 3, wherein, The electromagnetic shielding wall consists of multiple metal pillars arranged according to a set rule in a direction surrounding the outer periphery of the second interconnect line.

7. The package according to claim 1, characterized in that, The package further includes: A conductive bump is disposed on a first surface or a second surface of the carrier, the encapsulation covers the conductive bump, and one end of the conductive bump facing away from the carrier is exposed on the surface of the encapsulation. An external connection block is disposed on the surface of the encapsulation body and is electrically connected to the conductive bump.

8. The package according to claim 7, characterized in that, When both the radiating unit and the conductive bump are disposed on the first or second surface of the carrier, a plurality of the conductive bumps are disposed in a direction surrounding the radiating unit according to a set rule, so as to serve as the first electromagnetic guide wall.

9. The package according to claim 8, characterized in that, Multiple external connection blocks are arranged according to a set rule to serve as a second electromagnetic guide wall.

10. The package according to claim 9, characterized in that, The external connecting block is a solder ball.

11. The package according to claim 7, characterized in that, When both the radiating unit and the conductive bump are disposed on the first surface of the carrier, or when both the radiating unit and the conductive bump are disposed on the second surface of the carrier, the conductive bump is located outside the area defined by the first electromagnetic guide wall in a direction parallel to the first surface of the carrier.

12. The package according to claim 11, characterized in that, Multiple conductive bumps are arranged in a direction surrounding the first electromagnetic guide wall according to a set rule, serving as a supplementary electromagnetic shielding wall.

13. The package according to claim 1, characterized in that, The first electromagnetic guide wall consists of multiple metal pillars arranged in a direction surrounding the radiation unit according to a set rule.

14. The package according to claim 1, characterized in that, The surface of the radio frequency chip facing away from the substrate is exposed on the surface of the encapsulation.

15. The package according to claim 1, characterized in that, The surface of the processing chip facing away from the substrate is exposed on the surface of the molding compound.

16. The package according to claim 1, characterized in that, The processing chip and the radio frequency chip are positioned opposite each other in a direction perpendicular to the first surface of the substrate.

17. The package according to claim 1, characterized in that, The radio frequency chip is a millimeter-wave chip.

18. The package according to claim 1, characterized in that, The processing chip is a field-programmable gate array (FPGA) chip.

19. The package according to claim 1, characterized in that, The conductive post is a through-silicon via.

20. A packaging system, characterized in that, Includes the package as described in any one of claims 1 to 19.

21. The packaging system according to claim 20, characterized in that, The packaging system also includes: Carrier plate; The package is disposed on the upper surface of the carrier plate; A waveguide antenna is aligned with the radiating element of the package to form a continuous electromagnetic wave transmission channel.

22. The packaging system according to claim 21, characterized in that, The electromagnetic wave transmission direction of the radiating unit of the package is away from the carrier plate. The waveguide antenna is disposed on the surface of the package away from the carrier plate. The waveguide antenna includes a waveguide cavity, which is aligned with the area enclosed by the first electromagnetic guide wall to jointly form the electromagnetic wave transmission channel.

23. The packaging system according to claim 21, characterized in that, The packaging system also includes a mechanical support component located around the package and disposed between the waveguide antenna and the carrier plate, for supporting the waveguide antenna.

24. The packaging system according to claim 21, characterized in that, The electromagnetic wave transmission direction of the radiating unit of the package is towards the carrier plate. The waveguide antenna is disposed on the surface of the carrier plate away from the package. The carrier plate includes a waveguide transition cavity, and the waveguide antenna includes a waveguide cavity. The waveguide transition cavity is aligned with the area enclosed by the first electromagnetic guide wall. The waveguide cavity and the waveguide transition cavity are aligned to jointly form the electromagnetic wave transmission channel.

25. The packaging system according to claim 24, characterized in that, The inner wall of the waveguide transition cavity has an electromagnetic wave reflecting layer.

26. The packaging system according to claim 24, characterized in that, The packaging system further includes a heat dissipation component disposed on the surface of the package body opposite to the carrier plate.

27. The packaging system according to claim 22 or 24, characterized in that, The inner wall of the waveguide cavity has an electromagnetic wave reflecting layer.

28. The packaging system according to claim 21, characterized in that, The package is welded to the carrier plate via an external connecting block and is electrically connected to the carrier plate via the external connecting block.

29. The packaging system according to claim 21, characterized in that, The carrier plate is an FR-4 carrier plate.

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