Solid state evaporation source, control method and storage medium
By using multiple heating devices and controllers in the solid-state evaporation source, combined with a reflector and cooling water circuit, precise temperature control of the delivery pipeline and source bottle was achieved, solving the problems of uneven heating and evaporation rate decay, and improving the uniformity of thin film deposition and process consistency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- PIOTECH (SHENYANG) SEMICONDUCTOR EQUIPMENT CO LTD
- Filing Date
- 2026-05-25
- Publication Date
- 2026-07-24
AI Technical Summary
Existing traditional heating control technologies cannot adapt to the differentiated heat dissipation characteristics of areas such as the source bottle cavity and bent pipes, resulting in uneven heating, which affects the uniformity and consistency of the thin film deposition process. Furthermore, the consumption of solid source leads to a decrease in evaporation, which cannot meet the requirements of high-precision semiconductor production.
By employing multiple heating devices and controllers, and calibrating the pressure-temperature mapping curve of the delivery pipeline, the output power of the heating devices is adjusted in real time to achieve precise temperature control of the delivery pipeline and the source bottle. Combined with a reflector and cooling water circuit, temperature uniformity and stability are ensured.
It improves the uniformity and consistency of thin film deposition, overcomes slow process disturbances in the precursor output process, and enhances process stability and product yield.
Smart Images

Figure CN122446148A_ABST