Solid state evaporation source, control method and storage medium

By using multiple heating devices and controllers in the solid-state evaporation source, combined with a reflector and cooling water circuit, precise temperature control of the delivery pipeline and source bottle was achieved, solving the problems of uneven heating and evaporation rate decay, and improving the uniformity of thin film deposition and process consistency.

CN122446148APending Publication Date: 2026-07-24PIOTECH (SHENYANG) SEMICONDUCTOR EQUIPMENT CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
PIOTECH (SHENYANG) SEMICONDUCTOR EQUIPMENT CO LTD
Filing Date
2026-05-25
Publication Date
2026-07-24

AI Technical Summary

Technical Problem

Existing traditional heating control technologies cannot adapt to the differentiated heat dissipation characteristics of areas such as the source bottle cavity and bent pipes, resulting in uneven heating, which affects the uniformity and consistency of the thin film deposition process. Furthermore, the consumption of solid source leads to a decrease in evaporation, which cannot meet the requirements of high-precision semiconductor production.

Method used

By employing multiple heating devices and controllers, and calibrating the pressure-temperature mapping curve of the delivery pipeline, the output power of the heating devices is adjusted in real time to achieve precise temperature control of the delivery pipeline and the source bottle. Combined with a reflector and cooling water circuit, temperature uniformity and stability are ensured.

Benefits of technology

It improves the uniformity and consistency of thin film deposition, overcomes slow process disturbances in the precursor output process, and enhances process stability and product yield.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a solid evaporation source, a control method of the solid evaporation source, and a computer readable storage medium. The solid evaporation source comprises a cavity, a source bottle arranged in the cavity and used for containing a precursor, a delivery pipeline with a first end connected to the source bottle and a second end extending out of the cavity, at least one heating device used for heating the delivery pipeline, and a controller configured to determine an actual gas pressure in the delivery pipeline, wherein the actual gas pressure in the delivery pipeline changes with process parameters of a deposition process, determine a target temperature of the heating device according to a pre-calibrated delivery pipeline gas pressure-heating device temperature mapping relationship curve and the actual gas pressure, and adjust an output power of the heating device according to the target temperature of the heating device to adjust the actual gas pressure to a preset target gas pressure.
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