A distributed photonic synapse operation unit multilayer micro-crack optical waveguide carrying integration process

Abstract

The application discloses a micro-crack optical waveguide carrying integration process of a distributed photonic synapse operation unit, which sequentially comprises three procedures of visual high-precision alignment, dynamic weight matching and sealing stress release, and is matched with a quartz-plastic optical fiber composite transition connection structure through micron-level visual positioning, real-time optical path feedback adjustment and gradient temperature curing, so that the influence of assembly stress on the micro-crack optical path is reduced while the assembly precision is ensured, and the finished product yield and operation stability are greatly improved.

Description

Technical Field

[0001] This invention belongs to the field of photonic device integration and assembly technology, specifically relating to an integration process for a distributed photonic synaptic computing unit adapted to multilayer microcracked optical waveguides. Background Technology

[0002] Traditional optoelectronic device assembly often employs mechanical alignment and one-time potting processes, resulting in low assembly precision. Furthermore, the internal stress generated during colloid curing easily compresses microcracks in the optical path, causing crack deformation propagation, optical path performance degradation, and even failure. Simultaneously, conventional processes cannot match differentiated devices to the optical path weight requirements at different sites, leading to poor performance consistency in the integrated devices. Multilayer microcracked waveguide structures require precision and high stress stability; external impacts and curing stresses from conventional assembly processes can easily damage the internal core structure. Currently, there is no suitable dedicated integration process solution in the industry, becoming a key process bottleneck restricting the improvement of finished product yield. Summary of the Invention

[0003] This invention provides a high-precision, low-stress integration process that uses machine vision for precise alignment, dynamic weight matching for selection, and layered dispensing and gradient curing to ensure assembly accuracy while minimizing stress impact on the microcrack optical path during assembly, thereby significantly improving finished product yield and performance consistency. To achieve the above-mentioned objectives, the present invention adopts the following complete technical solution: A microcracked optical waveguide mounting and integration process for a distributed photonic synaptic computing unit, comprising three core processes in sequence: high-precision visual alignment, dynamic weight matching, and sealing stress relief. Preferably, the visual alignment accuracy is ≤2μm; Preferably, the optical path performance is monitored synchronously during the assembly process, and the optical path is adjusted in real time based on feedback. Preferably, a gradient curing process is used to release the internal stress during curing; Preferably, various curing processes can be used to adapt to different colloidal systems; Preferably, the coupling interface adopts a quartz fiber-plastic fiber composite transition connection structure. Attached Figure Description

[0004] Figure 1 is a flowchart of the integrated process of an embodiment of the present invention. Detailed Implementation

[0005] First, the multilayer microcracked optical waveguide substrate to be assembled is fixed on a high-precision vacuum adsorption fixture. A micron-level machine vision system is used to acquire images of the assembly cavities between each layer, identify the positioning marks on the edge of the cavity, calculate the three-dimensional coordinates and cavity size parameters of each mounting point, and complete the alignment reference calibration. The alignment accuracy of this step can reach 1.5μm. According to the preset optical path weight distribution scheme, photonic synaptic computing units with corresponding power and wavelength parameters are matched for different sites. The units are then grasped by a precision vacuum nozzle and implanted into the corresponding accommodating cavity one by one according to the alignment coordinates. During the implantation process, the optical path detection system is connected simultaneously to monitor the optical signal transmission status in real time and fine-tune the unit position until the optical path performance reaches the preset threshold. After all units were implanted, layered dispensing was performed using a micro-dispensing device, with each layer not exceeding 50μm in thickness. After dispensing, the layers were allowed to stand for pre-curing. A three-stage gradient temperature curing mode was then employed, with a total curing time of 36 hours, gradually releasing the internal stress generated by the curing shrinkage of the adhesive and preventing microcrack deformation and propagation caused by stress impact. The final integrated product exhibited an optical path performance attenuation rate of less than 5% and an assembly yield exceeding 90%. In addition to gradient temperature curing, gradient pressure reduction curing and UV segmented curing processes can also be used to adapt to different types of optical encapsulation colloids. Preferred Example 1 (UV Segmented Curing Solution) The UV segmented curing process replaces the gradient temperature curing process. After dispensing, the UV irradiation is carried out in three stages, with a total curing time of 12 hours. The internal stress release rate during curing is comparable to that of the gradient temperature curing scheme, and the production efficiency is increased by 2 times, making it suitable for large-scale mass production scenarios. Preferred Example 2 (Gradient Pressure Drop Curing Solution) It adopts a gradient pressure reduction curing process, which reduces the air pressure in stages under vacuum to complete the curing; the colloidal bubble rate is less than 0.1%, making it suitable for high-reliability aerospace-grade applications. Instructions for implementing new features This process introduces a new quartz fiber-plastic fiber composite transition connection structure. At the coupling interface between the photonic synaptic computing unit and the microcracked optical path, a quartz-plastic composite fiber segment with a graded refractive index is used to achieve the transition connection. The coupling loss can be controlled within 0.5dB, ensuring the overall transmission efficiency of the multi-material collaborative transmission optical path. Working principle The core working principle of this process is a low-stress precision assembly mechanism: sub-micron level assembly positioning is achieved through micron-level machine vision, adapting to the tiny size assembly requirements of microcracked optical waveguides; real-time optical path feedback is synchronized during the assembly process to ensure the coupling efficiency between the device and the optical path; the layered dispensing + gradient curing process significantly reduces the stress impact of colloid curing shrinkage on the microcracked structure by extending the curing time and releasing internal stress in stages, thus avoiding the deformation and propagation of microcracks; the quartz-plastic composite transition connection structure achieves low-loss coupling of different transmission paths, ensuring the overall performance of the multi-material transmission architecture. Beneficial effects

[0006] Micron-level visual alignment ensures installation accuracy and meets the assembly requirements of tiny-sized accommodating cavities in microcracked optical waveguides. Dynamic weight matching enables differentiated component selection, improving the customization and consistency of finished product performance; The stress relief design of layered dispensing and gradient curing significantly reduces the damage of curing internal stress to microcrack structures, and significantly improves assembly yield and long-term device stability. A new composite optical fiber transition connection structure is added to ensure low-loss coupling of the multi-material collaborative transmission optical path and improve the overall device performance.

Claims

1. A microcracked optical waveguide mounting and integration process for a distributed photonic synaptic computing unit, characterized in that, The steps are as follows: S1 Vision High-Precision Alignment: The multilayer microcracked optical waveguide substrate is fixed to a high-precision tooling fixture. The coordinates and topographic parameters of the assembly cavities between each layer are collected by the machine vision system to determine the installation position of each photonic synaptic computing unit. S2 Dynamic Weight Matching: Based on the weight distribution requirements of the target optical path, the corresponding photonic synaptic computing unit with the corresponding parameter specifications is matched, and the unit is precisely implanted into the corresponding accommodating cavity according to the alignment coordinates; S3 Sealing Stress Relief: An elastic optical encapsulating adhesive is injected into the cavity using a layered dispensing process. The internal stress of the adhesive is gradually released through a gradient temperature curing mode, thus completing the sealing integration.

2. The integration process according to claim 1, characterized in that, In step S1, the visual alignment accuracy is ≤2μm, and the positioning mark on the edge of the accommodating cavity is used as the identification reference.

3. The integration process according to claim 1, characterized in that, In step S2, the optical path transmission signal is collected synchronously, and the unit position is finely adjusted based on the real-time signal feedback until the optical path performance reaches the preset threshold.

4. The integration process according to claim 1, characterized in that, In step S3, the elastic modulus of the elastic optical encapsulant is matched with the residual stress field of the substrate, and the curing time range is 24h~48h. The curing process is divided into 3 stages of gradient heating.

5. The integration process according to claim 1, characterized in that, The sealing and curing process can be selected from any one of gradient temperature curing, gradient pressure curing, and UV segmented curing.

6. The integration process according to claim 1, characterized in that, The coupling interface between the photonic synaptic computing unit and the microcracked optical path adopts a quartz fiber-plastic fiber composite transition connection structure to achieve low-loss coupling between different transmission paths.

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