A positioning device for a multilayer circuit board

Abstract

The application discloses a positioning device for multilayer circuit boards, comprising a bottom table, a counterweight table, vertical frames, a top table and a dial plate table, the counterweight table is installed on one side of the bottom table, two groups of vertical frames are symmetrically installed on both sides of the top of the bottom table, the top table is arranged on the top of the vertical frames, and the dial plate table is installed on one side of the top table; the positioning device further comprises a multilayer circuit board positioning light source calibration unit arranged on one side of the dial plate table and used for light source auxiliary calibration when the multilayer circuit board is placed, and a multilayer circuit board flatness calibration unit arranged on the surface area of the bottom table and used for flatness calibration placement when the multilayer circuit board is stacked. The application realizes accurate positioning guidance through the light source calibration unit, guarantees the flatness of the multilayer circuit board stacking through the flatness calibration unit and the flatness sensor in the glue pressing, has high positioning precision and good stability, and effectively improves the qualified rate of multilayer circuit board processing.

Description

Technical Field

[0001] This invention relates to the field of auxiliary equipment for circuit board processing, specifically a positioning device for multilayer circuit boards. Background Technology

[0002] In the fabrication of multilayer circuit boards, precise positioning and stacking of the multilayer circuit boards are required for subsequent lamination, soldering, and other processing steps. Currently used multilayer circuit board positioning devices mostly only provide simple support and positioning functions, and have several shortcomings in practical applications: Firstly, they lack effective positioning guidance structures, making it easy for multilayer circuit boards to shift during placement, resulting in insufficient positioning accuracy; secondly, the flatness detection of the multilayer circuit boards after stacking is not precise enough, and real-time calibration during positioning is difficult. Uneven stacking can easily lead to problems such as poor soldering and uneven lamination in subsequent processing, affecting the processing quality and yield of the circuit boards.

[0003] Furthermore, the pressing structure of existing positioning devices is prone to damaging the circuit board surface when in contact with it. Additionally, the flatness detection elements have poor installation stability and protection, and are susceptible to dust, oil, and other contaminants after prolonged use, leading to a decrease in detection accuracy. Therefore, there is an urgent need for a multi-layer circuit board positioning device with precise positioning guidance, real-time flatness calibration, and good protective performance to address the problems existing in current technologies. Summary of the Invention

[0004] The purpose of this invention is to provide a positioning device for multilayer circuit boards to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a positioning device for a multilayer circuit board, comprising a base, a counterweight, a vertical frame, a top platform, and a shifting plate platform. The counterweight is installed on one side of the base, the vertical frame is configured in two sets, and the two sets of vertical frames are symmetrically installed on both sides of the top of the base, the top platform is located on the top of the vertical frame, the shifting plate platform is installed on one side of the top platform, a dustproof chamber is provided on the top of the top platform, and an observation port is installed on one side of the dustproof chamber. A multi-layer circuit board positioning light source calibration unit is disposed on one side of the dialing table and is used to perform auxiliary light source calibration when the multi-layer circuit board is placed. A multi-layer circuit board flatness calibration unit is disposed on the surface area of ​​the base platform and is used to perform flatness calibration placement when the circuit board is stacked in multiple layers.

[0006] Furthermore, the multi-layer circuit board positioning light source calibration unit includes a fixed base, which is installed on one side of the dial plate platform. An electric hinge is installed on one side of the fixed base, and a rotating block is installed on the rotating end of the electric hinge. A calibration lamp is embedded in the rotating block.

[0007] Furthermore, the multilayer circuit board flatness calibration unit includes a platform panel, which is mounted on the surface of the base platform. The top of the platform panel is provided with an assembly groove, and a support strip is placed and installed in the assembly groove on the surface of the platform panel. A thin film pressure sensor is installed on the surface of the support strip.

[0008] Furthermore, a linear cylinder is provided on the top of the platform. The linear cylinders are symmetrically arranged in two groups. Each group of linear cylinders is symmetrically equipped with two sets of vertical tubes. The vertical tubes penetrate the top of the platform, and a movable rod is slidably installed inside the vertical tubes.

[0009] Furthermore, a through hole is provided on the top of the platform, through which the moving end of the linear cylinder passes, and a fixing plate is installed on the moving end of the linear cylinder and the bottom of the movable rod.

[0010] Furthermore, the support bar has through grooves at both ends of its top, and mounting screws are installed in the through grooves.

[0011] Furthermore, a pressure plate is installed at the bottom of the fixing plate, and pressure adhesive is symmetrically installed at the bottom of the pressure plate.

[0012] Furthermore, the cross-sectional area of ​​the pressure plate is larger than the cross-sectional area of ​​the fixing plate.

[0013] Furthermore, a flatness sensor is installed at the bottom of the adhesive tape.

[0014] Furthermore, the adhesive tape has an inner cavity adapted to the flatness sensor, and a sealing gasket is provided at the opening of the inner cavity, the sealing gasket being flush with the bottom surface of the adhesive tape.

[0015] Compared with the prior art, the beneficial effects of the present invention are: 1. In use, this invention sets up a multi-layer circuit board positioning light source calibration unit, and uses an electric hinge to drive the rotating block and calibration lamp to rotate. The illumination angle of the calibration lamp can be adjusted to achieve precise light source guidance during the placement of multi-layer circuit boards, effectively avoiding circuit board placement deviation and improving positioning accuracy. At the same time, the calibration lamp is embedded in the rotating block, which provides better protection and is not easily affected by the external environment.

[0016] 2. During use, the thin-film pressure sensor on the surface of the support strip in the multi-layer circuit board flatness calibration unit can detect the pressure distribution of the multi-layer circuit boards in real time. Together with the flatness sensor in the adhesive, it can comprehensively detect the flatness of the circuit board from both the top and bottom directions, ensuring flat stacking and avoiding quality problems in subsequent processing. The support strip is installed through the mounting slot and mounting screws, which is convenient for disassembly, assembly and position adjustment, and can be adapted to circuit boards of different sizes.

[0017] 3. During use, the linear cylinder at the top of the platform drives the fixed plate and pressure plate to move up and down, thereby achieving the pressing and positioning of the multi-layer circuit board. The cooperation of the vertical tube and the movable rod can improve the stability of the pressing process and prevent the pressure plate from tilting. The adhesive at the bottom of the pressure plate is made of flexible material, which can effectively buffer the pressing force and avoid damaging the surface of the circuit board. At the same time, the inner cavity inside the adhesive provides a stable installation space for the flatness sensor. The sealing gasket at the opening can prevent dust and oil from entering the inner cavity, ensuring the detection accuracy and service life of the flatness sensor.

[0018] 4. During use, the counterweight platform can improve the overall stability of the device and prevent the device from shaking during the pressing and positioning process; the overall structure is reasonably designed, the components are coordinated, and the operation is convenient. It can effectively improve the processing efficiency and pass rate of multi-layer circuit boards, and has good practical value and promotion prospects. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall device of the present invention; Figure 2 This is a schematic diagram of the linear cylinder, vertical tube, and movable rod in this invention; Figure 3 This is a schematic diagram of the pressure plate and the adhesive pressing part in this invention; Figure 4 This is a schematic diagram of the fixing base part in the present invention; Figure 5 This is a schematic diagram of the platform panel portion of the present invention; Figure 6 This is a schematic diagram of the support strip and through groove in this invention; Figure 7 This is a schematic diagram of the electric hinge and rotating block in this invention.

[0020] In the diagram: 1. Base platform; 2. Counterweight platform; 3. Vertical frame; 4. Top platform; 41. Linear cylinder; 42. Vertical tube; 43. Movable rod; 44. Fixed plate; 45. Fixed base; 46. Electric hinge; 47. Rotating block; 5. Dustproof chamber; 51. Observation port; 6. Turning plate platform; 7. Table panel; 8. Support strip; 81. Through groove; 9. Pressure plate; 91. Adhesive pressing. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] In the description of this invention, it should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0023] In addition, a fixed connection refers to a connection in which parts or components are fixed and there is no relative movement; a transmission connection refers to a connection in which mechanical motion or torque is transmitted to other working parts through a transmission component; a sliding connection refers to a connection in which two objects are in contact but not fixed and can slide relative to each other; and a rotational connection refers to a connection in which two objects are in contact but not fixed and can rotate relative to each other.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0025] Example 1 Please see Figures 1-7 This invention provides a technical solution: a positioning device for multilayer circuit boards, comprising a base platform 1, a counterweight platform 2, a vertical frame 3, a top platform 4, and a shifting plate platform 6. The counterweight platform 2 is fixedly installed on one side of the base platform 1 by bolts to improve the overall stability of the device and prevent the device from shaking during the pressing and positioning process. The vertical frame 3 is configured as two sets, and the two sets of vertical frames 3 are symmetrically welded to both sides of the top of the base platform 1. The top platform 4 is fixedly installed on the top of the vertical frame 3 by bolts. The shifting plate platform 6 is welded to one side of the top platform 4. A dustproof chamber 5 is provided on the top of the top platform 4, and an observation port 51 is installed on one side of the dustproof chamber 5. The shifting plate platform 6 is used to assist in the loading and positioning guidance of the multilayer circuit boards.

[0026] A multi-layer circuit board positioning light source calibration unit is located on one side of the dial plate 6. It is used for auxiliary light source calibration when placing multi-layer circuit boards. The multi-layer circuit board positioning light source calibration unit includes a fixing base 45, which is bolted to one side of the dial plate 6. An electric hinge 46 is installed on one side of the fixing base 45 by screws. A rotating block 47 is welded to the rotating end of the electric hinge 46. A calibration lamp is embedded in the rotating block 47. The calibration lamp is an LED high-brightness lamp with a wide illumination range and adjustable brightness. The electric hinge 46 can drive the rotating block 47 and the calibration lamp to rotate, thereby adjusting the illumination angle of the calibration lamp to adapt to multi-layer circuit boards of different sizes and placement positions, achieving precise light source guidance and avoiding circuit board placement misalignment.

[0027] A multi-layer circuit board flatness calibration unit is located on the surface of the base platform 1. It is used for flatness calibration during multi-layer stacking of circuit boards. The multi-layer circuit board flatness calibration unit includes a platform panel 7, which is bolted to the surface of the base platform 1. The top of the platform panel 7 has an assembly groove, and a support bar 8 is placed in the assembly groove. A thin-film pressure sensor is attached to the surface of the support bar 8. The thin-film pressure sensor is a flexible pressure sensor that can detect the pressure distribution during multi-layer circuit board stacking in real time and determine the flatness of the circuit board stacking by the pressure distribution. Through slots 81 are opened at both ends of the top of the support bar 8. Assembly screws are installed in the through slots 81. The support bar 8 can be fixed in the assembly groove by the assembly screws. At the same time, the design of the through slots 81 facilitates the adjustment of the installation position of the support bar 8 to adapt to circuit boards of different sizes.

[0028] A linear cylinder 41 is bolted to the top of the top platform 4. Two sets of linear cylinders 41 are symmetrically arranged. Each set of linear cylinders 41 is symmetrically equipped with two sets of vertical tubes 42. The vertical tubes 42 are welded to the top of the top platform 4 and pass through the top platform 4. A movable rod 43 is slidably installed inside the vertical tube 42. The movable rod 43 is clearance-fitted with the vertical tube 42 and can slide up and down along the vertical tube 42. A through hole is opened at the top of the top platform 4. The moving end of the linear cylinder 41 passes through the through hole. A fixed plate 44 is bolted to the moving end of the linear cylinder 41 and the bottom of the movable rod 43. When the linear cylinder 41 works, it can drive the fixed plate 44 to move up and down. The movable rod 43 moves synchronously with the fixed plate 44, which plays a guiding and stabilizing role and prevents the fixed plate 44 from tilting during the movement.

[0029] A pressure plate 9 is bolted to the bottom of the fixing plate 44. The cross-sectional area of ​​the pressure plate 9 is larger than that of the fixing plate 44, which increases the contact area for pressing and improves the pressing stability. A pressure adhesive 91 is symmetrically attached to the bottom of the pressure plate 9. The pressure adhesive 91 is made of silicone material, which has good flexibility and elasticity and can effectively buffer the pressing force to avoid damage to the circuit board surface during the pressing process. A flatness sensor is installed in the inner bottom of the pressure adhesive 91. The flatness sensor adopts a miniature laser flatness sensor with high detection accuracy. An inner cavity adapted to the flatness sensor is opened in the pressure adhesive 91. A sealing gasket is provided at the opening of the inner cavity. The sealing gasket is a rubber sealing gasket and is flush with the bottom surface of the pressure adhesive 91. The sealing gasket can prevent dust, oil and other contaminants from entering the inner cavity, ensuring the detection accuracy and service life of the flatness sensor.

[0030] The working principle of this embodiment is as follows: When using this positioning device for multi-layer circuit boards, firstly, according to the size of the multi-layer circuit board to be processed, adjust the position of the support bar 8 in the mounting slot of the table panel 7, and fix the support bar 8 with mounting screws; then, adjust the illumination angle of the calibration lamp through the electric hinge 46 so that the light from the calibration lamp accurately illuminates the predetermined placement area of ​​the table panel 7; place the multi-layer circuit board sequentially on the support bar 8 of the table panel 7, achieving precise placement under the guidance of the light from the calibration lamp; after placement, start the linear cylinder 41, which drives the fixed... The fixing plate 44, pressure plate 9, and adhesive 91 move downwards. The adhesive 91 contacts the surface of the multilayer circuit board and applies a certain pressure to achieve pressing and positioning. During this process, the thin film pressure sensor on the surface of the support bar 8 detects the pressure distribution in real time, and the flatness sensor in the adhesive 91 detects the flatness of the circuit board in real time. If the flatness is not up to standard, the pressing force of the linear cylinder 41 can be adjusted or the placement position of the circuit board can be readjusted to ensure that the multilayer circuit board is stacked flat. After the pressing and positioning is completed, the linear cylinder 41 drives the pressure plate 9 to reset, and subsequent processing steps can be carried out.

[0031] Working principle: First, the counterweight platform 2 ensures the overall stability of the device. Based on the dimensions of the multi-layer circuit board to be processed, the mounting screws in the through slots 81 at both ends of the support bar 8 are used to adjust and fix the position of the support bar 8 in the mounting slot of the table panel 7. Then, the multi-layer circuit board positioning light source calibration unit is activated. The electric hinge 46 drives the rotating block 47 to rotate the calibration lamp to a suitable angle, allowing the light emitted by the calibration lamp to be accurately projected onto the predetermined placement area of ​​the table panel 7, providing light source guidance for the placement of the multi-layer circuit board to achieve initial positioning. The operator then stacks the multi-layer circuit boards sequentially onto the support bar 8. The thin-film pressure sensor on the surface of the support bar 8 detects the pressure distribution during the stacking process in real time and synchronously feeds it back to the control system to determine the initial flatness. After stacking is completed, the two sets of linear cylinders 41 on the top of the top platform 4 are activated synchronously, their moving ends passing through the through holes of the top platform 4 to drive... The fixed plate 44 moves downward, and the movable rod 43 inside the vertical tube 42 slides synchronously with the fixed plate 44 to ensure the stability of the movement. The fixed plate 44 drives the pressure plate 9 and the adhesive 91 symmetrically installed at the bottom to gradually approach and adhere to the surface of the multilayer circuit board to achieve pressing and positioning. During the pressing process, the flatness sensor at the bottom of the adhesive 91 detects the flatness of the circuit board surface in real time, and the sealing gasket at the inner cavity and opening of the adhesive 91 that is compatible with the flatness sensor can ensure the detection accuracy. If the thin film pressure sensor or the flatness sensor detects that the flatness is not up to standard, the control system can provide feedback signals to adjust the pressing force of the linear cylinder 41 or prompt the operator to readjust the placement position of the circuit board. After the detection data meets the standard, the linear cylinder 41 maintains the pressing force for a period of time to ensure stable positioning. After the positioning is completed, the linear cylinder 41 drives the pressure plate 9 to reset, and the subsequent processing steps can be carried out.

[0032] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A positioning device for multilayer circuit boards, characterized in that: It includes a base platform (1), a counterweight platform (2), a vertical frame (3), a top platform (4), and a lever platform (6). The counterweight platform (2) is installed on one side of the base platform (1). The vertical frame (3) is set in two sets, and the two sets of vertical frames (3) are symmetrically installed on both sides of the top of the base platform (1). The top platform (4) is set on the top of the vertical frame (3). The lever platform (6) is installed on one side of the top platform (4). A dustproof chamber (5) is set on the top of the top platform (4), and an observation port (51) is installed on one side of the dustproof chamber (5). Multi-layer circuit board positioning light source calibration unit, the multi-layer circuit board positioning light source calibration unit is set on one side of the dial plate stage (6), and is used to perform light source auxiliary calibration when the multi-layer circuit board is placed; A multi-layer circuit board flatness calibration unit is disposed on the surface area of ​​the base (1) and is used to perform flatness calibration placement when the circuit board is stacked in multiple layers.

2. The positioning device for a multilayer circuit board according to claim 1, characterized in that: The multi-layer circuit board positioning light source calibration unit includes a fixed base (45), which is installed on one side of the dial plate (6). An electric hinge (46) is installed on one side of the fixed base (45), and a rotating block (47) is installed on the rotating end of the electric hinge (46). A calibration lamp is embedded in the rotating block (47).

3. A positioning device for a multilayer circuit board according to claim 2, characterized in that: The multilayer circuit board flatness calibration unit includes a platform (7), which is mounted on the surface of the base (1). The top of the platform (7) is provided with an assembly groove, and a support strip (8) is placed and installed in the assembly groove on the surface of the platform (7). A thin film pressure sensor is installed on the surface of the support strip (8).

4. A positioning device for a multilayer circuit board according to claim 3, characterized in that: The top of the platform (4) is provided with a linear cylinder (41). The linear cylinder (41) is symmetrically arranged in two groups. Each group of linear cylinders (41) is symmetrically installed with two sets of vertical tubes (42). The vertical tubes (42) penetrate the top of the platform (4). A movable rod (43) is slidably installed inside the vertical tubes (42).

5. A positioning device for a multilayer circuit board according to claim 4, characterized in that: The top of the platform (4) is provided with a through hole, the moving end of the linear cylinder (41) passes through the through hole, and a fixing plate (44) is installed at the bottom of the moving end of the linear cylinder (41) and the movable rod (43).

6. A positioning device for a multilayer circuit board according to claim 1, characterized in that: The support bar (8) has through grooves (81) at both ends of its top, and mounting screws are installed in the through grooves (81).

7. A positioning device for a multilayer circuit board according to claim 1, characterized in that: The bottom of the fixing plate (44) is equipped with a pressure plate (9), and the bottom of the pressure plate (9) is symmetrically equipped with pressure adhesive (91).

8. A positioning device for a multilayer circuit board according to claim 7, characterized in that: The cross-sectional area of ​​the pressure plate (9) is greater than that of the fixed plate (44).

9. A positioning device for a multilayer circuit board according to claim 7, characterized in that: A flatness sensor is installed at the bottom of the adhesive tape (91).

10. A positioning device for a multilayer circuit board according to claim 9, characterized in that: The pressure adhesive (91) has an inner cavity adapted to the flatness sensor. The opening of the inner cavity is provided with a sealing gasket, which is flush with the bottom surface of the pressure adhesive (91).

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