A semiconductor chip package placement machine
By using a robotic arm and vacuum chuck in conjunction with an adjustable-spacing slide clamping structure, the problems of low efficiency and chip damage caused by existing pick-and-place machines are solved, achieving efficient and stable chip packaging.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- TIANJIN BESIRAN TECHNOLOGY CO LTD
- Filing Date
- 2026-05-07
- Publication Date
- 2026-07-24
AI Technical Summary
Existing semiconductor chip placement machines are inefficient and prone to chip damage due to excessive clamping.
A semiconductor chip packaging and placement machine was designed, which uses a robotic arm and vacuum chuck to automate chip placement. Combined with an adjustable-spacing slide and a buffer clamping structure, it achieves continuous feeding and stable clamping.
It enables continuous chip placement, improving placement efficiency, and protects the chips from damage through buffer clamping.
Smart Images
Figure CN122458729A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor chip technology, specifically to a semiconductor chip packaging and placement machine. Background Technology
[0002] Semiconductors are materials whose conductivity at room temperature is between that of conductors and insulators. Semiconductors have a wide range of applications in radios, televisions, and temperature measurement. For example, diodes are devices made of semiconductors. Semiconductors are materials whose conductivity can be controlled, ranging from that of insulators to conductors.
[0003] A chip is a silicon wafer containing integrated circuits. It is very small and is often part of a computer or other electronic device. It belongs to the semiconductor field. During the packaging process, individual chips need to be mounted, so a chip mounting machine is needed to perform the mounting process.
[0004] Currently, most semiconductor chip mounting processes involve manually placing the chip on a mounting table, using screws to move clamps to both sides for fixation, and then manually placing the chip onto the chip. After mounting, the chip is removed from the mounting device before transferring the next chip to the device. However, this mounting method cannot continuously mount chips, making the process cumbersome, time-consuming, and inefficient. Furthermore, the screws and clamps can easily cause over-clamping, which can damage the semiconductor chip. Summary of the Invention
[0005] The purpose of this invention is to provide a semiconductor chip packaging and placement machine to solve the problems mentioned in the background art, such as slow efficiency, cumbersome placement process, and excessive clamping during chip clamping, which can cause damage to the chip. To achieve the above objective, this invention provides the following technical solution: a semiconductor chip packaging and placement machine, including a base, a placement tray fixed to one end of the base, a packaging and placement component placed on the top of the placement tray, a robotic arm mounted on one end of the base, a connecting block hinged to the end of the robotic arm, a vacuum suction cup fixed to the bottom of the connecting block, a rotatable column mounted in the middle of the base, a mounting plate fixed to the top of the column, a mounting base fixed to the top of the mounting plate, a horizontally sliding slide on the surface of the mounting base, and a semiconductor chip body clamped on the top of the mounting base.
[0006] Preferably, the vacuum suction cup adheres to the packaging patch.
[0007] Preferably, the encapsulation patches are stacked.
[0008] Preferably, a support is fixed to the bottom of the base, a motor is fixed to the end of the support, a transmission rod is fixedly connected to the output end of the motor, and a drive gear is fixedly sleeved on the outside of the transmission rod.
[0009] Preferably, a support shaft is fixed to the surface of the base, and a driven gear is rotatably sleeved on the top of the support shaft, the driven gear meshing with the driving gear.
[0010] Preferably, a rotating rod is rotatably connected to the middle of the mounting base, and a rocker arm is fixed to the end of the rotating rod.
[0011] Preferably, a screw is sleeved on the outside of the rotating rod, and two screws are provided, which are symmetrically arranged about the axis of the rotating rod.
[0012] Preferably, the slide block is threadedly connected to the screw, and there are two slide blocks, which slide in the same direction.
[0013] Preferably, a guide rod is fixed in the middle of the mounting base, and the slide block is slidably sleeved with the guide rod.
[0014] Preferably, a spring is fixed to the side wall of the slide block, a slide rod is embedded inside the spring, a clamp is fixed to the end of the slide rod, the slide rod is slidably connected to the slide block, and two clamps are provided, which are attached to both sides of the semiconductor chip body.
[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: In this invention, an adjustable-spacing slide is provided, which can be used for semiconductor chips of different sizes and has a buffering clamping effect, thereby ensuring the stability of the semiconductor chip during the mounting process while providing a protective effect.
[0016] This invention enables continuous feeding and placement operations, thereby shortening the feeding time and achieving continuous placement processing, thus improving placement efficiency. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall isometric structure of the present invention; Figure 3 This is a schematic diagram of the overall front view of the present invention; Figure 4 For the present invention Figure 1 Schematic diagram of the connection structure of components such as mounting plate, mounting base, and slide; Figure 5 For the present invention Figure 4 Schematic diagram of the equiaxed side structure; Figure 6 For the present invention Figure 5 A top view of the connection structure of components such as the central column, driving gear, and driven gear.
[0018] In the diagram: 1. Base; 2. Placement tray; 3. Package chip; 4. Robotic arm; 5. Connecting block; 6. Vacuum suction cup; 7. Rotary column; 71. Support; 72. Motor; 73. Transmission rod; 74. Drive gear; 75. Driven gear; 76. Support shaft; 8. Mounting plate; 9. Mounting base; 10. Slide; 1001. Rotating rod; 1002. Rocker arm; 1003. Screw; 1004. Guide rod; 1005. Spring; 1006. Slide rod; 1007. Clamping plate; 11. Semiconductor chip body. Detailed Implementation
[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0020] Please see Figures 1 to 6 The present invention provides a technical solution: a semiconductor chip packaging and placement machine, including a base 1, a placement tray 2 fixed to one end of the base 1, a packaging and placement component 3 placed on the top of the placement tray 2, a robotic arm 4 mounted on one end of the base 1, a connecting block 5 hinged to the end of the robotic arm 4, a vacuum suction cup 6 fixed to the bottom of the connecting block 5, a rotatable rotating column 7 mounted in the middle of the base 1, a mounting plate 8 fixed to the top of the rotating column 7, a mounting seat 9 fixed to the top of the mounting plate 8, a horizontally sliding slide 10 provided on the surface of the mounting seat 9, and a semiconductor chip body 11 clamped at the top of the mounting seat 9.
[0021] In this embodiment, as Figure 1 , Figure 2 and Figure 3 As shown, the vacuum suction cup 6 is adsorbed and bonded to the packaged patch 3.
[0022] In this embodiment, as Figure 1 , Figure 2 and Figure 3 As shown, the packaged surface mount components 3 are stacked.
[0023] It should be noted that the robotic arm 4 drives the vacuum suction cup 6 to the surface of the packaged chip 3 on the placement plate 2 to perform vacuum adsorption, and then the robotic arm 4 delivers it to the surface of the held semiconductor chip body 11 for chip packaging. At the same time, the robotic arm 4 is a prior art in the field, and the specific model and specifications of it need to be selected and determined according to the actual specifications of the device. The specific selection and calculation method adopts the prior art in the field, so it will not be elaborated.
[0024] In this embodiment, as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, a support 71 is fixed to the bottom of the base 1, a motor 72 is fixed to the end of the support 71, a transmission rod 73 is fixedly connected to the output end of the motor 72, and a drive gear 74 is fixedly sleeved on the outside of the transmission rod 73.
[0025] In this embodiment, as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, a support shaft 76 is fixed on the surface of the base 1, and a driven gear 75 is rotatably sleeved on the top of the support shaft 76. The driven gear 75 meshes with the driving gear 74.
[0026] In this embodiment, as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, a rotating rod 1001 is rotatably connected to the middle of the mounting base 9, and a rocker arm 1002 is fixed to the end of the rotating rod 1001.
[0027] In this embodiment, as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, a screw 1003 is sleeved on the outside of the rotating rod 1001. There are two screws 1003, which are arranged symmetrically about the rotating rod 1001.
[0028] In this embodiment, as Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, the slide block 10 is threadedly connected to the screw 1003. There are two slide blocks 10, and the two slide blocks 10 slide in the same direction.
[0029] In this embodiment, as Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, a guide rod 1004 is fixed in the middle of the mounting base 9, and the slide block 10 is slidably connected to the guide rod 1004.
[0030] It should be noted that two screws 1003 are symmetrically arranged. When the two screws 1003 rotate synchronously, their external slides 10 slide horizontally in the same direction, thereby adjusting the clamping distance according to the size of the semiconductor chip body 11.
[0031] In this embodiment, as Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 As shown, a spring 1005 is fixed to the side wall of the slide block 10, and a slide rod 1006 is embedded inside the spring 1005. A clamping plate 1007 is fixed to the end side of the slide rod 1006. The slide rod 1006 is slidably connected to the slide block 10. There are two clamping plates 1007, and the two clamping plates 1007 are attached to both sides of the semiconductor chip body 11.
[0032] It should be noted that the specific model and specifications of the motor 72 need to be selected and determined based on the actual specifications of the device. The specific selection and calculation method adopts the existing technology in this field, so it will not be elaborated here.
[0033] The method of use and advantages of this invention: The semiconductor chip packaging and placement machine operates as follows: like Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 As shown, when packaging and mounting semiconductor chips, the semiconductor chip to be mounted is first placed between two clamping plates 1007. Then, the rocker arm 1002 is manually rotated to drive the rotating rod 1001 to rotate within the mounting base 9. When the rotating rod 1001 rotates, its externally symmetrical screw 1003 rotates accordingly. The sliding block 10 with the external thread of the screw 1003 then drives the clamping plate 1007 to slide horizontally along the guide rod 1004. The clamping plates 1007 on its end side then move closer to each other towards the two ends of the semiconductor chip body 11 to clamp it. During the clamping process, the clamping plate 1007 contacts the semiconductor chip body 11, and the spring 1005 deforms under force to buffer the impact, thus providing a buffering clamping effect for the semiconductor chip. This ensures the stability of the semiconductor chip during the mounting process while also providing a protective effect. Then, the robotic arm 4 is activated to pick up the packaged chip 3 on the placement tray 2 and send it to the semiconductor chip body 11 for chip placement. After the operation is completed, the motor 72 is activated to drive the transmission rod 73 to rotate the drive gear 74. When the drive gear 74 rotates, it meshes with the driven gear 75. The driven gear 75 is subjected to force and rotates around the support shaft 76, which drives the central rotating column 7 to rotate in the base 1. The top of the driven gear 75 is rotated by the semiconductor chip body 11 it is holding, and then it is processed again by the robotic arm 4. At the same time, the operator feeds the semiconductor chip. The repeated operation allows for continuous chip placement, improving chip placement efficiency.
[0034] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely preferred examples and are not intended to limit the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of the present invention is defined by the appended claims and their equivalents.
Claims
1. A semiconductor chip packaging and placement machine, comprising a base (1), characterized in that: A placement disk (2) is fixed to the end side of the base (1), and a packaged patch (3) is placed on the top of the placement disk (2). A robotic arm (4) is installed on the end side of the base (1), and a connecting block (5) is hinged to the end of the robotic arm (4). A vacuum suction cup (6) is fixed to the bottom of the connecting block (5). A rotatable rotating column (7) is installed in the middle of the base (1). A mounting plate (8) is fixed to the top of the rotating column (7). A mounting base (9) is fixed to the top of the mounting plate (8). A horizontally sliding slide (10) is provided on the surface of the mounting base (9). A semiconductor chip body (11) is held in the top of the mounting base (9).
2. The semiconductor chip packaging and placement machine according to claim 1, characterized in that: The vacuum suction cup (6) is adsorbed and bonded to the encapsulation patch (3).
3. A semiconductor chip packaging and placement machine according to claim 1, characterized in that: The encapsulation patch (3) is stacked.
4. A semiconductor chip packaging and placement machine according to claim 1, characterized in that: The base (1) has a support (71) fixed at its bottom. A motor (72) is fixed at the end of the support (71). A transmission rod (73) is fixedly connected to the output end of the motor (72). A drive gear (74) is fixedly sleeved on the outside of the transmission rod (73).
5. A semiconductor chip packaging and placement machine according to claim 4, characterized in that: A support shaft (76) is fixed to the surface of the base (1), and a driven gear (75) is rotatably sleeved on the top of the support shaft (76). The driven gear (75) meshes with the driving gear (74).
6. A semiconductor chip packaging and placement machine according to claim 1, characterized in that: A rotating rod (1001) is rotatably connected to the middle of the mounting base (9), and a rocker arm (1002) is fixed to the end of the rotating rod (1001).
7. A semiconductor chip packaging and placement machine according to claim 6, characterized in that: The rotating rod (1001) is sleeved with a screw (1003), and there are two screws (1003), which are arranged symmetrically about the rotating rod (1001).
8. A semiconductor chip packaging and placement machine according to claim 7, characterized in that: The slide (10) is threadedly connected to the screw (1003). There are two slides (10), and the two slides (10) slide in the same direction.
9. A semiconductor chip packaging and placement machine according to claim 6, characterized in that: The mounting base (9) has a guide rod (1004) fixed in the middle, and the slide (10) is slidably connected to the guide rod (1004).
10. A semiconductor chip packaging and placement machine according to claim 8, characterized in that: A spring (1005) is fixed to the side wall of the slide (10), and a slide rod (1006) is embedded inside the spring (1005). A clamping plate (1007) is fixed to the end side of the slide rod (1006). The slide rod (1006) is slidably connected to the slide (10). There are two clamping plates (1007), and the two clamping plates (1007) are attached to both sides of the semiconductor chip body (11).