Automatic resin material supply device

Abstract

The present invention provides an automatic resin material supply device. The automatic resin material supply device includes: a hopper (1010) for receiving granular resin material for forming encapsulating resin; a feeder (1020) for receiving resin material falling from the hopper (1010) and conveying the resin material laterally; and a container (1003) for receiving resin material falling from the feeder (1020). The hopper (1010) includes a hopper body (1030) and a cooling section (1040) configured to at least partially cover the outer peripheral surface of the hopper body (1030). The feeder (1020) includes a tray section (1021) for receiving resin material falling from the hopper (1010) and a vibration application device (1022) for vibrating the tray section (1021). The cooling section (1040) has a fluid inlet (1041a) and a fluid outlet (1041b), and a channel (1040c) is provided inside the cooling section (1040) to allow the cooling fluid to pass from the fluid inlet (1041a) to the fluid outlet (1041b).

Description

Technical Field

[0001] This invention relates to an automatic resin material supply device. Background Technology

[0002] To improve the moisture sensitivity level (MSL) of communication modules, the development and adoption of encapsulating resin materials with high adhesion and low elasticity are ongoing. To achieve high adhesion and low elasticity, there is a trend towards using encapsulating resin materials with lower molecular weights than before. Furthermore, due to the miniaturization and thinning of communication modules, there is a requirement for easy and reliable filling of narrow gaps with resin. Therefore, the development and adoption of small-particle-size fillers are currently underway. While viscosity often increases when fillers are made with smaller particle sizes, the trend towards using low-molecular-weight resins as encapsulating resin materials is evident in order to suppress this increase and ensure flowability.

[0003] In addition, Japanese Patent Application Publication No. 2008-29276 (Patent Document 1) describes a food hopper component and a fluid circulation device.

[0004] Patent Document 1: Japanese Patent Application Publication No. 2008-29276

[0005] Low-molecular-weight resins melt easily at room temperature. When low-molecular-weight resins are granulated, their melting at room temperature leads to a phenomenon where the particles solidify at the interface, resulting in a tendency to agglomerate. Once agglomeration occurs, the normal supply of encapsulating resin material becomes impossible. Therefore, this type of resin material must be stored in a condition that prevents agglomeration. Furthermore, to support continuous production in the factory, a continuous and automated supply of resin material is required. Summary of the Invention

[0006] Therefore, the object of the present invention is to provide an automatic resin material supply device that can store granular resin material in a state where it is not prone to clumping, and can provide continuous automatic supply sufficient to cope with continuous production in a factory.

[0007] To achieve the above objectives, an automatic resin material supply device based on the present invention comprises: a hopper for receiving granular resin material for forming encapsulating resin; a feeder for laterally conveying the resin material while receiving it falling from the hopper; and a container for receiving the resin material falling from the feeder. The hopper includes a hopper body and a cooling section configured to at least partially cover the outer peripheral surface of the hopper body. The feeder includes a tray portion for receiving the resin material falling from the hopper and a vibration application device for vibrating the tray portion. The cooling section has a fluid inlet and a fluid outlet. A channel is provided inside the cooling section for passing cooling fluid from the fluid inlet to the fluid outlet.

[0008] According to the present invention, granular resin materials can be stored in a state where they are not prone to clumping, and continuous automatic supply can be provided to meet the needs of continuous production in a factory. Attached Figure Description

[0009] Figure 1 This is a conceptual diagram of an automatic resin material supply device based on Embodiment 1 of the present invention.

[0010] Figure 2 This is a perspective view of the hopper body included in the automatic resin material supply device according to Embodiment 1 of the present invention.

[0011] Figure 3 This is a perspective view of the tray portion included in the automatic resin material supply device according to Embodiment 1 of the present invention.

[0012] Figure 4 This is a top view of the tray portion included in the automatic resin material supply device according to Embodiment 1 of the present invention.

[0013] Figure 5 This is an explanatory diagram showing the operating state of the automatic resin material supply device based on Embodiment 1 of the present invention.

[0014] Figure 6 The first explanatory figure shows a first example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0015] Figure 7 The second explanatory figure shows a first example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0016] Figure 8 The first explanatory figure shows a second example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0017] Figure 9 The second explanatory figure is a second example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0018] Figure 10 The first explanatory figure shows a third example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0019] Figure 11 This is a perspective view of the lower mold included in the third example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0020] Figure 12 A perspective view of the channel closure member included in the third example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0021] Figure 13 This is a diagram illustrating the operation of the channel closure member included in a third example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0022] Figure 14 The second explanatory figure shows a third example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0023] Figure 15 The first explanatory figure shows a fourth example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0024] Figure 16 The second explanatory figure shows a fourth example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0025] Figure 17 The third explanatory figure shows a fourth example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention.

[0026] Figure 18 This is an explanatory diagram of a fifth example of a resin molding apparatus that can be used in combination with the automatic resin material supply device based on Embodiment 1 of the present invention. Detailed Implementation

[0027] (Implementation Method 1)

[0028] Reference Figures 1 to 5The automatic resin material supply device according to Embodiment 1 of the present invention will be described below. The automatic resin material supply device in this embodiment is as follows: Figure 1 As shown.

[0029] An automatic resin material supply device includes: a hopper 1010 for receiving granular resin material for forming encapsulating resin; a feeder 1020 for receiving the resin material falling from the hopper 1010 and simultaneously conveying the resin material laterally; and a container 1003 for receiving the resin material falling from the feeder 1020. The hopper 1010 includes a hopper body 1030 and a cooling section 1040 configured to at least partially cover the outer peripheral surface of the hopper body 1030. The hopper body 1030 is removed separately as follows... Figure 2 As shown. The feeder 1020 includes a tray portion 1021 for receiving the resin material falling from the hopper 1010 and a vibration application device 1022 for vibrating the tray portion 1021. The situation after separately removing the tray portion 1021 is as follows. Figure 3 As shown. Viewing the tray section 1021 from directly above, the situation is as follows. Figure 4 As shown. The cooling section 1040 has a fluid inlet and a fluid outlet, and a channel 1040c is provided inside the cooling section 1040 to allow cooling fluid to pass from the fluid inlet to the fluid outlet. The container 1003 may be a container such as a cup. The shape of the container 1003 shown in this embodiment is merely an example and is not limited to this shape.

[0030] like Figure 1 As shown, the automatic resin material supply device in this embodiment includes: a weight measuring device 1004, a control unit 1005, and a fluid tank 1006. The weight measuring device may be, for example, an electronic balance. The container 1003 may be supported by the weight measuring device 1004. The output from the weight measuring device 1004 is transmitted to the control unit 1005. The vibration application device 1022 may be controlled by a signal from the control unit 1005. The fluid tank 1006 is connected to the cooling unit 1040 via a pipe. Cooling fluid is supplied from the fluid tank 1006 to the cooling unit 1040, and the cooling fluid that has circulated in the cooling unit 1040 returns to the fluid tank 1006. The cooling fluid may be a liquid. The cooling fluid may be water.

[0031] In this embodiment, the automatic resin material supply device operates as follows: Figure 5 As shown. In Figure 5 middle, Figure 1A portion of the automatic resin material supply device is shown in cross-sectional view. Granular resin material 6r is stored in the hopper body 1030. The cylindrical portion 1032 is filled with granular resin material 6r. A certain thickness of granular resin material 6r accumulates on the bottom surface 1023. Due to vibration, the resin material 6r accumulated on the bottom surface 1023 gradually moves to the left in the figure, thereby gradually shifting downwards within the cylindrical portion 1032 to correspond to the size of the newly created void below it.

[0032] In this embodiment, since the automatic resin material supply device includes a cooling section 1040 configured to at least partially cover the outer peripheral surface of the hopper body 1030, the resin material 6r stored inside the hopper body 1030 can be cooled. In the feeder 1020, the resin material 6r can be gradually fed out by vibrating the tray section 1021. As a result, the resin material 6r can be gradually removed into the container 1003 in the required amount. The resin material 6r can be supplied from the container 1003 to the required fixture or other parts as needed. Therefore, according to the automatic resin material supply device of this embodiment, granular resin material can be stored in a state where clumping is unlikely, and continuous automatic supply sufficient to cope with continuous factory production can be achieved.

[0033] In this embodiment, preferably, such as Figure 1 and Figure 2 As shown, the hopper body 1030 includes: a tapered portion 1031 whose cross-sectional area decreases when cut horizontally as it moves downwards; and a cylindrical portion 1032 extending downwards from the lower end of the tapered portion 1031. A cooling section 1040 is configured to cover the outer peripheral surfaces of the tapered portion 1031 and the cylindrical portion 1032. This configuration allows for smooth downward feeding of the resin material. Near the lower end of the tapered portion 1031, the resin material 6r travels in a narrow opening area, which could easily lead to agglomeration if conventionally present. However, in this embodiment, agglomeration is prevented by cooling through the cooling section 1040.

[0034] In this embodiment, preferably, in the cooling section 1040, the tapered cooling portion 1041 covering the outer peripheral surface of the tapered portion 1031 and the cylindrical cooling portion 1042 covering the outer peripheral surface of the cylindrical portion 1032 are separate. By adopting this structure, maintenance becomes easier since the cooling section 1040 is divided into at least two parts.

[0035] Furthermore, the tapered cooling section 1041 has a fluid inlet 1041a and a fluid outlet 1041b. The cylindrical cooling section 1042 has a fluid inlet 1042a and a fluid outlet 1042b. Viewed as a whole, the cooling section 1040 has fluid inlets 1041a and 1042a. The cooling section 1040 has fluid outlets 1041b and 1042b.

[0036] In this embodiment, the following structure is preferred. For example... Figure 3 As shown, the tray portion 1021 includes a bottom surface 1023 and a side wall 1024 extending upward from a portion of the outer edge of the bottom surface 1023. The bottom surface 1023 includes a receiving portion 1023a located below the hopper 1010 and a pouring portion 1023b extending laterally from the receiving portion 1023a. The pouring portion 1023b does not have a side wall 1024 at its end. Figure 1 As shown, the end of the pouring section 1023b is positioned above the container 1003. This configuration allows the resin material 6r to be properly guided into the container 1003.

[0037] In this embodiment, preferably, the bottom surface 1023 slopes downward from the receiving portion 1023a towards the end of the pouring portion 1023b. This construction allows the resin material to flow smoothly towards the end of the pouring portion 1023b. Furthermore, in Figure 1 For ease of explanation, the tilt angle of the bottom surface 1023 (i.e., the tilt angle of the tray portion 1021) is exaggerated in the illustration, but in reality, the tilt angle can be a smaller angle.

[0038] In this embodiment, preferably, a weight measuring device 1004 is provided to measure the total weight of the container 1003 and its contents or the weight of the contents of the container 1003, and a control unit 1005 is provided to control the operation of the vibration application device 1022. If the result measured by the weight measuring device 1004 reaches or exceeds a predetermined value, the control unit 1005 stops the conveying operation of the feeder 1020. With this structure, the operation of the feeder 1020 can be stopped when the container 1003 contains a predetermined amount of resin material 6r, and a predetermined amount of resin material 6r can be removed from the container 1003.

[0039] As shown in this embodiment, a fluid tank 1006 is preferably provided for maintaining the cooling fluid at a temperature below ambient temperature. The cooling fluid is guided from the fluid tank 1006 to the fluid inlet and from the fluid outlet back to the fluid tank 1006. With this configuration, since the cooling fluid at a temperature below ambient temperature is continuously supplied to the cooling section 1040, and the cooling fluid whose temperature has increased at the cooling section 1040 is continuously recycled back to the fluid tank 1006, the hopper body 1030 can be effectively cooled. Figure 1 In the example shown, the fluid inlet of the cooling section 1040 includes two inlets: fluid inlet 1041a and fluid inlet 1042a. Therefore, the pipe from the fluid tank 1006 to the fluid inlet branches along the way. Figure 1 In the example shown, the fluid outlet of the cooling section 1040 includes two outlets, fluid outlet 1041b and fluid outlet 1042b, so the pipe from the fluid outlet to the fluid tank 1006 forms a confluence along the way.

[0040] It should be noted that the resin material 6r, measured out in a predetermined amount via container 1003, is transported to the resin molding apparatus and placed inside the cavity provided within the resin molding apparatus. The cavity referred to here is the space in which molding takes place. Various types of resin molding apparatuses, as illustrated in the following examples, may be considered.

[0041] (First example of a resin molding apparatus)

[0042] Reference Figures 6 to 7 A first example of a resin molding apparatus that can be used in combination with the automatic resin material supply device in Embodiment 1 of the present invention will be described. The first example is of the type in which a cavity is formed in the lower mold.

[0043] like Figure 6 As shown, the resin molding apparatus includes a lower mold 2050 and an upper mold 2060. The lower mold 2050 includes a lower mold body 2051 and a sheet 2052. A component 2015 is configured to surround the sheet 2052 from its outer periphery. The component 2015 is connected to the lower mold body 2051 by a spring 2017. The spring 2017 is capable of elastically deforming the component 2015 to displace it in the height direction. The component 2015 is also referred to as a clamp.

[0044] The upper surface of sheet 2052 is located lower than the upper surface of component 2015. Because the upper surface of sheet 2052 is lower than the upper surface of component 2015, a cavity 10 is formed. A lower sheet 11 is configured to cover the inner surface of the cavity 10. The lower sheet 11 is a component provided to facilitate easy removal of the molded article from the lower mold 2050 after molding. The lower sheet 11 is also known as a release sheet.

[0045] Inside the cavity 10, granular resin material 6r is disposed on the lower sheet 11. This resin material 6r is a material that is supplied in a predetermined amount to a fixture or the like by an automatic resin material supply device according to Embodiment 1 of the present invention, and then transferred to the plate 2052 by a robot or the like. The object 1 is held at the lower surface of the upper mold 2060. The object 1 includes a substrate 1d and a component 1e mounted on the surface of the substrate 1d.

[0046] from Figure 6 The process begins with the resin material 6r being heated, and the lower mold 2050 and upper mold 2060 being brought closer together. The result is as follows... Figure 7 As shown. The originally granular resin material 6r changed shape due to heating. Figure 7 The viscosity decreases and becomes resin material 6e. Subsequently, the viscosity of resin material 6e further increases and solidifies. The end of substrate 1d is clamped by member 2015 and upper mold 2060. By clamping the area at the end of substrate 1d where component 1e is not installed, object 1 is held. Under the action of spring 2017, member 2015 applies force towards the upper mold 2060. Resin material 6e fills the space within cavity 10. Thus, component 1e is encapsulated by resin material on the surface of substrate 1d.

[0047] After the resin material 6e has cured, the lower mold 2050 and the upper mold 2060 are moved away from each other, and the article located on the upper side of the lower sheet 11 is removed, thereby obtaining a product in which the component 1e is covered by the encapsulating resin.

[0048] (Second example of a resin molding apparatus)

[0049] Reference Figures 8 to 9 A second example of a resin molding apparatus that can be used in combination with the automatic resin material supply device in Embodiment 1 of the present invention will be described. The second example is of the type in which a cavity is formed in the upper mold.

[0050] like Figure 8 As shown, the resin molding apparatus includes a lower mold 3050 and an upper mold 3060. The upper mold 3060 includes an upper mold body 3061 and a sheet 3062. A component 3015 is configured to surround the sheet 3062 from its outer periphery. The component 3015 is connected to the upper mold body 3061 by a spring 3017. The spring 3017 undergoes elastic deformation, thereby allowing the component 3015 to be displaced in the height direction. The component 3015 is also referred to as a clamping device.

[0051] The lower surface of sheet 3062 is positioned higher than the lower surface of component 3015. Because the lower surface of sheet 3062 is higher than the lower surface of component 3015, a cavity 10 is formed. An upper sheet 12 is configured to cover the inner surface of the cavity 10. The upper sheet 12 is a component provided to facilitate easy removal of the molded part from the upper mold 3060 after molding. The upper sheet 12 is also known as a release sheet.

[0052] Directly below the cavity 10, granular resin material 6r is disposed on the object 1. This resin material 6r is a material that has been supplied in a predetermined amount to a fixture or the like by an automatic resin material supply device according to Embodiment 1 of the present invention, and then transferred by a robot or the like. The object 1 is held by the upper surface of the lower mold 3050. The object 1 includes a substrate 1d and a component 1e mounted on the surface of the substrate 1d. The resin material 6r is placed on the object 1.

[0053] from Figure 8 As shown, the resin material 6r is heated, and the lower mold 3050 and upper mold 3060 are brought closer together. The result is as follows... Figure 9 As shown. The originally granular resin material 6r changed shape due to heating. Figure 9 The resin material 6e has been converted into a low-viscosity resin material. The end of the substrate 1d is clamped by the lower mold 3050 and the component 3015. By clamping the area of ​​the end of the substrate 1d where the component 1e is not installed, the object 1 is held. Under the action of the spring 3017, the component 3015 is forced towards the lower mold 3050. The resin material 6e fills the space within the cavity 10. In this way, the component 1e is encapsulated by the resin material on the surface of the substrate 1d.

[0054] After the resin material 6e has cured, the lower mold 3050 and the upper mold 3060 are moved away from each other, and the item located on the upper side of the lower mold 3050 is removed, thereby obtaining a product whose component 1e is covered by the encapsulating resin.

[0055] (A third example of a resin molding apparatus)

[0056] Reference Figures 10 to 14 A third example of a resin molding apparatus that can be used in conjunction with the automatic resin material supply device in Embodiment 1 of the present invention will be described. This third example is of the type where excess resin material is leaked to the outside through partial deformation of the lower mold.

[0057] like Figure 10As shown, the resin molding apparatus includes a lower mold 4050 and an upper mold 4060. The lower mold 4050 includes a lower mold body 4051 and a sheet 4052. A peeling portion 4033 is configured to surround the sheet 4052 from its outer periphery. The peeling portion 4033 is connected to the lower mold body 4051 via a spring 4037. The spring 4037 can be elastically deformed, thereby causing the peeling portion 4033 to displace in the height direction. The peeling portion 4033 has several through holes 4007. A stroke limiting member 4034 is inserted into the through holes 4007.

[0058] Several notches are provided on the inner periphery of the peeling portion 4033. A channel sealing member 4035 is disposed inside these notches. The cavity 10 is formed by the inner peripheral side of the peeling portion 4033, the side of the channel sealing member 4035 opposite to the peeling portion 4033, and the upper surface of the sheet 4052. The peeling portion 4033 has a recess, i.e., a pocket portion, located further outward than the cavity 10 for receiving resin material flowing out of the cavity 10. Figure 10 The pocket section is omitted from the illustration.

[0059] The resin material 6r disposed inside the cavity 10 is a material that is supplied in a predetermined amount to a fixture or the like by an automatic resin material supply device based on Embodiment 1 of the present invention, and then transferred onto the plate 4052 by a robot or the like.

[0060] The structure after removing the lower mold 4050 separately is as follows Figure 11 As shown. In this example, two pocket portions 4036 are provided near the cavity 10, and a total of four channel closure members 4035 are arranged around the cavity 10. The structure after removing the channel closure members 4035 individually is as follows. Figure 12 As shown. The channel closure member 4035 has two upper surfaces 4035a and 4035b with different heights. The channel closure member 4035 is capable of vertical displacement. The channel closure member 4035 can obtain at least two states: an ascended state and a descended state. Figure 10 and Figure 11 In the middle, the channel closure component 4035 is in the raised state. For example... Figure 11 As shown, the cavity 10 and the pocket portion 4036 are separated by a channel closure member 4035.

[0061] A cross-sectional view of the channel closure member 4035 and its vicinity is shown below. Figure 13 As shown. In Figure 13 In the middle, the channel closure component 4035 is in the lowered state. Figure 13In the middle, because the channel closure member 4035 has descended, the channel 9 is in an open state. The viscosity of the resin material decreases due to heating. The resin material 6e with reduced viscosity overflows from the cavity 10 and can flow through the channel 9 toward the pocket portion 4036 as shown by arrow 92.

[0062] As the channel sealing component 4035 descends, the resin material 6e overflows from the cavity 10, forming a structure like... Figure 14 The situation is shown. In this state, the channel closing member 4035 can be raised again. When the channel closing member 4035 rises to the point that its upper surface contacts the lower surface of the substrate 1d, the channel 9 is closed again, thereby preventing the resin material 6e from flowing further out of the cavity 10. The resin material is then cured in this state.

[0063] After the resin material has cured, the lower mold 4050 and the upper mold 4060 are moved away from each other, and the article located on the upper side of the lower sheet 11 is removed, thereby obtaining a product whose component 1e is covered by the encapsulating resin.

[0064] (Fourth example of a resin molding apparatus)

[0065] Reference Figures 15 to 17 A fourth example of a resin molding apparatus that can be used in combination with the automatic resin material supply device in Embodiment 1 of the present invention will be described. The fourth example is of the type that allows excess resin material to leak to the outside through a simple construction.

[0066] The resin molding device, as shown Figure 15 As shown. Object 1, resin material 6r, etc., are not part of the resin molding apparatus, but... Figure 15 For ease of explanation, the object 1 and resin material 6r are also illustrated. The object 1 is, for example, an object on which component 1e is mounted. Figure 15 In the middle, component 1e is mounted on the lower surface of substrate 1d. Figure 15 The resin material 6r shown is in granular form.

[0067] The resin molding apparatus includes a lower mold 5050, an upper mold 5060, and one or more frame members 5004. The lower mold 5050 has an upward-facing lower mold top surface 5050u. The upper mold 5060 has an upper mold top surface 5060u opposite to the lower mold top surface 5050u. The upper mold 5060 is positioned above the lower mold 5050. The one or more frame members 5004 are configured to separate from the object 1 at the lower mold top surface 5050u and surround the object 1 from the outside. A cavity is formed by being surrounded by the upper mold top surface 5060u and the frame members 5004. Although referred to here as "one or more frame members 5004", for ease of explanation, the following description will continue with a structure containing only one frame member 5004 as an example. In practice, multiple cavities can also be formed simultaneously by arranging multiple frame members 5004 on one upper mold top surface 5060u.

[0068] The lower mold 5050 comprises a lower mold body 5051, a cemented carbide plate 5052, and a jig 5053. The jig 5053 is a plate-shaped component. The upper mold 5060 comprises an upper mold body 5061 and a cemented carbide plate 5062. The upper mold 5060 is connected to a component 5015 via a spring 5017. The component 5015 is a frame-shaped component. The elastic deformation of the spring 5017 allows the component 5015 to move relative to the upper mold body 5061 in the vertical direction. A component 5016 is connected to the upper mold 5060. The component 5016 is a frame-shaped component. A sealing ring 5014 is disposed between components 5015 and 5016. A sealing ring 5013 is disposed at the lower end of component 5015. The resin molding apparatus is configured such that when the upper mold 5060 and the lower mold 5050 approach each other, a space for vacuuming is formed by the upper mold 5060, the lower mold 5050, the component 5015, the component 5016, etc.

[0069] The assembly kit 5040 is prepared as a whole elsewhere. The assembly kit 5040 is moved in and placed on top of the lower mold 5050. However, a portion of the lower mold 5050 is also a portion of the assembly kit 5040. The assembly kit 5040 includes a jig 5053, a frame member 5004, a lower sheet 11, a resin material 6r, an object 1, an upper sheet 12, and an interposer member 5005. The interposer member 5005 is a plate member formed of an elastomer. The interposer member 5005 is formed, for example, of rubber. More preferably, the interposer member 5005 is formed, for example, of silicone rubber. The lower sheet 11 is a release sheet. The upper sheet 12 is the same. The interposer member 5005 is not necessarily present. The lower sheet 11 and the upper sheet 12 are also not necessarily present. However, in practice, the lower sheet 11 and the upper sheet 12 are usually present as follows: Figure 15 Configure it as shown before starting the operation.

[0070] Because the lower sheet 11 and the upper sheet 12 are very thin, when referring to the "butting" between components below, their presence is ignored even if either or both of the lower sheet 11 and the upper sheet 12 are sandwiched in between. For example, when referring to "component A butting with component B", it includes not only the case where component A and component B are actually directly butting, but also the case where they are indirectly butting with either or both of the lower sheet 11 and the upper sheet 12 sandwiched in between.

[0071] A frame member 5004 is placed on the upper surface of the fixture 5053. Granular resin material 6r is disposed inside the frame member 5004. As described above, in the case where the assembly kit 5040 is pre-assembled outside the mold, the resin material 6r is supplied directly to the fixture 5053 by the automatic resin material supply device described in Embodiment 1. Alternatively, the assembly kit 5040 may be assembled on the lower mold 5050. In this case, the resin material 6r may be a material that has been supplied in a predetermined amount to the fixture or the like by the automatic resin material supply device described in Embodiment 1, and then transferred to the fixture 5053 by a robot or the like. The object 1 is placed on the resin material 6r.

[0072] When the resin molding apparatus has one or more frame members 5004, we focus on each frame member. Granular resin material 6r is disposed within a cavity space surrounded by the lower mold top surface 5050u and the frame members 5004. Object 1 is disposed on the upper side of the resin material 6r.

[0073] By bringing the lower mold 5050 and the upper mold 5060 close to each other to a certain extent, the sealing ring 5013 forms an abutment with the lower mold body 5051. The resin material 6r is heated to reduce its viscosity. Heating of the resin material 6r can be performed through the lower mold 5050.

[0074] When the lower mold 5050 and the upper mold 5060 get closer to each other, they present... Figure 16 The state shown is such that the upper mold 5060 is in contact with the intermediate member 5005. In this state, when the upper mold 5060 descends, the object 1 is pressed against the resin material 6e. Figure 16 In the middle, resin material 6r has reduced its viscosity to become resin material 6e. When the lower mold 5050 and the upper mold 5060 move closer together, it exhibits... Figure 17The state is shown. That is, the first portion 6e1, which is part of the resin material 6e, fills the space inside the frame member 5004, and the second portion 6e2, which is different from the first portion 6e1, can overflow through the gap between the frame member 5004 and the upper mold 5060 to the outside of the frame member 5004. When the resin material overflows, it can overflow from the entire circumference of the frame member 5004, or it can overflow from a localized area on the outer periphery of the frame member 5004. For example, when the frame member 5004 is rectangular in plan view, the resin material can overflow from all four sides, or it can overflow only from a portion of the edges.

[0075] The close proximity of the frame member 5004 and the interposer member 5005 causes the gap to narrow, thereby stopping the overflow of the resin material 6e. In this state, the resin material 6e cures. As a result, a product in which the component 1e is covered by the encapsulating resin can be obtained. The product includes a substrate 1d, a component 1e, and an encapsulating resin.

[0076] In this resin molding apparatus, such as Figure 17 As shown, excess resin material overflows to the outside of frame member 5004, thus naturally adjusting the amount of resin material remaining inside frame member 5004. Therefore, even if there are fluctuations in the thickness of substrate 1d, the product thickness obtained inside frame member 5004 remains constant.

[0077] Furthermore, since the object 1 is not directly pressed and clamped in this resin molding apparatus, damage to the object 1 can be avoided. This resin molding apparatus can be used when the substrate 1d included in the object 1 is a PCB substrate or an LTCC substrate.

[0078] Furthermore, in this resin molding apparatus, the area where the encapsulating resin is formed is larger than the area of ​​object 1. Therefore, when object 1 is a structure in which a component is mounted on a substrate, as shown in the example here, the area where the component can be mounted can be ensured to be large enough.

[0079] In this resin molding apparatus, such as Figure 17 As shown, the structure is based on the premise that a certain amount of resin material disposed inside the frame member 5004 will leak out from the gap, so there is no need to strictly control the amount of resin supplied.

[0080] Although Figures 15 to 17An example with intervening member 5005 is shown, but a construction without intervening member 5005 can also be used. In this case, when the lower mold 5050 and the upper mold 5060 approach each other, the frame member 5004 abuts against the upper mold 5060. Preferably, the frame member 5004 abuts against the top surface 5060u of the upper mold, thereby defining the distance between the top surface 5050u of the lower mold and the top surface 5060u of the upper mold when they are closest. By adopting this construction, the distance between the top surface 5050u of the lower mold and the top surface 5060u of the upper mold when they are closest is essentially directly equal to the thickness of the product, thus the required thickness can be accurately achieved with a simple structure.

[0081] It should be noted that the frame member 5004 can also be fixed to the fixture 5053 by magnetic force.

[0082] As shown in this example, it is preferable to have a resilient interposer 5005 disposed between the top surface 5060u of the upper mold and the top surface 5050u of the lower mold, positioned above the object 1. When the lower mold 5050 and the upper mold 5060 are brought close together, the interposer 5005, while in contact with the upper mold 5060, further abuts against the object 1 and the frame member 5004. By employing this structure, even if there are irregularities on the surface of the object 1, these irregularities can be absorbed, thereby preventing damage to the object 1. When the object 1 includes an installed component 1e, as shown in this example, and the component 1e is encapsulated in resin, by using the interposer 5005 to distribute the load, excessive load concentration at the component 1e can be avoided, thereby preventing damage to the installed component 1e.

[0083] Furthermore, it is preferable to define the distance between the lower mold top surface 5050u and the upper mold top surface 5060u when they are closest by having the frame member 5004 abut against and recess into the intermediate member 5005. Since the intermediate member 5005 is elastic, the frame member 5004 will recess into it to a certain extent when in contact with it, but the distance between the lower mold top surface 5050u and the upper mold top surface 5060u when they are closest can also be defined by taking this amount of recess into account. By defining the distance in this way, a product of the desired thickness can be obtained without being affected by substrate deviation.

[0084] (5th example of a resin molding apparatus)

[0085] Reference Figure 18 A fifth example of a resin molding apparatus that can be used in combination with the automatic resin material supply device in Embodiment 1 of the present invention will be described. The fifth example is the same as the fourth example, but with the addition of a limiting member.

[0086] The resin molding device, as shown Figure 18 As shown. The basic structure of this resin molding apparatus is the same as that of the resin molding apparatus described in Example 4. The resin molding apparatus of Example 5 includes a limiting member 5007 disposed on at least one of the lower mold 5050 and the upper mold 5060, located outside the frame member 5004. When the lower mold 5050 and the upper mold 5060 approach each other, the limiting member 5007 defines the closest distance between the lower mold 5050 and the upper mold 5060 by abutting against a certain member. Figure 18 In the example shown, the limiting member 5007 defines the closest distance between the lower mold 5050 and the upper mold 5060 by abutting against the carbide plate 5062, which is part of the upper mold 5060.

[0087] When the lower mold 5050 and the upper mold 5060 approach each other, the resin material 6e overflowing onto the outside of the frame member 5004 will be contained within the gap between the frame member 5004 and the limiting member 5007. Figure 18 For ease of explanation, the dimensions in the vertical direction are exaggerated while the dimensions in the horizontal direction are reduced. In reality, the aspect ratio of the gap between frame member 5004 and limiting member 5007 is not necessarily as shown. Figure 18 As shown in the image.

[0088] Alternatively, the limiting member 5007 can also be fixed to the fixture 5053 by magnetic force. The limiting member 7 can also be a frame-shaped member.

[0089] In this example, since the distance between the lower mold 5050 and the upper mold 5060 when they are closest is defined by the limiting member 5007, the product thickness obtained inside the frame member 5004 can remain constant even if there is a deviation in the thickness of the substrate 1d.

[0090] To demonstrate the structure with limiting member 5007 as the fifth example, Figure 18 The example shown does not include component 5005, but it can also be configured as follows. Figures 15 to 17 The intermediate member 5005 is shown. In this case, the upper end of the limiting member 5007 defines the distance between the lower mold 5050 and the upper mold 5060 when they are closest by abutting against the intermediate member 5005.

[0091] Therefore, according to the resin molding apparatus as the fifth example, the product thickness can be made to the required thickness without being affected by substrate deviation, and a resin molding apparatus that does not damage the substrate can be realized.

[0092] This concludes the example of a single frame member 5004. The area inside the frame member 5004 is the area where the object 1 is encapsulated with resin material. The number of frame members 5004 can also be two or more. That is, a structure in which two or more frame members 5004 are arranged on a single fixture 5053 can be used.

[0093] Furthermore, the embodiments disclosed herein are illustrative in all respects and should not be considered limiting. The scope of the invention is set forth in the claims and is intended to include all modifications within the meaning and scope equivalent to the claims.

[0094] (Postscript)

[0095] (Note 1)

[0096] An automatic resin material supply device includes: a hopper for receiving granular resin material for forming encapsulating resin; a feeder for receiving the resin material falling from the hopper and conveying the resin material laterally; and a container for receiving the resin material falling from the feeder. The hopper includes a hopper body and a cooling section configured to at least partially cover the outer peripheral surface of the hopper body. The feeder includes a tray for receiving the resin material falling from the hopper and a vibration application device for vibrating the tray. The cooling section has a fluid inlet and a fluid outlet, and a channel is provided inside the cooling section for passing cooling fluid from the fluid inlet to the fluid outlet.

[0097] (Note 2)

[0098] Based on the automatic resin material supply device described in Appendix 1, the hopper body includes: a conical portion whose cross-sectional area decreases when cut in a horizontal plane as it moves downward, and a cylindrical portion extending downward from the lower end of the conical portion, wherein the cooling portion is configured to cover the outer peripheral surface of the conical portion and the outer peripheral surface of the cylindrical portion.

[0099] (Note 3)

[0100] Based on the automatic resin material supply device described in Appendix 2, in the cooling section, the tapered cooling portion covering the outer peripheral surface of the tapered portion and the cylindrical cooling portion covering the outer peripheral surface of the cylindrical portion are separate.

[0101] (Note 4)

[0102] Based on the automatic resin material supply device described in any of Appendices 1 to 3, the tray portion includes a bottom surface and a side wall extending upward from a portion of the outer edge of the bottom surface, the bottom surface including a receiving portion located below the hopper and a pouring portion extending laterally from the receiving portion, wherein the side wall is not present at the end of the pouring portion, and the end of the pouring portion is disposed above the container.

[0103] (Note 5)

[0104] Based on the automatic resin material supply device described in Appendix 4, the bottom surface is inclined to descend from the receiving part to the end of the pouring part.

[0105] (Note 6)

[0106] Based on the automatic resin material supply device described in any of Appendix 1 to 5, the automatic resin material supply device includes a weight measuring device for measuring the total weight of the container and its contents or the weight of the contents of the container, and a control unit for controlling the operation of the vibration application device. If the measurement result of the weight measuring device reaches or exceeds a predetermined value, the control unit stops the conveying operation of the feeder.

[0107] (Note 7)

[0108] Based on the automatic resin material supply device described in any of Appendices 1 to 6, the automatic resin material supply device includes a fluid tank for maintaining the cooling fluid at a temperature lower than room temperature, wherein the cooling fluid is guided from the fluid tank to the fluid inlet and from the fluid outlet to the fluid tank.

[0109] Explanation of reference numerals in the attached figures

[0110] 1. Object; 1d. Substrate; 1e. Component; 6e. (Low-viscosity) resin material; 6e1. Part 1; 6e2. Part 2; 6r. (Partial) resin material; 9. Channel; 10. Cavity; 11. Lower sheet; 12. Upper sheet; 92. Arrow; 1003. Container; 1004. Weight measuring device; 1005. Control unit; 1006. Fluid tank; 1010. Hopper. 1020. Feeder; 1021. Tray section; 1022. Vibration application device; 1023. Bottom surface; 1023a. Receiving section; 1023b. Pouring section; 1024. Side wall; 1030. Hopper body; 1031. Conical section; 1032. Cylindrical section; 1040. Cooling section; 1040c. Channel; 1041. Cooling section of the conical section; 1041a. Fluid (in the cooling section of the conical section) Inlet, 1041b, (Fluid outlet of the conical cooling section), 1042, (Fluid outlet of the cylindrical cooling section), 1042a, (Fluid inlet of the cylindrical cooling section), 1042b, (Fluid outlet of the cylindrical cooling section), 2015, Component, 2017, Spring, 2050, Lower mold, 2051, Lower mold body, 2052, Plate, 2060, Upper mold, 3015, Component, 3017, Spring Spring, 3050, Lower mold, 3060, Upper mold, 3061, Upper mold body, 3062, Sheet metal, 4007, Through hole, 4010, Cavity, 4011, Lower sheet, 4033, Peeling part, 4034, Stroke limiting component, 4035, Channel closing component, 4037, Elastomer, 4050, Lower mold, 4051, Upper mold body, 4052, Sheet metal, 4060, Upper mold, 500 Frame component, 5005, Intermediate component, 5007, Limiting component, 5013, 5014, Sealing ring, 5015, 5016, Component, 5017, Spring, 5040, Assembly kit, 5050, Lower mold, 5050u, Lower mold top surface, 5051, Lower mold body, 5052, Carbide plate, 5053, Fixture, 5060, Upper mold, 5060u, Upper mold top surface, 5061, Upper mold body, 5062, Carbide plate.

Claims

1. An automatic resin material supply device, characterized in that, have: A hopper that receives granular resin material for forming an encapsulating resin; A feeder that, while receiving the resin material falling from the hopper, simultaneously conveys the resin material laterally; and A container that receives the resin material falling from the feeder. The hopper includes a hopper body and a cooling section configured to at least partially cover the outer peripheral surface of the hopper body. The feeder includes a tray portion for receiving the resin material falling from the hopper and a vibration application device for vibrating the tray portion. The cooling section has a fluid inlet and a fluid outlet, and a channel is provided inside the cooling section to allow cooling fluid to pass from the fluid inlet to the fluid outlet.

2. The automatic resin material supply device according to claim 1, characterized in that, The hopper body includes: a tapered portion whose cross-sectional area decreases when cut in a horizontal plane as it moves downwards, and a cylindrical portion extending downwards from the lower end of the tapered portion. The cooling section is configured to cover the outer peripheral surface of the conical section and the outer peripheral surface of the cylindrical section.

3. The automatic resin material supply device according to claim 2, characterized in that, In the cooling section, the tapered portion that covers the outer peripheral surface of the tapered portion and the cylindrical portion that covers the outer peripheral surface of the cylindrical portion are separate.

4. The automatic resin material supply device according to any one of claims 1 to 3, characterized in that, The tray portion includes a bottom surface and sidewalls extending upward from a portion of the outer edge of the bottom surface. The bottom surface includes a receiving section located below the hopper and a pouring section extending laterally from the receiving section. The pouring end has no sidewall, and the end of the pouring end is positioned above the container.

5. The automatic resin material supply device according to claim 4, characterized in that, The bottom surface is inclined so as to descend from the receiving part to the end of the pouring part.

6. The automatic resin material supply device according to any one of claims 1 to 5, characterized in that, The automatic resin material supply device includes a weight measuring device for measuring the total weight of the container and its contents or the weight of the contents of the container, and a control unit for controlling the operation of the vibration application device. If the measurement result of the weight measuring device reaches or exceeds a predetermined value, the control unit stops the conveying action of the feeder.

7. The automatic resin material supply device according to any one of claims 1 to 6, characterized in that, The automatic resin material supply device includes a fluid tank for maintaining the cooling fluid at a temperature lower than room temperature. The cooling fluid is directed from the fluid tank to the fluid inlet and from the fluid outlet back to the fluid tank.

Images