Liquid cooling module and related data storage components

Abstract

This invention discloses a liquid cooling module and related data storage components. The liquid cooling module is used to cool a heat-generating element. The liquid cooling module includes an inlet, an outlet, and a housing. The inlet is used to input coolant, and the outlet is used to output coolant. The housing includes a first sub-housing and a second sub-housing, which are interconnected and define a cavity. The cavity connects the inlet and the outlet, and the coolant flows through the cavity. The cavity is meandering. The first and second sub-housings are meandering to define a heat dissipation space outside the housing for housing the heat-generating element.

Description

Technical Field

[0001] This invention relates to a liquid cooling product, and more particularly to a liquid cooling module and related data storage components that can improve heat dissipation efficiency and overall space utilization. Background Technology

[0002] With the increasing demand for high-performance computing systems and artificial intelligence applications, liquid cooling solutions have gradually replaced air cooling solutions and become the mainstream trend due to their superior heat dissipation efficiency. However, when integrating liquid cooling systems into electronic devices or servers, the design must not only meet heat dissipation efficiency requirements but also take into account the overall efficiency of internal space utilization. Therefore, how to achieve efficient heat dissipation and improve overall space utilization within limited space is a problem that the industry urgently needs to solve. Summary of the Invention

[0003] Therefore, the purpose of this invention is to provide a liquid cooling module and related data storage components that can meet the requirements of efficient heat dissipation and improve the overall space utilization, so as to solve the above problems.

[0004] This invention discloses a liquid cooling module for cooling at least one heat-generating element. The liquid cooling module includes an inlet, an outlet, and a housing. The inlet is used to input a coolant, and the outlet is used to output the coolant. The housing includes a first sub-housing and a second sub-housing, which are interconnected and define a cavity. The cavity communicates with the inlet and the outlet, and the coolant flows through the cavity, which is meandering. The meandering shape of the first and second sub-housings defines at least one heat dissipation space outside the housing for accommodating the at least one heat-generating element.

[0005] The present invention also discloses a data storage component comprising a tray, at least one heating element and a liquid cooling module as described above, wherein the liquid cooling module is disposed on the tray and is used to cool the at least one heating element.

[0006] The liquid cooling module and related data storage components of the present invention have the following features: (1) the housing of the liquid cooling module is serpentine and at least one heat dissipation space is defined on the outside of the housing to accommodate at least one heat-generating element, thereby improving space utilization and equipment density; (2) one heat dissipation space of the liquid cooling module provides three contact surfaces for one heat-generating element, thereby improving heat dissipation area and efficiency; (3) each heat-generating element is installed in one heat dissipation space of the liquid cooling module, which facilitates installation and has high structural strength; and (4) the size of the heat dissipation space can be designed according to the standard specifications of the heat-generating element so that the liquid cooling module has commonality. Attached Figure Description

[0007] Figure 1This is a perspective view and a partially enlarged view of the data storage component according to an embodiment of the present invention;

[0008] Figure 2 This is an exploded view of the data storage component according to an embodiment of the present invention;

[0009] Figure 3 This is a perspective view of the liquid cooling module according to an embodiment of the present invention;

[0010] Figure 4 This is an exploded view of the liquid cooling module according to an embodiment of the present invention;

[0011] Figure 5 This is a cross-sectional view of the liquid cooling module according to an embodiment of the present invention;

[0012] Figure 6 This is a cross-sectional view of a liquid cooling module according to another embodiment of the present invention.

[0013] Symbol explanation:

[0014] 1000: Data storage component

[0015] 1: Pallet

[0016] 21: Hook

[0017] 3,3': Liquid cooling module

[0018] 31: Entrance

[0019] 32: Exports

[0020] 33: Shell

[0021] 331: Cavity

[0022] 3A: First Subshell

[0023] 3B: Second Subshell

[0024] 3C: First sidewall

[0025] 3D: Second sidewall

[0026] 4: First support

[0027] 41: Card slot

[0028] 5: Adapter board

[0029] 6: Second stent

[0030] 13: Third stent

[0031] 14: Fourth stent

[0032] 15: First Groove

[0033] 16: Second groove

[0034] 17: Ribs

[0035] A1~A18: wall

[0036] B1~B18: wall

[0037] E1~E8: Heating elements

[0038] S1~S8: Heat dissipation space

[0039] T1: First heat dissipation pad

[0040] T2: Second heat dissipation pad

[0041] T3: Third heat dissipation pad

[0042] W: Width

[0043] H: Height

[0044] X: First direction

[0045] Z: Second direction

[0046] Y: Third-party direction

[0047] O1: First opening

[0048] O2: Second opening Detailed Implementation

[0049] Please see Figure 1 This is a perspective view and a partially enlarged view of a data storage component 1000 according to an embodiment of the present invention. The data storage component 1000 includes a tray 1, at least one heating element E1-E8, and a liquid cooling module 3. The liquid cooling module 3 is disposed within the tray 1 and is used to cool the heating elements E1-E8. The heating elements E1-E8 are arranged along a first direction X and disposed within the heat dissipation space defined by the liquid cooling module 3. In this embodiment, the heating elements E1-E8 can be solid-state drives or other types of electronic devices. Those skilled in the art can select the type, quantity, and arrangement order of the heating elements E1-E8 according to actual needs, and are not limited to these parameters. Figure 1 The illustrated embodiment. In other embodiments, at least one of the heating elements E1 to E8 may be replaced with a non-heating element, such as a dummy element.

[0050] The data storage component 1000 further includes a first bracket 4, a docking board 5, and a second bracket 6. The first bracket 4 is disposed adjacent to a first side (e.g., the front side) of the liquid cooling module 3, and its two ends are connected to a tray 1 to fix the liquid cooling module 3 and heating elements E1-E8 to the tray 1. The docking board 5 is disposed adjacent to a second side (e.g., the rear side) of the liquid cooling module 3 opposite to the first side, and connects to the heating elements E1-E8 to provide power and signal transmission to them. The second bracket 6 is disposed adjacent to a second side of the liquid cooling module 3, and its two ends are connected to the tray 1 to fix the liquid cooling module 3 and the docking board 5 to the tray 1.

[0051] Specifically, the first bracket 4 and the second bracket 6 can be two U-shaped brackets, with the middle portions of the first bracket 4 and the second bracket 6 respectively abutting against the first and second sides of the liquid cooling module 3. The two ends of the first bracket 4 and the two ends of the second bracket 6 can be fixed to the tray 1 using corresponding fasteners (e.g., screws). In a second direction Z, the height of the middle portion of the first bracket 4 and the second bracket 6 is lower than the height of the liquid cooling module 3, thus preventing the liquid cooling module 3 from sliding out of the tray 1 in a third direction Y.

[0052] In one embodiment, as shown in the enlarged view, each of the heating elements E1 to E8 includes at least one hook 21, and the first bracket 4 has at least one slot 41 for securing the corresponding hook 21. In this way, when the heating elements E1 to E8 are inserted into the liquid cooling module 3 from the front, causing the slot 41 to engage with the hook 21, it ensures proper mating between the heating elements E1 to E8 and the rear adapter plate 5, and prevents the heating elements E1 to E8 from slipping out of the liquid cooling module 3 and falling out. In other embodiments, the hook 21 can be replaced with a protrusion or a spring, but is not limited to these.

[0053] Please see Figure 2This is an exploded view of the data storage component 1000 according to an embodiment of the present invention. The data storage component 1000 further includes a third support 13 and a fourth support 14. The third support 13 is disposed adjacent to the third side (e.g., the left side) of the liquid cooling module 3, with one end fixed to the side wall of the tray 1 and the other end fixed to the bottom of the tray 1. The fourth support 14 is disposed adjacent to the fourth side (e.g., the right side) of the liquid cooling module 3, with one end fixed to the other side wall of the tray 1 and the other end fixed to the bottom of the tray 1. One end of the first support 4 and the second support 6 are fixed to the third support 13, and the other end of the first support 4 and the second support 6 are fixed to the fourth support 14; that is, the first support 4 and the second support 6 are fixed to the tray 1 via the third support 13 and the fourth support 14. The third support 13 has a first groove 15, and an inlet 31 of the liquid cooling module 3 passes through the first groove 15; the fourth support 14 has a second groove 16, and an outlet 32 ​​of the liquid cooling module 3 passes through the second groove 16; this prevents the liquid cooling module 3 from sliding out of the tray 1 along the third direction Y.

[0054] In one embodiment, the tray 1 includes at least one rib 17 disposed at the bottom of the tray 1 and embedded in at least one heat dissipation space of the liquid cooling module 3. The at least one rib 17 is used to compensate for the height of the heating elements E1~E4 in the second direction Z, so that the height of all heating elements E1~E8 is consistent in the second direction Z. It should be understood that when the liquid cooling module 3 is installed in the tray 1, the rib 17, the first groove 15 and the second groove 16 can also serve as positioning structures to improve installation convenience. Furthermore, each heating element E1~E8 is installed in a heat dissipation space of the liquid cooling module 3, which facilitates installation and provides high structural strength.

[0055] Please see Figure 3 This is a perspective view of the liquid cooling module 3 according to an embodiment of the present invention. The liquid cooling module 3 includes an inlet 31, an outlet 32, and a housing 33. The inlet 31 is used to input coolant, and the outlet 32 ​​is used to output coolant. The coolant can flow into the housing 33 from the inlet 31 and then flow out of the housing 33 from the outlet 32. Understandably, the housing 33 can directly or indirectly contact the heating elements E1~E8 (drawn on...). Figure 1 , Figure 2 This creates a heat conduction interface, allowing the coolant flowing inside the housing 33 to carry away the heat transferred from the heating elements E1 to E8. A cavity 331 within the housing 33 roughly corresponds to the outer shape of the housing 33 and is meandering. The cavity 331 connects to the inlet 31 and the outlet 32 ​​to allow coolant flow. In practical applications, the inlet 31 and outlet 32 ​​can be connected to blind-mate quick connectors, and further connected to hoses or manifolds, but are not limited to these.

[0056] The housing 33 of the liquid cooling module 3 has a meandering shape, and at least one heat dissipation space S1 to S8 is defined on the outside of the housing 33 to accommodate at least one heat-generating element E1 to E8, thereby improving space utilization and device density. It is worth noting that the dimensions of the heat dissipation spaces S1 to S8, such as a width W and a height H, can be designed according to the standard specifications of the heat-generating elements S1 to S8 to ensure the liquid cooling module 3 has commonality. For example, E1.S refers to a form factor in the Enterprise & Datacenter SSD Form Factor (EDSFF) specification, where the width of the solid-state drive can be selected as 5.9 mm or 9.5 mm. If the width W of the heat dissipation spaces S1 to S8 is designed to be 5.9 mm or 9.5 mm plus tolerances, then the liquid cooling module 3 can be used with solid-state drives conforming to the E1.S specification.

[0057] Please see Figure 4 This is an exploded view of the liquid cooling module 3 according to an embodiment of the present invention. The housing 33 includes a first sub-housing 3A and a second sub-housing 3B, which are connected to each other and define an internal cavity 331. The first sub-housing 3A and the second sub-housing 3B are meandering to define multiple heat dissipation spaces S1 to S8 on the outside of the housing 33 for accommodating the heat-generating elements E1 to E8.

[0058] The housing 33 further includes a first sidewall 3C and a second sidewall 3D. The first sidewall 3C connects the first sub-housing 3A and the second sub-housing 3B on a first side (e.g., the front side), is meandering, and extends along a first direction X. The second sidewall 3D connects the first sub-housing 3A and the second sub-housing 3B on a second side (e.g., the rear side), is meandering, and extends along the first direction X, thereby enabling the first sub-housing 3A and the second sub-housing 3B to be interconnected. The first sidewall 3C is parallel to the second sidewall 3D and the XZ plane. In one embodiment, the first sub-housing 3A, the first sidewall 3C, and the second sidewall 3D are integrally formed mechanical components, and these mechanical components are interconnected with the second sub-housing 3B by welding. In other embodiments, the housing 33 can also be integrally formed by 3D printing; alternatively, the first sub-housing 3A, the second sub-housing 3B, the first sidewall 3C, and the second sidewall 3D can be manufactured separately and then interconnected by welding.

[0059] Please see Figure 5This is a cross-sectional view of the liquid cooling module 3 according to an embodiment of the present invention. The first sub-shell 3A includes M walls, which define N heat dissipation spaces on the outside of the shell 33. The (4×i-2), (4×i-1), and (4×i)th walls among the M walls jointly define the i-th heat dissipation space on the outside of the shell 33, where M=4×N+2, 1≤i≤N, and i, M, and N are natural numbers. For example, assuming N=4, then M=4×4+2=18, and the first sub-shell 3A includes eighteen walls A1~A18, where 1≤i≤4. If i=1, then walls A2, A3, and A4 together define the first heat dissipation space S1; if i=2, then walls A6, A7, and A8 together define the second heat dissipation space S2; if i=3, then walls A10, A11, and A12 together define the third heat dissipation space S3; and if i=4, then walls A14, A15, and A16 together define the fourth heat dissipation space S4.

[0060] In the first sub-shell 3A, multiple odd-numbered walls among the M walls are arranged parallel to each other, and multiple even-numbered walls among the M walls are arranged parallel to each other. The multiple odd-numbered walls are perpendicularly connected to each of the even-numbered walls. For example, in the eighteen walls A1~A18 of the first sub-shell 3A, odd-numbered walls A1, A3, A5, A7, A9, A11, A13, A15, and A17 are arranged parallel to each other, and even-numbered walls A2, A4, A6, A8, A10, A12, A14, A16, and A18 are arranged parallel to each other. Odd-numbered wall A1 is perpendicularly connected to even-numbered wall A2, odd-numbered wall A3 is perpendicularly connected between two even-numbered walls A2 and A4, odd-numbered wall A5 is perpendicularly connected between two even-numbered walls A4 and A6, and so on.

[0061] In the first sub-shell 3A, among the M walls A1~A18, multiple odd-numbered walls A1, A3, A5, A7, A9, A11, A13, A15, and A17 extend along the first direction X, and multiple even-numbered walls A2, A4, A6, A8, A10, A12, A14, A16, and A18 extend along the second direction Z. At least one heating element E1~E4 is respectively inserted into at least one heat dissipation space S1~S4 along the third direction Y, and the first direction X, the second direction Z, and the third direction Y are perpendicular to each other.

[0062] Assuming N=4 and 1≤i≤4, the i-th heating element of heating elements E1~E4 includes a first surface, a second surface, and a third surface. The first surface is used to contact the (4×i-2)-th wall; the second surface is parallel to the first surface and is used to contact the (4×i)-th wall; the third surface is perpendicular to the first and second surfaces and connects the first and second surfaces. For example, if i=1, when heating element E1 is inserted into heat dissipation space S1, the first surface of heating element E1 contacts the second wall A2, and the second surface of heating element E1 contacts the fourth wall A4. If i=2, when heating element E2 is inserted into heat dissipation space S2, the first surface of heating element E2 contacts the sixth wall A6, and the second surface of heating element E2 contacts the eighth wall A8. If i=3, when heating element E3 is inserted into heat dissipation space S3, the first surface of heating element E3 contacts the tenth wall A10, and the second surface of heating element E3 contacts the twelfth wall A12. If i=4, when the heating element E4 is inserted into the heat dissipation space S4, the first surface of the heating element E4 contacts the fourteenth wall A14, and the second surface of the heating element E4 contacts the sixteenth wall A16.

[0063] The first sub-shell 3A and the second sub-shell 3B are inversely symmetric, meaning that the shape and wall configuration of the second sub-shell 3B are mirror images of the first sub-shell 3A and are connected end-to-end, but in opposite directions. Specifically, the first wall A1 of the first sub-shell 3A is connected to the Mth wall B18 of the second sub-shell 3B, and the Mth wall A18 of the first sub-shell 3A is connected to the first wall B1 of the second sub-shell 3B.

[0064] The liquid cooling module 3 has at least (2×N) heat dissipation spaces. The second sub-shell 3B contains M walls. The (4×i-2), (4×i-1), and (4×i)th walls of these M walls together define the (N+i)th heat dissipation space outside the shell 33, where M=4×N+2, 1≤i≤N, and i, M, and N are natural numbers. For example, assuming N=4, then there are at least 2×4=8 heat dissipation spaces, M=4×4+2=18, and the second sub-shell 3B contains eighteen walls B1~B18, where 1≤i≤4. If i=1, then walls B2, B3, and B4 together define the fifth heat dissipation space S5; if i=2, then walls B6, B7, and B8 together define the sixth heat dissipation space S6; if i=3, then walls B10, B11, and B12 together define the seventh heat dissipation space S7; and if i=4, then walls B14, B15, and B16 together define the eighth heat dissipation space S8.

[0065] In the second sub-shell 3B, multiple odd-numbered walls among the M walls are arranged parallel to each other, and multiple even-numbered walls among the M walls are arranged parallel to each other. The multiple odd-numbered walls are perpendicularly connected to each of the even-numbered walls. For example, in the eighteen walls B1~B18 of the second sub-shell 3B, odd-numbered walls B1, B3, B5, B7, B9, B11, B13, B15, and B17 are arranged parallel to each other, and even-numbered walls B2, B4, B6, B8, B10, B12, B14, B16, and B18 are arranged parallel to each other. Odd-numbered wall B1 is perpendicularly connected to even-numbered wall B2, odd-numbered wall B3 is perpendicularly connected between two even-numbered walls B2 and B4, odd-numbered wall B5 is perpendicularly connected between two even-numbered walls B4 and B6, and so on.

[0066] In the second sub-shell 3B, among the M walls B1~B18, multiple odd-numbered walls B1, B3, B5, B7, B9, B11, B13, B15, and B17 extend along the first direction X, and multiple even-numbered walls B2, B4, B6, B8, B10, B12, B14, B16, and B18 extend along the second direction Z. At least one heating element E5~E8 is respectively inserted into at least one heat dissipation space S5~S8 along the third direction Y, and the first direction X, the second direction Z, and the third direction Y are perpendicular to each other.

[0067] Assuming N=4 and 1≤i≤4, the (4+i)th heating element of heating elements E5~E8 includes a first surface, a second surface, and a third surface. The first surface is used to contact the (4×i-2)th wall; the second surface is parallel to the first surface and is used to contact the (4×i)th wall; the third surface is perpendicular to the first and second surfaces and connects the first and second surfaces. For example, if i=1, when heating element E5 is inserted into heat dissipation space S5, the first surface of heating element E5 contacts the second wall B2, and the second surface of heating element E5 contacts the fourth wall B4. If i=2, when heating element E6 is inserted into heat dissipation space S6, the first surface of heating element E6 contacts the sixth wall B6, and the second surface of heating element E6 contacts the eighth wall B8. If i=3, when heating element E7 is inserted into heat dissipation space S7, the first surface of heating element E7 contacts the tenth wall B10, and the second surface of heating element E7 contacts the twelfth wall B12. If i=4, when the heating element E8 is inserted into the heat dissipation space S8, the first surface of the heating element E8 contacts the fourteenth wall B14, and the second surface of the heating element E8 contacts the sixteenth wall B16.

[0068] Furthermore, the Mth wall A18 of the first sub-shell 3A forms a first opening O1 for connecting the outlet 32; the Mth wall B18 of the second sub-shell 3B forms a second opening O2 for connecting the inlet 31. In various embodiments, those skilled in the art can design the position, shape, and number of the inlet 31 and the outlet 32 ​​as appropriate, and adaptively design the position, shape, and number of the first opening O1 and the second opening O2, without being limited to the embodiments of the present invention.

[0069] Please see Figure 6 This is a cross-sectional view of a liquid cooling module 3' according to another embodiment of the present invention. The liquid cooling module 3' further includes a first heat dissipation pad T1 and a second heat dissipation pad T2. The first heat dissipation pad T1 is located between the first surface and the (4×i-2)th wall and contacts the first surface and the (4×i-2)th wall; and the second heat dissipation pad is located between the second surface of the heating element and the (4×i)th wall and contacts the second surface and the (4×i)th wall. For example, if i=1, the first heat dissipation pad T1 is located between the first surface of the heating element E1 and the second wall A2 of the first sub-shell 3A, and the second heat dissipation pad T2 is located between the second surface of the heating element E1 and the fourth wall A4 of the first sub-shell 3A, such that the heating element E1 contacts the liquid cooling module 3' via the first heat dissipation pad T1 and the second heat dissipation pad T2. The other heating elements E2 to E8 contact the liquid cooling module 3' in the same way.

[0070] In one embodiment, the liquid cooling module 3' further includes a third heat dissipation pad T3, located between the third surface of the heating element and the (4×i-1)th wall, and in contact with the third surface and the (4×i-1)th wall. For example, if i=1, the third heat dissipation pad T3 is located between the third surface of the heating element E1 and the third wall A3 of the first sub-housing 3A, such that the heating element E1 contacts the liquid cooling module 3 via the third wall A3. The manner in which the remaining heating elements E2~E8 contact the liquid cooling module 3' can be deduced similarly. It should be understood that, in Figure 6 In this embodiment, the heat-generating elements E1~E8 indirectly contact the liquid-cooled module 3' via heat dissipation pads T1, T2, and T3; while Figure 5 In this embodiment, the heating elements E1 to E8 are in direct contact with the liquid cooling module 3. It is worth noting that one heat dissipation space of the liquid cooling module provides three (direct or indirect) contact surfaces for one heating element, which can improve the heat dissipation area and efficiency.

[0071] Furthermore, the assembly method for the data storage component 1000 includes the following steps.

[0072] Step A: Set the third bracket 13 adjacent to the third side (left side) of the liquid cooling module 3, with one end fixed to the side wall of the tray 1 and the other end fixed to the bottom of the tray 1.

[0073] Step B: Set the fourth bracket 14 adjacent to the fourth side (right side) of the liquid cooling module 3, with one end fixed to the other side wall of the tray 1 and the other end fixed to the bottom of the tray 1.

[0074] Step C: Place the liquid cooling module 3 into the tray 1. Prior to step C, the assembly method further includes: setting at least one rib 17 at the bottom of the tray 1.

[0075] Step D: Set the adapter plate 5 to the second side (rear side) adjacent to the liquid cooling module 3.

[0076] Step E: Place the first bracket 4 adjacent to the first side (front side) of the liquid cooling module 3 and fix its two ends to the third bracket 13 and the fourth bracket 14 respectively.

[0077] Step F: Set the second bracket 6 adjacent to the second side (rear side) of the liquid cooling module 3 and fix its two ends to the third bracket 13 and the fourth bracket 14 respectively.

[0078] Step G: Insert the heating elements E1~E8 into the heat dissipation spaces S1~S8 respectively.

[0079] In summary, the liquid cooling module and related data storage components of the present invention have the following characteristics: (1) the housing of the liquid cooling module is serpentine and at least one heat dissipation space is defined on the outside of the housing to accommodate at least one heat-generating element, thereby improving space utilization and equipment density; (2) one heat dissipation space of the liquid cooling module provides multiple contact surfaces for one heat-generating element, thereby improving heat dissipation area and efficiency; (3) each heat-generating element is installed in one heat dissipation space of the liquid cooling module, which facilitates installation and has high structural strength; and (4) the size of the heat dissipation space can be designed according to the standard specifications of the heat-generating element so that the liquid cooling module has commonality.

[0080] The above description is only a preferred embodiment of the present invention. All equivalent changes and modifications made in accordance with the claims of the present invention should be included within the scope of the present invention.

Claims

1. A liquid cooling module for cooling at least one heat-generating element, the liquid cooling module comprising: The inlet is used to introduce coolant. The outlet is used to discharge the coolant; and The housing includes a first sub-housing and a second sub-housing, which are interconnected and define a cavity; The cavity is connected to the inlet and the outlet, and the coolant flows through the cavity, which is meandering in shape. The first sub-shell and the second sub-shell are meandering to define at least one heat dissipation space outside the shell for accommodating at least one heat-generating element.

2. The liquid cooling module as described in claim 1, wherein the first sub-shell comprises M walls, the (4×i-2), (4×i-1) and (4×i) walls of the M walls together define the i-th heat dissipation space outside the shell, 1≤i≤N, M=4×N+2, and i, M and N are natural numbers.

3. The liquid cooling module as described in claim 2, wherein the plurality of odd-numbered walls among the M walls are arranged parallel to each other, the plurality of even-numbered walls among the M walls are arranged parallel to each other, and the plurality of odd-numbered walls are respectively perpendicularly connected between the plurality of even-numbered walls.

4. The liquid cooling module as claimed in claim 2, wherein the i-th heating element of the at least one heating element comprises: The first surface is used to directly or indirectly contact the (4×i-2)th wall; The second surface is parallel to the first surface and is used to directly or indirectly contact the (4×i)th wall; as well as The third surface is perpendicular to the first surface and the second surface, and connects the first surface and the second surface.

5. The liquid cooling module as described in claim 4, further comprising: A first heat dissipation pad is located between the first surface and the (4×i-2)th wall and contacts the first surface and the (4×i-2)th wall; and The second heat dissipation pad is located between the second surface and the (4×i)th wall and contacts the second surface and the (4×i)th wall.

6. The liquid cooling module as described in claim 4, further comprising: The third heat dissipation pad is located between the third surface and the (4×i-1)th wall and contacts the third surface and the (4×i-1)th wall.

7. The liquid cooling module as claimed in claim 2, wherein the second sub-shell is inversely symmetrical to the first sub-shell, the first sub-shell and the second sub-shell respectively include a first wall to an Mth wall, the first wall of the first sub-shell is connected to the Mth wall of the second sub-shell, and the Mth wall of the first sub-shell is connected to the first wall of the second sub-shell.

8. The liquid cooling module as claimed in claim 7, wherein the at least one heat dissipation space is not less than (2×N) spaces, and the (4×i-2), (4×i-1) and (4×i) walls of the M walls of the second sub-shell together define the (N+i)th heat dissipation space outside the shell.

9. The liquid cooling module as described in claim 7, wherein: The first sub-shell has a first opening formed in its Mth wall, and the outlet is connected to the first opening; as well as The Mth wall of the second sub-shell has a second opening, and the inlet is connected to the second opening.

10. The liquid cooling module as claimed in claim 1, wherein a plurality of odd-numbered walls of the M walls extend along a first direction, a plurality of even-numbered walls of the M walls extend along a second direction, and the at least one heating element is respectively inserted into the at least one heat dissipation space along a third direction, and the first direction, the second direction and the third direction are perpendicular to each other.

11. The liquid cooling module of claim 10, wherein the housing further comprises: The first sidewall, connecting the first sub-shell and the second sub-shell, is meandering and extends along the first direction; and The second sidewall, connecting the second side of the first sub-shell and the second sub-shell, is meandering and extends along the first direction.

12. A data storage component comprising: tray; At least one heating element; The liquid cooling module as described in claim 1 is disposed within the tray and is used to cool the at least one heating element.

13. The data storage component of claim 12, further comprising: A first bracket is provided adjacent to the first side of the liquid cooling module, with both ends connected to the tray, and is used to fix the liquid cooling module and the at least one heating element to the tray; An adapter plate is provided on a second side adjacent to the liquid cooling module relative to the first side, and is connected to the at least one heating element; and The second bracket is provided adjacent to the second side of the liquid cooling module, with both ends connected to the tray, and is used to fix the liquid cooling module and the adapter plate to the tray.

14. The data storage component of claim 13, wherein the first support has at least one slot for securing at least one hook of the at least one heating element.

15. The data storage component of claim 13, further comprising: A third bracket is provided adjacent to the third side of the liquid cooling module, with one end fixed to the side wall of the tray and the other end fixed to the bottom of the tray; and The fourth bracket is located adjacent to the fourth side of the liquid cooling module, with one end fixed to the other side wall of the tray and the other end fixed to the bottom of the tray. One end of the first bracket and the second bracket are fixed to the third bracket, and the other end of the first bracket and the second bracket are fixed to the fourth bracket.

16. The data storage component of claim 15, wherein the third bracket has a first groove, and the inlet of the liquid cooling module passes through the first groove; the fourth bracket has a second groove, and the outlet of the liquid cooling module passes through the second groove.

17. The data storage component of claim 12, wherein the tray includes at least one rib disposed at the bottom of the tray and embedded in at least one heat dissipation space of the liquid cooling module.

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