An automatic rivet welding device

By introducing a pre-tinning mechanism into the automatic wire bonding equipment, the problems of uneven solder flow and excessive heating time during the soldering process between the PCB board and the pins are solved, achieving efficient and stable soldering quality and avoiding PCB board damage and uncontrolled solder quantity.

CN122625747APending Publication Date: 2026-08-25SHENZHEN ACME ELECTRIC APPLIANCE CO LTD
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Patent Information

Application Number
CN202611139744.0
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2026-07-30
Publication Date
2026-08-25

AI Technical Summary

Technical Problem

The existing PCB board, pin and wire riveting process has problems such as low welding efficiency, easy damage to PCB board and unstable welding quality. In particular, the gap between the wire and the pin causes uneven solder flow and excessive heating time leads to uncontrolled solder volume.

Method used

Design an automatic wire bonding and riveting equipment, including a conveying worktable, a riveting mechanism, a pre-tinning mechanism, a welding mechanism, and a feeding mechanism. The pre-tinning mechanism forms a tin layer on the end face of the pin, fills the gap, improves the adhesion of the tin material, reduces heating time, and enhances welding quality.

Benefits of technology

It improves the stability and efficiency of soldering quality, avoids PCB board damage and uncontrolled solder volume, shortens soldering time, and ensures uniform filling and tight bonding of solder.

✦ Generated by Eureka AI based on patent content.

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Abstract

This invention discloses an automatic wire bonding and riveting device, including a conveying worktable and a riveting mechanism, a pre-tinning mechanism, a welding mechanism, and a unloading mechanism arranged sequentially along the conveying direction of the worktable. The riveting mechanism is used to rivet and fix the pins to the PCB board; the pre-tinning mechanism is used to pre-tin the pins fixed to the PCB board; the welding mechanism is used to weld the pre-tinned pins; and several supporting fixtures corresponding to the riveting mechanism, pre-tinning mechanism, welding mechanism, and unloading mechanism are fixed on the conveying worktable. By adding a pre-tinning mechanism before the welding mechanism, this invention can pre-form a layer of tin on the end face of the pin. On the one hand, this layer can be remelted to fill the gaps between the wire and the end face of the pin, as well as the gaps caused by unevenness of the pin end face, ensuring uniform and tight tin filling. On the other hand, it can avoid PCB board damage and uncontrolled tin content caused by excessive heating time.
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Description

Technical Field

[0001] This invention relates to the field of automatic riveting and welding technology, and more particularly to an automatic riveting and welding wire equipment. Background Technology

[0002] In the manufacturing of various electronic products, the PCB board 200, pins 100, and wires 300 are the core components for achieving circuit conduction and electrical connection. Reliable assembly of these three components is fundamental to ensuring stable power supply and normal signal transmission. Taking power supply electronic products as an example, in actual production and processing, the pins 100 are typically riveted and fixed to the PCB board 200, and then the pins 100 are soldered to the wires 300 through a wire bonding process, thus forming a complete electrical path to meet the power supply requirements of the electronic product.

[0003] The existing manufacturing process for crimping and bonding PCB board 200, pins 100, and conductors 300 has several shortcomings: Since conductors 300 are cylindrical or nearly cylindrical, a natural gap exists between them and pins 100. Allowing molten solder to flow into this gap takes a considerable amount of time, impacting work efficiency and potentially causing heat damage to the PCB board 200 and uncontrolled solder volume due to prolonged heating. Furthermore, uneven or incomplete flow can lead to poor solder filling in the gaps. Additionally, the crimped pin 100 end face is often not perfectly flat, further affecting the solder adhesion of conductors 300 and compromising the stability of soldering quality. Therefore, there is an urgent need to design a suitable automated crimping and bonding equipment. Summary of the Invention

[0004] The purpose of this invention is to provide an automatic wire bonding and riveting device that solves the problems of low welding efficiency, easy damage to PCB boards, and unstable welding quality of existing pins and wires.

[0005] To achieve this objective, the present invention adopts the following technical solution: An automatic wire bonding and riveting device includes a conveying worktable and a riveting mechanism, a pre-tinning mechanism, a welding mechanism, and a feeding mechanism arranged sequentially along the conveying direction of the conveying worktable. The riveting mechanism is used to rivet and fix the pins to the PCB board; The pre-tinning mechanism is used to pre-tin the pins that are riveted and fixed to the PCB board; The welding mechanism is used to perform wire welding operations on the pre-tinned pins; The unloading mechanism is used to unload the finished PCB board after the wire bonding is completed; The conveying worktable is fixed with several supporting fixtures corresponding to the riveting mechanism, the pre-tinning mechanism, the welding mechanism and the unloading mechanism. The conveying worktable is used to carry and drive the workpiece through the riveting mechanism, the pre-tinning mechanism, the welding mechanism and the unloading mechanism in sequence.

[0006] Furthermore, both the pre-tinning mechanism and the welding mechanism include a tin roll, a tin wire guiding structure, a tin feeding mechanism, a second linear drive mechanism, and a welding head; The tin wire guiding structure is located between the tin roll and the corresponding support fixture on the conveying worktable, and the tin feeding mechanism is set accordingly to the tin wire guiding structure. The welding head is located at the end of the second linear drive mechanism and above the corresponding support fixture.

[0007] Furthermore, both the pre-tinning mechanism and the welding mechanism further include a sub-frame, which is provided with mounting holes and mounting grooves for mounting the second linear drive mechanism, and the mounting holes are located at the center of the mounting grooves; The tin wire guide structure has a universal curved tube on the side near the conveyor worktable; The universal curved tube is fixed to a fixing frame at the end away from the solder roll assembly, and the fixing frame is fixed to the output end of the second linear drive mechanism. The tin feeding mechanism includes two conveying rollers and a conveying power source. The two conveying rollers are connected by a gear set, and the output end of the conveying power source is fixedly connected to one of the conveying rollers.

[0008] Furthermore, it also includes a first feeding mechanism, a second feeding mechanism, and a third feeding mechanism; along the conveying direction of the conveying worktable, the first feeding mechanism and the second feeding mechanism are sequentially located upstream of the riveting mechanism, and the third feeding mechanism is located between the pre-tinning mechanism and the welding mechanism; The conveying workbench is fixed with a bearing fixture corresponding to the first feeding mechanism and the second feeding mechanism; The first feeding mechanism is used to transport the inserts to the corresponding support fixture on the conveying worktable; The second loading mechanism is used to load the PCB board onto the corresponding support fixture on the conveying worktable; The third feeding mechanism is used to transport the wire to the bearing fixture at the corresponding welding mechanism on the conveying worktable.

[0009] Furthermore, it also includes a wire storage structure, a wire guiding mechanism, and a wire cutting mechanism. The wire guiding mechanism is used to guide the wire from the wire storage structure to the wire cutting mechanism. The wire cutting mechanism is used to cut the wire to a preset length. The third feeding mechanism is used to transport the wire from the discharge side of the wire cutting mechanism to the bearing fixture at the corresponding welding mechanism on the conveying worktable.

[0010] Furthermore, the third feeding mechanism includes a third robotic arm and a third gripping claw located at the end of the third robotic arm. The wire cutting mechanism includes two sets of cutting blades, which move closer to or further away from each other under the drive of the wire cutting drive mechanism. Each set of cutting blades includes a first cutting blade and a second cutting blade located on both sides of the first cutting blade. The first cutting blade and the second cutting blade are arranged along the guide direction of the wire guiding mechanism, and the cutting end of the first cutting blade protrudes beyond the cutting end of the second cutting blade. Along the guiding direction of the wire guiding mechanism, both sides of the wire cutting mechanism are provided with stripping pliers for clamping and stripping the insulation from the wire end that has been pre-cut by the second cutter.

[0011] Furthermore, the first feeding mechanism includes a first disc feeder and a first robotic arm; The first disc feeder is used to convey the pins to the first loading position; The first robotic arm is equipped with a first gripper at its end, which is used to move the insert from the first material to be loaded to the corresponding support fixture on the conveying worktable; The second feeding mechanism includes a second disc feeder and a second robotic arm; The second disc feeder is used to transport the PCB board to the second loading position; The second robotic arm is equipped with a second gripper at its end, which is used to move the PCB board from the second loading position to the corresponding support fixture on the conveying worktable.

[0012] Furthermore, the support fixture is provided with receiving holes for accommodating pins and clearance areas on both sides of the receiving holes, and the distance between the two clearance areas is adapted to the size of the PCB board; The first clamping claw is provided with an auxiliary clamping hole that corresponds to the receiving hole on the bearing fixture.

[0013] Furthermore, sensors are provided on the riveting mechanism, pre-tinning mechanism, welding mechanism, and unloading mechanism to detect whether the corresponding support fixture on the conveying worktable is facing the execution end of the riveting mechanism, pre-tinning mechanism, welding mechanism, and unloading mechanism.

[0014] Furthermore, the conveying worktable is a rotary worktable; The conveying workbench is provided with several hollowed-out sections; The riveting mechanism includes a first linear drive mechanism and a riveting head located at the execution end of the first linear drive mechanism; A boss is provided on the side of the riveting head. The end face of the boss is lower than the riveting end face of the riveting head, and the height difference between the end face of the boss and the riveting end face of the riveting head matches the height of the riveting end after the pin is riveted. The unloading mechanism includes a finished product box, a guide slide, and a fourth robotic arm; The fourth robotic arm is equipped with a fourth gripper at its execution end, which is used to transfer the finished PCB board from the carrying fixture of the corresponding unloading mechanism on the conveying workbench to the guide slide. The finished product box is located below the guide slide; The feeding mechanism is equipped with a brush on the side near the welding mechanism, and the brush is positioned directly opposite the movement path of the supporting fixture.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The automatic riveting and bonding wire equipment provided by this invention uses a conveyor table to move the carrying fixture and workpiece sequentially to the corresponding workstations of the riveting mechanism, the pre-tinning mechanism, the welding mechanism, and the unloading mechanism. First, the riveting mechanism rivets and fixes the pins to the PCB board to form a PCB board-pin assembly. Then, the pre-tinning mechanism pre-tins the riveted pins. Subsequently, the welding mechanism completes the wire welding operation on the pre-tinned pins. Finally, the unloading mechanism unloads the finished PCB board with the completed wire bonding. In this invention, by adding a pre-tinning mechanism before the welding mechanism, a tin layer can be pre-formed on the pin end face. On the one hand, it can fill the gap between the conductor and the pin end face and the gap caused by unevenness of the pin end face by remelting, ensuring uniform and tight tin filling. On the other hand, it can avoid PCB board damage and uncontrolled tin amount caused by excessive heating time. Moreover, the heat conduction effect of the tin layer on the pin surface is better after pre-tinning. During subsequent welding, the welding head can fuse in a relatively short time as soon as it makes contact, and only a small amount of tin needs to be added to complete the welding. This effectively shortens the welding time, improves the equipment processing cycle, and significantly improves the stability of welding quality. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] The structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which the present invention can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size, without affecting the effects and objectives that the present invention can produce, should still fall within the scope of the technical content disclosed in the present invention.

[0018] Figure 1 This is a three-dimensional schematic diagram of the automatic riveting and welding wire equipment of the present invention. Figure 1 ; Figure 2 This is a three-dimensional schematic diagram of the automatic riveting and welding wire equipment of the present invention. Figure 2 ,in Figure 2 Perspective and Figure 1 different; Figure 3 This is a schematic diagram of the conveying worktable, the first feeding mechanism, the second feeding mechanism, the riveting mechanism, the pre-tinning mechanism, the welding mechanism, the unloading mechanism, and the third feeding mechanism in this invention; Figure 4 This is a three-dimensional schematic diagram of the conveying workbench in this invention; Figure 5 This is a three-dimensional schematic diagram of the load-bearing fixture in this invention; Figure 6 This is a three-dimensional schematic diagram of the first feeding mechanism in this invention; Figure 7 This is a three-dimensional schematic diagram of the first clamping claw in this invention; Figure 8 This is a three-dimensional schematic diagram of the second feeding mechanism in this invention; Figure 9 This is a three-dimensional schematic diagram of the riveting mechanism in this invention. Figure 1 ; Figure 10 This is a three-dimensional schematic diagram of the riveting mechanism in this invention. Figure 2 ,in Figure 10 and Figure 9 Different perspectives; Figure 11 This is a three-dimensional schematic diagram of the pre-tinning mechanism in this invention; Figure 12 This is a three-dimensional schematic diagram of the welding mechanism and the third feeding mechanism in this invention; Figure 13 This is a three-dimensional schematic diagram of the second linear drive mechanism, welding head, and subframe in this invention. Figure 1 ; Figure 14 This is a three-dimensional schematic diagram of the second linear drive mechanism, welding head, and subframe in this invention. Figure 2 ,in Figure 14 and Figure 13 Different perspectives; Figure 15 This is a three-dimensional schematic diagram of the tin feeding mechanism in this invention; Figure 16 This is a three-dimensional schematic diagram of the wire guiding mechanism and the wire cutting mechanism in this invention; Figure 17 For the present invention Figure 16 Enlarged view of point A in the middle; Figure 18 This is a three-dimensional schematic diagram of the feeding mechanism in this invention; Figure 19 This is a schematic diagram of the PCB board, pins, and wire connections in this invention.

[0019] Illustrations: 1. Conveying worktable; 11. Support fixture; 111. Receiving hole; 112. Clearance area; 12. Hollowed-out section; 2. First feeding mechanism; 21. First disc feeder; 211. First feeding position; 22. First robotic arm; 23. First gripper; 231. Auxiliary gripping hole; 3. Second feeding mechanism; 31. Second disc feeder; 312. Second feeding position; 32. Second robotic arm; 33. Second gripper; 4. Riveting mechanism; 41. First linear drive mechanism; 42. Riveting head; 43. Boss; 5. Pre-tinning mechanism; 51. Tin coil assembly; 52. Tin wire guide structure; 521. Universal curved tube; 522. Fixing frame; 53. Tin feeding mechanism; 531. Conveying roller; 532. Conveying power source; 533. Gear set; 54. Second linear drive mechanism; 55. Welding head; 56. Sub-frame; 561. Mounting hole; 562. Mounting arc groove; 6. Welding mechanism; 7. Feeding mechanism; 71. Finished product box; 72. Guide slide; 73. Fourth robotic arm; 74. Fourth gripper; 75. Brush; 8. Third feeding mechanism; 81. Third robotic arm; 82. Third gripper; 91. Wire storage structure; 92. Wire guiding mechanism; 93. Wire cutting mechanism; 931. First cutter; 932. Second cutter; 933. Stripping pliers claws; 10. Frame; 101. Sensor; 100, pin; 200, PCB board; 300, wire. Detailed Implementation

[0020] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.

[0021] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.

[0022] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0023] This embodiment provides an automatic wire bonding and riveting device, which can automatically rivet the pin 100 to the PCB board 200, pre-solder, solder the wire 300, and unload the finished product, effectively improving welding quality and processing efficiency. Combined with... Figures 1-3 As shown, the automatic riveting and bonding wire equipment includes a conveyor table 1 and riveting mechanism 4, pre-tinning mechanism 5, welding mechanism 6, and unloading mechanism 7 arranged sequentially along the conveying direction of the conveyor table 1. Combined with... Figure 4 As shown, the conveying worktable 1 is fixed with several supporting fixtures 11 corresponding to the riveting mechanism 4, the pre-tinning mechanism 5, the welding mechanism 6, and the unloading mechanism 7. The supporting fixtures 11 are used to support and position the workpieces. In a specific embodiment, the workpiece is the processing object in the riveting and bonding wire, including the initial pin 100 and PCB board 200 to be processed, the PCB board-pin assembly after riveting and fixing, and the finished PCB board after bonding wire. The conveying worktable 1 is used to support and drive the workpiece through the riveting mechanism 4, the pre-tinning mechanism 5, the welding mechanism 6, and the unloading mechanism 7 in sequence to complete the riveting, pre-tinning, welding, and unloading processes of the pin 100. The riveting mechanism 4 is used to rivet and fix the pin 100 to the PCB board 200; the pre-tinning mechanism 5 is used to pre-tin the pin 100 that is riveted and fixed to the PCB board 200; the welding mechanism 6 is used to perform wire welding on the pin 100 after pre-tinning; and the unloading mechanism 7 is used to unload the finished PCB board after wire welding.

[0024] In practice, the conveyor table 1 moves the carrying fixture 11 and the workpiece sequentially to the corresponding positions of the riveting mechanism 4, the pre-tinning mechanism 5, the welding mechanism 6, and the unloading mechanism 7. The riveting mechanism 4 first rivets and fixes the pins 100 to the PCB board 200 to form a PCB board-pin assembly. The pre-tinning mechanism 5 then pre-tins the riveted pins 100. Subsequently, the welding mechanism 6 completes the wire welding operation on the pre-tinned pins 100. Figure 19 As shown, the final unloading mechanism 7 unloads the finished PCB board after wire bonding. Since the conductor 300 is cylindrical or nearly cylindrical, allowing the molten solder to flow into this gap would take a considerable amount of time, affecting work efficiency. Furthermore, excessive heating time could lead to heat damage to the PCB board 200 and uncontrolled solder volume. Uneven or incomplete flow could also result in poor solder filling of the gap. Additionally, the end face of the riveted pin 100 often cannot be completely flat, further affecting the solder adhesion of the conductor 300. In this embodiment, by adding a pre-soldering mechanism 5 before the soldering mechanism 6, pre-soldering can be applied to the end face of the pin 100. The formation of a tin layer can, on the one hand, fill the gaps between the conductor 300 and the end face of the pin 100, as well as the gaps caused by the unevenness of the end face of the pin 100, by remelting, ensuring that the tin material is filled evenly and fits tightly. On the other hand, it can avoid defects such as damage to the PCB board 200 and uncontrolled tin content caused by excessive heating time. Moreover, the heat conduction effect of the tin layer on the surface of the pin 100 is better after pre-adding tin. During subsequent soldering, the soldering head 55 can fuse in a relatively short time as soon as it makes contact, and only a small amount of tin material needs to be added to complete the soldering. This effectively shortens the soldering time, improves the equipment processing cycle, and significantly improves the stability of the soldering quality.

[0025] The automatic riveting and welding wire equipment described in this embodiment also includes a first feeding mechanism 2, a second feeding mechanism 3, and a third feeding mechanism 8. Along the conveying direction of the conveying worktable 1, the first feeding mechanism 2 and the second feeding mechanism 3 are sequentially located upstream of the riveting mechanism 4, and the third feeding mechanism 8 is located between the pre-tinning mechanism 5 and the welding mechanism 6. Along the conveying direction of the conveying worktable 1, a layout of the first feeding mechanism 2, the second feeding mechanism 3, the riveting mechanism 4, the pre-tinning mechanism 5, the welding mechanism 6, and the unloading mechanism 7 is formed. The processing sequence is as follows: first, the first feeding mechanism 2 conveys the pin 100 to the support fixture 11, then the second feeding mechanism 3 conveys the PCB board 200 to the support fixture 11 to align with the pin 100, then the support fixture 11 is conveyed with the conveying worktable 1 to the riveting mechanism 4 to complete the riveting of the pin 100 and the PCB board 200, then it is conveyed to the pre-tinning mechanism 5 to pre-tin the pin 100, then it is conveyed to the welding mechanism 6, where the third feeding mechanism 8 conveys the wire 300 to connect with the pin 100 and completes the welding, and finally it is conveyed to the unloading mechanism 7 to complete the unloading of the finished product. The conveying worktable 1 is fixed with a support fixture 11 corresponding to the first feeding mechanism 2 and the second feeding mechanism 3. This fixture is used to position and fix the pins 100 and the PCB board 200, providing a stable processing reference for subsequent riveting, pre-tinning, and soldering processes. The first feeding mechanism 2 feeds the pins 100 onto the corresponding support fixture 11 on the conveying worktable 1, positioning the pins 100 on the fixture 11. This ensures the alignment of the PCB board 200 with the pins 100 by the second feeding mechanism 3 and the riveting operation by the riveting mechanism 4. The second feeding mechanism 3 feeds the PCB board 200 onto the corresponding support fixture 11 on the conveying worktable 1. The pins 100 are aligned on the support fixture 11, ensuring accurate riveting positions between the pins 100 and the PCB board 200, and guaranteeing the smooth progress of the riveting process. The third feeding mechanism 8 is used to transport the wire 300 to the support fixture 11 on the conveying workbench 1 corresponding to the welding mechanism 6, so as to weld with the pin 100 on the support fixture 11.

[0026] Combination Figure 5As shown, the support fixture 11 is provided with a receiving hole 111 for accommodating the pin 100 and clearance areas 112 respectively disposed on both sides of the receiving hole 111. The distance between the two clearance areas 112 is adapted to the size of the PCB board 200. In specific implementation, after the pin 100 is conveyed by the first feeding mechanism 2, it is embedded into the receiving hole 111 on the support fixture 11. The receiving hole 111 plays a role in positioning and limiting the pin 100. The clearance area 112 can provide clearance space for the first clamping claw 23, the second clamping claw 33, and the fourth clamping claw 74. When the first clamping claw 23 performs the pin 100 placement operation, the second clamping claw 33 performs the PCB board 200 placement operation, and the fourth clamping claw 74 performs the gripping operation, mechanical interference between the first clamping claw 23, the second clamping claw 33, and the fourth clamping claw 74 and the support fixture 11 can be avoided, ensuring that the placement, clamping and other operations can be carried out smoothly. The first clamping claw 23 is provided with an auxiliary clamping hole 231 corresponding to the receiving hole 111 on the support fixture 11. The auxiliary clamping hole 231 corresponds to the receiving hole 111 of the support fixture 11. When the first clamping claw 23 clamps the plug 100 for feeding, it can position the plug 100 to prevent the plug 100 from being skewed, ensure that the plug 100 can be embedded in the receiving hole 111 of the support fixture 11, improve the positioning accuracy of the plug 100, and ensure the smooth progress of the subsequent riveting process.

[0027] Combination Figures 6-7 As shown, the first feeding mechanism 2 includes a first disc feeder 21 and a first robotic arm 22. The first disc feeder 21 is used to convey the pins 100 to the first loading position 211. In a specific embodiment, the first disc feeder 21 is a centrifugal disc feeder or a vibratory disc feeder, which continuously conveys the pins 100 to the first loading position 211 through centrifugal force or vibration, providing material supply for the subsequent clamping and feeding by the first robotic arm 22. Its specific structure and working principle are known to those skilled in the art. The first robotic arm 22 is provided with a first gripping claw 23 at its end, which is used to transfer the pin 100 from the first loading position 211 to the corresponding support fixture 11 on the conveying worktable 1. Through the movement of the first robotic arm 22 and the gripping of the first gripping claw 23, the pin 100 is transferred, so that the pin 100 can be placed in the designated position of the support fixture 11, laying the foundation for the subsequent riveting process. It should be noted that the first robotic arm 22 is conventional technology in the field and will not be described in detail here. As long as the transfer of the pin 100 from the first loading position 211 to the support fixture 11 can be realized and the positioning requirements of the pin 100 can be met, various conventional structures can be used in this embodiment.

[0028] Combination Figure 8As shown, the second feeding mechanism 3 includes a second disc feeder 31 and a second robotic arm 32. The second disc feeder 31 is used to transport the PCB board 200 to the second loading position 312. In a specific embodiment, the second disc feeder 31 is a centrifugal disc feeder or a vibratory disc feeder, which continuously transports the PCB board 200 to the second loading position 312 through centrifugal force or vibration, providing a stable material supply for the subsequent clamping and feeding by the second robotic arm 32. Its specific structure and working principle are known to those skilled in the art. The second robotic arm 32 is provided with a second gripper 33 at its end, which is used to transfer the PCB board 200 from the second loading position 312 to the corresponding carrier fixture 11 on the conveying worktable 1. It should be noted that the second robotic arm 32 and the second gripper 33 are conventional technologies in the field and will not be elaborated on here. As long as the transfer of the PCB board 200 from the second loading position 312 to the carrier fixture 11 can be realized and the alignment requirements between the PCB board 200 and the pin 100 can be met, various conventional structures can be used in this embodiment.

[0029] Sensors 101 are correspondingly installed on the riveting mechanism 4, pre-tinning mechanism 5, welding mechanism 6, and unloading mechanism 7 to detect whether the corresponding support fixture 11 on the conveying worktable 1 is aligned with the execution end of the riveting mechanism 4, pre-tinning mechanism 5, welding mechanism 6, and unloading mechanism 7. This ensures that the execution end of each processing mechanism is aligned with the processing part on the support fixture 11, guaranteeing the processing accuracy and stability of each process. In a specific embodiment, the sensor 101 is a diffuse reflection sensor, which can quickly identify the position of the support fixture 11 and has a sensitive response. The conveying worktable 1 is a rotary worktable. Its working principle is that the drive device drives the rotary worktable to rotate at a constant speed, sequentially transferring the support fixture 11 and the workpiece on it to the working position of each processing mechanism, realizing continuous operation of each process and greatly improving the automation level and processing efficiency of the equipment. Its specific structure and working principle are well known to those skilled in the art and do not require further detailed explanation. The conveying worktable 1 is provided with several hollowed-out portions 12. In a specific embodiment, there are six hollowed-out portions 12. This serves three purposes: firstly, it effectively reduces the overall weight of the conveying worktable 1, lowering the energy consumption for driving its movement; secondly, it optimizes the appearance and structure of the conveying worktable 1, making its overall shape simpler and more regular; and thirdly, it reduces the amount of material required to manufacture the conveying worktable 1, lowering the cost of the equipment. Combined with... Figures 9-10As shown, the riveting mechanism 4 includes a first linear drive mechanism 41 and a riveting head 42 located at the execution end of the first linear drive mechanism 41. During operation, the first linear drive mechanism 41 drives the riveting head 42 downwards to rivet and fix the pins 100 on the support fixture 11. By applying uniform pressure, the pins 100 are firmly connected to the PCB board 200, ensuring the stability and reliability of the connection and meeting subsequent usage requirements. In a specific embodiment, the first linear drive mechanism 41 is one of an electric cylinder, a pneumatic cylinder, or a hydraulic cylinder. A boss 43 is provided on the side of the riveting head 42, and the end face of the boss 43 is lower than the riveting end face of the riveting head 42. Further, the end face of the boss 43 is slightly lower than the riveting end face of the riveting head 42. During the riveting process, the boss 43 prevents the PCB board 200 from warping and displacing upwards due to the impact force of the riveting head 42. Simultaneously, the slightly lower height design avoids interference between the boss 43 and the riveting head 42. In a specific embodiment, the height difference between the end face of the boss 43 and the riveting end face of the riveting head 42 matches the height of the riveting end of the pin 100 after riveting, ensuring that the boss 43 can prevent the PCB board 200 from warping and floating during the riveting process, while avoiding the boss 43 interfering with the riveting action of the riveting head 42 on the pin 100.

[0030] Combination Figures 11-15 As shown, both the pre-tinning mechanism 5 and the welding mechanism 6 include a solder roll 51, a solder wire guide structure 52, a solder feeding mechanism 53, a second linear drive mechanism 54, and a welding head 55. The solder roll 51 is used to load and continuously supply solder wire. The solder wire guide structure 52 is located between the solder roll 51 and the corresponding support fixture 11 on the conveying worktable 1. The solder feeding mechanism 53 is positioned corresponding to the solder wire guide structure 52 and is used to transport the solder wire to the pin 100 position on the corresponding support fixture 11. For the pre-tinning mechanism 5, this pre-forms a solder layer on the surface of the pin 100, improving the reliability of subsequent welding connections. For the welding mechanism 6, it works in conjunction with the welding heat source to complete the welding of the pin 100 and the wire 300. The welding head 55 is located at the end of the second linear drive mechanism 54 and above the corresponding support fixture 11. Under the drive of the second linear drive mechanism 54, it achieves vertical displacement to perform the pre-tinning / welding operation. In a specific embodiment, the second linear drive mechanism 54 is one of an electric cylinder, a pneumatic cylinder, or a hydraulic cylinder.

[0031] In specific implementation, for the pre-tinning mechanism 5, the tin feeding mechanism 53 conveys the tin wire to the pin 100 position via the tin wire guide structure 52. The soldering head 55 heats the tin wire to melt it and adhere it to the surface of the pin 100, completing the pre-tinning process of the pin 100. For the soldering mechanism 6, the tin feeding mechanism 53 conveys the tin wire to the mating position between the pin 100 and the wire 300 via the tin wire guide structure 52. The soldering head 55 heats and melts the tin wire, realizing the soldering connection between the pin 100 and the wire 300.

[0032] Combination Figures 13-15 As shown, both the pre-tinning mechanism 5 and the welding mechanism 6 further include a sub-frame 56. The sub-frame 56 has a mounting hole 561 and a mounting groove 562 for mounting the second linear drive mechanism 54. The mounting hole 561 is located at the center of the mounting groove 562, allowing the second linear drive mechanism 54 to rotate around the mounting hole 561 to adjust its angle, thereby adjusting the angle of the welding head 55. The solder wire guiding structure 52 has a universal curved tube 521 near the conveying worktable 1. The end of the universal curved tube 521 away from the solder roll group 51 is fixed to a fixing frame 522. The fixing frame 522 is fixed to the output end of the second linear drive mechanism 54, moving with the output end of the second linear drive mechanism 54 to ensure that the solder wire conveying position corresponds to the welding head 55 processing position in real time; it can also adjust the solder wire guiding angle as the angle of the welding head 55 is adjusted. In a specific embodiment, the universal curved tube 521 is made of Teflon, which can reduce the frictional resistance during solder wire conveying. The solder feeding mechanism 53 includes two conveying rollers 531 and a power source 532. The two conveying rollers 531 are connected by a gear set 533. The output end of the power source 532 is fixedly connected to one of the conveying rollers 531. The solder wire is clamped between the two conveying rollers 531, and the continuous and stable feeding of the solder wire is achieved by the synchronous rotation of the two conveying rollers 531. In a specific embodiment, the power source 532 is one of an electric motor, a pneumatic motor, or a hydraulic motor.

[0033] Combination Figures 16-17As shown, the automatic wire bonding and riveting equipment described in this embodiment also includes a wire storage structure 91, a wire guiding mechanism 92, and a wire cutting mechanism 93. The wire storage structure 91 is used to store the wires 300 to be processed and to provide a stable material source for the subsequent conveying of the wires 300. The wire guiding mechanism 92 is used to guide the wires 300 from the wire storage structure 91 to the wire cutting mechanism 93. The wire cutting mechanism 93 is used to cut the wires 300 to a preset length. The third feeding mechanism 8 is used to convey the wires 300 from the discharge side of the wire cutting mechanism 93 to the bearing fixture 11 on the conveying worktable 1 corresponding to the welding mechanism 6. In practice, the wire storage structure 91 first releases the wire 300 to be processed. Under the guidance of the wire guiding mechanism 92, the wire 300 is transported to the processing station of the wire cutting mechanism 93. After the wire 300 is transported to the preset position, the wire cutting mechanism 93 starts and cuts the wire 300 to the preset length, completing the cutting process of the wire 300. After the wire 300 is cut, the third feeding mechanism 8 immediately moves to grab the cut wire 300 from the discharge side of the wire cutting mechanism 93, and then transports it to the bearing fixture 11 on the conveying workbench 1 corresponding to the welding mechanism 6, preparing for the subsequent welding process.

[0034] The third feeding mechanism 8 includes a third robotic arm 81 and a third gripping claw 82 located at the execution end of the third robotic arm 81. It is used to grip the wire 300 cut by the wire cutting mechanism 93 and, driven by the third robotic arm 81, transport the wire 300 to the corresponding support fixture 11 to prepare for the subsequent welding process. It should be noted that the third robotic arm 81 and the third gripping claw 82 both adopt conventional technical structures in the field. Their core function is to realize the gripping and transport of the wire 300. As long as the positional accuracy and stability requirements of the wire 300 transport can be met, various conventional structures can be used in this embodiment, which will not be elaborated on here. The wire cutting mechanism 93 includes two sets of cutting blades, which move closer to or further away from each other under the drive of the wire cutting drive mechanism. Each set of cutting blades includes a first cutting blade 931 and second cutting blades 932 located on both sides of the first cutting blade 931. The first cutting blade 931 and the second cutting blade 932 are arranged along the guide direction of the wire guiding mechanism 92, and the cutting end of the first cutting blade 931 protrudes beyond the cutting end of the second cutting blade 932. The first cutting blade 931 is used to cut the core wire of the wire 300, completing the cutting of the wire 300 length. The second cutting blade 932 is used to cut a notch in the insulation at the end of the wire 300, preparing for the subsequent stripping pliers 933 to peel off the insulation and expose the core wire for soldering. It should be noted that any mechanism that can drive the two sets of cutting blades to move closer to or further away from each other to cut the wire 300 can be used in the wire cutting drive mechanism in this embodiment. For example, two sets of cylinders can be used to drive the corresponding cutting blade sets to move. The specific structure will not be described in detail here. Along the guiding direction of the wire guiding mechanism 92, both sides of the wire cutting mechanism 93 are provided with stripping claws 933. These stripping claws 933 are mounted on a third linear drive mechanism and are used to clamp and peel off the insulation pre-cut by the second cutter 932 from the end of the wire 300, exposing the core wire of the wire 300. This ensures that the core wire can fully contact the pin 100 during subsequent welding, providing a suitable end structure for the wire 300 for subsequent welding processes. In a specific embodiment, the third linear drive mechanism is one of an electric cylinder, a pneumatic cylinder, or a hydraulic cylinder; or it can adopt a conventional linear drive structure in the art, such as a ball screw slide or a rack and pinion slide. Any mechanism capable of driving the stripping claws 933 to achieve linear displacement, moving them closer to or away from the wire 300, and smoothly completing the insulation stripping action, can be used in this embodiment.

[0035] In practice, the conductor storage structure 91 first continuously and stably releases the conductor 300. Guided by the conductor guiding mechanism 92, the conductor 300 is conveyed along a preset path to the processing station of the wire cutting mechanism 93. After the conductor 300 is in place, the wire cutting drive mechanism drives the two sets of cutting blades to approach each other. The cutting end of the first cutting blade 931 first contacts and cuts the core wire of the conductor 300, completing the fixed-length cutting of the conductor 300. At the same time, the second cutting blades 932 located on both sides of the first cutting blade 931 simultaneously cut the conductor 300. A pre-cut slit is made on the insulation at the 0 end; then, the stripping claws 933 on both sides of the wire cutting mechanism 93 clamp the pre-cut insulation at the end of the wire 300 and pull it outward to peel off the insulation so that the core wire of the wire 300 is exposed; finally, the third clamping claw 82 of the third feeding mechanism 8 clamps the wire 300 after cutting and stripping, and under the drive of the third robotic arm 81, the wire 300 is transported to the bearing fixture 11 corresponding to the welding mechanism 6 on the conveying worktable 1, completing the automatic feeding action of the wire 300.

[0036] Combination Figure 18 As shown, the unloading mechanism 7 includes a finished product box 71, a guide slide 72, and a fourth robotic arm 73. The fourth robotic arm 73 has a fourth gripping claw 74 at its end, which is used to transfer the finished PCB board from the carrying fixture 11 corresponding to the unloading mechanism 7 on the conveying worktable 1 to the guide slide 72, thereby realizing the automated unloading of the finished PCB board. It should be noted that the fourth robotic arm 73 and the fourth gripping claw 74 are conventional technical structures in the art and will not be elaborated on here. As long as the gripping and transfer of the finished PCB board can be realized, and the positional accuracy and motion stability requirements during the unloading process are met, various conventional structures can be used in this embodiment. The finished product box 71 is located below the guide slide 72 and is used to collect the finished PCB board that slides down the guide slide 72. In a specific embodiment, a flexible buffer layer can be provided inside the finished product box 71. A brush 75 is provided on the unloading mechanism 7 near the welding mechanism 6. The brush 75 is positioned directly opposite the movement path of the support fixture 11. It is used to clean the surface of the support fixture 11 as it moves past the conveyor table 1, removing weld beads and slag generated during the welding process. This removes any remaining debris from the support fixture 11, ensuring its cleanliness and preventing residual weld beads and slag from affecting the positioning accuracy and processing quality of the next batch of workpieces. This ensures the support fixture 11 can be used normally in subsequent applications. In a specific embodiment, the automatic riveting and welding wire equipment also includes a frame 10, which is used to mount the conveyor table 1, the first loading mechanism 2, the second loading mechanism 3, the riveting mechanism 4, the pre-tinning mechanism 5, the welding mechanism 6, and the unloading mechanism 7.

[0037] The automatic wire bonding equipment provided in this embodiment uses a conveyor table 1 to move the carrying fixture 11 and the workpiece sequentially to the corresponding workstations of the riveting mechanism 4, the pre-tinning mechanism 5, the welding mechanism 6, and the unloading mechanism 7. First, the riveting mechanism 4 rivets and fixes the pin 100 to the PCB board 200 to form a PCB board-pin assembly. Then, the pre-tinning mechanism 5 pre-tins the riveted pin 100. Subsequently, the welding mechanism 6 completes the wire welding operation on the pre-tinned pin 100. Finally, the unloading mechanism 7 unloads the finished PCB board with wire bonding completed. In this embodiment, by adding a pre-tinning mechanism 5 before the welding mechanism 6, a tin layer can be pre-formed on the end face of the pin 100. On the one hand, it can fill the gap between the conductor 300 and the end face of the pin 100 and the gap caused by the unevenness of the end face of the pin 100 by remelting, ensuring that the tin material is filled evenly and fits tightly. On the other hand, it can avoid the PCB board 200 being damaged and the tin amount being out of control due to excessive heating time. Moreover, the heat conduction effect of the tin layer on the surface of the pin 100 is better after pre-tinning. During subsequent welding, the welding head 55 can be fused in a relatively short time as soon as it makes contact, and only a small amount of tin material needs to be added to complete the welding. This effectively shortens the welding time, improves the equipment processing cycle, and significantly improves the stability of the welding quality.

[0038] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An automatic riveting and welding wire equipment, characterized in that: It includes a conveying workbench (1) and a riveting mechanism (4), a pre-tinning mechanism (5), a welding mechanism (6) and a feeding mechanism (7) arranged sequentially along the conveying direction of the conveying workbench (1); The riveting mechanism (4) is used to rivet and fix the pin (100) to the PCB board (200). The pre-tinning mechanism (5) is used to pre-tin the pins (100) that are riveted and fixed to the PCB board (200); The welding mechanism (6) is used to perform wire welding on the pre-tinned pins (100); The unloading mechanism (7) is used to unload the finished PCB board after the wire bonding is completed; The conveying worktable (1) is fixed with several carrying fixtures (11) corresponding to the riveting mechanism (4), the pre-tinning mechanism (5), the welding mechanism (6) and the unloading mechanism (7). The conveying worktable (1) is used to carry and drive the workpiece through the riveting mechanism (4), the pre-tinning mechanism (5), the welding mechanism (6) and the unloading mechanism (7) in sequence.

2. The automatic riveting and welding wire equipment according to claim 1, characterized in that: The pre-tinning mechanism (5) and the welding mechanism (6) both include a tin roll group (51), a tin wire guiding structure (52), a tin feeding mechanism (53), a second linear drive mechanism (54), and a welding head (55); The tin wire guide structure (52) is located between the tin roll group (51) and the corresponding bearing fixture (11) on the conveying worktable (1), and the tin feeding mechanism (53) is set in accordance with the tin wire guide structure (52); The welding head (55) is located at the end of the second linear drive mechanism (54) and above the corresponding support fixture (11).

3. The automatic riveting and welding wire equipment according to claim 2, characterized in that: The pre-tinning mechanism (5) and the welding mechanism (6) both include a sub-frame (56), which is provided with a mounting hole (561) and a mounting groove (562) for mounting the second linear drive mechanism (54). The mounting hole (561) is located at the center of the mounting groove (562). The tin wire guide structure (52) has a universal curved tube (521) on the side near the conveying worktable (1); The universal curved tube (521) is fixed to a fixing frame (522) at one end away from the solder roll (51), the fixing frame (522) being fixed to the output end of the second linear drive mechanism (54); The tin feeding mechanism (53) includes two conveying rollers (531) and a conveying power source (532). The two conveying rollers (531) are connected by a gear set (533). The output end of the conveying power source (532) is fixedly connected to one of the conveying rollers (531).

4. The automatic riveting and welding wire equipment according to claim 1, characterized in that: It also includes a first feeding mechanism (2), a second feeding mechanism (3), and a third feeding mechanism (8); along the conveying direction of the conveying workbench (1), the first feeding mechanism (2) and the second feeding mechanism (3) are sequentially located upstream of the riveting mechanism (4), and the third feeding mechanism (8) is located between the pre-tinning mechanism (5) and the welding mechanism (6); The conveying workbench (1) is fixed with a bearing fixture (11) corresponding to the first feeding mechanism (2) and the second feeding mechanism (3); The first feeding mechanism (2) is used to feed and transport the pin (100) to the corresponding support fixture (11) on the conveying workbench (1); The second feeding mechanism (3) is used to feed the PCB board (200) onto the corresponding support fixture (11) on the conveying worktable (1); The third feeding mechanism (8) is used to transport the wire (300) to the bearing fixture (11) at the corresponding welding mechanism (6) on the conveying workbench (1).

5. The automatic riveting and welding wire equipment according to claim 4, characterized in that: It also includes a wire storage structure (91), a wire guiding mechanism (92), and a wire cutting mechanism (93). The wire guiding mechanism (92) is used to guide the wire (300) from the wire storage structure (91) to the wire cutting mechanism (93). The wire cutting mechanism (93) is used to cut the wire (300) to a preset length. The third feeding mechanism (8) is used to transport the wire (300) from the discharge side of the wire cutting mechanism (93) to the carrying fixture (11) at the corresponding welding mechanism (6) on the conveying worktable (1).

6. The automatic riveting and welding wire equipment according to claim 5, characterized in that: The third feeding mechanism (8) includes a third robotic arm (81) and a third gripper (82) located at the execution end of the third robotic arm (81). The wire cutting mechanism (93) includes two sets of cutting blades, which move closer to or further away from each other under the drive of the wire cutting drive mechanism. Each set of cutting blades includes a first cutting blade (931) and a second cutting blade (932) located on both sides of the first cutting blade (931). The first cutting blade (931) and the second cutting blade (932) are arranged along the guide direction of the wire guiding mechanism (92), and the cutting end of the first cutting blade (931) protrudes beyond the cutting end of the second cutting blade (932). Along the guiding direction of the wire guiding mechanism (92), the wire cutting mechanism (93) is provided with stripping pliers (933) on both sides, which are used to clamp and strip the insulation of the wire (300) end pre-cut by the second cutter (932).

7. The automatic riveting and welding wire equipment according to claim 4, characterized in that: The first feeding mechanism (2) includes a first disc feeder (21) and a first robotic arm (22); The first disc feeder (21) is used to convey the pins (100) to the first loading position (211). The first robotic arm (22) has a first gripper (23) at its end, which is used to transfer the insert (100) from the first loading position (211) to the corresponding carrying fixture (11) on the conveying worktable (1).

8. The automatic riveting and welding wire equipment according to claim 7, characterized in that: The support fixture (11) is provided with a receiving hole (111) for accommodating the pin (100) and a clearance area (112) on both sides of the receiving hole (111). The distance between the two clearance areas (112) is adapted to the size of the PCB board (200). The first clamping claw (23) is provided with an auxiliary clamping hole (231) corresponding to the receiving hole (111) on the bearing fixture (11).

9. The automatic riveting and welding wire equipment according to claim 4, characterized in that: The second feeding mechanism (3) includes a second disc feeder (31) and a second robotic arm (32); The second disc feeder (31) is used to transport the PCB board (200) to the second loading position (312). The second robotic arm (32) is provided with a second gripper (33) at its end, which is used to transfer the PCB board (200) from the second loading position (312) to the corresponding carrying fixture (11) on the conveying worktable (1).

10. The automatic riveting and welding wire equipment according to claim 1, characterized in that: Sensors (101) are provided on the riveting mechanism (4), pre-tinning mechanism (5), welding mechanism (6) and unloading mechanism (7) respectively, for detecting whether the corresponding bearing fixture (11) on the conveying worktable (1) is facing the execution end of the riveting mechanism (4), pre-tinning mechanism (5), welding mechanism (6) and unloading mechanism (7).

11. The automatic riveting and welding wire equipment according to claim 1, characterized in that: The conveying worktable (1) is a rotary work plate; The conveying workbench (1) is provided with several hollowed-out sections (12). The riveting mechanism (4) includes a first linear drive mechanism (41) and a riveting head (42) located at the execution end of the first linear drive mechanism (41). The riveting head (42) is provided with a boss (43) on its side. The end face of the boss (43) is set lower than the riveting end face of the riveting head (42), and the height difference between the end face of the boss (43) and the riveting end face of the riveting head (42) matches the height of the riveting end of the pin (100) after riveting.

12. The automatic riveting and welding wire equipment according to claim 1, characterized in that: The unloading mechanism (7) includes a finished product box (71), a guide slide (72), and a fourth robotic arm (73); The fourth robotic arm (73) has a fourth gripper (74) at its execution end, which is used to transfer the finished PCB board from the carrying fixture (11) of the corresponding unloading mechanism (7) on the conveying worktable (1) to the guide slide (72). The finished product box (71) is located below the guide slide (72); The feeding mechanism (7) is provided with a brush (75) on the side near the welding mechanism (6), and the brush (75) is set in the direction of the movement path of the bearing fixture (11).