An insulating film for LED module and its attaching device and preparation method

Abstract

The application discloses an insulating film for an LED module, wherein the insulating film comprises a high-thermal-conductivity insulating film, a lower surface of the high-thermal-conductivity insulating film is provided with a plurality of grooves, the grooves can accommodate components on the LED module, and the layout of the grooves is adapted to the distribution of the components on the LED module; the high-thermal-conductivity insulating film is integrally arranged; a laminating device for the insulating film is also disclosed, which comprises a rack, a conveying mechanism, a laminating mechanism, a rolling mechanism and a pressing mechanism; the rolling mechanism comprises a pressing assembly, a driving device, a translation device and a turnover assembly, and can realize the combined laminating of pushing and rolling of the film from the center to the two sides; and a preparation method of the insulating film is also disclosed, which comprises the steps of three-dimensional scanning modeling, mold design and preparation, one-body forming of a film substrate and formation of a peelable interface layer, and solves the problems of poor heat dissipation effect of the existing LED module and easy deviation of the film in the film laminating process.

Description

Technical Field

[0001] This invention relates to LED module processing technology, specifically to an insulating film for LED modules, a bonding device thereon, and a preparation method thereof. Background Technology

[0002] As LED display technology continues to advance towards higher brightness and higher pixel density, the power density of the PCB driving surface has significantly increased, resulting in concentrated high-temperature hotspots. Currently, mainstream LED display modules in the industry generally use low thermal conductivity engineering plastics such as polycarbonate (PC) or ABS as the outer shell. The heat dissipation between the outer shell and the PCB driving surface mainly relies on a sealed air layer, resulting in high interface thermal resistance and low heat dissipation efficiency. This easily leads to local heat accumulation and uneven temperature distribution, which in turn affects the consistency of display color, accelerates the photoaging of components and solder joint failure, and shortens the overall lifespan of the module.

[0003] To address the aforementioned heat dissipation issues, existing technical solutions all have significant shortcomings: metal casings are prone to signal interference and are costly and heavy; adding external heat sinks increases module size and disrupts aesthetic consistency; using thermal grease presents problems such as curing, oil seepage, and maintenance difficulties; using strong adhesive to bond heat sinks makes them difficult to disassemble and hinders future repairs; and traditional thermal pads or graphite films typically require independent cutting and application, which is complex and makes it difficult to achieve conformal bonding with complex PCB layouts, thus failing to achieve optimal interface heat conduction.

[0004] In addition, although existing technologies attempt to eliminate air bubbles between the film and the substrate to improve sealing during the LED display film application process, their bonding method, which relies solely on the translational movement of a single pressing roller, is prone to film misalignment in actual operation, thus affecting the uniformity and quality of bonding. Summary of the Invention

[0005] The purpose of this invention is to provide an insulating film for LED modules, a bonding device for the film, and a preparation method thereof, which solves the problem of easy film misalignment in the bonding process of existing LED modules.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] An insulating film for LED modules, comprising:

[0008] A high thermal conductivity insulating film has several grooves on its lower surface, which can accommodate components on the LED module, and their layout is adapted to the distribution of components on the LED module.

[0009] The high thermal conductivity insulating film is a multi-layer composite structure, which includes an insulating encapsulation layer, a high thermal conductivity core layer and a peelable interface layer in sequence. The high thermal conductivity core layer is made of a high thermal conductivity flexible composite material, and several grooves penetrate the high thermal conductivity core layer.

[0010] A bonding device for bonding insulating films, comprising:

[0011] frame;

[0012] A conveyor mechanism used to transport LED modules;

[0013] A bonding mechanism is used to bond a highly thermally conductive insulating film onto an LED module;

[0014] The roller pressing mechanism includes a pressing assembly, a driving device, a translation device, and a flipping assembly;

[0015] The pressing mechanism is used to press and fix a high thermal conductivity insulating film onto the LED module;

[0016] The pressing assembly includes a pressing base and pressing rollers disposed on both sides of the pressing base. The side walls on both sides of the pressing base have arc-shaped openings for accommodating the pressing rollers. The contour of the bottom of the pressing rollers matches the contour of the bottom wall of the arc-shaped openings. The driving device is used to drive the pressing assembly to move toward the LED module with the high thermal conductivity insulating film attached. The translation device is used to drive the pressing rollers on both sides of the pressing base to move towards or away from each other in the horizontal direction. The flipping assembly is used to drive the pressing rollers to rotate.

[0017] The conveying mechanism, bonding mechanism, rolling mechanism, and pressing mechanism are arranged sequentially along the conveying direction of the LED module.

[0018] Furthermore, the bottom wall of the pressing seat and the lowest point of the bottom of the pressing roller are located on the same horizontal plane.

[0019] Furthermore, the driving device includes:

[0020] Translation drive component, which is fixedly connected to the frame;

[0021] The connecting frame is fixedly connected at its top to the output end of the translation drive component and at its bottom to the pressing seat.

[0022] Several side plates are rotatably connected to both ends of the pressing roller;

[0023] Several guide rods are fixed at both ends to the connecting frame, and they slide in conjunction with several side plates.

[0024] Furthermore, the translation device includes:

[0025] A rotary drive component, which is fixedly connected to a connecting frame;

[0026] A two-way lead screw is rotatably connected to the connecting frame, and its two ends with opposite threads are respectively threaded to the two side plates.

[0027] Further, the flipping component includes:

[0028] A rack, which is fixedly connected to the connecting frame;

[0029] Two gears are fixedly connected to two pressing rollers via rotating shafts, and both gears mesh with a rack.

[0030] Furthermore, the conveying mechanism includes:

[0031] A conveyor mounting frame, which is fixedly mounted on the machine frame;

[0032] The drive source is fixedly connected to the conveyor mounting frame;

[0033] A lead screw, which is rotatably connected to the conveyor mounting frame and fixedly connected to the output end of the drive source;

[0034] A connecting seat that is slidably connected to the conveyor mounting frame and threadedly connected to the lead screw;

[0035] The positioning frame is fixedly connected to the connector.

[0036] A method for preparing an insulating film, comprising the following steps:

[0037] S1. 3D Scanning and Modeling: A non-contact 3D scanning device is used to scan the PCB driving surface of the target LED display module to obtain 3D point cloud data including the height, outline and position distribution of each component, and a 3D digital model consistent with the physical object is established based on the data.

[0038] S2. Mold Design and Fabrication: Based on the three-dimensional digital model, a negative mold conforming to the layout of components on the PCB drive surface is generated by computer-aided design, and a solid mold is fabricated by CNC machining or 3D printing.

[0039] S3. Integrated molding of thin film substrate: Using the solid mold, a three-dimensional thin film substrate is prepared by injection molding or hot pressing process, so that the lower surface of the substrate forms several grooves corresponding to the shape and layout of the components.

[0040] The injection molding process includes injecting liquid thermally conductive and insulating composite material into the mold cavity in a layer-by-layer sequence, and then curing it layer by layer to form a multi-layer composite structure; the hot pressing process includes heating and softening a pre-made multi-layer flat high thermal conductivity film, placing it in a mold for hot pressing deformation, and then demolding it after cooling and shaping.

[0041] S4. Formation of a peelable interface layer: A non-silicone pressure-sensitive adhesive is coated or attached to the conformal surface of the three-dimensional thin film substrate to form a peelable interface layer, which is then cured or aged to obtain the high thermal conductivity insulating film.

[0042] Compared with existing technologies, the present invention provides an insulating film for LED modules, its bonding device, and its preparation method. Through an integrated molding process, it achieves precise conformal bonding with the component layout on the PCB driving surface. Combined with a multi-layer composite structure design, it can replace the inefficient heat dissipation method that relies on a sealed air layer. It eliminates interfacial air gaps, reduces thermal resistance, and improves heat dissipation efficiency and temperature uniformity, thereby avoiding color shift, light decay, and solder joint failure caused by high-temperature hot spots. It solves the problem of poor heat dissipation in existing LED modules.

[0043] A drive unit lowers the pressing assembly, causing the bottom of the pressing seat and the pressing roller to simultaneously contact the surface of the insulating film. The pressing seat first provides overall support and initial pressing, ensuring stable film positioning and preventing slippage or displacement during the initial bonding process. Subsequently, the pressing roller uses a combined translational and flipping motion to roll and press along the film surface from the center outwards, gradually expelling air from under the film and ensuring a tight adhesion between the film and the undulating surface of the PCB. This structure, through the synergistic effect of the planar pressing of the pressing seat and the rolling extension of the pressing roller, balances overall positioning and local bonding during the pressing process, improving the flatness and bonding strength of the film, avoiding wrinkles and residual air bubbles, and thus solving the problem of film displacement in existing lamination processes. Attached Figure Description

[0044] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this invention. For those skilled in the art, other drawings can be obtained based on these drawings.

[0045] Figure 1 This is a schematic diagram of the overall structure provided in Embodiment 1 of the present invention;

[0046] Figure 2 This is an exploded view of the high thermal conductivity insulating film provided in Embodiment 1 of the present invention;

[0047] Figure 3 This is a schematic diagram of the overall structure provided in Embodiment 2 of the present invention;

[0048] Figure 4 This is a schematic diagram of the conveying mechanism provided in Embodiment 2 of the present invention;

[0049] Figure 5 This is a schematic diagram of the roller pressing mechanism provided in Embodiment 2 of the present invention;

[0050] Figure 6 This is a schematic diagram of the pressing assembly and driving device provided in Embodiment 2 of the present invention;

[0051] Figure 7 This is a schematic diagram of the pressing assembly provided in Embodiment 2 of the present invention;

[0052] Figure 8 This is a schematic diagram of the translation device provided in Embodiment 2 of the present invention;

[0053] Figure 9 This is a schematic diagram of the structure of the flipping component provided in Embodiment 2 of the present invention;

[0054] Figure 10 This is a process flow diagram for preparing the thermally insulating film provided in Embodiment 3 of the present invention.

[0055] Explanation of reference numerals in the attached figures:

[0056] 1. High thermal conductivity insulating film; 2. Frame; 3. Conveying mechanism; 4. Laminating mechanism; 5. Rolling mechanism; 6. Pressing mechanism; 11. Groove; 12. Insulating encapsulation layer; 13. High thermal conductivity core layer; 14. Peelable interface layer; 31. Conveying mounting frame; 32. Drive source; 33. Lead screw; 34. Connecting seat; 35. Positioning frame; 51. Pressing assembly; 511. Pressing seat; 512. Pressing roller; 513. Arc-shaped opening; 52. Drive device; 521. Translation drive component; 522. Connecting frame; 523. Side plate; 524. Guide rod; 53. Translation device; 531. Rotation drive component; 532. Bidirectional lead screw; 54. Tilting assembly; 541. Rack; 542. Gear. Detailed Implementation

[0057] To enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be further described in detail below with reference to the accompanying drawings.

[0058] Example 1:

[0059] Please see Figures 1 to 2 An insulating film for LED modules, comprising:

[0060] A high thermal conductivity insulating film 1 has a plurality of grooves 11 on its lower surface. The grooves 11 can accommodate components on the LED module driving surface, and their layout is adapted to the distribution of components on the LED module driving surface.

[0061] The high thermal conductivity insulating film 1 is integrally formed and includes, in sequence, an insulating encapsulation layer 12, a high thermal conductivity core layer 13 and a peelable interface layer 14. The high thermal conductivity core layer 13 is made of a high thermal conductivity flexible composite material, and several grooves penetrate the high thermal conductivity core layer.

[0062] Among them, the high thermal conductivity insulating film 1 is prepared by an integrated molding process, so that its lower surface conformally matches the component layout on the PCB driving surface, thereby maximizing the contact area and reducing the interface thermal resistance.

[0063] The peelable interface layer 14 is a non-silicone pressure-sensitive adhesive, which is used to enable repeated application and removal of the film for easy maintenance.

[0064] The insulating encapsulation layer 12 is made of at least one material selected from polyimide (PI), epoxy resin or PET, and is used to ensure electrical insulation between the film and the PCB circuit to avoid signal interference.

[0065] The high thermal conductivity core layer 13 comprises a polymer composite material filled with boron nitride, aluminum oxide or graphene, or a flexible graphite film, with a thermal conductivity of not less than 2 W / m·K.

[0066] The film has a thickness of 0.1mm to 1.5mm and is suitable for small-pitch LED display modules or outdoor LED display modules, which can significantly improve heat dissipation efficiency and temperature uniformity.

[0067] This high thermal conductivity insulating film 1 achieves precise conformal bonding with the component layout on the PCB driving surface through an integrated molding process. Combined with a multi-layer composite structure design, it can replace the inefficient heat dissipation method that relies on a sealed air layer. It eliminates the interface air gap, reduces thermal resistance, and improves heat dissipation efficiency and temperature uniformity, thereby avoiding color shift, light decay, and solder joint failure caused by high-temperature hot spots. At the same time, the peelable interface layer 14 and the full insulation characteristics of this high thermal conductivity insulating film 1 enable convenient installation and maintenance disassembly while ensuring that the signal is not interfered with. It provides a lightweight, easy-to-maintain, and aesthetically pleasing integrated heat dissipation solution for high power density LED display modules.

[0068] Example 2:

[0069] Please see Figure 10 A method for preparing an insulating film, used to prepare the insulating film in Example 1, includes the following steps:

[0070] S1. 3D Scanning and Modeling: A non-contact 3D scanning device is used to scan the PCB driving surface of the target LED display module to obtain accurate 3D point cloud data, including the height, outline, position distribution of each component and the undulation of the PCB surface. Based on this data, a 3D digital model consistent with the physical object is established.

[0071] S2. Mold Design and Fabrication: Based on the three-dimensional digital model, a negative mold that is completely conformal to the component layout on the PCB drive surface is generated through computer-aided design (CAD). The cavity surface shape of the mold corresponds to the three-dimensional shape of the PCB drive surface in a mirror image. Subsequently, the negative mold is processed into a solid mold using CNC machining or 3D printing technology.

[0072] S3. Integrated molding of thin film substrate: Three-dimensional thin film substrates are prepared using a solid mold and any of the following integrated molding processes:

[0073] Injection molding: Liquid thermally conductive and insulating composite material is injected into the mold cavity in layers. First, the corresponding material that constitutes the insulating encapsulation layer 12 or the high thermal conductivity core layer 13 is injected. After heating and curing or ultraviolet curing, the next layer of material is injected and cured in sequence to form a multi-layer composite integrated structure. After demolding, a thin film substrate with grooves 11 on the lower surface that correspond one-to-one with the components and whose overall shape conformally matches the PCB is obtained.

[0074] Hot pressing: After stacking the prefabricated multi-layer flat high thermal conductivity film material, heat it to above its softening temperature, place it in a negative mold and apply hot pressing to plastically deform it into a conformal structure consistent with the mold cavity. After cooling and solidification, demold it; wherein, the prefabricated multi-layer flat high thermal conductivity film includes an insulating encapsulation layer 12 and a high thermal conductivity core layer 13 stacked in sequence.

[0075] S4. Formation of the peelable interface layer 14: A non-silicone pressure-sensitive adhesive is uniformly coated or precisely attached to the conformal surface (i.e., the lower surface) of the three-dimensional thin film substrate to form a peelable interface layer 14; after curing or aging treatment, a high thermal conductivity insulating film 1 is finally obtained. This film can achieve reliable bonding and non-destructive disassembly with the PCB driving surface through the interface layer.

[0076] Example 3:

[0077] Please see Figures 3 to 9 This embodiment provides an insulating film bonding device for bonding the insulating film in Embodiment 1, comprising:

[0078] Rack 2;

[0079] Conveying mechanism 3 is used to convey LED modules;

[0080] The bonding mechanism 4 is used to bond the high thermal conductivity insulating film 1 onto the LED module;

[0081] The roller pressing mechanism 5 includes a pressing assembly 51, a driving device 52, a translation device 53, and a flipping assembly 54;

[0082] Pressing mechanism 6 is used to press and fix the high thermal conductivity insulating film 1 onto the LED module;

[0083] The pressing assembly 51 includes a pressing seat 511 and pressing rollers 512 disposed on both sides of the pressing seat 511. The side walls on both sides of the pressing seat 511 are provided with arc-shaped openings 513 for accommodating the pressing rollers 512. The contour of the bottom of the pressing rollers 512 is adapted to the contour of the bottom wall of the arc-shaped openings 513. The driving device 52 is used to drive the pressing assembly 51 to move toward the LED module with the high thermal conductivity insulating film 1 attached. The translation device 53 is used to drive the pressing rollers 512 on both sides of the pressing seat 511 to move towards or away from each other in the horizontal direction. The flipping assembly 54 is used to drive the pressing rollers 512 to rotate.

[0084] The conveying mechanism 3, bonding mechanism 4, rolling mechanism 5, and pressing mechanism 6 are arranged sequentially along the conveying direction of the LED module.

[0085] The bonding mechanism 4 includes, but is not limited to, an electric robotic arm;

[0086] When the bonding device is in operation, the LED modules are first sent to the bonding station in sequence by the conveying mechanism 3. The end effector of the bonding mechanism 4 initially places the high thermal conductivity insulating film 1 on the PCB driving surface. Then, the driving device 52 of the roller pressing mechanism 5 drives the pressing component 51 to press down. The pressing rollers 512 on both sides move horizontally towards each other under the control of the translation device 53. At the same time, the flipping component 54 drives the rotation, so that the film is extended and pressed from the center to both sides by a combination of pushing and rolling actions, eliminating air bubbles and preventing the film from shifting.

[0087] Finally, the pressing mechanism 6 includes, but is not limited to, an electric telescopic rod or a pneumatic telescopic rod. The pressing mechanism 6 drives the film to be squeezed between the film and the PCB components through the output end to form a stable conformal bond. This process not only overcomes the problems of misalignment and unevenness that are easily caused by traditional single-roller bonding, but also ensures a tight and bubble-free bond between the high thermal conductivity insulating film 1 and the complex PCB surface, ultimately achieving a comprehensive optimization of efficient heat dissipation, reliable insulation and maintainability.

[0088] The bottom wall of the pressing seat 511 and the lowest point of the bottom of the pressing roller 512 are on the same horizontal plane.

[0089] During the bonding operation, when the drive device 52 drives the pressing assembly 51 to press down, the bottom wall of the pressing seat 511 and the bottom of the pressing roller 512 simultaneously contact the surface of the insulating film. The pressing seat 511 first provides overall support and initial pressing, so that the film is stably positioned and prevents slippage and displacement in the early stage of bonding. Then, under the combined motion of translation and flipping, the pressing roller 512 rolls along the film surface from the center to both sides, gradually expelling the air under the film and making it tightly adhere to the undulating surface of the PCB. Through the synergistic effect of the planar and rolling of the pressing seat 511 and the pressing roller 512, this structure takes into account both overall positioning and local extension during the pressing process, improves the flatness and bonding strength of the film bonding, avoids wrinkling and residual air bubbles, and thus ensures that the conformal heat dissipation film and the PCB driving surface achieve uniform, reliable and air bubble-free tight bonding.

[0090] Conveying mechanism 3 includes:

[0091] The conveyor mounting frame 31 is fixedly mounted on the frame 2;

[0092] The drive source 32 is fixedly connected to the conveyor mounting frame 31;

[0093] The lead screw 33 is rotatably connected to the conveyor mounting frame 31 and is fixedly connected to the output end of the drive source 32;

[0094] The connecting seat 34 is slidably connected to the conveyor mounting frame 31 and threadedly connected to the lead screw 33;

[0095] The positioning frame 35 is fixedly connected to the connecting seat 34.

[0096] The drive source 32 includes, but is not limited to, an electric motor, which is electrically connected to an external power source and is also controlled by an external PLC programming program. When the conveying mechanism 3 is in operation, the drive source 32 drives the lead screw 33 to rotate, which drives the threaded connecting seat 34 and the positioning frame 35 fixed thereon to slide smoothly along the conveying mounting frame 31, thereby accurately and stably conveying the LED module loaded in the positioning frame 35 to the subsequent bonding, rolling and hot pressing stations. Its function is to achieve high-precision and repeatable positioning and conveying through the lead screw 33 transmission, ensuring that the LED module is accurately positioned and does not deviate during continuous operation.

[0097] The drive unit 52 includes:

[0098] Translation drive component 521 is fixedly connected to frame 2;

[0099] The top of the connecting bracket 522 is fixedly connected to the output end of the translation drive 521, and the bottom of the bracket is fixedly connected to the pressing seat 511.

[0100] Several side plates 523 are rotatably connected to both ends of the pressing roller 512;

[0101] Several guide rods 524 are fixed at both ends to the connecting frame 522, and they slide in cooperation with several side plates 523.

[0102] The translation drive 521 is a pneumatic cylinder. The drive device 52 first drives the connecting frame 522 to move vertically downward. The connecting frame 522 drives the pressing seat 511, side plate 523 and pressing roller 512 to move downward synchronously. During this process, the guide rod 524 guides and limits the side plate 523, ensuring that the pressing roller 512 always approaches and presses onto the film surface smoothly and without shaking in the vertical direction. This provides a stable and controllable downward pressure and a precise vertical movement trajectory for the rolling process.

[0103] Translation device 53 includes:

[0104] Rotary drive component 531, which is fixedly connected to connecting bracket 522;

[0105] The bidirectional lead screw 532 is rotatably connected to the connecting frame 522, and its two ends with opposite threads are respectively threaded to the two side plates 523.

[0106] The rotary drive component 531 includes an electric motor, which is electrically connected to an external power source and controlled by an external PLC programming program. When the translation device 53 is in operation, the rotary drive component 531 drives the bidirectional lead screw 532 to rotate. Using the threads at its two ends with opposite directions, it synchronously drives the two pressing rollers 512 connected to the side plate 523 to move towards or away from each other in the horizontal direction. Its function is to precisely adjust the horizontal distance between the two pressing rollers 512 so that it can adapt to films or PCB areas of different sizes, and to achieve symmetrical and synchronous pressing from the center to both sides during the rolling process, thereby ensuring that the film is evenly stretched and bonded, and preventing film displacement or wrinkling caused by unilateral force.

[0107] The flip component 54 includes:

[0108] Rack 541, which is fixedly connected to connecting bracket 522;

[0109] Two gears 542 are fixedly connected to two pressing rollers 512 via rotating shafts, and both of them mesh with rack 541.

[0110] When the flipping assembly 54 is working, the two pressing rollers 512 will drive the two gears 542 to move in opposite directions during the unfolding process. The gears 542 drive the two pressing rollers 512 to rotate by meshing with the rack 541. The rack 541, which moves down with the connecting frame 522, meshes with the two gears 542 fixed on the rotating shaft of the pressing rollers 512, thereby converting the vertical motion of the pressing assembly 51 as a whole into the rotational motion of the pressing rollers 512 around their own axes.

[0111] The foregoing has only described certain exemplary embodiments of the present invention by way of illustration. Undoubtedly, those skilled in the art can modify the described embodiments in various ways without departing from the spirit and scope of the present invention. Therefore, the foregoing drawings and descriptions are illustrative in nature and should not be construed as limiting the scope of protection of the claims of the present invention.

Claims

1. An insulating film for LED modules, characterized in that, include: A high thermal conductivity insulating film (1) has a plurality of grooves (11) on its lower surface. The plurality of grooves (11) can accommodate components on the LED module, and their layout is adapted to the distribution of components on the LED module. The high thermal conductivity insulating film (1) is configured as an integral piece, which includes an insulating encapsulation layer (12), a high thermal conductivity core layer (13) and a peelable interface layer (14) from top to bottom. The high thermal conductivity core layer (13) is made of a high thermal conductivity flexible composite material, and several grooves (11) penetrate the high thermal conductivity core layer (13).

2. A device for bonding an insulating film, used for bonding the high thermal conductivity insulating film of claim 1, characterized in that, include: Rack (2); Conveying mechanism (3), which is used to convey LED modules; A bonding mechanism (4) is used to bond a high thermal conductivity insulating film (1) onto an LED module; The roller pressing mechanism (5) includes a pressing assembly (51), a driving device (52), a translation device (53), and a flipping assembly (54). Pressing mechanism (6) is used to press and fix the high thermal conductivity insulating film (1) onto the LED module; The pressing assembly (51) includes a pressing seat (511) and pressing rollers (512) disposed on both sides of the pressing seat (511). The side walls on both sides of the pressing seat (511) are provided with arc-shaped openings (513) for accommodating the pressing rollers (512). The contour of the bottom of the pressing rollers (512) is adapted to the contour of the bottom wall of the arc-shaped openings (513). The driving device (52) is used to drive the pressing assembly (51) to move toward the LED module with the high thermal conductivity insulating film (1) attached. The translation device (53) is used to drive the pressing rollers (512) on both sides of the pressing seat (511) to move towards each other or away from each other in the horizontal direction. The flipping assembly (54) is used to drive the pressing rollers (512) to rotate. The conveying mechanism (3), bonding mechanism (4), rolling mechanism (5) and pressing mechanism (6) are arranged sequentially along the conveying direction of the LED module.

3. The bonding device for an insulating film according to claim 2, characterized in that, The bottom wall of the pressing seat (511) and the lowest point of the bottom of the pressing roller (512) are on the same horizontal plane.

4. The bonding device for an insulating film according to claim 3, characterized in that, The drive device (52) includes: Translation drive (521), which is fixedly connected to the frame (2); The top of the connecting frame (522) is fixedly connected to the output end of the translation drive (521), and the bottom of the frame is fixedly connected to the pressing seat (511). Several side plates (523) are rotatably connected to both ends of the pressing roller (512); Several guide rods (524) are fixed at both ends to the connecting frame (522) and slide in cooperation with several side plates (523).

5. The bonding device for an insulating film according to claim 4, characterized in that, The translation device (53) includes: A rotary drive (531) is fixedly connected to a connecting frame (522); A two-way lead screw (532) is rotatably connected to a connecting frame (522), and its two ends are threadedly connected to two side plates (523) with opposite directions of rotation.

6. The bonding device for an insulating film according to claim 5, characterized in that, The flipping component (54) includes: A rack (541) is fixedly connected to a connecting bracket (522); Two gears (542) are fixedly connected to two pressing rollers (512) via rotating shafts, and both of them mesh with a rack (541).

7. The bonding device for an insulating film according to claim 2, characterized in that, The conveying mechanism (3) includes: The conveyor mounting frame (31) is fixedly mounted on the frame (2); The drive source (32) is fixedly connected to the conveyor mounting frame (31); The lead screw (33) is rotatably connected to the conveyor mounting frame (31) and is fixedly connected to the output end of the drive source (32); The connecting seat (34) is slidably connected to the conveyor mounting frame (31) and threadedly connected to the lead screw (33); The positioning frame (35) is fixedly connected to the connecting seat (34).

8. A method for preparing an insulating film, used to prepare the high thermal conductivity insulating film of claim 1, characterized in that, Includes the following steps: S1. 3D Scanning and Modeling: A non-contact 3D scanning device is used to scan the PCB driving surface of the target LED display module to obtain 3D point cloud data including the height, outline and position distribution of each component, and a 3D digital model consistent with the physical object is established based on the data. S2. Mold Design and Fabrication: Based on the three-dimensional digital model, a negative mold conforming to the layout of components on the PCB drive surface is generated by computer-aided design, and a solid mold is fabricated by CNC machining or 3D printing. S3. Integrated molding of thin film substrate: Using the solid mold, a three-dimensional thin film substrate is prepared by injection molding or hot pressing process, so that a number of grooves (11) corresponding to the shape and layout of the components are formed on its lower surface. The injection molding process includes injecting liquid thermally conductive and insulating composite material into the mold cavity in a layer-by-layer sequence, and then curing it layer by layer to form a multi-layer composite structure; the hot pressing process includes heating and softening a pre-made multi-layer flat high thermal conductivity film, placing it in a mold for hot pressing deformation, and then demolding it after cooling and shaping. S4. Formation of peelable interface layer (14): A non-silicone pressure-sensitive adhesive is coated or attached to the conformal surface of the three-dimensional thin film substrate to form a peelable interface layer (14), which is then cured or aged to obtain the high thermal conductivity insulating film (1).

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