A coreless current sensor adaptable to different busbars

Abstract

The application relates to the technical field of power modules, and discloses a coreless current sensor capable of adapting to different busbars, which comprises a coreless current sensor module, further comprises the busbar, the coreless current sensor module is fixedly installed at the middle part of the busbar, the coreless current sensor module is integrally injection molded, the coreless current sensor module comprises a plastic supporting box, a mounting groove is formed in the top of the plastic supporting box, a coreless current sensor is connected in the mounting groove, and a plastic supporting box positioning hole one is formed in the top of the plastic supporting box.1. The process steps are simple, and the production capacity is improved by 20% compared with traditional process steps;2. An integrated scheme is adopted, accurate positioning of the chip is realized, and the assembly tolerance of the client end is reduced;3. The integrated scheme can realize performance consistency, thereby reducing the additional calibration of the client end;4. The pin height is adjustable, and the coreless current sensor can adapt to various structural configurations of the client.

Description

Technical Field

[0001] This invention relates to the field of power module technology, specifically to a coreless current sensor that can be adapted to different busbars. Background Technology

[0002] Power modules are industrial products composed of power semiconductor devices such as IGBTs and MOSFETs, combined and packaged according to specific circuit functions. Their core function is to convert and control electrical energy. They are widely used in key equipment such as electric drive systems for new energy vehicles, photovoltaic inverters, wind power converters, 5G base station power supplies, industrial frequency converters, and UPS systems.

[0003] Among them, intelligent power modules integrate drive and protection circuits, resulting in a more compact structure. With technological advancements, third-generation semiconductor power modules, such as silicon carbide, are becoming an important development direction due to their advantages such as high efficiency and high temperature resistance.

[0004] Existing current sensors suffer from technical drawbacks such as large detection errors, weak vibration and high voltage resistance, low structural strength, low production efficiency, poor product consistency, and insufficient adaptability. Summary of the Invention

[0005] This invention provides a coreless current sensor that can be adapted to different busbars, solving the problems mentioned in the background art.

[0006] This invention provides the following technical solution: a coreless current sensor adaptable to different busbars, comprising a coreless current sensor module and the busbar. The coreless current sensor module is fixedly installed in the middle of the busbar. The coreless current sensor module is integrally injection molded. The coreless current sensor module includes a plastic support box. The top of the plastic support box has a mounting groove. The coreless current sensor is connected inside the mounting groove. The top of the plastic support box has a positioning hole located on both the front and rear sides of the plastic support box. The coreless current sensor frame contains a plastic shell. The front end of the plastic shell has a connecting growth pin with a fisheye structure. The middle of the busbar has an installation port. The plastic shell is connected to the busbar through the installation port. The diameter of the installation port is adapted to the cross-section of the plastic shell. The inside of the plastic shell contains a chip box. The chip box encapsulates a chip. A connecting piece extends from the front end of the chip box, and the other end of the connecting piece is connected to a pin.

[0007] Preferably, the plastic support box is completely fitted onto the outside of the busbar, and the bottom of the plastic support box has a second positioning hole and a third positioning hole. There are two sets of the second positioning holes, which are located on both sides of the third positioning hole, and the second positioning holes correspond to the first positioning hole.

[0008] Preferably, the plastic casing is an integral injection molded insulating material, the chip box is installed inside the plastic casing, and the front end of the pins penetrates the plastic casing and extends to its outer side.

[0009] Selectedly, the front end of the chip box is provided with four sets of connecting pieces, the four sets of connecting pieces correspond to four sets of pins, and the pins on both sides are provided with mounting holes for connecting growth pins.

[0010] Selectedly, the chip box completely covers the chip, connector, and pins to form a high-voltage isolation and protection structure; the pin height is adjustable.

[0011] Preferably, the outer side of the plastic casing has an adjustment opening.

[0012] Preferably, the plastic casing is an integrated rigid structure that covers the outside of the chip soldering area, providing rigid support for the sensor pins and improving their resistance to bending and vibration.

[0013] A fabrication process for a coreless current sensor adaptable to different busbars includes the following steps: S1. Frame pretreatment: The frame is reinforced by leveling and deoxidation treatment to ensure the flatness and cleanliness of the welding surface; S2. Chip welding: The chip is directly welded and fixed to the pre-treated reinforced frame at the preset welding points to complete the rigid connection between the chip and the frame. S3. Component assembly: The reinforced frame with the welded chips is precisely aligned and assembled with the busbar to fix the relative position. S4, Integrated Injection Molding: The assembled components are placed into an injection mold, and the injection molding process is used to form the injection-molded package body, realizing the integrated packaging of busbar, frame and chip. S5. Shaping and Adjusting: Based on the customer's assembly structure requirements, fine-tune the pin height of the reinforcing frame to complete the shaping of the finished product and obtain an integrated coreless current sensor.

[0014] In particular, after the integrated injection molding, the chip is completely covered by the injection-molded package body, achieving full insulation and high-voltage isolation protection, while locking the relative positions of the chip, frame, and busbar to eliminate assembly offset errors.

[0015] In step 5, the pin height can be adjusted as needed to accommodate various structural configurations such as circuit box mounting and flexible snap-fit ​​mounting for different customers.

[0016] The present invention has the following beneficial effects: 1. The process is simple, and the production capacity is 20% more efficient than traditional processes; 2. The integrated solution enables accurate chip positioning and reduces assembly tolerances at the client end; 3. An integrated solution can achieve performance consistency, thereby reducing the need for additional calibration on the client side; 4. The pin height is adjustable, which can be adapted to various customer structural configurations. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the connection busbar structure of the coreless current sensor of the present invention; Figure 2 For the present invention Figure 1 A schematic diagram of the test structure in the diagram; Figure 3 For the present invention Figure 1 A top-view structural diagram; Figure 4 This is a schematic diagram of the sensor structure of the present invention; Figure 5 This is a side view of the sensor structure of the present invention; Figure 6 This is a schematic diagram of the internal structure of the sensor of the present invention.

[0018] In the diagram: 1. Coreless current sensor module; 2. Busbar; 3. Plastic support box; 4. Mounting slot; 5. Coreless current sensor; 6. Connecting growth pin; 7. Positioning hole one of plastic support box; 8. Positioning hole two of plastic support box; 9. Positioning hole three of plastic support box; 10. Plastic casing; 11. Mounting port; 12. Chip box; 13. Connecting piece; 14. Pin. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Please see Figure 1-6A coreless current sensor adaptable to different busbars includes a coreless current sensor module 1 and a busbar 2. The coreless current sensor module 1 is fixedly installed in the middle of the busbar 2. The coreless current sensor module 1 is integrally injection molded. The coreless current sensor module 1 includes a plastic support box 3. The top of the plastic support box 3 has a mounting groove 4, and the coreless current sensor 5 is connected inside the mounting groove 4. The top of the plastic support box 3 has a plastic support box positioning hole 7, which is located at the front of the plastic support box 3. On both sides, the plastic support box 3 is completely fitted onto the outside of the busbar 2. The bottom of the plastic support box 3 has two sets of positioning holes: one for the plastic support box and another for the plastic support box. The two sets of positioning holes are located on either side of the third positioning hole, and the two positioning holes correspond to the first positioning hole. The coreless current sensor frame 5 contains a plastic casing 10. The outer surface of the plastic casing 10 has an adjustment opening. The front end of the casing 10 is provided with a connecting growth pin 6, which has a fisheye structure. A mounting port 11 is provided in the middle of the busbar 2. The plastic casing 10 is connected to the busbar 2 through the mounting port 11. The diameter of the mounting port 11 is adapted to the cross-section of the plastic casing 10. The interior of the plastic casing 10 contains a chip box 12, which encapsulates a chip. A connecting piece 13 extends from the front end of the chip box 12, and the other end of the connecting piece 13 is connected to a pin 14. The plastic casing 10 is an integrally injection-molded insulating material. The chip box 12 is mounted on the plastic casing 10. The chip housing 12 has four sets of connecting tabs 13 at its front end, corresponding to four sets of pins 14. The pins 14 on both sides are provided with mounting holes for connecting growth pins. The chip housing 12 completely covers the chip, connecting tabs 13 and pins 14, forming a high-voltage isolation and protection structure. The pin height of the pins 14 is adjustable. The plastic housing 10 is an integrated rigid structure that covers the outside of the chip soldering area, providing rigid support for the sensor pins and improving the pins' resistance to bending and vibration.

[0021] A fabrication process for a coreless current sensor adaptable to different busbars includes the following steps: S1. Frame pretreatment: The frame is reinforced by leveling and deoxidation treatment to ensure the flatness and cleanliness of the welding surface; S2. Chip welding: The chip is directly welded and fixed to the pre-treated reinforced frame at the preset welding points to complete the rigid connection between the chip and the frame. S3. Component assembly: The reinforced frame with the welded chips is precisely aligned and assembled with the busbar to fix the relative position. S4, Integrated Injection Molding: The assembled components are placed into an injection mold, and the injection molding process is used to form the injection-molded package body, realizing the integrated packaging of busbar, frame and chip. After one-piece injection molding, the chip is completely covered by the injection-molded package body, achieving full insulation and high-voltage isolation protection, while locking the relative positions of the chip, frame, and busbar to eliminate assembly offset errors. S5. Shaping and Adjusting: Based on the customer's assembly structure requirements, fine-tune the pin height of the reinforcing frame to complete the shaping of the finished product and obtain an integrated coreless current sensor. The pin height can be adjusted as needed to accommodate various structural configurations such as circuit box mounting and flexible snap-fit ​​mounting for different customers.

[0022] It integrates a coreless current sensor, directly solving the problem of busbar current detection and reassembly, eliminating measurement errors caused by installation deviations, and solving the problem of vibration affecting detection.

[0023] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A coreless current sensor adaptable to different busbars, comprising a coreless current sensor module (1), characterized in that: It also includes the busbar (2), the coreless current sensor module (1) is fixedly installed in the middle of the busbar (2), the coreless current sensor module (1) is integrally injection molded, the coreless current sensor module (1) includes a plastic support box (3), the top of the plastic support box (3) is provided with a mounting groove (4), the coreless current sensor (5) is connected inside the mounting groove (4), the top of the plastic support box (3) is provided with a plastic support box positioning hole (7), the plastic support box positioning hole (7) is located on the front and rear sides of the plastic support box (3), and the coreless current sensor frame (5) is internally packaged. The device includes a plastic casing (10), with a connecting growth pin (6) at the front end of the plastic casing (10). The connecting growth pin (6) has a fisheye structure. The busbar (2) has an installation port (11) in the middle. The plastic casing (10) is connected to the busbar (2) through the installation port (11). The diameter of the installation port (11) is adapted to the cross-section of the plastic casing (10). The inside of the plastic casing (10) contains a chip box (12). The chip box (12) contains a chip. The front end of the chip box (12) extends with a connecting piece (13). The other end of the connecting piece (13) is connected to a pin (14).

2. A coreless current sensor adaptable to different busbars according to claim 1, characterized in that: The plastic support box (3) is completely fitted onto the outside of the busbar (2), and the bottom of the plastic support box (3) is provided with a second plastic support box positioning hole (8). The bottom of the plastic support box (3) is also provided with a third plastic support box positioning hole (9). There are two sets of the second plastic support box positioning holes (8). The two sets of the second plastic support box positioning holes (8) are located on both sides of the third plastic support box positioning hole (9), and the second plastic support box positioning holes (8) correspond to the first plastic support box positioning hole (7).

3. A coreless current sensor adaptable to different busbars according to claim 1, characterized in that: The plastic casing (10) is an integral injection molded insulating material. The chip box (12) is installed inside the plastic casing (10), and the front end of the pin (14) penetrates the plastic casing (10) and extends to its outer side.

4. A coreless current sensor adaptable to different busbars according to claim 1, characterized in that: The chip box (12) has four sets of connecting pieces (13) at the front end, and the four sets of connecting pieces (13) correspond to four sets of pins (14), and the pins (14) on both sides are provided with mounting holes for connecting growth pins.

5. A coreless current sensor adaptable to different busbars according to claim 1, characterized in that: The chip box (12) completely covers the chip, the connector (13) and the pins (14) to form a high-voltage isolation protection structure; the pin height of the pins (14) is adjustable.

6. A coreless current sensor adaptable to different busbars according to claim 1, characterized in that: The outer side of the plastic casing (10) has an adjustment opening.

7. A coreless current sensor adaptable to different busbars according to claim 1, characterized in that: The plastic casing (10) is an integrated rigid structure that covers the outside of the chip welding area, providing rigid support for the sensor pins and improving their resistance to bending and vibration.

8. A fabrication process for a coreless current sensor adaptable to different busbars, characterized in that, Includes the following steps: S1. Frame pretreatment: The frame is reinforced by leveling and deoxidation treatment to ensure the flatness and cleanliness of the welding surface; S2. Chip welding: The chip is directly welded and fixed to the pre-treated reinforced frame at the preset welding points to complete the rigid connection between the chip and the frame. S3. Component assembly: The reinforced frame with the welded chips is precisely aligned and assembled with the busbar to fix the relative position. S4, Integrated Injection Molding: The assembled components are placed into an injection mold, and the injection molding process is used to form the injection-molded package body, realizing the integrated packaging of busbar, frame and chip. S5. Shaping and Adjusting: Based on the customer's assembly structure requirements, fine-tune the pin height of the reinforcing frame to complete the shaping of the finished product and obtain an integrated coreless current sensor.

9. A coreless current sensor adaptable to different busbars according to claim 8, characterized in that: After being injection molded in one piece, the chip is completely encapsulated by the injection-molded package body, achieving full insulation and high-voltage isolation protection. At the same time, it locks the relative positions of the chip, frame, and busbar, eliminating assembly offset errors.

10. A coreless current sensor adaptable to different busbars according to claim 1, characterized in that: In step 5, the pin height can be adjusted as needed to adapt to various structural configurations such as circuit box installation and flexible snap-fit ​​installation for different customers.

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