Display module and display device

Abstract

This disclosure provides a display module and display device, relating to the field of display technology, which can realize a borderless design on all four sides of the display device. The display module includes a display panel, a backlight assembly, a first polarizer, a main control circuit board, and a light sensing assembly. The display panel includes a stacked array substrate and a color filter substrate; the backlight assembly is disposed on the side of the array substrate away from the color filter substrate; the first polarizer is disposed on the side of the color filter substrate away from the array substrate; on the first side of the display panel, the edge portion of the array substrate and the edge portion of the first polarizer both extend beyond the boundary of the color filter substrate, and a first space is formed between the edge portion of the array substrate and the edge portion of the first polarizer; the first side is the side where one boundary of the display panel is located; the main control circuit board is connected to the first side of the display panel; the light sensing assembly includes a first circuit board and a light sensor disposed on the first circuit board; the light sensor is fixed in the first space, and one end of the first circuit board is connected to the main control circuit board.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and in particular to a display module and display device. Background Technology

[0002] Liquid crystal display (LCD) devices are electronic products that use an electric field to control the arrangement of liquid crystal molecules to adjust light and thus display images. LCD devices have significant advantages such as low power consumption, small size, and light weight, and are currently the mainstream screen technology in mobile phones, computers, and various instruments. Summary of the Invention

[0003] The technical problem solved by this disclosure is: how to integrate a light sensor into a display module and achieve a borderless design on all four sides of the display device.

[0004] On one hand, a display module is provided, including a display panel, a backlight assembly, a first polarizer, a main control circuit board, and a light sensing assembly. The display panel includes an array substrate and a color filter substrate stacked together. The backlight assembly is disposed on the side of the array substrate away from the color filter substrate. The first polarizer is disposed on the side of the color filter substrate away from the array substrate. On a first side of the display panel, the edge portions of the array substrate and the edge portions of the first polarizer both extend beyond the boundary of the color filter substrate, and a first space is formed between the edge portions of the array substrate and the edge portions of the first polarizer. The first side is the side where one boundary of the display panel is located. The main control circuit board is connected to the first side of the display panel. The light sensing assembly includes a first circuit board and a light sensor disposed on the first circuit board. The light sensor is fixed in the first space, and one end of the first circuit board is connected to the main control circuit board.

[0005] A light sensor is mounted on a first circuit board to form an integrated light-sensing component. This component can be integrated into the display module. Only the portion of the first polarizer corresponding to the first side of the display panel needs to be over-attached, so that the sidewall of the first polarizer protrudes from the sidewall of the color filter substrate on the first side of the display panel. The light sensor is fixed in the first space formed between the edge portion of the array substrate extending beyond the boundary of the color filter substrate and the edge portion of the first polarizer extending beyond the boundary of the color filter substrate. Light from the external environment can pass through the first polarizer and strike the light sensor. Simultaneously, one end of the first circuit board can be connected to the main control circuit board. The ambient light sensing data detected by the light sensor can be directly transmitted to the main control circuit board through the first circuit board. The main control circuit board can send corresponding control signals to the driver chip based on the received brightness data, allowing the display module to adaptively adjust the brightness of the display panel according to the brightness of the ambient light. This configuration eliminates the need for the light sensor to occupy space on the first side (ground side) of the display module, resulting in a smaller size on the first side (ground side) of the display module and enabling a borderless design on all four sides of the display device.

[0006] In some embodiments, the main control circuit board is disposed on the non-display side of the display panel; the first circuit board is a flexible circuit board, the light sensor is disposed at the first end of the first circuit board, and the second end of the first circuit board is bent to the non-display side of the display panel and connected to the main control circuit board.

[0007] In some embodiments, on the first side of the display panel, the edge portion of the first polarizer extends beyond the boundary of the array substrate; the orthographic projection of the photosensitive component onto the first polarizer is located within the boundary range of the first polarizer.

[0008] In some embodiments, the display module further includes a light-shielding portion that fills the first space and is disposed at least around the side of the light sensor.

[0009] In some embodiments, the light-shielding portion is adhesive and is bonded to the first polarizer.

[0010] In some embodiments, the display module further includes a transparent adhesive layer bonded between the photosensor and the first polarizer.

[0011] In some embodiments, one end of the first circuit board in which the optical sensor is disposed is bonded to the array substrate.

[0012] In some embodiments, the display module further includes a plurality of flip-chip films and a plurality of second circuit boards. The plurality of flip-chip films are arranged along a first direction and are respectively connected to the edge portion of the array substrate located on the first side of the display panel. The first direction is the extension direction of the boundary of the first side of the display panel. Each second circuit board is connected to at least two flip-chip films and to the main control circuit board. The first circuit board is connected to the main control circuit board through the second circuit boards.

[0013] In some embodiments, at least one second circuit board includes a first connection portion and a first signal line; the first circuit board is connected to the first connection portion; one end of the first signal line is connected to the first connection portion, and the other end of the first signal line is connected to the main control circuit board; the first signal line is used to transmit the sensing signal output by the photosensitive component.

[0014] In some embodiments, the display module further includes a third circuit board for setting a timing control chip; the third circuit board is connected between a plurality of second circuit boards and a main control circuit board; the third circuit board includes a second signal line, one end of the second signal line is connected to a first signal line, and the other end of the second signal line is connected to the main control circuit board.

[0015] In some embodiments, the display module further includes at least one connector, and at least one second circuit board is connected to a third circuit board via a connector; the connector includes a third signal line, one end of which is connected to a first signal line, and the other end of which is connected to a second signal line.

[0016] In some embodiments, the light-sensing component is disposed between two adjacent flip-chip films along a first direction.

[0017] In some embodiments, the display module includes a plurality of light-sensing components, which are arranged symmetrically with respect to a first center line; wherein the first center line is the center line of the display panel extending along a second direction, and the second direction is perpendicular to the first direction.

[0018] In some embodiments, the plurality of flip-chip films include a first flip-chip film, a second flip-chip film, a third flip-chip film, and a fourth flip-chip film arranged sequentially along a first direction; the plurality of second circuit boards include a first sub-circuit board and a second sub-circuit board; the first and second flip-chip films are connected to the first sub-circuit board, and the third and fourth flip-chip films are connected to the second sub-circuit board; the display module includes a plurality of photosensitive components, the plurality of photosensitive components including a first photosensitive component and a second photosensitive component; the first photosensitive component is disposed between the first and second flip-chip films, and the first circuit board of the first photosensitive component is connected to the first sub-circuit board; the second photosensitive component is disposed between the third and fourth flip-chip films, and the first circuit board of the second photosensitive component is connected to the second sub-circuit board.

[0019] In some embodiments, the first and second flip-chip films are located on the first side of the first centerline of the display panel, and the third and fourth flip-chip films are located on the second side of the first centerline; the first centerline is the centerline of the display panel extending along a second direction, which is perpendicular to the first direction; the first side and the second side of the first centerline are the two sides of the first centerline along the first direction; the second flip-chip film is closer to the first centerline than other flip-chip films located on the first side of the first centerline; the third flip-chip film is closer to the first centerline than other flip-chip films located on the second side of the first centerline.

[0020] In some embodiments, the display module includes a plurality of light-sensing components, the plurality of light-sensing components including a first light-sensing component and a second light-sensing component; the first light-sensing component and the second light-sensing component are respectively disposed on both sides of the plurality of flip-chip films along a first direction.

[0021] In some embodiments, the plurality of second circuit boards include a plurality of third sub-circuit boards and a plurality of fourth sub-circuit boards. The plurality of third sub-circuit boards are located between the first photosensitive component and the first center line, and are connected in sequence. The first photosensitive component is connected to the main control circuit board through the plurality of third sub-circuit boards. The plurality of fourth sub-circuit boards are located between the second photosensitive component and the first center line, and are connected in sequence. The second photosensitive component is connected to the main control circuit board through the plurality of fourth sub-circuit boards. The first center line is the center line of the display panel extending along a second direction, which is perpendicular to the first direction.

[0022] In some embodiments, the distance between the orthographic projection of the sidewall of the array substrate located on the first side of the display panel onto the first polarizer and the orthographic projection of the sidewall of the color filter substrate located on the first side of the display panel onto the first polarizer is in the range of 1 to 5 mm; and / or, on the first side of the display panel, the edge portion of the first polarizer extends beyond the boundary of the array substrate; the distance between the orthographic projection of the sidewall of the array substrate located on the first side of the display panel onto the first polarizer and the sidewall of the first polarizer located on the first side of the display panel is less than or equal to 5 mm.

[0023] In some embodiments, at boundaries of the display panel other than the first side, the edge portions of the array substrate and the edge portions of the first polarizer both extend beyond the boundary of the color filter substrate.

[0024] On the other hand, a display device is provided, including a display module as described in some of the embodiments above. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0026] Figure 1 This is a top view of a display device according to some embodiments; Figure 2 for Figure 1 Cross-sectional view along section line AA; Figure 3 This is a partial cross-sectional view of a display panel according to some embodiments; Figure 4 This is a partial top view of an array substrate according to some embodiments; Figure 5This is a partial cross-sectional view of a display module according to some embodiments; Figure 6 This is a partial cross-sectional view of another display module according to some embodiments; Figure 7 This is a partial cross-sectional view of another display module according to some embodiments; Figure 8 This is a structural diagram of an optical sensor according to some embodiments; Figure 9 This is a partial top view of a display module according to some embodiments; Figure 10 This is a partial cross-sectional view of another display module according to some embodiments; Figure 11 This is a partial top view of another display module according to some embodiments; Figure 12 This is a partial top view of another display module according to some embodiments. Detailed Implementation

[0027] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0028] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0029] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0030] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact with each other. Similarly, the term "coupled" may be used in describing some embodiments to indicate that two or more components have direct physical or electrical contact. However, the terms "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0031] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0032] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable deviation range, which is determined by those skilled in the art taking into account the measurement under discussion and the errors associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable deviation range for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable deviation range for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable deviation range for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0033] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0034] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0035] like Figure 1 As shown, the display device 1000 can be used to display images. The display device 1000 can be any device that displays either moving (e.g., video) or fixed (e.g., still images), and whether it is text or images. The display device 1000 includes, but is not limited to, televisions, mobile phones, wearable devices, personal digital assistants (PDAs), augmented reality (AR) devices, virtual reality (VR) devices, handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, clocks, calculators, television monitors, flat panel displays, computer monitors, in-vehicle displays (e.g., odometer displays), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc. Some embodiments of this disclosure are illustrated using a television as an example of the display device 1000.

[0036] For example, such as Figure 1 , Figure 2 As shown, where, Figure 2 for Figure 1 A cross-sectional view along section line AA. The display device 1000 may include one or more display modules 100; when the display device 1000 includes multiple display modules 100, it can form a splicing display device 1000 for large-screen display or ultra-large-screen display. The display device 1000 may also include, for example, an outer frame 200 surrounding one or more display modules 100.

[0037] For example, such as Figure 2 As shown, the display module 100 may include, for example, a display panel 10, which is a key component of the display device 1000 and can be used to display images.

[0038] With the development of display technology, the types of display panels 10 are increasing. For example, display panels 10 can be organic light-emitting diode (OLED) display panels, micro organic light-emitting diode (Micro OLED) display panels, quantum dot light-emitting diode (QLED) display panels, mini light-emitting diode (Mini LED) display panels, micro light-emitting diode (Micro LED) display panels, or liquid crystal display (LCD) display panels, etc. This disclosure does not limit the types of displays. Some embodiments of this disclosure are illustrated using liquid crystal display panels as examples.

[0039] For example, such as Figure 3 As shown, the display panel 10 (liquid crystal display panel) may include, for example, an array substrate 11, a liquid crystal layer 12 and a color filter substrate 13 stacked sequentially from bottom to top.

[0040] like Figure 4 As shown, the array substrate 11 may include a display area AA and a peripheral area BB located on at least one side of the display area AA. For example, the peripheral area BB may be located above, below, to the left and to the right of the display area AA, and the peripheral area BB may be arranged around the display area AA.

[0041] For example, such as Figure 4 As shown, the display area AA of the array substrate 11 can be provided with multiple signal lines. These multiple signal lines may include, for example, multiple data signal lines Dt, multiple gate signal lines GI, etc. The gate signal lines GI may extend along a first direction X, and the data signal lines Dt may extend along a second direction Y. The first direction X and the second direction Y may intersect.

[0042] like Figure 4 As shown, multiple data signal lines Dt and multiple gate signal lines GI, arranged in a cross configuration, can define multiple sub-pixel regions C. Each sub-pixel region C can be used to set one sub-pixel P. The sub-pixel P is the smallest unit for displaying images on the display panel 10, and each sub-pixel P can display a single color, such as red, green, or blue.

[0043] For example, such as Figure 4As shown, a sub-pixel P may include a pixel driving circuit D, which may be disposed in the array substrate 11, for example; a pixel driving circuit D may be disposed in a sub-pixel region C of the array substrate 11, and the pixel driving circuit D may be connected to the data signal line Dt and the gate signal line GI.

[0044] The pixel driving circuit D may include multiple transistors and at least one (e.g., one; or multiple) capacitor. For example, the pixel driving circuit D may be a structure such as "2T1C", "6T1C", "7T1C", "6T2C", or "7T2C". Here, "T" represents a transistor, such as a thin-film transistor. The number preceding "T" indicates the number of transistors. "C" represents a capacitor, and the number preceding "C" indicates the number of capacitors.

[0045] For example, refer to Figure 4 The peripheral area BB of the array substrate 11 can be provided with multiple signal lines, such as multiple drive signal lines, to ensure the normal display of the display panel 10.

[0046] For example, the pixel driving circuit D can be configured to provide an electrical signal to the pixel electrode coupled to the pixel driving circuit D in response to the gate signal transmitted by the gate signal line GI and the data signal transmitted by the data signal line Dt, so that an electric field is formed in the sub-pixel P where the pixel electrode is located, driving the liquid crystal molecules of the liquid crystal layer 12 to deflect, causing the sub-pixel P to emit light, thereby enabling the display panel 10 to display an image.

[0047] The color filter substrate 13 can also be called an opposing substrate or a packaged substrate. The color filter substrate 13 may include multiple light-filtering sections and multiple black matrices. The light-filtering sections can filter the light incident on the color filter substrate 13 so that each sub-pixel P can emit light of a specific color (such as red, green, or blue). Different sub-pixels P can emit light of different colors, thereby enabling the display panel 10 to achieve color display. The black matrices can be used to cover at least a portion of the pixel driving circuit D and signal lines on the array substrate 11, improving the contrast of the display panel 10.

[0048] The structure of the display panel 10 is not limited to this. The display panel 10 may also include other structures, as long as the same technical concept is adopted. For example, the display panel 10 may also include a first alignment film disposed on the side of the array substrate 11 near the liquid crystal layer 12, and a second alignment film disposed on the side of the color filter substrate 13 near the liquid crystal layer 12, etc.

[0049] For example, such as Figure 2As shown, the display module 100 may also include a polarizer 20, such as a first polarizer 21 and a second polarizer 22. The first polarizer 21 may be disposed on the upper surface of the display panel 10; the second polarizer 22 may be disposed on the lower surface of the display panel 10 to improve the display effect of the display panel 10 and reduce reflection.

[0050] For example, such as Figure 2 As shown, the display module 100 may also include a backlight assembly 30, which may be disposed on one side of the display panel 10 along its own thickness direction; for example, the backlight assembly 30 may be disposed on the non-display side of the display panel 10.

[0051] like Figure 2 As shown, the backlight assembly 30 may include a backplate 31, a light source 32, and a light guide plate 33. The backplate 31 may, for example, be used to provide a base support for the light source 32 and the light guide plate 33.

[0052] like Figure 2 As shown, a portion of the back plate 31 may be disposed opposite to the display panel 10 along the thickness direction of the display panel 10 and have a gap between them; for example, the back plate 31 may include a first portion 31-1 and a second portion 31-2. The first portion 31-1 of the back plate 31 may be disposed opposite to the display panel 10 and have a gap between them; the second portion 31-2 of the back plate 31 may extend along the thickness direction of the display panel 10; that is, the first portion 31-1 and the second portion 31-2 of the back plate 31 may intersect.

[0053] like Figure 2 As shown, the light guide plate 33 can be disposed, for example, on the surface of the first portion 31-1 of the back plate 31 near the display panel 10; the light source 32 can be disposed, for example, on the surface of the second portion 31-2 of the back plate 31 near the light guide plate 33. The light source 32 can be used to provide light to the display panel 10, ensuring the normal display of the display panel 10. The light guide plate 33 can be used to convert the point light source emitted by the light source 32 into a uniform surface light source, ensuring the uniformity of the brightness of the display panel 10.

[0054] For example, such as Figure 2 As shown, the display module 100 may also include a light-shielding adhesive 40, a portion of which may be filled between the edges of the display panel 10 and the backlight assembly 30, and another portion of which may surround the surface of the second part 31-2 of the back plate 31 away from the light guide plate 33. While the light-shielding adhesive 40 adheres and fixes the edges of the display panel 10 and the backlight assembly 30, it can also cover the light source 32 to prevent bright edges or halos from appearing around the display panel 10.

[0055] For example, such as Figure 2 As shown, the display module 100 may further include a driver chip 50, which can be connected to the display panel 10. The driver chip 50 can be configured to provide electrical signals to the display panel 10, such as control signals, thereby enabling the display panel 10 to display an image.

[0056] like Figure 1 , Figure 2 , Figure 3 As shown, the driver chip 50 can be specifically connected to the array substrate 11 in the display panel 10. In order to achieve the narrow bezel design of the display device 1000, a chip-on-film (COF) technology can be used to connect the driver chip 50 to the array substrate 11 in the display panel 10, and the driver chip 50 can be bent to the side of the light-shielding adhesive 40 or to the side of the backlight assembly 30 away from the display panel 10.

[0057] COF technology refers to the die-on-film assembly technology that fixes integrated circuits (such as driver chips 50) onto flexible circuit boards.

[0058] For example, such as Figure 2 , Figure 4 As shown, the display module 100 may also include a circuit board assembly 60. In some embodiments, the circuit board assembly 60 may be disposed on the side of the backlight assembly 30 away from the display panel 10, and one end of the flip-chip film 51 may be connected to the circuit board assembly 60. The control signal output by the circuit board assembly 60 may be transmitted to the pixel driving circuit D of the array substrate 11 through the driving chip 50 on the flip-chip film 51.

[0059] For example, such as Figure 2 As shown, the display module 100 may also include a middle frame 70, which may include a base plate portion and a side wall portion, the side wall portion being disposed around the base plate portion and protruding from the base plate portion; that is, the middle frame 70 may form an accommodating space with one side open.

[0060] like Figure 2 As shown, the circuit board assembly 60, the chip-on-chip 51, the light-shielding adhesive 40, the backlight assembly 30, and the display panel 10 can be disposed within the receiving space formed by the middle frame 70. The bottom plate portion of the middle frame 70 can provide support for the circuit board assembly 60, the driver chip 50, the light-shielding adhesive 40, the backlight assembly 30, and the display panel 10; the sidewall portion of the middle frame 70 can prevent displacement of the internal components and can protect the chip-on-chip 51.

[0061] Currently, integrating AI (Artificial Intelligence) functionality into display devices is becoming a development trend in the display industry. For example, ... Figure 1 As shown, a light sensor module 300 can be installed in the display device 1000. The display device 1000 can detect the brightness of the current ambient light through the light sensor module 300. When the ambient light is bright, the display device 1000 can adaptively increase the brightness of the display panel 10; when the ambient light is dark, the display device 1000 can adaptively decrease the brightness of the display panel 10. In this way, the optimal viewing experience of the display device 1000 can be achieved. Since the light sensor module 300 needs to detect the brightness of the ambient light, it needs to be installed on the front of the display device 1000 so that ambient light can be incident on the light sensor module 300.

[0062] For example, such as Figure 1 , Figure 2 As shown, the light sensor module 300 and the flip-chip film 51 of the display module 100 can be disposed on the same side of the display device 1000; for example, both the light sensor module 300 and the flip-chip film 51 can be disposed on the ground side of the display device 1000.

[0063] However, the technology of a four-sided bezel-less display device 1000 is emerging. On the ground side of the display device 1000, not only is it necessary to bond the flip-chip film 51 to the display panel 10, but it is also necessary to set up a light-sensing module 300, etc. These structures restrict the realization of a four-sided bezel-less display device 1000.

[0064] In some embodiments, such as Figure 5 , Figure 6 , Figure 7 , Figure 8 , Figure 9As shown, a display module 100 is provided, including a display panel 10, a backlight assembly 30, a first polarizer 21, a main control circuit board 61, and a light sensing assembly 80. The display panel 10 includes an array substrate 11 and a color filter substrate 13 stacked together. The backlight assembly 30 is disposed on the side of the array substrate 11 away from the color filter substrate 13. The first polarizer 21 is disposed on the side of the color filter substrate 13 away from the array substrate 11. On a first side 1 of the display panel 10, the edge portions of the array substrate 11 and the edge portions of the first polarizer 21 both extend beyond the boundary of the color filter substrate 13, and a first space 2 is formed between the edge portions of the array substrate 11 and the edge portions of the first polarizer 21. The first side 1 is the side where one boundary of the display panel 10 is located. The main control circuit board 61 is connected to the first side 1 of the display panel 10. The light sensing assembly 80 includes a first circuit board 81 and a light sensor 82 disposed on the first circuit board 81. The light sensor 82 is fixed in the first space 2, and one end of the first circuit board 81 is connected to the main control circuit board 61. Optionally, the first circuit board 81 is a flexible circuit board.

[0065] For example, such as Figure 5 , Figure 6 , Figure 7 As shown, the backlight assembly 30 in the display module 100 can be disposed on the side of the array substrate 11 of the display panel 10 away from the color filter substrate 13; that is, the color filter substrate 13 in the display panel 10 is located above the array substrate 11.

[0066] like Figure 5 , Figure 6 , Figure 7 As shown, the display module 100 may further include a first polarizer 21, which may be disposed on the side of the color filter substrate 13 away from the array substrate 11; for example, the first polarizer 21 may be disposed on the surface of the color filter substrate 13 away from the array substrate 11.

[0067] For example, such as Figure 5 , Figure 6 , Figure 7 As shown, on the first side 1 of the display panel 10, that is, on the first side 1 of the display module 100, the edge portion of the array substrate 11 and the edge portion of the first polarizer 21 can both extend beyond the boundary of the color filter substrate 13; that is, on the first side 1 of the display panel 10, the sidewall of the array substrate 11 and the sidewall of the first polarizer 21 can both protrude beyond the sidewall of the color filter substrate 13.

[0068] It should be noted that the first side 1 of the display panel 10 refers to the side where one of the boundaries of the display panel 10 is located. For example, the first side 1 of the display panel 10 can be the lower side (ground side) of the display panel 10.

[0069] In some embodiments, at the boundaries of the display panel 10 other than the first side 1, the edge portions of the array substrate 11 and the edge portions of the first polarizer 21 may both extend beyond the boundary of the color filter substrate 13.

[0070] For example, such as Figure 5 As shown, and refer to Figure 9 The circuit board assembly 60 of the display module 100 may include a main control circuit board 61, which may be connected to the first side 1 of the display panel 10. For example, the main control circuit board 61 may be connected to the array substrate 11 of the display panel 10. Optionally, the main control circuit board 61 may be a SOC (System on Chip) circuit board.

[0071] like Figure 5 , Figure 6 , Figure 7 As shown, on the first side 1 of the display panel 10, there is a gap between the edge portion of the array substrate 11 that extends beyond the boundary of the color filter substrate 13 and the edge portion of the first polarizer 21 that extends beyond the boundary of the color filter substrate 13, which can form a first space 2.

[0072] For example, such as Figure 5 , Figure 6 , Figure 7 As shown, the display module 100 may also include a light sensor 80, which may be disposed on the first side 1 of the display panel 10.

[0073] For example, such as Figure 5 , Figure 6 , Figure 7 As shown, the light sensing component 80 may include a first circuit board 81 and a light sensor 82 disposed on the first circuit board 81. The light sensor 82 may be, for example, a light sensing chip, which can be used to detect the brightness and color temperature of ambient light.

[0074] For example, the light sensor 82 can also integrate more functions. For instance, the light sensor 82 can also be used to detect infrared light.

[0075] For example, such as Figure 5 , Figure 6 , Figure 7 As shown, and refer to Figure 9 The light sensor 82 can be fixed in the first space 2 formed between the edge portion of the array substrate 11 that extends beyond the boundary of the color filter substrate 13 and the edge portion of the first polarizer 21 that extends beyond the boundary of the color filter substrate 13, and one end of the first circuit board 81 can be connected to the main control circuit board 61.

[0076] For example, such as Figure 8 As shown, and refer to Figure 5 , Figure 6 , Figure 7 The light sensor 82 may include, for example, a silicon-based photodiode 821, an analog-to-digital converter (ADC) circuit 822, and an I2C interface 823. The photodiode 821 can change the photocurrent in real time according to the brightness of the ambient light. The photocurrent generated by the photodiode 821 is converted into a digital signal by the ADC circuit 822 inside the light sensor 82. The converted digital signal can then be transmitted through the I2C interface 823 inside the light sensor 82 to the main control circuit board 61 via the first circuit board 81 of the light sensing component 80. Optionally, the main control circuit board 61 can be a SOC circuit board.

[0077] In some embodiments, the first circuit board 81 of the light-sensing component 80 can be a flexible circuit board, and the first circuit board 81 can be bent. Figure 5 , Figure 7 The cross-sectional view shown is a cross-sectional view of the first circuit board 81 of the light-sensing component 80 after bending; Figure 6 The cross-sectional view shown is a cross-sectional view of the first circuit board 81 of the light-sensing component 80 without bending.

[0078] For example, such as Figure 5 As shown, and refer to Figure 9 The main control circuit board 61 of the circuit board assembly 60 can be located on the non-display side of the display panel 10; for example, the main control circuit board 61 can be located on the side of the backlight assembly 30 away from the display panel 10.

[0079] The light sensor 82 of the light sensing component 80 can be set at the first end of the first circuit board 81, and the second end of the first circuit board 81 can be bent to the non-display side of the display panel 10 and connected to the main control circuit board 61.

[0080] A light sensor 82 is mounted on a first circuit board 81 to form an integrated light-sensing component 80. This light-sensing component 80 can be integrated into the display module 100. Only the portion of the first polarizer 21 corresponding to the first side 1 of the display panel 10 needs to be super-attached, such that the sidewall of the first polarizer 21 on the first side 1 of the display panel 10 protrudes beyond the sidewall of the color filter substrate 13. The light sensor 82 is then fixed between the edge portion of the array substrate 11 that extends beyond the boundary of the color filter substrate 13 and the edge portion of the first polarizer 21 that extends beyond the boundary of the color filter substrate 13. In the first space 2, light from the external environment can pass through the first polarizer 21 and be incident on the light sensor 82. Simultaneously, one end of the first circuit board 81 can be connected to the main control circuit board 61. The ambient light sensing data detected by the light sensor 82 can be directly transmitted to the main control circuit board 61 through the first circuit board 81. The main control circuit board 61 can send corresponding control signals to the driver chip 50 based on the received brightness data, thereby enabling the display module 100 to adaptively adjust the brightness of the display panel 10 according to the brightness of the ambient light. This configuration eliminates the need for the light sensing component 80 to occupy space on the first side 1 (ground side) of the display module 100, resulting in a smaller size on the first side 1 (ground side) of the display module 100 and achieving a borderless design on all four sides of the display device 1000.

[0081] In some embodiments, such as Figure 7 As shown, the distance S1 between the orthographic projection of the sidewall of the array substrate 11 located on the first side 1 of the display panel 10 onto the first polarizer 21 and the orthographic projection of the sidewall of the color filter substrate 13 located on the first side 1 of the display panel 10 onto the first polarizer 21 can range from 1 to 5 mm. For example, the distance S1 between the orthographic projection of the sidewall of the array substrate 11 located on the first side 1 of the display panel 10 onto the first polarizer 21 and the orthographic projection of the sidewall of the color filter substrate 13 located on the first side 1 of the display panel 10 onto the first polarizer 21 can be 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, or 5 mm.

[0082] In some embodiments, such as Figure 7As shown, on the first side 1 of the display panel 10, the edge portion of the first polarizer 21 may extend beyond the boundary of the array substrate 11; that is, on the first side 1 of the display panel 10, the sidewall of the first polarizer 21 may protrude beyond the sidewall of the array substrate 11. The distance S2 between the orthographic projection of the sidewall of the array substrate 11 on the first side 1 of the display panel 10 and the sidewall of the first polarizer 21 on the first side 1 of the display panel 10 can be less than or equal to 5 mm. For example, the distance S2 between the orthographic projection of the sidewall of the array substrate 11 on the first side 1 of the display panel 10 and the sidewall of the first polarizer 21 on the first side 1 of the display panel 10 can be 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, or 5 mm.

[0083] like Figure 5 , Figure 7 As shown, after a portion of the first circuit board 81 in the light-sensing component 80 is bent to the non-display side of the display panel 10 and connected to the main control circuit board 61, the orthographic projection of the light-sensing component 80 on the first polarizer 21 can be located within the boundary range of the first polarizer 21. The first circuit board 81 can be covered by the portion of the first polarizer 21 that extends beyond the boundary of the first side 1 of the array substrate 11, which can prevent the first circuit board 81 in the light-sensing component 80 from being exposed to the surface of the display module 100 and can protect the first circuit board 81 in the light-sensing component 80.

[0084] It should be noted that, on the first side 1 of the display panel 10, the sidewall of the first polarizer 21 may be flush with the sidewall of the array substrate 11; or, on the first side 1 of the display panel 10, the sidewall of the array substrate 11 may protrude from the sidewall of the first polarizer 21. This disclosure does not limit the scope of the invention.

[0085] In some embodiments, such as Figure 5 , Figure 6 , Figure 7 As shown, the display module 100 may further include a light-shielding portion 90, which may fill the first space 2 and may be disposed at least around the side of the light sensor 82. By filling the first space 2 with the light-shielding portion 90, the edge portion of the array substrate 11 that extends beyond the boundary of the color filter substrate 13, the first circuit board 81 in the light sensing component 80, and the side of the light sensor 82 can be shielded. This can prevent the edge of the display module 100 from yellowing due to reflection from the edge portion of the array substrate 11 that extends beyond the boundary of the color filter substrate 13 and the signal lines on the first circuit board 81 in the light sensing component 80.

[0086] In some embodiments, such as Figure 5 , Figure 6 , Figure 7 As shown, the light-shielding part 90 may also be adhesive, and the light-shielding part 90 may be bonded to the surface of the first polarizer 21 near the array substrate 11. The material of the light-shielding part 90 may be the same as the material of the light-shielding adhesive 40 in the display module 100, for example, the light-shielding part 90 may be black light-shielding adhesive.

[0087] For example, after placing or fixing the light sensor 82 in the light-sensing component 80 at a preset position in the first space 2, black light-blocking adhesive can be filled into the first space 2 by potting to form a light-blocking part 90.

[0088] In some embodiments, such as Figure 5 As shown, the light sensor 82 can be bonded and fixed to the surface of the first polarizer 21 near the array substrate 11 via the light-shielding part 90, allowing light from the external environment to pass through the first polarizer 21 and directly onto the light sensor 82. For example, a portion of the light-shielding part 90 can fill around the sidewall of the light sensor 82 and can be bonded to the surface of the first polarizer 21 near the array substrate 11; another portion of the light-shielding part 90 can also fill between the first circuit board 81 and the array substrate 11, between the first circuit board 81 and the color filter substrate 13, and between the light sensor 82 and the color filter substrate 13. While the light-shielding part 90 blocks the edge portion of the array substrate 11 extending beyond the boundary of the color filter substrate 13, the first circuit board 81 in the light-sensing assembly 80, and the side of the light sensor 82 within the first space 2, it can also fix the light sensor 82 in the first space 2 formed between the edge portion of the array substrate 11 extending beyond the boundary of the color filter substrate 13 and the edge portion of the first polarizer 21 extending beyond the boundary of the color filter substrate 13.

[0089] In other embodiments, such as Figure 6 As shown, the display module 100 may further include a transparent adhesive layer M, which can be bonded between the light sensor 82 and the first polarizer 21. That is, the light sensor 82 can be bonded and fixed to the surface of the first polarizer 21 near the array substrate 11 by the transparent adhesive layer M. Light from the external environment can pass through the first polarizer 21 and the transparent adhesive layer M and be incident on the light sensor 82. The transparent adhesive layer M can be a transparent double-sided adhesive.

[0090] The light sensor 82 can be fixed by the transparent adhesive layer M in the first space 2 formed between the edge portion of the array substrate 11 that extends beyond the boundary of the color filter substrate 13 and the edge portion of the first polarizer 21 that extends beyond the boundary of the color filter substrate 13. Furthermore, the transparent adhesive layer M will not block the light in the external environment and will not affect the detection data of the light sensor 82.

[0091] For example, such as Figure 6As shown, while the light sensor 82 is adhered and fixed to the surface of the first polarizer 21 near the array substrate 11 by the transparent adhesive layer M, a portion of the light-shielding part 90 can fill around the sidewall of the light sensor 82 and can be bonded to the surface of the first polarizer 21 near the array substrate 11; another portion of the light-shielding part 90 can also fill between the first circuit board 81 and the array substrate 11. The light-shielding part 90 not only blocks the edge portion of the array substrate 11 extending beyond the boundary of the color filter substrate 13, the first circuit board 81 in the light-sensing assembly 80, and the side of the light sensor 82 within the first space 2, but also re-fixes the light sensor 82, improving the stability of the light sensor 82 within the first space 2.

[0092] In some other embodiments, such as Figure 7 As shown, one end of the first circuit board 81 of the light-sensing component 80, where the light sensor 82 is disposed, can be bonded to the array substrate 11. That is, by binding one end of the first circuit board 81 where the light sensor 82 is disposed to the surface of the array substrate 11 near the first polarizer 21, the light sensor 82 can be fixed in the first space 2 formed between the edge portion of the array substrate 11 that extends beyond the boundary of the color filter substrate 13 and the edge portion of the first polarizer 21 that extends beyond the boundary of the color filter substrate 13.

[0093] For example, such as Figure 7 As shown, by binding one end of the first circuit board 81, in which the light sensor 82 is disposed, to the surface of the array substrate 11 near the first polarizer 21, the light sensor 82 is fixed within the first space 2. Simultaneously, a light-shielding portion 90 can fill the area around the sidewalls of the light sensor 82 and the surface of the light sensor 82 near the first polarizer 21, and the light-shielding portion 90 can be bonded to the surface of the first polarizer 21 near the array substrate 11. Light from the external environment can pass through the first polarizer 21 and the portion of the light-shielding portion 90 located between the light sensor 82 and the first polarizer 21 and be incident on the light sensor 82. Since the portion of the light-shielding portion 90 located between the light sensor 82 and the first polarizer 21 is typically thin, it will not affect the light from the external environment incident on the light sensor 82, i.e., it will not affect the detection accuracy of the light sensor 82. The light-shielding part 90 not only blocks the edge portion of the array substrate 11 that extends beyond the boundary of the color filter substrate 13, the first circuit board 81 in the light-sensing component 80, and the side of the light sensor 82, but also fixes the light sensor 82 again, thereby improving the stability of the light sensor 82 in the first space 2.

[0094] In yet other embodiments, reference is made to Figure 6 , Figure 7By binding one end of the first circuit board 81, in which the light sensor 82 is located, to the surface of the array substrate 11 near the first polarizer 21, the light sensor 82 is fixed within the first space 2. Simultaneously, a transparent adhesive layer M can be placed between the light sensor 82 and the first polarizer 21. The light sensor 82 can also be bonded to the surface of the first polarizer 21 near the array substrate 11 via the transparent adhesive layer M. Light from the external environment can pass through the first polarizer 21 and the transparent adhesive layer M and be incident on the light sensor 82. At this time, the light-shielding part 90 can fill around the sidewall of the light sensor 82 and can be bonded to the surface of the first polarizer 21 near the array substrate 11. The light-shielding part 90 not only blocks the edge portion of the array substrate 11 extending beyond the boundary of the color filter substrate 13, the first circuit board 81 in the light-sensing assembly 80, and the side of the light sensor 82 within the first space 2, but also further fixes the light sensor 82, improving its stability within the first space 2.

[0095] In some embodiments, such as Figure 7 As shown, when the light sensor 82 is fixed in the first space 2 by binding one end of the first circuit board 81 to the surface of the array substrate 11 near the first polarizer 21, the distance S3 between the surface of the array substrate 11 near the first polarizer 21 and the surface of the first polarizer 21 near the array substrate 11 can be greater than the sum of the thicknesses of the first circuit board 81 and the light sensor 82 in the light sensing component 80.

[0096] In some embodiments, such as Figure 6 As shown, when the light sensor 82 is attached and fixed to the surface of the first polarizer 21 near the array substrate 11 by the transparent adhesive layer M, the distance S3 between the surface of the array substrate 11 near the first polarizer 21 and the surface of the first polarizer 21 near the array substrate 11 can be greater than the thickness of the transparent adhesive layer M and the sum of the thicknesses of the first circuit board 81 and the light sensor 82 in the light sensing component 80.

[0097] For example, refer to Figure 6The distance S3 between the surface of the array substrate 11 near the first polarizer 21 and the surface of the first polarizer 21 near the array substrate 11 can be, for example, 1.3 mm. The thickness of the first circuit board 81 in the photosensitive assembly 80 can be, for example, 0.1 mm; the thickness of the photosensor 82 in the photosensitive assembly 80 can be, for example, 1 mm; and the thickness of the transparent adhesive layer M can be, for example, 0.1 mm. The above description is merely an exemplary illustration of the relevant dimensions, and this disclosure does not specifically limit the distance S3 between the surface of the array substrate 11 near the first polarizer 21 and the surface of the first polarizer 21 near the array substrate 11, the thickness of the first circuit board 81, the thickness of the photosensor 82, or the thickness of the transparent adhesive layer M.

[0098] For example, the thickness of the light sensor 82 in the light sensing component 80 may be less than or equal to 1.5 mm; further, the thickness of the light sensor 82 in the light sensing component 80 may be less than or equal to 1 mm.

[0099] For example, the thickness of the photosensor 82 in the photosensitive component 80 can be 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, 1.5mm, etc.

[0100] In some embodiments, such as Figure 9 , Figure 10 As shown, the display module 100 may further include a plurality of flip-chip films 51 and a plurality of second circuit boards 62. The plurality of flip-chip films 51 are arranged along a first direction X and are respectively connected to the edge portion of the array substrate 11 located on the first side 1 of the display panel 10. The first direction X is the extension direction of the boundary of the first side 1 of the display panel 10. Each second circuit board 62 is connected to at least two flip-chip films 51 and to the main control circuit board 61. The first circuit board 81 is connected to the main control circuit board 61 through the second circuit board 62.

[0101] For example, such as Figure 9 As shown, the display module 100 may include multiple flip-chip films 51, on which driver chips 50 may be disposed. The flip-chip films 51 are used to bond the driver chips 50 to the flexible circuit board. The flip-chip films 51 can be bonded and electrically connected to the non-display area of ​​the array substrate 11.

[0102] For example, the driver chip 50 can be a source driver chip, which can be connected to the data signal line Dt of the display area AA of the array substrate 11 in the display panel 10 and provide data signals to the data signal line Dt. For example, referring to Figure 3 , Figure 4In the pixel driving circuit D, the gate of one of the transistors can be electrically connected to the gate signal line GI, the first terminal of the transistor can be electrically connected to the data signal line Dt, and the second terminal of the transistor can be electrically connected to the pixel electrode. In response to the gate signal transmitted via the gate signal line GI and the data signal transmitted via the data signal line Dt, the pixel driving circuit D provides an electrical signal to the pixel electrode coupled to it, creating an electric field within the sub-pixel P where the pixel electrode is located. This electric field drives the liquid crystal molecules of the liquid crystal layer 12 to deflect, causing the sub-pixel P to emit light, thereby enabling the display panel 10 to display an image.

[0103] Optionally, the driver chip 50 can also be a central processing unit, a digital signal processor, a microcontroller, a programmable logic controller, etc. For example, the driver chip 50 may also include memory, a power supply module, etc., and implement power supply and signal input / output functions through separately provided wires, signal lines, etc. For example, the driver chip 50 may also include hardware circuits and computer-executable code. The hardware circuits may include conventional very large-scale integrated circuits (VLSI) or gate arrays, as well as existing semiconductors or other discrete components such as logic chips and transistors; the hardware circuits may also include field-programmable gate arrays, programmable array logic, programmable logic devices, etc.

[0104] The number of flip-chip films 51 can be set according to the actual situation, and this disclosure does not impose any restrictions.

[0105] like Figure 9 As shown, multiple flip-chip films 51 can be arranged sequentially along the first direction X, where the first direction X is the extension direction of the boundary of the first side 1 of the display panel 10.

[0106] like Figure 9 , Figure 10 As shown, each flip-chip film 51 can be connected to the edge portion of the array substrate 11 located on the first side 1 of the display panel 10; that is, each flip-chip film 51 can be bonded to the edge portion of the array substrate 11 located on the first side 1 of the display panel 10.

[0107] For example, such as Figure 7 , Figure 9 , Figure 10 As shown, when the light sensor 82 is fixed in the first space 2 by binding one end of the first circuit board 81 to the surface of the array substrate 11 near the first polarizer 21, the light sensor 82 can be simultaneously bound to the edge portion of the array substrate 11 located on the first side 1 of the display panel 10, where multiple flip-chip films 51 and light sensing components 80 are located.

[0108] For example, such as Figure 9 As shown, the circuit board assembly 60 of the display module 100 may further include a plurality of second circuit boards 62, the number of which may be less than the number of flip-chip films 51. Each second circuit board 62 may be connected to at least two flip-chip films 51, and each second circuit board 62 may be connected to the main control circuit board 61. Optionally, the second circuit board 62 may be a printed circuit board, such as a PCB. Adjacent second circuit boards 62 may be electrically connected by a connecting circuit board 64, which may be a flexible printed circuit (FPC) or a flexible flat cable (FFC).

[0109] The number of the second circuit board 62 can be set according to the actual situation, and this disclosure does not impose any restrictions.

[0110] In some embodiments, such as Figure 9 As shown, the display module 100 may include, for example, twelve flip-chip films 51 and four second circuit boards 62; the first end of each flip-chip film 51 may be bonded to the edge portion of the array substrate 11 located on the first side 1 of the display panel 10; the first end of each second circuit board 62 may be connected to the second end of three of the flip-chip films 51, and the second end of each second circuit board 62 may be connected to the main control circuit board 61.

[0111] For example, such as Figure 5 , Figure 9 As shown, the first circuit board 81 of the light sensing component 80 can be connected to the main control circuit board 61 via the second circuit board 62. That is, the end of the first circuit board 81 of the light sensing component 80 without the light sensor 82 can be connected to the first end of one of the second circuit boards 62.

[0112] In some embodiments, such as Figure 9 As shown, the light-sensing component 80 can be disposed, for example, between two adjacent flip-chip films 51 along the first direction X.

[0113] Reference Figure 5 , Figure 9 , Figure 10 When the circuit board assembly 60 (including the second circuit board 62 and the main control circuit board 61) is located on the side of the backlight assembly 30 away from the display panel 10, multiple flip-chip films 51 and the first circuit board 81 of the light sensor 80 can be bent at the same time so as to connect with the second circuit board 62 located on the side of the backlight assembly 30 away from the display panel 10.

[0114] In some embodiments, such as Figure 9 , Figure 11 As shown, at least one second circuit board 62 may include a first connection portion 621, and the first circuit board 81 of the light sensing component 80 may be connected to the first connection portion 621. When multiple light sensing components 80 are connected to a second circuit board 62, the second circuit board 62 may include multiple first connection portions 621, and the first circuit board 81 of one light sensing component 80 may be connected to one first connection portion 621.

[0115] like Figure 9 , Figure 11 As shown, the second circuit board 62 may also include a first signal line 622. One end of the first signal line 622 may be connected to the first connection part 621, and the other end of the first signal line 622 may be connected to the main control circuit board 61. The first signal line 622 may be used to transmit the sensing signal output by the light sensing component 80.

[0116] When the second circuit board 62 includes multiple first connection parts 621, the second circuit board 62 may include multiple first signal lines 622; one end of a first signal line 622 may be connected to a first connection part 621, and the other end of the first signal line 622 may be connected to the main control circuit board 61.

[0117] In some embodiments, such as Figure 9 As shown, the display module 100 may also include a third circuit board 63, which can be used to set the timing controller (TCON).

[0118] like Figure 9 As shown, the third circuit board 63 can be connected between multiple second circuit boards 62 and the main control circuit board 61; that is, multiple second circuit boards 62 can be connected to the main control circuit board 61 through the third circuit board 63. The third circuit board 63 may include a second signal line 631, one end of which can be connected to a first signal line 622, and the other end of which can be connected to the main control circuit board 61.

[0119] When the second circuit board 62 includes multiple first signal lines 622, the third circuit board 63 may include multiple second signal lines 631; one end of a second signal line 631 may be connected to a first signal line 622, and the other end of the second signal line 631 may be connected to the main control circuit board 61.

[0120] In some embodiments, such as Figure 9 As shown, the display module 100 may further include at least one connector L, and at least one second circuit board 62 may be connected to a third circuit board 63 via a connector L; that is, one or more second circuit boards 62 may be connected to a third circuit board 63 via a connector L. For example, as Figure 9As shown, the four second circuit boards 62 can be arranged, for example, along the first direction X, and two of the second circuit boards 62 can be located on one side of the first center line H1 of the display panel 10, while the other two second circuit boards 62 can be located on the other side of the first center line H1 of the display panel 10. The first center line H1 is the center line of the display panel 10 extending along the second direction Y, which is perpendicular to the first direction X.

[0121] like Figure 9 As shown, the display module 100 may include two connectors L; two second circuit boards 62 located on one side of the first center line H1 of the display panel 10 may be connected to each other, and one of the second circuit boards 62 near the first center line H1 may be connected to a third circuit board 63 through a connector L; two second circuit boards 62 located on the other side of the first center line H1 of the display panel 10 may be connected to each other, and one of the second circuit boards 62 near the first center line H1 may be connected to the third circuit board 63 through another connector L.

[0122] In some embodiments, such as Figure 9 As shown, the connector L may include a third signal line L1, one end of which may be connected to the first signal line 622, and the other end of which may be connected to the second signal line 631.

[0123] The connector L can be, for example, a flexible flat cable (FFC).

[0124] In some embodiments, such as Figure 9 As shown, the display module 100 may include multiple light sensing components 80, which can improve the detection accuracy of the display module 100 for ambient light. When some light sensing components 80 are blocked by objects or malfunction due to tabletop reflections, the remaining light sensing components 80 can continue to detect ambient light, thus avoiding the failure of the light sensing components 80 in the display module 100.

[0125] For example, one or more photosensitive components 80 can be disposed between any two adjacent flip-chip films 51.

[0126] In some embodiments, such as Figure 9 As shown, multiple light-sensing components 80 can be arranged symmetrically with respect to the first center line H1 of the display panel 10. This can further improve the detection accuracy of the display module 100 for ambient light.

[0127] In some embodiments, such as Figure 9As shown, the plurality of flip-chip films 51 may include a first flip-chip film 51-1, a second flip-chip film 51-2, a third flip-chip film 51-3, and a fourth flip-chip film 51-4 arranged sequentially along the first direction X; the plurality of second circuit boards 62 may include a first sub-circuit board 62-1 and a second sub-circuit board 62-2. The first flip-chip film 51-1 and the second flip-chip film 51-2 may be connected to the first sub-circuit board 62-1; the third flip-chip film 51-3 and the fourth flip-chip film 51-4 may be connected to the second sub-circuit board 62-2.

[0128] For example, such as Figure 7 , Figure 9 As shown, the display module 100 may include multiple light-sensing components 80, which may include a first light-sensing component 80-1 and a second light-sensing component 80-2. The first light-sensing component 80-1 may be disposed between a first flip-chip film 51-1 and a second flip-chip film 51-2, and the first circuit board 81 of the first light-sensing component 80-1 may be connected to a first sub-circuit board 62-1. The second light-sensing component 80-2 may be disposed between a third flip-chip film 51-3 and a fourth flip-chip film 51-4, and the first circuit board 81 of the second light-sensing component 80-2 may be connected to a second sub-circuit board 62-2.

[0129] In some embodiments, such as Figure 9 As shown, the first flip-chip film 51-1 and the second flip-chip film 51-2 can be located on the first side of the first center line H1 of the display panel 10, and the third flip-chip film 51-3 and the fourth flip-chip film 51-4 can be located on the second side of the first center line H1; the first side and the second side of the first center line H1 are the two sides of the first center line H1 along the first direction X.

[0130] like Figure 9 As shown, the second flip-chip film 51-2 can be closer to the first center line H1 than other flip-chip films 51 located on the first side of the first center line H1; the third flip-chip film 51-3 can be closer to the first center line H1 than other flip-chip films 51 located on the second side of the first center line H1. This allows the first light-sensing component 80-1 and the second light-sensing component 80-2 to be closer to the first center line H1 of the display panel 10, eliminating the need for a long first signal line 622 in the first sub-circuit board 62-1 and the second sub-circuit board 62-2. This avoids the first signal line 622 being too long and prone to breakage, further simplifies manufacturing costs, and improves the yield of the display module 100.

[0131] In other embodiments, such as Figure 12As shown, the display module 100 may include multiple light-sensing components 80, which may include a first light-sensing component 80-1 and a second light-sensing component 80-2. The first light-sensing component 80-1 and the second light-sensing component 80-2 may be respectively disposed on both sides of multiple flip-chip films 51 (e.g., all flip-chip films 51) along the first direction X. That is, the first light-sensing component 80-1 and the second light-sensing component 80-2 may be respectively disposed at two corner positions along the first direction X on the first side 1 of the display panel 10, which can increase the distance between the first light-sensing component 80-1 and the second light-sensing component 80-2, so that the first light-sensing component 80-1 and the second light-sensing component 80-2 can receive ambient light over a wider range, further improving the detection accuracy of the display module 100 for external ambient light.

[0132] In some embodiments, such as Figure 12 As shown, the multiple second circuit boards 62 may include multiple third sub-circuit boards 62-3 and multiple fourth sub-circuit boards 62-4; the multiple third sub-circuit boards 62-3 may be located between the first light-sensing component 80-1 and the first center line H1, the multiple third sub-circuit boards 62-3 may be connected in sequence, and the third sub-circuit board 62-3 closer to the first center line H1 may be connected to the main control circuit board 61 through a connector L; the first light-sensing component 80-1 may be connected to the main control circuit board 61 through the multiple third sub-circuit boards 62-3.

[0133] like Figure 12 As shown, multiple fourth sub-circuit boards 62-4 can be located between the second light-sensing component 80-2 and the first center line H1. Multiple fourth sub-circuit boards 62-4 can be connected in sequence, and the fourth sub-circuit board 62-4 closer to the first center line H1 can be connected to the main control circuit board 61 through a connector L. The second light-sensing component 80-2 can be connected to the main control circuit board 61 through multiple fourth sub-circuit boards 62-4.

[0134] Reference Figure 6 The method for manufacturing the above-mentioned display module 100 may include, for example: 1. A display panel 10 is provided, the display panel 10 including an array substrate 11 and a color filter substrate 13 stacked together; on a first side 1 of the display panel 10, the sidewall of the array substrate 11 protrudes from the sidewall of the color filter substrate 13.

[0135] 2. A second polarizing film is attached to the surface of the array substrate 11 on the side away from the color filter substrate 13, and the second polarizing film is cut to form a second polarizing film 22.

[0136] 3. Bind one end of the flip-chip film 51 to the portion of the array substrate 11 that protrudes from the color filter substrate 13; and bind the circuit board assembly 60 to the other end of the flip-chip film 51.

[0137] 4. A first polarizing film is attached to the side of the color filter substrate 13 away from the array substrate 11, and the first polarizing film is cut to form a first polarizing film 21; and on the first side 1 of the display panel 10, the sidewall of the first polarizing film 21 protrudes from the sidewall of the color filter substrate 13.

[0138] 5. Provide a light-sensing component 80, which includes a first circuit board 81 and a light sensor 82 disposed on the first circuit board 81; fix the light sensor 82 in a first space 2 formed between the edge portion of the array substrate 11 that extends beyond the boundary of the color filter substrate 13 and the edge portion of the first polarizer 21 that extends beyond the boundary of the color filter substrate 13.

[0139] 6. Fill the first space 2 with a light-shielding part 90.

[0140] 7. Connect the first circuit board 81 of the light sensor component 80 to the circuit board assembly 60.

[0141] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0142] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display module, characterized in that, include: The display panel includes an array substrate and a color filter substrate stacked together. A backlight assembly is disposed on the side of the array substrate away from the color filter substrate; A first polarizer is disposed on the side of the color filter substrate away from the array substrate; on the first side of the display panel, the edge portion of the array substrate and the edge portion of the first polarizer both extend beyond the boundary of the color filter substrate, and a first space is formed between the edge portion of the array substrate and the edge portion of the first polarizer. The first side is the side where one of the boundaries of the display panel is located; The main control circuit board is connected to the first side of the display panel; The light-sensing component includes a first circuit board and a light sensor disposed on the first circuit board; the light sensor is fixed in the first space, and one end of the first circuit board is connected to the main control circuit board.

2. The display module according to claim 1, characterized in that, The main control circuit board is located on the non-display side of the display panel; The first circuit board is a flexible circuit board, the light sensor is disposed at the first end of the first circuit board, and the second end of the first circuit board is bent to the non-display side of the display panel and connected to the main control circuit board.

3. The display module according to claim 2, characterized in that, On the first side of the display panel, the edge portion of the first polarizer extends beyond the boundary of the array substrate; the orthographic projection of the light-sensing component onto the first polarizer is located within the boundary range of the first polarizer.

4. The display module according to claim 1, characterized in that, The display module further includes a light-shielding part that fills the first space and is disposed at least around the side of the light sensor.

5. The display module according to claim 4, characterized in that, The light-shielding part is adhesive and is bonded to the first polarizer.

6. The display module according to claim 4, characterized in that, The display module further includes a transparent adhesive layer, which is bonded between the light sensor and the first polarizer.

7. The display module according to claim 4, characterized in that, One end of the optical sensor in the first circuit board is bonded to the array substrate.

8. The display module according to any one of claims 1 to 7, characterized in that, The display module also includes: Multiple flip-chip films are arranged along a first direction and are respectively connected to the edge portion of the array substrate located on the first side of the display panel; the first direction is the extension direction of the boundary of the first side of the display panel. Multiple second circuit boards, each second circuit board being connected to at least two flip-chip films and connected to the main control circuit board; the first circuit board is connected to the main control circuit board through the second circuit boards.

9. The display module according to claim 8, characterized in that, At least one second circuit board includes a first connection portion and a first signal line; the first circuit board is connected to the first connection portion; one end of the first signal line is connected to the first connection portion, and the other end of the first signal line is connected to the main control circuit board. The first signal line is used to transmit the sensing signal output by the photosensitive component.

10. The display module according to claim 9, characterized in that, The display module also includes: A third circuit board is used to house a timing control chip; the third circuit board is connected between the plurality of second circuit boards and the main control circuit board; the third circuit board includes a second signal line, one end of which is connected to the first signal line, and the other end of which is connected to the main control circuit board.

11. The display module according to claim 10, characterized in that, The display module also includes: At least one connector, at least one second circuit board is connected to the third circuit board via one of the connectors; the connector includes a third signal line, one end of the third signal line is connected to the first signal line, and the other end of the third signal line is connected to the second signal line.

12. The display module according to claim 8, characterized in that, The light-sensing component is disposed between two adjacent flip-chip films along the first direction.

13. The display module according to claim 12, characterized in that, The display module includes a plurality of light-sensing components, which are arranged symmetrically with respect to the first center line. Wherein, the first center line is the center line of the display panel extending along the second direction, and the second direction is perpendicular to the first direction.

14. The display module according to claim 12, characterized in that, The plurality of flip-chip films includes a first flip-chip film, a second flip-chip film, a third flip-chip film, and a fourth flip-chip film arranged sequentially along the first direction. The plurality of second circuit boards include a first sub-circuit board and a second sub-circuit board, the first flip-chip film and the second flip-chip film are connected to the first sub-circuit board, and the third flip-chip film and the fourth flip-chip film are connected to the second sub-circuit board; The display module includes a plurality of light-sensing components, including a first light-sensing component and a second light-sensing component; the first light-sensing component is disposed between the first flip-chip film and the second flip-chip film, and the first circuit board of the first light-sensing component is connected to the first sub-circuit board; the second light-sensing component is disposed between the third flip-chip film and the fourth flip-chip film, and the first circuit board of the second light-sensing component is connected to the second sub-circuit board.

15. The display module according to claim 14, characterized in that, The first and second flip-chip films are located on the first side of the first center line of the display panel, and the third and fourth flip-chip films are located on the second side of the first center line; the first center line is the center line of the display panel extending along a second direction, which is perpendicular to the first direction; the first side and the second side of the first center line are the two sides of the first center line along the first direction; The second flip-chip film is closer to the first center line than other flip-chip films located on the first side of the first center line; The third flip-chip film is closer to the first center line than the other flip-chip films located on the second side of the first center line.

16. The display module according to claim 8, characterized in that, The display module includes a plurality of light-sensing components, including a first light-sensing component and a second light-sensing component; the first light-sensing component and the second light-sensing component are respectively disposed on both sides of the plurality of flip-chip films along the first direction.

17. The display module according to claim 16, characterized in that, The plurality of second circuit boards include: Multiple third sub-circuit boards are located between the first photosensitive component and the first center line, and the multiple third sub-circuit boards are connected in sequence; the first photosensitive component is connected to the main control circuit board through the multiple third sub-circuit boards. Multiple fourth sub-circuit boards are located between the second photosensitive component and the first center line, and the multiple fourth sub-circuit boards are connected in sequence; the second photosensitive component is connected to the main control circuit board through the multiple fourth sub-circuit boards; Wherein, the first center line is the center line of the display panel extending along the second direction, and the second direction is perpendicular to the first direction.

18. The display module according to any one of claims 1 to 7, characterized in that, The distance between the orthographic projection of the sidewall of the array substrate located on the first side of the display panel onto the first polarizer and the orthographic projection of the sidewall of the color filter substrate located on the first side of the display panel onto the first polarizer is in the range of 1~5mm; and / or, On the first side of the display panel, the edge portion of the first polarizer extends beyond the boundary of the array substrate; the orthographic projection of the sidewall of the array substrate on the first side of the display panel onto the first polarizer is less than or equal to 5 mm.

19. The display module according to any one of claims 1 to 7, characterized in that, At the boundaries of the display panel other than the first side, the edge portions of the array substrate and the edge portions of the first polarizer both extend beyond the boundary of the color filter substrate.

20. A display device, characterized in that, include: The display module as described in any one of claims 1 to 19.

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