Thermal control device and active thermal management method, driving recorder, storage medium

Abstract

The application discloses a heat control device, an active heat management method, a driving recorder and a storage medium. The heat control device comprises a TEC component, a fan component and a main control module. The TEC component is arranged on the side of a heat generating chip of the driving recorder, and is used for cooling the heat generating chip through the cold end of the TEC component or heating the heat generating chip through the hot end of the TEC component. The fan component is arranged on the hot end of the TEC component, and is used for convection cooling of the TEC component or auxiliary heating. The main control module is connected with the TEC component and the fan component, and is used for determining a target signal for regulating the operation mode of the TEC component and the rotation speed of the fan component based on the corresponding operation temperature of the heat generating chip and the corresponding environment temperature of the driving recorder. The above technical scheme solves the problems of insufficient high-temperature heat dissipation and low-temperature starting failure of the driving recorder in a wide temperature range.

Description

Technical Field

[0001] This application relates to the field of automotive electronics technology, and more specifically, to a thermal control device and active thermal management method, a driving recorder, and a storage medium. Background Technology

[0002] As an in-vehicle electronic device, dashcams generate high-density heat during operation due to the high temperatures of their core processing units, such as System-on-Chips (SoCs) and DDR (Double Data Rate Synchronous Dynamic Random Access Memory) chips. These chips must also withstand extreme in-vehicle environments ranging from -30°C to 70°C. Related technical solutions face insufficient heat dissipation at high temperatures. With increasing chip integration, the hotspots formed by the SoC and DDR lead to inefficient passive or single active cooling, easily causing chip overheating-induced shutdowns, image stuttering, and data loss. At low temperatures, extreme cold causes decreased chip mobility and PCB embrittlement, rendering passive insulation solutions ineffective for active heating, making it difficult for the device to start.

[0003] There is currently no effective solution to the problems of insufficient heat dissipation at high temperatures and easy failure when starting at low temperatures in related technologies.

[0004] Therefore, it is necessary to improve the relevant technology to overcome the aforementioned defects. Summary of the Invention

[0005] This application provides a thermal control device and active thermal management method, a dashcam, and a storage medium to at least solve the problems of insufficient heat dissipation at high temperatures and easy failure during low-temperature startup in dashcams over a wide temperature range in related technologies.

[0006] According to one aspect of the embodiments of this application, a thermal control device is provided, comprising: a TEC component disposed on the heating chip side of a dashcam, used to cool and dissipate heat on the heating chip through the cold end of the TEC component, or to heat the heating chip through the hot end of the TEC component; a fan assembly disposed on the hot end of the TEC component, used to perform convection cooling or auxiliary heating on the TEC component; and a main control module connected to the TEC component and the fan assembly, used to determine target signals for regulating the operating mode of the TEC component and the operating speed of the fan assembly based on the operating temperature corresponding to the heating chip and the ambient temperature corresponding to the dashcam.

[0007] According to another aspect of the embodiments of this application, a dynamic thermal management method is also provided, comprising: acquiring the ambient temperature corresponding to the dashcam and the ambient temperature corresponding to the internal heating chip of the dashcam; determining a target signal for regulating the operating mode of the TEC component and the operating speed of the fan component based on the ambient temperature; and managing the real-time operating status of the thermal control device through the target signal.

[0008] According to another aspect of the embodiments of this application, a computer-readable storage medium is also provided, wherein a computer program is stored in the computer program, and the computer program is configured to execute the above-described active thermal management method applied to a thermal control device when it is run.

[0009] According to another aspect of the embodiments of this application, an electronic device is also provided, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the active thermal management method applied to the thermal control device through the computer program.

[0010] According to another aspect of the embodiments of this application, a computer program product is also provided, including a computer program, which, when executed by a processor, is the above-described active thermal management method applied to a thermal control device.

[0011] According to this application, the active thermal control device includes a TEC (Thermoelectric Cooler) component, a fan component, and a main control module. The TEC component is in close contact with the heat-generating chip and achieves cooling or heating through current polarity switching. The fan component is located at the hot end of the TEC and is responsible for high-temperature heat dissipation or assisting in low-temperature heat diffusion. The main control module monitors the chip temperature and ambient temperature in real time and executes a control strategy that prioritizes the TEC and follows the fan gradient based on a dual-threshold verification mechanism. By adopting the above technical solution, the problems of insufficient high-temperature heat dissipation and easy failure during low-temperature start-up of dashcams in a wide temperature range are solved. Furthermore, the TEC current is dynamically adjusted to execute the corresponding operating mode and fan speed, achieving precise temperature control while balancing heat dissipation efficiency, power consumption, and noise, ensuring stable operation of the dashcam in an extreme wide temperature range. Attached Figure Description

[0012] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0013] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0014] Figure 1 This is a hardware structure block diagram of a dashcam according to an embodiment of the present application, which describes an active thermal management method.

[0015] Figure 2 This is an active thermal management method applied to a thermal control device according to an embodiment of this application;

[0016] Figure 3 This is a schematic diagram of the assembly of a wide-temperature-range TEC active thermal control device for a dashcam according to an embodiment of this application;

[0017] Figure 4 This is a schematic diagram of the heat dissipation / heat conduction path of the core heat-generating component of the wide-temperature-range TEC active thermal control device according to an embodiment of this application;

[0018] Figure 5 This is a thermal simulation result diagram of the high-temperature cooling mode of the wide-temperature-range thermal management method according to the embodiments of this application at 70°C.

[0019] Figure 6 This is a thermal simulation result diagram of the low-temperature heating mode of the wide temperature range thermal management method according to the embodiment of this application in an environment of -30℃;

[0020] Figure 7 This is a structural block diagram of a thermal control device according to an embodiment of this application. Detailed Implementation

[0021] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort should fall within the scope of protection of the present application.

[0022] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0023] The methods and embodiments provided in this application can be executed in a dashcam, computer terminal, or similar computing device. Taking the operation on a dashcam as an example, Figure 1 This is a hardware structure block diagram of a dashcam according to an embodiment of the active thermal management method of this application. Figure 1 As shown, a dashcam may include one or more ( Figure 1 Only one is shown in the image. A processor 102 (which may include, but is not limited to, a central processing unit, microprocessor, or programmable logic device, etc.) and a memory 104 for storing data are also shown. The dashcam may further include a transmission device 106 for communication functions and an input / output device 108. Those skilled in the art will understand that... Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the dashcam described above. For example, the dashcam may also include components that are larger than... Figure 1 The more or fewer components shown, or having the same Figure 1 The different configurations shown.

[0024] The memory 104 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the active thermal management method applied to the thermal control device in this embodiment of the application. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, thereby implementing the above-described method. The memory 104 may include high-speed random access memory, and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include memory remotely located relative to the processor 102, and these remote memories can be connected to the dashcam via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0025] The transmission device 106 is used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by the dashcam's communication provider. In one example, the transmission device 106 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the transmission device 106 may be a Radio Frequency (RF) module used for wireless communication with the Internet.

[0026] This embodiment provides an active thermal management method applied to a thermal control device. Figure 2 This is a flowchart of an active thermal management method applied to a thermal control device according to an embodiment of this application, such as... Figure 2 As shown, the process includes the following steps S202-S206:

[0027] Step S202: Obtain the ambient temperature corresponding to the dashcam and the ambient temperature corresponding to the internal heating chip of the dashcam;

[0028] Step S204: Determine a target signal for regulating the operating mode of the TEC component and the operating speed of the fan component based on the ambient temperature.

[0029] Step S206: Manage the real-time operating status of the thermal control device through the target signal.

[0030] Through the above steps, the ambient temperature corresponding to the dashcam and the ambient temperature corresponding to the internal heating chip of the dashcam are obtained; based on the ambient temperature, a target signal is determined to regulate the operating mode of the TEC component and the operating speed of the fan component; the real-time operating status of the thermal control device is managed through the target signal. This technical solution solves the problems of insufficient heat dissipation at high temperatures and easy failure during low-temperature startup of dashcams over a wide temperature range. Furthermore, it dynamically adjusts the TEC current to execute the corresponding operating mode and fan speed, achieving precise temperature control while balancing heat dissipation efficiency, power consumption, and noise, ensuring stable operation of the dashcam in an extreme wide temperature range.

[0031] Optionally, a target signal for regulating the operating mode of the TEC component and the operating speed of the fan component is determined based on the ambient temperature and operating temperature. Specifically, the main control module sends the target signal to the TEC drive module, and the TEC drive module adjusts the direction and magnitude of the current flowing through the TEC component according to the target signal to switch between cooling mode and heating mode.

[0032] Optionally, the ambient temperature corresponding to the dashcam and the operating temperature corresponding to the internal heating chip of the dashcam can be obtained, specifically including: collecting the operating temperature through a thermistor set on the heating chip, and collecting the ambient temperature through a target sensor set on the main board where the thermal control device is located.

[0033] Optionally, a target signal for regulating the operating mode of the TEC component and the operating speed of the fan component is determined based on the ambient temperature and the operating temperature. Specifically, the judgment unit of the main control module determines the operating mode of the thermal control device based on the ambient temperature and the operating temperature: when the ambient temperature is greater than or equal to a first ambient threshold and the operating temperature approaches the preset upper limit of the chip junction temperature, a high-temperature cooling mode is determined to be executed; when the ambient temperature is less than or equal to a second ambient threshold, a low-temperature heating mode is determined to be executed; when the ambient temperature is less than the first ambient threshold and greater than the second ambient threshold, a normal temperature standby mode is determined to be executed; wherein, the first ambient threshold is greater than the second ambient threshold.

[0034] Optionally, the real-time operating status of the thermal control device is managed through target signals, specifically including: when the strategy unit of the main control module determines to execute the high-temperature cooling mode, it instructs the TEC drive module to start the cooling mode and determines the target operating speed of the fan assembly based on the hot end temperature of the TEC component; when the strategy unit determines to execute the low-temperature heating mode, it instructs the TEC drive module to start the heating mode and determines the target operating speed of the fan assembly based on the cold end temperature of the TEC component.

[0035] Obviously, the embodiments described above are only some embodiments of this application, and not all embodiments. To better understand the above method, the following description, in conjunction with embodiments, illustrates the process, but is not intended to limit the technical solutions of the embodiments of this application. Specifically:

[0036] Dashcams need to withstand extreme vehicle temperatures ranging from -30℃ to 70℃. However, at high temperatures, the high-density integration of dashcams, including SOC and DDR chips with a 3.7mm gap between them, easily leads to hotspots. Furthermore, passive and active cooling solutions in related technologies are inefficient, easily causing chip overheating and crashes, image stuttering, and data loss at 70℃, failing to meet the wide-range high-temperature control requirements. At low temperatures, environments at -30℃ and below cause a sharp drop in chip carrier mobility, coupled with increased PCB brittleness and solder joint cracking, leading to device failure. In addition, passive insulation solutions in related technologies can only slow down cooling and cannot actively raise temperatures, making them unsuitable for the needs of extremely cold regions. In other words, related technologies struggle to overcome the -20℃ startup bottleneck.

[0037] Existing technologies generally face a dual bottleneck due to the lack of efficient wide-temperature-range active thermal management solutions, resulting in insufficient heat dissipation at high temperatures and chip startup failure at low temperatures. This leads to problems such as image distortion and data loss, hindering adaptation to all scenarios.

[0038] This application proposes an optional embodiment of a wide-temperature-range TEC active thermal control device and thermal management method for a dashcam. Specifically, by constructing a wide-temperature-range high-efficiency heat conduction link, a double-layer high thermal conductivity gel and EC component adapter design are adopted to cover the SOC and DDR core heat-generating chips. The gel fills the contact gaps between the chip and the TEC, and between the TEC and the heat sink, constructing an efficient heat conduction path, providing structural support for the TEC's bidirectional temperature control, significantly reducing contact thermal resistance, and ensuring the stability of heat conduction within a wide temperature range. A wide-temperature-range temperature control and heat dissipation structure is established, relying on the bidirectional temperature control characteristics of the TEC component, and a forced convection system is constructed by combining a finned heat sink and an axial fan. The core structure of the wide-temperature-range TEC active thermal control device rapidly dissipates heat at the high-temperature end through TEC cooling and fan convection, while at the low-temperature end, TEC heating targets and heats the core components, and air heating the corresponding low-temperature end simultaneously solves the two major problems of chip overheating and low-temperature inactivation, adapting to all temperature range operating conditions. A closed-loop thermal management method is designed, and the supporting device structure is designed with dual-threshold detection, TEC priority, fan gradient following, and dynamic optimization logic for all operating conditions. The device adjusts the TEC operating status and fan speed in real time through temperature feedback, forming a detection, control, and feedback closed loop to ensure the accuracy of temperature control and system stability under various operating conditions within a wide temperature range, realizing the synergy between the device and the method.

[0039] Optionally, Figure 3 This is a schematic diagram of the assembly of a wide-temperature-range TEC active thermal control device for a dashcam according to an embodiment of this application; specifically including: 1-front-view camera module; 2-plastic front cover; 3-bracket; 4-plastic rear cover; 5-internal camera module;

[0040] Optionally, Figure 4 This is a schematic diagram of the heat dissipation / heat conduction path of the core heat-generating component of the wide-temperature-range TEC active thermal control device according to an embodiment of this application. It is used to illustrate the assembly and heat conduction relationship of SOC, DDR, TEC, and heat sink. Specifically, it includes: 201-first heat-generating component, which may include SOC, MPN: CR3A-HX, etc.; 202-second heat-generating component, which may include DDR, MPN: W634GU6RB11K, etc. (equivalent to the heat-generating chip in the above embodiment); 203-PCBA motherboard; 301-TEC component, the TEC component is the core of wide-temperature-range temperature control; 401-finned heat sink; 501-axial fan.

[0041] It should be noted that the above-mentioned wide-temperature-range TEC active thermal control device is suitable for a wide temperature range of -30℃ to 70℃ and for vehicle vibration and electromagnetic interference conditions. It adopts a modular stacked integrated design, and the core components all meet automotive-grade reliability standards, providing stable hardware support for thermal management methods. The core consists of two layers of thermal conductive gel, a TES-7103 model TEC component, a finned heat sink, and a low-power silent axial fan. All components work together to build an efficient heat conduction link.

[0042] Optionally, the TEC group is driven by a TEC drive and voltage polarity conversion circuit, which is integrated on the PCBA motherboard and consists of an H-bridge drive circuit, a MOSFET switching network, and an overcurrent / overtemperature / reverse connection protection circuit. It receives signals from the main control unit to realize the switching of TEC power supply polarity and continuous adjustment of 0–3A current, thereby completing the cooling / heating mode control.

[0043] In practical applications, two layers of thermally conductive gel can be selected with a thermal conductivity of 10 W / (m). The high thermal conductivity gel (K) is used as the base layer, custom-fitted to SOC (0.5mm) and DDR (0.8mm) chip specifications. The top layer is adapted for the TEC and heatsink, filling microscopic gaps at the contact surface to reduce thermal resistance and ensure stable heat conduction over a wide temperature range, while avoiding damage to the chip and TEC from hard contact. The TEC component, serving as the core for bidirectional temperature control over a wide temperature range, is fixed to the base gel with thermally conductive adhesive. The main control unit switches the current direction to achieve cooling / heating, precisely adapting to high temperatures of 70℃ and low temperatures of -30℃, providing targeted temperature control for the core chip. The finned heatsink has a thermal conductivity of 218 W / (m²). The Al1100 alloy (K) with 1.3mm fin spacing balances heat dissipation area and ventilation, rapidly and evenly distributing TEC heat at the high-temperature end and forming a thermal barrier at the low-temperature end for auxiliary heat preservation. The low-power, silent axial fan is compatible with 5V automotive power supplies, features PWM speed control, and does not operate continuously; it only intervenes in a gradient manner when the TEC hot end temperature rises too high, balancing performance and quietness.

[0044] Optionally, the aforementioned active thermal control device is precisely fixed inside the dashcam housing via an ABS / PC composite bracket and a pre-set mounting slot. The snap-fit ​​connection ensures both ease of assembly and structural stability, allowing for integration without modifying the original structure and guaranteeing the reliability of the air duct and structure over a wide temperature range.

[0045] As an optional implementation method, the above-mentioned active thermal control device's active thermal management method includes: constructing a closed-loop logic of detection, regulation, and feedback; utilizing a collaborative control logic of TEC priority and fan gradient following to achieve adaptive control in three modes across a wide temperature range of -30℃ to 70℃, accurately matching the vehicle operating conditions of the dashcam.

[0046] Optionally, the above-mentioned high-precision NTC sensors, which rely on the built-in thermistor of the SOC and the surface of the PCBA motherboard, synchronously collect the temperature of the SOC chip and DDR. Based on the chip junction temperature, for example, 125℃ for SOC and 105℃ for DDR; and the ambient temperature, such as a high temperature greater than or equal to 40℃ and a low temperature less than or equal to -20℃, the ambient temperature and chip temperature are combined for cross-verification to avoid the occurrence of false triggering by a single temperature control.

[0047] Optionally, the above-mentioned wide-temperature-range three modes include the following: High-temperature mode (≥40℃): TEC cooling is activated first to quickly reduce the chip temperature; the fan does not start temporarily, relying on the heatsink for natural heat dissipation; when the TEC hot-end temperature rises to the threshold, the fan gradually starts from a low speed and increases its speed linearly with the SOC temperature; when the chip temperature drops, the fan speed decreases, achieving coordinated rather than redundant control. In a 70℃ environment, the junction temperature of the SOC and DDR chips can be stabilized at ≤65℃. Low-temperature mode (≤-20℃): TEC reverse current targeted heating can raise the SOC and DDR chips from -30℃ to above 50℃, with the fan adjusted to its maximum speed for rapid chip heating. After the chip temperature exceeds the activation threshold, the TEC and fan stop working; Normal-temperature mode (-20℃-40℃): The fan stops, the TEC operates at low power, and the heat from the hot end is released through the heatsink, achieving zero-noise operation.

[0048] Optionally, Figure 5 This is a thermal simulation result diagram of the high-temperature cooling mode of the wide-temperature-range thermal management method according to the embodiments of this application at 70°C. Figure 6 This is a thermal simulation result diagram of the low-temperature heating mode of the wide-temperature-range thermal management method according to the embodiments of this application at -30℃. Under these two extreme conditions, the overall operating temperature of the dashcam remains stable.

[0049] Furthermore, for other operating conditions, an adaptive algorithm is built-in, employing an intelligent collaborative strategy of TEC-prioritized cooling and fan gradient following. This avoids simultaneous start-stop and redundant control, dynamically adjusting the TEC current (0-3A) and fan speed based on logic to achieve precise temperature control within a ±0.1℃ range. The fan speed is dynamically adjusted according to the TEC hot-end temperature, reducing power consumption and noise while ensuring heat dissipation efficiency. Mode switching is smooth and shock-free, and a sensor fault redundancy mechanism is added to improve stability over a wide temperature range. It should be noted that the algorithm is designed based on the device's hardware characteristics and implemented through specific circuit signal adjustments; this application does not impose further limitations on this aspect.

[0050] In summary, through the above embodiments, the chip-specific thermal conductive gel TEC heatsink fan stacked integrated structure for dashcams effectively solves the industry pain point that traditional general-purpose TEC structures cannot simultaneously meet the requirements of wide temperature range, low power consumption, and quiet operation. Through precise adaptation of the double-layer high thermal conductivity gel with the TEC components, contact thermal resistance is significantly reduced, providing stable hardware support for bidirectional temperature control and filling the technological gap in wide-temperature-range active thermal control devices for dashcams. This method constructs a closed-loop control logic based on dual threshold cross-validation of chip junction temperature and ambient temperature, achieving adaptive switching between three modes: high-temperature cooling, low-temperature heating, and normal-temperature standby. Adopting a TEC-priority, fan gradient-following intelligent collaborative strategy avoids control redundancy, dynamically adjusting the fan speed according to the TEC hot or cold end temperature, effectively balancing heat dissipation efficiency, system power consumption, and operating noise while ensuring precise temperature control within ±0.1 degrees Celsius. The device adopts a modular design and automotive-grade compatibility, directly integrating into existing models through a snap-fit ​​structure without significant modifications to the host structure or power supply system, thus balancing mass production convenience and structural stability. With a dedicated TEC voltage polarity conversion driver and multiple protection circuits, it not only improves the reliability of the system in extreme environments ranging from -30 degrees Celsius to 70 degrees Celsius, but also achieves low power consumption and quiet operation, combining automotive-grade reliability with user experience, and has significant value for mass production.

[0051] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the related technology, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods of the various embodiments of this application.

[0052] This embodiment also provides a thermal control device for implementing the above embodiments and preferred embodiments; details already described will not be repeated. As used below, the term "module" can refer to a combination of software and / or hardware that performs a predetermined function. Although the devices described in the following embodiments are preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0053] Figure 7 This is a structural block diagram of a thermal control device according to an embodiment of this application. The device includes:

[0054] The TEC component 72 is located on the heat-generating chip side of the dashcam and is used to cool and dissipate heat from the heat-generating chip through the cold end of the TEC component, or to heat the heat-generating chip through the hot end of the TEC component.

[0055] The fan assembly 74 is located at the hot end of the TEC assembly and is used for convection cooling of the TEC assembly or for auxiliary heating;

[0056] The main control module 76 is connected to the TEC component 72 and the fan component 74, and is used to determine the target signal for regulating the operating mode of the TEC component and the operating speed of the fan component based on the operating temperature of the heating chip and the ambient temperature of the dashcam.

[0057] The aforementioned device, an active thermal control unit, comprises a TEC (Thermoelectric Cooler) component, a fan component, and a main control module. The TEC component is in close contact with the heat-generating chip, achieving cooling or heating through current polarity switching. The fan component, located at the hot end of the TEC, is responsible for high-temperature heat dissipation or assisting in low-temperature heat diffusion. The main control module monitors the chip temperature and ambient temperature in real time, and based on a dual-threshold verification mechanism, executes a control strategy prioritizing the TEC and following the fan gradient. This technical solution solves the problems of insufficient high-temperature heat dissipation and easy failure during low-temperature startup in dashcams over a wide temperature range. It dynamically adjusts the TEC current to execute the corresponding operating mode and fan speed, achieving precise temperature control while balancing heat dissipation efficiency, power consumption, and noise, ensuring stable operation of the dashcam in an extreme wide temperature range.

[0058] In an exemplary embodiment, the thermal control device further includes a thermally conductive medium assembly, wherein the thermally conductive medium assembly includes at least a first thermally conductive layer and a second thermally conductive layer; the first thermally conductive layer is disposed between the heating chip and the cold end of the TEC assembly; the second thermally conductive layer is disposed between the hot end of the TEC assembly and the fan assembly; wherein the first thermally conductive layer and the second thermally conductive layer are high thermal conductivity gels, and the thickness of the first thermally conductive layer is determined according to the specifications of the heating chip.

[0059] In other words, the thermal control device adds a thermally conductive medium component to optimize the heat conduction path. This component includes two layers of highly thermally conductive gel. The first thermally conductive layer is filled between the heating chip and the cold end of the TEC component, and its thickness is customized according to the specific specifications of the heating chip to ensure tight contact and reduce thermal resistance. The second thermally conductive layer is located between the hot end of the TEC component and the fan component for efficient heat transfer. The two gel layers work together to ensure the bidirectional temperature control stability of the TEC component while effectively adapting to the installation requirements of chips of different specifications.

[0060] In an exemplary embodiment, the thermal control device further includes a TEC drive module connected to the main control module and the TEC component, used to determine the direction and magnitude of the current flowing through the TEC component based on the target signal.

[0061] Optionally, the thermal control device is equipped with a TEC drive module. This module serves as the control hub connecting the main control module and the TEC component. It is responsible for receiving the target signal sent by the main control module and accurately parsing the control command accordingly. It then adjusts the direction and magnitude of the current flowing through the TEC component, switches between cooling and heating modes by changing the polarity of the current, and precisely controls the temperature control intensity by adjusting the current amplitude, thereby achieving dynamic management of the internal temperature of the dashcam.

[0062] In one exemplary embodiment, the thermal control device further includes a temperature monitoring module; wherein the temperature monitoring module includes a thermistor disposed on the heating chip; and a target sensor disposed on the mainboard of the thermal control device; the thermistor is used to collect the operating temperature corresponding to the heating chip, and the target sensor is used to collect the ambient temperature corresponding to the dashcam.

[0063] The thermal control device is equipped with a temperature monitoring module to achieve comprehensive temperature sensing. This module consists of a thermistor integrated on the heating chip and a target sensor arranged on the main board of the thermal control device. The thermistor is specifically responsible for collecting the operating temperature of the heating chip in real time, while the target sensor is used to monitor the ambient temperature of the dashcam. The two work together to provide accurate data support for the thermal management strategy.

[0064] In an exemplary embodiment, the main control module further includes: a judgment unit, configured to determine that the thermal control device executes a high-temperature cooling mode when the ambient temperature is greater than or equal to a first ambient threshold and the operating temperature is close to a preset upper limit of the chip junction temperature; determine that the thermal control device executes a low-temperature heating mode when the ambient temperature is less than or equal to a second ambient threshold; and determine that the thermal control device executes a normal-temperature standby mode when the ambient temperature is less than the first ambient threshold and greater than the second ambient threshold, wherein the first ambient threshold is greater than the second ambient threshold.

[0065] Optionally, the main control module has a built-in judgment unit that automatically selects the thermal control mode based on the dual criteria of ambient temperature and operating temperature: when the ambient temperature reaches or exceeds the first ambient threshold and the chip operating temperature is close to the set upper limit, the system determines to enter the high-temperature cooling mode; when the ambient temperature drops to or falls below the second ambient threshold, the system determines to enter the low-temperature heating mode; and when the ambient temperature is between the first and second thresholds, the system determines to enter the normal temperature standby mode, thereby realizing adaptive thermal management based on temperature zone division.

[0066] In an exemplary embodiment, the main control module further includes: a strategy unit connected to the judgment unit, configured to, when the dashcam is subjected to a high-temperature cooling mode by the thermal control device, instruct the TEC drive module to activate the cooling mode of the TEC component and determine the target operating speed of the fan component based on the hot end temperature of the TEC component; and when the dashcam is subjected to a low-temperature heating mode by the thermal control device, instruct the TEC drive module to activate the heating mode of the TEC component and determine the target operating speed of the fan component based on the cold end temperature of the TEC component.

[0067] In short, the strategy unit and judgment unit of the main control module work together to perform fine-grained control based on the current thermal control mode: in high-temperature cooling mode, the strategy unit instructs the TEC drive module to start the cooling function and dynamically calculates the target fan speed based on the TEC hot end temperature to accelerate heat dissipation; similarly, in low-temperature heating mode, the strategy unit instructs the TEC drive module to start the heating function and determines the target fan speed based on the TEC cold end temperature. Through this feedback adjustment mechanism based on the temperature of key nodes, efficient and stable thermal management effects can be achieved in different temperature zones.

[0068] In an exemplary embodiment, the thermal control device is fixed in a preset mounting slot in the housing of the dashcam by a target structure bracket, and the thermal control device and the preset mounting slot in the housing are combined by a snap-fit ​​connection structure.

[0069] Optionally, the thermal control device adopts a modular design and is securely installed in the pre-set mounting slot of the dashcam housing through a dedicated target structure bracket. The two are quickly assembled and fixed using a snap-fit ​​connection structure. This design not only ensures the structural stability of the device in the vehicle vibration environment, but also achieves the advantage of convenient integration without modifying the original structure, taking into account both mass production assembly efficiency and reliability.

[0070] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above method embodiments when run.

[0071] Optionally, in this embodiment, the storage medium may be configured to store a computer program for performing the following steps:

[0072] S1, obtain the ambient temperature corresponding to the dashcam and the ambient temperature corresponding to the internal heating chip of the dashcam;

[0073] S2, based on the ambient temperature, determine a target signal for regulating the operating mode of the TEC component and the operating speed of the fan component;

[0074] S3, manage the real-time operating status of the thermal control device through the target signal.

[0075] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0076] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0077] Embodiments of this application also provide a computer program product, including a computer program, wherein the computer program, when executed by a processor, performs the steps in any of the above method embodiments.

[0078] Embodiments of this application also provide an electronic device including a memory and a processor, the memory storing a computer program and the processor being configured to run the computer program to perform the steps in any of the above method embodiments.

[0079] Optionally, in this embodiment, the processor can be configured to perform the following steps via a computer program:

[0080] S1, obtain the ambient temperature corresponding to the dashcam and the ambient temperature corresponding to the internal heating chip of the dashcam;

[0081] S2, based on the ambient temperature, determine a target signal for regulating the operating mode of the TEC component and the operating speed of the fan component;

[0082] S3, manage the real-time operating status of the thermal control device through the target signal.

[0083] In one exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0084] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0085] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0086] The above description is only a preferred embodiment of this application. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of this application, and these improvements and modifications should also be considered within the scope of protection of this application.

Claims

1. A thermal control device, characterized in that, include: The TEC component is disposed on the heating chip side of the dashcam and is used to cool and dissipate heat from the heating chip through the cold end of the TEC component, or to heat the heating chip through the hot end of the TEC component. A fan assembly is disposed at the hot end of the TEC assembly and is used to perform convection heat dissipation or auxiliary heating on the TEC assembly; The main control module, connected to the TEC component and the fan component, is used to determine the target signal for regulating the operating mode of the TEC component and the operating speed of the fan component based on the operating temperature of the heating chip and the ambient temperature of the dashcam.

2. The thermal control device according to claim 1, characterized in that, The thermal control device further includes a thermally conductive medium assembly, wherein the thermally conductive medium assembly includes at least a first thermally conductive layer and a second thermally conductive layer; The first thermally conductive layer is disposed between the heating chip and the cold end of the TEC component; The second thermally conductive layer is disposed between the hot end of the TEC component and the fan component; The first and second thermally conductive layers are made of highly thermally conductive gels, and the thickness of the first thermally conductive layer is determined according to the specifications of the heating chip.

3. The thermal control device according to claim 1, characterized in that, The thermal control device also includes: The TEC drive module, connected to the main control module and the TEC component, is used to determine the direction and magnitude of the current flowing through the TEC component based on the target signal.

4. The thermal control device according to claim 1, characterized in that, The thermal control device further includes: Temperature monitoring module; The temperature monitoring module includes: a thermistor disposed on the heating chip; and a target sensor disposed on the motherboard of the thermal control device. The thermistor is used to collect the operating temperature of the heating chip, and the target sensor is used to collect the ambient temperature of the dashcam.

5. The thermal control device according to claim 1, characterized in that, The main control module also includes: The judgment unit is used to determine that the thermal control device executes a high-temperature cooling mode when the ambient temperature is greater than or equal to a first ambient threshold and the operating temperature approaches a preset upper limit of the chip junction temperature. When the ambient temperature is less than or equal to the second ambient threshold, the thermal control device is determined to execute a low-temperature heating mode. When the ambient temperature is less than a first ambient threshold and the ambient temperature is greater than a second ambient threshold, the thermal control device is determined to execute a normal temperature standby mode, wherein the first ambient threshold is greater than the second ambient threshold.

6. The thermal control device according to claim 5, characterized in that, The main control module also includes: The strategy unit, connected to the judgment unit, is used to instruct the TEC drive module to start the cooling mode of the TEC component when the high-temperature cooling mode of the dashcam is executed by the thermal control device, and to determine the target operating speed of the fan component based on the hot end temperature of the TEC component. When the dashcam is in low-temperature heating mode via the thermal control device, the TEC drive module is instructed to activate the heating mode of the TEC component, and the target operating speed of the fan component is determined based on the cold end temperature of the TEC component.

7. The thermal control device according to claim 1, characterized in that, The thermal control device is fixed in the pre-installed mounting slot of the vehicle recorder's housing by a target structure bracket, and the thermal control device and the pre-installed mounting slot of the housing are combined by a snap-fit ​​connection structure.

8. An active thermal management method applied to the thermal control device according to any one of claims 1 to 7, characterized in that, include: The ambient temperature corresponding to the dash cam and the ambient temperature corresponding to the internal heating chip of the dash cam are obtained. Based on the ambient temperature, a target signal is determined for regulating the operating mode of the TEC component and the operating speed of the fan component. The real-time operating status of the thermal control device is managed through the target signal.

9. A dashcam, characterized in that, It includes a body, a camera module, and a thermal control device as described in any one of claims 1 to 7, wherein the thermal control device is disposed within the body and is used for thermal management of the dashcam.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes a stored program, wherein the program, when executed, performs the method of claim 8.

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