Display panel, preparation method thereof and display device

Abstract

The application relates to a display panel, a preparation method thereof and a display device. The display panel is provided with a display area and a non-display area connected with each other, the non-display area comprises a bending area, the preparation method comprises the following steps: providing a substrate; forming an inorganic material layer on the substrate; performing a patterning treatment on the inorganic material layer to form an inorganic layer, the inorganic layer comprises a first inorganic part formed in the display area and a plurality of second inorganic parts arranged at intervals and formed in the bending area; and forming a first organic layer covering the first inorganic part, the plurality of second inorganic parts and the substrate. The display panel, the preparation method thereof and the display device effectively reduce the influence of the bending area on the performance of the display area close to the bending area during the bending process, improve the product edge brightness and service life, and improve the flexibility and reliability of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] In the manufacturing process of display panels, handling the bending area is a key technical challenge.

[0003] Due to process requirements, brittle inorganic materials are typically removed from the bending area. In the manufacturing process, because of the full-surface film deposition characteristic of displays, a large area of ​​the inorganic layer is removed from the bending area after exposure and etching. Therefore, in the same inorganic material exposure and etching process, the actual remaining volume of inorganic material near the display area is less than ideal, resulting in larger apertures in the punched holes. This sometimes necessitates sacrificing display panel lifespan, brightness, and other specifications, leading to a decrease in product market competitiveness. Summary of the Invention

[0004] Therefore, it is necessary to provide a display panel and its manufacturing method, as well as a display device, to address the problem that in existing technologies, the inorganic layer in the bending area is largely removed after exposure and etching, resulting in a large aperture in the hole structure, which sometimes requires sacrificing the lifespan and brightness of the display panel.

[0005] To achieve the above objectives, this application provides a method for manufacturing a display panel, wherein the display panel has a connected display area and a non-display area, the non-display area including a bending area, and the manufacturing method includes:

[0006] Provide a base;

[0007] An inorganic material layer is formed on the substrate;

[0008] The inorganic material layer is patterned to form an inorganic layer, the inorganic layer including a first inorganic portion formed in the display area and a plurality of second inorganic portions arranged at intervals in the bending area;

[0009] A first organic layer is formed covering the first inorganic portion, the plurality of second inorganic portions, and the substrate.

[0010] In one embodiment, the substrate includes a substrate and a second organic layer located on the substrate, wherein the inorganic material layer is formed at least within the bending region on the side of the second organic layer away from the substrate;

[0011] Optionally, the substrate further includes an insulating layer, a third organic layer, and a conductive layer, wherein the insulating layer, the third organic layer, the conductive layer, and the second organic layer are sequentially stacked on the substrate in the bending region.

[0012] Secondly, this application provides a display panel having a connected display area and a non-display area, wherein the non-display area includes a bent area, and the display panel includes:

[0013] Base;

[0014] An inorganic layer, located on the substrate, includes a first inorganic portion and a plurality of second inorganic portions arranged at intervals, wherein the first inorganic portion is located in the display area and the plurality of second inorganic portions are located in the bending area;

[0015] A first organic layer covers the first inorganic portion, the plurality of second inorganic portions, and the substrate.

[0016] In one embodiment, the substrate includes a substrate and a second organic layer located on the substrate, wherein the plurality of second inorganic portions are formed at least in the bending region on the side of the second organic layer away from the substrate;

[0017] Optionally, the substrate further includes an insulating layer, a third organic layer, and a conductive layer, wherein the insulating layer, the third organic layer, the conductive layer, and the second organic layer are sequentially stacked on the substrate in the bending region.

[0018] In one embodiment, the plurality of second inorganic parts are arranged along a first direction and extend along a second direction, the first direction being parallel to the bending direction of the bending region, and the second direction intersecting the first direction;

[0019] Optionally, the second direction is perpendicular to the first direction;

[0020] Optionally, the second inorganic part is strip-shaped.

[0021] In one embodiment, the plurality of second inorganic parts are spaced apart from the first inorganic part;

[0022] Optionally, the plurality of second inorganic parts are arranged in an array;

[0023] Optionally, the second inorganic part is block-shaped.

[0024] In one embodiment, the display panel includes an encapsulation layer comprising alternating inorganic and organic encapsulation layers, wherein the inorganic layer includes at least one of the inorganic encapsulation layers.

[0025] In one embodiment, the display panel includes at least two of the inorganic layers;

[0026] The plurality of second inorganic parts in each inorganic layer located in the bending region are arranged opposite each other on the substrate by orthogonal projection.

[0027] In one embodiment, the display panel includes at least two of the inorganic layers;

[0028] The plurality of second inorganic portions in the inorganic layers of the adjacent layers located in the bending region are arranged with their orthogonal projections on the substrate staggered.

[0029] Thirdly, this application provides a display device including a display panel as described in any of the preceding claims.

[0030] The aforementioned display panel, its manufacturing method, and display device, through patterning the inorganic material layer, simultaneously form a first inorganic portion in the display area and multiple spaced-apart second inorganic portions in the bending area. This avoids over-etching of the first inorganic portion in the display area near the bending area during the process of removing the inorganic layer in a large area of ​​the bending area, effectively reducing the impact on the performance of the display area near the bending area and improving the edge brightness and lifespan of the product. Simultaneously, the spaced-apart second inorganic portions effectively alleviate cracking and warping problems caused by mechanical stress during bending, improving the flexibility and reliability of the display panel. By forming a first organic layer above the inorganic layer, the combination of the inorganic layer and the first organic layer not only provides good mechanical properties but also enhances encapsulation reliability. Specifically, the first organic layer located in the bending area fills the gaps between the second inorganic portions and covers the second inorganic portions, improving the overall uniformity and flexibility of the bending area while enhancing the protection of the second inorganic portions from external mechanical damage. Furthermore, the display panel manufactured using the above-mentioned method can meet the design requirements of display devices with high reliability and flexibility, and has a wide range of applications. Attached Figure Description

[0031] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a flowchart of a method for manufacturing a display panel provided in one embodiment;

[0033] Figure 2 This is a schematic diagram of the front cross-sectional structure of a display panel provided in one embodiment;

[0034] Figure 3 This is a schematic diagram of a front cross-sectional structure of the bending area of ​​a display panel provided in one embodiment;

[0035] Figure 4This is a top view cross-sectional structural diagram of the bending area of ​​a display panel provided in one embodiment;

[0036] Figure 5 This is a schematic diagram of another front cross-sectional structure of the bending area of ​​the display panel provided in one embodiment;

[0037] Figure 6 This is a schematic diagram of another top view cross-sectional structure of the bending area of ​​the display panel provided in one embodiment.

[0038] Explanation of reference numerals in the attached figures:

[0039] 100-Display area, 200-Non-display area, 201-Bending area, 1-Substrate, 11-Substrate, 12-Second organic layer, 13-Insulating layer, 14-Third organic layer, 15-Conductive layer, 16-Driving circuit layer, 17-Light-emitting functional layer, 18-Encapsulation layer, 2-Inorganic layer, 21-First inorganic part, 22-Second inorganic part, 3-First organic layer. Detailed Implementation

[0040] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate embodiments of the present application. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0041] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0042] It should be understood that when a component or layer is referred to as being "on," "adjacent to," "connected to," or "coupled to" other components or layers, it may be directly on, adjacent to, connected to, or coupled to other components or layers, or there may be intervening components or layers. Conversely, when a component is referred to as being "directly on," "directly adjacent to," "directly connected to," or "directly coupled to" other components or layers, there are no intervening components or layers.

[0043] Spatial relation terms such as “below,” “under,” “below,” “under,” “above,” “above,” etc., are used herein to describe the relationship between one element or feature shown in the figure and other elements or features. It should be understood that, in addition to the orientation shown in the figure, spatial relation terms also include different orientations of the device in use and operation. For example, if the device in the figure is flipped, the element or feature described as “below,” “under,” or “below” will be oriented “above” the other element or feature. Therefore, the exemplary terms “below” and “under” can include both above and below orientations. Furthermore, the device may also include other orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptive terms used herein will be interpreted accordingly.

[0044] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, in this specification, the term “and / or” includes any and all combinations of the associated listed items.

[0045] Please see Figure 1 This application provides a method for manufacturing a display panel. The display panel has a connected display area 100 and a non-display area 200. The non-display area 200 includes a bending area 201. The manufacturing method includes:

[0046] S1: Provides substrate 1;

[0047] S2: An inorganic material layer (not shown) is formed on substrate 1.

[0048] S3: The inorganic material layer is patterned to form an inorganic layer 2, which includes a first inorganic portion 21 formed in the display area and a plurality of second inorganic portions 22 arranged at intervals in the bending area 201.

[0049] S4: Form a first organic layer 3 covering the first inorganic part 21, a plurality of second inorganic parts 22 and the substrate 1.

[0050] In the above example, by patterning the inorganic material layer, while forming the first inorganic portion 21 located in the display area 100, multiple spaced-apart second inorganic portions 22 are formed within the bending area 201. This avoids over-etching of the first inorganic portion 21 near the bending area 201 during the process of removing the inorganic layer 2 from the bending area 201 over a large area, effectively reducing the impact on the performance of the display area 100 near the bending area 201 and improving the edge brightness and lifespan of the product. Simultaneously, the spaced-apart second inorganic portions 22 effectively alleviate cracking and warping problems caused by mechanical stress in the bending area 201, improving the flexibility and reliability of the display panel. Furthermore, by forming a first organic layer 3 above the inorganic layer 2, the combination of the inorganic layer 2 and the first organic layer 3 not only provides good mechanical properties but also enhances the reliability of the encapsulation. The first organic layer 3 located in the bending area 201 fills the gap between the second inorganic parts 22 and covers the second inorganic parts 22, which improves the overall uniformity and flexibility of the bending area 201, while enhancing the protection of the second inorganic parts 22 and preventing them from being damaged by external mechanical forces.

[0051] Specifically, steps S1 to S2 are performed to provide a substrate 1 and form an inorganic material layer on the substrate 1.

[0052] In some embodiments, the substrate 1 includes a substrate 11 and a second organic layer 12 located on the substrate 11.

[0053] At this time, in step S2, the inorganic material layer is formed at least in the bending region 201 on the side of the second organic layer 12 away from the substrate 11.

[0054] The substrate 11 is a flexible substrate with good flexibility and mechanical properties. The substrate 11 is used to provide strength support for the upper structure of the display panel and can also adapt to deformation during bending, reducing the damage to the upper structure caused by the stress generated by bending.

[0055] For example, methods for forming an inorganic material layer include chemical vapor deposition or other suitable methods, and the material of the inorganic material layer includes SiO2. x (x>0), SiN x (x>0) or other suitable materials.

[0056] Optionally, the substrate 1 further includes an insulating layer 13, a third organic layer 14, and a conductive layer 15. In the bending region 201, the substrate 1 includes an insulating layer 13, a third organic layer 14, a conductive layer 15, and a second organic layer 12 stacked sequentially on the substrate 11.

[0057] Optionally, the substrate 1 located in the display area 100 also includes a driving circuit layer 16, a light-emitting functional layer 17, and an encapsulation layer 18.

[0058] The driving circuit layer 16 includes a metal layer, an interlayer insulating layer, and an organic planarization layer. The metal layer is used to form conductive paths in the circuit, connect the electrodes of each pixel unit, and realize the transmission of electrical signals; the interlayer insulating layer is used to insulate between adjacent metal layers to prevent electrical short circuits, and the interlayer insulating layer is generally made of inorganic insulating materials such as silicon dioxide and silicon nitride; the organic planarization layer is used to planarize the driving circuit layer so that the light-emitting functional layer 17 can be formed on a flat surface to ensure the light-emitting performance of the display panel.

[0059] The light-emitting functional layer 17 includes an organic light-emitting layer and a pixel definition layer. The organic light-emitting layer is used to realize electroluminescence and is the core light-emitting area of ​​the display panel. The main function of the pixel definition layer is to isolate pixel units, limit the distribution of pixels, and prevent color mixing and electrical crosstalk between adjacent pixels. The pixel definition layer may contain an inorganic layer for further optimization of optical performance.

[0060] The encapsulation layer 18 comprises an inorganic encapsulation layer and an organic encapsulation layer stacked sequentially. The inorganic encapsulation layer has excellent water vapor and oxygen barrier properties, which can effectively prevent external water vapor and oxygen from penetrating into the organic light-emitting layer, thereby protecting the organic material from oxidation and hydrolysis. The organic encapsulation layer can compensate for the stress problem of the inorganic encapsulation layer, while providing good film formation and planarization effects, further enhancing the overall performance of the encapsulation layer 18.

[0061] Specifically, step S3 is performed to pattern the inorganic material layer to form an inorganic layer 2. The inorganic layer 2 includes a first inorganic portion 21 formed in the display area 100 and a plurality of second inorganic portions 22 arranged at intervals in the bending area 201.

[0062] Patterning an inorganic material layer to form an inorganic layer 2 includes: uniformly coating a photoresist (not shown) onto the inorganic material layer; exposing the photoresist; developing the exposed photoresist; etching the inorganic material layer based on the developed photoresist; and removing the photoresist.

[0063] The methods for etching inorganic material layers based on developed photoresist include wet etching, dry etching, or other suitable methods. It should be noted that the steps of forming and developing the photoresist described above are conventional techniques and will not be elaborated upon further.

[0064] Furthermore, by directly patterning the inorganic material layers to obtain the first inorganic portion 21 located in the display area 100 and multiple spaced second inorganic portions 22 located in the bending area 201, the resulting display panel has the second inorganic portion 22 in each inorganic layer 2 in the bending area 201 on the same layer as each first inorganic portion 21 in the display area 100. This maintains the material consistency between the bending area 201 and the display area 100, simplifies the manufacturing process, and improves product consistency and process controllability. Moreover, the design using the same material helps optimize the matching of thermal expansion coefficients, reducing the impact of thermal stress on the performance of the bending area 201.

[0065] Please refer to step S4 for details. Figure 2 A first organic layer 3 is formed covering the first inorganic part 21, a plurality of second inorganic parts 22 and the substrate 1.

[0066] For example, the method of forming the first organic layer 3 includes coating, spin coating or other suitable methods, wherein the formed first organic layer 3 fills the gaps of the second inorganic portion 22 and covers the second inorganic portion 22, improving the overall uniformity and flexibility of the bending area 201, while enhancing the protection of the second inorganic portion 22 and preventing it from being damaged by external mechanical forces.

[0067] For example, please refer to Figure 2 The inorganic layer 2 includes at least one inorganic encapsulation layer in the encapsulation layer 18, and the first organic layer 3 includes at least one organic encapsulation layer in the encapsulation layer 18. During the formation process, at least one interlayer insulating layer in the driving circuit layer 16 extends to the bending region 201 to serve as an insulating layer 13, at least one organic planarization layer in the driving circuit layer 16 extends to the bending region 201 to serve as a third organic layer 14 and a second organic layer 12, and at least one metal layer in the driving circuit layer 16 extends to the bending region 201 to serve as a conductive layer 15.

[0068] For example, the inorganic layer 2 includes at least one inorganic encapsulation layer in the pixel definition layer of the light-emitting functional layer 17 and / or the encapsulation layer 18, and the first organic layer 3 includes at least one organic encapsulation layer in the encapsulation layer 18. During the formation process, at least one interlayer insulating layer in the driving circuit layer 16 extends to the bending region 201 to serve as an insulating layer 13, at least one organic planarization layer in the driving circuit layer 16 extends to the bending region 201 to serve as a third organic layer 14 and a second organic layer 12, and at least one metal layer in the driving circuit layer 16 extends to the bending region 201 to serve as a conductive layer 15.

[0069] In some embodiments, please refer to Figure 2This application also provides a display panel having a connected display area 100 and a non-display area 200. The non-display area 200 includes a bending area 201. The display panel includes: a substrate 1, an inorganic layer 2, and a first organic layer 3. The inorganic layer 2 is located on the substrate 1 and includes a first inorganic part 21 and a plurality of second inorganic parts 22 arranged at intervals. The first inorganic part 21 is located in the display area 100, and the plurality of second inorganic parts 22 are located in the bending area 201. The first organic layer 3 covers the first inorganic part 21, the plurality of second inorganic parts 22, and the substrate 1.

[0070] The aforementioned display panel, by designing multiple spaced-apart second inorganic portions 22 in the bending region 201 and filling the gaps between the second inorganic portions 22 with a first organic layer 3 covering the second inorganic portions 22, avoids over-etching of the first inorganic portion 21 of the display area 100 near the bending region 201 during the process of removing the inorganic layer 2 over a large area of ​​the bending region 201. This effectively reduces the impact on the performance of the display area 100 near the bending region 201, improving the edge brightness and lifespan of the product. Simultaneously, the spaced-apart second inorganic portions 22 effectively alleviate cracking and warping problems caused by mechanical stress in the bending region 201, improving the flexibility of the display panel and enabling it to withstand higher mechanical stress in the bending region 201, meeting the design requirements of the display device. Furthermore, the reliable encapsulation of the display panel enhances its moisture and oxygen resistance, effectively extending its lifespan.

[0071] In some embodiments, the substrate 1 includes a substrate 11 and a second organic layer 12 located on the substrate 11, wherein a plurality of second inorganic portions 22 are located at least within the bending region 201 on the side of the second organic layer 12 away from the substrate 11.

[0072] Optionally, the substrate 1 further includes an insulating layer 13, a third organic layer 14, and a conductive layer 15. In the bending region 201, the substrate 1 includes an insulating layer 13, a third organic layer 14, a conductive layer 15, and a second organic layer 12 stacked sequentially on the substrate 11.

[0073] Optionally, the substrate 1 located in the display area 100 further includes a driving circuit layer 16, a light-emitting functional layer 17, and an encapsulation layer 18. The driving circuit layer 16 includes a metal layer, an interlayer insulating layer, and an organic planarization layer. The light-emitting functional layer 17 includes an organic light-emitting layer and a pixel definition layer. The encapsulation layer 18 includes alternating inorganic and organic encapsulation layers.

[0074] For example, please refer to Figure 2The inorganic layer 2 includes at least one inorganic encapsulation layer in the encapsulation layer 18, and the first organic layer 3 includes at least one organic encapsulation layer in the encapsulation layer 18. At this time, the insulating layer 13 includes at least one interlayer insulating layer in the driving circuit layer 16, the third organic layer 14 and the second organic layer 12 include at least one organic planarization layer in the driving circuit layer 16, and the conductive layer 15 includes at least one metal layer in the driving circuit layer 16.

[0075] For example, the inorganic layer 2 includes at least one inorganic encapsulation layer in the pixel definition layer of the light-emitting functional layer 17 and / or the encapsulation layer 18, and the first organic layer 3 includes at least one organic encapsulation layer in the encapsulation layer 18. In this case, the insulating layer 13 includes at least one interlayer insulating layer in the driving circuit layer 16, the third organic layer 14 and the second organic layer 12 include at least one organic planarization layer in the driving circuit layer 16, and the conductive layer 15 includes at least one metal layer in the driving circuit layer 16. That is, the inorganic layer 2 and the first organic layer 3 are formed through different structural definitions in the display area 100, and their layout and structural design can be customized according to actual conditions.

[0076] In some embodiments, please refer to Figure 2 Multiple second inorganic parts 22 are spaced apart from the first inorganic part 21; this avoids the bending cracks of the second inorganic parts 22 extending to the display area 100 area during bending, thereby affecting the performance of the display area 100.

[0077] Optionally, please refer to Figures 3 to 4 Multiple second inorganic parts 22 are arranged in an array on a plane parallel to the substrate 1, and the second inorganic parts 22 are block-shaped. The regularly arranged multiple second inorganic parts 22 can uniformly distribute mechanical stress within the bending region 201, further reducing the risk of uneven stress in the bending region 201 and enhancing the flexibility and durability of the bending region 201. Among them, the block-shaped second inorganic parts 22 have a relatively simple design. While satisfying the stress dispersion requirement, they are easy to manufacture and reduce manufacturing costs. The orthographic projection size of the block-shaped second inorganic parts 22 on the substrate 1 is 3μm*3μm, and the spacing between adjacent second inorganic parts 22 is equal. In this embodiment, the spacing between adjacent second inorganic parts 22 is 10μm.

[0078] In some embodiments, please refer to Figures 5 to 6Multiple second inorganic portions 22 are arranged along a first direction and extend along a second direction. The first direction is parallel to the bending direction of the bending region 201, and the second direction intersects the first direction. Optionally, the second direction is perpendicular to the first direction. Optionally, the shape of the second inorganic portion 22 is strip-shaped. The above-described structural design of the second inorganic portion 22 can optimize the mechanical properties of the bending region 201 to the greatest extent and further improve the stability of the display panel during bending. Moreover, under specific bending requirements, the strip-shaped design is more suitable for meeting the requirements of bending durability.

[0079] In some embodiments, the orthographic projections of a plurality of second inorganic parts 22 in each inorganic layer 2 of the bending region 201 onto the substrate 1 are arranged opposite each other, which ensures the stability of the bending region 201 structure and further optimizes mechanical strength and reliability.

[0080] In other embodiments, the orthographic projections of multiple second inorganic portions 22 in each inorganic layer 2 of the bending region 201 onto the substrate 1 are staggered. This staggered arrangement better disperses mechanical stress, allowing the bending region 201 to exhibit superior flexibility during bending, further improving the lifespan and reliability of the display panel.

[0081] Furthermore, in some embodiments, when the inorganic layer 2 and the first organic layer 3 serve as the encapsulation layer 18, the display panel includes at least two inorganic layers 2. This multi-layered design of inorganic layers 2 and the first organic layer 3 significantly improves encapsulation performance, enhances the protective performance of the display panel, and extends device lifespan. The multi-layered structure provides additional buffering, further disperses mechanical stress, optimizes the performance of the bending region 201, and improves the mechanical stability of the display panel.

[0082] This application also provides a display device, including the display panel as described above.

[0083] Using the aforementioned display panel enables the design of display devices that meet the requirements of high reliability and flexibility. Furthermore, the optimized bending area design significantly improves the actual performance and user experience of the device. The display panel can be applied to the following display devices: electronic paper, mobile phones, tablets, televisions, laptops, digital photo frames, navigators, and any other products or components with display functions.

[0084] In the description of this specification, references to terms such as "some embodiments," "other embodiments," and "ideal embodiments" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative descriptions of the above terms do not necessarily refer to the same embodiments or examples.

[0085] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features of the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0086] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for manufacturing a display panel, characterized in that, The display panel has a connected display area and a non-display area, the non-display area including a bending area, and the manufacturing method includes: Provide a base; An inorganic material layer is formed on the substrate; The inorganic material layer is patterned to form an inorganic layer, the inorganic layer including a first inorganic portion formed in the display area and a plurality of second inorganic portions arranged at intervals in the bending area; A first organic layer is formed covering the first inorganic portion, the plurality of second inorganic portions, and the substrate.

2. The method for manufacturing a display panel according to claim 1, characterized in that, The substrate includes a substrate and a second organic layer located on the substrate, wherein the inorganic material layer is formed at least in the bending region on the side of the second organic layer away from the substrate; Optionally, the substrate further includes an insulating layer, a third organic layer, and a conductive layer, wherein the insulating layer, the third organic layer, the conductive layer, and the second organic layer are sequentially stacked on the substrate in the bending region.

3. A display panel, characterized in that, The display panel has a connected display area and a non-display area, the non-display area including a bent area, and the display panel includes: Base; An inorganic layer, located on the substrate, includes a first inorganic portion and a plurality of second inorganic portions arranged at intervals, wherein the first inorganic portion is located in the display area and the plurality of second inorganic portions are located in the bending area; A first organic layer covers the first inorganic portion, the plurality of second inorganic portions, and the substrate.

4. The display panel according to claim 3, characterized in that, The substrate includes a substrate and a second organic layer located on the substrate, wherein the plurality of second inorganic portions are located at least on the side of the second organic layer away from the substrate in the bending region; Optionally, the substrate further includes an insulating layer, a third organic layer, and a conductive layer, wherein the insulating layer, the third organic layer, the conductive layer, and the second organic layer are sequentially stacked on the substrate in the bending region.

5. The display panel according to claim 3, characterized in that, The plurality of second inorganic parts are arranged along a first direction and extend along a second direction, wherein the first direction is parallel to the bending direction of the bending region and the second direction intersects the first direction; Optionally, the second direction is perpendicular to the first direction; Optionally, the second inorganic part is strip-shaped.

6. The display panel according to claim 3, characterized in that, The plurality of second inorganic parts are spaced apart from the first inorganic part; Optionally, the plurality of second inorganic parts are arranged in an array; Optionally, the second inorganic part is block-shaped.

7. The display panel according to claim 3, characterized in that, The display panel includes an encapsulation layer, which includes alternating inorganic encapsulation layers and organic encapsulation layers. The inorganic layer includes at least one of the inorganic encapsulation layers.

8. The display panel according to claim 3, characterized in that, The display panel includes at least two of the inorganic layers; The plurality of second inorganic parts in each inorganic layer located in the bending region are arranged opposite each other on the substrate by orthogonal projection.

9. The display panel according to claim 3, characterized in that, The display panel includes at least two of the inorganic layers; The plurality of second inorganic portions in the inorganic layers of the adjacent layers located in the bending region are arranged with their orthogonal projections on the substrate staggered.

10. A display device, characterized in that, Includes the display panel as described in any one of claims 3 to 9.

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