Universal assembly compatible with wafer and tray

Abstract

The application discloses a universal assembly compatible with wafer and tray, and belongs to the technical field of semiconductor chip mounting equipment, which comprises a bearing main body; a plurality of positioning modules are arranged on the bearing main body and used for loading a plurality of trays; the positioning module comprises a guide limiting mechanism used for guiding the positioning of the tray and a positioning mechanism used for fixing the position of the tray on the bearing main body. A plurality of positioning modules are arranged on the bearing main body, the positioning module can load the tray, the mounting reference part of the bearing main body is adapted to the bearing station in the magazine used for bearing the wafer, so that the chip tray structure in the form of the tray can also be adapted to the equipment used for the chip bearing structure in the form of the wafer, the same wafer table assembly can be compatible with the wafer bearing form and the tray bearing form, the line changing cost is reduced, and multi-working-condition compatibility is realized.

Description

Technical Field

[0001] This invention relates to the field of semiconductor chip mounting equipment technology, and more specifically to a universal component compatible with wafers and trays. Background Technology

[0002] In the manufacturing process, chips typically circulate in two forms: such as Figure 7 The wafer shown is a wafer that has been cut into several chips, which are arranged in a matrix within the effective area of ​​the wafer (common sizes are 12 inches, 8 inches, and 6 inches); for example... Figure 8 The tray (chip tray) format shown depicts multiple chips placed one by one in the tray's recesses. In existing equipment, the tray and wafer are independent of each other, requiring the replacement of special fixtures for adaptation. This results in poor equipment compatibility, long changeover times, high fixture costs, and repeated replacements can affect positioning accuracy and even cause wafer damage. Summary of the Invention

[0003] To address the aforementioned technical shortcomings, the purpose of this invention is to provide a universal component compatible with both wafers and trays. Through modular and multi-station integrated design, it enables universal support and rapid switching between the two material forms of wafers and trays.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: The present invention provides a universal component compatible with both wafers and trays, comprising: The carrier body has a mounting reference part, which is used to adapt the carrier body to the carrier station in the material box for carrying the wafer; Multiple positioning modules are mounted on the supporting body for mounting multiple tray disks; The positioning module includes a guide limiting mechanism for guiding the positioning of the tray and a positioning mechanism for fixing the position of the tray on the carrier body; the carrier body can load multiple trays through multiple positioning modules and share the same wafer stage assembly as the wafer.

[0005] Preferably, the guide limiting mechanism includes multiple guide blocks disposed on the support body, the spacing between two adjacent guide blocks is adapted to the width of the tray, and multiple baffles for blocking the tray are disposed on the support body at one end of the guide block.

[0006] Preferably, the positioning mechanism includes a plurality of flexible springs fixed on the guide block, the flexible springs being used to elastically press the edge of the tray.

[0007] Preferably, the flexible spring includes a fixing part and pressing parts symmetrically arranged at both ends of the fixing part, and the pressing part has a raised section at the end away from the fixing part.

[0008] Preferably, a clearance hole is provided in the middle of the bearing body, a base plate corresponding to the clearance hole is fixed on the bearing body, and an adjustment structure for adjusting the position of the stop shaft and guide block is provided on the bearing body and the base plate.

[0009] Preferably, the adjustment structure includes multiple sets of first positioning holes on the supporting body and multiple sets of second positioning holes on the base plate. The position of the stop shaft is adjusted by changing its alignment with the first positioning holes; the position of the guide block is adjusted by changing its alignment with the second positioning holes.

[0010] Preferably, the carrier body is adapted to the wafer stage assembly, the wafer stage assembly comprising: The lifting platform is mounted on the frame. The rotary platform is mounted on the lifting platform via a rotating assembly. The lifting platform is provided with a feeding track for guiding the carrier body on the side near the feeding area; the rotary platform is provided with a wafer track for guiding the carrier body and a limiting block for limiting the position; the rotary platform is provided with a wafer pressure plate and a top ring for constraining the carrier body from the upper and lower sides respectively.

[0011] Preferably, the frame is provided with a gripper assembly, and the carrier body is provided with a clamping part adapted to the gripper assembly. The gripper assembly is used to grab the carrier body from the material box and transfer it to the wafer track.

[0012] Preferably, the lifting platform is equipped with a material receiving sensor for detecting whether the material is in place; a flexible pressure strip is fixed to the bottom surface of the wafer pressure plate.

[0013] Preferably, the outer contour shape and size of the mounting reference portion match the outer contour shape and size of the wafer frame used to carry the wafer.

[0014] The beneficial effects of this invention are as follows: The carrier body of the present invention is provided with multiple positioning modules, and the positioning modules can load trays. At the same time, the mounting base of the carrier body is adapted to the carrier station in the material box used to carry the wafer, so that the chip tray structure in the form of tray can also be adapted to the equipment used for the chip carrier structure in the form of wafer. The same wafer stage assembly can be compatible with both wafer carrier form and tray carrier form, thereby reducing the cost of line changeover and achieving multi-condition compatibility.

[0015] The positioning module of this invention can guide the tray, such as a waffle box, to slide in quickly through multiple guide blocks and be precisely limited by the stop shaft after it is in place. The flexible spring can gently press the tray to avoid damage to the tray caused by rigid compression. The installation is stable and avoids chip jumping or popping out, which would cause damage.

[0016] The present invention features an adjustment structure that allows for changes in the installation positions of the guide block and the stop shaft, thereby altering the specifications of the compatible tray and enabling the component to adapt to a wider range of working conditions while reducing the number of specialized fixtures required. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the overall structure of a universal component compatible with both wafers and trays, provided as an embodiment of the present invention.

[0019] Figure 2 This is a perspective view of the rear of the tray support body in an embodiment of the present invention.

[0020] Figure 3 This is a front perspective view of the Tray disk after it has been installed on the carrier body in an embodiment of the present invention.

[0021] Figure 4 This is a schematic diagram of the Tray disk being slidably installed into the positioning module in an embodiment of the present invention.

[0022] Figure 5 This is a schematic diagram illustrating the installation of trays of different sizes in an embodiment of the present invention.

[0023] Figure 6 This is a partial perspective view of the flexible spring sheet and guide block cooperating in an embodiment of the present invention.

[0024] Figure 7 This is a schematic diagram of the overall structure of a wafer in the prior art.

[0025] Figure 8 This is a schematic diagram of the installation of a chip on a single Tray disk in the prior art.

[0026] Figure 9 This is a perspective view of the wafer stage assembly in an embodiment of the present invention.

[0027] Figure 10This is a top view of the wafer stage assembly in an embodiment of the present invention.

[0028] Figure 11 This is a schematic diagram illustrating the assembly of the material box, wafer stage assembly, and tray in an embodiment of the present invention.

[0029] Explanation of reference numerals in the attached figures: 1. Material box; 2. Wafer stage assembly; 3. Gripper assembly; 4. Support body; 5. Base plate; 6. Guide block; 7. First flexible spring; 8. Second flexible spring; 9. Stop shaft; 10. Waffle box / Tray; 11. Feed track; 12. Wafer pressure plate; 13. Incoming material sensor; 14. Top ring; 15. Lifting screw; 16. Rotating assembly; 17. Rotating lever; 18. Limit block; 19. Wafer track; 20. Flexible pressure strip; 21. Foolproof arrow; 22. Chip; 23. Fixing part; 24. Pressing part. Detailed Implementation

[0030] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0031] Example 1: like Figures 1 to 11 As shown, this embodiment of the invention provides a universal component compatible with both wafers and trays. The core design is a universal carrier body 4. The carrier body 4 itself is not specific to any particular material form; rather, its edge mounting reference portion is perfectly adapted to the carrier station within the original material box 1 used to carry wafers. This means that when the carrier body 4 enters the material box 1, it occupies a space similar to the original wafer frame, and is recognized and supported by the material box 1 using similar station logic. This allows for seamless switching between the two material forms without altering other equipment mechanisms or replacing the material box 1. Since trays also come in various forms, this invention uses the waffle box 10 as an example.

[0032] like Figures 2 to 6As shown, multiple positioning modules are installed on the carrier body 4. Each positioning module is used to load one or more trays, allowing a single carrier body 4 to carry multiple trays into the workflow simultaneously. Each positioning module contains two mechanisms: a guide and limit mechanism and a positioning mechanism. These two mechanisms work together to guide the tray from initial insertion to precise fixation. The guide and limit mechanism includes guide blocks 6 for initial guidance and a stop shaft 9 for final blocking. When the operator pushes the tray along the plane of the carrier body 4, the channel formed by two adjacent guide blocks 6 restricts the lateral movement freedom of the tray, allowing it to slide only longitudinally along the guide blocks 6, eliminating the skewed placement problem common during manual placement. When the tray slides to the predetermined position, the stop shaft 9 fixed on the carrier body 4 intercepts the end of the tray from the front, forming a rigid limit. Since the longitudinal length of guide block 6 is greater than the length of a single tray, only the foremost tray needs to rest against the stop shaft 9, and subsequent trays can rest against the tail of the previous tray. Meanwhile, a foolproof arrow 21 is provided on guide block 6, allowing the user to slide the waffle box 10 in the direction indicated by the foolproof arrow 21.

[0033] The positioning mechanism consists of multiple flexible springs. These springs are fixedly mounted on guide blocks 6. After the tray slides into place, the elastic pressure of the springs is applied to the edge of the tray, stably pressing it against the plane of the support body 4. The flexible springs provide sufficient clamping force to prevent the tray from shifting during movement, while avoiding the warping or deformation of the tray or abnormal impact on the chip 22 caused by excessive compression, unlike rigid clamps. Since multiple flexible springs are fixed on the guide blocks 6 on both sides of the tray, multi-point flexible clamping is formed at different edge positions of the tray, further ensuring a flat and secure fit of the tray on the support body 4 and preventing the chip 22 from jumping or popping out due to vibration.

[0034] like Figure 3As shown, the flexible spring can be divided into a first flexible spring 7 and a second flexible spring 8. The first flexible spring 7 is fixed to the two outermost guide blocks 6, while the second flexible spring 8 is located on the inner guide block 6. Since the outermost guide block 6 has a tray on only one side, the first flexible spring 7 includes a fixing part 23 fixed to the guide block 6 and two pressing parts 24 located at both ends of the fixing part 23. The pressing part 24 has a raised section at the end away from the fixing part 23. When the tray slides in along the guide block 6, the raised section contacts the edge of the tray and naturally lifts up, so that the pressing part 24 presses against the edge of the tray. Since the inner guide block 6 has trays on both sides, the second flexible spring 8 includes a fixing part 23 fixed to the guide block 6 and four pressing parts 24. The four pressing parts 24 are distributed in pairs at both ends of the fixing part 23 and in pairs on both sides of the guide block 6.

[0035] The carrier body 4, which carries multiple trays, has a mounting base that is perfectly compatible with the carrier station inside the material box 1. After the entire assembly enters the material box 1, the wafer stage assembly 2 performs transfer and positioning operations on it using the same action logic as when processing wafers. In this way, wafer-type and tray-type chips 22 share the same wafer stage assembly 2, eliminating the need to replace any hardware during line changes, greatly reducing line change costs, and eliminating the risk of inconsistent positioning caused by frequent disassembly and assembly.

[0036] Example 2: This embodiment, based on the basic scheme of Embodiment 1, focuses on explaining the specific implementation of the guide limiting mechanism and the adjustment structure.

[0037] The industry specifications for trays are not standardized, and trays from different batches and with different packaging types often differ in size. If a universal component can only accommodate trays of a fixed size, then the support fixture must be replaced every time a new specification is introduced, which contradicts the compatibility principle of this invention. Therefore, this embodiment features a clearance hole in the center of the support body 4, and also provides multiple oblong holes on the support body 4. A base plate 5 is fixed to these oblong holes with bolts, allowing for fine-tuning of the base plate 5's position on the support body 4 using the oblong holes. The base plate 5 corresponds vertically to the clearance hole.

[0038] The adjustment structure mainly consists of multiple sets of discrete positioning holes. For example... Figures 2 to 6As shown, the supporting body 4 has multiple sets of first positioning holes. The stop shaft 9 can be inserted into different sets of first positioning holes depending on the longitudinal and lateral dimensions of the tray, thereby changing the position of the stop shaft 9 relative to the end of the guide block, so that the limiting position of the stop shaft 9 matches the actual size of the tray. Simultaneously, the base plate 5 has multiple sets of second positioning holes. The guide block 6 adjusts its lateral position by changing its alignment with the second positioning holes, thereby changing the effective distance between the two guide blocks to accommodate trays of different widths. Both the first and second positioning holes can be threaded holes, and the guide block 6 is fixed to the corresponding second positioning hole with bolts.

[0039] The positions of the stop shaft 9 and the guide block 6 are adjusted independently. The operator can change the limit position of the stop shaft 9 alone, or change the lateral guide spacing alone, or adjust both simultaneously to accommodate different tray sizes. This adjustment structure allows the same load-bearing body 4 and positioning module to be adapted to multiple tray sizes simply by adjusting the installation position without replacing any parts. This significantly reduces the number of dedicated fixtures required, lowers fixture inventory costs, and reduces the operational risks associated with frequent fixture changes.

[0040] It is worth noting that the flexible spring is fixed on the guide block. When the position of the guide block or guide block 6 is adjusted according to the tray size, the flexible spring also moves as a whole. The pressing effect on the edge of the new size tray is still effective, and there is no need to reposition the flexible spring separately.

[0041] Example 3: like Figure 1 , Figure 9 , Figure 10 and Figure 11 As shown, the wafer stage assembly 2 includes a two-stage motion structure: a lifting platform and a rotary platform. The lifting platform is driven by multiple lifting screws 15 rotatably mounted on the frame. Multiple motors drive these screws 15 to rotate, causing the lifting platform to move vertically along the frame, thus achieving height matching between the material box 1 and the wafer stage assembly 2. The rotary platform is rotatably mounted on the lifting platform via a rotating assembly 16, giving it the ability to rotate around a vertical axis, thereby enabling angle correction of the material orientation.

[0042] The process of removing the carrier body 4 from the material box 1 and transferring it to the wafer stage is completed by the gripper assembly 3. The gripper assembly 3 is mounted on the rack and utilizes existing technology, possessing the functions of linear reciprocating movement and object gripping. The carrier body 4 is equipped with a clamping part whose shape is adapted to the gripper assembly 3. By recognizing and clamping the clamping part, the gripper assembly 3 grasps the carrier body 4 from the carrier station in the material box 1 with a stable and repeatable motion trajectory, guiding it along the feeding track 11 on one side of the lifting platform, and smoothly delivering the carrier body 4 into the working area of ​​the wafer stage assembly 2. The position and shape of the clamping part are specially designed so that the gripper assembly 3 will not touch any structure of the tray or positioning module during gripping.

[0043] After entering the wafer stage assembly 2, the wafer track 19 on the rotary platform guides the carrier body 4 to slide into the predetermined position. The limiting block 18 provides a terminal block when the carrier body 4 reaches the end point to prevent the carrier body 4 from overstepping its bounds. After completing the planar positioning, the carrier body 4 also needs to be firmly constrained in the vertical direction. The wafer pressure plate 12 on the rotary platform presses down on the edge area of ​​the carrier body 4 from above, and the top ring 14 supports the bottom surface of the carrier body 4 from below. The two form an upper and lower clamping relationship, locking the carrier body 4 on the rotary platform and ensuring that it will not shift or tilt during the rotation or lifting of the rotary platform. The flexible pressure strip 20 fixed to the bottom surface of the wafer pressure plate 12 forms a uniform flexible contact with the carrier body 4 when pressed, avoiding stress concentration and forming an additional layer of vibration buffer protection for the chip 22 on the tray. A rotating lever 17 is also provided on the rotary platform. The rotary lever 17 is used to contact the edge, notch or mating part of the wafer carrier or tray carrier assembly after the wafer frame or carrier body 4 is installed into the wafer stage assembly 2, so as to assist it in angle correction, positioning limit or anti-rotation positioning.

[0044] A material receiving sensor 13 is installed on the lifting platform. When the supporting body 4 in the material box 1 reaches the predetermined height with the lifting platform, the material receiving sensor 13 detects the positioning status of the supporting body 4 in real time. Only after confirming the positioning signal will the gripper assembly 3 perform the gripping action. This detection mechanism avoids problems such as empty gripping due to material not being in place or clamping misalignment due to inaccurate positioning.

[0045] Thus, a complete compatible support system is formed between the general-purpose component described in this embodiment and the wafer stage component 2: the support body 4 is identified and stored by the material box 1 in the same way as the wafer frame through the mounting reference part, and is grasped and transferred by the gripper component 3 in a standardized process. It is locked on the rotary platform with the same constraint mechanism as the wafer support. The entire process of loading, positioning and locking does not require any special treatment for the tray form, and truly realizes the indiscriminate compatible operation of the two material forms on the same device.

[0046] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A universal component compatible with both wafers and trays, characterized in that, include: The carrier body (4) has an installation reference part, which is used to adapt the carrier body (4) to the bearing station in the material box (1) for carrying the wafer; Multiple positioning modules are mounted on the supporting body (4) for loading multiple tray disks; The positioning module includes a guide limiting mechanism for guiding the positioning of the tray and a positioning mechanism for fixing the position of the tray on the carrier body (4); the carrier body (4) can load multiple trays through multiple positioning modules and share the same wafer stage assembly (2) with the wafer.

2. A universal component compatible with both wafers and trays as described in claim 1, characterized in that, The guide limiting mechanism includes multiple guide blocks (6) set on the bearing body (4). The distance between two adjacent guide blocks (6) is adapted to the width of the tray. Multiple baffles (9) for blocking the tray are set on the bearing body (4) at one end of the guide block.

3. A universal component compatible with both wafers and trays as described in claim 2, characterized in that, The positioning mechanism includes multiple flexible springs fixed on the guide block (6), which are used to elastically press the edge of the tray.

4. A universal component compatible with both wafers and trays as described in claim 3, characterized in that, The flexible spring includes a fixing part (23) and a pressing part (24) symmetrically arranged at both ends of the fixing part (23). The pressing part (24) has a raised section at the end away from the fixing part (23).

5. A universal component compatible with both wafers and trays as described in claim 2, characterized in that, The bearing body (4) has a clearance hole in the middle, and a base plate (5) corresponding to the clearance hole is fixed on the bearing body (4). The bearing body (4) and the base plate (5) are provided with adjustment structures for adjusting the position of the stop shaft (9) and the guide block (6).

6. A universal component compatible with both wafers and trays as described in claim 5, characterized in that, The adjustment structure includes multiple sets of first positioning holes on the bearing body (4) and multiple sets of second positioning holes on the base plate (5). The stop shaft (9) adjusts its position by changing its alignment with the first positioning holes; the guide block (6) adjusts its position by changing its alignment with the second positioning holes.

7. A universal component compatible with both wafers and trays as described in claim 1, characterized in that, The carrier body (4) is adapted to the wafer stage assembly (2), the wafer stage assembly (2) comprising: The lifting platform is mounted on the frame. A rotary platform is rotatably mounted on a lifting platform via a rotating assembly (16); The lifting platform is provided with a feeding track (11) for guiding the bearing body (4) on the side near the feeding area; the rotary platform is provided with a wafer track (19) for guiding the bearing body (4) and a limiting block (18) for limiting; the rotary platform is provided with a wafer pressure plate (12) and a top ring (14) for constraining the bearing body (4) from the upper and lower sides respectively.

8. A universal component compatible with both wafers and trays as described in claim 7, characterized in that, The frame is provided with a gripper assembly (3), and the carrier body (4) is provided with a clamping part adapted to the gripper assembly (3). The gripper assembly (3) is used to grab the carrier body (4) from the material box (1) and transfer it to the wafer track (19).

9. A universal component compatible with both wafers and trays as described in claim 7, characterized in that, The lifting platform is equipped with a material sensor (13) for detecting whether the material is in place; a flexible pressure strip (20) is fixed on the bottom surface of the wafer pressure plate (12).

10. A universal component compatible with both wafers and trays as described in claim 1, characterized in that, The outer contour shape and size of the mounting reference part match the outer contour shape and size of the wafer frame used to carry the wafer.

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