A mobile lifting polishing mechanism and a cylinder processing device having the same

Abstract

The application discloses a mobile lifting polishing mechanism, which comprises a mobile frame movably arranged on a support beam, at least one mobile driving assembly arranged on the mobile frame and used for driving the mobile frame to move, a bracket arranged on the mobile frame, and an extension polishing assembly arranged on the bracket and used for polishing a cylinder body. The polishing mechanism can move along the length direction of the support beam, i.e. move along the axial direction of the cylinder body to polish the cylinder body. The application further discloses a cylinder body processing device, which comprises the mobile lifting polishing mechanism and a lower beam arranged below the support beam. The cylinder body processing device can polish the cylinder body and roll the welding seam, thereby improving the processing efficiency.

Description

Technical Field

[0001] This application relates to the field of tank container processing technology, and in particular to a mobile lifting polishing mechanism and a cylinder processing device having the same. Background Technology

[0002] After the tank container body is formed and processed, the axial weld seams of the body need to be polished. Currently, most companies use manual polishing, while some use body polishing machines. However, these are mostly fixed structures, which cannot move the machine long distances along the body's axis for polishing. Therefore, a new technical solution is urgently needed to solve at least one of the above technical problems. Summary of the Invention

[0003] In view of the above shortcomings, one objective of this application is to provide a movable lifting polishing mechanism capable of moving along the length of the support beam, i.e., moving along the axial direction of the cylinder to polish the cylinder. Another objective of this application is to provide a cylinder processing device capable of polishing and weld seam compaction of the cylinder, thereby improving processing efficiency.

[0004] To achieve the above-mentioned technical objectives and meet the above-mentioned technical requirements, the technical solution adopted in this application is as follows: A mobile lifting polishing mechanism is characterized in that it includes a movable frame movably disposed on a support beam, at least one movable drive assembly disposed on the movable frame for driving the movable frame to move, a bracket disposed on the movable frame, and a telescopic polishing assembly disposed on the bracket for polishing a polishing cylinder.

[0005] Furthermore, the telescopic polishing assembly includes a rotating plate rotatably mounted on the bracket, a polishing motor mounted on the upper side of the rotating plate, a connecting column vertically mounted on the upper side of the rotating plate, a fixing plate mounted on the bracket, an angle adjustment drive device, a telescopic rod mounted on the rotating plate, a polishing bracket mounted at one end of the telescopic rod, a transmission wheel rotatably mounted on the polishing bracket, and a polishing belt. The polishing belt is sleeved on the output end of the polishing motor and the transmission wheel. One end of the angle adjustment drive device is connected to the connecting column, and the other end is connected to the fixing plate.

[0006] Furthermore, the telescopic polishing assembly also includes a telescopic drive device. The telescopic rod includes a fixed rod and a movable rod sleeved on the fixed rod. The telescopic drive device is disposed on one side of the movable rod, with one end connected to the movable rod and the other end connected to the fixed rod.

[0007] Furthermore, the motion drive assembly includes at least one motion drive motor with a motion output gear disposed on the motion frame, and at least one rack extending along the length direction of the support beam, wherein the motion output gear meshes with the rack.

[0008] Furthermore, the mobile lifting assembly also includes at least one lifting bracket disposed on the mobile frame, at least one lifting drive device, a wheel frame rotatably disposed on the mobile frame, a connecting shaft fixedly inserted into the wheel frame, and a pressure roller rotatably disposed on the wheel frame. One end of the lifting drive device is connected to the lifting bracket, and the other end is connected to the connecting shaft.

[0009] Furthermore, the wheel frame is fitted with a first base shaft, and the pressure roller is sleeved on the first base shaft.

[0010] Furthermore, the movable frame is equipped with at least one second base shaft, and the second base shaft is rotatably fitted with a support roller, which abuts against the lower side of the support beam.

[0011] Furthermore, the movable frame includes two parallel and spaced movable plates and a plurality of connecting rods inserted into the movable plates, with the support beam located between the two movable plates.

[0012] Furthermore, at least one guide groove is provided on at least one side of the support beam.

[0013] Furthermore, the movable frame is provided with at least one third base shaft, the third base shaft is rotatably fitted with a guide wheel, and the guide wheel is movably disposed in the guide groove.

[0014] Furthermore, the bracket includes a support plate connected to the movable frame and an adjustment plate detachably disposed on the upper side of the support plate, and the telescopic polishing assembly is connected to the adjustment plate.

[0015] Furthermore, the adjusting plate is provided with a plurality of adjusting holes that pass through it vertically, and the adjusting holes are arc-shaped and evenly distributed around the circumference.

[0016] Furthermore, a buffer spring is provided between the adjusting plate and the rotating plate.

[0017] This application also provides a cylinder processing device, including the aforementioned movable lifting and polishing mechanism, with a lower beam provided below the support beam, and the support beam and the support beam connected by a vertical beam.

[0018] Compared with traditional technical solutions, the beneficial effects of this application are: 1) This mechanism drives the moving frame to move along the length of the support beam through the moving drive component, which in turn drives the telescopic polishing component to move and polish along the entire axial direction of the cylinder. It can complete the polishing of the entire cylinder weld in one go, with strong polishing continuity and high processing efficiency. 2) The telescopic polishing assembly is equipped with an angle adjustment drive device and a telescopic rod structure. The angle adjustment drive device drives the rotating plate to rotate and adjust the polishing belt contact angle. The telescopic drive device controls the telescopic rod to extend and retract to adjust the polishing working radius, which can be adapted to polishing weld seams of cylinders with different diameters, greatly improving the equipment's versatility. 3) Equipped with a lifting drive device, wheel frame and pressure roller structure, the pressure roller presses down to clamp the cylinder during polishing, and the external guide rail restricts the displacement of the cylinder to avoid cylinder displacement during polishing, thereby improving the uniformity of weld polishing and processing accuracy. 4) A multi-guided support structure, including guide grooves, guide wheels, and support rollers, is set between the support beam and the mobile frame, ensuring smooth and stable movement of the mobile frame without jamming or shaking, resulting in high stability during polishing operations. 5) The bracket adopts a structure of a support plate and a detachable adjustment plate. The adjustment plate has evenly arranged arc-shaped adjustment holes, which can flexibly adjust the deflection angle of the telescopic polishing component. It is convenient to disassemble, install, and fine-tune. Attached Figure Description

[0019] Figure 1 This is a structural diagram of a polishing mechanism provided in one embodiment of this application; Figure 2 for Figure 1 A structural diagram from another direction; Figure 3 This is a structural diagram of a mobile frame provided in one embodiment of this application; Figure 4 A structural diagram of a rack provided in one embodiment of this application; Figure 5 This is a structural diagram of a movable output gear and rack provided in one embodiment of this application; Figure 6 This is a structural diagram of a telescopic polishing assembly provided in one embodiment of this application.

[0020] exist Figures 1-6In the middle, 1. Support beam; 101. Upper guide groove; 102. Lower guide groove; 103. Rack; 104. Protruding rib; 105. Lower beam; 106. Vertical beam; 2. Moving frame; 201. Moving plate; 202. Connecting rod; 203. Second base shaft; 204. Support roller; 205. Third base shaft; 206. Guide wheel; 207. Lifting bracket; 3. Moving drive assembly; 301. Moving drive motor; 302. Moving output gear; 4. Bracket; 401. Support plate; 402. Adjusting plate; 4021. Adjusting hole; 403. Reinforcing plate; 5. Telescopic polishing assembly; 501. Turning plate; 50 2. Polishing motor; 503. Connecting column; 504. Fixing plate; 505. Angle adjustment drive device; 506. Telescopic rod; 5061. Fixing rod; 5062. Movable rod; 507. Telescopic drive device; 508. Polishing bracket; 509. Transmission wheel; 510. Polishing belt; 6. Lifting drive device; 7. Wheel frame; 701. Connecting shaft; 702. First base shaft; 8. Pressure roller; 9. Buffer spring; 10. Cylinder rotating assembly; 1001. Mounting frame; 1002. Angle drive device; 1003. Rotating frame; 1004. Cylinder rotating motor; 1005. Cylinder rotating wheel. Detailed Implementation

[0021] The present application will now be further described with reference to the accompanying drawings.

[0022] In the accompanying drawings of the embodiments of this application, the same or similar reference numerals correspond to the same or similar components. In the description of this application, it should be understood that if terms such as "top", "bottom", "left", "right", "front", "rear", "inner", "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this application, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0023] Please refer to Figures 1-6 An embodiment of this application provides a mobile lifting polishing mechanism, including a support beam 1, a mobile frame 2, a mobile drive assembly 3, a bracket 4, and a telescopic polishing assembly 5. The mobile frame 2 is movably mounted across the outside of the support beam 1. The mobile drive assembly 3 is installed on the mobile frame 2 and is used to drive the mobile frame 2 to reciprocate along the length direction of the support beam 1. The bracket 4 is fixedly assembled on one side of the mobile frame 2. The telescopic polishing assembly 5 is installed on the bracket 4 as a whole. The telescopic polishing assembly 5 extends into the inside of the cylinder to complete the axial weld polishing operation of the inner wall of the cylinder.

[0024] like Figures 1-6As shown, the mobile frame 2 includes two parallel and spaced-apart movable plates 201 and multiple connecting rods 202 connecting the two movable plates 201. A support beam 1 passes between the two movable plates 201, allowing the mobile frame 2 to straddle the outside of the support beam 1 for movement. Multiple second base shafts 203 are inserted inside the mobile frame 2. Rollers 204 are rotatably fitted on the outside of the second base shafts 203. The top surface of the rollers 204 abuts against the lower side of the support beam 1, providing vertical support for the mobile frame 2 and reducing frictional resistance during movement. At least one side of the support beam 1 has a long guide groove. A third base shaft 205 is fixed on the movable plate 201 of the mobile frame 2. A guide wheel 206 is rotatably mounted on the outside of the third base shaft 205. The guide wheel 206 is slidably engaged inside the guide groove, providing lateral limitation for the mobile frame 2 and preventing deviation during movement.

[0025] like Figures 1-6 As shown, the mobile drive assembly 3 includes a mobile drive motor 301, which is fixed to the outside of the mobile frame 2. A mobile output gear 302 is mounted on the output end of the mobile drive motor 301. A rack 103 is fixed along the length direction on the support beam 1, and the mobile output gear 302 meshes with the rack 103. The operation of the mobile drive motor 301 drives the mobile output gear 302 to rotate, and the entire mobile frame 2 is driven to move at a constant speed along the length direction of the support beam 1 by means of the gear and rack 103 transmission pair, which simultaneously drives the bracket 4 and the telescopic polishing assembly 5 to perform polishing.

[0026] like Figures 1-6 As shown, specifically, the support beam 1 has two guide grooves on the same side, namely the upper guide groove 101 and the lower guide groove 102. The upper guide groove 101 and the lower guide groove 102 are separated by the protruding rib 104. At least one guide wheel 206 is respectively provided in the upper guide groove 101 and the lower guide groove 102. The rack 103 is detachably connected to the protruding rib 104.

[0027] like Figures 1-6 As shown, a lifting bracket 207 is fixed on the movable frame 2, and a lifting drive device 6 is mounted on the lifting bracket 207. A wheel frame 7 is rotatably mounted on the lower part of the movable frame 2, and a connecting shaft 701 is fixedly inserted on the wheel frame 7. The output end of the lifting drive device 6 is hinged to the connecting shaft 701. A first base shaft 702 passes through the inside of the wheel frame 7, and a pressure roller 8 is rotatably sleeved on the first base shaft 702. In actual operation, a bottom beam is set below the support beam 1, and a rigid guide rail is set on the bottom beam. During polishing, the lifting drive device 6 extends and pulls the wheel frame 7 to flip downward. The pressure roller 8 presses against the inner wall of the cylinder, and the cylinder abuts against the rigid guide rail. The cylinder is positioned in conjunction with the tooling guide rail below the cylinder. During the movement of the movable frame 2, the pressure roller 8 moves synchronously and presses against the cylinder throughout the process to prevent displacement of the cylinder.

[0028] like Figures 1-6As shown, the bracket 4 includes a support plate 401 rigidly connected to the movable frame 2, an adjusting plate 402 detachably mounted on the upper side of the support plate 401, and a reinforcing plate 403 disposed on the lower side of the support plate 401. The telescopic polishing assembly 5 is fixedly mounted on the adjusting plate 402. A connecting plate is provided on one side of the movable frame 2, and the reinforcing plate 403 is connected to the connecting plate and the support plate 401. The adjusting plate 402 has multiple vertically penetrating arc-shaped adjusting holes 4021 evenly distributed around its circumference. After loosening the locking bolts between the adjusting plate 402 and the support plate 401, the adjusting plate 402 can be rotated along the arc-shaped adjusting holes 4021 to adjust the overall deflection angle of the telescopic polishing assembly 5. After adjustment, the locking bolts can be tightened to position the assembly. The angle adjustment range is wide and the operation is convenient.

[0029] like Figures 1-6 As shown, the telescopic polishing assembly 5 includes a rotating plate 501, a polishing motor 502, a connecting column 503, a fixing plate 504, an angle adjustment drive device 505, a telescopic rod 506, a telescopic drive device 507, a polishing bracket 508, a transmission wheel 509, and a polishing belt 510. The fixing plate 504 is fixed on the adjusting plate 402 of the bracket 4. The rotating plate 501 is rotatably mounted above the fixing plate 504. The connecting column 503 is vertically fixed on the rotating plate 501. The angle adjustment drive device 505 is hinged at both ends to the connecting column 503 and the fixing plate 504, respectively, driving the rotating plate 501 to rotate as a whole, thereby adjusting the contact angle between the polishing belt 510 and the weld seam of the cylinder. The polishing motor 502 is fixed to the upper side of the rotating plate 501, and the telescopic rod 506 is installed at the front end of the rotating plate 501. The telescopic rod 506 is divided into a fixed rod 5061 and a movable rod 5062. The movable rod 5062 is slidably sleeved on the outside of the fixed rod 5061. The telescopic drive device 507 is arranged on the side of the movable rod 5062. One end of the telescopic drive device 507 is connected to the movable rod 5062, and the other end is connected to the fixed rod 5061, driving the telescopic rod 506 to extend and retract as a whole, adjusting the polishing working radius. The front end of the telescopic rod 506 is fixed with a polishing bracket 508. A transmission wheel 509 is rotatably installed on the polishing bracket 508. The annular polishing belt 510 is simultaneously sleeved on the output shaft of the polishing motor 502 and the outside of the transmission wheel 509. The operation of the polishing motor 502 drives the polishing belt 510 to rotate at high speed, conforming to the axial weld of the cylinder to complete the grinding and polishing.

[0030] like Figures 1-6 As shown, a buffer spring 9 is provided between the adjusting plate 402 and the rotating plate 501, which plays a buffering role when the rotating plate 501 rotates.

[0031] Please refer to Figures 1-6 Another embodiment of this application provides a cylinder processing device, including the movable lifting polishing mechanism, wherein a lower beam 105 is provided below the support beam 1, and a vertical beam 106 is connected to the support beam 1 and the lower beam 105 on the same side.

[0032] like Figures 1-6As shown, at least one cylinder rotation assembly 10 is provided on each side of the lower beam 105. The cylinder rotation assembly 10 includes a mounting frame 1001, an angle drive device 1002, a rotation frame 1003, a cylinder rotation motor 1004, and a cylinder rotation wheel 1005. The mounting frame 1001 is detachably fixed to the lower beam 105 of the frame. The angle drive device 1002 is mounted on the mounting frame 1001. The rotation frame 1003 is rotatably mounted on the mounting frame 1001. The output end of the angle drive device 1002 is connected to the rotation frame 1003. The cylinder rotation motor 1004 is fixed to the rotation frame 1003. The output end of the cylinder rotation motor 1004 is connected to the cylinder rotation wheel 1005. The angle drive device 1002 can adjust the cylinder rotating wheel 1005 so that the cylinder rotating wheel 1005 can fit with the cylinder. The cylinder rotating motor 1004 drives the cylinder rotating wheel 1005 to rotate, so that the cylinder can rotate, which is convenient for polishing or rolling the weld.

[0033] The working principle of the polishing mechanism in this application is as follows: Support beam 1 passes through the inside of the cylinder, and the cylinder to be processed is fitted onto the outside of support beam 1. Lifting drive device 6 drives pressure roller 8 to press down the cylinder so that the cylinder abuts against lower beam 105. The moving drive motor 301 is started, and the gear rack 103 drives the moving frame 2 to move to the cylinder processing starting position. According to the cylinder diameter specification, the locking bolt of bracket 4 adjusting plate 402 is loosened, and the adjusting plate 402 is rotated along the arc-shaped adjusting hole 4021 to coarsely adjust the overall installation angle of telescopic polishing assembly 5. Then, the angle adjustment drive device 505 is controlled to finely adjust the overall angle. The rotating plate 501 deflects at an angle, and the telescopic drive device 507 drives the telescopic rod 506 to extend, so that the polishing belt 510 fits tightly against the axial weld of the cylinder. The polishing motor 502 is started, and the polishing belt 510 rotates at high speed to grind the weld. The moving drive component 3 drives the moving frame 2 to move longitudinally along the support beam 1 at a uniform speed, completing the polishing of the entire axial weld of the cylinder in one go. After the polishing of a single weld is completed, the lifting drive device 6 retracts and lifts the pressure roller 8. The equipment can be used in conjunction with the external cylinder rotating component 10 to switch the position of the cylinder weld and repeat the polishing operation.

[0034] Any numerical values ​​cited herein include all values ​​ranging from a lower limit to an upper limit, increasing by one unit, with at least two units between any lower and any higher value. For example, if the quantity of a component or the value of a process variable (e.g., temperature, pressure, time, etc.) is described as being from 1 to 90, preferably from 20 to 80, more preferably from 30 to 70, the purpose is to illustrate that values ​​such as 15 to 85, 22 to 68, 43 to 51, 30 to 32 are also explicitly listed in this specification. For values ​​less than 1, a unit is appropriately considered to be 0.0001, 0.001, 0.01, 0.1, etc. These are merely examples intended for explicit expression, and it can be assumed that all possible combinations of values ​​listed between the minimum and maximum values ​​are explicitly described in this specification in a similar manner.

[0035] Unless otherwise stated, all ranges include the endpoints and all numbers between them. The terms "approximately" or "about" used with ranges apply to both endpoints of the range. Thus, "approximately 20 to 30" is intended to cover "approximately 20 to approximately 30," including at least the specified endpoints.

[0036] All articles and references disclosed herein, including patent applications and publications, are incorporated herein by reference for various purposes. The term “substantially constitutes…” used to describe a combination should include the identified elements, components, parts, or steps, as well as other elements, components, parts, or steps that do not substantially affect the essential novelty of the combination. The use of the terms “comprising” or “including” to describe combinations of elements, components, parts, or steps herein also contemplates embodiments substantially constituted by such elements, components, parts, or steps. The use of the term “may” herein is intended to indicate that any described attribute included by “may” is optional.

[0037] Multiple elements, components, parts, or steps can be provided by a single integrated element, component, part, or step. Alternatively, a single integrated element, component, part, or step can be divided into multiple separate elements, components, parts, or steps. The use of "a" or "an" to describe an element, component, part, or step does not imply the exclusion of other elements, components, parts, or steps.

[0038] It should be understood that the above description is for illustrative purposes and not for limitation. Many embodiments and applications beyond the provided examples will be apparent to those skilled in the art upon reading the above description. Therefore, the scope of this teaching should not be determined by reference to the above description, but rather by reference to the appended claims and the full scope of their equivalents. For purposes of completeness, all articles and references, including patent applications and publications, are incorporated herein by reference. The omission of any aspect of the subject matter disclosed herein in the preceding claims is not intended as a waiver of that subject matter, nor should it be construed as an indication that the inventors have not considered that subject matter as part of the disclosed inventive subject matter.

Claims

1. A mobile lifting polishing mechanism, characterized in that, It includes a movable frame movably mounted on a support beam, at least one movable drive assembly mounted on the movable frame for driving the movable frame to move, a bracket mounted on the movable frame, and a telescopic polishing assembly mounted on the bracket for polishing the cylinder.

2. The movable lifting polishing mechanism according to claim 1, characterized in that, The telescopic polishing assembly includes a rotating plate rotatably mounted on the bracket, a polishing motor mounted on the upper side of the rotating plate, a connecting column vertically mounted on the upper side of the rotating plate, a fixing plate mounted on the bracket, an angle adjustment drive device, a telescopic rod mounted on the rotating plate, a polishing bracket mounted at one end of the telescopic rod, a transmission wheel rotatably mounted on the polishing bracket, and a polishing belt. The polishing belt is sleeved on the output end of the polishing motor and the transmission wheel. One end of the angle adjustment drive device is connected to the connecting column, and the other end is connected to the fixing plate.

3. The movable lifting polishing mechanism according to claim 2, characterized in that, The telescopic polishing assembly further includes a telescopic drive device. The telescopic rod includes a fixed rod and a movable rod sleeved on the fixed rod. The telescopic drive device is disposed on one side of the movable rod, with one end connected to the movable rod and the other end connected to the fixed rod.

4. The movable lifting polishing mechanism according to claim 1, characterized in that, The moving drive assembly includes at least one moving drive motor with a moving output gear disposed on the moving frame, and at least one rack extending along the length direction of the support beam, wherein the moving output gear meshes with the rack.

5. The movable lifting polishing mechanism according to claim 4, characterized in that, The mobile lifting assembly further includes at least one lifting bracket disposed on the mobile frame, at least one lifting drive device, a wheel frame rotatably disposed on the mobile frame, a connecting shaft fixedly inserted into the wheel frame, and a pressure roller rotatably disposed on the wheel frame. One end of the lifting drive device is connected to the lifting bracket, and the other end is connected to the connecting shaft.

6. The movable lifting polishing mechanism according to claim 5, characterized in that, The wheel frame is fitted with a first base shaft, and the pressure roller is sleeved on the first base shaft.

7. The movable lifting polishing mechanism according to claim 1, characterized in that, The movable frame is equipped with at least one second base shaft, and the second base shaft is rotatably fitted with a support roller, which abuts against the lower side of the support beam.

8. The movable lifting polishing mechanism according to claim 1, characterized in that, The movable frame includes two parallel and spaced movable plates and multiple connecting rods inserted into the movable plates, with the support beam located between the two movable plates.

9. The movable lifting polishing mechanism according to claim 1, characterized in that, At least one guide groove is provided on at least one side of the support beam.

10. The movable lifting polishing mechanism according to claim 9, characterized in that, The movable frame is provided with at least one third base shaft, and the third base shaft is rotatably fitted with a guide wheel, which is movably disposed in the guide groove.

11. The movable lifting polishing mechanism according to claim 1, characterized in that, The bracket includes a support plate connected to the movable frame and an adjustment plate detachably disposed on the upper side of the support plate, and the telescopic polishing assembly is connected to the adjustment plate.

12. The movable lifting polishing mechanism according to claim 11, characterized in that, The adjusting plate is provided with multiple adjusting holes that pass through it vertically. The adjusting holes are arc-shaped and evenly distributed around the circumference.

13. The movable lifting polishing mechanism according to claim 11, characterized in that, A buffer spring is provided between the adjusting plate and the rotating plate.

14. A cylinder processing apparatus, characterized in that, The movable lifting polishing mechanism includes any one of claims 1-13, wherein a lower beam is provided below the support beam, and the support beam is connected to the support beam via a vertical beam.

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