Deposition apparatus with fixed ring cooling circuit

Abstract

The present application is a deposition apparatus with a fixed ring cooling loop, which mainly comprises a cavity, a fixed ring, a supporting plate and a cooling loop. The supporting plate is used to support a wafer, one end of the fixed ring is connected to the cavity, and the other end is used to contact the wafer placed on the supporting plate to fix the wafer on the supporting plate. The cooling loop is arranged inside the fixed ring, and a cooling fluid flows in the cooling loop to reduce the temperature of the fixed ring. By reducing the temperature of the fixed ring, the temperature of the wafer in contact with the fixed ring can be prevented from being too high, which is beneficial to improve the uniformity of the thin film deposited on the wafer surface.

Description

Technical Field

[0001] This invention relates to a deposition apparatus with a fixed ring cooling circuit, which can effectively improve the uniformity of thin films deposited on wafer surfaces. Background Technology

[0002] Chemical vapor deposition (CVD), physical vapor deposition (PVD), and atomic layer deposition (ALD) are all commonly used thin film deposition equipment and are widely used in integrated circuits, light-emitting diodes, and displays.

[0003] Thin film deposition equipment mainly includes a cavity and a support plate, with the support plate located inside the cavity and used to support at least one wafer. Taking physical vapor deposition (PVD) as an example, a target needs to be placed inside the cavity, with the target facing the wafer on the support plate. During PVD, the wafer is fixed to the support plate by a fixing device, and inert gas and / or reactive gas are delivered into the cavity to apply bias voltages to the target and the support plate, while the support plate also heats the supported wafer. The inert gas inside the cavity is ionized by the high-voltage electric field. The ionized inert gas is attracted by the bias voltage on the target and bombards the target. Target atoms or molecules sputtered from the target are attracted by the bias voltage on the support plate and deposited on the surface of the heated wafer to form a thin film on the wafer surface.

[0004] In physical vapor deposition (PVD) or atomic layer deposition (ALD) processes, long and continuous deposition times are typically required to meet production capacity demands, which keeps the components inside the deposition chamber at high temperatures for extended periods. When the temperature of the components in contact with the wafer inside the chamber becomes too high—for example, if the component temperature exceeds the wafer temperature—it will cause excessively high temperatures in the wafer-component area, leading to uneven temperature distribution on the wafer and affecting the quality of the thin film deposition. Summary of the Invention

[0005] To avoid the problems described in the prior art, the present invention proposes a novel deposition apparatus with a fixed ring cooling circuit. The cooling circuit is mainly set inside the fixed ring, and cooling fluid can be transported to the cooling circuit during the deposition process to reduce the temperature of the fixed ring, which is beneficial to improving the uniformity of the film deposited on the wafer surface.

[0006] One objective of this invention is to provide a deposition apparatus with a fixed ring cooling circuit, mainly comprising a cavity, a support plate, a fixed ring, and a cooling circuit, wherein the support plate is used to support at least one wafer. The cooling circuit is disposed inside the fixed ring, and the temperature of the fixed ring can be reduced by the cooling fluid circulating within the cooling circuit, thereby preventing the fixed ring from transferring heat to the wafer, improving the uniformity of the film deposited on the wafer surface, and preventing adhesion between the wafer and the fixed ring.

[0007] One object of the present invention is to provide a deposition apparatus with a fixed ring cooling circuit, wherein the fixed ring includes a fixing portion and a connecting portion. The connecting portion of the fixed ring is used to connect to a cavity, while the fixing portion is used to contact and fix the wafer on the carrier disk. The cooling circuit includes an input line, an output line, and a cooling line, wherein the cooling line is close to the fixing portion of the fixed ring, which can effectively reduce the temperature of the fixing portion near the wafer, thereby preventing the fixed ring from transferring heat to the wafer.

[0008] One objective of this invention is to provide a deposition apparatus with a fixed-ring cooling circuit, mainly comprising a cavity, a support plate, a fixing device, and a cooling circuit. The fixing device includes a suspension unit and a fixed ring, wherein the suspension unit is connected to the cavity, and the fixed ring is connected to the suspension unit through multiple units. In practical applications, the distance between the fixed ring and the suspension unit can be adjusted by connecting units, and the distance between the fixed ring and the support plate can be changed to improve ease of use.

[0009] To achieve the above objectives, the present invention provides a deposition apparatus with a fixed ring cooling circuit, comprising: a cavity including a support portion and a receiving space, wherein the support portion is located within the receiving space; a fixed ring including a connecting portion and a fixing portion, wherein the connecting portion is disposed on the support portion of the cavity; a cooling circuit including a cooling line, an input line and an output line, wherein the cooling line is located within the fixed ring, wherein the cooling circuit reduces the temperature of the fixed ring by a cooling fluid flowing internally; and a support plate disposed within the receiving space of the cavity and located below the fixed ring, wherein the support plate is used to support a wafer, and the fixing portion of the fixed ring is used to contact the wafer to fix the wafer on the support plate.

[0010] Furthermore, the present invention proposes another deposition apparatus with a fixed ring cooling circuit, comprising: a cavity including a support portion and a receiving space, wherein the support portion is located within the receiving space; a fixing device located within the receiving space of the cavity, and comprising: at least one suspension unit disposed on the support portion of the cavity; a fixed ring including a connecting portion and a fixing portion, wherein the connecting portion is connected to the suspension unit through a plurality of connecting units; a first cooling circuit including a cooling line, an input line and an output line, the cooling line being located within the fixed ring, wherein the first cooling circuit reduces the temperature of the fixed ring through a cooling fluid flowing internally; and a support plate disposed within the receiving space of the cavity and located below the fixed ring, wherein the support plate is used to support a wafer, and the fixing portion of the fixed ring is used to contact the wafer to fix the wafer on the support plate.

[0011] The deposition apparatus with a fixed ring cooling circuit has two connecting pipelines installed in the cavity, which are respectively connected to the input pipeline and the output pipeline of the cooling circuit. Cooling fluid is transported to the cooling pipeline through one of the connecting pipelines and the input pipeline, and then transported to the other connecting pipeline through the output pipeline from the cooling pipeline.

[0012] The deposition apparatus having a fixed ring cooling circuit includes a connecting pipeline connected to the support portion of the cavity, while the input and output pipelines are connected to the connecting pipeline located on the support portion.

[0013] The deposition apparatus with a fixed ring cooling circuit includes an upper cavity and a lower cavity, a support portion located in the lower cavity, and an upper cavity used to connect to the lower cavity and fix a connecting portion of the fixed ring located in the support portion.

[0014] The deposition equipment with a fixed ring cooling circuit has two connecting pipelines installed in the cavity, which are respectively connected to the input pipeline and the output pipeline of the first cooling circuit through two hoses. Cooling fluid is transported to the cooling pipeline through the connecting pipeline, hoses and input pipeline, and then transported to the other connecting pipeline through the output pipeline and hoses.

[0015] The deposition equipment with a fixed ring cooling circuit includes a second cooling circuit disposed within the suspension unit and connected to multiple connecting pipelines within the cavity.

[0016] The deposition equipment with a fixed ring cooling circuit is provided in which multiple connection holes are provided on the suspension unit, and multiple through holes are provided on the connection part of the fixed ring. Multiple connection units pass through the through holes on the fixed ring and are connected to the connection holes of the suspension unit.

[0017] The deposition apparatus having a fixed ring cooling circuit is wherein the diameter of the connecting hole of the fixed ring is larger than the diameter of the connecting unit, so that the fixed ring can be displaced relative to the suspension unit along the connecting unit.

[0018] The deposition equipment with a fixed ring cooling circuit includes multiple elastic units respectively sleeved on multiple connecting units, with the multiple elastic units located between the fixed ring and the suspension unit.

[0019] The deposition apparatus having a fixed ring cooling circuit includes a connecting unit for adjusting the distance between the fixed ring and the suspension unit.

[0020] The deposition apparatus having a fixed ring cooling circuit, wherein the cooling line is close to the fixed part of the fixed ring. Attached Figure Description

[0021] Figure 1 This is a cross-sectional schematic diagram of an embodiment of the deposition apparatus having a fixed ring cooling circuit according to the present invention; Figure 2 This is a partial cross-sectional schematic diagram of an embodiment of the deposition apparatus having a fixed ring cooling circuit according to the present invention; Figure 3 This is a perspective view of an embodiment of the fixing ring and cooling circuit of the present invention; Figure 4 This is a partial cross-sectional schematic diagram of another embodiment of the deposition apparatus with a fixed ring cooling circuit of the present invention; Figure 5 This is a partial cross-sectional schematic diagram of another embodiment of the deposition apparatus with a fixed ring cooling circuit of the present invention; Figure 6 This is a perspective view of an embodiment of the fixing ring and the first cooling circuit of the present invention; Figure 7 This is a partial cross-sectional schematic diagram of another embodiment of the deposition apparatus with a fixed ring cooling circuit of the present invention.

[0022] Explanation of reference numerals in the attached figures 10: Deposition equipment with a fixed-ring cooling circuit 11: Cavity 111: Lower cavity 112: Storage space 1121: Reaction Space 113: Upper cavity 114: Wafer Import and Export 115: Bearing section 116: O-ring 118: Connecting pipelines 12: Wafer 13: Support plate 14: Target Material 15: Fixing ring 151: Connecting part 152: Upper surface 153: Fixing part 154: Lower surface 156: Side surface 17: Cooling Circuit 171: Cooling Pipeline 173: Input pipeline 175: Output pipeline 18: Shielding ring 19: Insulating ring 20: Deposition equipment with a fixed-ring cooling circuit 22: Connection Unit 221: Elastic element 24: Hose 25: Fixing device 251: Retaining ring 2511: Connecting part 2513: Fixing part 2515: Perforation 253: Suspension Unit 2531: Connecting hole 26: Second cooling circuit 27: First Cooling Circuit 271: Cooling Pipeline 273: Input pipeline 275: Output pipeline. Detailed Implementation

[0023] Figure 1 This is a cross-sectional schematic diagram of an embodiment of the deposition apparatus 10 with a fixed ring cooling circuit of the present invention. Figure 2 This is a partial cross-sectional schematic diagram of an embodiment of the deposition apparatus 10 with a fixed ring cooling circuit of the present invention. The deposition apparatus 10 with a fixed ring cooling circuit mainly includes a cavity 11, a carrier plate 13, a fixed ring 15, and a cooling circuit 17. The cavity 11 includes a receiving space 112, and the carrier plate 13 and the fixed ring 15 are located within the receiving space 112 of the cavity 11. The fixed ring 15 is used to connect the cavity 11, while the carrier plate 13 is located below the fixed ring 15. The carrier plate 13 can be used to drive the supported wafer 12 to move relative to the fixed ring 15.

[0024] The fixing ring 15 is an annular body, including a connecting portion 151 and a fixing portion 153. Specifically, the connecting portion 151 is located radially outward of the fixing ring 15, while the fixing portion 153 is located radially inward of the fixing ring 15. Both the connecting portion 151 and the fixing portion 153 are annular, and the radius of the connecting portion 151 is larger than that of the fixing portion 153. The connecting portion 151 of the fixing ring 15 is used to connect to the support portion 115 of the cavity 11, while the fixing portion 153 is used to contact the wafer 12 placed on the support disk 13 to fix the wafer 12 on the support disk 13.

[0025] The carrier disk 13 is located below the retaining ring 15 and is used to carry at least one wafer 12. The carrier disk 13 can move the carried wafer 12 relative to the retaining ring 15. Figure 1 As shown, a wafer inlet / outlet 114 is provided on the cavity 11, wherein the carrier plate 13 can be displaced away from the fixing ring 15, so that the height of the carrier plate 13 is similar to that of the wafer inlet / outlet 114. Then, a robotic arm can place the wafer 12 outside the cavity 11 onto the carrier plate 13 through the wafer inlet / outlet 114, or transport the wafer 12 on the carrier plate 13 to the outside of the cavity 11 through the wafer inlet / outlet 114.

[0026] In one embodiment of the present invention, the deposition apparatus 10 with a fixed ring cooling circuit can be a physical vapor deposition apparatus. A target 14 may be disposed inside the cavity 11, wherein the target 14 faces the carrier disk 13 and / or the wafer 12. During the thin film deposition process, the gas in the accommodating space 112 of the cavity 11 can be extracted, so that the accommodating space 112 is at low pressure or a vacuum.

[0027] A process gas is then introduced into the containment space 112 for deposition; for example, the process gas can be an inert gas or a reactive gas. The deposition apparatus 10 with a fixed-ring cooling circuit is a physical vapor deposition apparatus, but this is only one embodiment of the present invention and is not a limitation of the scope of the invention. In different embodiments, the deposition apparatus 10 with a fixed-ring cooling circuit can be an atomic layer deposition apparatus or a plasma etching apparatus.

[0028] like Figure 1 As shown, the carrier disk 13 can move the supported wafer 12 towards the fixing ring 15 and / or the target 14, wherein the fixing part 153 of the fixing ring 15 contacts the edge of the wafer 12 on the carrier disk 13 to fix the wafer 12 on the carrier disk 13. The carrier disk 13, the fixing ring 15, and the cavity 11 define a reaction space 1121 within the accommodating space 112, and perform thin film deposition on the surface of the wafer 12 within the reaction space 1121. The reaction space 1121 is essentially an isolated space within the accommodating space 112, wherein the reaction gas, target atoms, and / or target molecules within the reaction space 1121 do not contact the cavity 11 outside the reaction space 1121 to avoid thin film deposition on the surface of the cavity 11.

[0029] During the thin film deposition process, the temperature inside the wafer 12 and cavity 11 must be controlled within an appropriate range. After a long deposition process on different batches of wafers 12, the retaining ring 15 will be in a high-temperature state and store a considerable amount of heat energy.

[0030] In practical applications, the carrier disk 13 has an active temperature control function to maintain the temperature of the wafer 12, while a water cooling system is installed on the back of the target 14 to eliminate the heat generated by the plasma. After continuous operation of high-power plasma, the temperature of the retaining ring 15 will increase significantly. When the retaining ring 15 contacts the wafer 12, the heat on the retaining ring 15 will be transferred to the contacting wafer 12, causing the temperature of the edge region of the wafer 12 to increase and making the temperature of various regions of the wafer 12 uneven. Specifically, the edge of the wafer 12 will contact the retaining ring 15, making the temperature of the edge region of the wafer 12 higher than that of the central region. This will not only cause fogging of the film deposited on the edge of the wafer 12, but may also cause whisker defects and hillock defects in the film deposited on the edge of the wafer 12, resulting in uneven film deposition quality between the center and the edge of the wafer 12.

[0031] Furthermore, when the temperature of the retaining ring 15 is greater than or equal to the melting point of the deposited metal, the deposited metal may flow between the retaining ring 15 and the wafer 12. For example, the deposited metal deposited on the retaining ring 15 may flow onto the wafer 12, causing a thin film of deposited metal to form at the interface between the two. When the temperature inside the cavity 11 decreases, the deposited metal between the retaining ring 15 and the wafer 12 will solidify, causing the retaining ring 15 and the wafer 12 to adhere to each other.

[0032] To avoid the aforementioned problems, the deposition process is typically temporarily halted, and cooling gas is supplied to the cavity 11 to lower the temperature of the retaining ring 15. While this reduces film quality inhomogeneity between the center and edges of the wafer 12, it also reduces the efficiency and throughput of the deposition process.

[0033] To effectively solve the above problems, the present invention proposes to provide a cooling circuit 17 within the fixing ring 15. In one embodiment of the present invention, as... Figure 3 As shown, the cooling circuit 17 may include a cooling line 171, an input line 173, and an output line 175. The cooling line 171 is approximately annular in shape and is disposed within the fixing ring 15, wherein the cooling line 171 is close to or disposed on the fixing portion 153 or the connecting portion 151 of the fixing ring 15. Specifically, the cooling line 171 may be disposed along the fixing portion 153 or the connecting portion 151 of the fixing ring 15, while the input line 173 and the output line 175 are connected to the side surface 156 of the fixing ring 15.

[0034] The inlet line 173 and outlet line 175 are connected to the cooling line 171, and cooling fluid can be delivered to the cooling line 171 through the inlet line 173. The cooling fluid flows along the cooling line 171 and exits the cooling line 171 through the outlet line 175, so that the cooling fluid flows within the cooling line 171 to reduce the temperature of the retaining ring 15. For example, the cooling fluid can be a gas or a liquid. In practical applications, the cooling line 171, inlet line 173, and outlet line 175 can be made of metals with high thermal conductivity, such as copper, aluminum, or soft metal tubes.

[0035] In one embodiment of the present invention, such as Figure 2 As shown, the cavity 11 may include a lower cavity 111 and an upper cavity 113. A support portion 115 is provided on the inner side of the lower cavity 111, and the support portion 115 can support the fixing ring 15. For example, the support portion 115 may be an annular groove provided above the inner side of the lower cavity 111, and the support portion 115 is located in the accommodating space 112.

[0036] The upper cavity 113 is used to connect to the lower cavity 111 and to fix the fixing ring 15 placed on the support portion 115 of the lower cavity 111. In one embodiment of the present invention, an O-ring 116 may be provided on the support portion 115 of the lower cavity 111, and an O-ring 116 may also be provided on the surface of the upper cavity 113 facing the support portion 115.

[0037] When the retaining ring 15 is connected to the cavity 11, the upper surface 152 and the lower surface 154 of the connecting part 151 of the retaining ring 15 will contact the two O-rings 116 respectively. The lower cavity 111 and the upper cavity 113 will apply pressure to the connecting part 151 of the retaining ring 15 through the O-rings 116 to fix the retaining ring 15 on the cavity 11 and maintain the sealed state of the accommodating space 112 in the cavity 11.

[0038] In one embodiment of the present invention, when the deposition apparatus 10 with the fixed ring cooling circuit is a physical vapor deposition apparatus, a shielding ring 18 can be disposed inside the cavity 11 or the upper cavity 113. For example, the shielding ring 18 can be placed on the connecting portion 151 of the fixed ring 15. Specifically, the shielding ring 18 is located between the target 14 and the cavity 11 or the upper cavity 113, and can be used to prevent the formation of deposits on the inner surface of the cavity 11 or the upper cavity 113, wherein the shielding ring 18 does not contact the target 14.

[0039] In addition, an insulating ring 19 can be disposed between the target 14 and the upper cavity 113 and / or the shielding ring 18, so that the target 14 is electrically isolated from the upper cavity 113 and the shielding ring 18. An O-ring 116 is also disposed between the insulating ring 19 and the upper cavity 113 and the target 14. For example, the insulating ring 19 can be placed on the upper cavity 113 and / or the shielding ring 18, and then the target 14 or the cover plate on which the target 14 is disposed can be placed on the insulating ring 19.

[0040] When the retaining ring 15 is installed in the cavity 11, the input line 173 and the output line 175 of the retaining ring 15 will be connected to the two connecting lines 118 installed on the cavity 11, so that the cooling fluid can be transported through the connecting line 118 of the cavity 11 to the cooling line 171 through the input line 173, and then transported from the cooling line 171 to the connecting line 118 through the output line 175.

[0041] In one embodiment of the present invention, such as Figure 4 As shown, a support portion 115 can be provided inside the cavity 11, and the connecting portion 151 of the fixing ring 15 can be placed on the support portion 115 of the cavity 11. The connecting line 118 extends from the outside of the cavity 11 to the bottom of the support portion 115. For example, the support portion 115 can be an annular protrusion, and the connecting line 118 is connected to the support portion 115.

[0042] Furthermore, two O-rings 116 may be provided on the bottom of the support portion 115 of the cavity 11, with the connecting line 118 located between the two O-rings 116. When the connecting portion 151 of the fixing ring 15 is placed on the support portion 115 of the cavity 11, the lower surface 154 of the connecting portion 151 of the fixing ring 15 will contact the two O-rings 116, and apply pressure to the support portion 115 through the O-rings 116 to set the fixing ring 15 on the cavity 11 and maintain the sealed state of the accommodating space 112 inside the cavity 11.

[0043] Furthermore, the input line 173 and the output line 175 connect to the lower surface 154 of the retaining ring 15 and are used to connect to the connecting line 118 located at the bottom of the support portion 115, wherein the input line 173 and the output line 175 are located between two O-rings 116. Cooling fluid outside the cavity 11 is delivered to the cooling line 171 through the connecting line 118 and the input line 173, while the cooling fluid inside the cooling line 171 is transferred to the connecting line 118 through the output line 175, so that the cooling fluid flows continuously within the cooling line 171 to reduce the temperature of the retaining ring 15 and its retaining portion 153.

[0044] Figure 2 and Figure 4 The main difference is that, Figure 2The O-rings 116 are located on the upper surface 152 and the lower surface 154 of the fixed ring 15, respectively, while the connecting line 118 provided on the cavity 11 is connected to the input line 173 and the output line 175 provided on the side surface 156 of the fixed ring 15. Figure 4 The O-ring 116 is located on the lower surface 154 of the fixed ring 15, and the connecting line 118 provided on the cavity 11 is connected to the input line 173 and the output line 175 provided on the lower surface 154 of the fixed ring 15.

[0045] Figure 5 This is a partial cross-sectional schematic diagram of another embodiment of the deposition apparatus 20 with a fixed ring cooling circuit of the present invention. Please refer to the accompanying drawings. Figure 1 The deposition equipment 20 with a fixed ring cooling circuit mainly includes a cavity 11, a support plate 13, a fixing device 25 and a first cooling circuit 27. The cavity 11 includes a receiving space 112 and a support part 115. The support part 115, the support plate 13 and the fixing device 25 are located in the receiving space 112 of the cavity 11.

[0046] The fixing device 25 includes a fixing ring 251 and at least one suspension unit 253, wherein the suspension unit 253 is connected to the cavity 11, and the fixing ring 251 is connected to the suspension unit 253. The carrier plate 13 is located below the fixing ring 251 of the fixing device 25, wherein the carrier plate 13 is used to drive the supported wafer 12 to move relative to the fixing device 25.

[0047] In one embodiment of the present invention, the suspension unit 253 may be an annular body, and the suspension unit 253 may be disposed on the support portion 115 of the cavity 11. The fixing ring 251 is located below the suspension unit 253. When the support plate 13 moves the supported wafer 12 toward the fixing device 25, the fixing ring 251 will contact the wafer 12 placed on the support plate 13 to fix the wafer 12 on the support plate 13.

[0048] The fixing ring 251 can be an annular body, including a connecting portion 2511 and a fixing portion 2513. Specifically, the connecting portion 2511 is located radially outward of the fixing ring 251, while the fixing portion 2513 is located radially inward of the fixing ring 251. Both the connecting portion 2511 and the fixing portion 2513 are annular, and the radius of the connecting portion 2511 is larger than that of the fixing portion 2513. The connecting portion 2511 of the fixing ring 251 is used to connect the suspension unit 253, while the fixing portion 2513 is used to contact and fix the wafer 12 placed on the carrier disk 13.

[0049] The first cooling circuit 27 is set inside the fixed ring 251, such as Figure 6As shown, the first cooling circuit 27 may include a cooling line 271, an input line 273, and an output line 275. The first cooling circuit 27 reduces the temperature of the fixed ring 251 through an internally flowing cooling fluid. The cooling line 271 is approximately annular in shape and is located within the fixed ring 251, close to the fixing portion 2513 of the fixed ring 251. For example, the cooling line 271 may be arranged along the fixing portion 2513 of the fixed ring 251. In practical applications, the cooling line 271, the input line 273, and the output line 275 may be made of metals with high thermal conductivity, such as copper or soft metal tubing.

[0050] The input line 273 and output line 275 can be connected to the outer surface of the retaining ring 251, and are respectively connected to two connecting lines 118 disposed inside the cavity 11 via two hoses 24. For example, the hoses 24 can be soft metal tubes. In practical applications, cooling fluid outside the cavity 11 can be transported to the input line 273 of the retaining ring 251 through the connecting lines 118 and hoses 24. The cooling fluid is then transported from the input line 273 to the cooling line 271, and then from the cooling line 271 to the connecting lines 118 inside the cavity 11 via the output line 275 and hoses 24. By circulating the cooling fluid within the cooling line 271, the temperature of the retaining ring 251 can be effectively reduced.

[0051] The connecting portion 2511 of the fixing ring 251 can be connected to the suspension unit 253 through multiple connecting units 22, wherein the number of connecting units 22 can be three or more, to facilitate adjustment of the horizontal height of the fixing ring 251. In one embodiment of the present invention, multiple through holes 2515 can be provided on the fixing ring 251, and multiple corresponding connecting holes 2531 are provided on the lower surface of the suspension unit 253. The connecting units 22 can pass through the through holes 2515 of the fixing ring 251 and connect to the connecting holes 2531 of the suspension unit 253, so that the fixing ring 251 is connected to the suspension unit 253. For example, the connecting unit 22 can be a screw, and the connecting hole 2531 of the suspension unit 253 can be a screw hole.

[0052] Furthermore, the distance between the fixing ring 251 and the suspension unit 253 can be further adjusted via the connecting unit 22. Since the fixing ring 251 is connected to the connecting line 118 of the cavity 11 via the flexible hose 24, when the position of the fixing ring 251 changes, the input line 273 and the output line 275 inside the fixing ring 251 will still be connected to the connecting line 118 of the cavity 11 via the flexible hose 24.

[0053] Specifically, when the length of the connecting unit 22 entering the connecting hole 2531 increases, the connecting unit 22 will cause the fixing ring 251 to move towards the suspension unit 253, thereby reducing the distance between the fixing ring 251 and the suspension unit 253. Conversely, when the length of the connecting unit 22 entering the connecting hole 2531 decreases, it will cause the fixing ring 251 to move away from the suspension unit 253, thereby increasing the distance between the fixing ring 251 and the suspension unit 253.

[0054] This invention Figure 2 and Figure 3 The fixing ring 15 is fixed to the cavity 11 and cannot be displaced relative to the cavity 11. In this embodiment of the invention, the distance between the fixing ring 251 and the suspension unit 253 can be finely adjusted according to the actual situation to change the distance between the fixing ring 251 and the wafer 12 and the carrier disk 13.

[0055] In one embodiment of the present invention, an internal thread may be provided in the through hole 2515 of the fixing ring 251, and the connecting unit 22 may be a screw, wherein the external thread of the connecting unit 22 matches the internal thread of the through hole 2515, so that the fixing ring 251 will not slide along the connecting unit 22.

[0056] In another embodiment of the invention, the through hole 2515 on the fixing ring 251 may not have a thread, and the diameter of the through hole 2515 may be slightly larger than the diameter of the connecting unit 22, allowing the fixing ring 251 to move relative to the suspension unit 253 along the connecting unit 22. In practical applications, when the wafer 12 carried by the carrier disk 13 contacts the fixing ring 251, the carrier disk 13 can continue to drive the wafer 12 to push the fixing ring 251, causing the fixing ring 251 to move towards the suspension unit 253. Since the fixing ring 251 is movable, it can prevent the fixing ring 251 from applying excessive pressure to the wafer 12 on the carrier disk 13, thereby reducing the probability of wafer 12 breakage. In addition, an elastic unit 221 can be sleeved on the connecting unit 22 between the fixing ring 251 and the suspension unit 253. The two ends of the elastic unit 221 will respectively abut against the fixing ring 251 and the suspension unit 253, which can improve the stability of the fixing ring 251.

[0057] During the deposition process, the suspension unit 253 is located between the target 14 and the fixing ring 251, and can be used to shield the fixing ring 251 to reduce the deposits deposited on the fixing ring 251. Specifically, the suspension unit 253 and the fixing ring 251 can be annular.

[0058] In one embodiment of the present invention, such as Figure 7As shown, a second cooling circuit 26 can be provided within the suspension unit 253. The construction of the second cooling circuit 26 is similar to that of the first cooling circuit 27, and it is connected to a connecting pipeline 118 disposed within the cavity 11. Since the suspension unit 253 does not shift relative to the cavity 11, the second cooling circuit 26 does not need to be connected to the connecting pipeline 118 within the cavity 11 via a hose 24. The connecting pipeline 118 can simultaneously deliver cooling fluid to both the first cooling circuit 27 and the second cooling circuit 26, and the first cooling circuit 27 and the second cooling circuit 26 can receive the used cooling fluid. By providing a second cooling circuit 26 within the suspension unit 253, it is beneficial to further reduce the temperature of the retaining ring 251.

[0059] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent variations and modifications made in accordance with the shape, structure, features and spirit described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. A deposition apparatus with a fixed-ring cooling circuit, characterized in that, include: A cavity includes a support portion and a receiving space, wherein the support portion is located within the receiving space; A fixed ring includes a connecting part and a fixing part, wherein the connecting part is disposed on the bearing part of the cavity; A cooling circuit includes a cooling line, an input line and an output line, the cooling line being located within the fixed ring, wherein the cooling circuit reduces the temperature of the fixed ring by a cooling fluid flowing inside it; A carrier disk is disposed within the accommodating space of the cavity and located below the fixing ring, wherein the carrier disk is used to carry a wafer, and the fixing part of the fixing ring is used to contact the wafer to fix the wafer on the carrier disk.

2. The deposition apparatus with a fixed ring cooling circuit according to claim 1, characterized in that, The cavity is equipped with two connecting pipelines, which are respectively connected to the input pipeline and the output pipeline of the cooling circuit. The cooling fluid is transported to the cooling pipeline through one of the connecting pipelines and the input pipeline, and then transported from the cooling pipeline to the other connecting pipeline through the output pipeline.

3. The deposition apparatus with a fixed ring cooling circuit according to claim 2, characterized in that, The connecting line is connected to the support part of the cavity, while the input line and the output line are connected to the connecting line located on the support part.

4. The deposition apparatus with a fixed ring cooling circuit according to claim 1, characterized in that, The cavity includes an upper cavity and a lower cavity. The supporting part is located in the lower cavity, and the upper cavity is used to connect to the lower cavity and fix the connecting part of the fixing ring located in the supporting part.

5. The deposition apparatus with a fixed ring cooling circuit according to claim 1, characterized in that, The cooling line is located near the fixing part of the retaining ring.

6. A deposition apparatus with a fixed-ring cooling circuit, characterized in that, include: A cavity includes a support portion and a receiving space, wherein the support portion is located within the receiving space; A fixing device, located within the receiving space of the cavity, and comprising: At least one suspension unit is disposed on the load-bearing part of the cavity; A fixed ring includes a connecting part and a fixing part, wherein the connecting part is connected to the suspension unit through a plurality of connecting units; A first cooling circuit includes a cooling line, an input line and an output line, the cooling line being located within the fixed ring, wherein the first cooling circuit reduces the temperature of the fixed ring by a cooling fluid flowing inside it; A carrier disk is disposed within the accommodating space of the cavity and located below the fixing ring, wherein the carrier disk is used to carry a wafer, and the fixing part of the fixing ring is used to contact the wafer to fix the wafer on the carrier disk.

7. The deposition apparatus with a fixed ring cooling circuit according to claim 6, characterized in that, The cavity is equipped with two connecting pipelines, which are respectively connected to the input pipeline and the output pipeline of the first cooling circuit through two hoses. The cooling fluid is transported to the cooling pipeline through the connecting pipeline, the hose and the input pipeline, and then transported from the cooling pipeline to the other connecting pipeline through the output pipeline and the hose.

8. The deposition apparatus with a fixed ring cooling circuit according to claim 7, characterized in that, It includes a second cooling circuit disposed within the suspension unit and connected to the plurality of connecting pipelines within the cavity.

9. The deposition apparatus with a fixed ring cooling circuit according to claim 6, characterized in that, The suspension unit is provided with multiple connection holes, and the connecting part of the fixing ring is provided with multiple through holes. The multiple connecting units pass through the through holes on the fixing ring and are connected to the connection holes of the suspension unit.

10. The deposition apparatus with a fixed-ring cooling circuit according to claim 9, characterized in that, The diameter of the connecting hole of the retaining ring is larger than the diameter of the connecting unit, so that the retaining ring can be displaced relative to the suspension unit along the connecting unit.

11. The deposition apparatus with a fixed-ring cooling circuit according to claim 10, characterized in that, The device includes multiple elastic units respectively fitted onto the multiple connecting units, and the multiple elastic units are located between the fixing ring and the suspension unit.

12. The deposition apparatus with a fixed-ring cooling circuit according to claim 6, characterized in that, The connecting unit is used to adjust the distance between the fixing ring and the suspension unit.

13. The deposition apparatus with a fixed-ring cooling circuit according to claim 6, characterized in that, The cooling line is located near the fixing part of the retaining ring.

Images