Electronic device and method of manufacturing an electronic device

Abstract

Electronic devices and methods of manufacturing electronic devices. In one example, an electronic device includes a substrate including a first side, a second side opposite the first side, a dielectric structure, and a conductive structure; a first electronic assembly over the first side of the substrate, wherein the first electronic assembly includes an image assembly facing away from the substrate at a first side of the first electronic assembly; and an encapsulant over the first side of the substrate and over the first side of the first electronic assembly. The encapsulant defines a cavity over the first side of the first electronic assembly, and the image assembly is exposed in the cavity. The electronic device further includes an interconnect in the encapsulant and coupled with the first electronic assembly and the conductive structure, and a cover over the cavity and covering the image assembly. Other examples and related methods are also disclosed herein.

Description

Technical Field

[0001] This disclosure generally relates to electronic devices, and more specifically to electronic devices and methods for manufacturing electronic devices. Background Technology

[0002] Previous electronic packaging and the methods used to form electronic packages are unsuitable, for example, causing excessive cost, reduced reliability, relatively low performance, or excessively large package size. By comparing conventional methods with this disclosure and referring to the drawings, those skilled in the art will understand the other limitations and disadvantages of these methods. Summary of the Invention

[0003] One embodiment of the present invention is an electronic device comprising: a substrate including a first side, a second side opposite to the first side, a dielectric structure, and a conductive structure; a first electronic component above the first side of the substrate, wherein the first electronic component includes an image component facing away from the substrate at a first side of the first electronic component; an encapsulant above the first side of the substrate and above the first side of the first electronic component, wherein the encapsulant defines a cavity above the first side of the first electronic component, and wherein the image component is exposed in the cavity; an interconnection in the encapsulant and coupled to the first electronic component and the conductive structure; and a cover above the cavity and covering the image component.

[0004] According to the electronic device of the present invention, the cavity is located within the area of ​​the first side of the first electronic component.

[0005] According to the electronic device of the present invention, the first electronic component includes a contact at a first side of the first electronic component, wherein the interconnect is coupled to the contact and the encapsulant covers the contact.

[0006] According to the electronic device of the present invention, the conductive structure includes an inward terminal at a first side of the substrate, wherein the interconnect is coupled to the inward terminal and the encapsulant covers the inward terminal.

[0007] According to the electronic device of the present invention, the cover is coupled to a first side of the encapsulating agent using an adhesive.

[0008] According to the electronic device of the present invention, a first portion of a first side of the encapsulant is covered by the cap, and a second portion of the first side of the encapsulant is not covered by the cap.

[0009] In the electronic device according to the present invention, the lateral side of the encapsulant is coplanar with the lateral side of the substrate.

[0010] According to the electronic device of the present invention, the second side of the first electronic component is coupled to the first side of the substrate using an adhesive.

[0011] According to the electronic device of the present invention, the encapsulating agent covers the lateral side of the first electronic component.

[0012] The electronic device according to the present invention includes a second electronic component in the encapsulant and coupled to the first side of the substrate, wherein the second electronic component is outside the covered area of ​​the cavity.

[0013] According to the electronic device of the present invention, the image component includes an image sensor, and the cover is transparent to light with the same wavelength as the operating wavelength of the image sensor.

[0014] Another embodiment of the present invention is an electronic device, comprising: a substrate including a top side, a bottom side, a dielectric structure, and a conductive structure; a first electronic component above the top side of the substrate, wherein the first electronic component includes a first image component facing away from the substrate at the top of the first electronic component; a second electronic component above the top side of the substrate, wherein the second electronic component includes a second image component facing away from the substrate at the top side of the first electronic component; and an encapsulant above the top side of the substrate and above the top sides of the first electronic component and the second electronic component, wherein... The encapsulant defines a first cavity above the top side of the first electronic component and a second cavity above the top side of the second electronic component; the first image component is in the first cavity and is not covered by the encapsulant; and the second image component is in the second cavity and is not covered by the encapsulant; a first interconnect is in the encapsulant and coupled to the first electronic component and the conductive structure; a second interconnect is in the encapsulant and coupled to the second electronic component and the conductive structure; and a first cap is above the encapsulant and covers at least one of the first cavity or the second cavity.

[0015] According to another embodiment of the electronic device, the first cover covers both the first cavity and the second cavity.

[0016] According to another embodiment of the electronic device, the first cover covers the first cavity, and the second cover covers the second cavity.

[0017] The electronic device according to another embodiment of the invention includes a third electronic component above the top side of the substrate and covered by the encapsulating agent.

[0018] According to another embodiment of the electronic device, the third electronic component is located between the first electronic component and the second electronic component.

[0019] Another aspect of the present invention is a method of manufacturing an electronic device, comprising: providing a substrate including a first side, a second side opposite to the first side, a dielectric structure, and a conductive structure; providing an electronic component over the first side of the substrate, wherein the electronic component includes an image component facing away from the substrate at the first side of the electronic component; providing an interconnect coupled to the first side of the electronic component and the first side of the substrate; providing an encapsulating agent over the first side of the substrate and over the first side of the electronic component, wherein: the encapsulating agent defines a cavity over the first side of the electronic component; the image component is exposed in the cavity; the interconnect is in the encapsulating agent; and providing a cover over the cavity and covering the image component.

[0020] According to another embodiment of the method, the cavity is located within the area of ​​the first side of the electronic component.

[0021] According to another embodiment of the method, the electronic components and the interconnects are provided prior to the provision of the encapsulating agent.

[0022] According to another embodiment of the method of the present invention, a film-assisted molding process is used to provide the encapsulating agent. Attached Figure Description

[0023] Figure 1 A cross-sectional view of an example electronic device is shown.

[0024] Figures 2A to 2H A cross-sectional view of an example method for manufacturing an example electronic device is shown.

[0025] Figure 3 A cross-sectional view of an example electronic device is shown.

[0026] Figure 4 A cross-sectional view of an example electronic device is shown. Detailed Implementation

[0027] The following discussion provides various examples of electronic devices and methods of manufacturing electronic devices. These examples are non-limiting, and the scope of the appended claims should not be limited to the specific examples disclosed. In the following discussion, the terms "example" and "for example" are non-limiting.

[0028] The drawings illustrate the general construction method and may omit descriptions and details of well-known features and techniques to avoid unnecessarily obscuring the present disclosure. Furthermore, elements in the drawings are not necessarily drawn to scale. For example, the dimensions of some elements in different figures may be exaggerated relative to other elements to aid in understanding the examples discussed in this disclosure. The same reference numerals in different figures denote the same elements.

[0029] The term "or" refers to any one or more items in a list connected by "or". As an example, "x or y" means any element in the three-element set {(x),(y),(x,y)}. As another example, "x, y or z" means any element in the seven-element set {(x),(y),(z),(x,y),(x,z),(y,z),(x,y,z)}.

[0030] The terms “comprising” and “including” are “open” terms that specify the presence of the stated feature but do not preclude the presence or addition of one or more other features. The terms “first,” “second,” etc., may be used herein to describe various elements, and these elements should not be limited by these terms. These terms are used only to distinguish one element from another. Thus, for example, a first element discussed in this disclosure may be referred to as a second element without departing from the teachings of this disclosure.

[0031] Unless otherwise specified, the term "coupled" may be used to describe two elements in direct contact with each other, or to describe two elements indirectly coupled through one or more other elements. For example, if element A is coupled to element B, then element A may be in direct contact with element B or indirectly coupled to element B through intervening element C. Similarly, the terms "above" or "on" may be used to describe two elements in direct contact with each other, or to describe two elements indirectly coupled through one or more other elements. As used herein, the term "coupled" may refer to mechanical coupling or electrical coupling.

[0032] In one example, an electronic device includes: a substrate including a first side, a second side opposite to the first side, a dielectric structure, and a conductive structure; a first electronic component above the first side of the substrate, wherein the first electronic component includes an image component facing away from the substrate at the first side of the first electronic component; and an encapsulant above the first side of the substrate and above the first side of the first electronic component. The encapsulant defines a cavity above the first side of the first electronic component, and the image component is exposed in the cavity. The electronic device further includes an interconnection in the encapsulant and coupled to the first electronic component and the conductive structure, and a cover above the cavity and covering the image component.

[0033] In another example, an electronic device includes: a substrate including a top side, a bottom side, a dielectric structure, and a conductive structure; a first electronic component over the top side of the substrate, wherein the first electronic component includes a first image component facing away from the substrate at the top of the first electronic component; a second electronic component over the top side of the substrate, wherein the second electronic component includes a second image component facing away from the substrate at the top side of the first electronic component; and an encapsulant over the top side of the substrate and over the top side of the first and second electronic components. The encapsulant defines a first cavity over the top side of the first electronic component and a second cavity over the top side of the second electronic component, the first image component being in the first cavity and not covered by the encapsulant, and the second image component being in the second cavity and not covered by the encapsulant. The electronic device further includes a first interconnection in the encapsulant and coupled to the first electronic component and the conductive structure, a second interconnection in the encapsulant and coupled to the second electronic component and the conductive structure, and a first cap over the encapsulant and covering at least one of the first or second cavities.

[0034] In yet another example, a method of manufacturing an electronic device includes: providing a substrate including a first side, a second side opposite to the first side, a dielectric structure, and a conductive structure; providing an electronic component over the first side of the substrate, wherein the electronic component includes an image component facing away from the substrate at the first side of the electronic component; providing interconnects coupled to the first side of the electronic component and the first side of the substrate; and providing an encapsulating agent over the first side of the substrate and over the first side of the electronic component. The encapsulating agent defines a cavity over the first side of the electronic component, in which the image component is exposed, and the interconnects are contained within the encapsulating agent. The method further includes providing a cap over the cavity and covering the image component.

[0035] Other examples are included in this disclosure. These examples can be found in the drawings, claims, or description of this disclosure.

[0036] Figure 1 A cross-sectional view of an example electronic device 100 is shown. Figure 1In the illustrated example, electronic device 100 may include a substrate 110, which may include a dielectric structure 112 and a conductive structure 114. Electronic device 100 may include an electronic component 120 above a top side or a first side of the substrate 110. Electronic device 100 may have an image component 122 located on or above the top side or the first side of the electronic component 120. The image component 122 may face away from the substrate 110. In some examples, electronic component 120 may be coupled to the top side or the first side of the substrate 110 using an adhesive 128. The adhesive 128 may be between the bottom side or the second side of the electronic device 120 and the top side or the first side of the substrate 110. External interconnect 160 may be coupled to the bottom side or the second side of the substrate 110 and may be coupled to an outward terminal 116 of the conductive structure 114.

[0037] Electronic device 100 may include an encapsulant 140 over or coupled to the top or first side of substrate 110. In some examples, the lateral side of encapsulant 140 may be flush with or coplanar with the lateral side of substrate 110. In some examples, the lateral side of encapsulant 140 may be exposed from the lateral side of electronic device 100. Encapsulant 140 may cover the lateral side or the top or first side of electronic component 120. The top or first side of electronic component 120 may include a contact 124, and conductive structure 114 of substrate 110 may include an inward terminal 118 at or exposed on the top side of substrate 110. Interconnectors 126, such as wires, may be coupled to the contact 124 and the inward terminal 118. In some examples, interconnectors 126 may be within encapsulant 140, and encapsulant 140 may cover the contact 124 or the inward terminal 118. Cavity 142 may be defined by the inner wall 120x of the encapsulating agent 140 above the top side of the electronic component 120. Electronic device 100 may include a cover 150 disposed above the top side of the electronic component 120 and above cavity 142. In some examples, cover 150 may be coupled to the top side or a first side of the encapsulating agent 140 using adhesive 152.

[0038] Electronic device 100 may be referred to as a package. In some examples, the overall size of electronic device 100 can be reduced compared to other types of packages. In some examples, a cavity 142 with a reduced size can be provided compared to the cavity size of other types of package cavities. In some examples, the size of cavity 142 can be reduced by providing an encapsulant 140 covering the top side of electronic component 120 such that the inner sidewall 120x of the encapsulant 140 is within the area of ​​the top side of electronic component 120 or within the covered area of ​​electronic component 120. This places the area of ​​cavity 142 within the area of ​​the top side of electronic component 120, i.e., within the covered area of ​​electronic component 120. Furthermore, the process of providing encapsulant 140 on substrate 110 can eliminate the following regarding… Figures 2A to 2HThe pre-cutting operation discussed.

[0039] Figures 2A to 2H This illustrates the use of examples in manufacturing electronic devices (e.g., Figure 1 A cross-sectional view of an example method of electronic device 100. Figure 2A A cross-sectional view of an electronic device 100 in an early stage of manufacturing is shown. Figure 2A In the example shown, a substrate 110 may be provided, including a dielectric structure 112 and a conductive structure 114. The conductive structure 114 may include an inward terminal 118 at a first side 110a of the substrate 110 and an outward terminal 116 at a second side 110b of the substrate. In some examples, the first side 110a may be referred to as the top side of the substrate 110, and the second side 110b may be referred to as the bottom side of the substrate 110.

[0040] Substrate 110 may include a core or may be coreless. In some examples, substrate 110 may include, or be referred to as, a rigid printed circuit board, a flexible printed circuit board, a rigid laminated substrate, a flexible laminated substrate, a redistribution layer (RDL) substrate, a stacked substrate, a ceramic substrate, a glass substrate, or a silicon substrate. In some examples, the area or coverage of substrate 110 may vary depending on the area or number of electronic components 120 mounted to substrate 110. In some examples, the thickness of substrate 110 may be between about 0.005 mm and about 4 mm.

[0041] In some examples, substrate 110 may be an RDL or a stacked substrate. The RDL substrate may include one or more conductive redistribution layers and one or more dielectric layers, and may be (a) formed layer-by-layer over an electronic device coupled to the RDL substrate, or (b) formed layer-by-layer over a carrier that may be completely or at least partially removed after the RDL substrate is formed. For example, the RDL substrate may be formed layer-by-layer over a carrier, and then the electronic device may be attached to the RDL substrate, and the carrier may be removed while the electronic device is attached to the RDL substrate. The RDL substrate may be fabricated layer-by-layer in a wafer-level process as a wafer-level substrate on a circular wafer, or layer-by-layer in a panel-level process as a panel-level substrate on a rectangular or square panel carrier. The RDL substrate may be formed using an additive stacking process and may include one or more dielectric layers and one or more conductive layers stacked alternately, defining corresponding conductive redistribution patterns or traces configured to collectively (a) fan the traces out of the coverage area of ​​the electronic device, or (b) fan the traces into the coverage area of ​​the electronic device. Conductive patterns can be formed using plating processes such as electroplating or electroless plating. The conductive patterns may include conductive materials such as copper or other platingable metals. The locations of the conductive patterns can be created using photolithography processes such as photolithography and photoresist materials used to form the photomask. The dielectric layer of the RDL substrate can be patterned using photolithography processes and may include a photomask through which light is exposed to photo-pattern the desired features (e.g., vias in the dielectric layer). The dielectric layer may be made of photodeterminable organic dielectric materials such as PI, BCB, or PBO. These dielectric materials may be spin-coated or otherwise coated in liquid form rather than attached as a preform. To allow for proper formation of the desired photodeterminable features, these photodeterminable dielectric materials may omit structural reinforcing agents or may be filler-free, free of strands, fabrics, or other particles that may interfere with light from the photolithography process. In some examples, these filler-free characteristics of filler-free dielectric materials may allow for a reduction in the thickness of the resulting dielectric layer. Although the photodeterminable dielectric material described above can be an organic material, in some examples, the dielectric material of the RDL substrate may include one or more inorganic dielectric layers. Some examples of one or more inorganic dielectric layers may include silicon nitride (Si3N4), silicon oxide (SiO2), or silicon oxynitride (SiON). The one or more inorganic dielectric layers may be formed not by using photodeterminable organic dielectric materials, but by growing inorganic dielectric layers using oxidation or nitriding processes. These inorganic dielectric layers may be filler-free, without strands, fabrics, or other dissimilar inorganic particles. In some examples, the RDL substrate may omit a permanent core structure, such as a dielectric material including BT or FR4, and these types of RDL substrates may include, or be referred to as, coreless substrates. As disclosed herein, substrate 110 may include an RDL substrate and may be formed on a carrier.

[0042] In some examples, substrate 110 may be a preformed or laminated substrate. The preformed / laminated substrate may be fabricated prior to attachment to an electronic device and may include a dielectric layer between respective conductive layers. The conductive layer may include copper and may be formed using an electroplating process. The dielectric layer may be a relatively thick, non-photoconfinable layer and may serve as a preformed film rather than a liquid attachment, and may contain a resin with fillers such as strands, fabrics, or other inorganic particles for rigid or structural support. Because the dielectric layer is non-photoconfinable, features such as vias or openings can be formed using a drill or laser. In some examples, the dielectric layer may include a prepreg material or ABF. The preformed substrate may include a permanent core structure comprising a dielectric material such as BT or FR4, and the dielectric and conductive layers may be disposed above the permanent core structure. In other examples, the preformed substrate may be a coreless substrate omitting the permanent core structure. The preformed substrate may be referred to as a printed circuit board (PCB) or laminated substrate. Such a preformed substrate may be formed via a semi-additive or modified semi-additive process.

[0043] Figure 2B A cross-sectional view of an electronic device 100 in the later stages of manufacturing is shown. Figure 2B In the example shown, electronic component 120 may be coupled to a first side 110a of substrate 110, for example, using adhesive 128. The first side or top side of electronic component 120 may include an image component 122 facing away from substrate 110. The first side of electronic component 120 may also include a contact 124 facing away from substrate 110. In some examples, image component 122 may include an image sensor, including, but not limited to, a complementary metal-oxide-semiconductor (CMOS) image sensor (CIS). In some examples, image component 122 may include a lens or lens array, such as a microlens or microlens array (MLA), but the scope of the disclosed subject matter is not limited in this respect.

[0044] Figure 2C A cross-sectional view of an electronic device 100 in the later stages of manufacturing is shown. Figure 2C In the example shown, interconnect 126 is coupled to contact 124 of electronic component 120 and inward terminal 118 of conductive structure 114 of substrate 110. In some examples, interconnect 126 may include wires, but the scope of the disclosed subject matter is not limited in this respect.

[0045] Figures 2D to 2F A cross-sectional view of an electronic device 100 in the later stages of manufacturing is shown. Figure 2DIn the example shown, a mold 160 is disposed over a first side 110a of a substrate 120, wherein a cavity 164 is disposed over the first side 110a of the substrate 110 according to the shape of the mold 160. A membrane 162 may be configured to conform to the shape of the mold 160 on the cavity 164 side of the mold 160, for example by using a vacuum to conform the membrane 162 to the shape of the mold 160. The cavity 164 defines an area in which an encapsulant 140 may be provided during the molding process. In some examples, the membrane 162 may protect the image assembly 122 from contact with the encapsulant 140 during the molding process. In some examples, the shape of the mold 160 may allow the top and lateral sides of the electronic assembly 120, contacts 124, inward terminals 118, and interconnects 126 to be exposed in the cavity 164 during the molding process, such that these elements may be covered by the encapsulant 140.

[0046] like Figure 2E As shown, encapsulating agent 140 can be provided in mold cavity 164. In some examples, the molding process may include a film-assisted molding (FAM) process, in which a liquid mold is inserted or injected into mold cavity 164 and then cured. Figure 2F As shown, after curing, the mold 160 can be separated from and removed from the encapsulant 140, wherein the film 162 facilitates the separation to expose the top and lateral sides of the encapsulant 140. In some examples, the molding process may be the same as or similar to the molding process used to manufacture microelectromechanical systems (MEMS) or biomedical MEMS (BioMEMS) devices with cavities, but the scope of the disclosed subject matter is not limited in this respect. After the encapsulant 140 is provided, a cavity 142 may be defined above the top side of the electronic component 120 via the inner sidewall 120x of the encapsulant 140, wherein the image component 122 is located in the cavity 142. In some examples, the cavity 142 is defined within the covered area of ​​the electronic component 120 such that the area of ​​the cavity 142 is within the area of ​​the top side of the electronic component 120. The encapsulant 140 may cover the top and lateral sides of the electronic component 120, as well as the first side 110 of the substrate 110.

[0047] Figure 2G A cross-sectional view of an electronic device 100 in the later stages of manufacturing is shown. Figure 2GIn the illustrated example, a cover 150 may be disposed above the cavity 142, above the top side of the electronic component 120 and above the imaging component 122. The cover 150 may be above the encapsulant 140 and may be coupled to a first side 140a of the encapsulant using an adhesive 152. In some examples, the first side 140a of the encapsulant 140 may be referred to as the top side of the encapsulant 140. In some examples, the area covered by the cover 150 may be smaller than the area of ​​the first side 140a of the encapsulant 140, such that the lateral side of the cover 150 does not extend to the lateral side of the encapsulant 140, thereby leaving the first side 140a of the encapsulant 140 uncovered or exposed. In some examples, the adhesive 152 may hermetically seal the cover 150 to the encapsulant 140 to hermetically isolate the cavity 142 from the surrounding environment of the electronic device 100. In some examples, the adhesive 152 may be gas-permeable and liquid- or moisture-impermeable, but the scope of the subject matter of this disclosure is not limited in this respect. In some examples, cover 150 may comprise a transparent or translucent material, such as glass, quartz, or plastic (e.g., polymethyl methacrylate). In some examples, cover 50 may be transparent to electromagnetic waves (e.g., infrared, ultraviolet, or visible light) at the operating wavelength of image component 122.

[0048] Figure 2H A cross-sectional view of an electronic device 100 in the later stages of manufacturing is shown. Figure 2G In the example shown, the external interconnect 160 can be coupled to a second side 110b or bottom side of the substrate 110 and can be coupled to the outward terminal 116 of the conductive structure 114. After providing the external interconnect 160, a saw or laser can be used to cut or saw the encapsulant 140 and the lateral side of the substrate 110 at the cutting line S to provide an electronic device 100 of the desired package size. Figures 2A to 2HIn the manufacturing process shown, the electronic component 120 can be attached to the substrate 110 before the encapsulant 140 is provided, and the interconnect 126 can be provided, for example, by wire bonding. This disclosed process allows the top side of the electronic component 120 to be covered by the encapsulant 140, enabling a smaller cavity 142 to be provided above the electronic component 120 and located within the covered area of ​​the electronic component. The reduced size of the cavity 142 can decrease the number of foreign material defects in the cavity 142, which is part of the workpiece of the disclosed process. This disclosed process also allows the interconnect 126 and the inward terminal 118 to be located within the encapsulant 140 rather than outside the encapsulant 140. Furthermore, the pre-cutting operation of the encapsulant 140 at the first side 140a and lateral end, which occurs before the electronic component 120 is provided, before the interconnect 126 is provided, and before the attachment cap 150, can be eliminated. The distance between the lateral edge of the image component 120 and the inner lateral edge of the contact 124 can be 650 micrometers (µm) or greater. The distance between the lateral side of the electronic component 120 and the inner lateral side of the outermost interconnect 160 can be 330 µm or greater. The width of the adhesive 152 in contact with the bottom side of the cover 150 from the inner contact point to the lateral side of the cover 150 can be 580 µm or greater. The distance from the lateral side of the cover 150 to the lateral side of the encapsulant 140 can be 400 µm or greater. The thickness of the encapsulant 140, as measured from the top side of the electronic component 120 to the first side 140a of the encapsulant 140, can be 250 µm or greater. It should be noted that these are merely examples of various features of the electronic device 100, and the scope of the disclosed subject matter is not limited in these respects.

[0049] Figure 3 A cross-sectional view of an example of electronic device 200 is shown. Figure 3 In the example shown, similar to Figure 1 The electronic device 100 and electronic device 200 may include a substrate 110, electronic components 120, an image component 122, interconnects 126, an encapsulant 140, a cavity 142, a cover 150, and external interconnects 160. They can be used with... Figures 2A to 2H Electronic device 200 is manufactured using the same or similar process as shown.

[0050] According to various examples, electronic device 200 may further include electronic component 220 coupled to a first side 110a of substrate 110 and coupled to conductive structure 114. In some examples, the electronic device may be on either side of electronic component 120 and located outside the coverage area of ​​cavity 142. Electronic component 220 may include active or passive devices, such as resistors, capacitors, inductors, transformers, antennas, etc., and the scope of the disclosed subject matter is not limited in these respects.

[0051] Figure 4 A cross-sectional view of an example of electronic device 300 is shown. Figure 3 In the example shown, similar to Figure 1 The electronic device 100 or the electronic device 200 of FIG. 2, the electronic device 300 may include a substrate 110, electronic components 120, image components 122, interconnects 126, encapsulant 140, cavity 142, cover 150 and external interconnects 160. It can be used with... Figures 2A to 2H Electronic device 200 is manufactured using the same or similar process as shown.

[0052] According to various examples, electronic device 300 may have multiple electronic components and multiple corresponding cavities. For example, encapsulant 140 may define cavity 142 above electronic component 120 and cavity 342 above electronic component 320. Image component 122 of electronic component 120 may be in cavity 142, and image component 322 of electronic component 320 may be in cavity 342. In some examples, electronic component 220 may be in encapsulant 140, located outside the coverage area of ​​cavity 142 and outside the coverage area of ​​cavity 342. For example, electronic component 220 may be between electronic component 120 and electronic component 320, such as... Figure 4 As shown. In some examples, Figure 4 The electronic device 300 can be like Figure 3 The electronic component 220 is included between the lateral sides of the electronic component 120 and the encapsulant 140, or between the lateral sides of the electronic component 320 and the encapsulant 140, with or without the electronic component 220 between the electronic component 120 and the electronic component 320.

[0053] although Figure 4 A single cover 150 is shown covering both cavities 142 and 342, but in some examples, two or more covers 150 may be provided, with each of cavities 142 and 342 covered by a corresponding cover of one of the covers 150. In such an arrangement, a first cover 150 may be above cavity 142 and a second cover 150 may be above cavity 342, but the scope of the disclosed subject matter is not limited in this respect.

[0054] This disclosure includes references to certain examples. However, those skilled in the art will understand that various changes can be made and equivalents can be substituted without departing from the scope of this disclosure. Furthermore, modifications can be made to the disclosed examples without departing from the scope of this disclosure. Therefore, it is intended that this disclosure be limited to the disclosed examples, but rather to include all examples falling within the scope of the appended claims.

Claims

1. An electronic device, characterized in that, include: A substrate, comprising a first side, a second side opposite to the first side, a dielectric structure, and a conductive structure; A first electronic component is located above the first side of the substrate, wherein the first electronic component includes an image component facing away from the substrate at the first side of the first electronic component; An encapsulating agent is provided above the first side of the substrate and above the first side of the first electronic component, wherein the encapsulating agent defines a cavity above the first side of the first electronic component, and wherein the image component is exposed in the cavity. Interconnectors, which are contained in the encapsulant and coupled to the first electronic component and the conductive structure; as well as A cover is placed over the cavity and covers the image component.

2. The electronic device according to claim 1, characterized in that, The cavity is located within the area of ​​the first side of the first electronic component.

3. The electronic device according to claim 1, characterized in that, The first electronic component includes a contact at a first side of the first electronic component, wherein the interconnect is coupled to the contact and the encapsulant covers the contact.

4. The electronic device according to claim 1, characterized in that, The conductive structure includes an inward terminal at the first side of the substrate, wherein the interconnect is coupled to the inward terminal and the encapsulant covers the inward terminal.

5. The electronic device according to claim 1, characterized in that, The cap is coupled to the first side of the encapsulating agent using an adhesive.

6. The electronic device according to claim 1, characterized in that, A first portion of the first side of the sac is covered by the cap, and a second portion of the first side of the sac is not covered by the cap.

7. The electronic device according to claim 1, characterized in that, The lateral side of the encapsulating agent is coplanar with the lateral side of the substrate.

8. The electronic device according to claim 1, characterized in that, The second side of the first electronic component is coupled to the first side of the substrate using an adhesive.

9. The electronic device according to claim 1, characterized in that, The encapsulating agent covers the lateral side of the first electronic component.

10. The electronic device according to claim 1, characterized in that, A second electronic component is included in the encapsulating agent and coupled to the first side of the substrate, wherein the second electronic component is outside the covered area of ​​the cavity.

11. The electronic device according to claim 1, characterized in that, The image assembly includes an image sensor, and the cover is transparent to light with the same wavelength as the operating wavelength of the image sensor.

12. An electronic device, characterized in that, include: The substrate includes a top side, a bottom side, a dielectric structure, and a conductive structure; A first electronic component is located above the top side of the substrate, wherein the first electronic component includes a first image component facing away from the substrate at the top of the first electronic component; A second electronic component is located above the top side of the substrate, wherein the second electronic component includes a second image component facing away from the substrate at the top side of the first electronic component; An encapsulating agent is disposed above the top side of the substrate and above the top side of the first electronic component and the top side of the second electronic component, wherein: The encapsulating agent defines a first cavity above the top side of the first electronic component and a second cavity above the top side of the second electronic component; The first image component is within the first cavity and is not covered by the encapsulating agent; and The second image component is located in the second cavity and is not covered by the encapsulating agent; A first interconnect is contained in the encapsulant and coupled to the first electronic component and the conductive structure; A second interconnect, which is contained in the encapsulant and coupled to the second electronic component and the conductive structure; and A first cap is placed over the sac sealant and covers at least one of the first cavity or the second cavity.

13. The electronic device according to claim 12, characterized in that, The first cover covers both the first cavity and the second cavity.

14. The electronic device according to claim 12, characterized in that, The first cover covers the first cavity, and the second cover covers the second cavity.

15. The electronic device according to claim 12, characterized in that, A third electronic component is included above the top side of the substrate and covered by the encapsulating agent.

16. The electronic device according to claim 15, characterized in that, The third electronic component is located between the first electronic component and the second electronic component.

17. A method for manufacturing an electronic device, characterized in that, include: A substrate is provided, the substrate including a first side, a second side opposite to the first side, a dielectric structure, and a conductive structure; An electronic component is provided above the first side of the substrate, wherein the electronic component includes an image component facing away from the substrate at the first side of the electronic component; An interconnect is provided that is coupled to the first side of the electronic component and the first side of the substrate; An encapsulating agent is provided above the first side of the substrate and above the first side of the electronic component, wherein: The encapsulating agent defines a cavity above the first side of the electronic component; The image component is exposed in the cavity; The interconnecting element is contained in the encapsulating agent; and A cover is provided above the cavity and covers the image component.

18. The method according to claim 17, characterized in that, The cavity is located within the area of ​​the first side of the electronic component.

19. The method according to claim 17, characterized in that, The electronic components and the interconnects are provided prior to the provision of the encapsulant.

20. The method according to claim 17, characterized in that, The encapsulating agent is provided using a membrane-assisted molding process.

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