A mobile bernoulli chuck

Abstract

The application relates to a mobile Bernoulli chuck, which comprises a circular adsorption disc, a supporting disc, a guide handle, an adjusting hinge, a fluid control valve and a gas supply joint. The circular adsorption disc is a hollow structure and is provided with a connecting piece at the edge; the bottom surface of the circular adsorption disc is circumferentially provided with a plurality of jet slits. The supporting disc is horizontally arranged below the circular adsorption disc and is provided with an extension connecting part between the circular adsorption disc; a gap for placing a wafer is reserved between the supporting disc and the circular adsorption disc. The guide handle is internally provided with an airflow channel. The adjusting hinge is arranged between the circular adsorption disc and the guide handle, one end of the adjusting hinge is hingedly connected with the leading end of the guide handle, the other end of the adjusting hinge is hingedly connected with the connecting piece, and the adjusting hinge is used for adjusting the deflection angle between the circular adsorption disc and the guide handle. The fluid control valve is installed on the guide handle and is used for controlling the conduction and cutoff of the airflow channel. The gas supply joint is arranged at the end of the guide handle far away from the circular adsorption disc and is used for connecting a mobile gas source.

Description

Technical Field

[0001] This invention relates to the field of material handling equipment technology, and more specifically to a mobile Bernoulli suction cup. Background Technology

[0002] Currently, in the wafer manufacturing process of semiconductor devices, existing heavy-duty fixed Bernoulli chucks are typically used for workpiece transfer within the same machine station. When wafer transfer is required between two machine stations that are slightly further apart, the industry still commonly uses contact vacuum chucks, tweezers, or manual picking. However, during manual handling over long distances, hand tremors can easily cause scratches, marks, or physical contamination on the wafer surface. Furthermore, if a contact vacuum chuck leaks air, the wafer may fall off and be damaged. Summary of the Invention

[0003] The purpose of this invention is to provide a mobile Bernoulli suction cup that, by setting a guide handle connected to a mobile air source and a circular suction cup, enables the overall mobility of the Bernoulli suction cup, expanding the range of manual handling across workstations. Simultaneously, by using the high-speed gas ejection slits on the bottom of the circular suction cup to generate a negative pressure zone through the Bernoulli effect, non-contact suspension adsorption of the wafer can be achieved, avoiding surface scratches, marks, and physical contamination easily caused by traditional contact handling. Furthermore, the support tray placed flat directly below the circular suction cup provides physical protection for long-distance handheld movement, and can promptly support the wafer in case of an accident causing it to fall, preventing it from directly hitting the ground and breaking.

[0004] To achieve the above objectives, the present invention provides a movable Bernoulli suction cup, comprising: A circular adsorption disk, wherein the circular adsorption disk has a hollow structure and is provided with a connector at its edge, and the bottom surface of the circular adsorption disk is provided with a number of air jet slits around the periphery. The support tray is placed flat directly below the circular adsorption disk and has an extended connection between it and the circular adsorption disk. A gap is reserved between the support tray and the circular adsorption disk for wafer placement. A guide handle, wherein an airflow channel is provided inside the guide handle; An adjusting hinge is disposed between the circular adsorption disk and the guide handle. One end of the adjusting hinge is hinged to the first end of the guide handle, and the other end of the adjusting hinge is hinged to the connecting piece. It is used to adjust the deflection angle between the circular adsorption disk and the guide handle. A fluid control valve, mounted on the guide handle, is used to control the opening and closing of the airflow channel; An air supply connector is located at the end of the guide handle away from the circular adsorption disk, and is used to connect a mobile air source; The airflow channel introduces an external air source through the air supply connector, and the airflow channel passes through the guide handle and is connected to the circular adsorption plate through a hose.

[0005] Optionally, the support tray has a hollow ring structure, and the top surface of the support tray has several air blowing holes. The support tray is connected to the airflow channel through a flexible hose.

[0006] Optionally, the top surface of the circular adsorption plate is fixedly provided with a limiting strip protruding in a direction away from the guide handle. The limiting strip is used to abut against the inner wall of the flower basket to limit the movement of the circular adsorption plate when it is inserted into the flower basket.

[0007] Optionally, the top surface of the support tray is affixed with an elastic cushioning pad to prevent the workpiece from directly impacting the support tray.

[0008] Optionally, the fluid control valve is a manual push-button switch.

[0009] Optionally, the movable Bernoulli suction cup further includes: A portable air compressor is provided with several casters at its bottom and a push rod on its side. The exhaust end of the portable air compressor is connected to the air supply connector.

[0010] Optionally, a filter purifier, a pressure regulating valve, a pressure gauge, and a flow meter are connected in series between the portable air compressor and the air supply connector.

[0011] The beneficial effects of this invention are as follows: by setting a guide handle connected to a mobile air source and a circular adsorption plate, the Bernoulli suction cup can be moved as a whole, expanding the range of manual hand-held movement across workstations; at the same time, by spraying gas at high speed through the air jet slits on the bottom of the circular adsorption plate and using the Bernoulli effect to generate a negative pressure zone, non-contact suspension adsorption of the wafer can be achieved, avoiding surface scratches, marks and physical contamination that are easily caused by traditional contact handling; in addition, the support tray placed flat directly below the circular adsorption plate can provide physical protection for long-distance hand-held movement, and can support the wafer in time when a sudden accident causes the wafer to fall, preventing the wafer from falling directly to the ground and breaking.

[0012] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, the preferred embodiments of the present invention are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0013] Figure 1This is a schematic side view of the circular suction cup and guide handle of a movable Bernoulli suction cup according to an embodiment of the present invention. Figure 2 This is a schematic top view of the circular suction cup and guide handle of a movable Bernoulli suction cup according to an embodiment of the present invention. Figure 3 This is a schematic structural diagram of the tray of a movable Bernoulli suction cup according to an embodiment of the present invention; Figure 4 This is a schematic structural diagram of a movable Bernoulli suction cup according to an embodiment of the present invention; In the diagram: 1. Circular suction plate; 11. Connector; 12. Air jet slit; 13. Limiting strip; 2. Support tray; 21. Extended connection; 22. Air blowing hole; 23. Elastic buffer pad; 3. Guide handle; 31. Fluid control valve; 32. Air delivery connector; 4. Adjustable hinge; 5. Portable air compressor; 51. Moving casters; 52. Push rod; 6. Filter purifier; 7. Pressure regulating valve; 8. Pressure gauge; 9. Flow meter. Detailed Implementation

[0014] The technical solution of the present invention will now be clearly and completely described with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0015] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0016] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances. Furthermore, the technical features involved in the different embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0017] Please see Figures 1 to 4 A preferred embodiment of this application shows a movable Bernoulli suction cup comprising a circular suction cup 1, a support tray 2, a guide handle 3, an adjusting hinge 4, a fluid control valve 31, and an air supply connector 32. The circular suction cup 1 is hollow and has a connecting piece 11 at its edge. Several air slits 12 are arranged circumferentially around the bottom surface of the circular suction cup 1. The support tray 2 is placed flat below the circular suction cup 1 and has an extended connecting portion 21 between it and the circular suction cup 1. A gap is reserved between the support tray 2 and the circular suction cup 1 for wafer insertion. An airflow channel is provided inside the guide handle 3. The adjusting hinge 4 is disposed between the circular suction cup 1 and the guide handle 3. One end of the adjusting hinge 4 is hinged to the first end of the guide handle 3, and the other end is hinged to the connecting piece 11, used to adjust the deflection angle between the circular suction cup 1 and the guide handle 3. The fluid control valve 31 is mounted on the guide handle 3 and used to control the opening and closing of the airflow channel. An air supply connector 32 is located at the end of the guide handle 3 furthest from the circular adsorption disk 1, and is used to connect a mobile air source. The airflow channel introduces an external air source through the air supply connector 32, and after passing through the guide handle 3, the airflow channel is connected to the circular adsorption disk 1 through a hose.

[0018] According to the embodiment of the present invention, by setting a guide handle 3 connected to a mobile air source and a circular adsorption plate 1, the Bernoulli suction cup can be moved as a whole, expanding the range of manual hand-held movement across workstations. At the same time, by spraying gas at high speed through the air jet slit 12 on the bottom surface of the circular adsorption plate 1 and generating a negative pressure zone using the Bernoulli effect, non-contact suspension adsorption of the wafer can be achieved, avoiding surface scratches, marks, and physical contamination that are easily caused by traditional contact handling. In addition, the support tray 2 placed flat directly below the circular adsorption plate 1 can provide physical protection for long-distance hand-held movement, and can support the wafer in time when a sudden accident causes the wafer to fall off, preventing the wafer from falling directly to the ground and breaking.

[0019] The following detailed description uses specific examples: Please see Figure 3The support tray 2 has a hollow ring structure, and several air holes 22 are opened on the top surface of the support tray 2. The support tray 2 is connected to the airflow channel through a hose. When high-pressure gas is introduced into the support tray 2, the airflow can continuously blow upwards on the bottom surface of the wafer through these air holes 22. This can not only effectively prevent the adhesion and accumulation of external dust on the back of the wafer during long-distance transportation, but also reduce the hard contact area between the support tray 2 and the wafer in the event of an accidental drop, thereby reducing the probability of scratches on the wafer surface.

[0020] Please see Figure 1 and Figure 2 The top surface of the circular adsorption disk 1 is fixedly provided with a limiting strip 13 protruding away from the guide handle 3. The limiting strip 13 is used to abut against the inner wall of the basket when the circular adsorption disk 1 is inserted into the basket. The outward extension of the limiting strip 13 is precisely matched so that when the circular adsorption disk 1 is fully inserted into the basket, the limiting strip 13 can reach the innermost inner wall of the basket first, thereby providing a hard limiting and isolation effect on the insertion depth, preventing the wafer edge from colliding with and damaging the extension connection part 21 behind it, and also ensuring that the circular adsorption disk 1 can be stably aligned with the center of the wafer to maintain stable suspension.

[0021] Please see Figure 3 The top surface of the support tray 2 is covered with an elastic buffer pad 23 to prevent the workpiece from directly impacting the support tray 2. When the wafer falls onto the support tray 2 due to some unexpected situation, this elastic buffer pad 23 can absorb the physical impact energy of the wafer falling in time, alleviate the local stress concentration caused by the hard impact, and thus protect the brittle wafer from mechanical breakage. Specifically, in this embodiment, the elastic buffer pad 23 is made of antistatic material, and the surface resistivity of the elastic buffer pad 23 is 10. 5 Ohms to 10 9 ohm.

[0022] Specifically, the fluid control valve 31 is a manual push-button switch.

[0023] Please see Figure 4The mobile Bernoulli suction cup also includes a portable air compressor 5. The portable air compressor 5 has several casters 51 at its bottom and a push rod 52 on its side. The exhaust end of the portable air compressor 5 is connected to the air supply connector 32. A filter purifier 6, a pressure regulating valve 7, a pressure gauge 8, and a flow meter 9 are connected in series between the portable air compressor 5 and the air supply connector 32. With the help of the casters 51 and the push rod 52, a portable mobile station can be equipped for the entire suction cup system, expanding the travel radius limitations of traditional fixed pipeline air sources. Operators can move freely between different production machines and process turnover workshops at relatively long distances. The series-connected air supply accessories can perform fine-tuning of dust removal and pressure adjustment on the airflow output by the mobile compressor at any time, ensuring that the ejected airflow meets the cleanliness requirements of semiconductors. Simultaneously, operators can dynamically fine-tune the air pressure according to wafers of different thicknesses and sizes, ensuring the stability of the flow field during long-distance cross-workstation transfers.

[0024] When the mobile Bernoulli suction cup is transferred across workstations, the operator first pushes the portable air compressor 5 to the starting workstation using push rod 52 and turns it on. The gas is purified by filter purifier 6 and pressure regulated by pressure regulating valve 7 before flowing to gas delivery connector 32. Next, the operator holds the guide handle 3 and uses adjusting hinge 4 and connector 11 to adjust the circular suction plate 1 and support tray 2 to a horizontal state, and inserts them into the gaps on both sides of the wafer inside the basket until the limiting strip 13 abuts against the inner wall of the basket. Subsequently, the operator presses fluid control valve 31 to open the airflow channel, and the gas is diverted through gas delivery connector 32: part of the gas... The gas is introduced into the circular adsorption plate 1 through a hose and then ejected at high speed through the jet slit 12. Utilizing the Bernoulli effect, the gas suspends and adsorbs the wafer non-contactly. Another portion of the gas is introduced into the support tray 2 through a hose and blown upwards through the air outlet 22 to prevent dust from entering the bottom surface of the wafer. Next, the operator holds the guide handle 3 and pushes the movable air compressor 5 to manually move the wafer to the next machine station, which is farther away. During this long-distance movement, the support tray 2 and the elastic buffer pad 23 provide drop protection for the wafer. Finally, at the target location, the fluid control valve 31 is released to stop the airflow channel, the circular adsorption plate 1 stops jetting, and the wafer is placed smoothly on the next machine station.

[0025] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0026] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A movable Bernoulli suction cup, characterized in that, include: A circular adsorption disk, wherein the circular adsorption disk has a hollow structure and is provided with a connector at its edge, and the bottom surface of the circular adsorption disk is provided with a number of air jet slits around the perimeter. The support tray is placed flat directly below the circular adsorption disk and has an extended connection between it and the circular adsorption disk. A gap is reserved between the support tray and the circular adsorption disk for wafer placement. A guide handle, wherein an airflow channel is provided inside the guide handle; An adjusting hinge is disposed between the circular adsorption disk and the guide handle. One end of the adjusting hinge is hinged to the first end of the guide handle, and the other end of the adjusting hinge is hinged to the connecting piece. It is used to adjust the deflection angle between the circular adsorption disk and the guide handle. A fluid control valve, mounted on the guide handle, is used to control the opening and closing of the airflow channel; An air supply connector is located at the end of the guide handle away from the circular adsorption disk, and is used to connect a mobile air source; The airflow channel introduces an external air source through the air supply connector, and the airflow channel passes through the guide handle and is connected to the circular adsorption plate through a hose.

2. The movable Bernoulli suction cup according to claim 1, characterized in that, The support tray has a hollow ring structure, and several air holes are opened on the top surface of the support tray. The support tray is connected to the airflow channel through a flexible tube.

3. The movable Bernoulli suction cup according to claim 1, characterized in that, The top surface of the circular adsorption plate is fixedly provided with a limiting strip that protrudes away from the guide handle. The limiting strip is used to abut against the inner wall of the flower basket to limit the movement of the circular adsorption plate when it is inserted into the flower basket.

4. The movable Bernoulli suction cup according to claim 1, characterized in that, The top surface of the support tray is covered with an elastic cushioning pad to prevent the workpiece from directly impacting the support tray.

5. The movable Bernoulli suction cup according to claim 1, characterized in that, The fluid control valve is a manual push-button switch.

6. The movable Bernoulli suction cup according to claim 1, characterized in that, Also includes: A portable air compressor is provided with several casters at its bottom and a push rod on its side. The exhaust end of the portable air compressor is connected to the air supply connector.

7. The movable Bernoulli suction cup according to claim 6, characterized in that, A filter purifier, a pressure regulating valve, a pressure gauge, and a flow meter are connected in series between the portable air compressor and the air supply connector.

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