A buffer type automatic screening device for wafer resistor manufacturing

Abstract

The application discloses a buffering type automatic screening device for wafer resistor manufacturing and belongs to the technical field of wafer resistor manufacturing, which comprises a supporting frame, a mounting frame is fixedly installed on the upper surface of the supporting frame, a screening mechanism is arranged on the inner surface of the supporting frame, a vibrating mechanism is arranged on the lower surface of the supporting frame, a feeding mechanism is arranged on the upper surface of the mounting frame, and a pre-classification mechanism is arranged on the inner surface of the mounting frame. In the application, the pre-classification mechanism is used for preliminarily separating wafer resistors and accompanying plating materials according to the weight difference between the wafer resistors and the accompanying plating materials by using airflow, then the screening mechanism is used for accurately separating the wafer resistors and the accompanying plating materials by adjusting the gap, the screening device is used for realizing the synergistic effect of the two screening mechanisms, the separation precision of the screening device is further improved, and the loss rate caused by the mixture of the wafer resistors and the accompanying plating materials is reduced.

Description

Technical Field

[0001] This invention belongs to the field of wafer resistor manufacturing technology, and particularly relates to a buffer-type automatic sorting device for wafer resistor manufacturing. Background Technology

[0002] In the field of modern electronic technology, many industries such as power systems, communication equipment, automotive electronics, and industrial automation have increasingly stringent performance requirements for electronic components. High-voltage lead-free thick-film wafer resistors are a key electronic component with extremely important application value. During the manufacturing of wafer resistors, some products may fall into the plating collection box along with the plating substrate. Moreover, the products have irregular structures, and direct falling into the product collection box may cause collisions and damage to the products.

[0003] A search revealed Chinese Patent Publication No. CN119588626A, which discloses a ceramic rod screening device and method for wafer resistors. The device includes a frame, a control module, a drive component, a screening component, and a rejection component. A loading platform is mounted on the frame. The screening component includes a fixed chuck fixedly mounted on the loading platform. The fixed chuck has a mounting groove, within which a lower gear disc is fixed. An upper gear disc connected to the drive component is mounted on the lower gear disc. The fixed chuck has a loading port. One end of the lower gear disc near the loading port has a first outlet for discharging wafer resistors with smaller diameters, and the other end has a second outlet for discharging qualified wafer resistors. The upper gear disc has V-shaped grooves evenly distributed circumferentially along its edge, and a third outlet is located at its center. The V-shaped grooves are used by the rejection component to reject wafer resistors with larger diameters, discharging them into the third outlet.

[0004] Regarding the aforementioned technologies, the inventors have discovered the following drawbacks: In the electroplating process, in order to ensure uniform plating, a co-plating agent is required to assist in conductivity. Existing screening devices are difficult to completely separate these co-plated materials. Some small-sized wafer resistors are easily mixed in with the co-plating agent and fall into the co-plating agent collection box, causing product loss. Furthermore, wafer resistors have irregular sheet / column structures. When they fall directly into the rigid collection box, they are prone to damage such as edge chipping, cracking, and plating peeling due to high-speed collisions, resulting in a decrease in yield. At the same time, traditional vibrating screens and magnetic screens cannot simultaneously achieve efficient separation and flexible conveying of small-sized products, and their irregular structures are prone to getting stuck in the screen holes, causing equipment jamming and shutdown.

[0005] Therefore, the present invention provides a buffer-type automatic sorting device for manufacturing wafer resistors to solve the above-mentioned problems. Summary of the Invention

[0006] The purpose of this invention is to provide a buffer-type automatic sorting device for manufacturing wafer resistors in order to solve the above-mentioned problems.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a buffer-type automatic screening device for manufacturing wafer resistors, comprising a support frame, an mounting frame fixedly mounted on the upper surface of the support frame, one end of the mounting frame near the support frame, movable grooves of the same size provided on both side walls of the support frame, a screening mechanism provided on the inner surface of the support frame, a vibration mechanism provided on the lower surface of the support frame, a feeding mechanism provided on the upper surface of the mounting frame, and a pre-grading mechanism provided on the inner surface of the mounting frame;

[0008] The screening mechanism includes a moving rod, the outer surface of which is slidably connected to the inner surface of the moving groove. Mounting plates are fixedly installed on both the moving rod and the inner sidewall of the support frame. The mounting plates are symmetrically distributed between the moving rod and the support frame. Transmission rollers are symmetrically rotatably installed between the mounting plates. A transmission belt is driven between the transmission rollers. The outer surface of the transmission belt is covered with a polyurethane elastic layer.

[0009] As a further description of the above technical solution:

[0010] Both the movable frame and the support frame have drive motors fixedly mounted on their side walls via mounting bases. The output end of the drive motor is fixedly connected to the side wall of one of the transmission rollers via a drive shaft.

[0011] As a further description of the above technical solution:

[0012] The screening mechanism also includes an adjusting motor. The outer surface of the adjusting motor is fixedly connected to the other side wall of the support frame via a connecting seat. A threaded rod is fixedly installed at the output end of the adjusting motor. A positioning plate is rotatably installed at one end of the threaded rod. The side wall of the positioning plate is fixedly connected to the other side wall of the support frame. A threaded sleeve is threadedly installed on the outer surface of the threaded rod. The side wall of the threaded sleeve is fixedly connected to the other side wall of the moving rod.

[0013] As a further description of the above technical solution:

[0014] The vibration mechanism includes a collection frame and a rotating rod. The upper surface of the collection frame is fixedly connected to the lower surface of the support frame. The collection frame is located between the mounting plate on the support frame and the mounting plate on the moving rod. A discharge port is provided on the side wall of the collection frame, and a discharge trough is fixedly installed on the side wall of the collection frame. The discharge trough and the discharge port correspond to each other.

[0015] As a further description of the above technical solution:

[0016] A connecting sleeve is symmetrically mounted on the outer surface of the rotating rod. The side wall of the connecting sleeve is fixedly connected to the side wall of the collecting frame. A fixed plate is fixedly mounted at equal intervals on the outer surface of the rotating rod. Several protrusions are fixedly mounted at equal intervals on the outer surface of the fixed plate. A movable groove is provided on the side wall of the connecting sleeve. A first toothed sprocket is fixedly mounted on the outer surface of the rotating rod. The first toothed sprocket is located outside the connecting sleeve.

[0017] As a further description of the above technical solution:

[0018] The vibration mechanism also includes a lifting plate and connecting columns. The two ends of the lifting plate extend into the movable slots of the two connecting plates respectively. A connecting spring is fixedly installed on the lower surface of the lifting plate. One end of the connecting spring is fixedly connected to the inner wall of the bottom surface of the movable slot. A striking rod is fixedly installed at equal intervals on the upper surface of the lifting plate. The striking rod corresponds to the lower surface of the collection frame. A number of top rods are evenly arranged on the lower surface of the lifting plate. The top rods correspond to the outer surface of the fixed plate.

[0019] As a further description of the above technical solution:

[0020] One end of the connecting column is fixedly connected to the side wall of one of the transmission rollers on the support frame. A second toothed sprocket is fixedly installed on the outer surface of the connecting column. The diameter of the second toothed sprocket is larger than that of the first toothed sprocket. The second toothed sprocket and the first toothed sprocket are connected by a toothed chain drive.

[0021] As a further description of the above technical solution:

[0022] The pre-grading mechanism includes a conveyor, the outer surface of which is fixedly connected to the inner surface of the mounting frame. The conveyor is located below the feeding mechanism. A conveyor motor is fixedly installed on the side wall of the conveyor. The output end of the conveyor motor is fixedly connected to the drive end of the conveyor. One end of the conveyor extends to the outside of the mounting frame.

[0023] As a further description of the above technical solution:

[0024] A mounting sleeve is fixedly installed on the lower surface of the conveyor, and a high-pressure air pipe is fixedly installed between the mounting sleeves. A high-pressure adjustable air nozzle is connected to the side wall of the high-pressure air pipe. A connecting rod is fixedly installed on the end face of the conveyor, and a guide plate is fixedly installed at one end of the connecting rod. The air outlet end of the high-pressure adjustable air nozzle corresponds to the guide plate, and a discharge box is fixedly installed on the side wall of the guide plate.

[0025] As a further description of the above technical solution:

[0026] The feeding mechanism includes a feeding hopper, a discharge frame is fixedly installed on the lower surface of the feeding hopper, a through groove is provided on the upper surface of the mounting frame, the outer surface of the discharge frame is fixedly connected to the inner surface of the through groove, feeding rollers are rotatably installed on the inner walls of both sides of the discharge frame, a feeding motor is fixedly installed on the side wall of the discharge frame, and the output end of the feeding motor is fixedly connected to one end of the feeding roller.

[0027] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0028] 1. In this invention, by setting up a screening mechanism and a pre-grading mechanism, the pre-grading mechanism uses airflow to initially separate the wafer resistor and the plating material based on the weight difference between the wafer resistor and the plating material. Then, the screening mechanism achieves precise separation of the wafer resistor and the plating material through an adjustable gap, so that the screening device realizes the synergistic effect of the two screening mechanisms, further improving the separation accuracy of the screening device and reducing the loss rate caused by the mixing of wafer resistor and plating material.

[0029] 2. In this invention, by setting an adjustable moving rod, the distance between the two transmission belts can be adjusted, thereby enabling the screening device to adjust the gap between the transmission belts according to the specifications of the wafer resistors. This makes the screening device applicable to wafer resistors of different specifications, improving the versatility of the screening device. At the same time, the polyurethane elastic layer covering the surface of the transmission belts reduces the impact force generated when the wafer resistors fall, further reducing the damage rate of wafer resistors caused by high-speed collisions, such as edge chipping, cracking, and plating peeling, and improving the yield of wafer resistors in the screening process.

[0030] 3. In this invention, a vibration mechanism is provided, which is driven by the rotation of the transmission roller. The vibration force generated when the striking rod strikes the collection frame can not only move the plating material in the collection frame to the discharge trough, but also transmit the vibration force to the screening mechanism, causing the screening mechanism to vibrate slightly. This causes the plating material in the gap to fall off, preventing the wafer resistor from being stuck in the gap, ensuring the screening stability of the screening device and improving the screening efficiency of the screening device.

[0031] 4. In this invention, by setting up a feeding roller, the feeding roller rotates at low speed in the discharge frame under the action of the feeding motor. This allows the feeding roller to not only break up the falling wafer resistors and the plating material, preventing the feeding mechanism from jamming and ensuring the feeding stability of the feeding mechanism, but also to ensure that the mixture of wafer resistors and plating material falls evenly, which facilitates the subsequent screening of the wafer resistors and improves the screening effect of the screening device. Attached Figure Description

[0032] Figure 1This is a three-dimensional structural diagram of a buffer-type automatic sorting device for manufacturing wafer resistors.

[0033] Figure 2 This is a three-dimensional structural diagram of a buffer-type automatic sorting device for manufacturing wafer resistors from another angle.

[0034] Figure 3 This is an exploded view of the screening mechanism in a buffer-type automatic screening device for manufacturing wafer resistors.

[0035] Figure 4 This is a cross-sectional schematic diagram of the support frame in a buffer-type automatic sorting device for manufacturing wafer resistors.

[0036] Figure 5 This is a three-dimensional structural diagram of a support frame in a buffer-type automatic sorting device for manufacturing wafer resistors.

[0037] Figure 6 In a buffer-type automatic sorting device for manufacturing wafer resistors Figure 5 A magnified structural diagram of point A in the middle.

[0038] Figure 7 This is a three-dimensional structural diagram of a mounting bracket in a buffer-type automatic sorting device for manufacturing wafer resistors.

[0039] Figure 8 This is an exploded view of the feeding mechanism in a buffer-type automatic sorting device for manufacturing wafer resistors.

[0040] Figure 9 This is an exploded view of the pre-grading mechanism in a buffer-type automatic sorting device for manufacturing wafer resistors.

[0041] Legend:

[0042] 1. Support frame; 2. Screening mechanism; 201. Adjusting motor; 202. Threaded rod; 203. Positioning plate; 204. Moving rod; 205. Threaded sleeve; 206. Mounting plate; 207. Drive motor; 208. Transmission belt; 209. Transmission roller; 3. Mounting frame; 4. Feeding mechanism; 401. Feed hopper; 402. Discharge frame; 403. Feeding roller; 404. Feeding motor; 5. Pre-grading mechanism; 501. Conveyor; 502. Conveyor motor; 503. Guide plate; 50 4. Connecting rod; 505. Discharge box; 506. High-pressure air pipe; 507. High-pressure adjustable air nozzle; 508. Mounting sleeve; 6. Moving groove; 7. Vibration mechanism; 701. Collection frame; 702. Discharge chute; 703. Rotating rod; 704. Connecting sleeve; 705. Fixed plate; 706. Protrusion; 707. Lifting plate; 708. Striking rod; 709. Connecting spring; 7010. Moving groove; 7011. First toothed sprocket; 7012. Connecting column; 7013. Second toothed sprocket. Detailed Implementation

[0043] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0044] In specific implementation, such as Figures 1-9 As shown, the present invention provides a technical solution: a buffer-type automatic screening device for manufacturing wafer resistors, including a support frame 1, a mounting frame 3 fixedly installed on the upper surface of the support frame 1, one end of the mounting frame 3 near the support frame 1, movable grooves 6 of the same size provided on both side walls of the support frame 1, a screening mechanism 2 provided on the inner surface of the support frame 1, a vibration mechanism 7 provided on the lower surface of the support frame 1, a feeding mechanism 4 provided on the upper surface of the mounting frame 3, and a pre-grading mechanism 5 provided on the inner surface of the mounting frame 3; wherein, the screening mechanism 2 includes a movable rod 204, the outer surface of the movable rod 204 is slidably connected to the inner surface of the movable groove 6, mounting plates 206 are fixedly installed on both the movable rod 204 and the inner side wall of the support frame 1, the mounting plates 206 are symmetrically distributed between the movable rod 204 and the support frame 1, transmission rollers 209 are symmetrically rotatably installed between the mounting plates 206, and a transmission belt 208 is driven between the transmission rollers 209, the outer surface of the transmission belt 208 is covered with a polyurethane elastic layer.

[0045] Both the movable frame and the support frame 1 have drive motors 207 fixedly mounted on their side walls via mounting bases. The output end of the drive motor 207 is fixedly connected to the side wall of one of the transmission rollers 209 via a drive shaft.

[0046] The screening mechanism 2 also includes an adjusting motor 201. The outer surface of the adjusting motor 201 is fixedly connected to the other side wall of the support frame 1 through a connecting seat. A threaded rod 202 is fixedly installed at the output end of the adjusting motor 201. A positioning plate 203 is rotatably installed at one end of the threaded rod 202. The side wall of the positioning plate 203 is fixedly connected to the other side wall of the support frame 1. A threaded sleeve 205 is threadedly installed on the outer surface of the threaded rod 202. The side wall of the threaded sleeve 205 is fixedly connected to the other side wall of the moving rod 204.

[0047] Specifically, by setting up the screening mechanism 2, according to the size of the wafer resistor, the motor 201 drives the threaded rod 202 to rotate under the limit of the positioning plate 203. Under the action of the thread, the threaded sleeve 205 will be displaced on the surface of the threaded rod 202. At this time, the threaded sleeve 205 will drive the moving rod 204 to move in the moving groove 6, thereby displacing one of the transmission belts 208. By adjusting the distance between the two transmission belts 208, the gap between the two transmission belts 208 is changed. Under the action of the drive motor 207, the transmission roller 209 drives the transmission belt 208 to rotate. At this time, the transmission belt 208 will drive the mixture of wafer resistor and plating material to move. When the mixture of wafer resistor and plating material passes through the gap, the plating material will fall from the gap into the vibration mechanism 7, while the wafer resistor moves to the discharge end under the transmission of the transmission belt 208, thereby realizing the screening of wafer resistor and plating material.

[0048] The vibration mechanism 7 includes a collection frame 701 and a rotating rod 703. The upper surface of the collection frame 701 is fixedly connected to the lower surface of the support frame 1. The collection frame 701 is located between the mounting plate 206 on the support frame 1 and the mounting plate 206 on the moving rod 204. A discharge port is provided on the side wall of the collection frame 701. A discharge trough 702 is fixedly installed on the side wall of the collection frame 701. The discharge trough 702 corresponds to the discharge port.

[0049] A connecting sleeve 704 is symmetrically mounted on the outer surface of the rotating rod 703. The side wall of the connecting sleeve 704 is fixedly connected to the side wall of the collecting frame 701. A fixing plate 705 is fixedly mounted at equal intervals on the outer surface of the rotating rod 703. Several protrusions 706 are fixedly mounted at equal intervals on the outer surface of the fixing plate 705. An movable groove 7010 is provided on the side wall of the connecting sleeve 704. A first toothed sprocket 7011 is fixedly mounted on the outer surface of the rotating rod 703. The first toothed sprocket 7011 is located outside the connecting sleeve 704.

[0050] The vibration mechanism 7 also includes a lifting plate 707 and a connecting column 7012. Both ends of the lifting plate 707 extend into the movable grooves 7010 of the two connecting plates respectively. A connecting spring 709 is fixedly installed on the lower surface of the lifting plate 707. One end of the connecting spring 709 is fixedly connected to the inner wall of the bottom surface of the movable groove 7010. A striking rod 708 is fixedly installed at equal intervals on the upper surface of the lifting plate 707. The striking rod 708 corresponds to the lower surface of the collection frame 701. A number of top rods are evenly arranged on the lower surface of the lifting plate 707. The top rods correspond to the outer surface of the fixed plate 705.

[0051] One end of the connecting column 7012 is fixedly connected to the side wall of one of the transmission rollers 209 on the support frame 1. A second toothed sprocket 7013 is fixedly installed on the outer surface of the connecting column 7012. The diameter of the second toothed sprocket 7013 is larger than that of the first toothed sprocket 7011. The second toothed sprocket 7013 and the first toothed sprocket 7011 are connected by a toothed chain drive.

[0052] Specifically, by setting up a vibration mechanism 7, the plating material falls through the gap into the collection frame 701. One of the transmission rollers 209, which is fixedly installed on the support frame 1, will drive the connecting column 7012 to rotate when it rotates. At this time, the connecting column 7012 will drive the second toothed sprocket 7013 to rotate synchronously. Under the transmission of the toothed chain, the first toothed sprocket 7011 drives the rotating rod 703 to rotate within the connecting sleeve 704. Since the diameter of the second toothed sprocket 7013 is larger than that of the first toothed sprocket 7011, the rotation speed of the rotating rod 703 is higher than that of the connecting column 7012. As the rotating rod 703 rotates, it will drive the fixed disk 705 to rotate synchronously. When the fixed plate 705 rotates synchronously, the protrusion 706 will rotate synchronously. Under the rotation of the protrusion 706, the top rod will drive the lifting plate 707 to move up and down in the movable groove 7010 under the connection of the connecting spring 709. When the lifting plate 707 moves up and down, it will drive the striking rod 708 to strike the lower surface of the collection frame 701, causing the collection frame 701 to vibrate. Through vibration, the plating material in the collection frame 701 will be discharged from the discharge groove 702. At the same time, the vibration force generated by the collection frame 701 will be transmitted to the support frame 1, which will drive the screening mechanism 2 to vibrate slightly, and help the plating material fall from the gap between the two transmission belts 208.

[0053] The pre-grading mechanism 5 includes a conveyor 501. The outer surface of the conveyor 501 is fixedly connected to the inner surface of the mounting frame 3. The conveyor 501 is located below the feeding mechanism 4. A conveyor motor 502 is fixedly installed on the side wall of the conveyor 501. The output end of the conveyor motor 502 is fixedly connected to the drive end of the conveyor 501. One end of the conveyor 501 extends to the outside of the mounting frame 3.

[0054] A mounting sleeve 508 is fixedly installed on the lower surface of the conveyor 501. A high-pressure air pipe 506 is fixedly installed between the mounting sleeves 508. A high-pressure adjustable air nozzle 507 is connected and installed on the side wall of the high-pressure air pipe 506. A connecting rod 504 is fixedly installed on the end face of the conveyor 501. A guide plate 503 is fixedly installed on one end of the connecting rod 504. The air outlet end of the high-pressure adjustable air nozzle 507 corresponds to the guide plate 503. A discharge box 505 is fixedly installed on the side wall of the guide plate 503.

[0055] The feeding mechanism 4 includes a feeding hopper 401, a discharge frame 402 is fixedly installed on the lower surface of the feeding hopper 401, a through groove is provided on the upper surface of the mounting frame 3, the outer surface of the discharge frame 402 is fixedly connected to the inner surface of the through groove, a feeding roller 403 is rotatably installed on the inner walls of both sides of the discharge frame 402, a feeding motor 404 is fixedly installed on the side wall of the discharge frame 402, and the output end of the feeding motor 404 is fixedly connected to one end of the feeding roller 403.

[0056] Specifically, by setting up the feeding mechanism 4 and the pre-grading mechanism 5, the feeding motor 404 drives the feeding roller 403 to rotate at low speed in the discharge frame 402. As the feeding roller 403 rotates in the discharge pipe, it will break up the mixture of wafer resistors and plating materials in the feeding hopper 401 and then evenly scatter it onto the conveyor 501. Under the action of the conveyor motor 502, the conveyor 501 will evenly transport the mixture to the outside of the mounting frame 3. At this time, the air pump fills the high-pressure air pipe 506 with gas. The gas in the high-pressure air pipe 506 is sprayed out through the high-pressure adjustable air nozzle 507. The high-pressure adjustable air nozzle 507 can adjust the airflow pressure according to the weight difference between the wafer resistors and the plating materials. Under the action of the high-pressure gas, the plating materials are blown towards the guide plate 503 and then fall into the discharge box 505. The wafer resistors fall onto the screening mechanism 2 and are screened twice by the screening mechanism 2, so that the screening device can pre-treat the wafer resistors.

[0057] Working principle: Place the support frame 1 on a stable ground, and then pour the wafer resistor into the feeding mechanism 4. Under the action of the feeding mechanism 4, the wafer resistor will be evenly scattered onto the pre-grading mechanism 5. The pre-grading mechanism 5 uses high-pressure airflow to pre-screen the wafer resistor, and pre-screen out the plating material in the wafer resistor. The pre-screened wafer resistor will fall onto the screening mechanism 2.

[0058] The screening mechanism 2 is adjusted according to the size of the wafer resistor to achieve secondary screening of the wafer resistor and the plating material. The plating material will fall into the vibration mechanism 7, and then the wafer resistor will be discharged with the conveying of the screening mechanism 2, thereby realizing the separation of the wafer resistor and the plating material.

[0059] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A buffer-type automatic sorting device for manufacturing wafer resistors, characterized in that: include: A support frame (1) is provided with a mounting frame (3) fixedly installed on its upper surface. The mounting frame (3) is located near one end of the support frame (1). The two side walls of the support frame (1) are provided with moving grooves (6) of the same size. A screening mechanism (2) is provided on the inner surface of the support frame (1). A vibration mechanism (7) is provided on the lower surface of the support frame (1). A feeding mechanism (4) is provided on the upper surface of the mounting frame (3). A pre-grading mechanism (5) is provided on the inner surface of the mounting frame (3). The screening mechanism (2) includes a moving rod (204), the outer surface of the moving rod (204) is slidably connected to the inner surface of the moving groove (6), and mounting plates (206) are fixedly installed on the inner sidewalls of the moving rod (204) and the support frame (1). The mounting plates (206) are symmetrically distributed between the moving rod (204) and the support frame (1). Transmission rollers (209) are symmetrically rotated between the mounting plates (206), and transmission belts (208) are driven between the transmission rollers (209). The outer surface of the transmission belts (208) is covered with a polyurethane elastic layer.

2. The buffer-type automatic sorting device for manufacturing wafer resistors according to claim 1, characterized in that, Both the movable frame and the support frame (1) have drive motors (207) fixedly mounted on their side walls via mounting bases. The output end of the drive motor (207) is fixedly connected to the side wall of one of the transmission rollers (209) via a drive shaft.

3. The buffer-type automatic sorting device for manufacturing wafer resistors according to claim 1, characterized in that, The screening mechanism (2) also includes an adjusting motor (201). The outer surface of the adjusting motor (201) is fixedly connected to the other side wall of the support frame (1) through a connecting seat. A threaded rod (202) is fixedly installed at the output end of the adjusting motor (201). A positioning plate (203) is rotatably installed at one end of the threaded rod (202). The side wall of the positioning plate (203) is fixedly connected to the other side wall of the support frame (1). A threaded sleeve (205) is threadedly installed on the outer surface of the threaded rod (202). The side wall of the threaded sleeve (205) is fixedly connected to the other side wall of the moving rod (204).

4. The buffer-type automatic sorting device for manufacturing wafer resistors according to claim 1, characterized in that, The vibration mechanism (7) includes a collection frame (701) and a rotating rod (703). The upper surface of the collection frame (701) is fixedly connected to the lower surface of the support frame (1). The collection frame (701) is located between the mounting plate (206) on the support frame (1) and the mounting plate (206) on the moving rod (204). A discharge port is provided on the side wall of the collection frame (701). A discharge trough (702) is fixedly installed on the side wall of the collection frame (701). The discharge trough (702) corresponds to the discharge port.

5. A buffer-type automatic sorting device for manufacturing wafer resistors according to claim 4, characterized in that, A connecting sleeve (704) is symmetrically mounted on the outer surface of the rotating rod (703). The side wall of the connecting sleeve (704) is fixedly connected to the side wall of the collecting frame (701). A fixed plate (705) is fixedly mounted at equal intervals on the outer surface of the rotating rod (703). A plurality of protrusions (706) are fixedly mounted at equal intervals on the outer surface of the fixed plate (705). An movable groove (7010) is provided on the side wall of the connecting sleeve (704). A first toothed sprocket (7011) is fixedly mounted on the outer surface of the rotating rod (703). The first toothed sprocket (7011) is located outside the connecting sleeve (704).

6. The buffer-type automatic sorting device for manufacturing wafer resistors according to claim 1, characterized in that, The vibration mechanism (7) also includes a lifting plate (707) and a connecting column (7012). The two ends of the lifting plate (707) extend into the movable grooves (7010) of the two connecting plates respectively. A connecting spring (709) is fixedly installed on the lower surface of the lifting plate (707). One end of the connecting spring (709) is fixedly connected to the inner wall of the bottom surface of the movable groove (7010). A striking rod (708) is fixedly installed at equal intervals on the upper surface of the lifting plate (707). The striking rod (708) corresponds to the lower surface of the collection frame (701). A number of top rods are arranged at equal intervals on the lower surface of the lifting plate (707). The top rods correspond to the outer surface of the fixed plate (705).

7. A buffer-type automatic sorting device for manufacturing wafer resistors according to claim 6, characterized in that, One end of the connecting column (7012) is fixedly connected to the side wall of one of the transmission rollers (209) on the support frame (1). A second toothed sprocket (7013) is fixedly installed on the outer surface of the connecting column (7012). The diameter of the second toothed sprocket (7013) is larger than that of the first toothed sprocket (7011). The second toothed sprocket (7013) and the first toothed sprocket (7011) are connected by a toothed chain drive.

8. A buffer-type automatic sorting device for manufacturing wafer resistors according to claim 1, characterized in that, The pre-grading mechanism (5) includes a conveyor (501), the outer surface of which is fixedly connected to the inner surface of the mounting frame (3), the conveyor (501) is located below the feeding mechanism (4), a conveyor motor (502) is fixedly installed on the side wall of the conveyor (501), the output end of the conveyor motor (502) is fixedly connected to the drive end of the conveyor (501), and one end of the conveyor (501) extends to the outside of the mounting frame (3).

9. A buffer-type automatic sorting device for manufacturing wafer resistors according to claim 8, characterized in that, A mounting sleeve (508) is fixedly installed on the lower surface of the conveyor (501). A high-pressure air pipe (506) is fixedly installed between the mounting sleeves (508). A high-pressure adjustable nozzle (507) is connected to the side wall of the high-pressure air pipe (506). A connecting rod (504) is fixedly installed on the end face of the conveyor (501). A guide plate (503) is fixedly installed at one end of the connecting rod (504). The air outlet of the high-pressure adjustable nozzle (507) corresponds to the guide plate (503). A discharge box (505) is fixedly installed on the side wall of the guide plate (503).

10. A buffer-type automatic sorting device for manufacturing wafer resistors according to claim 1, characterized in that, The feeding mechanism (4) includes a feeding hopper (401), a discharge frame (402) is fixedly installed on the lower surface of the feeding hopper (401), a through groove is provided on the upper surface of the mounting frame (3), the outer surface of the discharge frame (402) is fixedly connected to the inner surface of the through groove, a feeding roller (403) is rotatably installed on the inner walls of both sides of the discharge frame (402), a feeding motor (404) is fixedly installed on the side wall of the discharge frame (402), and the output end of the feeding motor (404) is fixedly connected to one end of the feeding roller (403).

Images