Electronic component

Abstract

An electronic component includes a base material having electrical insulation, a coil supported by the base material, a first terminal supported by the base material, a second terminal supported by the base material, and a molded body containing a magnetic material and holding the base material, the coil, the first terminal, and the second terminal. The first terminal and the second terminal are each integrated with the coil. The entire coil is embedded in the molded body. A portion of the first terminal is exposed to the outside of the molded body. A portion of the second terminal is exposed to the outside of the molded body.

Description

Technical Field

[0001] This disclosure relates to electronic components, and more specifically to electronic components having coils. Background Technology

[0002] In Patent Document 1, regarding an inductor, it is disclosed that: the coil includes a first coil and a second coil respectively disposed on opposite surfaces of a support containing an insulating material or a magnetic material, the first coil and the second coil respectively having a first lead portion exposed to the outside of the main body, a first lead portion and a second lead portion disposed on the main body, and the first lead portion and the second lead portion being electrically connected to the first lead portion respectively.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2022-162132 Summary of the Invention

[0004] One aspect of this disclosure relates to an electronic component comprising: a substrate having electrical insulation properties; a coil supported by the substrate; a first terminal supported by the substrate; a second terminal supported by the substrate; and a molded body containing a magnetic material, holding the substrate, the coil, the first terminal, and the second terminal. The first terminal and the second terminal are each integrated with the coil. The coil is entirely embedded in the molded body. A portion of the first terminal protrudes outside the molded body. A portion of the second terminal protrudes outside the molded body.

[0005] According to this disclosure, it is possible to suppress the reduction in conductivity and thermal conductivity between the coil and the first terminal and the second terminal, respectively. Attached Figure Description

[0006] Figure 1 This is a perspective view of the electronic component according to the first embodiment.

[0007] Figure 2 This is a perspective view of the electronic component according to the first embodiment.

[0008] Figure 3 This is a perspective view of the substrate in the electronic component of the first embodiment.

[0009] Figure 4 This is a perspective view of the substrate in the electronic component of the first embodiment.

[0010] Figure 5 This is a perspective view of the coil in the electronic component of the first embodiment.

[0011] Figure 6 This is a perspective view of the coil in the electronic component of the first embodiment.

[0012] Figure 7This is a front view of the coil in the electronic component of the first embodiment.

[0013] Figure 8 This is a side view of the coil in the electronic component of the first embodiment.

[0014] Figure 9 This is a perspective view of the combination of the substrate and the coil in the electronic component of the first embodiment.

[0015] Figure 10 This is a perspective view of the state in which the molded body in the electronic component of the first embodiment has been removed.

[0016] Figure 11 This is a perspective view of the electronic component after being cut apart according to the first embodiment.

[0017] Figure 12 This is a perspective view of the electronic component after being cut apart according to the first embodiment.

[0018] Figure 13 This is a front view of the electronic components of the first embodiment mounted on two substrates.

[0019] Figure 14 This is a perspective view of the electronic components according to the second embodiment.

[0020] Figure 15 This is a perspective view of the electronic components according to the third embodiment.

[0021] Figure 16 This is a perspective view of the coil in the electronic component of the third embodiment.

[0022] Figure 17 This is a perspective view of the coil in the electronic component of the third embodiment.

[0023] Figure 18 This is a front view of the coil in the electronic component of the third embodiment.

[0024] Figure 19 This is a side view of the coil in the electronic component of the third embodiment.

[0025] Figure 20 This is a perspective view of the combination of the substrate and the coil in the electronic component of the third embodiment.

[0026] Figure 21 This is a perspective view of the state in which the molded body in the electronic component of the third embodiment has been removed.

[0027] Figure 22 This is a perspective view of the electronic component after being cut open according to the third embodiment.

[0028] Figure 23This is a perspective view of the electronic component after being cut open according to the third embodiment.

[0029] Figure 24 This is a perspective view of the electronic components according to the fourth embodiment. Detailed Implementation

[0030] 1. Summary

[0031] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. However, the present disclosure is not limited to the embodiments described below. The embodiments described below are only a part of the various embodiments of the present disclosure, and various modifications can be made according to the design as long as the purpose of the disclosure is achieved. The drawings referred to below are schematic, and the size ratios of the constituent elements in the drawings may not reflect the actual size ratios.

[0032] The electronic component 1 according to the embodiment includes: an electrically insulating substrate 4, a coil 2 supported by the substrate 4, a first terminal 31 supported by the substrate 4, a second terminal 32 supported by the substrate 4, and a molded body 5 containing magnetic material and holding the substrate 4, the coil 2, the first terminal 31, and the second terminal 32. The first terminal 31 and the second terminal 32 are each integrated with the coil 2. The coil 2 is entirely embedded in the molded body 5. A portion of the first terminal 31 protrudes outside the molded body 5. A portion of the second terminal 32 protrudes outside the molded body 5.

[0033] Furthermore, the integration of the first terminal 31 and the second terminal 32 with the coil 2 means that there are no seams, interfaces, or discontinuous changes in composition between the first terminal 31 and the second terminal 32 and the coil 2, and the combination of the first terminal 31 and the second component with the coil 2 is identified as a single component.

[0034] According to the embodiment, the reduction in conductivity and thermal conductivity between the coil 2 and the first terminal 31 and the second terminal 32 can be suppressed. Therefore, the performance degradation of the electronic component 1 caused by the reduction in internal conductivity can be suppressed, and the heat dissipation of the electronic component 1 can be improved.

[0035] 2. Implementation Method

[0036] The following describes more specific embodiments of this disclosure.

[0037] 2.1. First Implementation Method

[0038] The electronic component 1 of the first embodiment is shown in Figures 1 to 12 .

[0039] The electronic component 1 in the first embodiment is an inductor. Furthermore, this electronic component 1 is a surface-mount component. That is, the electronic component 1 in the first embodiment is a surface-mount inductor (see [reference]). Figure 1 as well as Figure 2 ).

[0040] Electronic component 1 includes a substrate 4, a coil 2, and a molded body 5. Electronic component 1 also includes an insulating film 6.

[0041] The substrate 4 is electrically insulating. The substrate 4 is, for example, an inorganic board or a resin substrate. Examples of resin substrates include polyimide films or glass-based epoxy resin substrates.

[0042] like Figure 3 as well as Figure 4 As shown, if the substrate 4 is viewed along its thickness direction, it has a shape that is longer in one direction. Hereinafter, the direction along the thickness direction of the substrate 4 will be defined as the Z direction, the direction orthogonal to the Z direction along the long side of the substrate 4 will be defined as the X direction, and the direction orthogonal to both the Z and X directions will be defined as the Y direction. Furthermore, the long side direction of the substrate 4 is also the long side direction of the electronic component 1. The substrate 4 has a first main surface 401 and a second main surface 402 opposite to the first main surface 401. The first main surface 401 and the second main surface 402 are orthogonal to the Z direction. That is, the thickness of the substrate 4 is the dimension between the first main surface 401 and the second main surface 402.

[0043] The substrate 4 has a coil support portion 41, a first terminal support portion 43, and a second terminal support portion 44. The coil support portion 41 has a main portion 411, a first connecting portion 412, and a second connecting portion 413. When viewed along the Z direction, the main portion 411 is annular and longer in the X direction. That is, the substrate 4 has an opening 47 surrounded by the main portion 411 and extending from the first main surface 401 to the second main surface 402. The outer periphery of the main portion 411 is straight on both sides in the Y direction and arc-shaped on both sides in the X direction. The first connecting portion 412 and the second connecting portion 413 protrude in the X direction from two ends of one side portion in the Y direction. The first terminal support portion 43 and the second terminal support portion 44 are located at two ends in the X direction of the substrate 4. Both the first terminal support portion 43 and the second terminal support portion 44 are longer in the Y direction. The first terminal support portion 43 is connected to the main portion 411 of the coil support portion 41 and the first connecting portion 412. The second terminal support portion 44 is connected to the main portion 411 of the coil support portion 41 and the second connecting portion 413.

[0044] The main portion 411 of the coil support portion 41 has a coil connection hole 42 extending from the first main surface 401 to the second main surface 402. The first terminal support portion 43 has three first terminal connection holes 45 extending from the first main surface 401 to the second main surface 402. The three first terminal connection holes 45 are arranged in the Y direction. The second terminal support portion 44 has three second terminal connection holes 46 extending from the first main surface 401 to the second main surface 402. The three second terminal connection holes 46 are arranged in the Y direction.

[0045] As described above, coil 2, first terminal 31, and second terminal 32 are supported on substrate 4, and first terminal 31 and second terminal 32 are each integrated with coil 2. Figures 5 to 8 The coil 2, the first terminal 31, and the second terminal 32 are shown. Figure 9 The image shows the coil 2, the first terminal 31, and the second terminal 32 being supported by the substrate 4.

[0046] Coil 2, first terminal 31, and second terminal 32 are each made of an electrically conductive material such as metal. Coil 2, first terminal 31, and second terminal 32 are each made of copper, for example, but are not limited to this.

[0047] The coil 2 has: a first coil portion 21 overlapping with the first main surface 401 of the substrate 4, a second coil portion 22 overlapping with the second main surface 402 of the substrate 4, and a coil connecting portion 23 electrically connecting the first coil portion 21 and the second coil portion 22. The coil connecting portion 23 is disposed within the coil connecting hole 42 (see reference). Figure 11 ).

[0048] The first coil portion 21 has a first end 211 and a second end 212, extending from the first end 211 to the second end 212. The first end 211 of the first coil portion 21 is configured to cover the opening 47 on the first main surface 401 side of the coil connection hole 42 in the main portion 411. The first coil portion 21 has a shape in which it is wound outward from the first end 211 in the main portion 411 such that it surrounds the opening 47. The second end 212 extends to the first connecting portion 412.

[0049] The second coil portion 22 has a first end portion 221 and a second end portion 222, extending from the first end portion 221 to the second end portion 222. The first end portion 221 of the second coil portion 22 is configured to cover the opening 47 on the second main surface 402 side of the coil connection hole 42 in the main portion 411. The second coil portion 22 has a shape in which it is wound outward from the first end portion 221 in the main portion 411 such that it surrounds the opening 47. The second end portion 222 extends to the second connecting portion 413.

[0050] When viewing the coil 2 from the first coil section 21 side along the Z direction, the winding direction of the first coil section 21 from the first end 211 toward the second end 212 is the same as the winding direction of the second coil section 22 from the first end 221 toward the second end 222 when viewing the coil 2 from the second coil section 22 side along the Z direction.

[0051] The coil connection portion 23 is located between the first end 211 of the first coil portion 21 and the first end 221 of the second coil portion 22, and is connected to both the first end 211 of the first coil portion 21 and the first end 221 of the second coil portion 22. Thus, the coil connection portion 23 electrically connects the first coil portion 21 and the second coil portion 22. The coil connection portion 23 is disposed within the coil connection hole 42 in the main portion 411.

[0052] The first terminal 31 has: a first terminal portion 311 that overlaps with the first main surface 401 of the substrate 4, a second secondary terminal portion 322 that overlaps with the second main surface 402 of the substrate 4, and a first terminal connection portion 313 that electrically connects the first terminal portion 311 and the first secondary terminal portion 312.

[0053] The first terminal portion 311 is longer in the Y direction. The first terminal portion 311 is disposed on the first main surface 401 at the first terminal support portion 43. The first terminal portion 311 is configured to cover the opening 47 on the first main surface 401 side of the first terminal connection hole 45. The first auxiliary terminal portion 312 is longer in the Y direction. The first auxiliary terminal portion 312 is disposed on the second main surface 402 at the first terminal support portion 43. The first auxiliary terminal portion 312 is configured to cover the opening 47 on the second main surface 402 side of the first terminal connection hole 45. Alternatively, the first terminal support portion 43 is sandwiched between the first terminal portion 311 and the first auxiliary terminal portion 312.

[0054] The first terminal 31 has three first terminal connection portions 313. Each first terminal connection portion 313 is located between the first terminal portion 311 and the first auxiliary terminal portion 312, and is connected to both the first terminal portion 311 and the first auxiliary terminal portion 312. Thus, the first terminal connection portions 313 electrically connect the first terminal portion 311 and the first auxiliary terminal portion 312. Each first terminal connection portion 313 is disposed within a corresponding first terminal connection hole 45.

[0055] The second end portion 212 of the first coil portion 21 is connected to the first terminal portion 311. There are no seams, interfaces, or discontinuous changes in composition between the first terminal portion 311 and the second end portion 212. Therefore, the coil portion 21 is integrated with the first terminal portion 31. The Y-direction dimension of the first terminal portion 311 is larger than the overall Y-direction dimension of the first coil portion 21, and the ends on both sides of the first terminal portion 311 in the Y-direction protrude outwards from the ends on both sides of the first coil portion 21 in the Y-direction. The second end portion 212 is connected at one end of the first terminal portion 311 at a position slightly inwards from the edge of that end. That is, the first terminal portion 311 protrudes outwards from the second end portion 212 in the Y-direction.

[0056] The second terminal 32 has: a second terminal portion 321 that overlaps with the second main surface 402 of the substrate 4, a second auxiliary terminal portion 322 that overlaps with the first main surface 401 of the substrate 4, and a second terminal connection portion 323 that electrically connects the second terminal portion 321 and the second auxiliary terminal portion 322.

[0057] The second terminal portion 321 is longer in the Y direction. The second terminal portion 321 is disposed on the second main surface 402 at the second terminal support portion 44. The second terminal portion 321 is configured to cover the opening 47 on the second main surface 402 side of the second terminal connection hole 46. The second auxiliary terminal portion 322 is longer in the Y direction. The second auxiliary terminal portion 322 is disposed on the first main surface 401 at the second terminal support portion 44. The second auxiliary terminal portion 322 is configured to cover the opening 47 on the first main surface 401 side of the second terminal connection hole 46. Alternatively, the second terminal support portion 44 is sandwiched between the second terminal portion 321 and the second auxiliary terminal portion 322.

[0058] The second terminal 32 has three second terminal connection portions 323. Each second terminal connection portion 323 is located between the second terminal portion 321 and the second auxiliary terminal portion 322, and is connected to both the second terminal portion 321 and the second auxiliary terminal portion 322. Thus, the second terminal connection portions 323 electrically connect the second terminal portion 321 and the second auxiliary terminal portion 322. Each second terminal connection portion 323 is disposed within a corresponding second terminal connection hole 46 (see reference). Figure 12 ).

[0059] The second terminal portion 321 is connected to the second end portion 222 of the second coil portion 22. There are no seams, interfaces, or discontinuous changes in composition between the second terminal portion 321 and the second end portion 222. Therefore, the coil portion 2 and the second terminal 32 are integrated.

[0060] The second end portion 222 of the second coil portion 22 is connected to the second terminal portion 321. There are no seams, interfaces, or discontinuous changes in composition between the second terminal portion 321 and the second end portion 222. Therefore, the coil portion 2 and the second terminal 32 are integrated. The Y-direction dimension of the second terminal portion 321 is larger than the overall Y-direction dimension of the second coil portion 22, and the ends on both sides of the second terminal portion 321 in the Y-direction protrude outwards from the ends on both sides of the second coil portion 22. The second end portion 222 is connected at one end of the second terminal portion 321 in the Y-direction to a position slightly inwards from the edge of that end. That is, the second terminal portion 321 protrudes outwards from the second end portion 222 in the Y-direction.

[0061] In the first embodiment, by having the above-described structure on the substrate 4 and the coil 2, the coil 2 can be arranged compactly and with high density on the substrate 4. Furthermore, the first terminal 31 and the second terminal 32 are disposed at the ends of both sides of the substrate 4. Further, the first terminal portion 311 and the first sub-terminal portion 312 of the first terminal 31 are respectively disposed on the first main surface 401 and the second main surface 402 of the substrate 4, and the second sub-terminal portion 322 and the second terminal portion 321 of the second terminal 32 are respectively disposed on the first main surface 401 and the second main surface 402 of the substrate 4.

[0062] In this embodiment, the thickness of the first coil portion 21 along the thickness direction (Z direction) of the substrate 4 is smaller than the thickness of the first terminal portion 311 of the first terminal 31 along the thickness direction of the substrate 4. Furthermore, the thickness of the first coil portion 21 along the thickness direction of the substrate 4 is smaller than the thickness of the second sub-terminal portion 322 of the second terminal 32 along the thickness direction of the substrate 4. Further, the thickness of the second coil portion 22 along the thickness direction of the substrate 4 is smaller than the thickness of the second terminal portion 321 of the second terminal 32 along the thickness direction of the substrate 4. Additionally, the thickness of the second coil portion 22 along the thickness direction of the substrate 4 is smaller than the thickness of the first sub-terminal portion 312 of the first terminal 31 along the thickness direction of the substrate 4.

[0063] In this embodiment, the first coil portion 21 and the first terminal portion 311 are each constructed with free conductor wiring, and the second auxiliary terminal portion 322 is also constructed with conductor wiring. That is, the first coil portion 21, the first terminal portion 311, and the second auxiliary terminal portion 322 are constructed with conductor wiring located on the first main surface 401 of the substrate 4. Furthermore, the second coil portion 22 and the second terminal portion 321 are each constructed with free conductor wiring, and the first auxiliary terminal portion 312 is also constructed with conductor wiring. That is, the second coil portion 22, the second terminal portion 321, and the first auxiliary terminal portion 312 are constructed with conductor wiring located on the second main surface 402 of the substrate 4.

[0064] Furthermore, the width of the conductor wiring constituting the first coil portion 21 is smaller than the width of the conductor wiring constituting the first terminal portion 311, and smaller than the width of the conductor wiring constituting the second sub-terminal portion 322. Therefore, it is easily achievable that the thickness of the first coil portion 21 along the thickness direction of the substrate 4 is smaller than either the thickness of the first terminal portion 311 of the first terminal 31 along the thickness direction of the substrate 4 or the thickness of the second sub-terminal portion 322 of the second terminal 32 along the thickness direction of the substrate 4. Furthermore, the width of the conductor wiring constituting the second coil portion 22 is smaller than the width of the conductor wiring constituting the second terminal portion 321, and smaller than the width of the conductor wiring constituting the first sub-terminal portion 312. Therefore, it is easily achievable that the thickness of the second coil portion 22 along the thickness direction of the substrate 4 is smaller than either the thickness of the second terminal portion 321 of the second terminal 32 along the thickness direction of the substrate 4 or the thickness of the first sub-terminal portion 312 of the first terminal 31 along the thickness direction of the substrate 4. This will be explained later.

[0065] In addition, as an example, this embodiment is described below. Figures 4-8 The illustrated structure has one coil connection part 23, one coil connection hole 42, and three first terminal connection parts 313, three second terminal connection parts 323, three first terminal connection holes 45, and three second terminal connection holes 46. However, the number of these parts is not limited to the number shown in the illustration. Any number of parts is acceptable as long as it is sufficient to fix the coil 2, the first terminal 31, the second terminal 32, and the substrate 4.

[0066] The molded body 5 contains magnetic material. The molded body 5 is made, for example, by compacting magnetic powder. Specifically, it is made, for example, by compacting and molding a magnetic composite material containing magnetic powder, insulating resin, and appropriate additives as needed, and further heating it as needed.

[0067] Magnetic powders are, for example, iron-based soft magnetic alloy powders. Iron-based soft magnetic alloy powders include, for example, powders selected from at least one of the following groups: soft magnetic iron-silicon (Fe-Si) alloys, soft magnetic iron-aluminum (Fe-Al) alloys, soft magnetic iron-aluminum-silicon (Fe-Al-Si) alloys, soft magnetic iron-silicon-chromium (Fe-Si-Cr) alloys, soft magnetic iron-chromium (Fe-Cr) alloys, soft magnetic iron-nickel (Fe-Ni) alloys, soft magnetic iron-silicon-boron (Fe-Si-B) alloys, soft magnetic iron-nitrogen (Fe-N) alloys, soft magnetic iron-carbon (Fe-C) alloys, soft magnetic iron-boron (Fe-B) alloys, soft magnetic iron-phosphorus (Fe-P) alloys, permingle alloys (Fe-Co), soft magnetic iron-cobalt-vanadium (Fe-Co-V) alloys, Fe-based amorphous alloys, and Fe-based nanocrystalline alloys. The insulating resin contains, for example, at least one selected from the group consisting of epoxy resin, phenolic resin, phenoxy resin, silicone and polyimide.

[0068] The molded body 5 holds the substrate 4, the coil 2, the first terminal 31, and the second terminal 32. The molded body 5 is a cuboid that is longer in the long side direction (X direction) of the substrate 4. Hereinafter, the surface on the side of the first terminal 31 among the two sides in the X direction of the molded body 5 and the electronic component 1 will be referred to as the first end surface 13, and the surface on the side of the second terminal 32 will be referred to as the second end surface 14. Furthermore, the surface on the side of the first coil portion 21 relative to the second coil portion 22 among the two sides in the Z direction of the molded body 5 and the electronic component 1 will be referred to as the first patch surface 11, and the surface on the side of the second coil portion 22 relative to the first coil portion 21 will be referred to as the second patch surface 12.

[0069] The coil 2 is embedded in the molding body 5 by the entire coil 2, thereby being held in the molding body 5.

[0070] The first terminal 31 and the second terminal 32 are each partially embedded in the molded body 5. That is, a portion of the surface of each of the first terminal 31 and the second terminal 32 is exposed to the outside of the molded body 5.

[0071] The first terminal 31 and the second terminal 32 are respectively disposed at both ends of the molded body 5 and the electronic component 1 in a direction orthogonal to the thickness direction of the substrate 4. In particular, in the first embodiment, the first terminal 31 and the second terminal 32 are respectively disposed at both ends of the molded body 5 and the electronic component 1 in the long side direction (X direction). Therefore, it is less likely to cause a short circuit between the first terminal 31 and the second terminal 32 when the molded body 5 is mounted on the substrate.

[0072] On the first end face 13 of the electronic component 1 and the molded body 5, the side of the first terminal 31 opposite to the side of the second terminal 32 is exposed. That is, on the first end face 13, the side of the first terminal portion 311 opposite to the side of the second terminal 32 and the side of the first sub-terminal portion 312 opposite to the side of the second terminal 32 are exposed. On the first end face 13, the substrate 4 is located between the first terminal portion 311 and the first sub-terminal portion 312, and the surfaces of the first terminal portion 311, the substrate 4, and the first sub-terminal portion 312 in the first end face 13 are flush. Furthermore, on the second end face 14 of the electronic component 1 and the molded body 5, the side of the second terminal 32 opposite to the side of the first terminal 31 is exposed. That is, on the second end face 14, the side of the second terminal portion 321 opposite to the side of the first terminal 31 and the side of the second sub-terminal portion 322 opposite to the side of the first terminal 31 are exposed. The substrate 4 is located between the second terminal portion 321 and the second auxiliary terminal portion 322 in the second end face 14, and the surface of the second terminal portion 321 exposed in the second end face 14, the surface of the substrate 4, and the surface of the second auxiliary terminal portion 322 are flush.

[0073] On the first patch surface 11 of the molded body 5, the side of the first terminal portion 311 of the first terminal 31 opposite to the substrate 4 side and the side of the second sub-terminal portion 322 of the second terminal 32 opposite to the substrate 4 side are exposed. The surfaces of the molded body 5, the first terminal portion 311, and the second sub-terminal portion 322 in the first patch surface 11 are flush. In this embodiment, as described above, the thickness dimension of the first coil portion 21 along the thickness direction of the substrate 4 is smaller than either the thickness dimension of the first terminal portion 311 along the thickness direction of the substrate 4 or the thickness dimension of the second sub-terminal portion 322 of the second terminal 32 along the thickness direction of the substrate 4. Therefore, in this way, the first terminal portion 311 and the second sub-terminal portion 322 can be exposed on the first patch surface 11, and the entire first coil portion 21 is embedded in the molded body 5.

[0074] Furthermore, on the second patch surface 12 of the molded body 5, the surface opposite to the substrate 4 side of the second terminal portion 321 in the second terminal 32 and the surface opposite to the substrate 4 side of the first auxiliary terminal portion 312 in the first terminal 31 are exposed. The surfaces of the molded body 5, the second terminal portion 321, and the first auxiliary terminal portion 312 in the second patch surface 12 are flush. In this embodiment, as described above, the thickness dimension of the second coil portion 22 along the thickness direction of the substrate 4 is smaller than either the thickness dimension of the second terminal portion 321 along the thickness direction of the substrate 4 or the thickness dimension of the first auxiliary terminal portion 312 of the first terminal 31 along the thickness direction of the substrate 4. Therefore, in this way, the second terminal portion 321 and the first auxiliary terminal portion 312 can be exposed at the end face, and the entire second coil portion 22 is embedded in the molded body 5.

[0075] Furthermore, in this embodiment, at each of the two end faces 15 in the Y direction of the molded body 5 (the two end faces 15 in the Y direction of the capacitor), the first terminal portion 311 and the first sub-terminal portion 312 of the first terminal 31, and the second terminal portion 321 and the second sub-terminal portion 322 of the second terminal 32 are exposed. The substrate 4 is also exposed at each end face 15. The surfaces of the molded body 5, the first terminal portion 311, the first sub-terminal portion 312, the second terminal portion 321, the second sub-terminal portion 322, and the substrate 4 are flush with each other on these end faces 15. Here, as described above, in the first embodiment, the Y-direction dimension of the first terminal portion 311 is larger than the Y-direction dimension of the entire first coil portion 21, and the ends on both sides of the first terminal portion 311 in the Y direction protrude outwards from the ends on both sides of the entire first coil portion 21 in the Y direction. Furthermore, the Y-direction dimension of the second terminal portion 321 is larger than the Y-direction dimension of the entire second coil portion 22, and the ends on both sides of the second terminal portion 321 in the Y-direction protrude outwards from the ends on both sides of the entire second coil portion 22 in the Y-direction. Therefore, in this way, the first terminal portion 311, the first sub-terminal portion 312, the second terminal portion 321, and the second sub-terminal portion 322 can be exposed on the end faces 15 on both sides in the Y-direction, and the entire coil 2 is embedded in the molded body 5.

[0076] The first terminal 31 and the second terminal 32 are each exposed to the outside of the electronic component 1. That is, the electronic component 1 does not have a conductor covering the first terminal 31 and the second terminal 32 respectively.

[0077] The insulating film 6 is located between the coil 2, the first terminal 31, and the second terminal 32, and the molded body 5 respectively (see reference). Figure 10 as well as Figure 11 That is, the surfaces of the coil 2, the first terminal 311, and the second terminal 321 facing the molded body 5 are covered by the insulating film 6. Therefore, short circuits of current within the electronic component 1 can be suppressed. The insulating film 6 is made, for example, of a resist material mixed with epoxy resin and phenolic resin.

[0078] An example of the manufacturing method of electronic component 1 will be explained.

[0079] A raw substrate is prepared as the material for substrate 4. The raw substrate has a size from which multiple substrates 4 can be obtained.

[0080] In the original substrate, coil connection holes 42, first terminal connection holes 45 and second terminal connection holes 46 corresponding to multiple substrates 4 are formed by laser processing or drilling.

[0081] Next, coil 2, first terminal 31, and second terminal 32, corresponding to the various substrates, are fabricated on the original substrate. Coil 2, first terminal 31, and second terminal 32 are fabricated, for example, by electrolytic plating. That is, for example, an electroless plating film is first fabricated on the surface of the original substrate. A plating resist with a plating pattern covering the electroless plating film is fabricated using photolithography or the like. After conductor wiring is fabricated on the original substrate by electrolytic plating, the plating resist is stripped. Further, the electroless plating film is removed by flash etching or the like. In addition, vias are fabricated in the coil connection hole 42, the first terminal connection hole 45, and the second terminal connection hole 46 respectively by embedded plating or the like. Therefore, a first coil portion 21, a second coil portion 22, a first terminal portion 311, a first auxiliary terminal portion 312, and a second terminal portion 321, which are composed of conductor wiring, are manufactured, and a coil connection portion 23, a first terminal connection hole 45, and a second terminal connection portion 323, which are composed of through holes, are manufactured.

[0082] In this embodiment, the thickness dimension of the first coil portion 21 along the thickness direction of the substrate 4 is smaller than either the thickness dimension of the first terminal portion 311 of the first terminal 31 along the thickness direction (Z direction) of the substrate 4 or the thickness dimension of the second sub-terminal portion 322 of the second terminal 32 along the thickness direction (Z direction) of the substrate 4. When conductor wiring is fabricated by electroplating, there is a tendency that the larger the width or area of ​​the conductor wiring, the more the growth of the conductor wiring based on electroplating is promoted. Therefore, if the width dimension of the conductor wiring constituting the first coil portion 21 is smaller than the width dimension of the conductor wiring constituting the first terminal portion 311 and smaller than the width dimension of the conductor wiring constituting the second sub-terminal portion 322, the relationship between the thickness dimensions can be easily achieved by electroplating. Similarly, in this embodiment, the thickness dimension of the second coil portion 22 along the thickness direction of the substrate 4 is smaller than either the thickness dimension of the second terminal portion 321 of the second terminal 32 along the thickness direction (Z direction) of the substrate 4 or the thickness dimension of the first sub-terminal portion 312 of the first terminal 31 along the thickness direction (Z direction) of the substrate 4. If the width dimension of the conductor wiring constituting the second coil portion 22 is smaller than the width dimension of the conductor wiring constituting the second terminal portion 321 and smaller than the width dimension of the conductor wiring constituting the first sub-terminal portion 312, the relationship between the thickness dimensions can be easily achieved by electrolytic plating.

[0083] Alternatively, after first growing the first coil portion 21, the first terminal portion 311, and the second sub-terminal portion 322 through electroplating, further growth can be achieved by electroplating only of the first terminal portion 311 and the second sub-terminal portion 322. That is, this method can also be used to make the thickness dimension of the first coil portion 21 along the thickness of the substrate 4 smaller than either the thickness dimension of the first terminal portion 311 along the thickness direction (Z direction) of the substrate 4 or the thickness dimension of the second sub-terminal portion 322 along the thickness direction (Z direction) of the substrate 4. Similarly, after first growing the second coil portion 22, the second terminal portion 321, and the first sub-terminal portion 312 through electroplating, further growth can be achieved by electroplating only of the second terminal portion 321 and the first sub-terminal portion 312. That is, by means of this method, the thickness dimension of the second coil portion 22 along the thickness direction of the substrate 4 can be made smaller than either the thickness dimension of the second terminal portion 321 of the second terminal 32 along the thickness direction (Z direction) of the substrate 4 or the thickness dimension of the first auxiliary terminal portion 312 of the first terminal 31 along the thickness direction (Z direction) of the substrate 4.

[0084] Next, the original substrate is cut using laser processing or the like, and openings 47 are formed in the portions of the original substrate that correspond to the plurality of substrates 4 respectively, and these portions are formed into the shape of substrate 4. Alternatively, the portions of the original substrate that correspond to the plurality of substrates 4 respectively can be formed into the shape of substrate 4 before the coil 2, the first terminal 31 and the second terminal 32 are manufactured.

[0085] Next, the surfaces of the coil 2, the first terminal 31, and the second terminal 32 that are in contact with the molded body 5 are covered with an insulating film 6. For example, the insulating film 6 can be made by coating the surface with an insulating material, pasting the insulating film, or depositing the insulating material by methods such as vapor deposition or electroplating. Alternatively, the insulating film 6 can be made before the opening 47 is formed, and then the opening 47 is formed.

[0086] Next, a prototype is made by hot pressing the magnetic composite material, in which the original substrate, coil 2, first terminal 31 and second terminal 32 are embedded.

[0087] Next, multiple electronic components 1 are obtained by cutting the original substrate and the original molded body.

[0088] Furthermore, the manufacturing method of electronic component 1 is not limited to the above. For example, without using the original substrate, coil 2, first terminal 31 and second terminal 32 can be fabricated on substrate 4, and after further forming an insulating film 6, the magnetic composite material can be hot-pressed to form a molded body 5, thereby manufacturing electronic component 1.

[0089] The electronic component 1 of the first embodiment can be mounted on a substrate such as a printed wiring board using the first terminal 31 and the second terminal 32. In the first embodiment, the electronic component 1 can be mounted on both the first substrate 7 and the second substrate 8 with the electronic component 1 positioned between the opposing first substrate 7 and the second substrate 8. The first terminal portion 311 and the second auxiliary terminal portion 322 can be used for mounting to the first substrate 7, and the second terminal portion 321 and the first auxiliary terminal portion 312 can be used for mounting to the second substrate 8.

[0090] Specifically, at a position between the first substrate 7 and the second substrate 8, the electronic component 1 is configured such that the first mounting surface 11 faces the first substrate 7, and the second mounting surface 12 faces the second substrate 8. The surfaces of the first terminal portion 311 exposed on the first mounting surface 11 and the second sub-terminal portion 322 exposed on the first mounting surface 11 overlap with terminals 71 in the first substrate 7. The first terminal portion 311 and terminals 71 are connected by solder, and the second sub-terminal portion 322 and terminals 71 are connected by solder. Thus, the electronic component 1 is mounted on the first substrate 7. Furthermore, the surfaces of the second terminal portion 321 and the first sub-terminal portion 312 exposed on the second mounting surface 12 overlap with terminals 81 in the second substrate 8. The second terminal portion 321 and terminals 81 are connected by solder, and the first sub-terminal portion 312 and terminals 81 are connected by solder. Thus, electronic component 1 is mounted on the second substrate 8.

[0091] A power supply circuit is mounted on the second substrate 8, for example. A computing device, such as a central processing unit, powered by electricity supplied from the power supply circuit is mounted on the first substrate 7, for example. In this case, if the electronic component 1 is mounted on the first substrate 7 and the second substrate 8, the current path including the electronic component 1 between the power supply circuit and the computing device can be shortened.

[0092] When mounting electronic component 1, for example, the first substrate 7 is first configured such that the surface on which electronic component 1 is mounted faces upward. Solder is placed on each of the two terminals 71 of the first substrate 7. With the first surface mount 11 of electronic component 1 facing the first substrate 7, the first terminal portion 311 and the second sub-terminal portion 322 are each placed on the solder on the terminal 71. In this state, the solder is heated using a reflow oven or the like to bond the first terminal portion 311 and the second sub-terminal portion 322 to the terminal 71. Thus, electronic component 1 is mounted on the first substrate 7. Solder feet 72 are attached to the surface of the first terminal portion 311 exposed in the first end face 13, and solder feet 72 are also attached to the surface of the second sub-terminal portion 322 exposed in the second end face 14.

[0093] Next, the second substrate 8 is positioned such that the side on which the electronic component 1 is mounted faces upward. Solder is placed on each of the two terminals 81 of the second substrate 8. With the second surface mount 12 of the electronic component 1 facing the second substrate 8, the second terminal portion 321 and the first sub-terminal portion 312 are each placed on the solder on the terminal 81. In this state, the solder is heated using a reflow oven or the like to bond the second terminal portion 321 and the first sub-terminal portion 312 to the terminal. Thus, the electronic component 1 is mounted on the second substrate 8. Solder feet 82 are attached to the surface of the second terminal portion 321 exposed in the first end face 13, and solder feet 82 are also attached to the surface of the first sub-terminal portion 312 exposed in the second end face 14.

[0094] When the solder used for mounting the electronic component 1 is heated to mount it onto the second substrate 8, the solder feet 72 attached to the surface of the first terminal portion 311 exposed on the first end face 13 and the surface of the second sub-terminal portion 322 exposed on the second end face 14 are sometimes heated and melted. However, in this embodiment, the substrate 4 is located between the first terminal portion 311 and the first sub-terminal portion 312. The solder constituting the solder feet 72 has a higher affinity for the first terminal portion 311 and a lower affinity for the substrate 4. Therefore, even if the solder feet 72 melt, they are not easily moved from the first terminal portion 311 to the substrate 4. Therefore, it is easy to maintain the state of the solder feet 72 attached to the first terminal portion 311, and thus, it is easy to maintain the connection between the first terminal portion 311 and the terminal 71 of the first substrate 7. In addition, it is possible to suppress short circuits caused by the solder feet 72 attached to the first terminal portion 311 reaching the first sub-terminal portion 312. Similarly, in this embodiment, the substrate 4 is located between the second terminal portion 321 and the second sub-terminal portion 322. The solder constituting the solder foot 72 has a higher affinity for the second sub-terminal portion 322 and a lower affinity for the substrate 4. Therefore, even if the solder foot 72 melts, it is not easy for the solder foot 72 to move from the second sub-terminal portion 322 towards the substrate 4. Therefore, it is easy to maintain the state of the solder foot 72 attached to the second sub-terminal portion 322, and thus it is easy to maintain the connection between the second sub-terminal portion 322 and the terminal 71 of the first substrate 7. In addition, short circuits caused by the solder foot 72 reaching the second terminal portion 321 can be suppressed.

[0095] Furthermore, in the above description, the first terminal portion 311 and the first secondary terminal portion 312 are electrically connected, but they may not be electrically connected. That is, in the above description, the first secondary terminal portion 312 is included in the first terminal 31, but it may not be included in the first terminal 31 and may be a different element from the first terminal 31. In this case, the first secondary terminal portion 312 can be used to fix the electronic component 1 relative to the first substrate 7, but it is not used for the electrical connection between the first substrate 7 and the electronic component 1. Similarly, in the above description, the second terminal portion 321 and the second secondary terminal portion 322 are electrically connected, but they may not be electrically connected. That is, in the above description, the second secondary terminal portion 322 is included in the second terminal 32, but the second secondary terminal portion 322 may not be included in the second terminal 32, but may be a different element from the second terminal 32. In this case, the second secondary terminal portion 322 can be used to fix the electronic component 1 relative to the second substrate 8, but is not used for electrical connection between the second substrate 8 and the electronic component 1.

[0096] The thickness dimension TD2 (Z-direction dimension) of the conductor wiring constituting the coil 2 in the first embodiment (the conductor wiring constituting the first coil portion 21 and the second coil portion 22 respectively) is, for example, 35 μm or more and 350 μm or less.

[0097] The conductor wiring constituting the coil 2 in the first embodiment extends in a spiral and elongated manner along the long side direction DS2 of the conductor wiring. The width dimension WD2 of the conductor wiring constituting the coil 2 in the first embodiment (the dimension of the direction perpendicular to either the Z direction or the long side direction DS2 of the conductor wiring) is, for example, 10 μm or more and 200 μm or less.

[0098] The thickness dimension TD3 (Z-direction dimension) of the conductor wiring constituting the first terminal 31 and the second terminal 32 in the first embodiment (the conductor wiring constituting the first terminal portion 311, the first sub-terminal portion 312, the second terminal portion 321, and the second sub-terminal portion 322) is, for example, 35 μm or more and 500 μm or less. Furthermore, as described above, it is preferable that the width dimension WD2 of the conductor wiring constituting the coil 2 is smaller than the thickness dimension TD3 of the conductor wiring constituting the first terminal 31 and the second terminal 32.

[0099] In the first embodiment, the conductor wiring of each of the first terminal 31 and the second terminal 32 extends elongatedly in the long side direction DS3. In this embodiment, the long side direction DS3 is along the Y direction. The width dimension WD3 (the dimension in a direction perpendicular to either the Z direction or the long side direction DS3 of the conductor wiring of each of the first terminal 31 and the second terminal 32 in the first embodiment) is, for example, 50 μm or more and 200 μm or less. Further, as described above, it is preferable that the width dimension WD2 of the conductor wiring constituting the coil 2 is smaller than the width dimension WD3 of the conductor wiring constituting the first terminal portion 311 and the second terminal portion 321. If the coil 2 is composed of conductor wiring, it is easy to adjust the thickness dimension TD2 and the width dimension WD2 of the coil 2 independently. By setting the thickness dimension TD2 and the width dimension WD2 of the conductor wiring constituting the coil 2 to different values, the resistance value, L value, and thermal characteristics of the coil 2 can be appropriately adjusted. Similarly, if the first terminal 31 and the second terminal 32 are each composed of free conductor wiring, the thickness dimension TD3 and the width dimension WD3 of the first terminal 31 and the second terminal 32 can be adjusted independently. By setting the thickness dimension TD3 and the width dimension WD3 of the conductor wiring constituting the first terminal 31 and the second terminal 32 to different values, the resistance value, L value and thermal characteristics of the first terminal 31 and the second terminal 32 can be adjusted appropriately.

[0100] In the first embodiment, the first terminal 31 and the second terminal 32 are each exposed to the outside of the electronic component 1, and the electronic component 1 does not have a conductor covering the first terminal 31 and the second terminal 32. That is, the electronic component 1 does not have external electrodes that are not integrated with the coil 2, such as external electrodes formed of silver paste. Therefore, as described above, the performance degradation of the electronic component 1 caused by the decrease in the internal conductivity of the electronic component 1 can be suppressed, and the heat dissipation of the electronic component 1 can be improved.

[0101] However, the electronic component 1 may also have at least one of the following: a metal coating covering the portion of the first terminal 31 exposed to the outside of the molded body 5, and a metal coating covering the portion of the second terminal 32 exposed to the outside of the molded body 5. The metal coating is made, for example, by a plating process. That is, the metal coating is, for example, a plating coating.

[0102] The thickness of the metal coating is, for example, greater than 0.1 μm and less than 10 μm.

[0103] Even with the aforementioned metal coating, the electronic component 1's performance degradation caused by a decrease in internal conductivity can be suppressed, and its heat dissipation can be improved. Furthermore, the metal coating protects the surface of at least one of the first terminal 31 and the second terminal 32 from oxidation, and also improves the wettability of the solder on at least one of the first terminal 31 and the second terminal 32.

[0104] Appropriate surface treatment may also be performed on at least one of the portions of the first terminal 31 exposed to the outside of the molded body 5 and the portions of the second terminal 32 exposed to the outside of the molded body 5. As a surface treatment, for example, at least one treatment selected from the group consisting of oxidation prevention treatment, flux treatment, and solder leveling may also be performed.

[0105] 2.2. Second Implementation Method

[0106] For the electronic component 1 involved in the second embodiment, refer to Figure 14 To illustrate. In the following description, for the same elements as in the first embodiment, the same reference numerals are used in the accompanying drawings as in the first embodiment, and descriptions common to the first embodiment are appropriately omitted below.

[0107] In the second embodiment, the surfaces of the first mounting surface 11 of the electronic component 1, the first terminal portion 311, and the second sub-terminal portion 322 are not exposed. That is, the first mounting surface 11 of the electronic component 1 is composed only of the surface of the molded body 5. Furthermore, in the first end surface 13 of the electronic component 1, the surfaces of the molded body 5, the insulating film 6, the first terminal portion 311, the substrate 4, and the first sub-terminal portion 312 are arranged sequentially in the Z direction, and these surfaces are flush. Similarly, in the second end surface 14 of the electronic component 1, the surfaces of the molded body 5, the insulating film 6, the second sub-terminal portion 322, the substrate 4, and the second terminal portion 321 are arranged sequentially in the Z direction, and these surfaces are flush. In the second embodiment, when the electronic component 1 is mounted on the substrate, solder mounting defects such as patch lifting are less likely to occur.

[0108] 2.3. Third Implementation Method

[0109] For the electronic component 1 involved in the third embodiment, refer to Figures 15 to 23 To illustrate. In the following description, for the same elements as in the first embodiment, the same reference numerals are used in the accompanying drawings as in the first embodiment, and descriptions common to the first embodiment are appropriately omitted below.

[0110] In the third embodiment, in each of the end faces 15 at both ends of the electronic component 1 and the molded body 5 in the Y direction, the surface of the first terminal portion 311, the surface of the first sub-terminal portion 312, the surface of the second terminal portion 321, and the surface of the second sub-terminal portion 322 are not exposed. That is, each of the end faces 15 at both ends of the electronic component 1 in the Y direction is composed only of the surface of the molded body 5.

[0111] In the third embodiment, the Y-direction dimension of the first terminal portion 311 in the coil 2 is larger than the Y-direction dimension of the entire first coil portion 21, and the ends on both sides of the first terminal portion 311 in the Y-direction protrude outwards from the ends on both sides of the entire first coil portion 21 in the Y-direction. Further, the Y-direction dimension of the second terminal portion 321 in the coil 2 is larger than the Y-direction dimension of the entire second coil portion 22, and the ends on both sides of the second terminal portion 321 in the Y-direction protrude outwards from the ends on both sides of the entire second coil portion 22 in the Y-direction. Apart from this, the substrate 4, coil 2, and insulating film 6 in the third embodiment have the same structure as in the first embodiment (see [reference]). Figures 15 to 23 ).

[0112] According to the third embodiment, when multiple electronic components 1 are mounted on a substrate arranged in the Y direction, the first terminals 31 of adjacent electronic components 1 are less likely to come into contact with each other, and the second terminals 32 are less likely to come into contact with each other. Therefore, short circuits between electronic components 1 are less likely to occur.

[0113] 2.4. Fourth Implementation Method

[0114] For the electronic component 1 involved in the fourth embodiment, refer to Figure 24 To illustrate. In the following description, for the same elements as in the first embodiment, the same reference numerals are used in the accompanying drawings as in the first embodiment, and descriptions common to the first embodiment are appropriately omitted below.

[0115] In the fourth embodiment, the surfaces of the first terminal portion 311 and the second sub-terminal portion 322 are not exposed in the first mounting surface 11 of the electronic component 1 and the molded body 5. That is, the first mounting surface 11 of the electronic component 1 is composed only of the surface of the molded body 5. Furthermore, in the second mounting surface 12 of the electronic component 1 and the molded body 5, the surfaces of the second terminal portion 321 and the first sub-terminal portion 312 are not exposed. That is, the second mounting surface 12 of the electronic component 1 is also composed only of the surface of the molded body 5.

[0116] Furthermore, on the first end face 13 of the electronic component 1, the surfaces of the molded body 5, the insulating film 6, the first terminal portion 311, the substrate 4, the first secondary terminal portion 312, and the molded body 5 are arranged sequentially in the Z direction, and these surfaces are flush. Similarly, on the second end face 14 of the electronic component 1, the surfaces of the molded body 5, the insulating film 6, the second secondary terminal portion 322, the substrate 4, the second terminal portion 321, and the molded body 5 are arranged sequentially in the Z direction, and these surfaces are flush.

[0117] According to the fourth embodiment, it is not necessary to expose the first terminal 31 and the second terminal 32 on the first patch surface 11 and the second patch surface 12 respectively, so there is no need for a process of exposing the first terminal 31 and the second terminal 32 by grinding or the like.

[0118] 3. Method

[0119] This disclosure includes the following methods.

[0120] The electronic component (1) according to the first method comprises: an electrically insulating substrate (4), a coil (2) supported by the substrate (4), a first terminal (31) supported by the substrate (4), a second terminal (32) supported by the substrate (4), and a molded body (5) containing magnetic material and holding the substrate (4), the coil (2), the first terminal (31), and the second terminal (32). The first terminal (31) and the second terminal (32) are each integrated with the coil (2). The coil (2) is entirely embedded in the molded body (5). A portion of the first terminal (31) protrudes outside the molded body (5). A portion of the second terminal (32) protrudes outside the molded body (5).

[0121] According to this method, the reduction in conductivity and thermal conductivity between the coil (2) and the first terminal (31) and the second terminal (32) can be suppressed.

[0122] In the second embodiment, based on the first embodiment, the substrate (4) has a first main surface (401) and a second main surface (402) opposite to the first main surface (401). The coil (2) has a first coil portion (21) overlapping the first main surface (401), a second coil portion (22) overlapping the second main surface (402), and a coil connecting portion (23) electrically connecting the first coil portion (21) and the second coil portion (22). The first terminal (31) has a first terminal portion (311) overlapping the first main surface (401). The second terminal (32) has a second terminal portion (321) overlapping the second main surface (402). The first terminal portion (311) is connected to and integrated with one end of the first coil portion (21). The second terminal portion (321) is connected to and integrated with one end of the second coil portion (22).

[0123] According to this method, the first terminal portion (311) and the second terminal portion (321) can be disposed on the first main surface (401) and the second main surface (402) of the substrate (4), respectively.

[0124] In the third embodiment, based on the second embodiment, the substrate (4) further has a coil connection hole (42) extending from the first main surface (401) to the second main surface (402). The coil connection part (23) is disposed within the coil connection hole (42).

[0125] In the fourth embodiment, based on the second or third embodiment, the first terminal (31) further has a first secondary terminal portion (312) that overlaps with the second main surface (402) of the substrate (4), and a first terminal connection portion (313) that electrically connects the first terminal portion (311) and the first secondary terminal portion (312).

[0126] According to this method, either the first terminal portion (311) or the first sub-terminal portion (312) can be used to mount the electronic component (1) onto the substrate, and heat can be dissipated from either the first terminal portion (311) or the first sub-terminal portion (312), thereby further improving the heat dissipation performance of the electronic component (1).

[0127] In the fifth embodiment, based on the fourth embodiment, the substrate (4) further has a first terminal connection hole (45) extending from the first main surface (401) to the second main surface (402). The first terminal connection portion (313) is disposed within the first terminal connection hole (45).

[0128] In the sixth embodiment, based on the fourth or fifth embodiment, the second terminal (32) further has a second sub-terminal portion (322) that overlaps with the first main surface (401) of the substrate (4), and a second terminal connecting portion (323) that electrically connects the second terminal portion (321) and the second sub-terminal portion (322).

[0129] According to this method, either the second terminal portion (321) or the second sub-terminal portion (322) can be used to mount the electronic component (1) onto the substrate, and heat can be dissipated from either the second terminal portion (321) or the second sub-terminal portion (322), thereby further improving the heat dissipation performance of the electronic component (1).

[0130] In the seventh embodiment, based on the sixth embodiment, the substrate (4) further has a second terminal connection hole (46) extending from the first main surface (401) to the second main surface (402). The second terminal connection portion (323) is disposed within the second terminal connection hole (46).

[0131] In the eighth embodiment, based on any of the second to seventh embodiments, the thickness dimension of the first coil portion (21) along the thickness direction of the substrate (4) is smaller than the thickness dimension of the first terminal portion (311) along the thickness direction of the substrate (4).

[0132] In the ninth embodiment, based on the eighth embodiment, the first coil section (21) and the first terminal section (311) are each configured with free conductor wiring. The width of the conductor wiring constituting the first coil section (21) is smaller than the width of the conductor wiring constituting the first terminal section (311). The width of the conductor wiring constituting the second coil section (22) is smaller than the width of the conductor wiring constituting the second terminal section (321).

[0133] In the 10th embodiment, based on the 8th or 9th embodiment, the surface of the first terminal portion (311) of the first terminal (31) opposite to the substrate (4) side is exposed to the outside of the molded body (5).

[0134] According to this method, the surface of the first terminal portion (311) can be used to mount the electronic component (1) onto the substrate.

[0135] In the 11th embodiment, based on any of the 8th to 10th embodiments, the thickness dimension of the second coil portion (22) along the thickness direction of the substrate (4) is smaller than the thickness dimension of the second terminal portion (321) of the second terminal (32) along the thickness direction of the substrate (4).

[0136] In the 12th embodiment, based on the 11th embodiment, the second coil section (22) and the second terminal section (321) are each configured with free conductor wiring. The width of the conductor wiring constituting the second coil section (22) is smaller than the width of the conductor wiring constituting the second terminal section (321).

[0137] In the 13th embodiment, based on the 11th or 12th embodiment, the surface of the second terminal portion (321) of the second terminal (32) opposite to the substrate (4) side is exposed to the outside of the molded body (5).

[0138] According to this method, the surface of the second terminal portion (321) can be used to mount the electronic component (1) onto the substrate.

[0139] In the 14th embodiment, based on any of the 1st to 13th embodiments, a first terminal (31) and a second terminal (32) are respectively disposed at both ends of the electronic component (1) in a direction orthogonal to the thickness direction of the substrate (4).

[0140] According to this method, the first terminal (31) and the second terminal (32) are configured separately from each other, thereby suppressing short circuits when the electronic component (1) is mounted on the substrate.

[0141] In the 15th embodiment, based on the 14th embodiment, the side of the first terminal (31) opposite to the side of the second terminal (32) is exposed to the outside of the molded body (5), and the side of the second terminal (32) opposite to the side of the first terminal (31) is exposed to the outside of the molded body (5).

[0142] According to this method, the side of the first terminal (31) opposite to the side of the second terminal (32) and the side of the second terminal (32) opposite to the side of the first terminal (31) can be used to mount the electronic component (1) onto the substrate.

[0143] In the 16th embodiment, based on any of the 1st to 15th embodiments, there is also an insulating film (6) between the coil (2), the first terminal (31) and the second terminal (32) and the molded body (5).

[0144] According to this method, short circuits in the coil (2), the first terminal (31) and the second terminal (32) can be suppressed.

[0145] In the 17th method, based on any of the 1st to 16th methods, the electronic component (1) is a patch component.

[0146] In the 18th embodiment, based on any of the 1st to 17th embodiments, the electronic component (1) has at least one selected from the group consisting of a metal coating covering the portion of the first terminal (31) exposed to the outside of the molded body (5) and a metal coating covering the portion of the second terminal (32) exposed to the outside of the molded body (5).

[0147] Explanation of reference numerals in the attached figures

[0148] 1. Electronic components

[0149] 2 coils

[0150] 21 First coil section

[0151] 22 Second coil section

[0152] 23 Coil connection part

[0153] 31 Terminal 1

[0154] 311 Terminal 1

[0155] 312 First Sub-Terminal Section

[0156] 313 Terminal 1 Connection

[0157] 32 Terminal 2

[0158] 321 Second terminal section

[0159] 322 Second Sub-terminal Section

[0160] 323 Second terminal connection part

[0161] 4. Substrate

[0162] 401 1st Main Side

[0163] 402 2nd Main Side

[0164] 42 Coil Connection Hole

[0165] 45 Terminal 1 connection hole

[0166] 46 Terminal 2 connection hole

[0167] 5 formed body

[0168] 6. Insulating film.

Claims

1. An electronic component, comprising: The substrate has electrical insulation properties; The coil is supported by the substrate; The first terminal is supported by the substrate; The second terminal is supported by the substrate; and A molded body containing magnetic material holds the substrate, the coil, the first terminal, and the second terminal. The first terminal and the second terminal are each integrated with the coil. The coil is entirely embedded in the shaped body. A portion of the first terminal is exposed outside the molded body. A portion of the second terminal is exposed to the outside of the molded body.

2. The electronic component according to claim 1, wherein, The substrate has a first main surface and a second main surface opposite to the first main surface. The coil has: a first coil portion overlapping the first main surface, a second coil portion overlapping the second main surface, and a coil connecting portion electrically connecting the first coil portion and the second coil portion. The first terminal has a first terminal portion that overlaps with the first main surface. The second terminal has a second terminal portion that overlaps with the second main surface. The first terminal portion is connected to one end of the first coil portion and is integrated with it. The second terminal portion is connected to one end of the second coil portion and is integrated with it.

3. The electronic component according to claim 2, wherein, The substrate also has a coil connection hole extending from the first main surface to the second main surface. The coil connection portion is disposed within the coil connection hole.

4. The electronic component according to claim 2, wherein, The first terminal also has a first secondary terminal portion that overlaps with the second main surface of the substrate, and a first terminal connecting portion that electrically connects the first terminal portion and the first secondary terminal portion.

5. The electronic component according to claim 4, wherein, The substrate also has a first terminal connection hole extending from the first main surface to the second main surface. The first terminal connection portion is disposed within the first terminal connection hole.

6. The electronic component according to claim 4, wherein, The second terminal also has a second sub-terminal portion overlapping the first main surface of the substrate, and a second terminal connecting portion electrically connecting the second terminal portion and the second sub-terminal portion.

7. The electronic component according to claim 6, wherein, The substrate also has a second terminal connection hole extending from the first main surface to the second main surface. The second terminal connection portion is disposed within the second terminal connection hole.

8. The electronic component according to claim 2, wherein, The thickness dimension of the first coil portion along the thickness direction of the substrate is smaller than the thickness dimension of the first terminal portion along the thickness direction of the substrate.

9. The electronic component according to claim 8, wherein, The first coil section and the first terminal section are each configured with free conductor wiring. The width of the conductor wiring constituting the first coil portion is smaller than the width of the conductor wiring constituting the first terminal portion. The width of the conductor wiring constituting the second coil portion is smaller than the width of the conductor wiring constituting the second terminal portion.

10. The electronic component according to claim 8, wherein, The surface of the first terminal portion of the first terminal, opposite to the substrate side, is exposed to the outside of the molded body.

11. The electronic component according to claim 8, wherein, The thickness dimension of the second coil portion along the thickness direction of the substrate is smaller than the thickness dimension of the second terminal portion along the thickness direction of the substrate.

12. The electronic component according to claim 11, wherein, The second coil section and the second terminal section are each composed of free conductor wiring. The width of the conductor wiring constituting the second coil portion is smaller than the width of the conductor wiring constituting the second terminal portion.

13. The electronic component according to claim 11, wherein, The surface of the second terminal portion of the second terminal, opposite to the substrate side, is exposed to the outside of the molded body.

14. The electronic component according to claim 1, wherein, The first terminal and the second terminal are respectively disposed at both ends of the electronic component in a direction orthogonal to the thickness direction of the substrate.

15. The electronic component according to claim 14, wherein, The side of the first terminal opposite to the side of the second terminal is exposed to the outside of the molded body, and the side of the second terminal opposite to the side of the first terminal is exposed to the outside of the molded body.

16. The electronic component according to claim 1, wherein, It also has an insulating film between the coil, the first terminal and the second terminal and the molded body.

17. The electronic component according to claim 1, wherein, The electronic component is a surface-mount component.

18. The electronic component according to claim 1, wherein, It has at least one selected from the group consisting of a metal coating covering the portion of the first terminal exposed to the outside of the molded body and a metal coating covering the portion of the second terminal exposed to the outside of the molded body.

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