A liquid crystal display module test flow control method and system

Abstract

The application discloses a liquid crystal display module test process control method and system, and relates to the technical field of liquid crystal display module control. The method extracts film layer stacking thickness parameters, driving chip binding area coordinate parameters and flexible circuit board pressing offset parameters of a liquid crystal display module to be tested to establish basic test control constraints; collects vacuum chuck array coordinates, adsorption negative pressure feedback values, probe contact stroke feedback values, test execution beat state and mechanical impact vibration frequency parameters of an execution mechanism to construct real-time control state data; calculates vacuum chuck negative pressure compensation, probe slow descent speed compensation and asynchronous image acquisition trigger timing; controls the screen emission of a light image at a grabbing point according to the asynchronous image acquisition trigger timing and extracts a brightness abnormal area; when the abnormal area is extracted, the compensation is corrected according to the associated state data and the execution mechanism is driven to perform secondary ladder slow descent retest actions, and a sorting instruction is issued when no abnormal area is extracted.

Description

Technical Field

[0001] This invention relates to the field of liquid crystal display module control technology, specifically to a liquid crystal display module testing process control method and system. Background Technology

[0002] Liquid crystal display (LCD) modules are core human-computer interaction components in smart products such as smartphones, automotive displays, and wearable devices. With the rapid expansion of the related smart device market, manufacturers face enormous production capacity demands. In the LCD module production process, automated testing is a crucial step in ensuring the quality of the screens before they leave the factory. This typically involves using automated screen testing stations and various crimping fixtures to test optical and electrical characteristics, eliminating defective products and ensuring a high yield rate for the final product.

[0003] In actual automated testing processes, manufacturing tolerances from upstream processes (such as bonding and welding) lead to differences in the physical tolerance of different individual modules. Furthermore, the probe modules and vacuum suction cups in the testing station experience physical wear and tear and fluctuations in their adsorption state after long-term operation. Existing technologies mostly employ fixed probe pressure, fixed vacuum suction negative pressure, and fixed mechanical cycles to perform pressing and screen testing actions. This mechanical execution method generates a rigid impact upon probe contact with the module, easily causing microscopic compression of the panel structure and readily triggering optical interference distortion due to pressure on the liquid crystal layer. This temporary mechanical deformation is frequently misjudged by visual acquisition systems as inherent screen brightness unevenness defects, resulting in the rejection of many good products and severely reducing the production line's first-pass yield. Therefore, it is still necessary to provide a control method for the testing process of liquid crystal display modules to improve the adaptive adjustment capability of the testing process and the accuracy of defect judgment. Summary of the Invention

[0004] In order to overcome the above-mentioned defects of the prior art, embodiments of the present invention provide a liquid crystal display module testing process control method and system to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a test process control method for liquid crystal display modules, comprising the following steps: S1, extracting the film layer stacking thickness parameters, driver chip bonding area coordinate parameters, and flexible circuit board pressing offset parameters of the liquid crystal display module under test, and establishing basic test control constraints for the optical test station; S2, collecting the vacuum chuck array coordinates, adsorption negative pressure feedback values, probe pressing contact stroke feedback values, and test execution cycle status of the actuator in the optical test station, and simultaneously acquiring the mechanical impact vibration frequency parameters at the moment of probe contact, constructing real-time control status data of the actuator; S3, based on the basic test control constraints and The actuator calculates the vacuum suction cup negative pressure compensation, probe descent speed compensation, and asynchronous image acquisition trigger timing based on real-time control status data; S4, based on the asynchronous image acquisition trigger timing, the image acquisition mechanism is controlled to capture the screen's luminous image and extract the screen's abnormal brightness area; when the screen's abnormal brightness area is extracted, the vacuum suction cup negative pressure compensation and probe descent speed compensation are corrected based on the actuator's real-time control status data associated with the screen's abnormal brightness area, and the actuator is driven to perform a secondary stepped descent retest action based on the corrected vacuum suction cup negative pressure compensation and probe descent speed compensation; when the screen's abnormal brightness area is not extracted, a sorting instruction is issued to the sorting mechanism.

[0006] Preferably, the specific process for extracting the film stacking thickness parameters, driver chip bonding area coordinate parameters, and flexible circuit board lamination offset parameters of the liquid crystal display module under test is as follows: read the unique identifier code of the liquid crystal display module under test, and retrieve the pre-process production log bound in the manufacturing execution system; parse the film stacking thickness parameters from the bonding process log; extract the driver chip bonding area coordinate parameters from the chip bonding process log; and extract the flexible circuit board lamination offset parameters from the visual alignment process log.

[0007] Preferably, the logical process for establishing the basic test control constraints of the optical test station is as follows: mapping the film stack thickness parameters and the driver chip binding area coordinate parameters to a two-dimensional physical coordinate system to generate the in-plane thickness distribution topological features of the liquid crystal display module under test; combining the in-plane thickness distribution topological features and the flexible circuit board pressing offset parameters to define the deformation force boundary of the flexible circuit board and the extreme value of probe contact pressure; converting the deformation force boundary of the flexible circuit board and the extreme value of probe contact pressure into the basic test control constraints for the downward pressing action of the optical test station.

[0008] Preferably, the specific process for acquiring the vacuum suction cup array coordinates, adsorption negative pressure feedback value, probe pressing contact stroke feedback value, and test execution cycle status of the actuator in the optical test station is as follows: a status polling command is sent to the programmable logic controller of the optical test station to extract the vacuum suction cup array coordinates in the control register; the adsorption negative pressure feedback value output by the actuator's air pressure sensor channel is acquired; the probe pressing contact stroke feedback value output by the encoder of the probe module servo driver is extracted; the clock cycle flow timing data inside the programmable logic controller is read and converted into the test execution cycle status for output.

[0009] Preferably, the specific process of synchronously acquiring the mechanical impact vibration frequency parameters at the moment of probe contact and constructing the real-time control status data of the actuator is as follows: In response to the state reversal signal generated when the probe pressing contact stroke feedback value reaches the physical contact critical point, a high-frequency vibration sensor is triggered to collect the transient mechanical waveform of the probe module; the main frequency characteristics of the transient mechanical waveform are extracted and the mechanical impact vibration frequency parameters are converted and output; the vacuum suction cup array coordinates, adsorption negative pressure feedback value, probe pressing contact stroke feedback value, test execution cycle state and mechanical impact vibration frequency parameters are timestamped and aggregated and packaged into multi-dimensional real-time control status data of the actuator.

[0010] Preferably, the specific process for calculating the vacuum suction cup negative pressure compensation, probe descent speed compensation, and asynchronous image acquisition trigger timing based on the basic test control constraints and the real-time control status data of the actuator is as follows: The adsorption negative pressure feedback value and probe downward contact stroke feedback value in the real-time control status data of the actuator are compared with the flexible circuit board deformation force boundary and probe contact pressure extreme value in the basic test control constraints through a closed-loop deviation comparison, and the physical contact stress deviation difference is extracted; the physical contact stress deviation difference is converted into servo drive control variables and pneumatic proportional valve control variables, respectively generating the probe descent speed compensation and vacuum suction cup negative pressure compensation; the mechanical impact vibration frequency parameters and test execution cycle state in the real-time control status data of the actuator are mapped to the physical damping attenuation function, the mechanical vibration ripple dissipation delay period is extracted, and the asynchronous image acquisition trigger timing is output.

[0011] Preferably, the specific process of controlling the image acquisition mechanism to capture the luminous image of the dot screen and extract the abnormal brightness area of ​​the dot screen according to the asynchronous image acquisition trigger timing quantity is as follows: Analyze the asynchronous image acquisition trigger timing quantity, generate a hardware trigger pulse signal with a corresponding delay period inside the programmable logic controller; send the hardware trigger pulse signal to the image acquisition mechanism to control the image acquisition mechanism to capture the luminous image of the dot screen at the node of mechanical impact vibration dissipation; extract the pixel cluster with brightness change in the luminous image of the dot screen, transform and align the image pixel coordinate system where the brightness change pixel cluster is located to the mechanical physical coordinate system of the actuator, and output the abnormal brightness area of ​​the dot screen.

[0012] Preferably, when an abnormal brightness area of ​​the screen is extracted, the specific process of correcting the vacuum suction cup negative pressure compensation amount and the probe descent speed compensation amount based on the real-time control status data of the actuator associated with the abnormal brightness area is as follows: the mechanical physical coordinates of the abnormal brightness area of ​​the screen are spatially interfered and overlapped with the coordinates of the vacuum suction cup array in the real-time control status data of the actuator to lock the target vacuum suction cup that causes local stress interference and the associated probe pressing contact stroke feedback value; based on the spatial distribution state of the target vacuum suction cup and the probe pressing contact stroke feedback value, a stress release coefficient is generated for the local stress interference area; the stress release coefficient is integrated into the vacuum suction cup negative pressure compensation amount and the probe descent speed compensation amount to output the corrected vacuum suction cup negative pressure compensation amount and the probe descent speed compensation amount.

[0013] Preferably, the specific process of the drive actuator performing the secondary stepped descent retest based on the corrected vacuum suction cup negative pressure compensation and probe descent speed compensation is as follows: the corrected vacuum suction cup negative pressure compensation is converted into an analog voltage signal and sent to the pneumatic proportional valve to control the vacuum suction cup array to perform a small negative pressure exhaust action to release residual mechanical stress; the corrected probe descent speed compensation is parsed into a multi-segment servo motion pulse sequence and sent to the probe servo driver; the probe servo driver is controlled to perform micro-lifting, deceleration and pressure holding actions in sequence according to the multi-segment servo motion pulse sequence to complete the secondary stepped descent retest.

[0014] A liquid crystal display module testing process control system, used to execute the aforementioned liquid crystal display module testing process control method, includes: a constraint construction module, used to extract the film layer stacking thickness parameters, driver chip bonding area coordinate parameters, and flexible circuit board pressing offset parameters of the liquid crystal display module under test, and establish basic test control constraints for the optical test station; a state acquisition module, used to acquire the vacuum chuck array coordinates, adsorption negative pressure feedback values, probe pressing contact stroke feedback values, and test execution cycle states of the actuator in the optical test station, and synchronously acquire the mechanical impact vibration frequency parameters at the moment of probe contact, constructing real-time control state data of the actuator; and a compensation calculation module, used to calculate the basic test constraints based on the constraints. The test control constraint and the real-time control status data of the actuator calculate the vacuum suction cup negative pressure compensation, probe descent speed compensation, and asynchronous image acquisition trigger timing. The closed-loop control module is used to control the image acquisition mechanism to capture the screen's luminous image and extract abnormal brightness areas based on the asynchronous image acquisition trigger timing. When an abnormal brightness area is extracted, the vacuum suction cup negative pressure compensation and probe descent speed compensation are corrected based on the actuator's real-time control status data associated with the abnormal brightness area. The actuator is then driven to perform a secondary stepped descent retest based on the corrected vacuum suction cup negative pressure compensation and probe descent speed compensation. If no abnormal brightness area is extracted, a sorting instruction is issued to the sorting mechanism.

[0015] The technical effects and advantages of this invention are as follows: (1) In the technical solution described in this invention, the film layer stacking thickness parameters, driver chip bonding area coordinate parameters, and flexible circuit board pressing offset parameters of the liquid crystal display module under test are extracted to establish the basic test control constraints of the optical test station; the vacuum suction cup array coordinates, adsorption negative pressure feedback values, probe pressing contact stroke feedback values, and test execution cycle states of the actuator in the optical test station are collected, and the mechanical impact vibration frequency parameters at the moment of probe contact are obtained simultaneously to construct the real-time control state data of the actuator. Thus, the physical structure differences caused by upstream manufacturing tolerances can be integrated with the real-time dynamic wear state of the actuator in the current test station, changing the rigid control logic in the prior art that ignores individual differences of modules and dynamic changes of equipment, and providing an accurate underlying state benchmark for subsequent targeted action compensation.

[0016] (2) In the technical solution described in this invention, the vacuum suction cup negative pressure compensation amount, probe descent speed compensation amount, and asynchronous image acquisition trigger timing amount are calculated based on the basic test control constraints and the real-time control status data of the actuator. Based on the asynchronous image acquisition trigger timing amount, the image acquisition mechanism is controlled to capture the luminous image of the dot screen and extract the dot screen brightness abnormal area. When the dot screen brightness abnormal area is extracted, the compensation amount is corrected according to the associated real-time control status data of the actuator, and the actuator is driven to perform a secondary step descent retest action based on the corrected compensation amount. If no abnormality is extracted, a sorting instruction is issued. Thus, the pre-state data can be directly converted into the physical closed-loop control parameters of the actuator, and the frequency band of stress interference caused by probe rigid impact can be effectively avoided by using the asynchronous image acquisition timing. When an abnormality occurs, the step descent unloading retest is automatically performed, eliminating the optical interference misjudgment problem caused by mechanical stress, and improving the pass rate of the test process and the fault tolerance rate of equipment operation.

[0017] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0018] Figure 1 This is a flowchart of a liquid crystal display module testing process control method according to the present invention; Figure 2 This is a schematic diagram of the in-plane thickness topology and stress extremum distribution of the liquid crystal display module under test in an embodiment of the present invention; Figure 3 This is a schematic diagram of the timing of mechanical vibration dissipation and closed-loop control in an embodiment of the present invention; Figure 4 This is a flowchart of a test process control system for a liquid crystal display module according to the present invention. Detailed Implementation

[0019] This application provides a test process control method and system for liquid crystal display modules, which solves the problem that rigid mechanical impact caused by fixed motion parameters in existing liquid crystal display module test processes can easily lead to misjudgment of stress optical distortion and mechanical micro-damage.

[0020] The overall approach of the scheme in this application embodiment is as follows: extract the structural tolerance parameters of the module under test to establish basic test control constraints, and collect feedback values ​​and mechanical impact vibration frequencies from actuators such as vacuum suction cups and probe modules in the test station to construct real-time control state data; calculate the vacuum suction cup negative pressure compensation amount, probe descent speed compensation amount, and asynchronous image acquisition trigger timing amount based on the aforementioned control constraints and state data; drive the image acquisition mechanism to extract abnormal brightness areas based on the trigger timing amount; when abnormal brightness areas exist, correct the negative pressure and speed compensation amounts and drive the actuator to perform a secondary stepped descent retest control action; execute the sorting instruction when no abnormal areas are extracted.

[0021] Example 1; please refer to Figure 1 This invention provides a technical solution: a test process control method for liquid crystal display modules, comprising the following steps: S1, extracting the film layer stacking thickness parameters, driver chip bonding area coordinate parameters, and flexible circuit board pressing offset parameters of the liquid crystal display module under test, and establishing basic test control constraints for the optical test station; S2, collecting the vacuum suction cup array coordinates, adsorption negative pressure feedback values, probe pressing contact stroke feedback values, and test execution cycle status of the actuator in the optical test station, and simultaneously acquiring the mechanical impact vibration frequency parameters at the moment of probe contact, constructing real-time control status data of the actuator; S3, based on the basic test control constraints and the execution... The mechanism calculates the vacuum suction cup negative pressure compensation, probe descent speed compensation, and asynchronous image acquisition trigger timing based on real-time control status data; S4, based on the asynchronous image acquisition trigger timing, the image acquisition mechanism is controlled to capture the screen's luminous image and extract abnormal brightness areas; when an abnormal brightness area is extracted, the vacuum suction cup negative pressure compensation and probe descent speed compensation are corrected based on the real-time control status data of the actuator associated with the abnormal brightness area, and the actuator is driven to perform a secondary stepped descent retest action based on the corrected vacuum suction cup negative pressure compensation and probe descent speed compensation; when no abnormal brightness area is extracted, a sorting instruction is issued to the sorting mechanism.

[0022] In this implementation scheme, step S1 establishes boundary constraints for the pressing action of the optical testing station by acquiring the physical dimensional tolerance parameters left in the early manufacturing stages of the liquid crystal display module under test. The film layer stacking thickness parameter refers to the actual total thickness of the liquid crystal panel after the various layers of materials such as the glass substrate, polarizer, and backlight module are bonded together. The driver chip bonding area coordinate parameter is used to indicate the specific physical spatial position of the display control chip in the edge area of ​​the glass substrate. The flexible circuit board pressing offset parameter characterizes the physical microscopic value of the flexible ribbon cable deviating from the standard positioning coordinates during the hot pressing process. After extracting the specific tolerance values ​​from the above-mentioned pre-manufacturing process, the control system calculates the deformation-sensitive area and the extreme value that the module under test can withstand when subjected to mechanical pressure, and transforms these physical boundary characteristics into the initial position limit and the upper limit of the force of the test station's execution components, forming the basic test control constraints.

[0023] Step S2 is used to collect the physical wear status and dynamic execution parameters of the testing equipment itself in real time. The actuator refers to the mechanical motion hardware combination in the optical testing station responsible for fixing the module and realizing electrical connection. The control system reads the coordinates of the vacuum suction cup array at multiple suction holes on the base and obtains the actual suction negative pressure feedback value returned by the pneumatic sensor to understand the fixed state of the bottom. At the same time, the system reads the probe pressing contact stroke feedback value returned by the servo motor encoder and records the actual pressing depth of the probe. The test execution cycle status represents the real-time timing progress of the current production line mechanical flow and test cycle. At the moment the probe contacts the module surface, the system captures the micro-oscillation waveform generated by the rigid collision through the piezoelectric sensor and extracts the mechanical impact vibration frequency parameter. The above real-time physical feedback quantities from the field hardware are aggregated and encapsulated into the real-time control status data of the actuator, which serves as the real physical benchmark for subsequent control deviation calculation.

[0024] Step S3 performs closed-loop deviation calculation between the pressure resistance limit of the individual module and the current execution state of the testing equipment, and outputs the corresponding adjustment control quantity. The control system compares the actual negative pressure and downward stroke with the upper limit of the basic constraints to calculate the vacuum suction cup negative pressure compensation amount and the exhaust volume value that the one-way indicating pneumatic proportional valve needs to be fine-tuned. The probe descent speed compensation amount is calculated based on the deviation between the contact stroke and the tolerance, and is the downward speed control command value that the probe servo motor needs to reduce at the contact end. The control system further combines the mechanical shock vibration frequency parameters and the cycle time to calculate the time delay required for the mechanical shock wave to completely dissipate in the glass substrate, and generates asynchronous image acquisition trigger timing quantity. The asynchronous image acquisition trigger timing quantity forces the image acquisition unit to wait for the panel deformation caused by mechanical vibration to recover before executing the capture command, eliminating the physical interference of mechanical vibration on optical detection.

[0025] Step S4 executes the actual test action judgment and physical closed-loop adjustment. The control system, according to the delay requirements of the asynchronous image acquisition trigger timing quantity, sends trigger pulses to the camera to capture the screen illumination image after the module is powered on, and locates areas of uneven brightness distribution or water ripples in the screen brightness within the image. When the system extracts an abnormal area, it does not directly determine it as a product defect, but instead retrieves the underlying control status data such as suction cup negative pressure and probe stroke corresponding to the image coordinates. Based on the status data, the system determines whether the abnormality is caused by local mechanical pressure and corrects the control commands for negative pressure and speed. The control system sends the corrected compensation commands to the pneumatic components and servo motor, controlling the suction cup to appropriately unload the negative pressure, and directing the probe to re-press the module with a segmented deceleration and gentle contact secondary step-down retest action. If no abnormal area is found, the system directly outputs control levels to direct the logistics sorting mechanism to transport the module to the good product silo, completing the physical closed-loop control of the entire automated testing process.

[0026] Specifically, the process for extracting the film stacking thickness parameters, driver chip bonding area coordinate parameters, and flexible circuit board lamination offset parameters of the liquid crystal display module under test is as follows: read the unique identifier code of the liquid crystal display module under test, and retrieve the pre-process production log bound in the manufacturing execution system; parse the film stacking thickness parameters from the bonding process log; extract the driver chip bonding area coordinate parameters from the chip bonding process log; and extract the flexible circuit board lamination offset parameters from the vision alignment process log.

[0027] In this implementation, the control system sends a data reading command through the fieldbus interface to obtain the unique identifier code string of the LCD module under test uploaded by the code reader arranged on the carrier track. Using this unique identifier code string as an index field, it initiates a cross-table query to the central database of the manufacturing execution system and downloads a production data package containing the entire life cycle history of the preceding processes. The control system's parsing module extracts the discrete thickness readings returned by multiple thickness sensors evenly distributed along the long axis of the substrate from the bonding process log, and encapsulates them dimensionally according to the measurement point position to form a film layer stacking thickness parameter vector. ,in, This represents a vector of film stacking thickness parameters; This represents the measured stack thickness at the k-th sampling point; n represents the total number of thickness sensors. The system reads the set of corner feature contour pixels fed back by the chip bonding machine's vision alignment module from the chip bonding process log, and generates the coordinate matrix of the driver chip bonding area through an affine transformation of the coordinate system. In the visual alignment process log, the system extracts the two-dimensional translational and rotational deviations between the reference mark before and the actual mark after lamination of the flexible circuit board, and analyzes and outputs the flexible circuit board lamination offset parameter vector. ,in This represents the vector of parameters indicating the lamination offset of the flexible circuit board. This indicates the horizontal displacement deviation. This indicates the vertical displacement deviation. This indicates the rotation angle offset.

[0028] Specifically, the logical process for establishing the basic test control constraints of the optical test station is as follows: Map the film stack thickness parameters and the driver chip binding area coordinate parameters to a two-dimensional physical coordinate system to generate the in-plane thickness distribution topological features of the liquid crystal display module under test; combine the in-plane thickness distribution topological features and the flexible circuit board pressing offset parameters to define the deformation force boundary of the flexible circuit board and the extreme value of probe contact pressure; convert the deformation force boundary of the flexible circuit board and the extreme value of probe contact pressure into the basic test control constraints for the downward pressing action of the optical test station.

[0029] In this implementation scheme, the control system establishes a two-dimensional physical coordinate system with the physical geometric center of the liquid crystal display module under test as the origin, and integrates the discrete thickness values ​​in the film layer stacking thickness parameter vector H and the coordinate matrix of the driver chip binding area. Projected onto a two-dimensional physical coordinate system, the discrete thickness data points are fitted to a surface using a bicubic spline interpolation algorithm, outputting a smooth and continuous in-plane thickness distribution topological characteristic function. ,in Let x represent the in-plane thickness distribution topological feature function; y represent the horizontal axis coordinate of the two-dimensional physical coordinate system; and y represent the vertical axis coordinate of the two-dimensional physical coordinate system. The control system extracts the in-plane thickness distribution topological feature function. The first-order spatial partial derivative is used as the local deformation curvature gradient, and based on the flexible circuit board pressing offset parameter vector. Spatial offset attenuation compensation calculation is performed on the downward contact force to calculate the extreme value of probe contact bearing pressure. The calculation formula is: In the formula, Indicates the extreme pressure value at which the probe contacts; The Young's modulus reference constant representing the glass substrate material; The thickness gradient along the horizontal axis represents the topological characteristic function of the in-plane thickness distribution. The thickness gradient along the vertical axis represents the topological characteristic function of the in-plane thickness distribution. This represents the offset attenuation weighting coefficient. The control system determines the offset attenuation weighting coefficient. The process is as follows: The system retrieves the historical measured data set of peel strength of the same batch of flexible circuit board materials from the local parameter configuration library, calculates the geometric median of all peel strength test values ​​in the dataset, divides the preset stress offset reference constant in the control program by the geometric median, and assigns the result to the offset attenuation weighting coefficient. The control system calculates the extreme pressure values ​​at the probe contact point. Define the coordinate set of the deformation stress boundary of the flexible circuit board, and transmit the coordinate set of the deformation stress boundary of the flexible circuit board and the extreme values ​​of probe contact pressure through an industrial field communication network. The parameters are burned into the underlying programmable logic controller (PLC) of the optical testing station. Within the PLC's internal registers, these parameters are rewritten and mapped to the maximum physical displacement limit parameters and torque overload alarm threshold parameters of the probe-pressing servo motor, thus completing the conversion and configuration into basic test control constraints. For example... Figure 2 As shown, a three-dimensional spatial system is established with the physical geometric center of the liquid crystal display module under test as the origin. The X and Y axes of the bottom surface correspond to a two-dimensional physical coordinate system, and the Z axis represents the measured thickness of the film stack. The continuously undulating surface in the figure intuitively maps the in-plane thickness distribution topological feature function generated by fitting using a bicubic spline interpolation algorithm. The discrete dots distributed at specific coordinate positions on the curved surface represent the extreme values ​​of probe contact pressure determined after offset attenuation compensation calculations within the bonding area of ​​the driver chip. This figure visually demonstrates how the system transforms microscopic thickness tolerances into visualized physical force boundaries, providing a clear spatial interference avoidance map for subsequent probe pressing.

[0030] Specifically, the process of acquiring the coordinates of the vacuum chuck array, the negative pressure feedback value, the probe pressure contact stroke feedback value, and the test execution cycle status of the actuator in the optical test station is as follows: a status polling command is sent to the programmable logic controller of the optical test station to extract the coordinates of the vacuum chuck array in the control register; the negative pressure feedback value output by the pressure sensor channel of the actuator is acquired; the probe pressure contact stroke feedback value output by the encoder of the probe module servo driver is extracted; the clock cycle flow timing data inside the programmable logic controller is read and converted into the test execution cycle status for output.

[0031] In this implementation scheme, the control system sends periodic polling messages to the programmable logic controller (PLC) of the optical testing station via the on-site industrial Ethernet protocol, directly addressing and reading the coordinates of the vacuum suction cup array configured in the control register. The control system's analog-to-digital converter (ADC) reads the analog voltage signal from the actuator's pressure sensor channel in parallel, converting it into a digital form of suction negative pressure feedback value. The high-speed counter inside the probe module's servo driver performs real-time calculations of the absolute encoder pulses during the probe's descent, outputting the probe's downward contact stroke feedback value. The control system intercepts the crystal oscillator count value from the PLC's core clock, converts it into the current mechanical motion timing data, and maps it to the test execution cycle state. During multi-source state acquisition, the control system calculates the normalized contact stroke deviation based on the suction negative pressure feedback value and the probe's downward contact stroke feedback value. The calculation formula is: In the formula, This indicates the normalized contact stroke deviation; This represents the probe's downward contact stroke feedback value during the m-th sampling period; This indicates the standard contact travel reference value set within the servo drive; This indicates the total number of polling samples taken from the servo driver encoder within the control cycle; This represents the negative pressure feedback value output by the air pressure sensor channel; Indicates the standard adsorption negative pressure reference quantity; This represents the pressure compensation correlation weighting coefficient. The control system determines the pressure compensation correlation weighting coefficient. The process is as follows: read the pressure sensor's fluctuation calibration log under different atmospheric pressure environments during historical no-load conditions, calculate the arithmetic mean of the pressure fluctuation variance over a predetermined number of consecutive working cycles, and assign the reciprocal of this arithmetic mean to the pressure compensation correlation weighting coefficient. The calculation of the above-mentioned normalized deviation value is not a pure data analysis, but rather serves as a feedforward compensation benchmark to directly drive the opening feedback closed loop of the bottom pressure proportional valve, ensuring that the negative pressure adsorption state adapts to the change in probe depth through physical balancing.

[0032] Specifically, the process of synchronously acquiring the mechanical impact vibration frequency parameters at the moment of probe contact and constructing the real-time control status data of the actuator is as follows: A state reversal signal is generated when the probe's downward contact stroke feedback value reaches the physical contact critical point, triggering a high-frequency vibration sensor to collect the transient mechanical waveform of the probe module; the main frequency characteristics of the transient mechanical waveform are extracted and the mechanical impact vibration frequency parameters are converted and output; the vacuum suction cup array coordinates, adsorption negative pressure feedback value, probe downward contact stroke feedback value, test execution cycle state, and mechanical impact vibration frequency parameters are timestamped and aggregated into multi-dimensional real-time control status data of the actuator.

[0033] In this implementation, when the probe's downward contact stroke feedback value equals the set physical contact critical point coordinates, the programmable logic controller's hardware interrupt interface outputs a level state toggle signal, triggering the high-frequency vibration sensor fixed to the probe module's backplate to open data latching and acquire the transient mechanical waveform of the probe impacting the surface of the LCD module under test. The digital signal processor within the control system reads this transient mechanical waveform, extracts the extreme point distribution characteristics of the transient mechanical waveform in the frequency domain, and converts it to output mechanical impact vibration frequency parameters. The calculation formula is: In the formula, This represents the frequency parameter of mechanical impact vibration. Represents discrete frequency domain scan variables; This indicates the total number of sampling points of the high-frequency vibration sensor within the hardware trigger window; Indicates the first The transient mechanical waveform amplitude value at each sampling point; This indicates the hardware sampling rate of the high-frequency vibration sensor; Represents the imaginary unit; This represents the physical assembly damping correction factor. The control system determines the physical assembly damping correction factor. The process is as follows: A rigid calibration plate is placed below the probe module to perform a no-load full-stroke pressing action. The fundamental resonant frequency output by the high-frequency vibration sensor is recorded. The ratio of the ideal rigid collision reference frequency to the fundamental resonant frequency is calculated, and this ratio is directly assigned to the physical assembly damping correction coefficient. The control system sends the output mechanical impact vibration frequency parameters, along with the coordinates of the vacuum suction cup array with the same command clock identifier, the suction negative pressure feedback value, the probe pressing contact stroke feedback value, and the test execution cycle status, into a buffer register for timestamp alignment. The data frame format of the underlying hardware protocol is then spliced ​​and multi-dimensionally aggregated to encapsulate the data into real-time control status data of the actuator for subsequent closed-loop control.

[0034] Specifically, the process for calculating the vacuum suction cup negative pressure compensation, probe descent speed compensation, and asynchronous image acquisition trigger timing based on the basic test control constraints and the real-time control status data of the actuator is as follows: The negative pressure feedback value and probe downward contact stroke feedback value in the real-time control status data of the actuator are compared with the flexible circuit board deformation force boundary and probe contact pressure extreme value in the basic test control constraints through a closed-loop deviation comparison to extract the physical contact stress deviation difference; the physical contact stress deviation difference is converted into servo drive control variables and pneumatic proportional valve control variables to generate the probe descent speed compensation and vacuum suction cup negative pressure compensation, respectively; the mechanical impact vibration frequency parameters and test execution cycle state in the real-time control status data of the actuator are mapped to the physical damping attenuation function to extract the mechanical vibration ripple dissipation delay period and output the asynchronous image acquisition trigger timing.

[0035] In this implementation scheme, the comparator inside the control system reads the suction negative pressure feedback value and the probe pressing contact stroke feedback value from the real-time control status data of the actuator. It then retrieves the pre-stored flexible circuit board deformation force boundary and probe contact bearing pressure extreme value from the basic test control constraints. A digital subtractor performs a subtraction operation between the feedback value and the constraint boundary at the underlying physical dimensions, outputting the physical contact stress deviation difference in the corresponding coordinate space. The control system sends this physical contact stress deviation difference in parallel to the pneumatic control loop and the servo position control loop. In the pneumatic proportional valve control loop, a vacuum suction cup negative pressure compensation amount is generated based on proportional-derivative control logic to directly adjust the opening of the air path exhaust valve. In the servo drive control loop, the probe descent speed compensation amount is calculated. The calculation formula is: In the formula, This indicates the amount of compensation for the probe's descent speed; This represents the difference in physical contact stress deviation. Represents the equivalent stiffness constant of a mechanical structure; This indicates the probe's downward contact stroke feedback value; Indicates the stress boundary of the flexible circuit board under deformation; This represents the speed smoothing suppression weighting coefficient; This represents the servo drive's basic bias. The control system determines the speed smoothing suppression weighting coefficient. The process is as follows: The average torque feedback value of the probe servo motor is extracted from the first five standard no-load descent cycles. This average torque feedback value is divided by the preset rated torque constant of the servo motor, and the resulting dimensionless ratio is directly assigned to the speed smoothing suppression weight coefficient. The extracted average torque feedback values ​​are all directly derived from the closed local area network hardware operation logs of the local industrial control equipment. During the extraction process, the underlying communication gateway performs desensitization and isolation processing through a hardware encryption protocol, physically blocking external data network connection channels to establish an absolute local anti-leakage and anti-tampering risk mitigation mechanism. Subsequently, the control system maps the mechanical impact vibration frequency parameters and test execution cycle status from the real-time control status data of the actuator to the internally constructed physical damping attenuation function, extracts the physical time period required for the mechanical vibration ripple to dissipate completely within the glass substrate, and converts and outputs the asynchronous image acquisition trigger timing quantity. The calculation formula is: In the formula, This represents the timing quantity for asynchronous image acquisition. Indicates the number of periods of damped oscillation; This represents the frequency parameter of mechanical impact vibration. This represents the initial amplitude calibration constant for the impact. Indicates the permissible vibration amplitude limit for optical imaging; This indicates the test execution cycle status. The control system determines the permissible vibration amplitude limits for optical imaging. The process is as follows: During the factory initialization and calibration stage of the equipment, the image acquisition mechanism is controlled to continuously capture images of the calibration target on the test platform with gradually changing amplitude, extract the grayscale sharpness feature value of the target edge pixels, record the actual physical value of the underlying mechanical amplitude corresponding to the first drop of the grayscale sharpness feature value below the sharpness judgment baseline, and directly burn the actual physical value of the underlying mechanical amplitude into the non-volatile memory of the field programmable gate array as the fixed optical imaging allowable vibration amplitude limit.

[0036] Specifically, the process of controlling the image acquisition mechanism to capture the luminous image of the dot screen and extract the abnormal brightness area of ​​the dot screen based on the asynchronous image acquisition trigger timing quantity is as follows: Analyze the asynchronous image acquisition trigger timing quantity and generate a hardware trigger pulse signal with a corresponding delay period inside the programmable logic controller; send the hardware trigger pulse signal to the image acquisition mechanism to control the image acquisition mechanism to capture the luminous image of the dot screen at the node where the mechanical impact vibration dissipates; extract the pixel cluster with brightness change in the luminous image of the dot screen, transform and align the image pixel coordinate system where the brightness change pixel cluster is located to the mechanical physical coordinate system of the actuator, and output the abnormal brightness area of ​​the dot screen.

[0037] In this implementation scheme, the control system writes the asynchronous image acquisition trigger timing value into the internal hardware timer register of the programmable logic controller. When the underlying clock overflows and matches this timing value, it directly drives the high-speed input / output port to generate a level flip, producing a hardware trigger pulse signal with a corresponding delay period. This hardware trigger pulse signal is transmitted through the industrial fieldbus to the light source controller and camera trigger terminal of the image acquisition mechanism, forcing the image acquisition mechanism to open the global shutter at the physical node where the aftershock wave of the underlying mechanical stress has completely dissipated, capturing the dot-screen luminous image of the module under test. The visual detection algorithm inside the control system extracts connected pixel clusters with step abrupt changes in grayscale values ​​from the dot-screen luminous image, and then calls the hand-eye calibration matrix to perform spatial alignment calculations, outputting the physical coordinates of the dot-screen brightness abnormal area. The calculation formula is: In the formula, The output matrix represents the two-dimensional mechanical physical coordinates of the area with abnormal brightness on the screen; A affine matrix representing the rotation-scaling calibration between the mechanical system and the vision system; and These represent the horizontal and vertical centroid pixel extreme coordinates of the pixel cluster with abrupt brightness changes in the image coordinate system; Represents the absolute translation vector based on the machine's mechanical origin; This represents the radial distortion correction factor of the optical lens. The control system determines the radial distortion correction factor. The process is as follows: during the equipment initialization phase, the image acquisition mechanism is controlled to capture the image of the standard checkerboard calibration board, and the variance of the physical offset of the corner points radiating from the center of the calibration board to the edge is extracted. The reciprocal of this variance is directly assigned to the radial distortion correction coefficient. The above calibration process is completed in closed-loop calculation in the memory of the local industrial control computer that is completely disconnected from the network. It is strictly forbidden to write the original image log to the external storage medium, and a low-level data isolation mechanism to prevent leakage is established.

[0038] Specifically, when an abnormal brightness area of ​​the screen is extracted, the process of correcting the vacuum suction cup negative pressure compensation and probe descent speed compensation based on the real-time control status data of the actuator associated with the abnormal brightness area is as follows: Spatial interference overlap determination is performed between the mechanical physical coordinates of the abnormal brightness area and the vacuum suction cup array coordinates in the real-time control status data of the actuator to lock the target vacuum suction cup that causes local stress interference and the associated probe pressing contact stroke feedback value; based on the spatial distribution of the target vacuum suction cup and the probe pressing contact stroke feedback value, a stress release coefficient is generated for the local stress interference area; the stress release coefficient is integrated into the vacuum suction cup negative pressure compensation and probe descent speed compensation, and the corrected vacuum suction cup negative pressure compensation and probe descent speed compensation are output.

[0039] In this implementation scheme, the control system calculates the spatial Euclidean distance between the physical coordinates of the abnormal brightness area of ​​the output screen and the coordinates of the vacuum chuck array recorded in the programmable logic controller. When this distance is less than the physical radius limit of the chuck, the spatial interference overlap judgment logic is triggered, locking the chuck address corresponding to the physical area as the target vacuum chuck, and simultaneously freezing the probe pressing contact stroke feedback value associated in the servo dual-port memory at the current moment. The control system then calculates and generates the stress release coefficient for the local stress interference area based on the locked state parameters. The calculation formula is: In the formula, This represents the stress relief coefficient for the localized stress interference region; This represents the absolute spatial distance between the physical coordinates of the abnormal region and the center coordinates of the target vacuum suction cup; This represents the physical boundary radius constant of the vacuum chuck; This represents the equivalent constant of stress transmission within the panel substrate; This indicates the feedback value of the probe's downward contact stroke when locked; Indicates the maximum physical descent travel allowed for the probe servo axis; This represents the physical deformation relaxation damping weighting coefficient. The process by which the control system determines the physical deformation relaxation damping weighting coefficient is as follows: The stress attenuation curve logs of the same batch of flexible circuit boards from the initial material reliability test are retrieved from the enterprise's internal manufacturing execution system (MES). The integral dissipation area of ​​residual stress within the standard pressing cycle is calculated. The reference area is divided by this integral dissipation area, and the resulting dimensionless proportional value is directly assigned to the physical deformation relaxation damping weighting coefficient. When retrieving the MES logs, read-only permissions are used to send de-identification commands through a one-way data gateway to ensure that the control system does not pose a risk of tampering with production source data. The control system uses the calculated stress release coefficient... The original compensation amounts are nonlinearly attenuated and fused, and the results after attenuation and fusion are output as the corrected vacuum suction cup negative pressure compensation amount and probe descent speed compensation amount.

[0040] Specifically, the process by which the actuator performs the secondary stepped descent retest based on the corrected vacuum suction cup negative pressure compensation and probe descent speed compensation is as follows: The corrected vacuum suction cup negative pressure compensation is converted into an analog voltage signal and sent to the pneumatic proportional valve to control the vacuum suction cup array to perform a small negative pressure exhaust action to release residual mechanical stress; the corrected probe descent speed compensation is parsed into a multi-segment servo motion pulse sequence and sent to the probe servo driver; the probe servo driver is controlled to perform micro-lifting, deceleration and pressure holding actions in sequence according to the multi-segment servo motion pulse sequence to complete the secondary stepped descent retest.

[0041] In this implementation scheme, the analog-to-digital converter module of the control system directly maps the corrected vacuum suction cup negative pressure compensation amount into a standard analog voltage signal, and sends it to the control terminal of the pneumatic proportional valve via a hard-wired connection. The pneumatic proportional valve finely adjusts the opening of its internal valve core based on this voltage signal, controlling the air path branch containing the target vacuum suction cup array to perform a small negative pressure exhaust action, forcibly releasing the residual mechanical tensile stress at the bottom of the panel. Simultaneously, the motion control base plate analyzes the corrected probe descent speed compensation amount and generates a multi-segment servo motion pulse sequence. The pulse is then sent to the probe servo driver, and the pulse generation formula is as follows: In the formula, This represents the position setpoint of the servo motion pulse sequence output at time t; t represents the continuous time variable during the retest execution phase. This represents the constant frequency of the probe's base reset falling pulse. This indicates the amount of compensation for the corrected probe descent speed; Represents the time variable of the integral element; This represents the feedforward acceleration / deceleration time constant of the servo driver; This represents the reverse compensation pulse constant for the micro-lifting action. The control system determines the reverse compensation pulse constant. The process is as follows: During the initial homing action of the equipment, record the number of encoder feedback pulses required for the probe Z-axis lead screw to eliminate all mechanical backlash. This number of feedback pulses is then directly written into the non-volatile parameter block of the motion control base plate as the reverse compensation pulse constant. After receiving the pulse sequence, the servo driver drives the probe motor to first perform a micro-lifting action to disengage from the rigid contact based on the reverse compensation pulse constant. Then, it decelerates and presses down according to the exponentially decaying pulse frequency. Upon reaching the critical contact coordinate, it maintains its position in the dead zone and performs a critical point holding pressure action, ultimately completing the physical control process of a secondary stepped descent retest to eliminate mechanical interference. For example... Figure 3 As shown in the figure, the horizontal axis represents the flow time sequence t of the control system, and the vertical axis represents the physical amplitude and the servo pulse setpoint. The high-frequency decay curve in the figure represents the transient mechanical oscillation waveform generated at the moment of contact of the probe module, and its amplitude decays exponentially with damping over time. The vertical dashed line marks the asynchronous image acquisition trigger timing quantity calculated by the physical damping decay function, at which point the mechanical vibration has dissipated to within the allowable limit. The thick solid line descending in a stepped manner in the figure represents the servo motion pulse sequence. The controlled probe trajectory clearly demonstrates the entire dynamic closed-loop control process from the initial high-level downward pressure, the collision-induced oscillation, the micro-lifting and unloading, the waiting for the trigger timing quantity, to the final execution of secondary deceleration and pressure holding at the critical point.

[0042] Example 2; please refer to Figure 4 A liquid crystal display module testing process control system is provided for executing a liquid crystal display module testing process control method described in the embodiments. The system includes: a constraint construction module for extracting film layer stacking thickness parameters, driver chip bonding area coordinate parameters, and flexible circuit board pressing offset parameters of the liquid crystal display module under test, establishing basic test control constraints for the optical testing station; a state acquisition module for acquiring the vacuum suction cup array coordinates, adsorption negative pressure feedback values, probe pressing contact stroke feedback values, and test execution cycle states of the actuator in the optical testing station, simultaneously acquiring the mechanical impact vibration frequency parameters at the moment of probe contact, and constructing real-time control state data of the actuator; and a compensation calculation module for calculating the basic... The system calculates the vacuum suction cup negative pressure compensation, probe descent speed compensation, and asynchronous image acquisition trigger timing based on the basic test control constraints and the real-time control status data of the actuator. A closed-loop control module controls the image acquisition mechanism to capture the screen's luminous image and extract abnormal brightness areas based on the asynchronous image acquisition trigger timing. When an abnormal brightness area is extracted, the system corrects the vacuum suction cup negative pressure compensation and probe descent speed compensation based on the actuator's real-time control status data associated with the abnormal brightness area, driving the actuator to perform a secondary stepped descent retest based on the corrected values. If no abnormal brightness area is extracted, a sorting instruction is issued to the sorting mechanism.

[0043] In this implementation scheme, the constraint construction module, in the initial stage of system operation, links with the manufacturing execution system through the field communication interface to sequentially extract the film layer stacking thickness parameters, driver chip bonding area coordinate parameters, and flexible circuit board pressing offset parameters of the liquid crystal display module under test. This module imports the aforementioned pre-process parameters into a two-dimensional physical coordinate system for surface fitting and topology calculation, delineating the deformation force boundary of the flexible circuit board and the extreme values ​​of probe contact pressure. It then transforms the physical boundaries and extreme values ​​of pressure into the basic test control constraints for the optical test station's pressing action and writes them into the internal register of the programmable logic controller as the underlying limit reference.

[0044] The status acquisition module captures low-level data through periodic message polling and hardware interrupt interfaces when performing test actions at the optical test station. This module directly extracts the coordinates of the vacuum suction cup array in the controller register, acquires the negative pressure feedback value output from the pressure sensor channel in parallel, reads the probe pressure contact stroke feedback value output from the servo driver encoder, and converts it into the current test execution cycle state. Simultaneously, at the instant the probe touches the module surface and generates a state reversal signal, a high-frequency vibration sensor is triggered to acquire transient mechanical waveforms and convert them into mechanical impact vibration frequency parameters. Finally, the multi-dimensional status parameters are timestamped, aligned, and aggregated.

[0045] The compensation calculation module uses an internal comparator to perform a closed-loop deviation comparison between the adsorption negative pressure feedback value and the probe pressing contact stroke feedback value obtained by the state acquisition module and the basic test control constraints established by the constraint construction module. This module calculates the physical contact stress deviation difference using underlying mathematical formulas and converts it into servo drive control variables and pneumatic proportional valve control variables to generate probe descent speed compensation and vacuum suction cup negative pressure compensation. Simultaneously, it maps the mechanical impact vibration frequency parameters and test execution cycle state to the physical damping attenuation function, calculates the mechanical vibration ripple dissipation delay period, and outputs the asynchronous image acquisition trigger timing quantity.

[0046] The closed-loop control module generates a hardware trigger pulse signal based on the asynchronous image acquisition trigger timing output by the compensation calculation module. This signal controls the image acquisition mechanism to capture the luminous image of the dot screen. The module then extracts pixel clusters with brightness abrupt changes from the image and converts them into mechanical physical coordinates to output the abnormal brightness areas of the dot screen. When an abnormal area is detected, the module uses spatial interference overlap judgment to lock onto the target vacuum suction cup and the associated probe stroke. It generates a stress release coefficient, integrates it into the original compensation amount, and outputs the corrected compensation amount. Subsequently, the corrected vacuum suction cup negative pressure compensation amount is converted into an analog voltage signal and sent to the pneumatic proportional valve to release residual stress. The corrected probe descent speed compensation amount is then parsed into a servo motion pulse sequence to drive the probe to perform a secondary stepped descent retest. If no abnormal area is detected, a sorting instruction is directly issued to the sorting mechanism.

[0047] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A method for controlling the testing process of a liquid crystal display module, characterized in that, Includes the following steps: S1. Extract the film layer stacking thickness parameters, driver chip bonding area coordinate parameters, and flexible circuit board pressing offset parameters of the liquid crystal display module under test, and establish the basic test control constraints of the optical test station. S2. Collect the vacuum suction cup array coordinates, adsorption negative pressure feedback value, probe pressing contact stroke feedback value and test execution cycle status of the actuator in the optical test station, and simultaneously acquire the mechanical impact vibration frequency parameters at the moment of probe contact to construct the real-time control status data of the actuator. S3. Calculate the vacuum suction cup negative pressure compensation, probe descent speed compensation, and asynchronous image acquisition trigger timing based on the basic test control constraints and the real-time control status data of the actuator. S4. Based on the asynchronous image acquisition trigger timing quantity, control the image acquisition mechanism to capture the luminous image of the dot screen and extract the dot screen brightness abnormal area; when the dot screen brightness abnormal area is extracted, correct the vacuum suction cup negative pressure compensation amount and probe slow descent speed compensation amount according to the real-time control status data of the actuator associated with the dot screen brightness abnormal area, and drive the actuator to perform a secondary step slow descent retest action according to the corrected vacuum suction cup negative pressure compensation amount and probe slow descent speed compensation amount; when the dot screen brightness abnormal area is not extracted, issue a sorting instruction to the sorting mechanism.

2. The liquid crystal display module testing process control method according to claim 1, characterized in that: The specific process for extracting the film stacking thickness parameters, driver chip bonding area coordinate parameters, and flexible circuit board lamination offset parameters of the liquid crystal display module under test is as follows: Read the unique identifier code of the LCD module under test and retrieve the previous process production log bound in the manufacturing execution system; The film stacking thickness parameters were extracted from the lamination process log; Extract the coordinate parameters of the driver chip bonding area from the chip bonding process log; Extract the flexible circuit board lamination offset parameter from the visual alignment process log.

3. The liquid crystal display module testing process control method according to claim 1, characterized in that: The logical process for establishing the basic test control constraints of the optical test station is as follows: The film stack thickness parameters and the driver chip binding area coordinate parameters are mapped to a two-dimensional physical coordinate system to generate the in-plane thickness distribution topological features of the liquid crystal display module under test. By combining the in-plane thickness distribution topological characteristics and the flexible circuit board pressing offset parameters, the deformation force boundary of the flexible circuit board and the extreme value of probe contact pressure are defined. The deformation stress boundary of the flexible circuit board and the extreme value of probe contact pressure are converted into the basic test control constraints for the downward execution action of the optical test station.

4. The liquid crystal display module testing process control method according to claim 1, characterized in that: The specific process for acquiring the coordinates of the vacuum chuck array, the negative pressure feedback value, the probe pressing contact stroke feedback value, and the test execution cycle status of the actuator in the optical testing station is as follows: Send a status polling command to the programmable logic controller of the optical testing station to extract the coordinates of the vacuum chuck array in the control register; Collect the negative pressure feedback value of adsorption output from the air pressure sensor channel of the actuator; Extract the probe pressing contact stroke feedback value output by the encoder of the probe module servo driver; Read the clock cycle flow timing data inside the programmable logic controller and convert it into the output test execution tick state.

5. The liquid crystal display module testing process control method according to claim 1, characterized in that: The specific process of synchronously acquiring the mechanical impact vibration frequency parameters at the moment of probe contact and constructing the real-time control status data of the actuator is as follows: The state reversal signal generated when the feedback value of the probe's downward contact stroke reaches the physical contact critical point triggers the high-frequency vibration sensor to collect the transient mechanical waveform of the probe module. Extract the dominant frequency characteristics of transient mechanical waveforms and convert them to output mechanical shock vibration frequency parameters; The coordinates of the vacuum suction cup array, the negative pressure feedback value of adsorption, the feedback value of the probe pressing contact stroke, the test execution cycle status, and the mechanical impact vibration frequency parameters are timestamped and aggregated into multi-dimensional real-time control status data of the actuator.

6. The liquid crystal display module testing process control method according to claim 1, characterized in that: The specific process for calculating the vacuum suction cup negative pressure compensation, probe descent speed compensation, and asynchronous image acquisition trigger timing parameters based on the basic test control constraints and the real-time control status data of the actuator is as follows: The adsorption negative pressure feedback value and probe downward contact stroke feedback value in the real-time control status data of the actuator are compared with the flexible circuit board deformation force boundary and probe contact bearing extreme value in the basic test control constraints in a closed-loop deviation comparison, and the physical contact stress deviation difference is extracted. The physical contact stress deviation difference is converted into servo drive control variables and pneumatic proportional valve control variables, which are then used to generate probe descent speed compensation and vacuum suction cup negative pressure compensation, respectively. The mechanical shock vibration frequency parameters and test execution cycle status in the real-time control status data of the actuator are mapped to the physical damping attenuation function, the mechanical vibration ripple dissipation delay period is extracted, and the asynchronous image acquisition trigger timing quantity is output.

7. The liquid crystal display module testing process control method according to claim 1, characterized in that: The specific process of controlling the image acquisition mechanism to capture the luminous image of the dot screen and extract the abnormal brightness areas of the dot screen based on the asynchronous image acquisition trigger timing quantity is as follows: Analyze the asynchronous image acquisition trigger timing parameters and generate a hardware trigger pulse signal with the corresponding delay period inside the programmable logic controller; Send a hardware trigger pulse signal to the image acquisition mechanism to control the image acquisition mechanism to capture the luminous image of the dot screen at the point where the mechanical impact vibration dissipates; Extract pixel clusters with brightness abrupt changes from the dot-screen luminous image, transform and align the image pixel coordinate system of the pixel clusters with brightness abrupt changes to the mechanical physical coordinate system of the actuator, and output the dot-screen brightness abnormal area.

8. The liquid crystal display module testing process control method according to claim 1, characterized in that: When an area of ​​abnormal screen brightness is detected, the specific process for correcting the vacuum suction cup negative pressure compensation and probe descent speed compensation based on the real-time control status data of the actuator associated with the abnormal screen brightness area is as follows: The mechanical physical coordinates of the abnormal brightness area of ​​the screen are compared with the coordinates of the vacuum suction cup array in the real-time control status data of the actuator to determine the spatial interference overlap, and the target vacuum suction cup that causes local stress interference and the associated probe pressure contact stroke feedback value are locked. Based on the spatial distribution of the target vacuum suction cup and the feedback value of the probe's downward contact stroke, a stress relief coefficient is generated for the local stress interference region. The stress relief coefficient is integrated into the vacuum chuck negative pressure compensation and probe descent speed compensation, and the corrected vacuum chuck negative pressure compensation and probe descent speed compensation are output.

9. The liquid crystal display module testing process control method according to claim 1, characterized in that: The specific process by which the drive actuator performs the secondary stepped descent retest based on the corrected vacuum suction cup negative pressure compensation and probe descent speed compensation is as follows: The corrected vacuum suction cup negative pressure compensation amount is converted into an analog voltage signal and sent to the pneumatic proportional valve to control the vacuum suction cup array to perform a small negative pressure exhaust action to release residual mechanical stress. The corrected probe descent speed compensation is parsed into a multi-segment servo motion pulse sequence and sent to the probe servo driver. The control probe servo driver sequentially executes micro-lifting, deceleration and pressure holding actions according to a multi-segment servo motion pulse sequence to complete the secondary step-down retest action.

10. A liquid crystal display module testing process control system, used to execute the liquid crystal display module testing process control method according to any one of claims 1-9, characterized in that, include: The constraint construction module is used to extract the film layer stacking thickness parameters, driver chip bonding area coordinate parameters, and flexible circuit board pressing offset parameters of the liquid crystal display module under test, and to establish the basic test control constraints of the optical test station. The status acquisition module is used to acquire the coordinates of the vacuum suction cup array, the negative pressure feedback value, the probe pressing contact stroke feedback value, and the test execution cycle status of the actuator in the optical test station. It also acquires the mechanical impact vibration frequency parameters at the moment of probe contact and constructs real-time control status data of the actuator. The compensation calculation module is used to calculate the vacuum suction cup negative pressure compensation, probe descent speed compensation, and asynchronous image acquisition trigger timing based on the basic test control constraints and the real-time control status data of the actuator. The closed-loop control module is used to control the image acquisition mechanism to capture the luminous image of the dot screen and extract the abnormal brightness areas of the dot screen based on the asynchronous image acquisition trigger timing quantity. When an abnormal brightness area of ​​the dot screen is extracted, the vacuum suction cup negative pressure compensation amount and the probe slow descent speed compensation amount are corrected according to the real-time control status data of the actuator associated with the abnormal brightness area of ​​the dot screen, and the actuator is driven to perform a secondary step slow descent retest action according to the corrected vacuum suction cup negative pressure compensation amount and probe slow descent speed compensation amount. When no abnormal brightness area of ​​the dot screen is extracted, a sorting instruction is issued to the sorting mechanism.

Images