High-precision exposure method for a vertical exposure machine and related apparatus

Abstract

The application relates to the technical field of circuit board exposure, and provides a high-precision exposure method of a vertical exposure machine and related equipment, the method comprising the following steps: controlling an exposure mechanism of the vertical exposure machine to project a light beam to a photosensitive mechanism; controlling an image taking mechanism to take an image of a photochromic mark caused by the light beam on the photosensitive mechanism, so as to obtain a calibration image; identifying the deviation of the exposure mechanism according to the calibration image; and controlling the exposure mechanism to perform exposure according to the deviation. The photochromic mark is formed by the photosensitive mechanism to perform calibration, and the traditional circuit board target is not needed, so that multiple system errors such as target manufacturing errors, circuit board deformation errors, double-camera shooting errors and overturning errors are avoided, the double-side exposure light paths of the vertical exposure machine are accurately aligned, and the double-face pattern alignment precision is improved.

Description

Technical Field

[0001] This invention relates to the field of circuit board exposure technology, specifically to a high-precision exposure method and related equipment for a vertical exposure machine. Background Technology

[0002] In the double-sided exposure process of circuit boards, the alignment of the two sides is the critical line that determines whether the product can work properly. If the patterns on the two sides are not precisely aligned, the resulting board will be defective. Therefore, during the double-sided exposure process of the exposure mechanism on the workpiece, it is necessary to perform calibration / alignment operations on the exposure mechanism to ensure that the patterns on the two sides of the circuit board are aligned.

[0003] The traditional target alignment method involves: applying a dry film to the first side of the circuit board, exposing and developing it, and simultaneously forming the circuit and aligning the target with the board edge; flipping the circuit board using a flipping mechanism so that the side with the target faces the bottom of the equipment and re-fixing it to the exposure stage; the equipment uses a bottom camera to collect the actual coordinates of the first target, and a top camera to construct the second imaging coordinate system; the computer calculates the translation, rotation, scaling, and distortion deviations of the target relative to the standard position; the software performs corresponding geometric compensation on the second exposure pattern, and finally completes the alignment exposure of the second side.

[0004] However, traditional target alignment methods suffer from several systematic errors that are difficult to eliminate and calibrate, including but not limited to: Circuit board deformation error: The previous processes such as circuit board cutting, pressing, grinding, film application and drying will cause the overall shrinkage or stretching of the board material in batches. As a result, the first target formed has a fixed scaling deviation relative to the theoretical standard size.

[0005] Target manufacturing errors: The synchronous exposure and development of cross and circular alignment targets and circuits on the circuit board inevitably introduces manufacturing errors during the target manufacturing process.

[0006] The shooting errors of the bottom camera and the top camera: the bottom camera shoots the first target facing downwards, and the light needs to pass through multiple layers of media such as substrate and dry film; the top camera directly contacts the air to shoot the board surface. The two light paths pass through media with different thicknesses and refractive indices, and the refraction of light causes a fixed coordinate offset.

[0007] The flipping error caused by circuit board flipping: Traditional solutions require flipping the circuit board, and the flipping mechanism will cause a flipping positioning deviation.

[0008] Therefore, improving the alignment of patterns on both sides of the circuit board during exposure has become a pressing technical problem that needs to be solved. Summary of the Invention

[0009] To address the shortcomings of existing technologies, this application provides a high-precision exposure method for a vertical exposure machine, the technical solution of which is as follows: In a first aspect, embodiments of this application provide a high-precision exposure method for a vertical exposure machine, the method comprising: controlling the exposure mechanism of the vertical exposure machine to project a light beam onto a photosensitive mechanism; controlling the image acquisition mechanism to acquire an image of a photochromic mark on the photosensitive mechanism caused by the light beam, thereby obtaining a calibration image; identifying a deviation of the exposure mechanism based on the calibration image; and controlling the exposure mechanism to perform exposure based on the deviation.

[0010] Secondly, this application provides a vertical exposure machine, the vertical exposure machine comprising: at least one processor; and a memory communicatively connected to the at least one processor; wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform a high-precision exposure method of the vertical exposure machine as described in the first aspect.

[0011] Thirdly, this application provides a computer-readable storage medium storing an executable program that is executed by a processor to implement the high-precision exposure method of the vertical exposure machine as described in the first aspect.

[0012] Fourthly, this application provides a computer program product, which includes a computer program that, when executed by a processor, implements a high-precision exposure method for a vertical exposure machine as described in the first aspect.

[0013] One of the beneficial effects of this application is that calibration is performed by forming a photochromic mark through a photosensitive mechanism, without relying on a traditional circuit board target, thus avoiding multiple system errors such as target manufacturing error, circuit board deformation error, dual-camera shooting error, and flipping error, achieving precise alignment of the double-sided exposure optical path of the vertical exposure machine and improving the alignment accuracy of the double-sided pattern. Attached Figure Description

[0014] Figure 1 This is a flowchart illustrating a control method for a vertical exposure machine provided in an embodiment of this application.

[0015] Figure 2 This is a schematic diagram of a vertical exposure machine in the related art provided in the embodiments of this application.

[0016] Figure 3 This is a schematic flowchart of a high-precision exposure method for a vertical exposure machine provided in an embodiment of this application.

[0017] Figure 4 This is another schematic diagram of the high-precision exposure method of the vertical exposure machine provided in the embodiments of this application.

[0018] Figure 5This is a schematic diagram of the structure of a vertical exposure machine provided in an embodiment of this application.

[0019] Figure 6 This is a structural block diagram of a computer-readable storage medium provided in an embodiment of this application.

[0020] Figure 7 This is a schematic diagram of the structure of a double-frame assembly of a vertical exposure machine provided in an embodiment of this application.

[0021] Figure 8 This is a schematic diagram of the feeding mechanism of a vertical exposure machine provided in an embodiment of this application.

[0022] Figure 9 This is a schematic diagram of the structure of the air knife assembly provided in the embodiments of this application. Detailed Implementation

[0023] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0024] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0025] Please see Figure 1 , Figure 1 This is a flowchart illustrating the control method for the vertical exposure machine provided in an embodiment of this application. Figure 1 As shown, the control method 100 of the vertical exposure machine of this application includes steps 110 to 140.

[0026] Step 110: Control the robotic arm to adsorb the workpiece. After adsorption is completed, control the robotic arm to move the workpiece between the first frame and the second frame of the double frame assembly; wherein the first frame and the second frame are both in an upright state.

[0027] Please see Figure 2 ,like Figure 2 As shown, Figure 2 This is a schematic diagram of a vertical exposure machine in the related art provided in an embodiment of this application. For example... Figure 2As shown, vertical exposure machines in related technologies typically fix the workpiece in the through hole at the center of the overall frame, and then expose the workpiece on both sides.

[0028] However, because the flatness of the circuit board is inconsistent during exposure, it needs to be flattened. Figure 2 The circuit board in the structure is fixed inside the overall frame. Although some related technologies set a flattening mechanism on one side of the overall frame to flatten the circuit board in a certain direction, on the one hand, the space inside the frame is limited, and forcibly adding a flattening mechanism will make the equipment bulky. On the other hand, it is difficult to guarantee the flattening effect in the other direction if flattening is only done in one direction.

[0029] Therefore please see Figure 7 , Figure 7 This is a schematic diagram of the structure of a double-frame assembly of a vertical exposure machine provided in an embodiment of this application. For example... Figure 7 As shown, in this application, the integral frame is no longer used to fix the workpiece, but a separable double frame assembly is used. The double frame assembly includes an upright first frame 2 and a second frame 3.

[0030] Therefore, the flattening operation no longer relies on a flattening mechanism set at the edge of the through-hole in the frame. Instead, it uses the combination of two frames, with the flat glass of the other frame pressing the circuit board flat. This change from tension to pressure overcomes the problem that traditional flattening mechanisms can only apply tension to the circuit board from a single edge, which can easily lead to wrinkles or wavy deformation in the direction perpendicular to the tension direction, and the central area is difficult to flatten completely. This application uses the second frame as the active flattening component. Its complete and flat frame / glass cooperates with the first frame to apply uniform normal pressure to the entire surface of the circuit board, changing from "line / point force" to "surface force". This can effectively overcome problems such as circuit board warping and uneven residual stress, achieving high-precision flattening globally and significantly improving the pattern alignment accuracy and linewidth consistency of double-sided exposure.

[0031] Optionally, Figure 7 The double-frame assembly 10 includes a base 1, a first frame portion 2, a second frame portion 3, and an airflow injection mechanism 8. The base 1 serves as the mounting foundation for the entire double-frame assembly, supporting and securing the first frame portion 2 and the second frame portion 3. Both the first frame portion 2 and the second frame portion 3 are erected on the base 1 to fix the workpiece position and keep the workpiece upright. The first frame portion 2 and the second frame portion 3 can move closer together or further apart, so that when they are close together, the workpiece located between them is pressed together, and when they are far apart, the workpiece is released for loading and unloading.

[0032] Both the first frame portion 2 and the second frame portion 3 are provided with through holes 4, and flattening members 5 are installed in the through holes 4. The flattening members 5 are light-transmitting and provide a path for the exposure light to pass through. When the workpiece is pressed between the first frame portion 2 and the second frame portion 3, the flattening members 5 support and flatten the workpiece, while the exposure light emitted by the exposure assembly can pass through the light-transmitting flattening members 5 to expose the workpiece. The flattening members 5 are preferably high-transmittance glass sheets. The through holes 4 penetrate the first surface and the second surface of the first frame portion 2 and / or the second frame portion 3, and the flattening members 5 are embedded in the through holes 4, so that the exposure assemblies on both sides of the frame can expose the workpiece without obstruction.

[0033] Optionally, the double-frame assembly also includes a first drive mechanism 6 and a guide rail 7, with the second frame portion 3 disposed on the guide rail 7. The first drive mechanism 6 is used to drive the second frame portion 5 to move on the guide rail to move closer to or further away from the first frame portion 2.

[0034] Please refer to the following: Figure 8 , Figure 8 This is a schematic diagram of the feeding mechanism of a vertical exposure machine provided in an embodiment of this application. Figure 8 The system includes two robotic arms, namely a first robotic arm 12 and a second robotic arm 11. The workpiece 13 is adsorbed onto a flat suction cup on the second robotic arm 11. At this time, step 110 includes steps 111 to 113.

[0035] Step 111: Control the first robotic arm to grasp the workpiece and turn it into an upright position.

[0036] Step 112: Control the workpiece on the first robotic arm to dock with the flat suction cup erected on the second robotic arm, and transfer the workpiece to the flat suction cup.

[0037] Step 113: Control the planar suction cup on the second robotic arm to move the workpiece between the first and second frame portions of the double-frame assembly.

[0038] Since the gap between vertical double frames is usually quite narrow, the workpiece is fed in using the high-precision linear motion of the robotic arm in steps 111 to 113 above, avoiding the scratches that may be caused to the frame or plate surface by traditional push rod or conveyor belt methods.

[0039] Furthermore, once the workpiece is turned into an upright position by the first robotic arm, thin circuit boards (especially large-sized boards or flexible boards) are prone to drooping or bending under their own weight. The flat suction cup, however, has a large suction area that matches the size of the workpiece. Through evenly distributed negative pressure, it firmly holds the entire board surface flat on the reference plane, ensuring that the workpiece will not deform or fall when entering the narrow gap between the first and second frames, thus preventing scratches when passing through the narrow gap between the vertical double frames.

[0040] Optionally, by designing the motion path of the robotic arm, the risk of scratching can be further reduced. In this case, step 110 includes the following steps: after adsorption is completed, control the robotic arm to move the workpiece between the first frame and the second frame of the double frame assembly along a moving direction parallel to the double frame assembly.

[0041] At this time, step 113 includes: controlling the planar suction cup on the second robotic arm to move the workpiece between the first frame portion and the second frame portion of the double frame assembly in a movement direction parallel to the double frame assembly.

[0042] Step 120: Control the robotic arm to dock and fix the workpiece with the first frame.

[0043] Optionally, the robotic arm places the workpiece inside the first frame and activates the air knife assembly inside the first frame to fix the workpiece. At this time, step 120 includes the step of controlling the air knife assembly to blow air onto the workpiece. The force applied by the air knife assembly to the workpiece includes a component force perpendicular to the first frame.

[0044] Please refer to the following: Figure 7 and Figure 9 , Figure 9 This is a schematic diagram of the structure of the air knife assembly provided in the embodiments of this application. Figure 7 and Figure 9 The air knife assembly 8 applies an upward-sloping blowing force to the workpiece. This force can be decomposed into a first vertically upward component and a second component perpendicular to the first frame. By using the air knife assembly to blow air, it is not necessary to use mechanical structures to contact the circuit board for fixation, thus preventing damage such as friction to the circuit board during the fixation process.

[0045] Optionally, Figure 9 As shown, the air knife assembly 8 includes a housing 811, an air inlet connected to an external air supply device, an airflow channel located inside the first housing, and an air outlet 813.

[0046] Optionally, the air outlet 813 is located on the upper surface of the first housing 811 and communicates with the airflow channel, and the airflow of the air knife assembly 8 is ejected from the air outlet 813.

[0047] Optionally, the double frame assembly 10 also includes a support device 9, which is disposed on the bottom inner side of the first frame portion 2 and located above the air knife assembly 8. The support device 9 is used to support the bottom edge of the workpiece, limit the vertical position of the workpiece, prevent the workpiece from shifting upward under the action of airflow, and ensure the vertical alignment accuracy of the workpiece.

[0048] Specifically, the support device 9 includes a plurality of positioning pins 91, which are pins perpendicular to the surface of the first frame portion 2. The multiple positioning pins 91 are arranged at equal intervals along the length of the first frame portion 2. After the workpiece is placed, its bottom edge abuts against the positioning pins 91, achieving vertical reference positioning. The tips of the positioning pins are made of a wear-resistant, flexible material to avoid scratching the bottom edge of the workpiece and the plating.

[0049] Step 130: Control the second frame portion to move closer to the first frame portion and dock with and fix it to the first frame portion to flatten the workpiece.

[0050] Optionally, a sealing ring is provided on the first frame portion to surround the workpiece. The double frame assembly includes a lead screw motor. The second frame portion is connected to the nut of the lead screw motor. The lead screw motor drives the second frame portion to move closer to the first frame portion. After moving closer, pressure is applied to the sealing ring and the workpiece to complete the docking and fixing and flattening of the workpiece.

[0051] Step 140: Control the double-frame assembly to move to the exposure position, and control the exposure mechanisms on both sides to expose the workpiece on both sides.

[0052] Optionally, when the vertical exposure machine includes two double-frame components, the two double-frame components are controlled to move alternately to the exposure position, that is, the two double-frame components perform alternating exposure, and after one exposure is completed, the other is exposed, and so on.

[0053] Optionally, when the vertical exposure machine includes a double-frame assembly, the single double-frame assembly is controlled to cyclically move to the exposure position, that is, the single double-frame assembly is cyclically exposed.

[0054] Optionally, in this application, both the first frame and the second frame are provided with transparent glass, and the workpiece is sandwiched between the two transparent glass panes. During exposure, light passes through the transparent glass to expose the workpiece.

[0055] Therefore, this application needs to ensure the cleanliness of the glass surface to prevent dirt from causing exposure failure. In this case, the method of this application also includes steps 150 to 160.

[0056] Step 150: Control the cleaning mechanism on the robotic arm to clean the surface of the transparent glass in the first frame and the second frame.

[0057] Optionally, the robotic arm and the cleaning mechanism can be detachably connected. For example, the first robotic arm and the gripper for grasping the workpiece can be detachably installed. During cleaning, the gripper can be removed and then switched to the cleaning mechanism. The same applies to the second robotic arm.

[0058] Optionally, the gripping component and the cleaning mechanism on the robotic arm can work asynchronously without interfering with each other, for example, through a telescopic structure, a switching structure, or a special structural design.

[0059] Step 160: After cleaning is completed, perform a self-cleaning operation on the cleaning mechanism.

[0060] Optionally, the cleaning mechanism includes a cleaning roller assembly, in which case step 150 includes step 151: controlling the cleaning roller assembly on the robotic arm to move to the glass surface to be cleaned, driving the cleaning roller assembly to contact and roll with the glass surface to remove dirt from the glass surface.

[0061] Optionally, step 151 specifically includes: (1) Obtain the glass dimensions and plan a serpentine cleaning path.

[0062] Specifically, the surface parameters of the glass surface to be cleaned are acquired, including length and width values. Based on the effective working width that the cleaning roller assembly can cover laterally, the glass surface is divided into multiple continuous longitudinal cleaning strips. The width of each strip is less than or equal to the effective working width of the cleaning roller assembly, and a preset overlap width (5 to 10 mm) is set between adjacent strips to prevent uncleaned areas from appearing at the strip boundaries. The controller calculates the total number of lateral rotations based on the ratio of the glass width to the width of a single strip, and calculates the longitudinal travel length of the robotic arm within each strip based on the glass length. Simultaneously, a serpentine path is planned for the cleaning mechanism, starting from one corner of the glass, moving longitudinally to the end of the strip, stepping laterally to the adjacent strip, and then moving longitudinally in the opposite direction to the end of the strip. This path covers the entire surface area of ​​the glass.

[0063] (2) Move the cleaning roller assembly to the starting position on the glass surface and establish contact.

[0064] Specifically, the controller controls the movement of the robotic arm, moving the cleaning roller assembly mounted at the end of the robotic arm to a predetermined starting position on the glass surface, which is located at the beginning of the first row of strips on the glass. The robotic arm lowers the cleaning roller assembly, causing the outer circumference of each cleaning roller to adhere to the glass surface with a preset contact pressure (0.2 to 0.5 Newtons per square centimeter) under the action of an elastic floating mechanism. Simultaneously, the controller starts the first drive motor connected to the cleaning roller assembly, driving each cleaning roller to begin rotating in a preset direction.

[0065] Optionally, the upper row of cleaning rollers rotates in a first direction, and the two lower row of cleaning rollers rotates in a second direction opposite to the first direction. The two sets of cleaning rollers create a rubbing effect on the glass surface to enhance the ability to peel off and adsorb dirt.

[0066] (3) Walk longitudinally along the current strip and continuously absorb dirt.

[0067] The controller controls the robotic arm to move at a constant speed along the longitudinal direction of the current strip. The cleaning rollers rotate continuously during the movement and move synchronously with the robotic arm, adsorbing the dirt on the glass surface covered by the walking path onto the surface of each cleaning sleeve.

[0068] (4) Step laterally to the adjacent strip and reverse the walking direction.

[0069] After completing the longitudinal movement of the current strip, the robotic arm drives the cleaning roller group to move one strip width in the lateral direction to the starting position of the next adjacent strip. At the same time, the direction of the robotic arm's longitudinal movement is switched so that the robotic arm moves in the opposite longitudinal direction to the previous strip on the adjacent strip, thereby realizing serpentine reciprocating movement.

[0070] At the same time, the controller records the number of horizontal steps that have been completed and compares this number with the total number of horizontal wraps calculated in step one to determine whether the entire width of the glass has been covered.

[0071] (5) Repeat steps (3) and (4) until all strips are cleaned.

[0072] Once all strip cleaning is completed, the preset cleaning task is deemed complete, and subsequent steps 161 and 162 are executed.

[0073] Optionally, in steps (3) and (4), it is also determined whether an interruption condition is met. The interruption condition includes at least one of the following: The cumulative cleaned area is greater than or equal to the preset area threshold; The cumulative number of rows cleaned has reached the preset row count threshold; The torque sensor installed at any cleaning roller bearing housing detects an increase in the rotational torque of the cleaning roller that exceeds a preset torque increment threshold (indicating that a large amount of dirt has been adsorbed on the surface of the cleaning sleeve, resulting in a decrease in adsorption capacity).

[0074] After the interruption condition is met, the cleaning roller group leaves the glass surface and moves to the self-cleaning station to perform self-cleaning (the self-cleaning operation is the same as the self-cleaning operation in steps 161 to 162). After self-cleaning is completed, the cleaning roller group returns to the position where the current strip travel is interrupted and continues to perform the cleaning task of the current strip, thereby preventing dirt from accumulating on the cleaning roller group and affecting the cleaning effect.

[0075] Based on step 151, step 160 includes steps 161 to 162.

[0076] Step 161: After completing the preset cleaning task, control the cleaning roller group to leave the glass surface and move to the self-cleaning working position, so that the cleaning roller group comes into contact with the surface of the adhesive paper on the self-cleaning component.

[0077] Step 162: Drive the cleaning roller assembly to roll relative to the sticky paper, and take advantage of the fact that the sticky paper has a greater adhesive force than the cleaning roller has an adsorption force to transfer the dirt from the surface of the cleaning roller to the sticky paper.

[0078] Optionally, the cleaning roller assembly includes multiple cleaning rollers arranged in a rectangular array, with the axes of each cleaning roller parallel to each other and perpendicular to the forward direction of the robotic arm.

[0079] Optionally, the cleaning roller includes a cleaning sleeve fitted and fixed to the outer periphery of the roller core, made of porous sponge rubber or microfiber nonwoven fabric, which has adsorption and elasticity.

[0080] Optionally, the self-cleaning component includes a first transfer roller and a second transfer roller arranged in parallel and at intervals. Both are cylindrical roller structures, and their axial length is not less than the axial length of any cleaning roller in the cleaning roller group, so as to ensure that the working surface of the cleaning roller can be completely covered when they come into contact.

[0081] The first transfer roller acts as an unwinding roller, used to carry unused adhesive paper rolls; the second transfer roller acts as a rewinding roller, used to wind up used adhesive paper rolls that have absorbed dirt. The axes of the first and second transfer rollers are parallel to each other and located in the same horizontal plane, forming a tensioned paper surface working area between the two rollers. This working area is the contact position where the cleaning roller in the cleaning roller group performs self-cleaning.

[0082] Optionally, based on the structure of the self-cleaning component described above, step 161 includes the following steps: after completing the preset cleaning task, controlling the cleaning roller group to leave the glass surface and move to the self-cleaning working position, so that the cleaning roller group comes into contact with the working surface of the sticky paper segment tensioned between the first transfer roller and the second transfer roller.

[0083] Step 162 includes the following steps: driving at least one of the first transfer roller, the second transfer roller, and the cleaning roller to rotate, winding the used sticky paper segment with the dirt adhering to it onto the second transfer roller, while simultaneously pulling out an unused sticky paper segment of the corresponding length from the first transfer roller, unfolding it, and tensioning it in the working area between the first transfer roller and the second transfer roller to replace the paper segment with the transferred dirt, thus completing the self-cleaning cycle.

[0084] During the self-cleaning process described above, the cleaning roller assembly contacts the working area of ​​the paper surface tensioned between the first and second transfer rollers, rather than directly contacting the cylindrical surface of the first transfer roller. This is because the first transfer roller is wound with unused paper rolls, which have an arc-shaped surface and a relatively large diameter. If the cleaning roller is directly pressed against the surface of the paper roll, the pressure on the contact surface will be uneven, and it will hinder the smooth unwinding process, thus affecting the cleaning effect.

[0085] Alternatively, in the double-sided exposure process of circuit boards, the alignment of the two sides is the critical line that determines whether the product can work properly. If the patterns on the two sides are not precisely aligned, the resulting board will be a waste.

[0086] Therefore, to reduce alignment errors, this application also provides a high-precision exposure method using a vertical exposure machine, which can also be considered a refined process of step 140. Please refer to... Figure 3 , Figure 3 This is a schematic flowchart of a high-precision exposure method for a vertical exposure machine provided in an embodiment of this application. Figure 3 As shown, the high-precision exposure method 200 of the vertical exposure machine includes steps 210 to 240.

[0087] Step 210: Control the exposure mechanism of the vertical exposure machine to project a light beam onto the photosensitive mechanism.

[0088] Optionally, the photosensitive mechanism includes a photochromic material that undergoes a reversible color change under illumination, thereby enabling it to be captured by the imaging component.

[0089] Optionally, the photosensitive mechanism is disposed in the frame assembly that fixes the workpiece to be exposed, and moves synchronously with the workpiece to be exposed.

[0090] Optionally, the exposure mechanism includes multiple sets of exposure units, and each set of exposure units includes multiple exposure lenses.

[0091] Optionally, in this application, one side of the workpiece includes at least one set of exposure units, and the other side of the workpiece includes at least one set of exposure units. In this case, step 210 includes: controlling the exposure unit located on one side of the photosensitive mechanism to project a light beam onto the photosensitive mechanism, and then controlling the exposure unit located on the other side of the photosensitive mechanism to project a light beam onto the photosensitive mechanism; or, controlling the exposure unit located on one side of the photosensitive mechanism and the exposure unit located on the other side of the photosensitive mechanism to simultaneously project light beams onto the photosensitive mechanism.

[0092] That is, the exposure units on both sides can be exposed separately or simultaneously. This application does not limit the specific exposure method.

[0093] Optionally, in order to form a clear photochromic mark, it may be necessary to move the photosensitive mechanism or the exposure unit when different exposure units project light beams onto the photosensitive mechanism. Therefore, the photosensitive mechanism and / or the exposure unit can be movable.

[0094] Alternatively, the exposure unit can be moved in a vertical direction.

[0095] Optionally, the vertical exposure machine is equipped with a track, and the photosensitive mechanism can move along the track following the workpiece to be exposed.

[0096] Step 220: Control the imaging mechanism to capture an image of the photochromic mark on the photosensitive mechanism caused by the light beam, and obtain a calibration image.

[0097] Optionally, the imaging mechanism includes a CCD camera.

[0098] Optionally, the photochromic mark can be circular, square, cross-shaped, etc., and this application does not impose any restrictions.

[0099] Optionally, when the exposure mechanism projects the beam, the exposure mechanism needs to rise to a suitable position along the Z-axis (vertical direction) so that the focal plane coincides with the bearing surface of the photosensitive mechanism. Otherwise, the quality of the photochromic mark will not meet expectations. In order to prevent the exposure mechanism from shifting and causing the focal plane to shift, step 220 includes steps 221 to 225.

[0100] Step 221: Continuously acquire real-time image sequences of the photochromic marker.

[0101] Specifically, after the exposure mechanism forms a photochromic mark in the photosensitive mechanism, the imaging mechanism is triggered to enter a high-speed continuous acquisition mode to continuously image the photochromic mark and obtain a real-time image sequence ordered by time.

[0102] In one implementation, the imaging mechanism continuously captures images of the area where the photochromic sign is located at a preset acquisition frame rate. The preset acquisition frame rate is determined based on the recovery rate of the photochromic material and is typically set as the reciprocal of the time required for the photochromic sign to decay from a fully colored state to a state indistinguishable to the naked eye, multiplied by a preset multiple (for example, if the visible duration of the sign under standard operating conditions is approximately 2 seconds, the acquisition frame rate can be set to 10 to 30 frames per second) to ensure that a sufficient density of image samples can be captured throughout the entire lifespan of the sign.

[0103] As another implementation, the imaging mechanism can delay the acquisition by a preset time after detecting the photochromic mark formation signal (in order to avoid interference from residual stray light from the exposure light source), and then continuously acquire data until the apparent contrast of the mark drops below a preset minimum identifiable threshold, or until a preset maximum acquisition time is reached.

[0104] Step 222: Monitor the dissipation characteristic curve of the color / contrast of the photochromic label over time.

[0105] Based on the real-time image sequence obtained in step 221, image analysis processing is performed on the photochromic marker in each frame of the image to extract the color feature parameters or contrast feature parameters of the marker, and the dissipation feature curve of the marker is constructed accordingly.

[0106] Specifically, for each frame of the image, the average grayscale value or color channel value (such as the L channel value in the Lab color space) of the pixels in the target region (Region of Interest, ROI) where the photochromic marker is located is extracted. This value is compared with the background reference value of the same region before the marker is formed, and the apparent contrast value Ct of the marker at that frame time is calculated. The apparent contrast value Ct can be defined as: Ct = |Vt - V0| / V0, where Vt is the average grayscale value of the marker region in the current frame, and V0 is the average grayscale value of the background in the same region before the marker is formed.

[0107] By correlating each frame time t with the corresponding apparent contrast value Ct, a "contrast-time" dissipation characteristic curve of the photochromic label is generated. This curve reflects the process of the photochromic label transitioning from a saturated color state to a faded state.

[0108] As a preferred solution, to avoid the influence of ambient light fluctuations on the measurement results, a narrowband filter can be set in the optical path of the imaging mechanism to collect only the light intensity information within the wavelength range corresponding to the absorption peak of the color-changing state of the photochromic material, so as to improve the signal-to-noise ratio.

[0109] Step 223: Extract the marker fading rate and determine if there is focal plane deviation.

[0110] Extract the flag decay rate index from the dissipation characteristic curve generated in step 222. Specifically, the length of time during which the contrast in the dissipation characteristic curve decays from a preset initial contrast threshold (e.g., 80% of the highest contrast) to a preset termination contrast threshold (e.g., 20% of the highest contrast) can be calculated as the "effective duration" T_decay of the flag; or, the average slope k_decay = ΔCt / Δt of the dissipation characteristic curve in the initial decay stage can be calculated as the flag decay rate.

[0111] The extracted marker fading rate is compared with a preset attenuation threshold. The preset attenuation threshold can be determined through a prior calibration experiment, for example, by measuring and recording the standard dissipation characteristic parameters of the photochromic marker as a benchmark when the exposure lens is known to be at an ideal focal plane position.

[0112] If the fading rate of the mark exceeds the upper limit of the preset attenuation threshold (i.e., the fading speed of the mark is significantly faster than the reference), it is determined that there is a negative deviation between the current focal plane of the exposure lens corresponding to the mark and the normal distance between the photosensitive mechanism. That is, the focal plane of the lens is too close to the photosensitive mechanism, the power density of the projected light spot is too high, resulting in a shallow color change depth and faster apparent dissipation.

[0113] If the fading rate of the marker is lower than the preset attenuation threshold (i.e., the fading speed of the marker is significantly slower than the reference or the residual time is abnormally prolonged), then a positive deviation is determined to exist, that is, the focal plane of the lens is too far from the photosensitive mechanism, and the power density of the projected light spot is reduced, resulting in abnormal color change depth or insufficient color change.

[0114] 224: After determining that there is a focal plane deviation, calculate the deviation between the mark fading rate and the standard fading rate, and adjust the Z-axis position of the exposure lens according to the fading rate deviation.

[0115] Optionally, the fading rate deviation = mark fading rate - standard fading rate.

[0116] As one implementation method, a mapping table or fitting function between the fade rate deviation and the lens Z-axis offset can be established in advance through calibration experiments. For example, a linear or nonlinear mapping can be established between the fade rate deviation and the Z-axis offset. This mapping relationship is pre-stored in the controller's memory.

[0117] Optionally, the Z-axis offset is obtained by looking up a table based on the fade rate deviation, and the offset direction is determined based on the sign of the fade rate deviation. The Z-axis actuator of the exposure lens (such as a piezoelectric ceramic micro-displacement stage or a precision lead screw stepper motor) is then adjusted according to the calculated Z-axis offset and offset direction to complete a single focal plane compensation.

[0118] Step 225: Iterate until the flag fading rate falls into the preset normal range, and capture a calibration image.

[0119] After focal plane compensation is completed in step 224, the controller determines whether the iteration termination condition is met. If not, a new round of calibration verification loop is triggered.

[0120] Specifically, the exposure mechanism re-forms the photochromic mark at the same position or adjacent area on the photosensitive mechanism, and steps 221 to 224 are repeated sequentially. During the iterative process, the position after the previous compensation is used as the new starting point to continue the next round of compensation iterations until the termination condition is met or the preset maximum number of iterations is reached. If convergence is not achieved after reaching the maximum number of iterations, a warning message is issued, indicating that the exposure lens may have loose optical components or other hardware malfunctions, requiring manual inspection.

[0121] Through the closed-loop iteration of steps 221 to 225 above, the real-time verification and automatic compensation of the focal plane position of the exposure lens can be completed simultaneously in each alignment and calibration operation, eliminating the impact of defocusing caused by factors such as temperature drift and mechanical creep on exposure quality.

[0122] Step 230: Identify the deviation of the exposure mechanism based on the calibration image.

[0123] For example, a CCD camera captures a circular mark projected by an exposure mechanism, identifies the center coordinates of the circular mark as the coordinates of the corresponding exposure mechanism, and then compares the coordinates with preset coordinates to obtain the deviation.

[0124] Optionally, the deviation of the exposure mechanism includes the deviation of each group of exposure units.

[0125] In one possible scenario, when calculating the deviation, the deviation of the entire group of exposure units is calculated, that is, each exposure lens in the exposure unit is not individually calibrated. For example, each exposure lens in the entire group of exposure units is controlled to project a part of a complete pattern, thereby improving the calibration speed.

[0126] In another possible scenario, when calculating the deviation, the deviation of each exposure lens in the group is calibrated individually. For example, each exposure lens in the entire exposure unit is controlled to project a complete pattern, thereby improving the calibration accuracy.

[0127] Step 240: Control the exposure mechanism to perform exposure according to the deviation.

[0128] Optionally, the deviation can be eliminated by a software algorithm, in which case step 240 includes adjusting the exposure pattern of the exposure mechanism according to the deviation.

[0129] Optionally, the deviation can be eliminated by moving the position of the exposure mechanism, in which case step 240 includes: moving the exposure mechanism according to the deviation.

[0130] Optionally, in one embodiment, the deviation of each exposure lens within the exposure mechanism is calibrated; in this case, please refer to [reference needed]. Figure 4 , Figure 4 This is another schematic diagram of the high-precision exposure method for the vertical exposure machine provided in the embodiments of this application. For example... Figure 4 As shown, the high-precision exposure method 300 of the vertical exposure machine includes steps 301 to 308.

[0131] Step 301: Control each group of exposure units of the vertical exposure machine to project a light beam onto the photosensitive mechanism in sequence.

[0132] Optionally, the exposure units located on the same side of the workpiece to be exposed may project light beams sequentially first, and then the exposure units located on the other side of the photosensitive mechanism may project light beams sequentially.

[0133] For example, if there are four groups of exposure units, with two groups on each side, then the two groups on one side can project the light beam first, and then the two groups on the other side can project the light beam.

[0134] Optionally, during exposure, each exposure unit is raised vertically to the projection focal plane position, and the photosensitive glass is moved to the projection position corresponding to that exposure unit to ensure clear imaging.

[0135] Step 302: After projecting the light beam into each exposure unit, control the imaging mechanism to capture the photochromic mark on the photosensitive mechanism caused by the light beam, thereby obtaining the calibration image corresponding to each exposure unit.

[0136] Optionally, all exposure lenses in each exposure unit project a complete calibration pattern, allowing for subsequent calibration of each exposure lens.

[0137] Step 303: Sequentially identify each of the calibration images, and identify the coordinates of each photochromic marker in each calibration image to obtain multiple coordinates equal to the number of exposure lenses.

[0138] Optionally, the photochromic mark is a color-changing dot matrix or crosshair mark formed after the light beam is irradiated, and its center coordinates can be extracted by image binarization, centroid algorithm or template matching.

[0139] For example, if each exposure unit contains 8 exposure lenses, then 8 photochromic marker coordinates can be identified in each set of calibration images; a total of 32 coordinates are obtained from the four sets, each corresponding to 2 exposure lenses.

[0140] Step 304: Select one of the coordinates as the reference coordinate.

[0141] Optionally, the selection rules for the reference coordinates are not limited in this application, and in this embodiment, the exposure lenses on both sides use the same reference coordinates to achieve alignment of the patterns on both sides.

[0142] For example, the reference coordinates are selected based on the lens corresponding to the photochromic marker located at the center of the exposure area or near the geometric center of the photosensitive mechanism, in order to reduce the cumulative error of the overall correction.

[0143] For example, the reference coordinates are selected from the coordinates corresponding to the first exposure lens in the exposure unit where the first beam is projected.

[0144] Step 305: Calculate the coordinate difference between the remaining coordinates and the reference coordinates, as the corresponding deviation.

[0145] Optionally, the coordinate difference is the actual measurement deviation, that is, the coordinate difference value directly calculated from the current calibration image, which reflects the actual positional offset of each lens relative to the reference lens under the current device state.

[0146] Step 306: Adjust the exposure pattern of the corresponding exposure lens according to the deviation; and / or, move the corresponding exposure lens according to the deviation.

[0147] Optionally, adjusting the exposure pattern can be achieved by pixel-level translation, rotation, or scaling compensation of the exposure image; moving the exposure lens can be achieved by a motor driving the lens to physically displace in the X / Y / Z directions.

[0148] For example, if the deviation is (+2μm, -3μm), the exposure pattern of the corresponding lens can be shifted 2μm to the right and 3μm downwards, or the lens can be driven to move 2μm along the positive X-axis and 3μm along the negative Y-axis to achieve calibration alignment. In actual operation, one or a combination of these methods can be selected according to the hardware capabilities of the device.

[0149] In steps 301 to 306 above, the calibration mark is not a physical target, but a photochromic mark generated by the exposure unit directly projecting a beam onto the photosensitive mechanism during the current calibration. This eliminates the manufacturing and deformation errors introduced by the physical target and removes the target manufacturing error.

[0150] Furthermore, the calibration process no longer depends on the physical characteristics of the circuit board itself, so the expansion, contraction or positional shift of the circuit board will not affect the calibration results, thus eliminating circuit board deformation errors.

[0151] Furthermore, in traditional solutions, the bottom camera needs to pass through multiple layers of media such as the substrate and dry film to capture images, while the top camera only needs to pass through the air. The two light paths pass through media with different thicknesses and refractive indices, and the refraction of light causes a fixed coordinate shift. In the above solution, the light beam directly enters the photosensitive glass, and the CCD directly captures the light spot on the glass surface. The light path has no PCB board medium, and there is no point shift caused by refraction of multiple layers of materials.

[0152] Furthermore, traditional methods typically require exposing one side first, then flipping the workpiece 180° to expose the other side. Mechanical flipping mechanisms suffer from repeatability positioning accuracy errors and flipping axis misalignment, resulting in the front and back patterns not perfectly aligning. In the above steps, the circuit board remains fixed throughout the calibration process, eliminating the physical operation of exposing the front side first and then flipping it over to expose the back side, thus completely bypassing the flipping error caused by the flipping mechanism.

[0153] This allows for calibration by forming a photochromic mark through a photosensitive mechanism, eliminating the need for traditional circuit board targets and avoiding multiple system errors such as target manufacturing errors, circuit board deformation errors, dual-camera shooting errors, and flipping errors. This enables precise alignment of the exposure optical paths on both sides of the vertical exposure machine, improving the alignment accuracy of double-sided patterns.

[0154] Optionally, after step 240 or step 308, the method further includes: Step L1: Construct the calibration fingerprint of the exposure mechanism and store it in the historical deviation database.

[0155] After each calculation of the exposure mechanism deviation, a structured calibration fingerprint is constructed and stored in the historical deviation database.

[0156] Optionally, the deviation of the exposure mechanism may include either the overall deviation of each exposure unit or the deviation of each exposure lens. This application does not impose any limitation, but the subsequent process will be described using the deviation of the exposure mechanism including the deviation of each exposure lens as an example.

[0157] The calibration fingerprint includes the following fields: the timestamp of the current calibration, the number i of each exposure lens and its corresponding two-dimensional translation deviation value (ΔX_i, ΔY_i).

[0158] The calibration fingerprints are continuously appended to the historical deviation database in chronological order according to their timestamps. The historical deviation database is stored in the non-volatile memory of the vertical exposure machine control system and has a preset storage capacity limit. When the database reaches its storage capacity limit, a first-in, first-out (FIFO) strategy is used to overwrite the oldest historical record, ensuring that the database always retains calibration data from the most recent preset time window.

[0159] Step L2: Extract the calibration fingerprint history sequence of each exposure lens within the specified range from the historical deviation database.

[0160] When the total number of calibration fingerprints accumulated in the historical deviation database reaches a preset first threshold (e.g., no less than 100 records), or when the time span between the earliest and latest calibration fingerprints in the database reaches a preset second threshold (e.g., no less than 7 days), a health assessment process is triggered.

[0161] Each time the health assessment process is triggered, all calibration fingerprints within a specified range are extracted from the historical deviation database as the raw data set for this assessment. The specified range can be a time window, such as the time range covered by all current records in the database, or a preset time window of the most recent N days.

[0162] Based on the original dataset, for each exposure lens, a historical sequence of its two-dimensional translational deviation values ​​within the specified range is constructed.

[0163] Specifically, for the exposure lens numbered i, the X-axis translational deviation component ΔX_i and the Y-axis translational deviation component ΔY_i of the lens are extracted from each calibration fingerprint in the original dataset. These components are then arranged in ascending order according to the timestamps of each record, forming the X-axis translational deviation history sequence S_i_X and the Y-axis translational deviation history sequence S_i_Y of the lens. Each data point in each history sequence contains a timestamp and a deviation value, and the sequence length is equal to the number of records in the original dataset.

[0164] Step L3: Perform time-domain decomposition on the historical sequence of two-dimensional translation deviation values ​​for each lens to extract long-term trend components, periodic components, and residual components.

[0165] For each two-dimensional translation deviation value historical sequence constructed in step L2, a time-domain sequence decomposition algorithm is used to decompose it into three components: long-term trend component, periodic component, and residual component.

[0166] Specifically, taking the historical sequence S_i_X of the X-direction translation deviation of the exposure lens numbered i as an example, the sequence is first smoothed using a local weighted regression smoothing algorithm, and the long-term trend component T_i_X(t) reflecting the overall evolution direction of the deviation value within the specified time window is extracted, where t is time.

[0167] Subsequently, the long-term trend component T_i_X(t) is subtracted from the original sequence S_i_X to obtain the detrended residual sequence. Periodogram analysis or autocorrelation analysis is performed on the residual sequence to identify significant periodic patterns and extract the periodic component P_i_X(t). This periodic component reflects the amplitude and phase of the deviation value fluctuating regularly with a specific period (e.g., 24 hours, 7 days, or a period corresponding to the production cycle).

[0168] Finally, the periodic component P_i_X(t) is subtracted from the residual sequence, and the remaining part is the residual component R_i_X(t), which represents the random fluctuations that cannot be explained by long-term trends and periodic laws.

[0169] Using the same method, the above time-domain decomposition process is performed on the Y-direction translation deviation history sequence S_i_Y of this exposure lens, as well as the X-direction translation deviation history sequences and Y-direction translation deviation history sequences of all other exposure lenses, to obtain the long-term trend component, periodic component and residual component of each exposure lens in each translation dimension.

[0170] Step L4: Determine the health level of each exposure lens based on the long-term trend component.

[0171] On the basis that the long-term trend components of each exposure lens in the X direction and Y direction are obtained in step L3, anomaly drift pattern recognition is performed on the long-term trend components, and the health level of each exposure lens is determined accordingly.

[0172] As an embodiment, for each long-term trend component, the local drift rate at the end of the entire specified time window is calculated. The local drift rate can be obtained by performing linear fitting on the last M data points of the long-term trend component, and the slope of the linear fitting is the current drift rate of the lens in this translation dimension.

[0173] For example, the slope obtained by fitting the last M data points of T_i_X(t) is denoted as k_i_X, with the unit of deviation amount / day, representing the current drift rate of lens i in the X direction. Similarly, the current drift rate k_i_Y in the Y direction is obtained.

[0174] The calculated current drift rates in the X direction and Y direction are respectively compared with preset drift rate grading thresholds. The preset drift rate grading thresholds at least include an early warning threshold and a danger threshold, and the early warning threshold is smaller than the danger threshold.

[0175] For example, for the X-direction translation deviation, an early warning threshold K_warn_X and a danger threshold K_danger_X are preset, satisfying K_warn_X<K_danger_X; for the Y-direction translation deviation, an early warning threshold K_warn_Y and a danger threshold K_danger_Y are preset, satisfying K_warn_Y<K_danger_Y.

[0176] According to the comparison result, the health degree of the exposure lens is determined as one of the following levels: If the absolute values of the current drift rates of the lens in both the X direction and the Y direction are less than their corresponding early warning thresholds (i.e., |k_i_X|<K_warn_X and |k_i_Y|<K_warn_Y), the health degree of the lens is marked as "normal".

[0177] If the absolute value of the current drift rate of the lens in at least one of the X direction or the Y direction reaches or exceeds its corresponding early warning threshold, but the absolute values of the current drift rates in both directions do not reach the corresponding danger thresholds, the health degree of the lens is marked as "early warning".

[0178] If the absolute value of the current drift rate of the lens in any one of the X direction or the Y direction reaches or exceeds its corresponding danger threshold, the health degree of the lens is marked as "danger".

[0179] For exposure lenses marked as "warning" or "dangerous" in terms of health status, auxiliary diagnostic information is further extracted from the periodic and residual components obtained in step L3. For example, if the amplitude of the periodic component of the lens increases significantly and its fluctuation period matches the diurnal fluctuation period of the workshop ambient temperature, it is preliminarily determined that the lens drift is related to thermal deformation; if the variance of the residual component continues to increase, it is preliminarily determined that there are signs of increased loosening in the mechanical fixing mechanism of the lens. This auxiliary diagnostic information will be used as additional descriptive fields and associated with the lens health status assessment result.

[0180] Step L5: Generate differentiated maintenance instructions based on the health level and output them to the maintenance terminal.

[0181] Based on the health level of each exposure lens determined in step L4, the control system of the vertical exposure machine automatically generates differentiated maintenance instructions and outputs these instructions to the designated maintenance terminal via the communication network.

[0182] Optionally, for exposure lenses marked as "normal" in health status, no maintenance instructions are generated; instead, an assessment report is generated based on the results of this health status assessment and stored in the equipment operation log for future reference.

[0183] Optionally, for exposure lenses with a health rating marked as "Warning," a warning notification instruction is generated. This instruction includes: the lens number, health level, current drift rate values ​​in the X and Y directions (k_i_X, k_i_Y), and estimated remaining available days.

[0184] Optionally, for exposure lenses marked as "dangerous" in health status, a mandatory maintenance work order is generated. This work order includes: the lens number, health status level, current drift rate values ​​(k_i_X, k_i_Y) in the X and Y directions, a historical trend chart of the lens's complete deviation values ​​in the X and Y directions, and auxiliary diagnostic information extracted in step L4.

[0185] After maintenance personnel complete the inspection, adjustment, or replacement of the relevant exposure lens according to the maintenance instructions and send back a "maintenance completed" confirmation message through the maintenance terminal, a maintenance event marker is inserted into the historical deviation database for the maintained exposure lens. This allows the subsequent health assessment process to use the maintenance event marker as a dividing point when reading the historical sequence of the lens, and only use the newly accumulated data after the marker for trend analysis, thereby resetting the degradation trend baseline of the lens.

[0186] Through the continuous closed-loop operation of steps L1 to L5, the vertical exposure machine has the ability to self-sensitize, self-assess, and self-warn about the health of each exposure lens in its exposure mechanism. It can identify lenses with a degradation trend in advance and guide preventive maintenance before the deviation gradually accumulates and eventually leads to double-sided pattern misalignment. This significantly improves the long-term stability of equipment alignment accuracy and the continuity of production at the system level.

[0187] Please see Figure 5 , Figure 5 This is a schematic diagram of the structure of a vertical exposure machine provided in an embodiment of this application. For example... Figure 5 As shown, the vertical exposure machine 200 includes: one or more processors 210 and a memory 220. Figure 5 Take a processor 210 as an example.

[0188] In some implementations, the processor 210 and the memory 220 can be connected via a bus or other means. Figure 5 Taking the example of a connection between China and Israel via a bus.

[0189] In some embodiments, the processor 210 is configured to control the exposure mechanism of the vertical exposure machine to project a light beam onto the photosensitive mechanism; control the image acquisition mechanism to acquire an image of the photochromic mark on the photosensitive mechanism caused by the light beam, thereby obtaining a calibration image; identify the deviation of the exposure mechanism based on the calibration image; and control the exposure mechanism to perform exposure based on the deviation.

[0190] In some embodiments, memory 220 serves as a non-volatile computer-readable storage medium, used to store non-volatile software programs, non-volatile computer-executable programs, and modules, such as the program instructions / modules for the control method of the vertical exposure machine or the high-precision exposure method of the vertical exposure machine in the embodiments of this application. Processor 210 executes various functional applications and data processing of the vertical exposure machine by running the non-volatile software programs, instructions, and modules stored in memory 220, thereby implementing the high-precision exposure method of the vertical exposure machine described in the above method embodiments.

[0191] In some embodiments, memory 220 may include a program storage area and a data storage area, wherein the program storage area may store an operating system and application programs required for at least one function; and the data storage area may store data created based on the use of the vertical exposure machine, etc. Furthermore, memory 220 may include high-speed random access memory and may also include non-volatile memory, such as at least one disk storage device, flash memory device, or other non-volatile solid-state storage device. In some embodiments, memory 220 may optionally include memory remotely located relative to processor 210, and these remote memories may be connected to the controller via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0192] In some implementations, one or more modules are stored in memory 220. When executed by one or more processors 210, they perform the control method of the vertical exposure machine or the high-precision exposure method of the vertical exposure machine in any of the above method embodiments. For example, they perform the methods described above. Figure 1 Method steps 110 to 140, and / or Figure 3 Steps 210 to 240 of the method.

[0193] Please refer to Figure 6 , Figure 6 This is a structural block diagram of a computer-readable storage medium provided in an embodiment of this application. The computer-readable storage medium 300 stores program code 310, which can be called by a processor to execute the high-precision exposure method for the vertical exposure machine described in the above method embodiments.

[0194] The computer-readable storage medium 300 may be an electronic memory such as flash memory, EEPROM (Electrically Erasable Programmable Read-Only Memory), EPROM, hard disk, or ROM. Optionally, the computer-readable storage medium includes a non-volatile computer-readable medium. The computer-readable storage medium 300 has storage space for program code that performs any of the method steps of the control method described above. This program code can be read from or written to one or more computer program products. The program code may, for example, be compressed in a suitable form.

[0195] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A high-precision exposure method for a vertical exposure machine, characterized in that, The method includes: The exposure mechanism of the vertical exposure machine is controlled to project a light beam onto the photosensitive mechanism; The imaging mechanism is controlled to capture an image of the photochromic mark on the photosensitive mechanism caused by the light beam, thereby obtaining a calibration image; The deviation of the exposure mechanism is identified based on the calibration image; The exposure mechanism is controlled to perform exposure based on the deviation.

2. The method according to claim 1, characterized in that, The exposure mechanism includes multiple sets of exposure units, and each set of exposure units includes multiple exposure lenses.

3. The method according to claim 2, characterized in that, The plurality of exposure units are partially disposed on one side of the photosensitive mechanism and partially disposed on the other side of the photosensitive mechanism. The exposure mechanism controlling the vertical exposure machine projects a light beam onto the photosensitive mechanism, including: The exposure unit located on one side of the photosensitive mechanism is controlled to project a light beam onto the photosensitive mechanism, and then the exposure unit located on the other side of the photosensitive mechanism is controlled to project a light beam onto the photosensitive mechanism; or, The exposure unit located on one side of the photosensitive mechanism and the exposure unit located on the other side of the photosensitive mechanism simultaneously project light beams onto the photosensitive mechanism.

4. The method according to claim 2, characterized in that, The exposure mechanism that controls the vertical exposure machine to project a light beam onto the photosensitive mechanism includes: Each exposure unit of the vertical exposure machine sequentially projects a light beam onto the photosensitive mechanism.

5. The method according to claim 4, characterized in that, The controlled imaging mechanism captures an image of the photochromic mark on the photosensitive mechanism caused by the light beam, obtaining a calibration image, including: After the beam is projected into each exposure unit, the imaging mechanism is controlled to capture an image of the photochromic mark on the photosensitive mechanism caused by the beam, thereby obtaining a calibration image corresponding to each exposure unit.

6. The method according to claim 5, characterized in that, Each calibration image includes photochromic markers equal in number to the number of exposure lenses in the corresponding exposure unit. Identifying deviations in the exposure mechanism based on the calibration images includes: Each calibration image is identified sequentially, and the coordinates of each photochromic marker in each calibration image are identified to obtain multiple coordinates equal to the number of exposure lenses; Select one of the coordinates as the reference coordinate, calculate the deviation of the remaining coordinates from the reference coordinate, and thus obtain the deviation between the remaining lenses in the exposure mechanism and the lens corresponding to the reference coordinate.

7. The method according to claim 6, characterized in that, The calculation of the deviation between the remaining coordinates and the reference coordinates includes: Calculate the coordinate difference between each of the remaining coordinates and the reference coordinate, as the corresponding deviation.

8. The method according to claim 1, characterized in that, The step of controlling the exposure mechanism to perform exposure based on the deviation includes: Adjust the exposure pattern of the corresponding exposure lens according to the deviation; or, The corresponding exposure lens is moved according to the deviation.

9. The method according to any one of claims 1-8, characterized in that, The photosensitive mechanism is disposed in the frame assembly that fixes the workpiece to be exposed.

10. A vertical exposure machine, characterized in that, The vertical exposure machine includes: At least one processor; and, A memory communicatively connected to the at least one processor; wherein, The memory stores instructions that can be executed by the at least one processor to enable the at least one processor to perform a high-precision exposure method for a vertical exposure machine as described in any one of claims 1 to 9.

11. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores an executable program, which is executed by a processor to implement the high-precision exposure method of the vertical exposure machine as described in any one of claims 1 to 9.

12. A computer program product, characterized in that, The computer program product includes a computer program that, when executed by a processor, implements a high-precision exposure method for a vertical exposure machine as described in any one of claims 1 to 9.

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