Multi-chip burning seat with built-in flow channel heat dissipation

Abstract

The application is suitable for the technical field of chip burning seat, and provides a multi-chip burning seat with built-in flow channel heat dissipation, which comprises a bottom plate, a mounting plate, a guide shaft, a lifting platform and a push-positioning assembly. The burning seat further comprises a burning seat body assembly, a pressing and limiting assembly, a guide reset assembly, a push-pull assembly and a cooling liquid conveying mechanism. The burning seat body assembly comprises a plurality of burning boxes with built-in serpentine pipes. By pressing the handle of the push-positioning assembly, the burning seat body assembly can be pulled to the working position through the push-pull assembly, and the chips are pressed by the pressing and limiting assembly. The spring energy storage in the cooling liquid conveying mechanism is driven through the gear and rack. When the chips are pressed in place, the transmission is disconnected, the spring releases energy to drive the impeller, and the cooling liquid is pumped into the serpentine pipes of each burning box to circulate and flow, directly performing efficient heat dissipation on the chips. The mechanical linkage of chip clamping, positioning and efficient heat dissipation is realized, the structure is compact, the heat dissipation is uniform and timely, and the reliability and efficiency of multi-chip high-speed burning are significantly improved.

Description

Technical Field

[0001] This invention belongs to the field of chip programming socket technology, and particularly relates to a multi-chip programming socket with built-in heat dissipation channels. Background Technology

[0002] Currently, in the field of multi-chip parallel programming, commonly used programming sockets primarily focus on the reliability of electrical connections and the ease of chip mounting. Existing heat dissipation methods are relatively passive and inefficient in addressing the significant heat generated during programming, especially at high speeds. Common practices include: relying on the natural heat dissipation of the programming socket and the chip itself; installing external cooling fans for air cooling; or using thermally conductive silicone pads to conduct heat to the programming socket housing. Some high-end solutions attempt to incorporate metal heat sinks or simple fins at the bottom of the programming socket.

[0003] The existing devices have the following shortcomings:

[0004] Low heat dissipation efficiency: Natural heat dissipation and air cooling have limited heat dissipation capacity and are unable to cope with the instantaneous large heat generated by multiple chips working at high speed at the same time. This can easily lead to chip overheating, affecting programming stability or even damaging the chip.

[0005] Uneven heat dissipation: Traditional conduction or air cooling methods cannot ensure that multiple chips receive uniform cooling, which may cause some chips to overheat and become a bottleneck in programming yield.

[0006] Complex structure or external dependence: Externally enhanced heat dissipation devices (such as high-power fans or external water chillers) increase the overall size, complexity, and cost of the equipment. The operation of the heat dissipation system often requires independent control and fails to achieve intelligent linkage with the burning operation itself.

[0007] Separation of operation steps: The placement, clamping and activation of the heat dissipation system of the chip are usually performed in separate steps, with a low degree of automation, which affects the overall production efficiency. Summary of the Invention

[0008] This invention provides a multi-chip programming socket with built-in heat dissipation channels, aiming to solve the technical problems of low heat dissipation efficiency, poor uniformity, increased system complexity, and asynchronous heat dissipation operation and programming process in existing multi-chip programming sockets.

[0009] This invention is implemented as follows: a multi-chip programming socket with built-in heat dissipation channels includes a base plate, a mounting plate vertically fixed to the top of the base plate, two guide shafts symmetrically fixed to the mounting plate, a lifting platform slidably sleeved on the two guide shafts, and a toggle positioning assembly disposed on the mounting plate for driving the lifting platform to move up and down, and further includes:

[0010] The main body assembly of the programming socket is located above the base plate. The main body assembly of the programming socket includes multiple programming boxes. A heat-conducting plate is embedded inside the programming box. A connecting pipe is fixedly connected to both ends of the programming box. Two serpentine tubes are embedded inside the heat-conducting plate. A shunt pipe is fixedly connected to the inlet and outlet ports of the serpentine tubes. The shunt pipe is fixedly connected to the connecting pipe. The connecting pipe between two adjacent programming boxes is fixedly connected.

[0011] Multiple clamping and limiting components are provided on the lifting platform for clamping and limiting the chip to be programmed placed in the main body of the programming socket;

[0012] A guide reset assembly is disposed on the top of the base plate and is used to install the main body assembly of the programming socket and to constrain and guide the movement of the main body assembly of the programming socket.

[0013] Two push-pull components are symmetrically arranged between the lifting platform and the main body assembly of the burning socket. During the downward movement of the lifting platform, the main body assembly of the burning socket is driven to move below the clamping and limiting component.

[0014] A coolant delivery mechanism is disposed on the base plate and connected to the main body assembly of the programming socket. It is used to deliver coolant into the connecting tube during the pressing and limiting assembly pressing the chip to be programmed.

[0015] Preferably, the main body assembly of the programming socket further includes a base, on the top of which a substrate is mounted, and a plurality of programming cartridges are equidistantly mounted on the top of the substrate.

[0016] Preferably, the guide reset assembly includes four fixed blocks arranged in a rectangle on the top of the base plate, with a shaft fixedly connected between two aligned fixed blocks. The shaft slides through the base, and a reset spring is sleeved on the outside of the shaft. The two ends of the reset spring are respectively connected to the base and the fixed blocks.

[0017] Preferably, the coolant delivery mechanism includes:

[0018] The fluid delivery component installed on the side wall of the base is used to deliver coolant into one of the connecting pipes;

[0019] A transmission component is disposed on one side of the infusion component;

[0020] Guide components are disposed above the base plate;

[0021] The rack, which is fixedly connected to the top wall of the guide component, allows the transmission component to intermittently engage with the rack during the movement of the infusion component along with the main body assembly of the burning socket.

[0022] Two support components disposed on the base plate are used to support the guide component;

[0023] The positioning rod is fixed to the side wall of the base. As the positioning rod moves with the base, it can intermittently press the guide component.

[0024] Preferably, the infusion component includes an outer cover fixed to the side wall of the base, an impeller rotatably disposed inside the outer cover, a discharge pipe fixedly connected to the liquid outlet end of the side wall of the outer cover, the discharge pipe being fixedly connected to one of the connecting pipes, and an outer pipe fixedly connected to the liquid inlet end of the front side of the outer cover.

[0025] Preferably, the transmission component includes a housing, which is fixedly mounted on the side wall of the base by a bracket. A rotating rod is rotatably connected to the center of the housing, and a spring is connected between the rotating rod and the housing. The rotating rod rotatably passes through the outer wall of the outer tube and extends to the inner side of the outer cover, where it is coaxially fixed to the impeller.

[0026] The outer wall of the housing is provided with a small gear that is coaxially fixed to the rotating rod, and the outer wall of the housing is rotatably connected to a large gear that meshes with the small gear.

[0027] Preferably, the guide component includes an outer frame, an inner plate is provided on the inner side of the outer frame, a track is formed between the outer frame and the inner plate, the positioning rod is slidably sleeved on the inner side of the track, and a baffle is rotatably connected to the bottom of the inner plate slope via a rotating shaft;

[0028] The supporting component includes a U-shaped block fixed between the outer frame and the inner plate. An inner rod is fixedly connected to the bottom end of the U-shaped block. An outer cylinder is fixedly sleeved on the bottom plate. The inner rod slides into the interior of the outer cylinder. A connecting spring connects the inner rod and the outer cylinder.

[0029] Preferably, the clamping and limiting assembly includes a mounting plate installed on the lifting platform, a cylinder is fixedly connected to the bottom end of the mounting plate, a rod is slidably sleeved on the inner side of the cylinder, a pressure roller is hinged to the bottom end of the rod, a limiting ring is fixedly connected to the outer wall of both the cylinder and the rod, and a support spring is connected between the two limiting rings.

[0030] Preferably, the push-pull assembly includes a pressure rod fixed to the side wall of the lifting platform and a V-shaped rod hinged to the top of the base plate. One end of the V-shaped rod is hinged to a roller, and a sliding cavity is opened on one side of the V-shaped rod. A fixing rod is fixed to the side wall of the base, and a lever is fixed to the outer wall of the fixing rod. The lever is slidably sleeved inside the sliding cavity.

[0031] Preferably, the toggle positioning assembly includes a mounting bracket fixedly installed on the outer wall of the mounting plate, a handle is hinged to the mounting bracket, a connecting plate is symmetrically hinged to both sides of the handle, a lifting rod is hinged to the bottom of the two connecting plates, the bottom end of the lifting rod is fixedly connected to the lifting platform, a guide sleeve is fixedly connected to the bottom of the mounting bracket, and the lifting rod is slidably sleeved inside the guide sleeve.

[0032] Compared with related technologies, the multi-chip programming socket with built-in heat dissipation channel provided by the present invention has the following beneficial effects:

[0033] 1. This invention employs a linked structure comprising a toggle positioning component, a push-pull component, a coolant delivery mechanism, and a guide reset component. A single drive handle simultaneously moves the programming socket, clamps and positions the chip, and simultaneously, triggers an internal impeller via a gear rack and spring-loaded energy storage mechanism to pump coolant into the serpentine tube within the programming cartridge. This achieves fully mechanized linkage of chip loading, positioning, clamping, and efficient heat dissipation, simplifying operation. The cooling system's activation is strictly synchronized with the programming process, enabling "on-demand, real-time" active cooling, effectively solving the problem of concentrated overheating during high-speed multi-chip programming, and improving programming efficiency and reliability. The entire system requires no external power supply to drive the pump, resulting in a compact structure.

[0034] 2. The main component of the programming socket comprises multiple independent programming boxes, each containing a heat-conducting plate with a serpentine tube. These boxes are connected in series via connecting pipes to form a coolant circulation channel network. The coolant delivery mechanism activates when the chip is pressed together, driving the coolant to flow through all the serpentine tubes. This achieves parallel and uniform heat dissipation for multiple chips, preventing overheating of a single chip from affecting the overall programming yield. The built-in channel design highly integrates the heat dissipation system without occupying additional equipment space. The coolant directly contacts the heat-conducting plate, resulting in high heat exchange efficiency and rapid removal of chip heat, ensuring the chip junction temperature remains within a safe range. Attached Figure Description

[0035] Figure 1 This is a schematic diagram of the multi-chip programming socket with built-in heat dissipation channel of the present invention after the chip is pressed together;

[0036] Figure 2 This is a schematic diagram of the multi-chip programming socket with built-in heat dissipation channel of the present invention before chip clamping;

[0037] Figure 3 This is a schematic diagram of the structure of the toggle positioning component of the present invention;

[0038] Figure 4 This is a schematic diagram of the assembly structure of the programming socket main body component and the guide reset component of the present invention;

[0039] Figure 5 for Figure 1Enlarged structural diagram at point A in the middle;

[0040] Figure 6 This is a three-dimensional structural diagram of the clamping and limiting component of the present invention;

[0041] Figure 7 This is a partial cross-sectional view of the clamping and limiting component of the present invention;

[0042] Figure 8 This is a schematic diagram of the assembly structure of the coolant delivery mechanism of the present invention;

[0043] Figure 9 This is a schematic diagram of the guide component structure of the present invention;

[0044] Figure 10 This is a schematic diagram of the assembly structure of the transmission component and the infusion component of the present invention;

[0045] Figure 11 This is a partial cross-sectional view of the burning box of the present invention;

[0046] Figure 12 This is a cross-sectional view of the heat-conducting plate of the present invention.

[0047] In the picture:

[0048] 1. Base plate; 11. Mounting plate; 12. Guide shaft;

[0049] 2. Positioning assembly; 21. Mounting bracket; 22. Handle; 23. Connecting plate; 24. Guide sleeve; 25. Lifting rod;

[0050] 3. Lifting platform;

[0051] 4. Chip to be programmed;

[0052] 5. Main assembly of the programming socket; 51. Base; 52. Substrate; 53. Programming box; 531. Heat-conducting plate; 532. Connecting pipe; 533. Diverter pipe; 534. Serpentine pipe;

[0053] 6. Clamping and limiting assembly; 61. Insert cylinder; 62. Insert rod; 63. Limit ring; 64. Support spring; 65. Mounting plate; 66. Pressure roller;

[0054] 7. Guide reset assembly; 71. Fixing block; 72. Shaft; 73. Reset spring;

[0055] 8. Push-pull assembly; 81. Pressure rod; 82. V-shaped rod; 83. Slide cavity; 84. Roller; 85. Fixing rod; 86. Toggle lever;

[0056] 9. Coolant delivery mechanism; 91. Support component; 911. U-shaped block; 912. Inner rod; 913. Connecting spring; 914. Outer cylinder; 92. Guide component; 921. Outer frame; 922. Inner plate; 923. Baffle; 924. Track; 93. Rack; 94. Positioning rod; 95. Transmission component; 951. Housing; 952. Pinion; 953. Gear; 954. Bracket; 955. Spring; 956. Rotating rod; 96. Infusion component; 961. Outer cover; 962. Impeller; 963. Outer connecting pipe; 964. Discharge pipe. Detailed Implementation

[0057] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0058] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0059] Example

[0060] A preferred embodiment of the multi-chip programming socket with built-in heat dissipation channel provided by the present invention is as follows: Figures 1 to 12As shown: A multi-chip programming socket with built-in heat dissipation channels includes a base plate 1, a mounting plate 11 vertically fixed to the top of the base plate 1, two guide shafts 12 symmetrically fixed to the mounting plate 11, a lifting platform 3 slidably sleeved on the two guide shafts 12, and a toggle positioning component 2 disposed on the mounting plate 11 for driving the lifting platform 3 to rise and fall. It also includes a programming socket main body assembly 5, disposed above the base plate 1. The programming socket main body assembly 5 includes multiple programming boxes 53, each with a heat-conducting plate 531 embedded inside. Both ends of the programming box 53 are fixedly connected to a connecting pipe 532. The heat-conducting plate 531 has two serpentine tubes 534 embedded inside. The inlet and outlet ports of each serpentine tube 534 are fixedly connected to a shunt pipe 533, which is fixedly connected to the connecting pipe 532. Adjacent programming boxes... The connecting pipe 532 between the recording cartridges 53 is fixedly connected; multiple clamping and limiting components 6 are provided on the lifting platform 3 to clamp and limit the chip 4 to be programmed placed in the main body assembly 5 of the programming socket; the guide and reset component 7 is provided on the top of the base plate 1 to install the main body assembly 5 of the programming socket and to constrain and guide the movement of the main body assembly 5 of the programming socket; two push-pull components 8 are symmetrically arranged between the lifting platform 3 and the main body assembly 5 of the programming socket, and drive the main body assembly 5 of the programming socket to move below the clamping and limiting components 6 during the downward movement of the lifting platform 3; the coolant delivery mechanism 9 is provided on the base plate 1 and connected to the main body assembly 5 of the programming socket, and is used to deliver coolant into the connecting pipe 532 during the clamping and limiting components 6 clamping the chip 4 to be programmed.

[0061] The toggle positioning component 2 includes a mounting frame 21 fixedly installed on the outer wall of the mounting plate 11. A handle 22 is hinged to the mounting frame 21. A connecting plate 23 is symmetrically hinged to both sides of the handle 22. A lifting rod 25 is hinged to the bottom of the two connecting plates 23. The bottom end of the lifting rod 25 is fixedly connected to the lifting platform 3. A guide sleeve 24 is fixedly connected to the bottom of the mounting frame 21. The lifting rod 25 is slidably sleeved inside the guide sleeve 24.

[0062] The main component 5 of the burning socket also includes a base 51, a substrate 52 is mounted on the top of the base 51, and multiple burning boxes 53 are equidistantly mounted on the top of the substrate 52.

[0063] In this embodiment, the base 51 and the substrate 52 constitute the rigid support frame of the entire programming socket main assembly 5. Multiple programming cartridges 53 are equidistantly mounted on the substrate 52, ensuring that multiple chips 4 to be programmed can be precisely and parallelly positioned, creating conditions for parallel programming. This modular layout also facilitates the series arrangement of coolant pipelines, achieving uniform heat dissipation for all programming cartridges 53.

[0064] In a further preferred embodiment of the present invention, the guide reset assembly 7 includes four fixed blocks 71 arranged in a rectangle on the top of the base plate 1. A shaft 72 is fixedly connected between two aligned fixed blocks 71. The shaft 72 slides through the base 51. A reset spring 73 is sleeved on the outside of the shaft 72. The two ends of the reset spring 73 are respectively connected to the base 51 and the fixed blocks 71.

[0065] In this embodiment, the shaft 72 provides precise linear guidance for the forward and backward movement of the programming socket main body assembly 5, preventing it from deviating. The reset spring 73 stores elastic potential energy when the programming socket main body assembly 5 is pulled to the working position; when the external force (applied by the push-pull assembly 8) is removed, the elastic force can automatically and reliably push the programming socket main body assembly 5 back to the initial position, facilitating chip placement and removal, and realizing the automatic reset function of the mechanism.

[0066] In a further preferred embodiment of the present invention, the coolant delivery mechanism 9 includes a delivery component 96 mounted on the side wall of the base 51 for delivering coolant into one of the connecting pipes 532; a transmission component 95 disposed on one side of the delivery component 96; a guide component 92 disposed above the base plate 1; a rack 93 fixedly connected to the top wall of the guide component 92, wherein the transmission component 95 can intermittently engage with the rack 93 during the movement of the delivery component 96 with the main body assembly 5 of the programming socket; two support components 91 disposed on the base plate 1 for supporting the guide component 92; and a positioning rod 94 fixedly connected to the side wall of the base 51, wherein the positioning rod 94 can intermittently press the guide component 92 during the movement of the base 51.

[0067] Furthermore, the infusion component 96 includes an outer cover 961 fixedly attached to the side wall of the base 51. An impeller 962 is rotatably disposed inside the outer cover 961. A discharge pipe 964 is fixedly connected to the liquid outlet end of the side wall of the outer cover 961. The discharge pipe 964 is fixedly connected to one of the connecting pipes 532. An outer pipe 963 is fixedly connected to the liquid inlet end on the front side of the outer cover 961.

[0068] Furthermore, the transmission component 95 includes a housing 951, which is fixedly mounted on the side wall of the base 51 via a bracket 954. A rotating rod 956 is rotatably connected at the center of the housing 951. A spring 955 is connected between the rotating rod 956 and the housing 951. The rotating rod 956 rotatably passes through the outer wall of the outer tube 963 and extends to the inner side of the outer cover 961, where it is coaxially fixed to the impeller 962. A small gear 952 is provided on the outer wall of the housing 951 and is coaxially fixed to the rotating rod 956. A large gear 953 that meshes with the small gear 952 is rotatably connected to the outer wall of the housing 951.

[0069] Furthermore, the guide component 92 includes an outer frame 921, an inner plate 922 is provided on the inner side of the outer frame 921, a track 924 is formed between the outer frame 921 and the inner plate 922, a positioning rod 94 is slidably sleeved on the inner side of the track 924, and a baffle 923 is rotatably connected to the bottom of the slope of the inner plate 922 through a rotating shaft; the support component 91 includes a U-shaped block 911 fixed between the outer frame 921 and the inner plate 922, an inner rod 912 is fixedly connected to the bottom end of the U-shaped block 911, an outer cylinder 914 is fixedly sleeved on the bottom plate 1, the inner rod 912 slides into the interior of the outer cylinder 914, and a connecting spring 913 is connected between the inner rod 912 and the outer cylinder 914.

[0070] In this embodiment, the core innovation of the coolant delivery mechanism 9 lies in its mechanical linkage and energy storage design. The positioning rod 94 cooperates with the guide component 92, which has a specific track 924, to precisely control the lifting and lowering sequence of the rack 93. When the programming socket main body assembly 5 moves to the working position, the positioning rod 94 slides along the track 924. At a specific stage, the guide component 92 causes the rack 93 to mesh with the large gear 953, thereby converting the kinetic energy of the movement into the elastic potential energy of the spring 955 through gear transmission and storing it. When the programming socket is in place and the chip is pressed, the meshing disengages, and the stored energy is released to drive the pump. The advantage of this design is that it achieves strict mechanical synchronization between the heat dissipation system and the chip pressing action. Heat dissipation only automatically starts during programming, requiring no additional control circuitry or power supply, making it energy-efficient and reliable.

[0071] In this embodiment, the guide component 92 and the support component 91 together constitute a precise stroke and timing control mechanism. The specific shape of the track 924 (including ramps, crossbars, and vertical grooves) and its cooperation with the positioning rod 94 determine the lifting and lowering action of the rack 93. The baffle 923 acts as a one-way valve, allowing the positioning rod 94 to enter the ramp section of the track 924 to press down on the guide component 92, preventing it from accidentally sliding out from the bottom.

[0072] In a further preferred embodiment of the present invention, the pressing and limiting component 6 includes a mounting plate 65 installed on the lifting platform 3. A tube 61 is fixedly connected to the bottom end of the mounting plate 65. A rod 62 is slidably sleeved on the inner side of the tube 61. A pressure roller 66 is hinged to the bottom end of the rod 62. A limiting ring 63 is fixedly connected to the outer wall of both the tube 61 and the rod 62. A support spring 64 is connected between the two limiting rings 63.

[0073] In this embodiment, the clamping and limiting assembly 6 provides a flexible, adaptive clamping force. When the lifting platform 3 descends and the pressure roller 66 contacts the chip, the insertion rod 62 can continue to descend a certain distance relative to the insertion cylinder 61, compressing the support spring 64. The elastic force generated by the compression of the support spring 64 is the clamping force applied to the chip. The hinged design of the pressure roller 66 allows it to adapt to minor unevenness and relative slippage on the chip surface. It provides a stable, flexible clamping force, avoiding rigid pressure that could damage the chip pins; the spring buffer absorbs manufacturing and assembly errors, ensuring reliable electrical contact for each chip; the structure is simple and maintenance is convenient.

[0074] In a further preferred embodiment of the present invention, the push-pull assembly 8 includes a pressure rod 81 fixed to the side wall of the lifting platform 3 and a V-shaped rod 82 hinged to the top of the base plate 1. A roller 84 is hinged to one end of the V-shaped rod 82, and a sliding cavity 83 is provided on one side of the V-shaped rod 82. A fixing rod 85 is fixed to the side wall of the base 51, and a lever 86 is fixed to the outer wall of the fixing rod 85. The lever 86 is slidably sleeved inside the sliding cavity 83.

[0075] In this embodiment, the push-pull assembly 8 is a key linkage mechanism connecting the lifting motion and the horizontal movement. When the lifting platform 3 moves downward, the pressure rod 81 fixed to it presses down on the roller 84 at one end of the V-shaped rod 82, forcing the V-shaped rod 82 to rotate around its hinge point with the base plate 1. The rotational motion of the V-shaped rod 82 is converted into a horizontal pulling force on the lever 86 through the sliding cavity 83 on it, thereby pulling the entire programming socket main body assembly 5 horizontally. The sliding cavity 83 provides the necessary motion stroke compensation and force transmission direction conversion. The single vertical downward pressure is efficiently and reliably converted into the horizontal movement required by the programming socket, realizing the linkage of "pressing down and moving horizontally", simplifying the operation steps.

[0076] Working principle of this invention:

[0077] Initial state (chip placement position), such as Figure 2 As shown, the handle 22 of the positioning component 2 is in the vertical position, and the lifting platform 3 is at its highest point. The main body assembly 5 of the programming socket is positioned in front of the lifting platform 3 (i.e., away from the mounting plate 11) under the action of the reset spring 73 of the guide reset assembly 7. At this time, the operator can easily place multiple chips 4 to be programmed into each programming cassette 53.

[0078] After inserting the chip, pull handle 22 downwards to the horizontal position (e.g., Figure 1(As shown). The handle 22 pushes the lifting rod 25 down along the guide sleeve 24 through the two sets of connecting plates 23, thereby driving the lifting platform 3 to descend steadily along the guide shaft 12. When the lifting platform 3 descends, the pressure rod 81 on its side moves down synchronously, pressing down the roller 84 at one end of the V-shaped rod 82 in the push-pull assembly 8, causing the V-shaped rod 82 to rotate clockwise. The sliding cavity 83 on it drags the lever 86, which in turn pulls the base 51 of the entire programming socket main body assembly 5 along the shaft 72 to slide backward (towards the mounting plate 11) through the fixed rod 85, compressing the return spring 73.

[0079] When handle 22 reaches the horizontal position, the main body assembly 5 of the burning socket is pulled directly below the lifting platform 3. At this time, multiple pressing and limiting components 6 on the lifting platform 3 also descend synchronously. Under the elastic force of the support spring 64, the pressure rollers 66 at their bottom flexibly press the corresponding chip 4 to be burned in the burning box 53, completing precise positioning and electrical contact, and the burning operation can begin.

[0080] Heat dissipation system triggering and operation process (reference) Figure 8 , Figure 9 as well as Figure 10 ):

[0081] Energy Storage Stage: As the main body assembly 5 of the programming socket is pulled towards the working position, the coolant delivery mechanism 9 fixed to it moves synchronously. During the movement of the base 51, the large gear 953 on the transmission component 95 engages with the rack 93 fixed on the guide component 92, driving the small gear 952 and the rotating rod 956 to rotate, thereby winding the spring 955 to store energy. During this process, the positioning rod 94 slides at the bottom of the track 924 of the guide component 92. The positioning rod 94 can lift the baffle 923, causing it to flip upwards, allowing the positioning rod 94 to smoothly slide to the bottom right end of the track 924. At this time, the main body assembly 5 of the programming socket moves to the working position, and the pressure roller 66 at the bottom of the pressing and limiting component 6 presses the chip 4 to be programmed inside the programming cartridge 53, initiating the transcription process.

[0082] Simultaneously, when the main body assembly 5 of the programming socket reaches the working position and the chip is pressed to begin programming, the large gear 953 disengages from the rack 93. The energy stored in the spring 955 is released, driving the rotating rod 956 to rotate at high speed. The rotating rod 956 directly drives the impeller 962 inside the liquid delivery component 96 to rotate at high speed. The rotation of the impeller 962 creates a negative pressure inside the outer casing 961. The external connecting pipe 963 is connected via a hose to the outlet of an external coolant tank (not shown in the figure, containing deionized water or heat transfer oil or other cooling media) independent of this device. Under the action of negative pressure, coolant is drawn from the external coolant tank, enters the outer casing 961 through the external connecting pipe 963, and is then pumped into the cooling pipeline of the main body assembly 5 of the programming socket through the discharge pipe 964. The coolant flows sequentially through the connecting pipe 532 and the branch pipe 533, then enters the serpentine pipe 534 embedded inside the heat-conducting plate 531, and finally flows out from the connecting pipe 532 on the other side into the next programming cartridge 53, and is finally discharged through the connecting pipe 532 on the last programming cartridge 53 (it can flow back to the coolant tank or be collected separately). This cycle continuously removes the heat absorbed by the heat-conducting plate 531 from the chip being programmed, achieving efficient heat dissipation.

[0083] Reset and chip pick-and-place process:

[0084] After programming is complete, pull handle 22 upwards to the vertical position. The lifting platform 3 is raised, and the clamping and limiting assembly 6 rises accordingly to release the chip. At the same time, the pressure rod 81 moves upwards, releasing the pressure on the V-shaped rod 82. Under the elastic force of the reset spring 73 in the guide reset assembly 7, the base 51 drives the entire programming socket main body assembly 5 to slide forward along the shaft 72 back to the initial position. The coolant delivery mechanism 9 then resets.

[0085] During the reset process, the positioning rod 94 slides along the track 924, guiding the baffle 923. The positioning rod 94 first compresses the ramp section of the track 924, causing the guide component 92 to move downwards and compress the support component 91. Then, the positioning rod 94 slides along the upper horizontal track of the track 924. Its path design allows the guide component 92 to be briefly pressed down and then lifted, resulting in the rack 93 and the large gear 953 always being separated, preventing the spring 955 from being unnecessarily tightened during non-working periods. When the base 51 returns to the initial position at the front end, under the action of the connecting spring 913 on the support component 91, the inner rod 912 pushes the guide component 92 upwards, causing the positioning rod 94 to pass through the vertical groove on the left side of the track 924 and be located at the bottom of the left end of the track 924. The entire device is stabilized in the initial state, making it easy for the operator to remove the programmed chip and insert a new chip 4 to be programmed, preparing for the next working cycle.

[0086] It is worth noting that the circuits, electronic components, and modules involved in this invention are all existing technologies, which can be fully implemented by those skilled in the art, and need not be elaborated upon. The content protected by this invention does not involve improvements to the software and methods.

[0087] It should be understood that the disclosed apparatus can be implemented in other ways, as illustrated in the embodiments provided in this application. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of units described above is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or communication connections shown or discussed may be through some interfaces; the indirect coupling or communication connections between devices or units may be telecommunications or other forms.

[0088] The above embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit the scope of protection of the invention. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on these embodiments, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. Although the present invention has been described in detail with reference to the above embodiments, those skilled in the art can still combine, add, delete, or otherwise adjust the features of the various embodiments of the present invention according to the circumstances without conflict or creative effort, thereby obtaining different technical solutions that do not fundamentally depart from the concept of the present invention. These technical solutions also fall within the scope of protection of the present invention.

Claims

1. A multi-chip programming socket with built-in heat dissipation channels, comprising a base plate (1), a mounting plate (11) vertically fixed to the top of the base plate (1), two guide shafts (12) symmetrically fixed to the mounting plate (11), a lifting platform (3) slidably sleeved on the two guide shafts (12), and a toggle positioning component (2) disposed on the mounting plate (11) for driving the lifting platform (3) to rise and fall, characterized in that, Also includes: The main body assembly (5) of the programming socket is located above the base plate (1). The main body assembly (5) of the programming socket includes multiple programming boxes (53). A heat-conducting plate (531) is embedded inside the programming box (53). A connecting pipe (532) is fixedly connected to both ends of the programming box (53). Two serpentine tubes (534) are embedded inside the heat-conducting plate (531). A shunt pipe (533) is fixedly connected to the inlet and outlet ports of the serpentine tubes (534). The shunt pipe (533) is fixedly connected to the connecting pipe (532). The connecting pipe (532) between two adjacent programming boxes (53) is fixedly connected. Multiple clamping and limiting components (6) are provided on the lifting platform (3) for clamping and limiting the chip (4) to be burned in the main body component (5) of the burning socket; The guide reset component (7) is disposed on the top of the base plate (1) for installing the main body component (5) of the burner and for constraining and guiding the movement of the main body component (5); Two push-pull components (8) are symmetrically arranged between the lifting platform (3) and the main body assembly of the burning socket (5). During the downward movement of the lifting platform (3), the main body assembly of the burning socket (5) is driven to move to the lower part of the pressing and limiting component (6). Coolant delivery mechanism (9) is set on the base plate (1) and connected to the main body assembly (5) of the programming socket, and is used to deliver coolant into the connecting tube (532) during the process of the pressing and limiting assembly (6) pressing the chip (4) to be programmed.

2. The multi-chip programming socket with built-in heat dissipation channel as described in claim 1, characterized in that, The main body assembly (5) of the burning socket also includes a base (51), on which a substrate (52) is mounted, and multiple burning boxes (53) are equidistantly mounted on the top of the substrate (52).

3. A multi-chip programming socket with built-in heat dissipation channel as described in claim 2, characterized in that, The guide reset assembly (7) includes four rectangular fixed blocks (71) distributed on the top of the base plate (1). A shaft (72) is fixedly connected between two aligned fixed blocks (71). The shaft (72) slides through the base (51). A reset spring (73) is sleeved on the outside of the shaft (72). The two ends of the reset spring (73) are connected to the base (51) and the fixed blocks (71) respectively.

4. A multi-chip programming socket with built-in heat dissipation channel as described in claim 3, characterized in that, The coolant delivery mechanism (9) includes: The fluid delivery component (96) installed on the side wall of the base (51) is used to deliver coolant into one of the connecting pipes (532); A transmission component (95) is disposed on one side of the infusion component (96); Guide component (92) disposed above the base plate (1); The rack (93) fixedly connected to the top wall of the guide component (92) allows the transmission component (95) to intermittently engage with the rack (93) as the infusion component (96) moves with the main body assembly (5). Two support components (91) are provided on the base plate (1) for supporting the guide component (92); The positioning rod (94) fixed to the side wall of the base (51) can intermittently press the guide component (92) as the positioning rod (94) moves with the base (51).

5. A multi-chip programming socket with built-in heat dissipation channel as described in claim 4, characterized in that, The infusion component (96) includes an outer cover (961) fixedly attached to the side wall of the base (51), an impeller (962) rotatably disposed inside the outer cover (961), a discharge pipe (964) fixedly connected to the liquid outlet end of the side wall of the outer cover (961), the discharge pipe (964) being fixedly connected to one of the connecting pipes (532), and an outer pipe (963) fixedly connected to the liquid inlet end of the front side of the outer cover (961).

6. A multi-chip programming socket with built-in heat dissipation channel as described in claim 5, characterized in that, The transmission component (95) includes a housing (951), which is fixedly installed on the side wall of the base (51) via a bracket (954). A rotating rod (956) is rotatably connected at the center of the housing (951). A spring (955) is connected between the rotating rod (956) and the housing (951). The rotating rod (956) rotatably passes through the outer wall of the outer tube (963) and extends to the inner side of the outer cover (961) and is coaxially fixed to the impeller (962). The outer wall of the outer casing (951) is provided with a small gear (952) that is coaxially fixed to the rotating rod (956), and the outer wall of the outer casing (951) is rotatably connected with a large gear (953) that meshes with the small gear (952).

7. A multi-chip programming socket with built-in heat dissipation channel as described in claim 6, characterized in that, The guide component (92) includes an outer frame (921), an inner plate (922) is provided on the inner side of the outer frame (921), a track (924) is formed between the outer frame (921) and the inner plate (922), the positioning rod (94) is slidably sleeved on the inner side of the track (924), and a baffle (923) is rotatably connected to the bottom of the slope of the inner plate (922) through a rotating shaft. The support component (91) includes a U-shaped block (911) fixed between the outer frame (921) and the inner plate (922). An inner rod (912) is fixedly connected to the bottom end of the U-shaped block (911). An outer cylinder (914) is fixedly sleeved on the bottom plate (1). The inner rod (912) slides into the interior of the outer cylinder (914). A connecting spring (913) connects the inner rod (912) and the outer cylinder (914).

8. A multi-chip programming socket with built-in heat dissipation channel as described in claim 7, characterized in that, The clamping and limiting assembly (6) includes a mounting plate (65) installed on the lifting platform (3). A tube (61) is fixedly connected to the bottom end of the mounting plate (65). A rod (62) is slidably sleeved on the inner side of the tube (61). A pressure roller (66) is hinged to the bottom end of the rod (62). A limiting ring (63) is fixedly connected to the outer wall of both the tube (61) and the rod (62). A support spring (64) is connected between the two limiting rings (63).

9. A multi-chip programming socket with built-in heat dissipation channel as described in claim 8, characterized in that, The push-pull assembly (8) includes a pressure rod (81) fixed to the side wall of the lifting platform (3) and a V-shaped rod (82) hinged to the top of the base plate (1). A roller (84) is hinged to one end of the V-shaped rod (82). A sliding cavity (83) is opened on one side of the V-shaped rod (82). A fixing rod (85) is fixed to the side wall of the base (51). A lever (86) is fixed to the outer wall of the fixing rod (85). The lever (86) is slidably sleeved inside the sliding cavity (83).

10. A multi-chip programming socket with built-in heat dissipation channel as described in claim 9, characterized in that, The toggle positioning component (2) includes a mounting bracket (21) fixedly installed on the outer wall of the mounting plate (11). A handle (22) is hinged on the mounting bracket (21). A connecting plate (23) is symmetrically hinged on both sides of the handle (22). A lifting rod (25) is hinged to the bottom of the two connecting plates (23). The bottom end of the lifting rod (25) is fixedly connected to the lifting platform (3). A guide sleeve (24) is fixedly connected to the bottom of the mounting bracket (21). The lifting rod (25) is slidably sleeved inside the guide sleeve (24).

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