Chip-scale packaged light source assembly and method of making same

Abstract

The application discloses a chip-scale packaged light source assembly and a manufacturing method thereof, and relates to the technical field of CSP. The light source assembly comprises a light emitting chip, a first reflector, a second reflector and a packaging adhesive layer. The first reflector is provided with a containing window, the light emitting chip is located in the containing window, and the maximum height of the first reflector is smaller than the height of the light emitting chip. At least part of the second reflector is filled in the containing window and is combined with the first reflector to form a bottom reflector, and the second reflector covers the bottom of the light emitting chip provided with a positive electrode and a negative electrode. The packaging adhesive layer covers the bottom reflector and the light emitting chip. The first reflector and the second reflector are separately arranged, so that the first reflector can be manufactured separately, the consistency of the surface shape of the first reflector is improved, the consistency of the light emitting effect of the light source is improved, and the first reflector and the second reflector are combined to form a whole bottom reflector, so that the light emitting efficiency and uniformity are improved.

Description

Technical Field

[0001] This application relates to the technical field of CSP (Chip-Scale Package), specifically to a chip-scale packaged light source component and its manufacturing method. Background Technology

[0002] CSP (Chip Scale Package) light sources are an advanced LED packaging technology. Their core characteristic is that the packaged component is almost the same size as the internal light-emitting chip itself, allowing for extremely small LED chip packaging. This results in advantages such as good heat dissipation, high light density, and high reliability. To improve the luminous effect of CSP, some chip-scale packaged light sources have a full-layer reflective layer on the bottom. During manufacturing, multiple light-emitting chips are typically placed on a carrier board, and then adhesive is applied between the chips to form the full-layer reflective layer. Because the adhesive needs to fill the gaps between the light-emitting chips and the carrier board, as well as the gaps between adjacent chips, it flows around the chips, making it difficult to ensure the consistency of the surface shape of the reflective layer formed between adjacent chips. This affects the consistency of the light source's luminous effect. Summary of the Invention

[0003] This application provides a chip-level packaged light source component and its manufacturing method, which can solve the problem of consistency in the light emission effect of the light source.

[0004] According to one aspect of this application, one embodiment provides a chip-scale packaged light source component, comprising:

[0005] A light-emitting chip, the light-emitting chip including a positive electrode and a negative electrode located on the same side of the light-emitting chip;

[0006] A first reflector has a receiving window, the light-emitting chip is located inside the receiving window, and the light-emitting chip and the first reflector do not contact each other. The maximum height of the first reflector is less than the height of the light-emitting chip.

[0007] A second reflector, at least partially filling the receiving window and joined with the first reflector to form a bottom reflector, the second reflector covering the bottom of the light-emitting chip where the positive electrode and the negative electrode are located, with the bottom sides of the positive electrode and the negative electrode exposed outside the second reflector; and

[0008] An encapsulating adhesive layer is applied over the bottom reflector and the light-emitting chip.

[0009] In one embodiment, the top surface of the first reflector is a first reflective surface, which is an inclined surface or an arc-shaped surface; and / or, the top surface of the second reflector is a second reflective surface, which is an inclined surface or a plane parallel to the top surface of the light-emitting chip, and the top surface is the side close to the encapsulating adhesive layer.

[0010] In one embodiment, both the first and second reflective surfaces are inclined surfaces. The lowest point of both the first and second reflective surfaces is close to the light-emitting chip, while the highest point of both the first and second reflective surfaces is far from the light-emitting chip. Furthermore, the highest point of the second reflective surface is lower than the highest point of the first reflective surface.

[0011] In one embodiment, the lowest point of the second reflective surface is adjacent to the side of the light-emitting chip.

[0012] In one embodiment, the bottom surface of the second reflector is coplanar with the bottom surface of the first reflector; and / or, the bottom surface of the second reflector is coplanar with the bottom surfaces of the positive electrode and the negative electrode; the bottom surface is the side away from the encapsulating adhesive layer.

[0013] In one embodiment, the outer surface of the first reflector is coplanar with the outer surface of the corresponding side of the encapsulating adhesive layer, and the encapsulating adhesive layer contains phosphor.

[0014] According to another aspect of this application, one embodiment provides a method for manufacturing a chip-scale packaged light source component, comprising the following steps:

[0015] A carrier plate and a first reflector layer are provided. The first reflector layer is disposed on the carrier plate, and multiple receiving windows are arranged in an array on the first reflector layer.

[0016] A light-emitting chip is disposed in the receiving window, and the light-emitting chip and the first reflector layer are not in contact. The maximum height of the first reflector layer is less than the height of the light-emitting chip.

[0017] A second reflector is formed by filling the receiving window with reflective material. The second reflector is bonded to the first reflector layer to form a bottom reflective layer. The second reflector covers the bottom of the light-emitting chip where the positive electrode and the negative electrode are located.

[0018] An encapsulating adhesive layer is provided, which covers the bottom reflective layer and the light-emitting chip;

[0019] The carrier board is cut and peeled off to form a single chip-level packaged light source component.

[0020] In one embodiment, providing the first reflector layer includes:

[0021] The first reflector layer is formed by injection molding. The first reflector layer has an array of multiple first reflectors. The receiving window is disposed in the first reflector. The top surface of the first reflector is a slope.

[0022] The step of disposing the first reflector layer on the carrier plate includes:

[0023] Apply double-sided adhesive to the carrier plate;

[0024] The first reflector layer is attached to the double-sided adhesive;

[0025] The provision of the light-emitting chip in the accommodating window includes:

[0026] The light-emitting chip is placed in the receiving window, and the positive and negative electrodes of the light-emitting chip are attached to the double-sided adhesive.

[0027] In one embodiment, filling the receiving window with reflective material to form a second reflector includes:

[0028] The receiving window is filled with reflective material and a vacuum is drawn. Part of the reflective material is filled between the light-emitting chip and the carrier plate, and part of the reflective material surrounds the bottom periphery of the light-emitting chip and is bonded to the first reflector.

[0029] Heating and curing form a second reflector.

[0030] In one embodiment, setting the encapsulating adhesive layer includes:

[0031] A semi-cured encapsulating adhesive is prepared, wherein the encapsulating adhesive contains phosphor.

[0032] A hot-pressing process is used to press the semi-cured encapsulating adhesive onto the bottom reflective layer and the light-emitting chip to form an encapsulating adhesive layer.

[0033] The chip-level packaged light source assembly and its manufacturing method according to the above embodiments include a first reflector and a second reflector. A light-emitting chip is disposed in a receiving window of the first reflector, and the second reflector fills the receiving window and is bonded to the first reflector to form a bottom reflector. The second reflector covers the bottom of the light-emitting chip, where positive and negative electrodes are located. The first and second reflectors are separately disposed, allowing the first reflector to be fabricated independently, which facilitates shape control of the first reflector surface and improves the consistency of the light-emitting effect. Furthermore, the bonding of the first and second reflectors forms a complete bottom reflector layer, which helps improve luminous efficiency and uniformity. Attached Figure Description

[0034] Figure 1 This is a schematic diagram of a chip-scale packaged light source component according to one embodiment;

[0035] Figure 2 This is a schematic diagram of another structure of a chip-scale packaged light source component, as shown in one embodiment.

[0036] Figure 3 A flowchart illustrating a method for fabricating a chip-scale packaged light source component according to one embodiment;

[0037] Figure 4 This is a schematic diagram illustrating the fabrication steps of a chip-scale packaged light source component according to one embodiment.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1-First reflector; 101-First reflective surface; 102-Lowest point of the first reflective surface; 103-Highest point of the first reflective surface; 104-Accommodation window; 2-Second reflector; 201-Second reflective surface; 202-Lowest point of the second reflective surface; 203-Highest point of the second reflective surface; 3-Light-emitting chip; 301-Positive electrode; 302-Negative electrode; 303-Top surface of the light-emitting chip; 4-Encapsulating adhesive layer; 5-Carrier plate; 6-First reflector layer; 7-Encapsulating adhesive; 100-Light source assembly. Detailed Implementation

[0040] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0041] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0042] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0043] To improve the light emission effect of CSP (Chip-Scale Packaged Light Source), some chip-scale packaged light sources have a full-layer reflective layer on the bottom. During manufacturing, multiple light-emitting chips are usually placed on a carrier board first, and then adhesive is applied between the light-emitting chips to form a full-layer reflective layer. Because the adhesive needs to fill the gaps between the light-emitting chips and the carrier board, as well as the gaps between adjacent light-emitting chips, the adhesive has poor flow around the light-emitting chips, resulting in low controllability of the surface shape of the reflective layer. After molding, the surface shape of the reflective layer between adjacent light-emitting chips is less consistent, affecting the consistency of the light emission effect of the light source.

[0044] Based on this, this application provides a first reflector and a second reflector. The light-emitting chip is disposed in the receiving window of the first reflector, and the second reflector fills the receiving window and is joined with the first reflector to form a bottom reflector. The second reflector covers the bottom of the light-emitting chip, which has positive and negative electrodes. The first and second reflectors are separately disposed, so the first reflector can be fabricated separately before fixing the light-emitting chip. The molding of the first reflector is not affected by the light-emitting chip, which is beneficial for controlling the surface shape of the first reflector and improving the consistency of the light emission effect. Furthermore, the first and second reflectors are joined to form a whole-layer bottom reflector, which is beneficial for improving luminous efficiency and uniformity.

[0045] The following describes some embodiments of the chip-scale packaged light source component and its manufacturing method provided in this application, with reference to the accompanying drawings.

[0046] Please see Figure 1 , Figure 2 , Figure 4 This application provides a chip-level packaged light source component 100, including a light-emitting chip 3, a first reflector 1, a second reflector 2, an encapsulating adhesive layer 4, and other functional components as needed, which are described in detail below.

[0047] In this embodiment, the light-emitting chip 3 includes a positive electrode 301 and a negative electrode 302 located on the same side of the light-emitting chip 3. The first reflector 1 is provided with a receiving window 104, and the light-emitting chip 3 is located in the receiving window 104. The light-emitting chip 3 and the first reflector 1 do not contact each other, so as to form a gap between the first reflector 1 and the light-emitting chip 3. The maximum height h1 of the first reflector 1 is less than the height h2 of the light-emitting chip 3.

[0048] It is understood that the light-emitting chip 3 in this embodiment can be a flip chip, and the positive electrode 301 and negative electrode 302 of the flip chip are generally located at the bottom of the chip. In terms of size, the light-emitting chip 3 can be a regular light-emitting chip or a micro light-emitting chip, such as a Mini LED (Mini Light Emitting Diode). The first reflector 1 in this embodiment can be directly made of a reflective adhesive material. This embodiment does not impose specific limitations on the reflective adhesive material, as long as it can reflect light. This embodiment also does not impose limitations on the specific manufacturing method of the first reflector 1, such as injection molding, compression molding, stamping, etc. In some embodiments, the first reflector 1 may also include a non-reflective body and a reflective film covering the surface of the body, through which light is reflected. This embodiment does not impose limitations on the specific materials of the body and the reflective film. For example, the body can be a transparent adhesive material formed by injection molding, and the reflective film can be a layer of metal film sputtered / deposited. In this embodiment, the area of ​​the receiving window 104 is larger than the area of ​​the top surface 303 of the light-emitting chip, thereby preventing the light-emitting chip 3 and the first reflector 1 from contacting each other. A gap is left between the first reflector 1 and the light-emitting chip 3, which facilitates the subsequent filling of the second reflector 2 and also facilitates the operation of placing the light-emitting chip 3 in the receiving window 104. In this embodiment, the maximum height h1 of the first reflector 1 is less than the height h2 of the light-emitting chip 3, thereby allowing the light-emitting chip 3 to retain at least part of its side emission, which is beneficial to improving luminous efficiency and improving the emission angle of the light source. The height h2 of the light-emitting chip 3 is the distance between the top surface 303 of the light-emitting chip and the bottom surface of the electrode.

[0049] In this embodiment, at least a portion of the second reflector 2 fills the receiving window 104 and is bonded to the first reflector 1 to form a bottom reflector. The second reflector 2 covers the bottom of the light-emitting chip 3, which has a positive electrode 301 and a negative electrode 302, with the bottom sides of the positive electrode 301 and the negative electrode 302 exposed outside the second reflector 2. An encapsulating adhesive layer 4 covers the bottom reflector and the light-emitting chip 3.

[0050] In some embodiments, the second reflector 2 can be completely located within the receiving window 104, meaning the edge of the first reflector 1 can be joined to the sidewall of the receiving window 104; or the second reflector 2 can be partially located within the receiving window 104 and partially located on the outer periphery of the receiving window 104, joined to the surface of the first reflector 1. The bottom reflector formed after joining is a single-layer structure, which helps to ensure a good reflection effect. This embodiment does not impose specific limitations on the manufacturing method of the second reflector 2; it can be filled into the receiving window 104 to cover the bottom of the light-emitting chip 3. For example, a dispensing process can be used. The size and structure of the second reflector 2 can be achieved by controlling the dispensing position, dispensing amount, and other dispensing process parameters. The bottom sides of the positive electrode 301 and the negative electrode 302 are exposed on the second reflector 2 for electrical connection between the light-emitting chip 3 and the external circuit. In this embodiment, the encapsulating adhesive layer 4 can be made of transparent encapsulating adhesive material. The encapsulating adhesive layer 4 covers the bottom reflector and the light-emitting chip 3, protecting the light-emitting chip 3 and extending its service life.

[0051] The chip-level packaged light source assembly 100 provided in this embodiment includes a first reflector 1 and a second reflector 2. A light-emitting chip 3 is disposed in a receiving window 104 of the first reflector 1. The second reflector 2 fills the receiving window 104 and is joined with the first reflector 1 to form a bottom reflector. The second reflector 2 covers the bottom of the light-emitting chip 3, which has a positive electrode 301 and a negative electrode 302. The first reflector 1 and the second reflector 2 are separately disposed, allowing the first reflector 1 to be fabricated separately first. This facilitates control over the surface shape of the first reflector 1, improves the consistency of the light-emitting effect, and the joining of the first reflector 1 and the second reflector 2 forms a complete bottom reflector, which helps improve luminous efficiency and uniformity.

[0052] In one embodiment, the top surface of the first reflector 1 is a first reflective surface 101, which can be an inclined or curved surface. An inclined or curved surface of the first reflective surface 101 improves the reflection effect and increases light extraction efficiency. In some embodiments, the first reflective surface 101 can also be any combination of an inclined surface, a curved surface, or a horizontal surface. Furthermore, the top surface of the second reflector 2 is a second reflective surface 201, which can be an inclined surface or a plane parallel to the top surface 303 of the light-emitting chip, with the top surface being the side closest to the encapsulating adhesive layer 4. The second reflective surface 201 achieves a reflection effect at the location of the receiving window 104, which helps improve light extraction efficiency. In some application scenarios, depending on the required light extraction angle, the first reflective surface 101 can also be a plane parallel to the top surface 303 of the light-emitting chip, and the second reflective surface 201 can also be a curved surface or a surface of other shapes.

[0053] In one implementation, such as Figure 1As shown, both the first reflective surface 101 and the second reflective surface 201 can be inclined surfaces. The lowest point 102 of the first reflective surface and the lowest point 202 of the second reflective surface are close to the light-emitting chip 3, while the highest point 103 of the first reflective surface and the highest point 203 of the second reflective surface are far away from the light-emitting chip 3. That is, the first reflective surface 101 and the second reflective surface 201 have a structure that gradually rises in the direction away from the light-emitting chip 3. The highest point 203 of the second reflective surface is connected to the first reflective surface 101, and the highest point 203 of the second reflective surface is lower than the highest point 103 of the first reflective surface. Since both the first reflective surface 101 and the second reflective surface 201 are inclined surfaces, it is beneficial to have a relatively smooth transition connection between the first reflective surface 101 and the second reflective surface 201. Furthermore, the top surface of the bottom reflector is generally inclined, which is beneficial to improving the light extraction efficiency. In one embodiment, the lowest point 202 of the second reflective surface is connected to the side of the light-emitting chip 3, that is, the second reflector 2 is thicker, which can limit the position of the light-emitting chip 3, which is beneficial to improve the stability of the light-emitting chip 3 and avoid the displacement of the light-emitting chip 3 when the encapsulation adhesive layer 4 is covered later.

[0054] In some implementations, such as Figure 2 As shown, both the first reflecting surface 101 and the second reflecting surface 201 can be planar. Planar surfaces are simple to manufacture, which helps to simplify the manufacturing process.

[0055] In one implementation, such as Figure 2 As shown, the highest point 103 of the first reflective surface is lower than half the height of the light-emitting chip 3. At least half of the side surface of the light-emitting chip 3 is not blocked, preserving sufficient side light emission, which is beneficial to improving light extraction efficiency. In some application scenarios, the highest point 103 of the first reflective surface can also be greater than or equal to half the height of the light-emitting chip 3, ensuring that the highest point 103 of the first reflective surface is lower than the top surface 303 of the light-emitting chip.

[0056] In one embodiment, such as Figure 1 , Figure 2 As shown, the bottom surface of the second reflector 2 is coplanar with the bottom surface of the first reflector 1; and / or, the bottom surface of the second reflector 2 is coplanar with the bottom surfaces of the positive electrode 301 and the negative electrode 302; the bottom surface is the side away from the encapsulating adhesive layer 4. The coplanarity of the bottom surface of the second reflector 2 with the bottom surface of the first reflector 1, and the coplanarity of the bottom surface of the second reflector 2 with the bottom surfaces of the positive electrode 301 and the negative electrode 302, facilitates the subsequent assembly of the light source assembly 100 onto other components, and after assembly, it is less likely to have gaps due to steps. In this embodiment, coplanarity means being located on the same plane. In some application scenarios, due to specific needs, the bottom surface of the second reflector 2 may not be coplanar with the bottom surface of the first reflector 1, and the bottom surface of the second reflector 2 may not be coplanar with the bottom surfaces of the positive electrode 301 and the negative electrode 302.

[0057] In one embodiment, such as Figure 1 , Figure 2 As shown, the outer surface of the first reflector 1 is coplanar with the corresponding outer surface of the encapsulating layer 4, and the encapsulating layer 4 contains phosphor. The coplanarity of the outer surface of the first reflector 1 with the corresponding outer surface of the encapsulating layer 4 facilitates fabrication; it can be cut along the cutting plane during fabrication. The presence of phosphor in the encapsulating layer 4 simplifies fabrication, eliminating the need for an additional phosphor layer structure. The encapsulating layer 4 covers the bottom reflector and the light-emitting chip 3, providing good phosphor coverage and helping to prevent blue light leakage. In some applications, when a specific color light source is required, phosphor may not need to be mixed into the encapsulating layer 4, such as in blue light sources.

[0058] The chip-level packaged light source assembly 100 provided in the above embodiment includes a first reflector 1 and a second reflector 2. A light-emitting chip 3 is disposed in a receiving window 104 of the first reflector 1. The second reflector 2 fills the receiving window 104 and is joined with the first reflector 1 to form a bottom reflector. The second reflector 2 covers the bottom of the light-emitting chip 3, which has a positive electrode 301 and a negative electrode 302. The first reflector 1 and the second reflector 2 are separately disposed, allowing the first reflector 1 to be fabricated separately first. This facilitates shape control of the surface of the first reflector 1, improves the consistency of the light-emitting effect, and the joining of the first reflector 1 and the second reflector 2 forms a complete bottom reflector, which helps improve luminous efficiency and uniformity.

[0059] Please see Figure 3 , Figure 4 This application also provides a method for manufacturing a chip-scale packaged light source component 100, including the following steps:

[0060] S1: Provide a carrier plate and a first reflector layer, and place the first reflector layer on the carrier plate.

[0061] In this embodiment, a plurality of receiving windows 104 are arranged in an array on the first reflector layer 6. The outer periphery of each receiving window 104 is the first reflector 1 described in the above embodiment. After the cutting step in the manufacturing process is completed, the first reflector layer 6 can be divided into a plurality of first reflectors 1. The receiving windows 104 can be distributed in a matrix, and the area of ​​the receiving windows 104 can be larger than the area of ​​the top surface 303 of the light-emitting chip. In this embodiment, there is no specific limitation on the material of the carrier plate 5, as long as it has a certain strength and can play a supporting role. Forming the first reflector layer 6 first is beneficial to the shape control of the surface of the first reflector 1 and improves the consistency of the light emission effect of the light source. In some embodiments, the first reflector layer 6 can be positioned on the carrier plate 5 by a positioning structure. In addition, the carrier plate 5 can be marked to facilitate the subsequent setting of the light-emitting chip 3.

[0062] S2: A light-emitting chip is placed in the receiving window, and the light-emitting chip and the first reflector layer do not contact each other.

[0063] In this embodiment, the maximum height of the first reflector layer 6 is less than the height of the light-emitting chip 3. After the light-emitting chip 3 is placed in the receiving window 104, the light-emitting chip 3 can protrude from the first reflector layer 6, which is beneficial for the side emission of the light-emitting chip 3.

[0064] S3: Fill the receiving window with reflective material to form a second reflector, and the second reflector is bonded to the first reflector layer to form a bottom reflective layer.

[0065] In this step, the second reflector 2 covers the bottom of the light-emitting chip 3, which has a positive electrode 301 and a negative electrode 302. The entire bottom reflective layer helps to improve luminous efficiency and uniformity. In the previous step, the light-emitting chip 3 and the first reflector layer 6 were not in contact, which created a gap between the first reflector layer 6 and the light-emitting chip 3, facilitating the filling of the gap by the second reflector 2.

[0066] S4: Set the encapsulating adhesive layer, which covers the bottom reflective layer and the light-emitting chip.

[0067] In this step, phosphor may be mixed into the encapsulating adhesive layer 4.

[0068] S5: Cut and peel off the carrier board to form a single chip-level packaged light source component.

[0069] After cutting, the first reflector layer 6 is divided into multiple first reflectors 1, and the encapsulating adhesive layer 4 and the bottom reflector layer are also divided into multiple independent units, wherein the bottom reflector layer, after being divided, forms multiple independent bottom reflectors. The specific structure of the single-chip-level packaged light source assembly 100 formed after peeling off the carrier board can be the same as the example structure of the above embodiment, and will not be described again here. In this step, when the carrier board 5 can serve as the substrate of the chip-level packaged light source assembly 100, it is not necessary to peel off the carrier board 5.

[0070] In one embodiment, providing the first reflector layer 6 may include the following steps:

[0071] The first reflector layer 6 is formed using an injection molding process.

[0072] The first reflector layer 6 formed in this embodiment has an array of multiple first reflectors 1, and a receiving window 104 is disposed within the first reflector 1. The top surface of the first reflector 1 can be a slope. Injection molding not only improves processing efficiency, but also ensures high surface shape consistency of the injection-molded first reflector 1. The slope is easy to form, resulting in good product consistency, which is beneficial to improving the consistency of the light emission effect of the light source. The first reflector 1 provided in this embodiment can also be other structures provided in the above embodiments, which will not be described in detail here.

[0073] In one embodiment, placing the first reflector layer 6 on the carrier plate 5 may include the following steps: applying double-sided adhesive to the carrier plate 5; and attaching the first reflector layer 6 to the double-sided adhesive.

[0074] Setting the light-emitting chip 3 in the receiving window 104 includes: placing the light-emitting chip 3 in the receiving window 104, so that the positive electrode 301 and negative electrode 302 of the light-emitting chip 3 are attached to the double-sided adhesive.

[0075] The double-sided adhesive used in this embodiment can fix the first reflector layer 6 and the light-emitting chip 3, which helps to prevent the first reflector layer 6 and the light-emitting chip 3 from shifting and increases manufacturing accuracy. The double-sided adhesive also facilitates the subsequent peeling of the carrier plate 5 and prevents the second reflector 2 from covering the bottom surfaces of the positive electrode 301 and the negative electrode 302. However, this bonding method is not limited to this; the carrier plate 5 can also be fixed to the first reflector layer 6 and the light-emitting chip 3 in other ways.

[0076] In one embodiment, filling the receiving window 104 with reflective material to form a second reflector 2 may include the following steps:

[0077] The reflective material is filled into the receiving window 104 and a vacuum is drawn. Part of the reflective material is filled between the light-emitting chip 3 and the carrier plate 5, and part of the reflective material surrounds the bottom outer periphery of the light-emitting chip 3 and is bonded to the first reflector 1.

[0078] Heating and curing form the second reflector 2.

[0079] In this embodiment, reflective material can be filled into the receiving window 104 using a dispensing process. Vacuuming facilitates material flow and removes air bubbles. The structure of the second reflector 2 formed in this embodiment is the same as that in the previous embodiment, and will not be described again here. When the top surface of the second reflector 2 is inclined, the dispensing position can be controlled to be on the inclined first reflective surface 101 near the receiving window 104, so that the adhesive flows obliquely from top to bottom into the receiving window 104.

[0080] In one embodiment, setting the encapsulating adhesive layer 4 may include the following steps:

[0081] A semi-cured encapsulating adhesive 7 is prepared, which contains phosphor.

[0082] A hot-pressing process is used to press the semi-cured encapsulating adhesive 7 onto the bottom reflective layer and the light-emitting chip 3 to form an encapsulating adhesive layer 4.

[0083] Phosphor is mixed into encapsulating adhesive 7 and then laminated in whole to form encapsulating adhesive layer 4. The phosphor has good coverage of the light-emitting chip 3, resulting in better encapsulation and sealing. In some embodiments, encapsulating adhesive layer 4 can also be made by other methods, such as potting.

[0084] The method for manufacturing the chip-level packaged light source component 100 provided in the above embodiment involves setting a first reflector layer 6, with a light-emitting chip 3 disposed in a receiving window 104 of the first reflector layer 6, and a second reflector 2 filling the receiving window 104 and bonding with the first reflector 1 to form a bottom reflective layer. The second reflector 2 covers the bottom of the light-emitting chip 3, which has a positive electrode 301 and a negative electrode 302. Forming the first reflector layer 6 first and then the second reflector 2 facilitates the control of the surface shape of the first reflector 1, improves the consistency of the light emission effect, and the entire bottom reflector layer helps to improve the luminous efficiency and uniformity.

[0085] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A chip-scale packaged light source component, characterized in that, include: A light-emitting chip, the light-emitting chip including a positive electrode and a negative electrode located on the same side of the light-emitting chip; A first reflector has a receiving window, the light-emitting chip is located inside the receiving window, and the light-emitting chip and the first reflector do not contact each other. The maximum height of the first reflector is less than the height of the light-emitting chip. The second reflector is at least partially filled in the receiving window and is joined with the first reflector to form a bottom reflector. The second reflector covers the bottom of the light-emitting chip where the positive electrode and the negative electrode are located, and the bottom sides of the positive electrode and the negative electrode are exposed in the second reflector. as well as An encapsulating adhesive layer is applied over the bottom reflector and the light-emitting chip.

2. The chip-scale packaged light source assembly as described in claim 1, characterized in that, The top surface of the first reflector is a first reflective surface, which is an inclined surface or an arc-shaped surface; and / or, the top surface of the second reflector is a second reflective surface, which is an inclined surface or a plane parallel to the top surface of the light-emitting chip, and the top surface is the side close to the encapsulating adhesive layer.

3. The chip-scale packaged light source assembly as described in claim 2, characterized in that, Both the first and second reflective surfaces are inclined surfaces. The lowest point of the first and second reflective surfaces is close to the light-emitting chip, while the highest point of the first and second reflective surfaces is far from the light-emitting chip. The highest point of the second reflective surface is lower than the highest point of the first reflective surface.

4. The chip-scale packaged light source assembly as described in claim 3, characterized in that, The lowest point of the second reflective surface is connected to the side of the light-emitting chip.

5. The chip-scale packaged light source assembly as described in any one of claims 1-4, characterized in that, The bottom surface of the second reflector is coplanar with the bottom surface of the first reflector; and / or, the bottom surface of the second reflector is coplanar with the bottom surfaces of the positive electrode and the negative electrode; the bottom surface is the side away from the encapsulating adhesive layer.

6. The chip-scale packaged light source assembly as described in any one of claims 1-4, characterized in that, The outer surface of the first reflector is coplanar with the outer surface of the corresponding side of the encapsulating adhesive layer, and the encapsulating adhesive layer contains phosphor.

7. A method for fabricating a chip-scale packaged light source component, characterized in that, Includes the following steps: A carrier plate and a first reflector layer are provided. The first reflector layer is disposed on the carrier plate, and multiple receiving windows are arranged in an array on the first reflector layer. A light-emitting chip is disposed in the receiving window, and the light-emitting chip and the first reflector layer are not in contact. The maximum height of the first reflector layer is less than the height of the light-emitting chip. A second reflector is formed by filling the receiving window with reflective material. The second reflector is bonded to the first reflector layer to form a bottom reflective layer. The second reflector covers the bottom of the light-emitting chip where the positive electrode and the negative electrode are located. An encapsulating adhesive layer is provided, which covers the bottom reflective layer and the light-emitting chip; The carrier board is cut and peeled off to form a single chip-level packaged light source component.

8. The method for manufacturing a chip-scale packaged light source component as described in claim 7, characterized in that, The provision of the first reflector layer includes: The first reflector layer is formed by injection molding. The first reflector layer has an array of multiple first reflectors. The receiving window is disposed in the first reflector. The top surface of the first reflector is a slope. The step of disposing the first reflector layer on the carrier plate includes: Apply double-sided adhesive to the carrier plate; The first reflector layer is attached to the double-sided adhesive; The provision of the light-emitting chip in the accommodating window includes: The light-emitting chip is placed in the receiving window, and the positive and negative electrodes of the light-emitting chip are attached to the double-sided adhesive.

9. The method for manufacturing a chip-scale packaged light source assembly as described in claim 7 or 8, characterized in that, The step of filling the receiving window with reflective material to form a second reflector includes: The receiving window is filled with reflective material and a vacuum is drawn. Part of the reflective material is filled between the light-emitting chip and the carrier plate, and part of the reflective material surrounds the bottom periphery of the light-emitting chip and is bonded to the first reflector. Heating and curing form a second reflector.

10. The method for manufacturing a chip-scale packaged light source assembly as described in claim 7 or 8, characterized in that, The setting of the encapsulating adhesive layer includes: A semi-cured encapsulating adhesive is prepared, wherein the encapsulating adhesive contains phosphor. A hot-pressing process is used to press the semi-cured encapsulating adhesive onto the bottom reflective layer and the light-emitting chip to form an encapsulating adhesive layer.

Images