A method and system for reducing wafer damage by flip-chip wafer bonding

Abstract

The present application relates to wafer bonding technical field, especially to a kind of flip-chip wafer bonding method and system for reducing wafer damage, method includes: on the bearing surface of substrate bearing mechanism, corresponding each wafer bonding position processing buffer notch;Wafer substrate is bonded to the bearing surface of substrate bearing mechanism, adjust wafer substrate position, so that each wafer bonding position is aligned with each buffer notch, and the gap between wafer bonding position corresponding wafer substrate and the bearing surface of substrate bearing mechanism is left;Control substrate bearing mechanism to complete work station transfer, so that the wafer bonding position to be mounted moves to the exact position under the needle assembly;Control needle assembly adsorbs wafer and is pressed to wafer substrate direction, and wafer is bonded and fixed on wafer substrate.The present application realizes pressing buffer by bearing surface buffer notch and substrate elastic deformation, reduces wafer damage, improves mounting yield, while reducing equipment precision requirement and manufacturing cost.

Description

Technical Field

[0001] This invention relates to the field of wafer bonding technology, and more particularly to a method and system for reducing wafer damage in flip-chip wafer bonding. Background Technology

[0002] Flip-chip bonding is a core process in semiconductor packaging and flexible electronics manufacturing. It involves precisely mounting bare wafer chips onto corresponding points on a wafer substrate with the electrode side facing down. This process is widely used in the mass production of products such as RFID tags and flexible sensors. The process relies on a substrate support mechanism for substrate fixation and conveying, and uses a pin assembly to pick up the wafer and perform a pressing action. The accuracy of the mounting position and the wafer integrity rate directly determine the product's electrical performance and production yield.

[0003] Currently, the mass mounting of flip-chip wafers on flexible substrates generally employs a solid bearing surface combined with needle-punching pressing. The bearing surface of the substrate bearing mechanism is a complete solid rigid structure. The flexible wafer substrate is tightly bonded to the bearing surface through vacuum adsorption, forming a continuous rigid support below the wafer bonding position. During operation, the needle assembly carries the wafer vertically downward, relying on the rigid reaction force of the bearing surface to ensure the mounting pressure and bonding firmness. In this solution, the wafer is in a hard clamping state between the needle and the rigid bearing surface. The travel deviation of the needle and the instantaneous pressing impact force can easily cause wafer damage and breakage, which is the core problem restricting the improvement of yield. To reduce the risk of damage, the industry needs to set extremely high standards for the processing accuracy of the bearing surface and the precision of the needle motion control, which drives up the equipment manufacturing cost and limits the further improvement of production cycle.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the general background of this disclosure and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0005] In view of at least one of the above technical problems, the present invention provides a method and system for reducing wafer damage during flip-chip wafer bonding. The method involves setting a buffer slot on the bearing surface of the substrate carrier mechanism that corresponds to the wafer bonding position, so as to buffer the compression force by the elastic deformation of the wafer substrate itself, thereby achieving low-damage wafer bonding.

[0006] This invention provides a method for reducing wafer damage during flip-chip wafer bonding. The method involves using a substrate carrier mechanism to support the wafer substrate, and using a pin assembly to press the wafer onto the wafer bonding position on the wafer substrate. The method includes the following steps: On the bearing surface of the substrate bearing mechanism, buffer slots are processed corresponding to each wafer bonding position. The width and depth of the buffer slots are both greater than the maximum external dimensions of the wafer to be bonded. The wafer substrate is bonded to the bearing surface of the substrate support mechanism. The position of the wafer substrate is adjusted so that each wafer bonding position is aligned with each buffer slot. The projection of the wafer bonding position falls within the outline range of the buffer slot, and a gap is left between the wafer substrate corresponding to the wafer bonding position and the bearing surface of the substrate support mechanism. The substrate carrier mechanism is controlled to complete the workpiece conveying, so that the wafer to be mounted is moved to the position directly below the needle assembly to complete the alignment; The needle assembly is controlled to adsorb the wafer and press it towards the wafer substrate. During the pressing process, the wafer substrate above the buffer groove is subjected to pressure and undergoes elastic deformation, thus attaching and fixing the wafer to the wafer substrate.

[0007] Furthermore, the wafer substrate is a flexible substrate, and the elastic deformation generated during the lamination process is within the elastic deformation range of the wafer substrate material; After the pressing is completed, the needle assembly is reset upwards, and the wafer substrate recovers to its initial flat state by relying on its own material elasticity.

[0008] Furthermore, when the wafer substrate is bonded to the bearing surface of the substrate bearing mechanism, the wafer substrate is fixed to the bearing surface of the substrate bearing mechanism by vacuum adsorption, and the adsorption and fixing area is the solid bearing area other than the buffer slot.

[0009] Furthermore, when adjusting the position of the wafer substrate, the alignment relationship between the wafer substrate and the buffer slot is calibrated by a visual positioning system so that the center of the wafer bonding position coincides with the center of the corresponding buffer slot.

[0010] Furthermore, the substrate carrier mechanism is a rotary carrier structure, which sequentially moves different wafer bonding positions to directly below the needle assembly by intermittent rotation to achieve continuous bonding operations.

[0011] Furthermore, the buffer groove provides clearance space for the elastic deformation of the wafer substrate, and the elastic deformation of the wafer substrate adapts to the vertical distance deviation between the needle assembly and the substrate support mechanism.

[0012] Furthermore, the needle assembly adopts a rigid pressing structure, and the stroke adaptation during the pressing process is achieved solely through the elastic deformation of the wafer substrate above the buffer slot.

[0013] Furthermore, the wafer bonding position is correspondingly disposed on the antenna functional area of ​​the wafer substrate, and the buffer slot is arranged correspondingly to the wafer bonding position of the antenna functional area.

[0014] The present invention also provides a system for reducing wafer damage through flip-chip wafer bonding, comprising: Substrate support mechanism, used to support wafer substrates; A needle assembly for pressing a wafer onto the wafer bonding position of the wafer substrate; The processing module processes buffer slots on the bearing surface of the substrate bearing mechanism, corresponding to each wafer bonding position. The width and depth of the buffer slots are both greater than the maximum external dimensions of the wafer to be bonded. The alignment module attaches the wafer substrate to the bearing surface of the substrate support mechanism, adjusts the position of the wafer substrate so that each wafer attachment position is aligned with each buffer slot, the projection of the wafer attachment position falls within the outline range of the buffer slot, and a gap is left between the wafer substrate corresponding to the wafer attachment position and the bearing surface of the substrate support mechanism. The alignment module controls the substrate carrying mechanism to complete the workpiece conveying, so that the wafer to be mounted is moved to the bonding position directly below the needle assembly to complete the alignment; The bonding module controls the needle assembly to adsorb the wafer and press it towards the wafer substrate. During the pressing process, the wafer substrate above the buffer groove is subjected to pressure and undergoes elastic deformation, thus bonding and fixing the wafer onto the wafer substrate.

[0015] Furthermore, the alignment module also includes: The vacuum adsorption unit, when the wafer substrate is attached to the bearing surface of the substrate bearing mechanism, fixes the wafer substrate to the bearing surface of the substrate bearing mechanism by vacuum adsorption. The adsorption and fixing area is the solid bearing area other than the buffer slot.

[0016] The technical solution of this invention can achieve the following technical effects: By optimizing the structure of the substrate carrier surface, the instantaneous impact force and stroke deviation during the pressing process are eliminated by utilizing the elastic deformation of the wafer substrate itself. This avoids the crushing and breakage problems caused by rigid hard contact to the wafer, effectively improving the mounting yield. The requirements for the processing accuracy of the carrier surface and the control accuracy of the needle movement are relaxed, reducing the equipment manufacturing cost while ensuring mounting quality. At the same time, it provides conditions for improving production cycle time and increasing batch production efficiency, and is compatible with the architecture layout of existing flip-chip mounting production lines.

[0017] The above description is only an overview of the technical solution of this application. In order to better understand the technical means of this application and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of this application more obvious and understandable, the following are specific embodiments of this application. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart illustrating the method for reducing wafer damage through flip-chip wafer bonding in an embodiment of the present invention. Figure 2 This is a logic diagram illustrating the method of fixing a wafer substrate by vacuum adsorption in an embodiment of the present invention; Figure 3 This is a logical schematic diagram illustrating the alignment of the wafer substrate and the buffer slot using a visual positioning system in an embodiment of the present invention. Figure 4 This is a schematic diagram of the system for reducing wafer damage through flip-chip wafer bonding in an embodiment of the present invention; Figure 5 This is a schematic diagram of the system from another perspective in an embodiment of the present invention; Reference numerals: 1. Substrate support mechanism; 11. Buffer groove; 2. Wafer substrate; 21. Wafer bonding position; 3. Needle assembly. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] This invention provides a method such as Figures 1 to 3 The method for reducing wafer damage in flip-chip wafer bonding, as shown, involves a substrate carrier 1 supporting a wafer substrate 2, and a pin assembly 3 pressing the wafer onto the wafer bonding position 21 of the wafer substrate 2, comprising the following steps: On the bearing surface of the substrate carrier mechanism 1, buffer slots 11 are processed corresponding to each wafer bonding position 21. The width and depth of the buffer slots 11 are both greater than the maximum external dimensions of the wafer to be bonded. The wafer substrate 2 is bonded to the bearing surface of the substrate bearing mechanism 1. The position of the wafer substrate 2 is adjusted so that each wafer bonding position 21 is aligned with each buffer slot 11. The projection of the wafer bonding position 21 falls within the outline range of the buffer slot 11, and a gap is left between the wafer substrate 2 corresponding to the wafer bonding position 21 and the bearing surface of the substrate bearing mechanism 1. The control substrate carrier mechanism 1 completes the workpiece delivery, so that the wafer bonding position 21 to be bonded is moved to the direct under the needle assembly 3 to complete the alignment; The needle assembly 3 is controlled to adsorb the wafer and press it towards the wafer substrate 2. During the pressing process, the wafer substrate 2 above the buffer groove 11 is subjected to pressure and undergoes elastic deformation, thus attaching and fixing the wafer to the wafer substrate 2.

[0023] The working principle of this invention is as follows: In the flip-chip mounting process, buffer slots 11 are first processed on the bearing surface of the substrate carrier 1, corresponding to each preset wafer bonding position 21. The width and depth of the buffer slots 11 are both set to be larger than the maximum external dimensions of the wafer to be mounted. The inner contour of the buffer slots 11 can adopt a closed shape that matches the wafer shape, ensuring that the wafer bonding positions 21 can correspond to the clearance area of ​​the slot within the normal alignment tolerance range. For example, for a wafer with a rectangular contour, the buffer slots 11 adopt a rectangular inner contour, so that the wafer can be covered by the slot range in both length and width directions. After the buffer slots 11 are processed, the wafer substrate 2 is bonded to the bearing surface of the substrate carrier 1. The overall position of the wafer substrate 2 is adjusted so that each wafer bonding position 21 is aligned with each buffer slot 11, ensuring that the projection of the wafer bonding position 21 falls within the contour range of the buffer slot 11. At this time, the wafer bonding positions 21 are aligned with the buffer slots 11. There is a gap between the wafer substrate 2 area corresponding to 1 and the bearing surface of the substrate carrier mechanism 1, and there is no rigid support contact. Then, the substrate carrier mechanism 1 is controlled to complete the workpiece conveying action, and the wafer bonding position 21 to be mounted is smoothly moved to the underside of the needle assembly 3 to complete the pre-pressing alignment. After the alignment is completed, the needle assembly 3 is controlled to adsorb the wafer to be mounted and perform a pressing action in the direction of the wafer substrate 2. During the pressing process, the wafer substrate 2 area directly above the buffer groove 11 is subjected to downward pressure and generates elastic deformation. This elastic deformation is used to dissipate the instantaneous impact force during the pressing process, and to prevent the wafer from being clamped between the needle assembly 3 and the rigid bearing surface to form a hard contact state. Finally, the wafer is smoothly bonded and fixed to the corresponding position of the wafer substrate 2, thereby relaxing the requirements for the processing accuracy of the bearing surface and the control accuracy of the needle movement, reducing the equipment manufacturing cost, and effectively improving the qualification rate of the mounted products.

[0024] In some embodiments of the present invention, the wafer substrate 2 is a flexible substrate, and the elastic deformation generated during the lamination process is within the elastic deformation range of the material of the wafer substrate 2. After the pressing is completed, the needle assembly 3 is reset upwards, and the wafer substrate 2 recovers to its initial flat state by relying on its own material elasticity.

[0025] The wafer substrate 2 is made of a flexible substrate. During the pressing process, the substrate area above the buffer groove 11 is bent and deformed by the pressing force of the needle assembly 3. The deformation is within the elastic deformation range of the wafer substrate 2 throughout the process, and will not cause irreversible damage to the functional circuits on the substrate body and surface. For example, a polyimide flexible substrate can be used as the wafer substrate 2, which has good elastic recovery performance. Under conventional mounting pressure, it only produces recoverable elastic bending. After the pressing action is completed, the needle assembly 3 resets upward and detaches from the wafer surface. The wafer substrate 2, which has lost the external force, automatically rebounds by relying on the elastic properties of its own material and returns to the initial flat state before pressing. It will not have problems such as wrinkles or warping due to local deformation, and can smoothly enter the next mounting process with the substrate carrying mechanism 1.

[0026] In some embodiments of the present invention, such as Figure 2 As shown, when the wafer substrate 2 is attached to the bearing surface of the substrate bearing mechanism 1, the wafer substrate 2 is fixed to the bearing surface of the substrate bearing mechanism 1 by vacuum adsorption. The adsorption and fixing area is the solid bearing area other than the buffer slot 11.

[0027] Vacuum adsorption holes are evenly arranged around the outer contour of each buffer slot 11, forming a closed adsorption band around the corresponding buffer slot 11. For example, for a rectangular buffer slot 11, the vacuum adsorption holes are arranged in the solid areas on the outer side of the four sides of the slot, so that the surrounding area of ​​the wafer bonding position 21 is stably adsorbed and fixed. This not only avoids the lateral displacement of the wafer substrate 2 during the pressing operation and ensures the accuracy of the bonding position, but also does not form an adsorption constraint on the substrate area above the buffer slot 11, ensuring that the area can freely generate elastic deformation when subjected to pressing force, and fully exert the buffering effect.

[0028] In some embodiments of the present invention, such as Figure 3 As shown, when adjusting the position of the wafer substrate 2, the alignment relationship between the wafer substrate 2 and the buffer slot 11 is calibrated by the visual positioning system so that the center of the wafer bonding position 21 coincides with the center of the corresponding buffer slot 11.

[0029] The vision positioning system can consist of an industrial acquisition camera and an image processing control unit. The acquisition end is set up at the corresponding position of the substrate loading station. During the calibration process, the position reference information of each buffer slot 11 on the substrate support mechanism 1 is first acquired, and then the alignment mark information of each wafer bonding position 21 on the wafer substrate 2 is acquired. The position deviation between the wafer bonding position 21 and the corresponding buffer slot 11 is calculated by the image processing unit, and then the substrate fine adjustment mechanism is driven to compensate and adjust the position of the wafer substrate 2. Finally, the center of the wafer bonding position 21 coincides with the center of the corresponding buffer slot 11, ensuring that the substrate deformation area is uniform and symmetrical during the pressing process, and ensuring the stability of the mounting accuracy and buffering effect.

[0030] In some embodiments of the present invention, the substrate carrier mechanism 1 is a rotary carrier structure, which sequentially moves different wafer bonding positions 21 to directly below the needle assembly 3 by intermittent rotation to achieve continuous bonding operation.

[0031] The substrate carrier mechanism 1 can be a cylindrical rotating carrier stage. Each buffer slot 11 is evenly arranged on the carrier surface along the circumference of the rotating carrier stage, which is adapted to the wafer bonding positions 21 distributed sequentially along the feeding direction on the wafer substrate 2. During the operation, the substrate carrier mechanism 1 is used for workpiece conveying by intermittent rotation. After rotating by a preset station angle, it stops running, so that the wafer bonding position 21 at the corresponding position is accurately positioned directly below the needle assembly 3 to complete the alignment. After the pressing operation of the current station is completed, the substrate carrier mechanism 1 continues to rotate to the next station. For example, multiple sets of buffer slots 11 corresponding to different wafer bonding positions 21 are arranged in the circumference of the rotating carrier stage. Different wafer bonding positions 21 are moved to directly below the needle assembly 3 by step-by-step intermittent rotation. With the cyclic pressing action of the needle assembly 3, uninterrupted continuous mounting operation is achieved, which is suitable for the industrial production needs of large-volume flexible substrates.

[0032] In some embodiments of the present invention, the buffer slot 11 provides clearance space for the elastic deformation of the wafer substrate 2, and the elastic deformation of the wafer substrate 2 adapts to the vertical distance deviation between the needle assembly 3 and the substrate support mechanism 1.

[0033] The buffer slot 11 provides ample clearance for the elastic deformation of the wafer substrate 2. The depth dimension of the slot is reserved with sufficient deformation allowance to ensure that the deformation area of ​​the wafer substrate 2 will not make rigid contact with the bottom of the slot during the pressing process. The elastic deformation generated by the wafer substrate 2 itself adapts to the vertical distance deviation between the needle assembly 3 and the substrate support mechanism 1. The depth setting of the buffer slot 11 can cover the maximum stroke deviation range of the needle assembly 3 under normal working conditions. For example, when the equipment has been running for a long time and assembly wear occurs, or when there is a small stroke error in motion control, the wafer substrate 2 can generate elastic deformation of the corresponding amplitude within the clearance space of the buffer slot 11 to offset the dimensional error in the vertical direction. The stable pressing state can be maintained without repeated calibration of the motion parameters of the needle assembly 3, thereby reducing the impact of vertical distance accuracy on the mounting effect from a structural perspective.

[0034] In some embodiments of the present invention, the needle assembly 3 adopts a rigid pressing structure, and the stroke adaptation during the pressing process is achieved only by the elastic deformation of the wafer substrate 2 above the buffer slot 11.

[0035] The suction nozzle at the pressing end of the needle assembly 3 is made of a high-hardness rigid material. The nozzle is rigidly connected to the main moving parts of the needle assembly 3. The suction nozzle at the pressing end of the needle assembly 3 can be made of tungsten steel, possessing high structural hardness and dimensional stability, ensuring positional accuracy during wafer adsorption and pressing. The stroke adaptation during pressing is achieved solely through the elastic deformation of the wafer substrate 2 above the buffer slot 11. The entire pressing buffering process does not rely on elastic buffer components on the pressing side; pressure buffering and stroke compensation are achieved solely through the layout of the buffer slot 11 on the bearing side in conjunction with the flexible properties of the wafer substrate 2 itself. In actual mounting operations, the rigid needle assembly 3 presses down with a preset fixed stroke. All stroke errors and impact forces generated during the pressing process are eliminated by the elastic bending of the wafer substrate 2 above the buffer slot 11. This avoids the nozzle swaying and positional accuracy loss problems caused by adding a buffer structure at the pressing end, simplifies the structural design of the needle assembly 3, and reduces the daily maintenance costs of the equipment.

[0036] In some embodiments of the present invention, the wafer bonding position 21 is correspondingly disposed on the antenna functional area of ​​the wafer substrate 2, and the buffer slot 11 is arranged correspondingly to the wafer bonding position 21 of the antenna functional area.

[0037] The wafer bonding position 21 is correspondingly set on the antenna functional area of ​​the wafer substrate 2. The antenna functional area is a functional area on the wafer substrate 2 with pre-prepared antenna lines. The wafer bonding position 21 is specifically located at the chip electrode bonding point of the antenna functional area. The buffer slots 11 are arranged corresponding to the wafer bonding positions 21 of the antenna functional area. Each buffer slot 11 can be arranged sequentially at intervals along the substrate feeding direction. The arrangement spacing is consistent with the spacing of each antenna functional area on the wafer substrate 2. For example, when applied to the production of RFID electronic tags, several independent antenna functional areas are arranged sequentially along the length direction on the wafer substrate 2. Each antenna functional area is provided with a wafer bonding position 21 for mounting wafer chips. The substrate carrier mechanism 1 has the same number of buffer slots 11 with the same arrangement spacing on the carrier surface, so that the wafer bonding position 21 of each antenna functional area can correspond to a buffer slot 11, ensuring the buffering effect during the mounting operation of the antenna functional area, and at the same time, not affecting the structure of other non-mounted areas on the substrate.

[0038] Based on the same inventive concept as the method for reducing wafer damage through flip-chip wafer bonding in the foregoing embodiments, the present invention also provides a method such as... Figure 4 and Figure 5 The system shown for reducing wafer damage through flip-chip wafer bonding includes: Substrate support mechanism 1 is used to support wafer substrate 2; The needle assembly 3 is used to press the wafer onto the wafer bonding position 21 of the wafer substrate 2; The processing module processes buffer slots 11 on the bearing surface of the substrate bearing mechanism 1, corresponding to each wafer bonding position 21. The width and depth of the buffer slots 11 are both greater than the maximum external dimensions of the wafer to be bonded. The alignment module attaches the wafer substrate 2 to the bearing surface of the substrate support mechanism 1, adjusts the position of the wafer substrate 2 so that each wafer attachment position 21 is aligned with each buffer slot 11, the projection of the wafer attachment position 21 falls within the outline range of the buffer slot 11, and a gap is left between the wafer substrate 2 corresponding to the wafer attachment position 21 and the bearing surface of the substrate support mechanism 1. The alignment module controls the substrate carrier mechanism 1 to complete the workpiece conveying, so that the wafer bonding position 21 to be mounted is moved to the underside of the needle assembly 3 to complete the alignment; The bonding module controls the needle assembly 3 to adsorb the wafer and press it towards the wafer substrate 2. During the pressing process, the wafer substrate 2 above the buffer groove 11 is subjected to pressure and undergoes elastic deformation, thus bonding and fixing the wafer onto the wafer substrate 2.

[0039] The system described above in this invention can effectively realize the method of reducing wafer damage through flip-chip wafer bonding, and the technical effects it can achieve are as described in the above embodiments, and will not be repeated here.

[0040] In some embodiments of the present invention, the alignment module further includes: The vacuum adsorption unit fixes the wafer substrate 2 to the bearing surface of the substrate bearing mechanism 1 by vacuum adsorption when the wafer substrate 2 is attached to the bearing surface of the substrate bearing mechanism 1. The adsorption and fixing area is the solid bearing area other than the buffer slot 11.

[0041] Similarly, the above-mentioned optimization schemes for the system can also respectively achieve the optimization effects corresponding to the methods in the embodiments, which will not be repeated here.

[0042] Although this application has been described in conjunction with specific features and embodiments, it is obvious that various modifications and combinations can be made thereto without departing from the spirit and scope of this application. Accordingly, this specification and drawings are merely exemplary illustrations of the application as defined herein, and are to be considered as covering any and all modifications, variations, combinations, or equivalents within the scope of this application. Clearly, those skilled in the art can make various alterations and modifications to this application without departing from its scope. Thus, if such modifications and modifications fall within the scope of this application and its equivalents, this application intends to include such modifications and modifications.

Claims

1. A method for reducing wafer damage during flip-chip wafer bonding, comprising: supporting a wafer substrate using a substrate carrier mechanism; and pressing a wafer onto the wafer bonding position on the wafer substrate using a pin assembly, characterized in that... Includes the following steps: On the bearing surface of the substrate bearing mechanism, buffer slots are processed corresponding to each wafer bonding position. The width and depth of the buffer slots are both greater than the maximum external dimensions of the wafer to be bonded. The wafer substrate is bonded to the bearing surface of the substrate support mechanism. The position of the wafer substrate is adjusted so that each wafer bonding position is aligned with each buffer slot. The projection of the wafer bonding position falls within the outline range of the buffer slot, and a gap is left between the wafer substrate corresponding to the wafer bonding position and the bearing surface of the substrate support mechanism. The substrate carrier mechanism is controlled to complete the workpiece conveying, so that the wafer to be mounted is moved to the position directly below the needle assembly to complete the alignment; The needle assembly is controlled to adsorb the wafer and press it towards the wafer substrate. During the pressing process, the wafer substrate above the buffer groove is subjected to pressure and undergoes elastic deformation, thus attaching and fixing the wafer to the wafer substrate.

2. The method for reducing wafer damage through flip-chip wafer bonding according to claim 1, characterized in that, The wafer substrate is a flexible substrate, and the elastic deformation generated during the lamination process is within the elastic deformation range of the wafer substrate material. After the pressing is completed, the needle assembly is reset upwards, and the wafer substrate recovers to its initial flat state by relying on its own material elasticity.

3. The method for reducing wafer damage through flip-chip wafer bonding according to claim 1, characterized in that, When the wafer substrate is attached to the bearing surface of the substrate bearing mechanism, the wafer substrate is fixed to the bearing surface of the substrate bearing mechanism by vacuum adsorption. The adsorption and fixing area is the solid bearing area other than the buffer slot.

4. The method for reducing wafer damage through flip-chip wafer bonding according to claim 1, characterized in that, When adjusting the position of the wafer substrate, the alignment relationship between the wafer substrate and the buffer slot is calibrated by a visual positioning system so that the center of the wafer bonding position coincides with the center of the corresponding buffer slot.

5. The method for reducing wafer damage through flip-chip wafer bonding according to claim 1, characterized in that, The substrate carrier mechanism is a rotary carrier structure that moves different wafer bonding positions to the underside of the needle assembly in an intermittent rotation manner to achieve continuous bonding operations.

6. The method for reducing wafer damage through flip-chip wafer bonding according to claim 1, characterized in that, The buffer slot provides clearance for the elastic deformation of the wafer substrate, and the elastic deformation of the wafer substrate adapts to the vertical distance deviation between the needle assembly and the substrate support mechanism.

7. The method for reducing wafer damage through flip-chip wafer bonding according to claim 1, characterized in that, The needle assembly adopts a rigid pressing structure, and the stroke adaptation during the pressing process is achieved only through the elastic deformation of the wafer substrate above the buffer slot.

8. The method for reducing wafer damage through flip-chip wafer bonding according to claim 1, characterized in that, The wafer bonding position is correspondingly disposed on the antenna functional area of ​​the wafer substrate, and the buffer slot is arranged correspondingly to the wafer bonding position of the antenna functional area.

9. A system for reducing wafer damage through flip-chip wafer bonding, characterized in that, The method described in any one of claims 1 to 8 includes: Substrate support mechanism, used to support wafer substrates; A needle assembly for pressing a wafer onto the wafer bonding position of the wafer substrate; The processing module processes buffer slots on the bearing surface of the substrate bearing mechanism, corresponding to each wafer bonding position. The width and depth of the buffer slots are both greater than the maximum external dimensions of the wafer to be bonded. The alignment module attaches the wafer substrate to the bearing surface of the substrate support mechanism, adjusts the position of the wafer substrate so that each wafer attachment position is aligned with each buffer slot, the projection of the wafer attachment position falls within the outline range of the buffer slot, and a gap is left between the wafer substrate corresponding to the wafer attachment position and the bearing surface of the substrate support mechanism. The alignment module controls the substrate carrying mechanism to complete the workpiece conveying, so that the wafer to be mounted is moved to the bonding position directly below the needle assembly to complete the alignment; The bonding module controls the needle assembly to adsorb the wafer and press it towards the wafer substrate. During the pressing process, the wafer substrate above the buffer groove is subjected to pressure and undergoes elastic deformation, thus bonding and fixing the wafer onto the wafer substrate.

10. The system for reducing wafer damage through flip-chip wafer bonding according to claim 9, characterized in that, The alignment module also includes: The vacuum adsorption unit, when the wafer substrate is attached to the bearing surface of the substrate bearing mechanism, fixes the wafer substrate to the bearing surface of the substrate bearing mechanism by vacuum adsorption. The adsorption and fixing area is the solid bearing area other than the buffer slot.

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