Ceramic electronic component

Abstract

A ceramic electronic component (101) includes a first surface (11) and a second surface facing opposite directions, a first side surface contacting the first surface (11) via a first ridge line (31) and connecting the first surface (11) and the second surface, and a first base electrode (21) covering a portion of the first surface (11), an outline of the first base electrode (21) viewed in a direction perpendicular to the first surface (11) having an outer edge (21a) extending along the first ridge line (31) in parallel with the first ridge line (31), an inner edge (21c) on an opposite side from the outer edge (21a), and a side edge (21b) extending to connect the outer edge (21a) and the inner edge (21c), at least a portion of the side edge (21b) being covered with a protective layer (40) formed of ceramic, the first base electrode (21) having an electrode exposed region (45) not covered with the protective layer (40) but exposed, and the protective layer (40) at a first portion of the side edge (21b) closer to the outer edge (21a) than the inner edge (21c) being thicker than the protective layer (40) at a second portion of the side edge (21b) closer to the inner edge (21c) than the outer edge (21a).

Description

Technical Field

[0001] This invention relates to ceramic electronic components. Background Technology

[0002] International Patent Publication WO2023 / 002894A1 (Patent Document 1) discloses a ceramic electronic component. This ceramic electronic component has a first surface, a second surface, and a side surface connecting them. A first base electrode is disposed along the long side of the first surface. A side electrode is disposed on the side surface. A portion of the side electrode also extends from the first surface. An external electrode is formed by the first base electrode, the side electrode, etc. The object of the invention described in Patent Document 1 is to prevent the external electrode from being peeled off even when stress is concentrated on it. Specifically, in Patent Document 1… Figure 9 B discloses the following configuration, in which three sides of the first base electrode are covered by a ceramic protective layer.

[0003] Patent Document 1: International Publication WO2023 / 002894A1

[0004] After the ceramic electronic component was installed, there were cases where cracks appeared near the edge due to stress concentration. Summary of the Invention

[0005] Therefore, the object of the present invention is to provide a ceramic electronic component that suppresses the generation of cracks after installation.

[0006] To achieve the above objectives, the ceramic electronic component based on the present invention comprises: a first surface and a second surface facing opposite sides; a first side surface contacting the first surface via a first ridge line and connecting the first surface and the second surface; and a first base electrode covering a portion of the first surface. The outline of the first base electrode, when viewed from a direction perpendicular to the first surface, has: an outer edge extending parallel to the first ridge line; an inner edge located on the side opposite to the outer edge; and a side edge extending connecting the outer edge and the inner edge. At least a portion of the side edge is covered by a protective layer formed of ceramic. The first base electrode has an exposed electrode area that is not covered by the protective layer. The thickness of the protective layer at a first portion of the side edge closer to the outer edge than the inner edge is greater than the thickness of the protective layer at a second portion of the side edge closer to the inner edge than the outer edge.

[0007] According to the present invention, the thickness of the protective layer at the first location is greater than the thickness of the protective layer at the second location, thus making it easier to withstand the stress applied after the ceramic electronic component is installed, and suppressing the generation of cracks after installation. Attached Figure Description

[0008] Figure 1 This is a perspective view of the ceramic electronic component based on Embodiment 1 of the present invention.

[0009] Figure 2 From Figure 1 The image shows a ceramic electronic component based on Embodiment 1 of the present invention viewed directly below.

[0010] Figure 3 yes Figure 2 A magnified top view of the first base electrode and its vicinity.

[0011] Figure 4 Is with Figure 3 A cross-sectional view showing the direction of the arrows related to line IV-IV.

[0012] Figure 5 Is with Figure 3 A cross-sectional view showing the direction of the arrows related to the V-V lines.

[0013] Figure 6 This is an explanatory diagram of the first step of the manufacturing method of ceramic electronic components based on Embodiment 1 of the present invention.

[0014] Figure 7 This is an explanatory diagram of the second step of the manufacturing method of ceramic electronic components based on Embodiment 1 of the present invention.

[0015] Figure 8 This is an explanatory diagram of the third step in the manufacturing method of ceramic electronic components based on Embodiment 1 of the present invention.

[0016] Figure 9 This is an explanatory diagram of the fourth step in the manufacturing method of ceramic electronic components based on Embodiment 1 of the present invention.

[0017] Figure 10 This is a partial cross-sectional view of the state of the ceramic electronic component before completion, based on Embodiment 2 of the present invention.

[0018] Figure 11 This is a partial cross-sectional view of the ceramic electronic component based on Embodiment 2 of the present invention.

[0019] Figure 12 This is an enlarged top view of the first base electrode and its vicinity in the ceramic electronic component according to Embodiment 2 of the present invention.

[0020] Figure 13 This is an enlarged top view of the first base electrode and its vicinity in the ceramic electronic component according to Embodiment 3 of the present invention.

[0021] Figure 14This is an enlarged top view of the first base electrode and its vicinity, taken when the ceramic electronic component in Embodiment 3 of the present invention has undergone chamfering processing.

[0022] Figure 15 This is an enlarged top view of the first base electrode and its vicinity before monolithization, based on a modified example of the ceramic electronic component in Embodiment 3 of the present invention.

[0023] Figure 16 This is an enlarged top view of the first base electrode and its vicinity after monolithization, based on a modified example of the ceramic electronic component in Embodiment 3 of the present invention.

[0024] Figure 17 Is Figure 16 The diagram shows a cross-sectional view of the structure after the side electrodes have been formed. Detailed Implementation

[0025] The dimensions shown in the accompanying drawings are not necessarily intended to faithfully represent reality; sometimes, they are exaggerated for ease of explanation. In the following description, the concepts of "up" or "down" do not necessarily mean absolute up or down, but sometimes mean relative up or down in the illustrated posture.

[0026] (Implementation Method 1)

[0027] Reference Figures 1-5 The ceramic electronic component based on Embodiment 1 of the present invention will be described below. Figure 1 The image below shows the appearance of the ceramic electronic component 101 in this embodiment. The ceramic electronic component 101 is formed by forming several electrodes on the surface of a ceramic laminate 70.

[0028] The ceramic electronic component 101 has a first surface 11 and a second surface 12 facing opposite sides. The ceramic electronic component 101 has a first side surface 13 that contacts the first surface 11 via a first ridge 31 and connects the first surface 11 to the second surface 12. Figure 1 In the arrangement of the ceramic electronic component 101 shown, the first surface 11 is the lower surface, and the second surface 12 is the upper surface. The second surface 12 contacts the first side surface 13 via a second ridge 32. The ceramic electronic component 101 includes: a first base electrode 21 covering a portion of the first surface 11, a second base electrode 22 covering a portion of the second surface 12, and a side electrode 23. The side electrode 23 is configured to cover a portion of the first side surface 13, a portion of the first surface 11, and a portion of the second surface 12. The side electrode 23 includes an end portion 23a and an end portion 23b. The end portion 23a partially covers the first base electrode 21. The end portion 23b partially covers the second base electrode 22. As a result, the side electrode 23 electrically connects the first base electrode 21 and the second base electrode 22.

[0029] exist Figure 2 The middle indicates from Figure 1 Observe the ceramic electronic component 101 from directly below. Figure 2 In the middle, see page 11 on the first page. Figure 3 The middle indicates that it has been enlarged. Figure 2 The situation near the first base electrode 21. Figure 3 For ease of explanation, the diagram shows the state before the formation of the side electrode 23. Figure 3 In the diagram, the side electrode 23 is represented by a double-dotted line.

[0030] The outline of the first base electrode 21, when viewed from a direction perpendicular to the first surface 11, includes: an outer edge 21a extending parallel to the first ridge 31, an inner edge 21c located on the side opposite to the outer edge 21a, and a side edge 21b extending to connect the outer edge 21a and the inner edge 21c. In addition to the side edge 21b, the first base electrode 21 also has a side edge 21d. Hereinafter, focus will be placed on the side edge 21b. At least a portion of the side edge 21b is covered by a protective layer 40 formed of ceramic. The first base electrode 21 has an electrode exposure area 45 exposed from the protective layer 40.

[0031] Here, the width of the side electrode 23 is smaller than the width of the first base electrode 21, but this is only one example. The width of the side electrode 23 can also be equal to or larger than the width of the first base electrode 21. However, it is preferable that the width of the side electrode 23 is smaller than the width of the first base electrode 21. The reasons are as follows.

[0032] To form the side electrode 23, a conductive paste is applied. However, if the coating position is offset due to error, the side electrode 23 extends into a region where the first base electrode 21 is not present. That is, a portion of the side electrode 23 directly covers the first surface 11 of the ceramic laminate 70. Such a portion can be a significant factor in crack formation. If the width of the side electrode 23 is equal to the width of the first base electrode 21, even a slight offset in the coating position will result in a region where the side electrode 23 is coated in an area where the first base electrode 21 is not present. However, if the width of the side electrode 23 is smaller than the width of the first base electrode 21, even with a slight offset in the coating position, the side electrode 23 is more likely to converge within the width of the first base electrode 21, thus reducing the likelihood of the side electrode 23 directly covering a region in the first surface 11 where the first base electrode 21 is not present. Therefore, it is preferable that the width of the side electrode 23 is smaller than the width of the first base electrode 21.

[0033] exist Figure 4 The middle indicates with Figure 3 A cross-sectional view with arrows pointing in the direction of line IV-IV. The thickness A of the protective layer 40 at the first location 81 in side 21b, which is closer to the outer edge 21a than the inner edge 21c, is thicker than the thickness C of the protective layer 40 at the second location 82 in side 21b, which is closer to the inner edge 21c than the outer edge 21a. Figure 5 The middle indicates with Figure 3 A cross-sectional view showing the direction of the arrows related to the V-V lines.

[0034] The "first part" and the "second part" are selected appropriately, respectively. This will be explained in more detail below. The "first part" is a part appropriately selected from the range that satisfies the condition that side 21b is closer to outer side 21a than inner side 21c. Here, as... Figure 4 As shown, a certain location is selected as the first location, denoted as first location 81. Here, we focus on the thickness A of the protective layer 40 at first location 81, but alternatively, other points can be selected as the first location within the range that meet the conditions. For example, we can also focus on the thickness B of the protective layer 40 at first location 81x. Any location in side 21b that is closer to the outer edge 21a than the inner edge 21c can be appropriately selected as the "first location". First location 81x also meets this condition. The thickness B of the protective layer 40 at first location 81x is thicker than the thickness C of the protective layer 40 at second location 82.

[0035] The "second part" is a part appropriately selected from the range of side 21b that satisfies the condition that it is closer to the inner side 21c than the outer side 21a. Here, for example... Figure 4 As shown, a certain part is selected as the second part, and it is designated as the second part 82. The thickness C of the protective layer 40 at the second part 82 is equal to the thickness D of the protective layer 40 in the inner sheet 21c, but this is only an example. A part with a thickness that is not equal to the thickness D can also be designated as the "second part".

[0036] The location selected as the first location is not limited to the location with the thickest protective layer 40 among any location in side 21b that is closer to outer 21a than inner 21c. For example, the thickness B of the protective layer 40 at the first location 81x is not the thickest among "any location in side 21b that is closer to outer 21a than inner 21c". In fact, there may be a location on the side closer to outer 21a than the first location 81x. This is also a possibility.

[0037] The same applies to the second part. The part selected as the second part is not limited to the part with the smallest protective layer 40 thickness among any part of side 21b that is closer to inner side 21c than outer side 21a.

[0038] The first part cannot be chosen at any position simply because it falls within the range where side 21b is closer to outer side 21a than inner side 21c. Similarly, the second part cannot be chosen at any position simply because it falls within the range where side 21b is closer to inner side 21c than outer side 21a. The relationship described later is satisfied by appropriately selecting the first and second parts.

[0039] By appropriately selecting the first and second portions from the sides, it is possible to achieve a situation where "the thickness of the protective layer 40 at the first portion is thicker than the thickness of the protective layer 40 at the second portion 82". The ceramic electronic component in Embodiment 1 of the present invention is configured such that the relationship between the thickness of the protective layer 40 at the first portion and the thickness of the protective layer 40 at the second portion 82 is achieved by appropriately selecting the first and second portions from the sides. That is, any combination of the first and second portions that achieves this relationship is acceptable as long as at least one such combination exists.

[0040] In this embodiment, since the thickness A of the protective layer 40 at the first part 81 is thicker than the thickness C of the protective layer 40 at the second part 82, it is easier to withstand the stress after the ceramic electronic component 101 is installed, and the generation of cracks after installation can be suppressed.

[0041] Furthermore, as in this embodiment Figure 4 As shown, preferably at least a portion of the inner edge 21c is covered by a protective layer 40, and the thickness D of the protective layer 40 in the inner edge 21c is thinner than the thickness A of the protective layer 40 at the first portion 81. By adopting this configuration, at least a portion of the inner edge 21c is covered by the protective layer 40, thus more reliably preventing the formation of cracks around the first base electrode 21.

[0042] As in this embodiment Figure 5 As shown, if we are concerned with the thickness of the protective layer 40 covering side 21b, from the third portion 83 closest to the exposed electrode area 45 to the fourth portion 84 overlapping with side 21b, it is preferable that the thickness of the protective layer 40 gradually increases from the third portion 83 towards the fourth portion 84. By adopting this configuration, side 21b is covered by the protective layer 40, and the thickness of the protective layer 40 gradually increases, thus more reliably preventing the formation of cracks in side 21b. Figure 5 In the example shown, the thickness of the protective layer 40 is 0 at the third location 83, but the thickness of the protective layer 40 is E at the fourth location 84. The protective layer 40 gradually increases in thickness from 0 to E.

[0043] As in this embodiment Figure 2 as well as Figure 3As shown, a side electrode 23 preferably covers a portion of the first side surface 13 and a portion of the first surface 11. When viewed from a direction perpendicular to the first surface 11, the end of the side electrode 23 furthest from the first ridge line 31 is located in the electrode exposure area 45. With this configuration, a reliable electrical connection between the side electrode 23 and the first base electrode 21 can be made in the electrode exposure area 45.

[0044] Furthermore, the protective film 40 is shown here to be formed along the outline of the first base electrode 21, but not along the outline of the second base electrode 22. However, the protective film 40 may also be formed along the outline of the second base electrode 22.

[0045] (Manufacturing method)

[0046] The ceramic electronic component 101 in this embodiment can be manufactured as follows. In particular, attention should be paid to... Figure 5 The cross-section shown illustrates Figure 5 The structure shown is manufactured as follows: First, multiple ceramic sheets are stacked to form a ceramic laminate 70, which is obtained by forming the necessary conductor pattern in the necessary positions. The ceramic laminate 70 has a first surface 11 and a second surface 12 facing opposite sides. Figure 6 As shown, a first substrate electrode 21 is formed by printing a conductive paste on the first surface 11 of the ceramic laminate 70. Figure 6 In the middle, the first face 11 is shown facing upwards. Figure 6 In the image, the sides 21b and 21d of the first base electrode 21 are visible. Figure 6 In the middle, I saw Figure 4 The first part, 81. Figure 6 There is a second part 82 on the inside of the paper.

[0047] like Figure 7 As shown, the first layer 41 is formed to cover the sides 21b and 21d. The first layer 41 is part of the protective layer 40. For example, the protective layer 40 can be formed by screen printing. The number of screen printing operations varies depending on the location of the protective layer 40, and may be one or two. The first layer 41 is formed by the first screen printing. Next, as... Figure 8 As shown, a second layer 42 is formed. The second layer 42 is part of the protective layer 40. In the example shown here, the protective layer 40 is formed by a total of two screen printing processes. The second layer 42 is formed by a second screen printing process. Figure 8 What we see is the first part 81, so two screen printing processes are performed, resulting in a state where two layers are stacked. On the other hand, although not shown, in the... Figure 8The second part 82 on the inside of the paper is screen printed only once, thus becoming a state where only one layer is configured.

[0048] The flat component is pressed against the first surface 11. The result is as follows: Figure 9 As shown, the first base electrode 21 and the protective layer 40 are embedded in the ceramic laminate 70. Figure 9 The sides 21b and 21d of the first base electrode 21, which are originally areas where the protective layer 40 is thicker, are therefore deeply recessed. By making... Figure 9 The structure formed in the middle is reversed vertically, thus obtaining Figure 5 The structure shown.

[0049] In addition to being fabricated as individual ceramic laminates 70, an assembly of multiple ceramic laminates 70 can also be used as a large substrate, and each process can be performed simultaneously on this large substrate. Alternatively, multiple ceramic electronic components 101 can be obtained by cutting the large substrate into individual product sizes after printing the required electrodes and protective layer 40 as shown in this manner.

[0050] (Implementation Method 2)

[0051] Reference Figures 10-12 The ceramic electronic component according to Embodiment 2 of the present invention will be described. The basic structure of the ceramic electronic component in this embodiment is the same as that described in Embodiment 1. Before completion, the ceramic electronic component in this embodiment has… Figure 10 The structure shown is such that the protective layer 40 is thinner in areas away from the first side surface 13, but thicker near the first side surface 13. The upper surface of the protective layer 40 lies in the same plane as the first side surface 11. The protective layer 40 is pressed into the laminate 70. In areas where the protective layer 40 is present, the first base electrode 21 is pressed into the underside of the protective layer 40. In areas where the protective layer 40 is thicker, the first base electrode 21 is pressed down particularly significantly. To obtain the ceramic electronic component of this embodiment, such as... Figure 10 As shown by the double-dotted line, a chamfering process is performed. The chamfering is performed using known techniques. The first edge 31 is given a fillet through the chamfering process. The result is... Figure 11 The structure shown is such that the first rounded corner region 46 is formed. Figure 12 The text indicates the view from a direction perpendicular to the first surface 11 in this state. Figure 12 In this configuration, the upper end of the protective layer 40 is slightly separated from the first side surface 13. That is, when viewing the first rounded corner region 46 from a direction perpendicular to the first side surface 11, a portion of the first base electrode 21 is exposed, not covered by the protective layer 40, at the location closest to the first side surface 13. This... Figure 11The portion of the first base electrode 21 that is not covered by the protective layer 40 is also visible.

[0052] In the ceramic electronic component of this embodiment, the first ridge 31 has a first rounded corner region 46 with rounded corners, and more than 90% of the portion of the side 21b located in the first rounded corner region 46 is covered by the protective layer 40. Figure 11 In the example shown, the side 21b of the first base electrode 21 is present throughout the interval 48. More than 90% of the intervals within the first rounded corner region 46 of this side 21b are covered by the protective layer 40. The intervals within the first rounded corner region 46 of the side 21b that are covered by the protective layer 40... Figure 11 The interval shown is 47.

[0053] In this embodiment, more than 90% of the area in the first rounded corner region 46 of the side 21b is covered by the protective layer 40, thus suppressing the generation of cracks after the ceramic electronic components are installed.

[0054] (Implementation Method 3)

[0055] Reference Figures 13-14 The ceramic electronic component based on Embodiment 3 of the present invention will be described. The basic structure of the ceramic electronic component in this embodiment is the same as that described in Embodiment 1.

[0056] In the ceramic electronic component of this embodiment, at least a portion of the outer edge 21a becomes an outer edge covering region 49 of the protective film 40 extending along the outer edge 21a, and the side electrode 23 covers and extends beyond at least a portion of the protective film 40 in the outer edge covering region 49 into the electrode exposed region 45.

[0057] exist Figure 13 In the example shown, chamfering to give the first edge 31 a rounded corner is not performed, but chamfering can still be performed. If chamfering is performed, such as... Figure 14 As shown.

[0058] exist Figure 14 In the example shown, the first edge 31 is rounded by chamfering. In this example, the outer edge covering section 49 protrudes inward from the sides 21b and 21d at two locations. Between the outer edge covering sections 49 at the two locations, there is a section where the protective film 40 does not extend along the outer edge 21a. The side electrode 23 is configured to partially cover each of the outer edge covering sections 49 at the two locations.

[0059] In ceramic electronic components, there is a risk of cracks originating from the first side 13. However, in this embodiment, at least a portion of the outer edge 21a becomes an outer edge coverage area 49 extending along the outer edge 21a by a protective film 40, thus making it less likely for cracks to originate from the first side 13 to occur. This further suppresses the generation of cracks after the ceramic electronic components are installed.

[0060] In this embodiment, the side electrode 23 covers and extends beyond at least a portion of the protective film 40 in the outer coverage area 49 and extends into the electrode exposure area 45, thus ensuring an electrical connection between the side electrode 23 and the first base electrode 21 within the electrode exposure area 45.

[0061] (Variation example)

[0062] Furthermore, as an example where at least a portion of the outer edge 21a becomes the outer covering region 49, an example is shown where the outer edge 21a partially becomes the outer covering region 49 from the left and right ends toward the inward side. However, it is also possible for the entire outer edge 21a to be the outer covering region 49. For example... Figure 15 The image shows a state during the manufacturing process of a ceramic electronic component whose outer edge 21a is entirely covered by the outer edge 49. Figure 15 A portion of a large substrate before monolithization is shown. Here, adjacent ceramic electronic components are connected. It is cut at cut line 75. This cutting is also referred to as monolithization. This forms the first side surface 13. After monolithization in this manner, the first edge 31 is chamfered as needed. Then, as... Figure 16 As shown by the double-dotted line, the side electrode 23 is formed. For example, the side electrode 23 can be formed by an impregnation method. Preferably... Figure 16 The width G of the protective film 40 in the outer covering region 49 is set sufficiently large so that even if the actual cutting position is offset due to error, no problem will occur. After the side electrode 23 is formed, if represented by a cross-sectional view, it becomes Figure 17 The structure shown. (As illustrated) Figure 17 As shown, the electrical connection between the side electrode 23 and the first base electrode 21 is performed not only inside the electrode exposed area 45, but also outside the area 21a.

[0063] In addition, multiple embodiments described above can be used in combination as appropriate.

[0064] Furthermore, the embodiments disclosed herein are illustrative in all respects and are not restrictive. The scope of the invention is defined by the claims, which include all modifications within the meaning and scope of the claims.

[0065] (Postscript)

[0066] (Note 1)

[0067] A ceramic electronic component, wherein:

[0068] The first and second sides face opposite directions;

[0069] A first side surface, which contacts the first surface via a first ridge and connects the first surface to the second surface; and

[0070] The first base electrode covers a portion of the aforementioned first surface.

[0071] The outline of the first base electrode, when viewed from a direction perpendicular to the first surface, has: an outer edge extending parallel to the first ridge line; an inner edge located on the side opposite to the outer edge; and a side edge extending connecting the outer edge and the inner edge.

[0072] At least a portion of the aforementioned side is covered by a protective layer made of ceramic.

[0073] The aforementioned first base electrode has an exposed electrode area, which is not covered by the aforementioned protective layer but is exposed.

[0074] The thickness of the protective layer at the first location on the side that is closer to the outer edge than the inner edge is greater than the thickness of the protective layer at the second location on the side that is closer to the inner edge than the outer edge.

[0075] (Note 2)

[0076] According to the ceramic electronic components described in Appendix 1, among which,

[0077] At least a portion of the inner edge is covered by the protective layer, and the thickness of the protective layer at the inner edge is thinner than the thickness of the protective layer at the first part.

[0078] (Note 3)

[0079] According to the ceramic electronic components described in Appendix 1 or 2, among which,

[0080] If we focus on the thickness of the protective layer covering the aforementioned side, from the third portion closest to the exposed electrode area to the fourth portion overlapping the aforementioned side,

[0081] The thickness of the protective layer gradually increases as it moves from the third part to the fourth part.

[0082] (Note 4)

[0083] According to any one of the ceramic electronic components described in Appendix 1 to 3, among which,

[0084] The first edge has a first rounded corner region with rounded corners, and more than 90% of the section of the side located in the first rounded corner region is covered by the protective layer.

[0085] (Note 5)

[0086] According to any one of the ceramic electronic components described in Appendix 1 to 4, among which,

[0087] It has a side electrode that covers a portion of the first side and a portion of the first surface. When viewed from a direction perpendicular to the first surface, the end of the side electrode that is furthest from the first ridge is in the electrode exposure area.

[0088] (Note 6)

[0089] According to the ceramic electronic components described in Appendix 5, among which,

[0090] At least a portion of the outer edge is the outer edge coverage area along which the protective film extends, and the side electrode covers and extends beyond at least a portion of the protective film in the outer edge coverage area to the exposed area of ​​the electrode.

[0091] Explanation of reference numerals in the attached figures

[0092] 11…First surface; 12…Second surface; 13…First side surface; 21…First base electrode; 21a…Outer edge; 21b, 21d…Side edge; 21c…Inner edge; 22…Second base electrode; 23…Side electrode; 23a, 23b…(Side electrode)End; 31…First ridge; 32…Second ridge; 40…Protective layer; 41…First layer; 42…Second layer; 45…Electrode exposed area; 46…First rounded corner area; 47…Interval; 48…(Interval with side surface); 49…Outer edge covered area; 70…Ceramic laminate; 75…Cut line; 81, 81x…First part; 82…Second part; 83…Third part; 84…Fourth part; 101…Ceramic electronic component.

Claims

1. A ceramic electronic component, wherein, have: The first and second sides face opposite directions; A first side surface, which contacts the first surface via a first ridge and connects the first surface to the second surface; and The first base electrode covers a portion of the aforementioned first surface. The outline of the first base electrode, when viewed from a direction perpendicular to the first surface, has: an outer edge extending parallel to the first ridge line; an inner edge located on the side opposite to the outer edge; and a side edge extending connecting the outer edge and the inner edge. At least a portion of the aforementioned side is covered by a protective layer made of ceramic. The aforementioned first base electrode has an exposed electrode area, which is not covered by the aforementioned protective layer and is thus exposed. The thickness of the protective layer at the first location on the side that is closer to the outer edge than the inner edge is greater than the thickness of the protective layer at the second location on the side that is closer to the inner edge than the outer edge.

2. The ceramic electronic component according to claim 1, wherein, At least a portion of the inner edge is covered by the protective layer, and the thickness of the protective layer at the inner edge is less than the thickness of the protective layer at the first part.

3. The ceramic electronic component according to claim 1 or 2, wherein, If we focus on the thickness of the protective layer covering the aforementioned side, from the third portion closest to the exposed electrode area to the fourth portion overlapping the aforementioned side, The thickness of the protective layer gradually increases as it moves from the third part to the fourth part.

4. The ceramic electronic component according to any one of claims 1 to 3, wherein, The first edge has a first rounded corner region with rounded corners, and more than 90% of the section of the side located in the first rounded corner region is covered by the protective layer.

5. The ceramic electronic component according to any one of claims 1 to 4, wherein, It has a side electrode that covers a portion of the first side and a portion of the first surface. When viewed from a direction perpendicular to the first surface, the end of the side electrode that is furthest from the first ridge is in the electrode exposure area.

6. The ceramic electronic component according to claim 5, wherein, At least a portion of the outer edge is the outer edge coverage area along which the protective film extends, and the side electrode covers and extends beyond at least a portion of the protective film in the outer edge coverage area to the exposed area of ​​the electrode.

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