Device for bonding parts with improved tool holder protection against contamination

Abstract

An apparatus 100 for bonding or adhering a component 600 to or on one or more substrates, the apparatus comprising a tool holder 400 and a component tool 500, the apparatus providing at least one gas curtain 750, the at least one gas curtain at least partially enclosed by at least one groove 520 formed in a peripheral portion between the tool holder 400 and the component tool 500; and wherein in use, the at least one gas curtain 750 is configured to reduce a degree of deposition of a contaminant 850 onto one or more portions of a tool holder contact face 450 by providing at least one gas flow path from an interior portion to an outer periphery of each tool contact face.

Description

Technical Field

[0001] The present invention relates to an apparatus for bonding a component, such as a grain, to one or more substrates. Background Technology

[0002] Generally, tools used in bonding processes are coupled to a suitably configured tool holder using methods such as fixation by vacuum, magnets, clamping forces, or combinations thereof. However, contamination of the tool holder and / or tools can cause a variety of problems, including tools sticking to the holder, reduced accuracy due to non-planar contact surfaces, leakage in the vacuum coupling channel, reduced heat transfer between the heating elements in the tool holder and the tools, and any combination thereof. Contamination levels may be more problematic during processes similar to thermosetting bonding or involving higher temperatures and / or pressures, see, for example, WO2012 / 165313 A1 or EP 3 098 837 A2. The purpose of this invention

[0003] The purpose of this invention is to provide better protection against contamination when bonding components to a substrate. Summary of the Invention

[0004] This disclosure provides an apparatus for bonding or attaching a component to one or more substrates, wherein the apparatus includes a tool holder having a tool holder contact surface for receiving a component tool. The tool holder further includes at least one gas outlet, hereinafter referred to as a tool holder gas outlet, which provides an airflow from a central portion of the tool holder contact surface to a peripheral portion between the tool holder and the component tool. The apparatus also includes at least one air curtain that flows away from the peripheral portion and is partially surrounded by grooves formed in the tool holder and the component tool. The air curtain reduces the deposition of contaminants on the tool holder contact surface.

[0005] To address the contamination problem, an improved contamination protection is disclosed to protect at least a portion of the contact surface between a tool and a tool holder, and may include a heating element if necessary. This protection prevents process residues and byproducts (such as flux) from condensing, depositing, or vapor-phase depositing on the contact surface. This is achieved by creating one or more air curtains at one or more peripheral portions of the contact surface, thereby generating a significant gas outflow. Nitrogen or any other suitable gas can be used for the gas outflow, preferably maintaining a substantially constant flow rate during use. In grain bonding processes similar to thermosetting, the process area may be contaminated by process residues such as flux, which can be deposited on the contact surface through vapor-phase condensation and / or particle deposition. Due to vacuum coupling and / or capillary forces, such residues can reach the contact surface between the tool and the tool holder. According to this disclosure, one or more air curtains are created around the contact surface by introducing an airflow such as nitrogen into a relatively small gap surrounding the contact surface. This outward flow of gas reduces the risk of process residues reaching the contact surface. Advantageously, the device can be configured to process components, for example, by bonding them in an environment containing an inert gas. This environment can be provided in one or more chambers. Preferably, one or more suitably configured exhaust systems can be used to further control airflow. The disclosed device can effectively reduce contamination, such as flux vapors in hot-pressing processes, particles in cleanroom processes, or any combination thereof.

[0006] Specific examples of the invention are associated with various advantages and / or technical effects and are described by way of the following illustrative examples.

[0007] A specific example of an apparatus for bonding a component to or onto one or more substrates includes a tool holder and a component tool, wherein the apparatus provides at least one air curtain 750 in use, the at least one air curtain being at least partially surrounded by at least one groove 520 formed in a peripheral portion between the tool holder and the component tool; and wherein in use, the at least one air curtain is configured to reduce the level of contaminant deposition on one or more portions of the tool holder contact surfaces by providing at least one gas flow path from the inner portion to the outer edge of each tool contact surface.

[0008] A specific example of an apparatus for bonding a component to or onto one or more substrates includes an adhesive head configured to operate at the bonding location with the component for releasably receiving the component.

[0009] A specific example of the device further includes a tool holder having a tool holder contact surface for receiving a component tool, wherein the component tool preferably includes a tool attachment surface configured to be received by the tool holder contact surface during use. The tool holder further includes at least one tool holder gas outlet configured to provide at least one airflow between the tool holder and the component tool during use, from a central portion of the tool holder contact surface to one or more peripheral portions of the tool holder contact surface. The tool holder is further configured to provide at least one air curtain flowing away from one or more peripheral areas of the tool holder contact surface during use, and wherein the at least one air curtain is at least partially surrounded by at least one groove formed in the peripheral portion between the tool holder and the component tool during use, and wherein the at least one air curtain is configured to reduce the degree of contaminant deposition on one or more portions of the tool holder contact surface during use. The device achieves improved adhesion between the component and one or more substrates by reducing contaminant deposition on the tool holder contact surface. This helps maintain a clean and efficient bonding process.

[0010] As required, in specific instances of the apparatus, at least one gas flow comprises an inert gas, nitrogen, argon, helium, neon, carbon dioxide, air, oil-free air, or any combination thereof. The inclusion of at least one inert gas gas in the gas flow also improves the bonding process. Inert gases help create a controlled environment that reduces the risk of chemical reactions with process residues or byproducts that may promote deposition and / or aggregation.

[0011] As required, in specific embodiments of the device, during use, at least one air curtain is at least partially surrounded by at least one groove formed in the peripheral portion of the tool holder contact surface and / or the peripheral portion of the tool attachment surface. The use of at least one groove helps to surround the air curtain, thereby providing a more concentrated and directional airflow. This improved air curtain reduces the efficiency of contaminant deposition and ensures effective utilization of airflow.

[0012] In a specific example of the device, a tool rack with a tool holder contact surface provides a safe and stable platform for storing component tools. This ensures more precise alignment and positioning of the component tools, thereby providing a more accurate and consistent bond between the component and the substrate.

[0013] In further development, specific examples of the device are particularly suitable for handling components, such as chips, semiconductor packages, wafers, integrated circuits, another substrate, or any combination thereof. For example, handling components in the form of a combination of chips or wafers applied to a substrate, wherein the combination is bonded to another substrate. In this way, the device can accommodate a variety of components, thereby allowing for universal use in different applications.

[0014] In further development, specific examples of the device also include, when in use, an average interval of 0.5 mm or less between the tool holder contact surface and the tool attachment surface of at least one recess in the peripheral portion.

[0015] As needed, specific examples of the device include tool holders configured to hold component tools using a degree of vacuum, one or more magnets, a degree of clamping force, or any combination thereof.

[0016] As needed, specific examples of the device include and are configured to raise the temperature of at least a portion of the bonding surfaces of the components during use. This achieves effective bonding and strong adhesion between the components and other materials. The device allows for controlled temperature rise, thereby preventing overheating or thermal damage to the components. This provides improved integrity and reliability of the bonded structure. The potential temperature rise of the device can be selectively applied to specific areas of the components, allowing for localized heating and bonding. This enhances accuracy and minimizes unnecessary heat exposure.

[0017] Specific examples of the device include at least one heating element, preferably integrated into a tool holder by means of a replaceable insert or mechanical fixation, or preferably integrally integrated with a heater in the form of a sintered ceramic component, and configured such that, during use, it raises the temperature of at least a portion of the tool component. This eliminates the need for a separate heating element and simplifies the overall system design.

[0018] As needed, in specific instances of the device, the device itself is configured such that, during use, it applies adhesive pressure to at least a portion of the adhesive surface of the component. As needed, the component tool includes a component attachment surface for receiving the component. Attached Figure Description

[0019] Other advantages and features of the present invention are as can be seen from the following figures, namely:

[0020] Figure 1A A simplified and schematic cross-section of the peripheral portion of the bonding head is shown, the bonding head including a tool holder with a tool holder contact surface for receiving component tools;

[0021] Figure 1B A simplified and schematic cross-section of the tool rack and the periphery of the tool rack after the component tool has been attached to the tool rack;

[0022] Figure 2 Showing a bottom view of the tool rack after the component tools have been attached; and

[0023] Figure 3 A perspective view of the tool rack before and / or after the component tools are attached to the tool rack. Detailed Implementation

[0024] The term "adhesive surface" is used herein to refer to the surface of a component that forms an adhesive bond with a substrate when heated and / or subjected to mechanical pressure.

[0025] The term "deposition level" indicates the amount of contaminants deposited on the tool rack contact surface.

[0026] The term "vacuum level" indicates the pressure difference between the inside and outside of the tool holder.

[0027] The term "adhesive position" can refer to the adhesive position in which the device is placed in contact with the substrate.

[0028] The term “adhesion pressure” is used herein to refer to the pressure applied by means of means for bonding or adhering a component to or onto one or more substrates.

[0029] In the drawings, a first axis 910, a second axis 920, and a third axis 930 are depicted to make it easier for those skilled in the art to associate the different views with the different parts. The first axis 910 is substantially perpendicular to the second axis 920, and the third axis 930 is substantially perpendicular to both the first axis 910 and the second axis 920.

[0030] The first axis 910 can be conveniently regarded as being in the X direction, the second axis 920 as being in the Y direction, and the third axis 930 as being in the Z direction.

[0031] Conventionally, in use, the first axis 910 and the second axis 920 are substantially horizontal, and the third axis 930 is substantially vertical. To clarify the description of the different components, the drawings depict the parts in these conventional orientations. Additionally, some relative terms, such as upper, side, and bottom, have been similarly used to match this convention. However, the device described in this disclosure can be configured and arranged by those skilled in the art to operate with different deviations from these conventional orientations and nominal coordinate axes.

[0032] Figure 1A A simplified and schematic cross-section of the peripheral portion of the bonding head 150 is shown, the bonding head including a tool holder 400 having tool holder contact surfaces 450, 450' for receiving the component tool 500. The bonding head 150 is a portion of a means 100 for bonding or adhering the component 600 to or onto one or more substrates. The bonding head 150 is designed to be releasably attached to the component 600 and positioned at the bonding location with the component 600. Figure 1AThe cross-section in the figure represents a plane including a first axis 910 and a third axis 930, wherein the third axis 930 has a positive direction from bottom to top and the first axis 910 has a positive direction from left to right. The second axis 920 has a positive direction from the outside of the figure.

[0033] In the depicted example, the bonding head 150 includes at least one optional heating element 420, which is configured such that, in this example, it forms a tool holder contact surface 450' during use to raise the temperature of at least a portion of the component tool (500).

[0034] Tool rack 400 includes at least one tool rack gas inlet 700 filled with at least one gas. Tool rack gas inlet 700 is connected to at least one tool rack gas outlet 720, which provides at least a portion of the gas injected under pressure into tool rack gas inlet 700 to component tool 500. Component tool 500 includes at least one tool gas inlet 740, which receives at least a portion of the gas injected by tool rack gas outlet 720.

[0035] Figure 1A The diagram illustrates the peripheral portion of the tool holder 400 and the peripheral portion of the component tool 500, which are separated by a significant distance along the third axis 930, either before the component tool 500 is attached to the tool holder 400 and / or after the component tool 500 is removed from the tool holder 400.

[0036] exist Figure 1A In this component tool 500, a tool attachment surface 550 is included, the tool attachment surface having at least one groove 520 in its peripheral portion. The groove 520 connects to a tool gas inlet 740 and allows airflow from the central portion of the tool holder contact surfaces 450, 450' to one or more peripheral portions of the tool holder contact surfaces 450, 450'. The component tool 500 also includes a component attachment surface 560 for receiving a component 600.

[0037] Figure 1B The same peripheral portion of the tool holder 400 and the same peripheral portion of the tool 500 are shown after the component tool 500 has been attached to the tool holder 400 in preparation for bonding. Figure 1B The cross-section in the figure represents a plane including a first axis 910 and a third axis 930, wherein the third axis 930 has a positive direction from bottom to top and the first axis 910 has a positive direction from left to right. The second axis 920 has a positive direction from the outside of the figure.

[0038] exist Figure 1BIn this assembly, the bonding head 150 is designed to receive gas at the tool holder gas inlet 700 and supply gas to the gas inlet of the component tool 500 via the tool holder gas outlet 720, hereinafter referred to as the tool gas inlet 740. The bonding head 150 is further designed to generate an airflow between the tool holder 400 and the component tool 500 from the central portion of the tool holder contact surface 450 to one or more peripheral portions of the tool holder contact surface 450. The bonding head 150 also generates at least one air curtain 750 flowing away from the peripheral portions of the tool holder contact surfaces 450, 450'. The air curtain 750 is partially surrounded by at least one groove 520 formed in the peripheral portion between the tool holder 400 and the component tool 500. The air curtain 750 reduces the deposition of contaminants 850 on the tool holder contact surfaces 450, 450'. Additionally, Figure 1B The part tool 500 is depicted after the part 600 is attached to the part tool 500.

[0039] Figure 2 The demonstration shows, for example, the attachment of component tool 500 to tool holder 400 in preparation for bonding. Figure 1B A bottom view of a specific instance of the tool rack 400 depicted in the figure. Figure 2 It also shows at least one heating device 420 that may be selected as needed, and a component tool 500 that is attached to the at least one heating device. Figure 2 Describe the entire tool rack 400, including the central section and all surrounding parts. Figure 2 In the diagram, the attachment surface 560 of the component faces the observer. The component tool 500 is displayed in a plane including a first axis 910 and a second axis 920. The first axis 910 has a positive direction from bottom to top, and the second axis 920 has a positive direction from left to right. The third axis 930 has a positive direction for entering the diagram.

[0040] exist Figure 2 In the example depicted, at least one air curtain 750 is indicated by an arrow. At least one air curtain 750 is configured to effectively provide protection against contaminants 850 to each side of the component tool 500 over a large portion of the perimeter between the tool holder 400 and the component tool 500. If necessary, at least one air curtain may provide protection against contaminants 850 to each side of the component tool 500 over the entire perimeter between the tool holder 400 and the component tool 500.

[0041] exist Figure 2In the example shown, a channel 545 for applying a vacuum can also be identified on the component attachment surface 560. By applying a vacuum, a removable unimaged component 600 can be attached to the component attachment surface 560. Four connecting channels 530 are visible in the channel 545, the position and number of which depend on the design of the channel 545, making it possible for additional connecting channels 530 to be used for additional retention, such as in corners.

[0042] Figure 3 Displayed before and / or after the tool 500 is attached to the tool holder 400. Figure 1A The top perspective view of the same specific instance of the tool rack 400, which is schematically depicted in the figure. Figure 3 A tool holder 400, capable of providing a suitable vacuum level for holding a component tool, is shown. It includes a central region (not marked with numbers, but readily apparent from the context) and all surrounding areas resulting from the inclusion of the component tool 500 (not shown in the figure). To hold the component tool 500 in place with the aid of a suitable vacuum level, vacuum-applyable channels 540 are embedded in the tool mounting surface 550. These channels may be located at different levels within the tool holder 400 and are interconnected with each other and connected to a vacuum source (not shown) via connecting channels 530.

[0043] exist Figure 3 In the image, the tool attachment surface 550 faces the observer. The component tool 500 is displayed in a plane including a first axis 910 and a second axis 920. The first axis 910 has a positive direction from the lower left to the upper right, and the second axis 920 has a positive direction from the lower right to the upper left. The third axis 930 has a positive direction from top to bottom. On the sides of this specific example, which are arranged in pairs that are square to each other and parallel to each other, tool gas inlets 740 are drawn in various configurations. A groove 520 surrounding the tool mounting surface is shown around the circumference of the tool holder 400.

[0044] Overall, Figures 1A to 3 This illustration shows a specific example or a portion of a specific example of a device 100 for bonding a component 600 to or onto one or more substrates, wherein the device preferably includes a tool holder 400 and a component tool 500, and each of the devices provides at least one air curtain 750, the at least one air curtain being at least partially surrounded by at least one groove 520 formed in a peripheral portion between the tool holder 400 and the component tool 500; and wherein, in use, the at least one air curtain 750 is configured to reduce the degree of contaminant 850 deposition on one or more portions of the tool holder contact surfaces 450, 450', wherein at least one gas flow path is provided from the inner portion of each tool contact surface to the outer periphery. Reference Symbol Table

[0045] Brief description of the number

[0046] 100: Device

[0047] 150: Adhesive Head

[0048] 400: Tool Rack

[0049] 420: Heating device

[0050] 450: Tool holder contact surface / Tool holder contact area

[0051] 450': Tool rack contact surface

[0052] 500: Parts and Tools

[0053] 520: Groove

[0054] 530: Connection Channel

[0055] 540: Vacuum channel can be applied

[0056] 545: Channel

[0057] 550: Tool attachment surface

[0058] 560: Component attachment surface

[0059] 600: Components

[0060] 700: Tool rack gas inlet

[0061] 720: Tool rack gas outlet

[0062] 740: Tool Gas Inlet

[0063] 750: Air Curtain

[0064] 850: Pollutants

[0065] 910: First axis (X)

[0066] 920: Second axis (Y)

[0067] 930: Third axis (Z)

Claims

1. An apparatus (100) for bonding or adhering a component (600) to or onto one or more substrates, the apparatus (100) comprising: An adhesive head (150) is provided for releasably receiving the component (600) and configured to be positioned at an adhesive location with the component (600); A tool rack (400) having a tool rack contact surface (450) for storing a component tool (500); and The component tool (500) includes a tool attachment surface (550) configured to be received by the tool holder contact surface (450). The tool holder (400) further includes at least one gas outlet (720) configured to provide, in use, at least one airflow (700) between the tool holder (400) and the component tool (500) from a central portion of the tool holder contact surface (450) to one or more peripheral portions of the tool holder contact surface (450); and The tool rack (400) is further configured to provide at least one air curtain (750) flowing away from the one or more peripheral portions of the tool rack contact surface (450) during use. In use, the at least one air curtain (750) is at least partially surrounded by at least one groove (520) formed in the peripheral portion between the tool holder (400) and the component tool (500); and In use, the at least one air curtain (750) is configured to reduce the degree to which contaminants (850) are deposited on one or more portions of the tool rack contact surface (450).

2. The apparatus of any of the preceding claims, wherein the at least one gas flow comprises an inert gas, nitrogen, argon, helium, neon, carbon dioxide, air, oil-free air, or any combination thereof.

3. The apparatus of any of the preceding claims, wherein, in use, the at least one air curtain (750) is at least partially surrounded by at least one groove (520) formed in a peripheral portion of the tool holder contact surface (450).

4. The apparatus of any of the preceding claims, wherein, in use, the at least one air curtain (750) is at least partially surrounded by at least one groove (520) formed in a peripheral portion of the tool attachment surface (550).

5. The apparatus of any of the preceding claims, wherein in use, the at least one air curtain (750) is at least partially surrounded by at least one groove (520) formed in a peripheral portion of the tool attachment surface (550) and at least partially surrounded by at least one corresponding groove formed in a peripheral portion of the tool holder contact surface (450).

6. The apparatus of any of the preceding claims, wherein the component is a die, a semiconductor package, a wafer, an integrated circuit, another substrate, or any combination thereof.

7. The apparatus of any of the preceding claims, wherein in use, an average interval of 0.5 mm or less is provided between the tool holder contact surface (450) and the tool attachment surface (550) adjacent to the at least one groove (520) formed in a peripheral portion.

8. The apparatus of any of the preceding claims, wherein the tool holder is configured to hold the component tool (500) using a degree of vacuum, one or more magnets, a degree of clamping force or any combination thereof.

9. The apparatus of any of the preceding claims, wherein the apparatus is configured to raise the temperature of at least a portion of an adhesive surface of the component (600) during use.

10. The apparatus of any of the preceding claims, wherein at least one heating element (420) is included in the tool holder (400) and configured to raise the temperature of at least a portion of the component tool (500) in use.

11. The apparatus of any of the preceding claims, wherein the apparatus (100) is configured to apply an adhesive pressure to at least a portion of an adhesive surface of the component (600) in use.

12. The apparatus (100) of any of the preceding claims, wherein the component tool (500) includes a component attachment surface (560) for receiving the component (600).

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