Semiconductor packaging frame receiving device

Abstract

The utility model belongs to the field of semiconductor packaging frames, and particularly relates to a semiconductor packaging frame material receiving device, which comprises a machine table, a material receiving device and a material receiving device, the material moving assembly comprises a clamping mechanism, the clamping mechanism is movably arranged on the first frame body, and the clamping mechanism is configured to move in the first direction and the third direction; the multiple cooling assemblies are arranged on the side, away from the clamping mechanism, of the first frame body in parallel; the collecting assembly comprises a first collecting box, a second collecting box, a third linear module and a containing mechanism, the first collecting box and the second collecting box are arranged on the machine table side by side, the third linear module is arranged on the second frame body in the third direction, and the containing mechanism is arranged at the moving end of the third linear module and arranged in the first collecting box and the second collecting box in a penetrating mode. The material collecting device can shorten the cooling waiting time, so that the production time is shortened, and the collecting efficiency is improved.

Description

Technical Field

[0001] The present application relates to the field of semiconductor packaging frames, and in particular to a semiconductor packaging frame receiving device. Background Art

[0002] The semiconductor package frame is an important component in the semiconductor manufacturing process. It provides protection for chips and other electronic components and helps to achieve connections between circuits. The package frame is usually made of metal, plastic or other materials, which can provide proper mechanical support and electrical connections, while ensuring the stability and reliability of chips and other components. During the production process, precise processing and assembly are required according to the design and requirements of the circuit board, which may include fixing the chip on the frame, connecting the metal wires on the circuit board, and connecting the frame to external components (such as heat sinks). The quality and design of the package frame are critical to the performance, reliability and life of electronic equipment.

[0003] In the related art, in semiconductor packaging technology, after the packaging frame is plastic-sealed, it needs to be grabbed by a robot and placed in a cooling device for cooling. After cooling, the robot moves it to a receiving device for collection. In this process, setting up a cooling device separately to cool the packaging frame not only increases production time, but also increases the overall system manufacturing cost.

[0004] It should be noted that the information disclosed in the above background technology section is only used to enhance the understanding of the background of the present disclosure, and therefore may include information that does not constitute the prior art known to ordinary technicians in the field. Utility Model Content

[0005] In view of at least one of the above technical problems, the present application provides a semiconductor packaging frame receiving device, which solves the problem that separately setting a cooling device to cool the packaging frame not only increases production time but also increases the overall system manufacturing cost.

[0006] The embodiment of the present application provides a semiconductor packaging frame receiving device, comprising:

[0007] The machine is provided with a first frame and a second frame;

[0008] The material moving assembly includes a clamping mechanism, which is movably arranged on the first frame and is configured to be movable along a first direction and a third direction;

[0009] A plurality of cooling components are arranged in parallel on a side of the first frame away from the clamping mechanism;

[0010] The collecting component includes a first collecting box, a second collecting box, a third linear module and a receiving mechanism. The first collecting box and the second collecting box are arranged side by side on the machine platform. The third linear module is arranged on the second frame along the third direction. The receiving mechanism is arranged on the moving end of the third linear module. The receiving mechanism is inserted into the first collecting box and the second collecting box.

[0011] Compared with the prior art, the material receiving device integrates the cooling component on one side of the material moving component. When the clamping mechanism clamps the packaging frame from the previous process and is ready to move it to the collection component, the cooling component can blow air to cool the packaging frame on the clamping mechanism. After cooling, the packaging frame can be directly placed in the collection component. In this way, the material receiving device can shorten the cooling waiting time, thereby shortening the production time and improving the collection efficiency.

[0012] In some possible implementations, the material moving assembly includes a first linear module, a movable plate, a second linear module, a mounting seat and a clamping mechanism. The first linear module is arranged on the first frame along a first direction, the movable plate is arranged on the movable end of the first linear module, the second linear module is arranged on the movable plate along a third direction, the mounting seat is arranged on the movable end of the second linear module, and the clamping mechanism is arranged on the mounting seat.

[0013] In some possible implementations, the cooling assembly includes a support frame, a mounting plate and a blowing nozzle. The support frame is mounted on the first frame, the mounting plate is movably mounted on the support frame, there are two blowing nozzles which are arranged in parallel on the mounting plate, and the blowing nozzles are connected to an air source.

[0014] In some possible implementations, an arc-shaped groove is provided on the support frame, and extension columns are provided at opposite ends of the mounting plate. The extension columns are inserted into the arc-shaped groove, and a locking nut is threadedly connected to the extension column and abuts against the support frame.

[0015] In some possible implementations, the receiving mechanism includes a receiving seat, a receiving rack and a receiving plate. The receiving seat is arranged on the third linear module. There are two receiving racks and they are arranged in parallel on the receiving seat. The two receiving racks are movably arranged in the first collection box and the second collection box. There are two receiving plates and they are arranged on the receiving racks.

[0016] The present invention will be further described below in conjunction with the accompanying drawings and embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 is a structural diagram of a semiconductor packaging frame receiving device shown in an embodiment of the present application;

[0019] Figure 2 is a structural diagram of a cooling assembly shown in an embodiment of the present application;

[0020] Wherein, the accompanying drawings are marked as follows:

[0021] 100, machine platform; 110, first frame; 120, second frame;

[0022] 200, material moving assembly; 210, first linear module; 220, moving plate; 230, second linear module; 240, mounting seat; 250, clamping mechanism;

[0023] 300, cooling assembly; 310, support frame; 320, mounting plate; 330, air blowing nozzle; 311, arc groove; 321, extension column;

[0024] 400, collecting assembly; 410, first collecting box; 420, second collecting box; 430, third linear module; 440, receiving mechanism;

[0025] 441, receiving seat; 442, receiving frame; 443, receiving board; DETAILED DESCRIPTION

[0026] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific embodiments of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0027] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0028] In the description of the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0029] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0030] In the description of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] In the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0032] In the related art, in the semiconductor packaging technology, after the packaging frame is plastic-sealed, it needs to be grabbed by a robot and placed in a cooling device for cooling. After cooling is completed, it is moved to a material receiving device by a robot for collection. In this process, separately setting up a cooling device to cool the packaging frame not only increases the production time, but also increases the overall system manufacturing cost. Compared with the prior art, the present material receiving device integrates the cooling component on one side of the material moving component. When the clamping mechanism clamps the packaging frame from the previous process and is ready to move to the collection component, the cooling component can blow air to cool the packaging frame located on the clamping mechanism. After cooling is completed, the packaging frame can be directly placed in the collection component. In this way, the present material receiving device can shorten the cooling waiting time, thereby shortening the production time and improving the collection efficiency.

[0033] See also Figure 1 , Figure 2 ,in, Figure 1 is a structural diagram of a semiconductor packaging frame receiving device shown in an embodiment of the present application; Figure 2 1 is a structural diagram of a cooling assembly shown in an embodiment of the present application; an embodiment of the present application provides a semiconductor packaging frame receiving device, comprising: a machine 100, a material moving assembly 200, a cooling assembly 300 and a material receiving assembly.

[0034] like Figure 1 to Figure 2 As shown, the present embodiment provides a semiconductor packaging frame material receiving device, including: a machine 100, provided with a first frame 110 and a second frame 120; a material moving component 200, including a clamping mechanism 250, the clamping mechanism 250 is movably arranged on the first frame 110, and the clamping mechanism 250 is configured to be able to move along a first direction and a third direction; a plurality of cooling components 300 are arranged in parallel on a side of the first frame 110 away from the clamping mechanism 250; a collecting component 400, including a first collecting box 410, a second collecting box 420, a third linear module 430 and a receiving mechanism 440, the first collecting box 410 and the second collecting box 420 are arranged in parallel on the machine 100, the third linear module 430 is arranged on the second frame 120 along the third direction, the receiving mechanism 440 is arranged on the moving end of the third linear module 430, and the receiving mechanism 440 is penetrated in the first collecting box 410 and the second collecting box 420.

[0035] It is worth noting that the first direction corresponds to the X-axis of the spatial coordinate axis (i.e., the left-right direction), the second direction corresponds to the Y-axis of the spatial coordinate axis (i.e., the front-back direction), and the third direction corresponds to the Z-axis of the spatial coordinate axis (i.e., the up-down direction). The first direction, the second direction, and the third direction are perpendicular to each other.

[0036] In this embodiment, a base is provided on the machine 100, and the base has two cavities, and the first collection box 410 and the second collection box 420 are detachably connected to the cavities. When the first collection box 410 or the second collection box 420 is full of materials, the first collection box 410 or the second collection box 420 can be directly taken out of the base and replaced with a new first collection box 410 or the second collection box 420. In this way, the collection box can be quickly replaced, and the system can continue to operate without stopping to wait for the collection box to be emptied, which can improve production efficiency. At the same time, when a collection box is full, it can be replaced immediately instead of waiting for the whole process to end, which can reduce the downtime caused by replacing the collection box.

[0037] In this embodiment, the clamping mechanism 250 is used to clamp the packaging frame. In some embodiments, the clamping mechanism 250 may include a plurality of clamping jaws, which are movably arranged on the mounting seat 240, and the clamping jaws are used to abut against the edge of the packaging frame. When in use, the relatively arranged clamping jaws can move synchronously, so that the distance between the two clamping jaws increases or decreases, thereby achieving the clamping operation of the packaging frame. In addition, the clamping mechanism may also include a cylinder for driving the clamping jaws to move, but the present embodiment is not limited thereto.

[0038] like Figure 1 to Figure 2 As shown, in some embodiments, the material moving assembly 200 includes a first linear module 210, a movable plate 220, a second linear module 230, a mounting seat 240 and a clamping mechanism 250. The first linear module 210 is arranged on the first frame 110 along a first direction, the movable plate 220 is arranged on the movable end of the first linear module 210, the second linear module 230 is arranged on the movable plate 220 along a third direction, the mounting seat 240 is arranged on the movable end of the second linear module 230, and the clamping mechanism 250 is arranged on the mounting seat 240.

[0039] In this embodiment, the first linear module 210 and the second linear module 230 are used to drive the clamping mechanism 250 to move in a plane, so that the packaging frame is transferred from the previous process to one side of the cooling component 300 and the collection component 400.

[0040] like Figure 1 to Figure 2 As shown, in some embodiments, the cooling assembly 300 includes a support frame 310, a mounting plate 320 and a blowing nozzle 330. The support frame 310 is arranged on the first frame 110, the mounting plate 320 is movably arranged on the support frame 310, and the blowing nozzle 330 has two and is arranged in parallel on the mounting plate 320, and the blowing nozzle 330 is connected to the air source.

[0041] In this embodiment, the packaging frame stops when it moves to one side of the cooling assembly 300, and the air blowing nozzle 330 blows air to the packaging frame to accelerate the cooling of the packaging frame.

[0042] like Figure 1 to Figure 2As shown, in some embodiments, an arc-shaped groove 311 is opened on the support frame 310, and extension columns 321 are provided at opposite ends of the mounting plate 320. The extension columns 321 are passed through the arc-shaped groove 311, and a locking nut is threadedly connected to the extension columns 321 and rests on the support frame 310.

[0043] In this embodiment, the blowing angle of the blowing nozzle 330 is adjusted by adjusting the inclination of the mounting plate 320 relative to the support frame 310 .

[0044] like Figure 1 to Figure 2 As shown, in some embodiments, the receiving mechanism 440 includes a receiving seat 441, a receiving rack 442 and a receiving plate 443. The receiving seat 441 is disposed on the third linear module 430. The receiving rack 442 has two and is disposed in parallel on the receiving seat 441. The two receiving racks 442 are movably disposed in the first collection box 410 and the second collection box 420. The receiving plate 443 has two and is disposed on the receiving rack 442.

[0045] In this embodiment, the third linear module 430 drives the receiving frame 442 and the receiving plate 443 to move upward and close to the clamping mechanism 250, thereby shortening the distance between the receiving plate 443 and the clamping mechanism 250 and reducing the downward movement distance of the clamping mechanism 250, thereby improving the material discharge efficiency of the clamping mechanism 250.

[0046] In addition, the third linear module 430 drives the receiving frame 442 and the receiving plate 443 to gradually move downward, so that the packaging frames placed on the receiving plate 443 are gradually received in the first collecting box 410 and the second collecting box 420 .

[0047] The above are only preferred embodiments of the present application, and do not constitute any formal limitation on the present application. Any technician familiar with the art can use the above disclosed methods and technical contents to make many possible changes and modifications to the technical solution of the present application without departing from the scope of the technical solution of the present application, or modify it into an equivalent embodiment of equivalent changes. Therefore, all equivalent changes made according to the shape, structure and principle of the present application without departing from the content of the technical solution of the present application should be included in the protection scope of the present application.

Claims

1. A semiconductor packaging frame receiving device, characterized in that: include: The machine is provided with a first frame and a second frame; A material moving assembly, comprising a clamping mechanism, wherein the clamping mechanism is movably disposed on the first frame, and the clamping mechanism is configured to be movable along a first direction and a third direction; A plurality of cooling components are arranged in parallel on a side of the first frame away from the clamping mechanism; The collecting component includes a first collecting box, a second collecting box, a third linear module and a receiving mechanism. The first collecting box and the second collecting box are arranged side by side on the machine platform. The third linear module is arranged on the second frame along a third direction. The receiving mechanism is arranged on the moving end of the third linear module. The receiving mechanism is inserted into the first collecting box and the second collecting box.

2. The semiconductor packaging frame receiving device according to claim 1, characterized in that: The material moving assembly includes a first linear module, a movable plate, a second linear module, a mounting seat and a clamping mechanism. The first linear module is arranged on the first frame along a first direction, the movable plate is arranged on the movable end of the first linear module, the second linear module is arranged on the movable plate along a third direction, the mounting seat is arranged on the movable end of the second linear module, and the clamping mechanism is arranged on the mounting seat.

3. The semiconductor packaging frame receiving device according to claim 1, characterized in that: The cooling assembly includes a support frame, a mounting plate and a blowing nozzle, the support frame is mounted on the first frame, the mounting plate is movably mounted on the support frame, the blowing nozzle has two and is arranged in parallel on the mounting plate, and the blowing nozzle is connected to an air source.

4. The semiconductor packaging frame receiving device according to claim 3, characterized in that: The support frame is provided with an arc groove, and the two opposite ends of the mounting plate are provided with extension columns, the extension columns are passed through the arc groove, and a locking nut is threadedly connected to the extension column and abuts against the support frame.

5. The semiconductor package frame receiving device according to claim 1, characterized in that: The receiving mechanism includes a receiving seat, a receiving frame and a receiving plate. The receiving seat is arranged on the third linear module. The receiving frame has two and is arranged in parallel on the receiving seat. The two receiving frames are movably arranged in the first collection box and the second collection box. The receiving plates have two and are arranged on the receiving frames.

Images